CN1206116A - Method of manufacturing color filter - Google Patents
Method of manufacturing color filter Download PDFInfo
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- CN1206116A CN1206116A CN 98108591 CN98108591A CN1206116A CN 1206116 A CN1206116 A CN 1206116A CN 98108591 CN98108591 CN 98108591 CN 98108591 A CN98108591 A CN 98108591A CN 1206116 A CN1206116 A CN 1206116A
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Abstract
The present invention provides a method of manufacturing color filter including following steps: coating a base with black matrix material then forming a black matrix pattern with photoetching technology; radiating a first heat transferring film on the matrix with light source such that a first color filtering layer is formed; radiating a second heat transferring film on the matrix with light source such that a second color filtering layer is formed; radiating a third heat transferring film on the matrix with light source such that a third color filtering layer is formed; solidifying matrix of forming the first, the second and the third color filtering layer when 200 Degree Celsius; forming a transparent electrode layer on the matrix. The present method is simple low in cost. Therefore, the color filter of the present invention has better felting force, chemical resistance, heat resistance, light resistance, color coordinate, planeness than existing technique, and protecting layer is not necessary.
Description
The present invention relates to make the method for color filter, more specifically, relate to the method for the color filter of making LCD.
Color filter shown in Figure 1 comprises the black matrix layer 12 on the glass basis 11; red, blue, the green color filter layer 13a, 13b, the 13c that on black matrix layer 12, form, and on black matrix layer 12 and color filter layer 13a, 13b, 13c the protective seam 14 and the transparent electrode layer 15 of formation successively.
Use the pigment dispersing method, print process, electrodeposition process is made color filter.According to the pigment dispersing method, by applying, expose, the pigment that colour developing and baking are dispersed in the photosensitive resin forms color filter.With reference to Fig. 2 method according to pigment dispersing manufactured color filter is described.
With reference to Fig. 2, on glass basis 21, apply black matix and form material 26, as the chromium metal, or organic material.Thereby carry out photoetching process subsequently and form black matix pattern 22.Then, the coated red filter layer forms composition 27 on the glass basis 21 with black matix pattern 22, exposes with 28 pairs of presumptive areas of light shield then, thereby and develops the color and form red filter layer 23a.
Form green and blue color filter layer 23b and 23c by the same way as that forms red filter layer.
On the product that is obtained, form protective seam 24 and transparent electrode layer 25 then successively, to make color filter.
By above method, can make color filter obtain good degree of accuracy and reproducibility, but its manufacture process is oversize and complicated.
Also can make color filter with print process, wherein coating is red, green on printed panel, the blue oil China ink.Yet print process has relatively poor degree of accuracy and reproducibility.
In electro-deposition method, on transparency electrode galvanochemistry form red, green, blue color filter.Use this method, the flatness of color filter is better, but color characteristics is relatively poor as purity.
In order to overcome the above problems, the someone has proposed film transfer method and thermal shift assay recently.Here, red, green except replacing forming with the sandwich method of using film, outside the cladding process of the composition of blue color filter layer, the film transfer method is similar to conventional pigment dispersing method.By the thermal shift assay that proposes by Kodak and 3M, use light source, thereby the color filter layer material of transfer membrane is transferred to formation color filter layer on the matrix as laser or flashlamp.
Simultaneously, the hardness that the color filter of display device is had relatively high expectations, cohesive force, chemical resistance, thermotolerance, photostability, and color characteristics.Yet in the color filter made from thermal shift assay, above performance is not gratifying.And thermal shift assay still has many problems, and it does not also reach practical degree.
An object of the present invention is provides a kind of manufacturing to have good film hardness with thermal shift assay, cohesive force, the straightforward procedure of the color filter of reliability and color characteristics.
In order to reach above purpose of the present invention, the invention provides a kind of method of making color filter, it comprises step:
A-1) use the black matrix material coated substrates, and form the black matix pattern by photoetching process subsequently;
B-1) be positioned on the matrix with radiation of light source and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form the first color filter layer thus;
C-1) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
D-1) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
E-1) form the matrix of the first, the second, the 3rd color filter layer thereon 200～300 ℃ of following curing;
F-1) on the product that is obtained, form transparent electrode layer.
The invention provides the another kind of method of making color filter, it comprises step:
A-2) use the black matrix material coated substrates, and form the black matix pattern by photoetching process subsequently;
B-2) be positioned on the matrix with radiation of light source and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form the first color filter layer thus;
C-2) form the matrix of the first color filter layer thereon 200～300 ℃ of following curing;
D-2) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
E-2) form the matrix of the second color filter layer thereon 200～300 ℃ of following curing;
F-2) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
G-2) form the matrix of the 3rd color filter layer thereon 200～300 ℃ of following curing;
H-2) on the product that is obtained, form transparent electrode layer.
The present invention also provides another to make the method for color filter, and it comprises step:
A-3) thus be positioned on the matrix and comprise that the transfer membrane that heat shifts black matrix layer forms the black matix pattern with radiation of light source.
B-3) be positioned on the matrix with radiation of light source and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form the first color filter layer thus;
C-3) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
D-3) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
E-3) form the matrix of the first, the second, the 3rd color filter layer thereon 200～300 ℃ of following curing;
F-3) on the product that is obtained, form transparent electrode layer.
The present invention also provides another to make the method for color filter, and it comprises step:
A-4) thus be positioned on the matrix and comprise that the transfer membrane that heat shifts black matrix layer forms the black matix pattern on matrix with radiation of light source;
B-4) be positioned on the matrix with radiation of light source and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form the first color filter layer thus;
C-4) form the matrix of the first color filter layer thereon 200～300 ℃ of following curing;
D-4) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
E-4) form the matrix of the second color filter layer thereon 200～300 ℃ of following curing;
F-4) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
G-4) form the matrix of the 3rd color filter layer thereon 200～300 ℃ of following curing;
H-4) on the product that is obtained, form transparent electrode layer.
