CN119998902A - 陶瓷电子部件、包装体、电路板和陶瓷电子部件的制造方法 - Google Patents

陶瓷电子部件、包装体、电路板和陶瓷电子部件的制造方法 Download PDF

Info

Publication number
CN119998902A
CN119998902A CN202380069730.4A CN202380069730A CN119998902A CN 119998902 A CN119998902 A CN 119998902A CN 202380069730 A CN202380069730 A CN 202380069730A CN 119998902 A CN119998902 A CN 119998902A
Authority
CN
China
Prior art keywords
internal electrode
face
electronic component
ceramic electronic
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380069730.4A
Other languages
English (en)
Chinese (zh)
Inventor
北村翔平
城田步
松冈亚友美
浅子光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Publication of CN119998902A publication Critical patent/CN119998902A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
CN202380069730.4A 2022-09-30 2023-09-29 陶瓷电子部件、包装体、电路板和陶瓷电子部件的制造方法 Pending CN119998902A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022158955 2022-09-30
JP2022158517 2022-09-30
JP2022-158517 2022-09-30
JP2022-158955 2022-09-30
PCT/JP2023/035788 WO2024071420A1 (ja) 2022-09-30 2023-09-29 セラミック電子部品、包装体、回路基板、およびセラミック電子部品の製造方法

Publications (1)

Publication Number Publication Date
CN119998902A true CN119998902A (zh) 2025-05-13

Family

ID=90478208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380069730.4A Pending CN119998902A (zh) 2022-09-30 2023-09-29 陶瓷电子部件、包装体、电路板和陶瓷电子部件的制造方法

Country Status (4)

Country Link
US (1) US20250259787A1 (https=)
JP (1) JPWO2024071420A1 (https=)
CN (1) CN119998902A (https=)
WO (1) WO2024071420A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101197787B1 (ko) * 2010-10-29 2012-11-05 삼성전기주식회사 적층형 세라믹 캐패시터 및 이의 제조방법
JP5811152B2 (ja) * 2012-11-05 2015-11-11 株式会社村田製作所 積層セラミック電子部品、その製造方法、テーピング電子部品連、その製造方法、および積層セラミック電子部品の方向識別方法
KR102724891B1 (ko) * 2020-10-20 2024-11-01 삼성전기주식회사 적층형 전자 부품
JP7720706B2 (ja) * 2021-03-01 2025-08-08 太陽誘電株式会社 セラミック電子部品およびその製造方法

Also Published As

Publication number Publication date
US20250259787A1 (en) 2025-08-14
JPWO2024071420A1 (https=) 2024-04-04
WO2024071420A1 (ja) 2024-04-04

Similar Documents

Publication Publication Date Title
JP7629494B2 (ja) セラミック電子部品
US12112893B2 (en) Ceramic electronic device and manufacturing method of the same
US20230223196A1 (en) Multilayer ceramic electronic device and manufacturing method of the same
US20220059288A1 (en) Multilayer ceramic capacitor
CN114823146A (zh) 陶瓷电子器件及其制造方法
JP2022143334A (ja) セラミック電子部品およびその製造方法
US12198861B2 (en) Ceramic electronic device and manufacturing method of the same
US11315731B2 (en) Ceramic electronic device and manufacturing method of the same
CN119998902A (zh) 陶瓷电子部件、包装体、电路板和陶瓷电子部件的制造方法
US20260018343A1 (en) Ceramic electronic component and manufacturing method of the same
CN115083780A (zh) 陶瓷电子器件、粉末材料、膏剂材料和陶瓷电子器件制造方法
US20240194406A1 (en) Ceramic electronic component, taped package, circuit board, and method for manufacturing ceramic electronic component
US20250357049A1 (en) Ceramic electronic component and method of manufacturing the same
US20250349466A1 (en) Ceramic electronic component, method for manufacturing ceramic electronic component, and mounting board
WO2024204743A1 (ja) セラミック電子部品およびその製造方法
JP7633788B2 (ja) セラミック電子部品およびその製造方法
US20250343005A1 (en) Ceramic electronic component and method for manufacturing the same
US20240331945A1 (en) Multilayer ceramic electronic device
WO2024079966A1 (ja) 積層セラミック電子部品
WO2024070485A1 (ja) セラミック電子部品およびその製造方法
JP2025088273A (ja) 積層セラミック電子部品
WO2024202203A1 (ja) 積層セラミック電子部品、回路基板、および包装体
JP2025028625A (ja) 積層セラミック電子部品およびその製造方法
JP2025088272A (ja) 積層セラミック電子部品
CN120937096A (zh) 层叠陶瓷电子部件、电路板、包装体和层叠陶瓷电子部件的制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination