DE10224057A1 - Ceramic electronics device, of multiple layer construction, has internal electrical connections provided by external conductor grooves, transverse to the layer edges - Google Patents
Ceramic electronics device, of multiple layer construction, has internal electrical connections provided by external conductor grooves, transverse to the layer edges Download PDFInfo
- Publication number
- DE10224057A1 DE10224057A1 DE2002124057 DE10224057A DE10224057A1 DE 10224057 A1 DE10224057 A1 DE 10224057A1 DE 2002124057 DE2002124057 DE 2002124057 DE 10224057 A DE10224057 A DE 10224057A DE 10224057 A1 DE10224057 A1 DE 10224057A1
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- Germany
- Prior art keywords
- electrically conductive
- contact
- layer
- conductive surface
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000004020 conductor Substances 0.000 title claims description 12
- 238000010276 construction Methods 0.000 title abstract 2
- 239000000919 ceramic Substances 0.000 title description 15
- 239000007784 solid electrolyte Substances 0.000 claims abstract description 8
- 239000000523 sample Substances 0.000 claims abstract description 7
- 239000002131 composite material Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 9
- 238000010292 electrical insulation Methods 0.000 claims description 4
- 239000012811 non-conductive material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000005192 partition Methods 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 abstract description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 abstract description 4
- 239000010410 layer Substances 0.000 abstract 3
- 239000011229 interlayer Substances 0.000 abstract 1
- 239000011224 oxide ceramic Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 description 18
- 238000003475 lamination Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02D—CONTROLLING COMBUSTION ENGINES
- F02D41/00—Electrical control of supply of combustible mixture or its constituents
- F02D41/02—Circuit arrangements for generating control signals
- F02D41/14—Introducing closed-loop corrections
- F02D41/1438—Introducing closed-loop corrections using means for determining characteristics of the combustion gases; Sensors therefor
- F02D41/1444—Introducing closed-loop corrections using means for determining characteristics of the combustion gases; Sensors therefor characterised by the characteristics of the combustion gases
- F02D41/1454—Introducing closed-loop corrections using means for determining characteristics of the combustion gases; Sensors therefor characterised by the characteristics of the combustion gases the characteristics being an oxygen content or concentration or the air-fuel ratio
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Oxygen Concentration In Cells (AREA)
Abstract
Description
Stand der TechnikState of the art
Die Erfindung geht aus von einer Kontaktverbindung zwischen zwei in verschiedenen Ebenen eines Schichtenverbundes angeordneten, elektrisch leitenden Flächen. nach dem Oberbegriff des Anspruchs 1.The invention is based on one Contact connection between two layers in different layers arranged, electrically conductive surfaces. according to the generic term of claim 1.
Schichtstrukturen, die durch das Bedrucken, Stapeln oder Laminieren von keramischen Folien erzeugt werden, finden außer bei elektronischen Schaltungen auch Anwendung in der Sensorik, beispielsweise bei Gassensoren und Temperaturfühlern. In einer solchen Laminatstruktur ist es oft notwendig, daß elektrisch leitende Flächen, z. B. Leiterbahnen, durch eine nicht leitende, keramische Folie hindurch auf eine mit einer leitenden Schicht belegte, nächstfolgende Folie geführt werden müssen.Layered structures created by the Printing, stacking or laminating ceramic foils will find except in electronic circuits also used in sensors, for example for gas sensors and temperature sensors. In such a laminate structure it is often necessary that electrical conductive surfaces, z. B. traces, by a not conductive, ceramic foil through to one with a conductive Layer occupied, next one Slide out Need to become.
Um Leiterbahnen durch eine keramische Folie durchzukontaktieren, werden üblicherweise Duchkontaktierungslöcher, sog. Vias, die entweder gestanzt, gebohrt oder durch einen Laser erzeugt werden, vollständig oder teilweise mit einer elektrisch leitfähigen Paste gefüllt, so daß sich in dem Durchkontaktierungsloch ein elektrisch leitfähiger Kontaktmantel oder Kontaktzylinder bildet. Wird auf der nächstfolgenden Folie an dieser Stelle eine Leiterbahn geführt, entsteht eine durchgehende elektrische Verbindung, wenn beide Folien paßgenau mit gleichmäßigem Flächendruck laminiert werden. Da die Keramikfolien jedoch plastisch verformbar sind, weicht das Material der Keramikfolien im Bereich der Kanten und der Durchkontaktierung aus, wodurch sich in diesem Bereich der Laminatdruck reduziert. Dies führt schließlich dazu, daß nach dem Sintern an der Stelle der Durchkontaktierung sowohl der Laminatverbund zwischen den beiden keramischen Folien als auch die elektrische Verbindung unterbrochen sind oder aber durch thermische Wechselbeanspruchung unterbrochen werden kann.To trace through a ceramic Through-contacting foil are usually via holes, so-called Vias that are either punched, drilled or created by a laser become, completely or partially filled with an electrically conductive paste, so that itself an electrically conductive contact jacket in the via hole or contact cylinder forms. Will be on the next slide on this Place a conductor track, A continuous electrical connection is created when both foils snugly with even surface pressure be laminated. However, since the ceramic foils are plastically deformable the material of the ceramic foils in the area of the edges and the through-plating, which means that the Laminate printing reduced. this leads to finally to the fact that after the sintering at the point of the via both the laminate composite between the two ceramic foils as well as the electrical Connection is interrupted or due to alternating thermal stress can be interrupted.
Um diesem Problem zu begegnen und
eine dauerhafte elektrische Kontaktierung auch während des Sinterns und des
Betriebs mit thermischer Wechselbelastung sicherzustellen, ist bei
einer bekannten Kontaktverbindung (
Die erfindungsgemäße Kontaktverbindung mit den Merkmalen des Anspruchs 1 hat den Vorteil, daß durch die endseitige, nutförmige, vorzugsweise halblochartige Ausbildung der Durchkontaktierung eine gute elektrische Kontaktierung mit geringer Ausschußquote erreicht wird. Die elektrische Kontaktierung läßt sich visuell oder optisch prüfen, und festgestellte Fehler in der Durchkontaktierung können durch nachträgliches, zusätzliches Beschichten des Kontaktpfads behoben werden. Die erfindungsgemäße Kontaktverbindung erlaubt eine Durchkontaktierung über mehrere dazwischenliegende Schichten und ist fertigungstechnisch einfach und mit gegenüber den bekannten Kontaktverbindungen wesentlich niedrigeren Gestehungskosten herzustellen.The contact connection according to the invention with the Features of claim 1 has the advantage that the end-side, groove-shaped, preferably half-hole Formation of the plated-through hole a good electrical connection with a low reject rate is achieved. The electrical contact can be made visually or optically check, and detected faults in the via can be caused by subsequent, additional Coating the contact path can be fixed. The contact connection according to the invention allows via connection several intermediate layers and is manufacturing technology simple and with opposite the known contact connections much lower production costs manufacture.
Durch die in den weiteren Ansprüchen 2–9 aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen und Verbesserungen der im Anspruch 1 angegebenen Kontaktverbindung möglich.By the measures listed in the further claims 2-9 are advantageous developments and improvements in the claim 1 specified contact connection possible.