Preferably, the thickness of transparent electrode layer is 800～4000_, and its plate resistance is 2～100 Ω/.
Preferably, on matrix, form redly, green, behind the blue color filter layer, before forming transparent electrode layer, form thickness and reach tens～several thousand _ cushion so that increase cohesive force between color filter layer and the transparent electrode layer.Cushion is by SiO
2Or silicon nitride (SiN
4) form.
Preferably, green forming black matrix layer and red, form protective seam on the matrix of blue color filter layer, so that increase planarization.More preferably, further forming thickness on protective seam reaches tens to several thousand _ the SiO as cushion
2Layer.
In addition, preferably, forming black matrix layer, color filter layer, transparent electrode layer, cushion (SiO
2) use UV ray and/or O before and afterwards
3Or surfactant is handled matrix surface.
Describe optimized technical scheme in detail by the reference accompanying drawing, above purpose of the present invention and advantage will become more obvious.
Fig. 1 represents the structure of conventional color filter;
Fig. 2 represents the method with conventional pigment dispersing manufactured color filter;
Fig. 3 A-Fig. 6 A represents to make according to the present invention the method for color filter;
Fig. 7 represents the structure of transfer membrane;
Fig. 8 is the structure sketch of transfer device.
With reference to Fig. 3, form material formation black matrix layer 32a (Fig. 3 A) thereby on matrix 31, apply black matix, and form black matix pattern 32b by photoetching process (Fig. 3 B).Place the transfer membrane 33 of first color filter thereon on the matrix 31 with predetermined space formation black matix pattern 32b, then, when using the counterdie 33a of light source radiative transfer film 33, thereby light absorbing zone 33b absorbing light is emitted heat.Because the heat of emitting, thereby the first color filter layer 33c transfers to and forms the first color filter layer 34a (Fig. 3 C) on the matrix 31, with identical method formation the second and the 3rd color filter layer 34b and 34c.Then, solidify final product (Fig. 3 D) down at 200～300 ℃.
In solidification process, solidify the color filter layer by condensation reaction or radical reaction, the hardness of color filter layer is increased to 3H or higher from about 1H (before solidifying).When increasing the hardness of color filter layer by curing, film will shrink.At this moment, the contraction factor of film thickness is 2～20%.
As shown in Figure 3, solidification process can carry out once after forming the first, the second, the 3rd color filter, or shown in Fig. 4-6, carries out three times with the formation of each color filter layer.It is elongated that curing makes whole process respectively, but prevented the color filter layer that at first forms and influence between next step the transfer layer.
Solidify the back and on matrix 31, form protective seam 35, on protective seam 35, form transparent electrode layer 36 (Fig. 3 E) with sputter or electron beam then.When the thickness of color filter layer is full and uniform, can be the first, the second, the 3rd color filter layer 34a, 34b, 34c is last directly to be formed transparent electrode layer 36 and need not protective seam 35 (Fig. 3 F).
The method that Fig. 4 makes color filter is identical with Fig. 3, but carries out solidification process separately for the color filter layer that each solidifies.
That is to say, on matrix 41, apply black matrix material, so that form black matrix layer 42a (Fig. 4 A), form black matix pattern 42b (Fig. 4 B) with photoetching process, the transfer membrane 43 of the first color filter layer is placed on it to be formed on the matrix 41 of black matix pattern 42b.Then, when using the counterdie of light source radiative transfer film 43, thereby light absorbing zone 43b absorbing light is emitted heat.At this moment, the heat of being emitted is transferred to the first color filter layer 43c on the matrix 41, thereby forms the first color filter layer 44a (Fig. 4 c).Then, solidify final product (Fig. 4 D) down at 200～300 ℃.
Shift the second color filter layer with identical method.Then, thus solidifying down final products at 200～300 ℃ again forms the second color filter layer 44b (Fig. 4 E).
Shift the 3rd color filter layer 44c with identical method, and be cured as mentioned above.Fig. 4 F is illustrated in and forms the first, the second and the 3rd color filter layer 44a, 44b, the state of 44c on the matrix 41.(Fig. 4 F).
Form thereon on the matrix 41 of color filter layer and form protective seam 45 and transparent electrode layer 46 successively.Or at the first, the second and the 3rd color filter layer 44a, 44b, 44c is last directly to be formed transparent electrode layer 46 and need not protective seam 45.(Fig. 4 H).
In the manufacture method of Fig. 3 and 4,, require the solidification process of black matix pattern when black matrix material is a graphite or when black pigment is dispersed in the organic material that obtains in the photosensitive resin.The solidification process of black matix pattern can be in the curing schedule of first color filter before the formation step of the first color filter layer, or carries out in the curing schedule of the first, the second, the 3rd color filter layer.When black matrix material was graphite, solidification temperature was 100～300 ℃, otherwise solidification temperature is 200～300 ℃.
In the manufacture method of Fig. 5 color filter, adopt heat to shift and form black matix pattern and color filter layer.
On matrix 51, place the transfer membrane 52 of black matrix layer.When using the counterdie 52a of light source radiative transfer film 52, thereby light absorbing zone 52b absorbing light is emitted heat.At this moment, thus the heat of emitting black matrix layer 52c transferred on the matrix 51 form black matrix layer 53 (Fig. 5 A).
