CN1209886A - Method and apparatus for bonding adhesive tape of liquid crystal panel - Google Patents
Method and apparatus for bonding adhesive tape of liquid crystal panel Download PDFInfo
- Publication number
- CN1209886A CN1209886A CN97191876A CN97191876A CN1209886A CN 1209886 A CN1209886 A CN 1209886A CN 97191876 A CN97191876 A CN 97191876A CN 97191876 A CN97191876 A CN 97191876A CN 1209886 A CN1209886 A CN 1209886A
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- Prior art keywords
- band
- bonding
- liquid crystal
- crystal display
- substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Two electrode terminals can be electrically connected always stably with each other while preventing dust, etc., from being caught between them. An extension portion (21c) of a transparent substrate (21a) of a liquid crystal panel (3) is disposed above a tape (12) inclusive of an ACF (14a). A panel support table (4) is lowered as indicated by an arrow (B) and a predetermined tape bonding surface (29) on the substrate extension portion (21c) is brought into surface-contact with the ACF (14a). Thereafter, a pair of upper and lower press-bonding heads (17a and 17b) are moved forth from a stand-by position of a solid line to an extension position of a dash line as indicated by an arrow (E), and are further moved for closing from an open position of a dash line as indicated by an arrow (F) so that the substrate extension portion (21c) and the tape (12) are heated and pressed from both of their sides and the ACF (14a) is bonded to the substrate extension portion (21c). Since the tape bonding surface (29) always faces downward during the work, dust, etc., can be prevented from attaching to it.
Description
Technical field
The present invention relates to that an anisotropic conducting film (ACF) etc. is bonding to adhere to sticking method and sticking device on the liquid crystal display substrate with band.
Background technology
Generally, liquid crystal display be bonding mutually by making a pair of substrate clamping encapsulant with several transparency electrodes and separation pad and also the cell gap that between two substrates, forms in enclose liquid crystal and form.One side of the substrate of holding liquid crystal or two extensions that formation is stretched out to the outside form the electrode terminal that is connected in described several transparency electrodes on this extension.On these electrode terminals, directly or by tape carrier encapsulation (the Tape Carrier Package) connecting elements of etc.ing conduct electricity connection liquid crystal drive integrated circuit indirectly.
Direct bonding liquid crystal drive is called COG (Chip On Glass, glass-based chip) mode with the structure of integrated circuit on liquid crystal display, substrate.On this COG, bonding with band, then be with bonding liquid crystal drive integrated circuit in this bonding usefulness at the bonding ACF in the installation site of the integrated circuit on the substrate etc.That is to say, with band, when bonding to liquid crystal drive on the substrate with integrated circuit, also with band TCP is bonded on the substrate with bonding with bonding.
As described above with bonding with band when being connected to liquid crystal drive on the substrate with IC, the 1st point at first must be bonding with being with on the precalculated position that adheres on the substrate.In the past, adhesion is bonding on the substrate of liquid crystal display uses when being with, this liquid crystal display of configuration on suitable support platform, so that the band bonding plane that makes the liquid crystal display substrate up, at the substrate contacts adhesion band of this state that makes progress, and by making bonding being pressed to band both bonding on the substrate with predetermined pressure.
, adopt described existing sticking method, the dust etc. that is suspended in the space is attached to the band bonding plane on the substrate or is attached to and is bonded in bonding with band on the substrate.Its result is mingled with dust etc. between two electrode terminals that connect will conducting electricity, and then might make stickability and electric conductivity between these electrode terminals low.
The present invention puts forward in view of existing sticking method has described problem, its objective is to prevent to sandwich dust etc. between two electrode terminals that connect will conducting electricity, and can often keep stable electrical connection so that make between these electrode terminals.
In order to reach described purpose, the relevant bonding sticking method with band of the present invention is: adhesion is bonding with band at least one side's substrate of holding liquid crystal, opposed a pair of substrate, it is characterized in that, dispose described substrate, make its band bonding plane down, this the band bonding plane from below the contact bonding with the band, push then substrate and bonding with the band, make their the adhesion.
If adopt this sticking method, because the band bonding plane of liquid crystal display in adhesion operating period maintenance down, so can prevent on this band bonding plane and adhere on this band bonding plane bonding with the band surface attachment dust, its result, by this bonding liquid crystal drive that connects on the substrate of band at liquid crystal display with the protuberance of IC etc., when being power supply terminal, can keep the cementability and the electric conductivity of this coupling part well.
In addition, bonding sticking device with band of the present invention is the bonding sticking device with band of adhesion at least one side's of holding liquid crystal, opposed a pair of substrate substrate, have the screen bracing or strutting arrangement that supports liquid crystal display and make bonding with strap clamp betwixt, opposite one another a pair of crimp head.And described screen bracing or strutting arrangement supports this liquid crystal display, so that make the band bonding plane of liquid crystal display be positioned at bonding top with band.And, in the described a pair of crimp head at least the crimp head of bonding downside with band and bonding with the band position contacting and from bonding advance and retreat between with the position left of band mobile.
If adopt this sticking device, then when the adhesion operation, the band bonding plane of liquid crystal display is kept down, and it is bonding with band to place this band bonding plane down to adhere from the below.Because the band bonding plane of substrate keeps down, so can prevent to adhere to dust etc. on this face.
In described sticking method and sticking device, so-called bonding be to be used for band with the substrate of liquid crystal display and electronic unit in addition, for example liquid crystal drive is conducted electricity the band of connection with IC, TCP etc.Bonding as this with band, can contain the anisotropic conductive film ACF (Anisotropic Conductive Film) of conducting particles, the inner banded adhesives that does not contain conducting particles etc. with inside.
The simple declaration of accompanying drawing
Fig. 1 is the bonding skeleton view with sticking device one embodiment that is with of expression liquid crystal display of the present invention.
Fig. 2 is the major part of the sticking device of presentation graphs 1, especially is illustrated in the sectional drawing that carries out bonding placement configurations with band adhesion operation on the transparency carrier of liquid crystal display.
Fig. 3 is and the structure of Fig. 2 same position, represents that this is configured in the sectional drawing of different work state constantly.
Fig. 4 is that another major part of presentation graphs 1 sticking device especially represents to carry bonding front elevation with band Handling device one example of being with.
Fig. 5 is the Handling device identical with Fig. 4, represents the front elevation of the different work state constantly of this device.
Fig. 6 represents bonding skeleton view with an example of being with partly.
Fig. 7 is another major part of the sticking device of presentation graphs 1, especially is expressed as the skeleton view that the treatment step of the band member that comprises bonding usefulness band is opened in hemisection.
Fig. 8 is the skeleton view of expression liquid crystal display one example.
Fig. 9 is the sectional drawing of cross-section structure of the liquid crystal display of presentation graphs 8.
The most preferred embodiment that carries out an invention
Fig. 1 provides a bonding embodiment with the sticking device of being with of liquid crystal display of the present invention.This sticking device has the material platform S of the liquid crystal screen that is untreated of placing the liquid crystal screen that is untreated
0, on the band bonding plane of liquid crystal display the bonding adhesion operating position S of position of adhesion with band
1With the screen material platform S that disposes that places the liquid crystal display of having done the adhesion processing
2
At adhesion operating position S
1A side on disposed discoid multi-station turning table 1, along the circumferential direction equi-angularly space is provided with 4 screen bracing or strutting arrangements 2 on the peripheral edge portion of this multi-station turning table 1.This multi-station turning table 1 is driven by not shown rotating driving device at intermittence, and as shown by arrow A, intermittently rotation is moved.Intermittently rotate mobilely by this, each shields bracing or strutting arrangement 2 between four positions setting around the multi-station turning table 1, that is: adhesion operating position S
1, screen reclaims position S
3, position of readiness S
4, shield supplementary view S subsequently
5Each position between intermittently rotation move.
Each shield bracing or strutting arrangement 2 have the stylobate that is fixed on the multi-station turning table 1 and carrying by this stylobate support, as the screen brace table 4 of the liquid crystal display 3 of operand.Each shields brace table 4 and relies on stylobates supporting up or down, and then the elastic component by spring etc. under state of nature is upward in the pushing of position.At adhesion operating position S
1On fixedly install cylinder 6.By the rotation of multi-station turning table 1, each shields bracing or strutting arrangement 2 and is transported to adhesion operating position S one by one
1, then, cylinder 6 one actions, as shown in Figure 2, by the elastic force of resistance spring, screen brace table 4 moves downwards as shown by arrow B.If the effect of cylinder 6 one is removed, screen brace table 4 is returned to initial top position as shown by arrow C by elastic forces such as springs.