Gemäß einer vorteilhaften Ausführungsform der Erfindung ist zwischen der Nutwand und dem Kontaktpfad eine vorzugsweise als Film ausgeführte Isolierung aus elektrisch isolierendem Material angeordnet. Diese Isolierung verhindert, daß in dem zwischen den elektrisch leitenden Flächen liegenden Teil des Schichtenverbunds vorhandene, elektrisch leitfähige Schichten oder Flächen an den Kontaktpfad angeschlossen werden. Dies ist auch in dem Fall von Bedeutung, in dem die Schichten als keramische Folien aus einem ionenleitenden Festelektrolyten ausgebildet sind, wie dies bei Gassensoren zur Messung der Sauerstoffkonzentration im Abgas von Brennkraftmaschinen der Fall ist.According to an advantageous embodiment of the Invention is preferred between the groove wall and the contact path insulation made as a film arranged from electrically insulating material. This isolation prevents in the part of the layer composite lying between the electrically conductive surfaces existing, electrically conductive Layers or surfaces be connected to the contact path. This is also the case important in which the layers as ceramic films from a ion-conducting solid electrolytes are formed, as is the case with gas sensors for measuring the oxygen concentration in the exhaust gas of internal combustion engines the case is.
Gerade im Falle einer erforderlichen elektrischen Isolation des Kontaktpfads gegenüber dem Schichtenverbund kommt der Vorteil der erfindungsgemäßen Kontaktverbindung gegenüber den herkömmlichen, durch eine Bohrung im Schichtverbund herbeigeführten Durchkontaktierung zum Tragen. Da sowohl das Isolationsmaterial als auch das elektrisch leitfähige Material des vorzugsweise als Kontaktfilm ausgeführten Kontaktpfads gleiche Farbe aufweisen, läßt sich im Bohrloch der bekannten Kontaktverbindung nicht erkennen, ob die Isolationsschicht überall mit einem elektrisch leitenden Material überzogen ist. Dagegen ist dies durch die erfindungsgemäße Anordnung des Kontaktpfads in einer nach außen offenen Nut ohne weiteres zu sehen und kann ggf. nachgearbeitet werden.Especially in the case of a necessary electrical insulation of the contact path from the layer composite comes the advantage of the contact connection according to the invention across from the conventional, through-hole brought about by a hole in the layer composite Wear. Because both the insulation material and the electrically conductive material the same as the contact path, preferably implemented as a contact film Can have color in the well of the known contact connection does not recognize whether the Insulation layer with everywhere is coated with an electrically conductive material. This is against it by the arrangement according to the invention of the contact path in an outwardly open groove without further notice to see and can be reworked if necessary.
Gemäß einer vorteilhaften Ausführungsform der Erfindung erstreckt sich die Nut im Schichtenverbund ausschließlich zwischen den beiden elektrisch leitenden Flächen. Dabei ist vorzugsweise jede elektrische leitenden Fläche auf einer Schicht des Schichtenverbunds aufgebracht und die Schichten durch Laminieren zum Schichtenverbund zusammengesetzt. Sind die Schichten als plastisch verformbare Keramikfolien ausgebildet, so kann es u. U. beim Laminieren vorkommen, daß das Material der Keramikfolien im Bereich der Durchkontaktierung ausweicht, wobei der Laminierdruck reduziert wird. Dies führt dazu, daß in einem nachfolgenden Sinterprozeß des Schichtenverbundes an der Stelle der Durchkontaktierung die elektrische Verbindung zwischen Kontaktpfad und der auf der zweiten Schicht angeordneten elektrisch leitenden Fläche unterbrochen sein kann. Bei der erfindungsgemäßen Ausbildung der Kontaktverbindung kann diese Unterbrechung gut erkannt werden und läßt eine Nachbearbeitung der Durchkontaktierung zur Behebung dieser Unterbrechung zu.According to an advantageous embodiment of the invention, the groove in the layer composite extends exclusively between the two electrically conductive surfaces. Each electrically conductive surface is preferably applied to a layer of the layer composite and the layers are assembled by lamination to form the layer composite. If the layers are designed as plastically deformable ceramic films, it can u. U. occur during lamination that the material of the ceramic foils dodges in the area of the plated-through hole, the lamination pressure being reduced. This leads to the fact that in a subsequent sintering process of the layer composite at the location of the Through-contacting the electrical connection between the contact path and the electrically conductive surface arranged on the second layer can be interrupted. In the embodiment of the contact connection according to the invention, this interruption can be easily recognized and allows the through-contact to be reworked to remedy this interruption.
Um jedoch die Nachbearbeitungsaufwand infolge dieses Effekts zu vermeiden, weist gemäß einer vorteilhaften Ausführungsform der Erfindung die Nut zusätzlich zu ihrem Erstreckungsbereich zwischen den beiden elektrisch leitenden Flächen einen sich daran anschließenden, im Nutquerschnitt reduzierten, weiteren Erstreckungsbereich auf. Dieser weitere Erstreckungsbereich ist durch die die zweite elektrisch leitende Fläche tragende Schicht hindurchgeführt. Durch diese konstruktive Maßnahme steht die von den beiden Schichten eingeschlossene, zweite elektrisch leitende Fläche mit einem Vorstehrand in die Nut vor und wird damit großflächig von dem durch den weiteren Erstreckungsbereich der Nut hindurchgeführten Kontaktpfad überzogen. Ein Ablösen des Kontaktpfads von der zweiten elektrisch leitenden Fläche beim Laminieren und Sintern wird durch diese größflächige Anbindung vermieden, zumal auch der Kontaktpfad erst nach dem Laminieren der beiden Schichten aufgebracht wird.However, due to the post-processing effort Avoiding this effect, according to an advantageous embodiment the invention the groove in addition to their area of extension between the two electrically conductive surfaces a subsequent reduced extension area in the groove cross section. This further range is electrical by the second conductive surface carrying layer. Through this constructive measure the second enclosed by the two layers is electrical conductive surface with a protruding edge in the groove and is thus large area of the covered through the further extension area of the groove through the contact path. A releasing the contact path from the second electrically conductive surface at This extensive connection avoids laminating and sintering, especially since the contact path only after the two layers have been laminated is applied.
Das erfindungsgemäße Verfahren zur Herstellung der Kontaktverbindung mit den Merkmalen des Anspruchs 10 oder 11 hat den Vorteil einer rationellen Fertigung, die problemlos der Automatisierung zugänglich ist. Durch das erfindungsgemäße Herstellen des Kontaktpfads in einem geschlossenen Durchgangskanal, vorzugsweise in einem Bohrloch im Schichtenverbund, können die herkömmlichen Verfahren zur Herstellung der bekannten Durchkontaktierungen und deren Isolation gegenüber dem Schichtenverbund, z. B. das Stapelansaugverfahren, das nachträgliche Eintropfen (Dispensen), Stempeln u. ä., angewandt werden. Durch das Trennen des Schichtenverbunds längs des Kontaktpfads und das Vereinzeln der beiden Trennhälften können zwei der erfindungsgemäßen Kontaktverbindungen in einem Arbeitsgang hergestellt werden.The manufacturing method according to the invention the contact connection with the features of claim 10 or 11 has the advantage of a rational production, which is easy Automation accessible is. By manufacturing according to the invention the contact path in a closed through channel, preferably in a borehole in the layer composite, the conventional Process for producing the known vias and their isolation from each other the layered composite, e.g. B. the stack suction process that subsequent Dripping (dispensing), stamping u. Ä., applied become. By separating the layers along the Contact paths and separating the two halves can be two of the contact compounds according to the invention can be produced in one operation.
Die Erfindung ist anhand eines in der Zeichnung dargestellten Ausführungsbeispiels in der nachfolgenden Beschreibung näher erläutert. Es zeigen:The invention is based on a the drawing shown embodiment explained in more detail in the following description. Show it:
Beschreibung des Ausführungsbeispielsdescription of the embodiment
Mit dem in
In
eine mit einer elektrisch leitenden Flächen
In one with an electrically conductive surface
Mit dem in
In zwei jeweils mit
einer elektrisch leitenden Fläche
In two each with an electrically conductive surface
In
In
In
Die Erfindung ist nicht auf die beschriebenen Ausführungsbeispiele
beschränkt,
so kann die Nut
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002124057 DE10224057A1 (en) | 2002-05-31 | 2002-05-31 | Ceramic electronics device, of multiple layer construction, has internal electrical connections provided by external conductor grooves, transverse to the layer edges |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002124057 DE10224057A1 (en) | 2002-05-31 | 2002-05-31 | Ceramic electronics device, of multiple layer construction, has internal electrical connections provided by external conductor grooves, transverse to the layer edges |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10224057A1 true DE10224057A1 (en) | 2004-01-08 |
Family
ID=29718820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2002124057 Withdrawn DE10224057A1 (en) | 2002-05-31 | 2002-05-31 | Ceramic electronics device, of multiple layer construction, has internal electrical connections provided by external conductor grooves, transverse to the layer edges |
Country Status (1)
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DE (1) | DE10224057A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2173148A1 (en) * | 2007-08-29 | 2010-04-07 | Murata Manufacturing Co. Ltd. | Ceramic multilayer substrate |
US20140177179A1 (en) * | 2011-07-25 | 2014-06-26 | Kyocera Corporation | Wiring substrate, electronic device, and electronic module |
DE102008001928B4 (en) | 2008-05-21 | 2022-07-07 | Robert Bosch Gmbh | Sensor element for a gas sensor and method for producing a via in a sensor body of a sensor element |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5274963A (en) * | 1991-03-11 | 1994-01-04 | Moshav Shitu Fi Regba | Flush-mount sink assembly method |
GB2322974A (en) * | 1997-03-03 | 1998-09-09 | Alps Electric Co Ltd | Circuit board having edge vias |
DE19838466A1 (en) * | 1998-08-25 | 2000-03-02 | Bosch Gmbh Robert | Control system for a diffusion type oxygen measurement cell, e.g. used in exhaust gas streams to control fuel mixture supplied to IC engine |
DE10016064A1 (en) * | 1999-04-02 | 2000-10-12 | Murata Manufacturing Co | Combined substrate for production of single substrate has oblong single substrate formed with bore with first and second single substrates being adjacent and having common front part area of wide part |
-
2002
- 2002-05-31 DE DE2002124057 patent/DE10224057A1/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5274963A (en) * | 1991-03-11 | 1994-01-04 | Moshav Shitu Fi Regba | Flush-mount sink assembly method |
GB2322974A (en) * | 1997-03-03 | 1998-09-09 | Alps Electric Co Ltd | Circuit board having edge vias |
DE19838466A1 (en) * | 1998-08-25 | 2000-03-02 | Bosch Gmbh Robert | Control system for a diffusion type oxygen measurement cell, e.g. used in exhaust gas streams to control fuel mixture supplied to IC engine |
DE10016064A1 (en) * | 1999-04-02 | 2000-10-12 | Murata Manufacturing Co | Combined substrate for production of single substrate has oblong single substrate formed with bore with first and second single substrates being adjacent and having common front part area of wide part |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2173148A1 (en) * | 2007-08-29 | 2010-04-07 | Murata Manufacturing Co. Ltd. | Ceramic multilayer substrate |
EP2173148A4 (en) * | 2007-08-29 | 2010-09-08 | Murata Manufacturing Co | Ceramic multilayer substrate |
US8450615B2 (en) | 2007-08-29 | 2013-05-28 | Murata Manufacturing Co., Ltd. | Ceramic multilayer substrate |
DE102008001928B4 (en) | 2008-05-21 | 2022-07-07 | Robert Bosch Gmbh | Sensor element for a gas sensor and method for producing a via in a sensor body of a sensor element |
US20140177179A1 (en) * | 2011-07-25 | 2014-06-26 | Kyocera Corporation | Wiring substrate, electronic device, and electronic module |
US9788424B2 (en) * | 2011-07-25 | 2017-10-10 | Kyocera Corporation | Wiring substrate, electronic device, and electronic module |
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