Use the transfer membrane of the transfer membrane replacement black matrix layer 52 of the first color filter layer 54, with the method identical the first color filter layer 54c shifted on matrix 51, thereby form the first color filter layer 55a (Fig. 5 B) with black matrix layer 52c.Form the second and the 3rd color filter layer 55b and 55c with identical method.Solidify final product down so that increase the hardness (Fig. 5 C) of film at 200～300 ℃.The the first, the second, the 3rd color filter layer 55a, 55b, 55c can solidify together, or solidifies separately as shown in Figure 6.
On final product, form protective seam 56 and transparent electrode layer 57 (Fig. 5 D) successively, or transparent electric 57 directly form (Fig. 5 E) on the structure shown in Fig. 5 C.
The method that Fig. 6 makes color filter is identical with Fig. 5, but each color filter layer solidifies separately.
Place the transfer membrane 62 of black matrix layer on matrix 61, then, when radiation of light source passes the counterdie 62a of transfer membrane 62, thereby light absorping film 62b absorbing light is emitted heat.The heat of emitting at this moment, is transferred to black matrix layer 62c on the matrix 61.Thereby on matrix 61, form black matrix layer 63 (Fig. 6 A).
Use the transfer membrane 64 of the first color filter layer to replace the transfer membrane 62 of black matrix layers, the first color filter layer 64c shifted on matrix 61 (Fig. 6 B) with the method identical with black matrix layer 63.Thereby 200～300 ℃ solidify down obtained product form the first color filter layer 65a (Fig. 6 C).
Form the second, the three color filter layer 65b and 65c (Fig. 6 D and 6E) with the method identical with the first color filter layer 65a.
On final product, form protective seam 66 and transparent electrode layer 67 (Fig. 6 F) successively, or transparent electrode layer 67 directly forms (Fig. 6 G) thereon.
In the manufacture method shown in Fig. 5 and 6, the solidification process of black matix pattern in the curing schedule of the first color filter layer, or carried out in the curing schedule of the first, the second, the 3rd color filter layer before the formation step of the first color filter layer.Preferably 200～300 ℃ of solidification temperatures.
Thermal transfer film of the present invention is not restricted to the film of particular type, they are common induced with laser transfer membrane.The basic structure of transfer membrane is shown among Fig. 7.Other that can be formed for improving performance in case of necessity counted tunic.
With reference to Fig. 7, counterdie 71 supports other film, and it is individual layer or compound multilayer.It is thick that counterdie 71 is preferably 10～500 μ m.This layer be by the higher polymer film of transparency, as polyester, and polyacrylic acid, epoxy resin, tygon, polypropylene, or polystyrene is made.Therebetween, polyester film, particularly poly-terephthalic acids ethyl (PET) film is preferred.
Inorganic material comprises aluminium (Al), tin (Sn), and titanium (Ti), cobalt (Co), zinc (Zn), plumbous (Pb), its oxide or potpourri, and have 0.2～3.0 pseudodensity.The oxide of Al and Al is most preferred.Inorganic material layer is preferred thick to be 0.1～10 μ m.
By with colorant, as pigment, thereby or dyestuff and spreading agent be distributed to and obtain organic material in the polymer bonding resin.Preferably, binding resin has reticulate texture, so that guarantee high-octane persistence in transfer process.Pigment or dyestuff comprise carbon black, graphite pigment or IR dyestuff.Their absorbing wavelength are that UV is to infrared light.
The composition of transfer membrane 73 depends on material for transfer.Typical case the can be by adding pigment or dyestuff in the spreading agent, thereby products therefrom being dispersed in the solvent, adding binding resin and other adjuvant obtain transfer membrane and touch 73 composition in the potpourri that disperses.
According to the present invention, black matrix layer is by a kind of composition the in three kinds of materials.The manufacture method of black matrix layer is different with the material of black matrix layer.
At first, chromium (Cr) and chromium oxide (CrO
x) be widely used for black matrix layer.Here, by using sputter or electron beam deposition on glass basis, to form individual layer Cr or the CrO that thickness is approximately 400～2000_
xAnd this single layer patternization is obtained black matrix layer with photoetching process.In addition, also can form thickness and be approximately the double-deck of 400～3000_ or three layers of Cr or CrO
x
Black matrix layer of the present invention can be pressed one of array structure and form, and wherein the thickness of black matrix layer is preferably 400～3000_.
1) Cr layer
2) CrO
xLayer
3) Cr layer/CrO
xLayer
4) CrO
xLayer/Cr layer
5) CrO
xLayer/Cr layer/CrO
xLayer
The second, the photosensitive organic material is used for black matrix layer.Obtain the photosensitive organic material by being dispersed in the photosensitive resin with pigment, as carbon black, spin coating photosensitive organic material on matrix then, thereby and exposure and colour developing form the black matix pattern.Here, preferably, the thickness of black matix pattern is 0.5～1.5 μ m.
The 3rd, graphite can be used for black matrix layer.In the matrix exposure and the colour developing that will apply on the matrix after positive photosensitive resin also will apply, thereby form the photosensitive resin pattern.
Spin coating thickness is the graphite of 1000～5000_ and removes photosensitive resin pattern (removing method) fully with aqueous slkali subsequently on the matrix that forms the photosensitive resin pattern, thereby finishes the preparation of black matix pattern.
Preferably, with double-deck Cr and CrO
xBe used for black matrix layer.Available CrN
x, chromic sulfide, or its potpourri replaced C r and CrO
x
In the transfer equipment of Fig. 8, high energy laser beam is emitted from light source 81.But light source high-performance solid laser instrument, as Nd/YAG, gas laser is as CO
2, or CO, or the Nd/YAG laser instrument (Nd/YAG of coupling diode, 0.1～40W) that combine with diode.
The laser beam of being emitted is single bundle or by beam splitter Dan Shu is cut apart the multi-beam that the intensity that obtains equates.In addition, can respectively restraint light intensity and make the pattern that forms by a pattern that forms and by simple lines by a light beam being divided into multi-beam and control.
Preferably, the multi-beam that replaces intensity to equate with single laser beam.This is because under the situation of Dan Shu, and the pattern that is formed by simple lines can and form in the short period of time with simple device fabrication.
According to the form that is shifted, with first lens combination 83, the control strength ratio arrives on the scanning mirror 84 laser beam of single bundle or multi beam in modulator 82.Here, scanning mirror 84 is transferred to light along matrix X-axle the position of hope.
Transfer on the transfer membrane 86 that scribbles material for transfer by the light that second lens combination 85 will arrive on the scanning mirror 84.Simultaneously, the material transfer that only will apply in the Department of Radiation office of transfer membrane 86 is to matrix 87.Here, the width of pattern is by the susceptibility of transfer membrane, and the scanning of the distribution of luminous energy and intensity and light is than decision.By moving of computing machine 89 control platforms 88.Here, reference number 90 representatives are used for the scanning mirror controller of gated sweep mirror 84.
According to the present invention, but light source laser, argon lamp, or Halogen lamp LED.Here, can use common lasers, as solid, gas, semiconductor, dyestuff, excimer.Simultaneously, but laser beam multimode bundle or single mode Gaussian beam.
Describe the present invention with reference to embodiment, but embodiment does not limit the invention.
(embodiment)
I. shift manufacturing black matix pattern with heat
With cleaning fluid (ET-cold, Environmental Tech_USA), clean 370 * 400mm
2Glass basis, and in deionized water, carry out sonicated subsequently.Glass basis surface after the cleaning is carried out UV and thermal treatment again, thereby increases the cohesive force of the film that forms.
Then, on matrix, place by counterdie the transfer membrane that light absorping film and black matrix film are formed.
A beam sizes is approximately 30 μ m (1/e
2) continuous wave (CW) the Nd/YAG laser multiple laser that is divided into intensity and equates, unlatching and the closure of each Shu Guang that control subsequently and window shape formula adapt.Thereby laser beam is approximately the black matix pattern of 20 μ m to transfer membrane scanning manufacturing width.
II. make the black matix pattern with photoetching process
1. make Cr, CrO
x, Cr/CrO
x, or CrO
x/ Cr/CrO
xBlack matrix layer and pattern thereof.
Under the condition of table 1, make black matrix layer with batch sputter equipment.The Cr film uses argon (Ar) as discharge gas, CrO
xFilm CO
2And N
2As reacting gas.
(table 1)
| Film type | Target | Oxygen (SCCM) | Argon (SCCM) | Sputtering pressure (? the milli torr) | Voltage (kw) | Substrate temperature (℃) | Thickness (nm) |
| The Cr monofilm | ?Cr(T2) | ????0.0 | ????900 | ??8.9×10 -3 | ??DC5.5 | ??200 | ????1750 |
| ?CrO xMonofilm | ?Cr(T1) | CO 2：40 ?N 2：19 | ????330 | ??3.9×10 -3 | ??DC5.0 | ??200 | ????1750 |
| ?Cr/CrO xTwo films | ?Cr(T1) | CO 2：40 N 2：19 | ????330 | ??3.9×10 -3 | ??DC5.0 | ??200 | ????1650 |
| ?Cr(T2) | ??0.00 | ????900 | ??8.9×10 -3 | ??DC5.5 | ??200 | ||
| ?CrO xThe two films of/Cr | ?Cr(T2) | ??0.00 | ????900 | ??8.9×10 -3 | ??DC5.5 | ??200 | ????1950 |
| ?Cr(T1) | CO 2：40 N 2：19 | ????330 | ??3.9?×?10 -3 | ??DC5.0 | ??200 | ||
| ?CrO x/Cr/ ??CrO xThree films | ?Cr(T2) | CO 2：40 ?N 2：19 | ????330 | ??3.9×10 -3 | ??DC5.0 | ??200 | ????1650 |
| ?Cr(T1) | ??0.00 | ????900 | ??8.9×10 -3 | ??DC5.5 | ??200 | ||
| ?Cr(T2) | CO 2：40 N 2：19 | ????330 | ??3.9×10 -3 | ??DC5.0 | ??200 |
With cleaning fluid (ET-cold, Environmental Tech_USA) cleans the black matix laminar surface, and handle the surface of being cleaned in deionized water for ultrasonic subsequently, coating thickness is approximately the photosensitive resin (Shielpy SRC-300 or Hochest Korea HKR230M) of 1-2 μ m on this surface.With light shield with about 50～80mJ/cm
2Photosensitive resin layer is exposed, and developed the color 60 seconds with the photosensitive resin layer of Hochest Korea MIF312 developer subsequently, thereby form the photosensitive resin pattern exposure.
With photosensitive resin pattern and Cr etching solution MA-SO
3(ammonium nitrate: HNO
3: deionized water=11.2: 4.5: 84.3, Dongwoo Semiconductor Co.) etching black matix (chromium) layer subsequently, NaOH solution with 3% or N-Methyl pyrrolidone (NMP) are removed the photosensitive resin pattern, thus formation black matix pattern.
The colour developing and the etching condition that form the material of black matrix layer have been shown in table 2.Here, the standard pattern width of used light shield is 20 μ m to SVGA, be 25 μ m to VAG, and developed width is 20 ± 0.5 μ m to SVGA, is 25 ± 0.5 μ m to VAG.
Table 2
| Colour developing | Clean | Etching | Clean | |
| Cr monofilm (1750_) | Spray: 50 seconds 0.1kgf/cm 2,25℃ | 4 seconds 2.0kgf/cm 2 | Spray: 50 seconds 0.3kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 |
| ??CrO xMonofilm (1750_) | Spray: 50 seconds 0.1kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 | Spray: 40 seconds 0.3kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 |
| CrO xThe two films of/Cr (550_/1400_) | Spray: 50 seconds 0.1kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 | Spray: 45 seconds 0.3kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 |
| Cr/CrO xTwo films (1l00_/550_) | Spray: 50 seconds 0.1kf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 | Spray: 50 seconds 0.3kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 |
| CrO/Cr/CrO x(550_/500_ ??/550_) | Spray: 50 seconds 0.1kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 | Spray: 50 seconds 0.3kgf/cm 2,25℃ | 48 seconds 2.0kgf/cm 2 |
2. the manufacturing of organic black matix pattern
Clean glass basis (370 * 400mm with cleaning fluid (ET-cold, Environmental Tech_USA)
2), and the glass basis surface after sonicated is cleaned subsequently.Spin coating sensitization organic black matix material (Fuji-Hunt Co.CK-S171) on glass basis.Then, thus it is the organic black matix layer of 1.0 μ m that the prebake conditions products therefrom forms thickness.
Then, use light shield with 400mJ/cm
2Presumptive area to black matrix layer is exposed, and in 20%CD (developer) solution (Fuji-Hunt Co.) products therefrom is developed the color about 70 seconds subsequently.Then, at 26 ℃ temperature and 140kg/cm
2Pressure cleans black matrix layer down, remains in lip-deep pigment thereby remove, and solidifies 1 hour down at 220 ℃.At this moment, the standard pattern width of light shield is 20 μ m to SVGA, 24 μ m concerning VGA, and developed width is 21 ± 0.5 μ m to SVGA, is 25+0.5 μ m to VGA.
3. the manufacturing of graphite black matix pattern
Clean glass basis (370 * 400mm with cleaning fluid (ET-cold, Environmental Tech_USA)
2), and the glass basis after sonicated is cleaned subsequently.Glass surface after UV processing and annealing are cleaned.
Have the glass basis on the surface after the processing with photosensitive resin (PMER-6005, Tokyo Ohka Kogyo Co.LTD) spin coating, and, be the photosensitive resin layer of 1 μ m thereby form thickness 120 ℃ of following prebake conditions.With light shield with 70mJ/cm
2The photosensitive resin layer presumptive area is exposed, and products therefrom was developed the color about 64 seconds by spraying 0.5%NaOH solution.Then, thus clean and dry products therefrom formation photosensitive resin pattern.
With graphite (LCD-BM12, Hitachi Powdered Metal Co.LTD) spin coating photosensitive resin pattern and prebake conditions subsequently, be the black matrix layer of 0.4 μ m thereby form thickness.Then, the NaOH aqueous solution with 1% is used 3kgf/cm subsequently to black matrix layer colour developing 85 seconds
2Thereby pressure dispose photosensitive resin and make its complete banding and further dry.Then, under 150 ℃, solidify products therefrom again 20 seconds, thereby form graphite black matix pattern.At this moment, the standard pattern width of light shield is 20 μ m to SVGA, be 25 μ m to VGA, and developed width is 20 ± 0.5 μ m to SVGA, is 25 ± 0.5 μ m to VGA.
III. (R), green (G), the formation of blue (B) color filter layer
Clean on it matrix that forms the black matix pattern with cleaning fluid (ET-cold, Environmental Tech_USA), and sonicated matrix subsequently.Then, the matrix surface after UV processing and annealing are cleaned.
On the glass basis after the cleaning, place the transfer membrane of red color filtrator, then, from CW Nd/YAG (Quantronic8W) thus the single-mode laser bundle that penetrates the laser instrument forms strip red color filtrator pattern with the velocity sweeping transfer membrane of about 5 meter per seconds.At this moment, the laser beam spot diameter is controlled to be: to VGA is 140 μ m (1/e
2), be 130 μ m (1/e to SVGA
2).At this moment, the actual pattern width is 100 μ m concerning VGA, is 90 μ m concerning SVGA.
After laser beam is finished scanning process, remove the transfer membrane of red color filtrator.Then, to form the green and blue color filter pattern of strip in the identical mode of red color filtrator pattern.No matter strip color filter pattern can form and its color by any order.
Curing is red, green down at about 250 ℃, blue color filter pattern 1 hour.
IV. there is not the manufacturing of the color filter of protective seam
With cleaning fluid (ET-cold, Environmental Tech_USA) clean on it form red, green, the matrix of blue color filter pattern, and sonicated matrix subsequently.Then, UV handles and the annealed glass matrix surface.Then, the plate resistance that is formed for flat-panel display devices with the batch (-type) sputter equipment under the condition of table 3 is the ITO layer of 7～8 Ω/.
Table 3
| Part | Condition |
| Sputtering voltage | DC1KW+RF1KW |
| Reach pressure | 10 -7～10 -5(???) |
| Sputtering pressure | 2.3 milli torr |
| Film forms speed | 50_/minute |
| Spatter the time in advance | 3 minutes |
| Thickness | ～2000_ |
| Argon (SCCM) | 300 |
| Substrate temperature | 200℃ |
V. form cushion (SiO on it
2The manufacturing of color filter layer)
Clean formation red (R) on it with cleaning fluid (ET-cold, Environmental Tech_USA), green (G), the matrix of blue (B) color filter layer, and subsequently matrix surface is carried out UV processing and annealing.Then, under the condition of table 4, be formed for the ITO layer of 7～8 Ω/ of flat-panel display devices with the batch (-type) sputter equipment.
Table 4
| SiO 2Layer | The ITO layer | |
| Sputtering voltage | RF3．5KW | DC1KW+RF1KW |
| Arrive pressure | 3×10 6Torr | 3×10 -6Torr |
| Sputtering pressure | 3．3×10 -3The milli torr | 3．3×10 -3The milli torr |
| Spatter the time in advance | 3 minutes | 3 minutes |
| Thickness | ～2000_ | ～2000_ |
| Argon (SCCM) | 300 | 300 |
| Substrate temperature | 200℃ | 200℃ |
VI. form protective seam and cushion (SiO thereon
2The manufacturing of color filter layer)
Clean on it with cleaning fluid (ET-cold, Environmental Tech_USA) and to form redly, green, the glass basis of blue color filter layer, and carry out sonicated subsequently advances to do UV to a surface of matrix and handles and anneal.
Mix OptomerSS6600 and SS0600 (Japan synthetic rubber Co.).This potpourri of spin coating on the matrix surface of UV processing and annealing.At 120 ℃ of following prebake conditions products, thereby and solidify again under 230 ℃ subsequently that to form thickness in 1 hour be the protective seam of 2.0 μ m.(ET-cold EnvironmentalTech_USA) cleans the matrix that forms protective seam on it, and carries out sonicated subsequently with cleaning fluid.Matrix surface after cleaning is carried out UV processing and annealing.
To have SiO with manufacturing
2The identical method of color filter of layer, the thickness that is formed for flat-panel display devices with the clearance-type sputter equipment is the SiO of 200_
2Layer, and formation thickness is that 2000_, plate resistance are the ITO layer of 7～8 Ω/.
(comparing embodiment)
With red photosensitive resin coated glass matrix, thereby form red color filtrator pattern with post-exposure and colour developing.Then, replace red photosensitive resin, on the glass basis that forms red color filtrator pattern, form green and blue color filter pattern with green and blue photosensitive resin.
Here, respectively with red 6011L, green 6011L, blue 6011L, (Fuji-Hunt Co.) is used for red, green, blue photosensitive resin.
As mentioned above, in the method for making color filter, form color filter layer and/or black matrix layer and curing subsequently.Simultaneously, in conventional thermal transfer method, curing is carried out in heat transfer process automatically, and does not have independent solidification process.Yet, according to the present invention, use thermosetting material, under 200～300 ℃ (preferably, under about 250 ℃), be cured process about 1 hour.As a result, the hardness of the film of color filter layer is better than conventional prior art.
The hardness of the film of solidification process front and back color filters has been shown in table 5.The hardness of this film is tested according to Japanese Industrial Standards (JIS) K5400.
Table 5
| Shift the back pencil hardness | Solidify the back pencil hardness | |
| Red (R) layer | 1H | 4H |
| Green (G) layer | 1H | 4H |
| Blue (B) layer | 1H | 4-5H |
Fig. 5 shows that the film hardness of color filter layer is higher behind the solidification process.
Simultaneously, test is by cohesive force, chemical resistance, thermotolerance, photostability and the color coordinates characteristic of the color filter layer of embodiment and comparing embodiment production.Interpretation of result is as follows.In following table, each numerical value is the mean value that obtains from three or more revision test.
At first, according to ASTMD3359-93, X-cuts girdle tests (X-cut tape test), tests that each is red, green, the cohesive force of blue color filter layer (thickness: be approximately 1.2 μ m).The results are shown in the table 6.
Table 6
| Red (R) | Green (G) | Blue (B) | |
| Embodiment | 5A | 5A | 5A |
| Comparing embodiment | 5A | 5A | 5A |
Second, under 25 ℃, each color filter layer is immersed in chemical solution, as 5%NaOH, 10%HCl, γ-Ding Suan lactone, N-Methyl pyrrolidone (NMP), or check its change color in the isopropyl alcohol (IPA) after about 10 minutes, each is red, green thereby test, blue color filter layer (thickness: chemical resistance about 1.2 μ m).The results are shown in the table 7.Here, as Δ E
AbBe 3 or still less the time, chemical resistance is defined as well.
Table 7
| 5％NaOH | ?10％HCl | γ-Ding Suan-1 lactone | ??NMP | ??IPA | Acetone | Deionized water | ||
| Embodiment | Red (Δ E ab) | ??1.83 | ??0.63 | ??0.63 | ??0.47 | ??0.35 | ??0.97 | ??0.65 |
| Green (Δ E ab) | ??1.86 | ??0.59 | ??0.55 | ??0.58 | ??0.50 | ??0.58 | ??0.85 | |
| Blue (Δ E ab) | ??0.43 | ??0.35 | ??0.82 | ??0.35 | ??0.78 | ??0.23 | ??0.49 | |
| Comparing embodiment | Red (Δ E ab) | ??0.86 | ??0.41 | ??0.29 | ??2.59 | ??0.31 | ??0.59 | ??0.65 |
| Green (Δ E ab) | ??0.72 | ??0.51 | ??0.89 | ??0.47 | ??0.27 | ??0.67 | ??0.58 | |
| Blue (Δ E ab) | ??0.15 | ??0.65 | ??0.29 | ??0.52 | ??0.34 | ??0.56 | ??0.065 | |
The 3rd, by each color filter layer being put into about 250 ℃, N
2Check its change in color after reaching 1 hour in the stove of atmosphere, each is red, green thereby test, the thermotolerance of blue color filter layer (thickness: be approximately 1.2 μ m).The results are shown in the table 8.
Table 8
| Red (R) △ E ab | Green (G) △ E ab | Blue (B)) △ E ab | |
| Embodiment | 1．45 | 1．28 | 1．54 |
| Comparing embodiment | 1．25 | 1．45 | 1．36 |
The 4th, illustrated in table 9 that each is red, green, the photostability of blue color filter layer (thickness: be approximately 1.2 μ m).Here, it is as follows to test sunproof condition:
Equipment: Weather-Ometer Ci65/XW
Temperature: 53～88 ℃
Humidity: 20～70%RH
Lamp: Xenon Sunshine Carbon
Time: 250 hours
Table 9
| Red (R) △ E ab | Green (G) △ E ab | Blue (B) △ E ab | |
| Embodiment | 1．64 | 0．82 | 2．17 |
| Comparing embodiment | 2．85 | 2．82 | 1．81 |
The 5th, use the color coordinates characteristic of Olympus spectrometer test color filter layer (thickness: be approximately 1.2 μ m), and be shown in Table 10.Here, reference coupon is 1737 naked glass (Coming Co).
Table 10
| Embodiment | Comparing embodiment | ||
| Color coordination | Red | ??R(1.0μm) ????Y：27.7 ??X：0.54,y：0.34 | ??R(1.0μm) ????Y：27.7 ??X：0.53,y：0.34 |
| Green | ??G(1.0μm) ????Y：56.6 ??X：0.32,y：0.50 | ??G(1.0μm) ????Y：56.6 ??X：0.3l,y：0.50 | |
| Blue | ??B(1.0μm) ????Y：22.1 ??X：0.15,y：0.16 | ??B(1.0μm) ????Y：22.1 ??X：0.15,y：0.16 | |
As show shown in the 6-10, the cohesive force of color filter layer of the present invention, chemical resistance, thermotolerance, photostability, color coordination performance are better than these characteristics of the color filter of comparing embodiment.
Simultaneously, the present invention makes the method for color filter and relatively to implement to compare technological process shorter and simpler.
According to the present invention, carry out the hot setting process and form SiO
2Cushion, thus the color filter layer that has than high film hardness formed.As a result, in the formation and cleaning process of combined films, reduced the interface striped that causes owing to the bonding defect between each layer.
Simultaneously, because color filter of the present invention institute augmented performance, thereby do not require protective seam.
Claims (36)
1. method of making color filter, this method may further comprise the steps:
A-1) use the black matrix material coated substrates, and form the black matix pattern by photoetching process subsequently;
B-1) be positioned on the matrix with radiation of light source and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form the first color filter layer thus;
C-1) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
D-1) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
E-1) form the matrix of the first, the second, the 3rd color filter layer thereon 200～300 ℃ of curing;
F-1) on the product that is obtained, form transparent electrode layer.
2. the manufacturing color filter method of claim 1, wherein black matrix material is chromium or chromium oxide.
3. the method for the manufacturing color filter of claim 1, wherein black matrix material is a graphite, or by black pigment being dispersed in the organic material that obtains in the photosensitive resin.
4. the method for the manufacturing color filter of claim 3 wherein also comprises step: 100～300 ℃ of cured matrix, wherein at step b-1) form the black matix pattern by black matrix material before.
5. the method for the manufacturing color filter of claim 3 is wherein at step e-1) in solidify the black matix pattern that forms by black matrix material.
6. the method for the manufacturing color filter of claim 1, wherein the thickness of transparent electrode layer is 800～4000_, and its plate resistance is 2～100 Ω/.
7. the method for the manufacturing color filter of claim 1 also is included in step f-1) form the step of protective seam before.
8. the method for the manufacturing color filter of claim 1 also is included in step f-1) form the step of cushion before.
9. the method for the manufacturing color filter of claim 8 also is included in the step that buffer layer forming step forms protective seam before.
10. the method for the manufacturing color filter of claim 1 wherein forming black matrix layer and the first, the second and the 3rd color filter layer before with afterwards, is used UV ray and/or O
3Or surfactant is handled matrix surface.
11. a method of making color filter, this method may further comprise the steps:
A-2) use the black matrix material coated substrates, and form the black matix pattern by photoetching process subsequently;
B-2) be positioned on the matrix with radiation of light source and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form the first color filter layer thus;
C-2) form the matrix of the first color filter layer thereon 200～300 ℃ of following curing;
D-2) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
E-2) form the matrix of the second color filter layer thereon 200～300 ℃ of following curing;
F-2) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
G-2) form the matrix of the 3rd color filter layer thereon 200～300 ℃ of following curing;
H-2) on the product that is obtained, form transparent electrode layer.
12. the method for the manufacturing color filter of claim 11, wherein black matrix material is chromium or chromium oxide.
13. the method for the manufacturing color filter of claim 11, wherein black matrix material is a graphite, or by black pigment being dispersed in the organic material that obtains in the photosensitive resin.
14. the method for the manufacturing color filter of claim 13 also comprises step: 100～300 ℃ of cured matrix, wherein at step b-2) form the black matix pattern by black matrix material before.
15. the method for the manufacturing color filter of claim 13 is wherein at step c-2) in solidify the black matix pattern that forms by black matrix material.
16. the method for the manufacturing color filter of claim 11, wherein the thickness of transparent electrode layer is 800～4000_, and its plate resistance is 2～100 Ω/.
17. the method for the manufacturing color filter of claim 11 also is included in step h-2) form the step of protective seam before.
18. the method for the manufacturing color filter of claim 11 also is included in step h-2) form the step of cushion before.
19. the method for the manufacturing color filter of claim 18 also is included in the step that buffer layer forming step forms protective seam before.
20. the method for the manufacturing color filter of claim 11 is wherein forming black matrix layer and the first, the second and the 3rd color filter layer before with afterwards, with UV ray and/or O
3, or surfactant is handled matrix surface.
21 1 kinds of methods of making color filter, it comprises step:
A-3) thus be positioned on the matrix and comprise that the transfer membrane that heat shifts black matrix layer forms the black matix pattern with radiation of light source.