Turn back to Fig. 2, at adhesion operating position S
1A side on configuration band supply dish 7, configuration roll coil of strip drum 8 on opposite side.In addition, a plurality of take-up pulleies 9 of configuration between these dishes, but also disposed two shifting rollers 11.Be involved in the stratiform band 12 of ring-type on band supply dish 7, the stratiform band 12 that rolls out from there is batched by roll coil of strip drum 8 through each take-up pulley 9 and shifting roller 11.Shifting roller 11 drives by not shown drive unit as shown in Figure 4, with the operating position S of adhesion
1For batching side position P in the boundary
0With send side position P
1Between do reciprocating linear motion as shown by arrow D.
Get back to Fig. 1, about the conveyance direction of stratiform band 12, from adhesion operating position S
1Send on the band carrying channel of side the configuration band and cut 16, this band cut 16 with relevantly with the conveyance speed of stratiform band 12, suitable time interval knee-action, promptly cut off action repeatedly.Cut off action by this, only cut off half the ACF14 in the stratiform band 12, the base material band 13 of remaining half does not cut off.Realize so-called hemisection processing.Its result cuts at band on 16 the downstream side position, forms the sheet ACF14a of predetermined length L as illustrated in fig. 7, and this ACF14a is loaded on the base material band 13 by conveyance.
Turn back to Fig. 1, clip adhesion operating position S
1, on an opposite side of screen bracing or strutting arrangement 2, be provided with a pair of crimp head 17a and 17b up and down.This two crimp head portion within it keeps well heater, is heated to predetermined temperature.In addition, this two crimp head 17a and 17b are by the driving by not shown parallel moving mechanism, as Fig. 2, at adhesion operating position S
1Last extended position reaches and do back and forth parallel moving between the retreating position of keeping out of the way therefrom shown in arrow E-E '.In addition, this crimp head 17a and 17b are by the driving by not shown parallel moving mechanism, at adhesion operating position S
1The state that stretches out, shown in arrow F-F ', back and forth open and close mobile between the position at open position shown in Figure 2 (state shown in the dot-and-dash line) and shown in Figure 3 closing.The top end face of downside crimp head 17b promptly with on the surface of contact of being with is provided with the buffer component 18 that is formed by silicon rubber and other elastic component.The top end face of the crimp head 17a of upside also is provided with buffer component 18 in addition.
Below, the action of the sticking device that is made of described structure is described.
At present embodiment, the liquid crystal display 3 of the ACF that adhere for glass-based chip (COG) mode shown in Figure 8.This liquid crystal display 3, as shown in Figure 9, separation pad 23 is clamped between the 2nd transparency carrier 21b of glass the 1st transparency carrier 21a and same glass and is connected to each other, form by enclosing liquid crystal 24 in the cell gap G that between this two substrates, forms by encapsulant 22.
On the inner surface of the 1st transparency carrier 21a, form the 1st transparency electrode 25a, in addition, on the inner surface of the 2nd transparency carrier 21b, form the 2nd transparency electrode 25b.And the electrode terminal 26 that connects these transparency electrodes is formed on the 1st transparency carrier 21a extension 21c.In addition, on the end of this extension 21c, form the connection terminal 27 that the external circuit conduction is connected.In addition, on the outer surface of each transparency carrier 21a and 21b, the polarization plates of adhering respectively 31a and 31b.
When the installation liquid crystal drive is used IC28 on this liquid crystal display 3, as shown in Figure 8, at first at the beginning, adhesion sheet ACF14a on the predetermined band bonding plane 29 on the substrate 21a extension 21c, then, on this ACF14a, place liquid crystal drive IC28, then, this liquid crystal drive is heated to predetermined temperature with IC28 on one side, is pressed to substrate extension 21c simultaneously.Handle by this thermo-compressed that adds, rely on the resin of ACF14a partly to make liquid crystal drive bonding mutually with IC28 and substrate extension 21c, meanwhile by being dispersed in the conducting particles in the resin, liquid crystal drive is conducted electricity respectively with protuberance with the output input of IC28 and is connected on external cabling terminal 27 and the electrode of substrate terminal 26.
The band sticking device of present embodiment is the operation that was implemented in adhesion ACF14a on this liquid crystal display 3 before installation liquid crystal drive on the liquid crystal display 3 is with IC28, below the adhesion operation of this ACF of explanation.
