CN1195960A

CN1195960A - Return circuit basilar plate

Info

Publication number: CN1195960A
Application number: CN98100591A
Authority: CN
Inventors: 井上善贵
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 1997-03-03
Filing date: 1998-03-02
Publication date: 1998-10-14
Anticipated expiration: 2018-03-02
Also published as: GB9802869D0; JPH10247766A; DE19808932C2; GB2322974A; CN1091339C; FR2760313A1; FR2760313B1; KR19980079794A; DE19808932A1

Abstract

A circuit board comprises an insulating board (1a) and a side through hole portion (5) provided on an end face (4) of the insulating board. The side through hole portion contains a first plated layer (5a), and a second plated layer (5b) made of a material whose hardness is higher than the first plated layer, overlaid on the first plated layer. A third plated layer of, e.g. gold may also be added. These layers prevents burring when the end of the circuit board is cut.

Description

Loop substrate

The present invention relates to loop substrate, in detail, relate to loop substrate with side through-hole structure.

Loop substrate extensive use on many electricapparatus goods.Because miniaturization, the tendency of lightness, the integrated level of loop substrate improve just day by day.And, in recent years, for example on female loop substrate of the main substrate of television set, use more small-sized loop substrate be housed, by the female loop substrate that is built up.

As this with the small loop substrate that is loaded, a kind of method that is electrically connected with female loop substrate is to utilize in the side throughhole portions that the loop substrate end face is made the formation splicing ear, utilize this splicing ear, be connected with the loop figure of female loop substrate.

Here, according to Fig. 5～Fig. 8 previous loop substrate is described.

Fig. 5 is previous loop substrate 10; Fig. 6 is the profile that utilizes the major part that the VI-VI line of the side throughhole portions of previous loop substrate cuts open; Fig. 7 is the vertical view of loop substrate material that is used to illustrate the manufacturing of previous loop substrate; Fig. 8 is the vertical view of the D amplification partly of Fig. 7.

At first, as shown in Figure 5, previous loop substrate 10 is made by insulating material, greatly slightly square, on the surperficial 10a, form given loop figure 20 thereon, on this loop figure 20, chip component 30 and discrete component (not shown) etc. are installed, constitute loop substrate 10 with given function.

This loop substrate 10 forms by cutting apart the loop substrate material B.

In addition, on the end face 40 of loop substrate 10, form a plurality of sides throughhole portions 50; They are made of through hole 70 (referring to Fig. 8), and its shape can be (for example) semicircle or circular arc etc.Above-mentioned through hole 70 is divided into two parts by copper electrodeposited coating 50a and scolding tin coating 50b respectively, constitutes side throughhole portions 50.Again, as shown in Figure 5 and Figure 8, on the side throughhole portions 50 of this loop substrate 10 formerly, the electrodeposited coating 50a of copper covered is as substrate, and on this copper electrodeposited coating 50a, it is thicker (for example to form thickness, about 20 micron thickness), the scolding tin coating 50b that constitutes by scolding tin.

Moreover this scolding tin coating 50b is when utilizing scolding tin, when the loop figure of the female loop substrate that does not illustrate among side throughhole portions 50 and the figure is connected, for the adhesion property that improves scolding tin is provided with.In addition, be to be undertaken cutting apart of above-mentioned through hole 70 by the cut-out that utilizes the revolution blade.

But, as shown in Figure 7, because the loop substrate 10 of said structure forms on same substrate simultaneously, when along cutting off line 60a, 60b, in the time of will being divided into single loop substrate 10 by the loop substrate material B cut-out that a plurality of loop substrates 10 that are connected to together constitute, be to utilize cutter (not shown) to cut off with revolution blade, and when cutting off, because it is big to constitute the viscosity of the scolding tin coating 50b (referring to Fig. 5) that forms on the through hole 70 of side throughhole portions 50, therefore, scolding tin can stick to around the revolution blade.

In addition, because the easy plastic deformation of scolding tin coating 50b, viscosity is big, therefore, be difficult to cut off fully, and the cutting powder is difficult to fall.In addition, the cutting powder is bonded on the revolution blade, and the sharpness of revolution blade is degenerated.And, because the sharpness of revolution blade degenerates, can produce burr on the otch of copper electrodeposited coating 50a, stick up tail; Again because scolding tin coating 50b softness also has the problem that produces burr, sticks up tail.

The bigger burr that forms by this copper electrodeposited coating 50a and scolding tin coating 50b, when the loop substrate 10 that has side throughhole portions 50 on end face 40 is placed on female loop substrate (not shown), can peel off from the side throughhole portions 50 of loop substrate 10, and contact with other loop figure on (for example) female loop substrate, thereby make short circuit between the loop, this also is a problem.

Loop substrate of the present invention is made of insulated substrate and the side throughhole portions that is located on this insulated substrate end face, forms first electrodeposited coating and second electrodeposited coating on this side throughhole portions; This second electrodeposited coating is on this first electrodeposited coating, by making than the higher material of the first electrodeposited coating hardness.

In the present invention, first electrodeposited coating is the copper electrodeposited coating, and second electrodeposited coating is the nickel electrodeposited coating.

In addition, in the present invention, on second electrodeposited coating, also form golden electrodeposited coating as the 3rd electrodeposited coating.

The purpose of this invention is to provide a kind of scolding tin adhesion property loop substrate good, stable performance.

Now in conjunction with the accompanying drawings the present invention is described in detail.