B-3) be positioned on the matrix with radiation of light source and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form the first color filter layer thus;
C-3) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
D-3) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
E-3) form the matrix of the first, the second, the 3rd color filter layer thereon 200～300 ℃ of curing;
F-3) on the product that is obtained, form transparent electrode layer.
22. the method for the manufacturing color filter of claim 21 also comprises step: at step b-3) form the matrix of black matix patterned layer before thereon 200～300 ℃ of curing.
23. the method for the manufacturing color filter of claim 21 is wherein at step e-3) solidify the black matix pattern before.
24. the method for the manufacturing color filter of claim 21, wherein the thickness of transparent electrode layer is 800～40000_, and its plate resistance is 2～100 Ω/.
25。The method of the manufacturing color filter of claim 21 also is included in step f-3) form the step of protective seam before.
26. the method for the manufacturing color filter of claim 21 also is included in step f-3) form the step of cushion before.
27. the method for the manufacturing color filter of claim 26 also is included in the step that buffer layer forming step forms protective seam before.
28. the method for the manufacturing color filter of claim 21 is wherein forming black matrix layer and the first, the second and the 3rd color filter layer before with afterwards, with UV ray and/or O
3, or surfactant is handled matrix surface.
29. a method of making color filter, this method may further comprise the steps:
A-4) be positioned on the matrix with radiation of light source and comprise that heat shifts the commentaries on classics film of black matrix layer, thereby on matrix, form the black matix pattern;
B-4) with radiation of light source on matrix and comprise that first heat shifts the transfer membrane of color filter layer, on matrix, form a color filter layer thus;
C-4) form the matrix of the first color filter layer thereon 200～300 ℃ of curing;
D-4) be positioned on the matrix with radiation of light source and comprise that second heat shifts the transfer membrane of color filter layer, on matrix, form the second color filter layer thus;
E-4) form the matrix of the second color filter layer thereon 200～300 ℃ of curing;
F-4) be positioned on the matrix with radiation of light source and comprise that the 3rd heat shifts the transfer membrane of color filter layer, on matrix, form the 3rd color filter layer thus;
G-4) form the matrix of the 3rd color filter layer thereon 200～300 ℃ of curing;
H-4) on the product that is obtained, form transparent electrode layer.
30. the method for the manufacturing color filter of claim 29 also comprises step: 200～300 ℃ of cured matrix, wherein at step b-4) form the black matix pattern before.
31. the method for the manufacturing color filter of claim 29 is wherein at step c-4) in solidify the black matix pattern.
32. the method for the manufacturing color filter of claim 29, wherein the thickness of transparent electrode layer is 800～4000_, and its plate resistance is 2～100 Ω/.
33. the method for the manufacturing color filter of claim 29 also is included in step h-4) form the step of protective seam before.
34. the method for the manufacturing color filter of claim 29 also is included in step h-4) form the cushion step before.
35. the method for the manufacturing color filter of claim 34 also is included in the step that buffer layer forming step forms protective seam before.
36. the method for the manufacturing color filter of claim 31 is wherein forming black matrix layer and the first, the second and the 3rd color filter layer before with afterwards, with UV ray and/or O
3Or surfactant is handled matrix surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98108591 CN1206116A (en) | 1997-05-23 | 1998-03-31 | Method of manufacturing color filter |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20394/97 | 1997-05-23 | ||
| CN 98108591 CN1206116A (en) | 1997-05-23 | 1998-03-31 | Method of manufacturing color filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1206116A true CN1206116A (en) | 1999-01-27 |
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ID=5219683
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98108591 Pending CN1206116A (en) | 1997-05-23 | 1998-03-31 | Method of manufacturing color filter |
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|---|---|
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005019918A1 (en) * | 2003-08-21 | 2005-03-03 | Quanta Display Inc. | A color filter sheet structure and method thereof |
| CN100365446C (en) * | 2002-11-06 | 2008-01-30 | 普立尔科技股份有限公司 | Method for manufacturing color separation film |
| CN100397106C (en) * | 2002-08-07 | 2008-06-25 | 精工爱普生株式会社 | Color filter, method for mfg of color filter substrate and use thereof |
| CN104166265A (en) * | 2014-06-16 | 2014-11-26 | 京东方科技集团股份有限公司 | Color filter substrate, manufacturing method for color filter substrate, organic light-emitting display panel and display device |
| CN101150735B (en) * | 2006-09-19 | 2015-12-02 | 三星电子株式会社 | Image picking-up apparatus, method and medium |
-
1998
- 1998-03-31 CN CN 98108591 patent/CN1206116A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100397106C (en) * | 2002-08-07 | 2008-06-25 | 精工爱普生株式会社 | Color filter, method for mfg of color filter substrate and use thereof |
| CN100365446C (en) * | 2002-11-06 | 2008-01-30 | 普立尔科技股份有限公司 | Method for manufacturing color separation film |
| WO2005019918A1 (en) * | 2003-08-21 | 2005-03-03 | Quanta Display Inc. | A color filter sheet structure and method thereof |
| CN101150735B (en) * | 2006-09-19 | 2015-12-02 | 三星电子株式会社 | Image picking-up apparatus, method and medium |
| CN104166265A (en) * | 2014-06-16 | 2014-11-26 | 京东方科技集团股份有限公司 | Color filter substrate, manufacturing method for color filter substrate, organic light-emitting display panel and display device |
| CN104166265B (en) * | 2014-06-16 | 2017-12-19 | 京东方科技集团股份有限公司 | A kind of colored filter substrate and preparation method thereof, organic electroluminescence display panel, display device |
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