At Fig. 1, the material platform S of the screen that is untreated
0On have a plurality of liquid crystal displays 3 stacked with band bonding plane 29 (with reference to Fig. 8) state down.And, pick up by not shown carrying device for 1 piece of uppermost position in fig-ure in these a plurality of untreated liquid crystal displays 3, it is transported to multi-station turning table 1 place.And retainer belt bonding plane 29 state down is being placed in screen supplementary view S
5On the screen of screen supportive device 2 support to place on the platform 4 liquid crystal display 3.At this moment, in order to keep being placed in the liquid crystal display 3 on the screen brace table 4 securely, wish on screen brace table 4, to set up the maintaining body etc. that some mechanical screen protection is held mechanism or utilized the air attractive force.
Be placed on of the intermittence rotation of the liquid crystal display 3 of screen on the brace table 4, from screen supplementary view S by multi-station turning table 1
5Rotation is transported to adhesion operating position S
1, stop in this position.On the one hand, from the stratiform band 12 that band supply dish 7 is sent, cut 16 by band, after accepting hemisection and handling, conveyance is to adhesion operating position S
1At this moment, the position relation between liquid crystal display 3 and the stratiform band 12 is positioned at the top position of stratiform band 12 as shown in Figure 2 from the outstanding laterally substrate extension 21c of screen brace table 4.More particularly, the band bonding plane 29 of the extension 21c of substrate 21b is positioned at the top position of the sheet ACF14a on the stratiform band 12.
Be disposed at adhesion operating position S thereafter,
1Cylinder 6 work, screen brace table 4 moves downwards as shown by arrow B, therefore, the band bonding plane 29 of substrate extension 21c moves downwards, contacts with the ACF14a face., state that a pair of crimp head 17a and 17b keep open, from retreating position (solid line) to arrow E direction move, move to adhesion operating position S always thereafter
1Till.Thereafter, up and down crimp head 17a and 17b close to arrow F direction respectively mobile, as shown in Figure 3, make stratiform band 12 and substrate extension 21c under closed state from pros and cons pushing they.
Handle by this pushing, the ACF14a of stratiform band 12 is being heated under the state of predetermined temperature, be pressed on the substrate extension 21c with predetermined pressure, and its result, ACF14a adheres on substrate extension 21c.Thereafter, crimp head 17a and 17b open mobile to arrow F ' direction, reach till the open position of representing with dot-and-dash line on Fig. 2 always, then move to arrow E ' direction, keep out of the way retreating position (solid line).
Thereafter, remove the work of cylinder 6, screen brace table 4 rises as shown by arrow C, returns top position at the beginning, meanwhile, Fig. 4 move wheel to 11 as shown by arrow D to sending side position P
1Move.So, as shown in Figure 5, stratiform band 12 drops to the lower position shown in the solid line from the top position of the beginning shown in the dot-and-dash line, and therefore, the sheet ACF14a of adhesion separates from the base material band 13 of stratified pieces 12 on liquid crystal display 3.So, ACF14a adheres on the band bonding plane 29 of substrate 21a of liquid crystal display 3.Move wheel and send side position P in arrival 11
1After, the moving direction that reverses at once moves to arrow D ' direction, returns and batches side position P
0
Thereafter, at Fig. 1, intermittently rotation of multi-station turning table 1, the screen bracing or strutting arrangement 2 that supports the liquid crystal display 3 after ACF adhesion operational processes is from adhesion operating position S
1Reclaim position S to screen
3The rotation conveyance.And by the effect of not shown screen carrying device, the liquid crystal display of handling 3 takes out from brace table 4, and then conveyance is to the liquid crystal display material platform S that handled
2And be placed on there.Thereafter, screen bracing or strutting arrangement 2 is according to the rotation of multi-station turning table 1, via position of readiness S
4Conveyance is to screen supplementary view S again
5, receive untreated liquid crystal display 3.
Afterwards, by carrying out described processing repeatedly, be loaded in the screen material platform S that is untreated
0On liquid crystal display 3 be transported to adhesion operating position S in turn
1, adhesion ACF and be deposited in the screen material platform S that handled in turn
2The liquid crystal display 3 of processing of ACF of having adhered is transported to other not shown treatment bench thereafter, subsequently as shown in Figure 8, stacked liquid crystal drive IC28 on ACF14a, then handle by thermo-compressed, this liquid crystal drive with IC28 through the ACF14a conductive bond on the band bonding plane 29 of substrate extension 21c.