Fig. 1 is the perspective view of the loop substrate of embodiments of the invention;

Fig. 2 is the profile that utilizes the major part that the II-II line of side throughhole portions of the loop substrate of embodiments of the invention cuts open;

Fig. 3 is the vertical view of loop substrate material that is used to illustrate the manufacturing of loop substrate of the present invention;

Fig. 4 is the vertical view of amplification of the C portion of Fig. 3 of the present invention;

Fig. 5 is the perspective view of previous loop substrate;

Fig. 6 is the profile that utilizes the major part that the side throughhole portions VI-VI line of the previous loop substrate of Fig. 5 cuts open;

Fig. 7 is the vertical view of loop substrate material that is used to illustrate the manufacturing of previous loop substrate;

Fig. 8 is the vertical view of the D amplification partly of Fig. 7.

As shown in Figure 1, the loop substrate of being made by insulating material of the present invention 1 is made of big slightly square insulated substrate 1a, on the surperficial thereon 1b, be provided with desirable loop figure 2, on this loop figure 2, placing chip components such as (for example) resistance and electric capacity 3 and discrete component (not shown) etc., forming loop substrate 1 with desired function.

On the end face 4 of above-mentioned loop substrate 1, make the side throughhole portions 5 of a plurality of (for example) semicircles or circular arc etc..And for example shown in Figure 2, in this side throughhole portions 5 ... on, form as the first electrodeposited coating 5a and the second electrodeposited coating 5b substrate, that (for example) is made of the copper electrodeposited coating.This second electrodeposited coating is done to be made by the higher material of the above-mentioned first electrodeposited coating 5a hardness of (for example) nickel electrodeposited coating geometric ratio on this first electrodeposited coating 5a.

In addition, copper electrodeposited coating, condition and electroplating blank material composition different and different of the hardness of nickel electrodeposited coating when electroplating.Generally, the hardness ratio copper electrodeposited coating of nickel electrodeposited coating wants high.

On the above-mentioned second electrodeposited coating 5b, also form relatively thinner (for example, several micron thickness), by for example, the 3rd electrodeposited coating 5c that the good materials of scolding tin adhesion property such as gold or silver are made.

Above-mentioned side throughhole portions 5 ... promptly become loop figure connection terminals part with female loop substrate (not shown).

Again as shown in Figure 3 and Figure 4, when making loop substrate 1, on the slit shearing line 6a of this loop substrate materials A, be provided with the through hole 7 of shapes such as a plurality of (for example) circles or ellipse, and in this through hole 7, form the above-mentioned the first, the second and the 3rd electrodeposited coating 5a, 5b, 5c.In addition, this through hole 7 passes through to utilize the cut-out of turning round blade by separated, thereby produces the loop substrate 1 that has side throughhole portions 5 respectively.

In addition, as shown in Figure 3, each above-mentioned loop substrate 1 is to utilize the cutter (not shown) with revolution blade, respectively along many slit shearing line 6a and transversely cutting line 6b, the loop substrate materials A is cut off and produced.This revolution baseplate material A is connected a plurality of by multirow * the multiple row mode disposes when 6 row * 5 row (for example 30) loop substrate 1 and forms with same substrate.Be provided with a pair of ear 8,8 at the two ends of loop substrate materials A, they are used for by anchor clamps (not shown) supporting loop substrate materials A.

Because first electrodeposited coating of loop substrate of the present invention (for example, the copper electrodeposited coating) and on this first electrodeposited coating, second electrodeposited coating of being made by the higher material of hardness ratio first electrodeposited coating (for example, the nickel electrodeposited coating) is formed in the side throughhole portions of work on end face, therefore, when utilizing the revolution blade to cut off to do the slit shearing line of the through hole that the loop substrate material is arranged, second electrodeposited coating is attached on the revolution blade, become pulverulence, and be cut off.Because the viscosity of the viscosity ratio scolding tin coating of second electrodeposited coating is low, therefore, second electrodeposited coating is difficult to be attached on the revolution blade, can not damage the sharpness of revolution blade.In addition, because therefore the hardness of second electrodeposited coating, even suppose to produce burr on the cut-off parts of first electrodeposited coating, stick up tail, also can have the effect that suppresses them also than the hardness height of first electrodeposited coating.

Therefore, when utilizing revolution blade cut-off loop baseplate material, first, the burr of second electrodeposited coating produces fewer, and, even produce, it also is less burr, this burr can not be stripped from from loop substrate, does not therefore have the short circuit between the loop that causes owing to the burr that peels, and the loop substrate of stable performance can be provided.

Again, in the present invention, because on second electrodeposited coating, formed as the electrodeposition of metals golden electrodeposited coating of the 3rd electrodeposited coating or silver-colored electrodeposited coating etc., that the scolding tin adhesion property is better than second electrodeposited coating, and the adhesion property of golden electrodeposited coating and scolding tin is good, therefore, can provide the side throughhole portions that constitutes the good splicing ear part of scolding tin adhesion property.

In addition, owing to compare with second electrodeposited coating, the 3rd electrodeposited coating is thin especially, and therefore, its hardness and viscosity are to cutting off not influence.

Claims

1. a loop substrate is characterized in that, it is made of insulated substrate and the side throughhole portions that is located on this insulated substrate end face, forms first electrodeposited coating and second electrodeposited coating on this side throughhole portions; This second electrodeposited coating is on this first electrodeposited coating, and material that hardness ratio first electroplate floor height low by viscosity ratio scolding tin made.

2. loop substrate as claimed in claim 1 is characterized in that, above-mentioned first electrodeposited coating is the copper electrodeposited coating, and second electrodeposited coating is the nickel electrodeposited coating.

3. loop substrate as claimed in claim 1 is characterized in that, on above-mentioned second electrodeposited coating, formed as the 3rd electrodeposited coating, the scolding tin adhesion property is than the good electrodeposition of metals of above-mentioned second electrodeposited coating.