As previously discussed, if adopt the sticking device of the ACF of present embodiment, because when the band bonding plane 29 (with reference to Fig. 8) of liquid crystal display 3 is adhered operation, the total maintenance down, so can this with bonding plane 29 on and on the surface of ACF14a of adhesion on this band bonding plane 29, prevent adhering to of dust etc., its result, through this ACF14a, on the substrate 21a of liquid crystal display 3, connect liquid crystal drive with the protuberance of IC28, when being electrode terminal, can keep the connectivity and the electric conductivity of this coupling part well.
More than enumerated comparatively ideal embodiment the present invention is described, but the present invention is not limited to this embodiment, in the scope of claim record, can do all changes.
For example, as bonding with band, any banded adhesives beyond also can enough ACF14, for example with the common splicing tape that does not contain conducting particles.In addition, the liquid crystal display that becomes the adhesion process object is not limited to the liquid crystal display of COG form shown in Figure 8, also can adopts on the electrode terminal that forms on the extension 21c of substrate 21a by TCP and connect the liquid crystal display of liquid crystal drive with the form of IC.In this case, electrode terminal bonding that is used to connect electrode terminal on the substrate extension 21c and TCP with band, for example adhere to substrate extension 21c and go up predetermined band bonding plane with sticking method of the present invention such as ACF and sticking device.
The possibility of industrial utilization
As mentioned above, the present invention is being connected to substrate to liquid crystal drive with IC etc. with bonding with band When upper, prevented between two electrode terminals that need conductions connects, carrying secretly the appropriate technology of dust etc., energy Enough make and often stably keep conduction to connect between these electrode terminals.
Claims (8)
1. a liquid crystal display is bonding with the sticking method of being with, be adhered to holding liquid crystal and in the opposed a pair of substrate at least one side bonding with band, it is characterized by: dispose described substrate, so that should be with bonding plane down, this the band bonding plane on from below the contact bonding with the band, push substrate and bonding subsequently mutually with band, and with they adhesions.
2. a liquid crystal display is bonding with the sticking method of being with, and it is characterized by: in the described bonding sticking method with band of claim 1, bonding is the anisotropic conductive film that forms by dispersed electro-conductive particle in resin molding with band.
3. a liquid crystal display is bonding with the sticking device of being with, and it is bonding with band to adhere at least one side in the opposed a pair of substrate at holding liquid crystal, it is characterized by:
Have the screen bracing or strutting arrangement that supports liquid crystal display and folder bonding with band therebetween, a pair of crimp head opposite one another;
Described screen bracing or strutting arrangement supports this liquid crystal display, so that the band bonding plane of liquid crystal display is positioned at bonding top with band;
In the described a pair of crimp head at least the crimp head of bonding downside with band and bonding with band contact position and leave bonding with the position of band between advance and retreat mobile.
4. a liquid crystal display is bonding with the adhering device of being with, and it is characterized by: in the described bonding sticking device with band of claim 3, bonding is the anisotropic conductive film that is formed by dispersed electro-conductive particle in resin molding with band.
5. a liquid crystal display is bonding with the adhering device of being with, it is characterized by: in claim 3 or 4 described bonding sticking devices, be provided with that conveyance is bonding supports described liquid crystal display with the band carrying device of being with, described screen bracing or strutting arrangement in the top position of the band carrying channel by this band carrying device with band.
6. the bonding adhering device with band of a liquid crystal display is characterized by: in the described sticking device of claim 5, described band carrying device have adhesion described bonding with band ring-type long substrate band and at the vertical band carrying device of this base material band of conveyance.
7. a liquid crystal display is bonding with the adhering device of being with, it is characterized by: in claim 5 or 6 described sticking devices, described screen supportive device the band bonding plane that makes liquid crystal display band on the carrying channel the adhesion operating position and leave this adhesion operating position, be used to load between the liquid crystal display loading position of liquid crystal display mobile, and
Described a pair of crimp head can open and close as the center with the band carrying channel and move.
8. a liquid crystal display is bonding with the sticking device of being with, it is characterized by: in claim 3 to 7 in each described bonding sticking device, with being with the face contact and being arranged at least one face of face of bonding crimp head with the upside of being with and substrate contacts buffer part is set with bonding in the crimp head that is arranged in bonding downside with band with band.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26494596A JP3484896B2 (en) | 1996-10-04 | 1996-10-04 | Method and apparatus for attaching adhesive tape to liquid crystal panel substrate |
| JP264945/1996 | 1996-10-04 | ||
| JP264945/96 | 1996-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1209886A true CN1209886A (en) | 1999-03-03 |
| CN1124517C CN1124517C (en) | 2003-10-15 |
Family
ID=17410379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97191876A Expired - Fee Related CN1124517C (en) | 1996-10-04 | 1997-10-06 | Method and apparatus for bonding adhesive tape of liquid crystal panel |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3484896B2 (en) |
| KR (1) | KR100482376B1 (en) |
| CN (1) | CN1124517C (en) |
| TW (1) | TW527514B (en) |
| WO (1) | WO1998014822A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325981C (en) * | 2002-03-20 | 2007-07-11 | Lg.菲利浦Lcd株式会社 | Working platform structure of binding machine and its control method |
| CN102348372A (en) * | 2010-07-29 | 2012-02-08 | 株式会社日立高新技术 | FPD component assembling device |
| CN101916001B (en) * | 2007-08-21 | 2012-10-10 | 株式会社日立高新技术 | ACF attaching method and ACF attaching apparatus |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3886266B2 (en) * | 1998-09-30 | 2007-02-28 | オプトレックス株式会社 | ACF sticking device for liquid crystal display panel |
| KR20000042747A (en) * | 1998-12-26 | 2000-07-15 | 전주범 | Method for controlling translation of anisotropic conductive film and rotation table when the anisotropic conductive film is pressed |
| US6414741B2 (en) * | 2000-05-10 | 2002-07-02 | Kabushiki Kaisha Toshiba | Method of manufacturing flat-panel display device |
| JP4340788B2 (en) * | 2003-04-22 | 2009-10-07 | シャープ株式会社 | Polarizer pasting device to substrate |
| JP2007297177A (en) * | 2006-04-28 | 2007-11-15 | Tomoegawa Paper Co Ltd | Refractive index adjustable tape pasting device |
| KR100968214B1 (en) * | 2008-09-09 | 2010-07-06 | 한동희 | Substrate bonding apparatus and method |
| JP5616494B1 (en) * | 2013-07-04 | 2014-10-29 | 日東電工株式会社 | Method and apparatus for forming laminated substrate |
| KR102148674B1 (en) * | 2018-12-31 | 2020-08-27 | 주식회사 에스에프에이 | System for attaching film to panel |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553130A (en) * | 1991-08-28 | 1993-03-05 | Osaki Eng Kk | Anisotropic conductive film sticking device |
| JPH08136943A (en) * | 1994-11-14 | 1996-05-31 | Ricoh Co Ltd | Liquid crystal display device |
-
1996
- 1996-10-04 JP JP26494596A patent/JP3484896B2/en not_active Expired - Fee Related
-
1997
- 1997-10-03 TW TW086114470A patent/TW527514B/en not_active IP Right Cessation
- 1997-10-06 WO PCT/JP1997/003578 patent/WO1998014822A1/en active IP Right Grant
- 1997-10-06 KR KR10-1998-0704135A patent/KR100482376B1/en not_active IP Right Cessation
- 1997-10-06 CN CN97191876A patent/CN1124517C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325981C (en) * | 2002-03-20 | 2007-07-11 | Lg.菲利浦Lcd株式会社 | Working platform structure of binding machine and its control method |
| CN101916001B (en) * | 2007-08-21 | 2012-10-10 | 株式会社日立高新技术 | ACF attaching method and ACF attaching apparatus |
| CN102348372A (en) * | 2010-07-29 | 2012-02-08 | 株式会社日立高新技术 | FPD component assembling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3484896B2 (en) | 2004-01-06 |
| KR100482376B1 (en) | 2005-08-24 |
| CN1124517C (en) | 2003-10-15 |
| KR19990071851A (en) | 1999-09-27 |
| TW527514B (en) | 2003-04-11 |
| JPH10111483A (en) | 1998-04-28 |
| WO1998014822A1 (en) | 1998-04-09 |
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