CN119585961A - 金属气体封入单元 - Google Patents

金属气体封入单元 Download PDF

Info

Publication number
CN119585961A
CN119585961A CN202380058027.3A CN202380058027A CN119585961A CN 119585961 A CN119585961 A CN 119585961A CN 202380058027 A CN202380058027 A CN 202380058027A CN 119585961 A CN119585961 A CN 119585961A
Authority
CN
China
Prior art keywords
gas
metal gas
unit
glass plate
unit body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380058027.3A
Other languages
English (en)
Chinese (zh)
Inventor
平井义和
清濑俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoto University NUC
Original Assignee
Kyoto University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto University NUC filed Critical Kyoto University NUC
Publication of CN119585961A publication Critical patent/CN119585961A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04F—TIME-INTERVAL MEASURING
    • G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
    • G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
    • G04F5/145—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks using Coherent Population Trapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/24—Arrangements or instruments for measuring magnetic variables involving magnetic resonance for measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/26—Arrangements or instruments for measuring magnetic variables involving magnetic resonance for measuring direction or magnitude of magnetic fields or magnetic flux using optical pumping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0361—Tips, pillars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/031—Anodic bondings

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ecology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Measuring Cells (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN202380058027.3A 2022-09-09 2023-08-30 金属气体封入单元 Pending CN119585961A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-143731 2022-09-09
JP2022143731 2022-09-09
PCT/JP2023/031643 WO2024053527A1 (ja) 2022-09-09 2023-08-30 金属ガス封入セル

Publications (1)

Publication Number Publication Date
CN119585961A true CN119585961A (zh) 2025-03-07

Family

ID=90190992

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380058027.3A Pending CN119585961A (zh) 2022-09-09 2023-08-30 金属气体封入单元

Country Status (5)

Country Link
US (1) US20260079451A1 (https=)
EP (1) EP4586419A1 (https=)
JP (1) JPWO2024053527A1 (https=)
CN (1) CN119585961A (https=)
WO (1) WO2024053527A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6031787B2 (ja) 2011-07-13 2016-11-24 株式会社リコー 原子発振器の製造方法
JP7528597B2 (ja) * 2020-07-20 2024-08-06 日本電気硝子株式会社 原子セル及びその製造方法
EP4243225A4 (en) 2020-11-06 2024-09-04 Kyoto University METAL GAS SEALED CELL AND ITS MANUFACTURING METHOD

Also Published As

Publication number Publication date
US20260079451A1 (en) 2026-03-19
EP4586419A1 (en) 2025-07-16
WO2024053527A1 (ja) 2024-03-14
JPWO2024053527A1 (https=) 2024-03-14

Similar Documents

Publication Publication Date Title
US8906470B2 (en) Method for producing a microfabricated atomic vapor cell
US9498777B2 (en) Cells having cavities and the manufacture and use of the same
EP2362281B1 (en) Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells
US7400207B2 (en) Anodically bonded cell, method for making same and systems incorporating same
US20180188030A1 (en) Micro three-dimensional shell resonator gyroscope
US20050007118A1 (en) Micromachined alkali-atom vapor cells and method of fabrication
EP2546707B1 (en) Atomic oscillator and method for fabricating atomic oscillator
EP2362282A2 (en) Apparatus and methods for alkali vapor cells
US10775747B2 (en) Gas cell for an atomic sensor and method for filling a gas cell
Overstolz et al. Wafer scale fabrication of highly integrated rubidium vapor cells
EP3112315B1 (en) Method for filling csac absorption cells with high-purity alkali metal
CN119585961A (zh) 金属气体封入单元
JP7780803B2 (ja) 金属ガス封入セル及びその製造方法
US7508132B2 (en) Device having a getter structure and a photomask
Liew et al. Micromachined alkali atom vapor cells for chip-scale atomic clocks
Gorecki Development of first European chip-scale atomic clocks: Technologies, assembling and metrology
US20210208542A1 (en) Devices, systems, and methods for fabricating alkali vapor cells
US12602016B2 (en) Chip-scale atomic beam generating systems
EP4307565A1 (en) Substrate, production method for substrate, and production method for unit cell
US6808644B2 (en) Capillary with glass internal surface
Kazakin et al. MEMS alkali vapor cell encapsulation technologies for chip-scale atomic clock
JPH08203875A (ja) ドライエッチングによる部品の製造方法
Chen et al. Fabrication of low cost spherical alkali atom vapor cells by combining a low temperature anodic bonding and a Chemical Foaming Process (CFP)
Hirai et al. Alkali Metal Dispenser Utilizing Scalloped Silicon Groove for Microfabricated Vapor Cells
Huang et al. Microfabricated Alkali Atom Vapor Cells for Chip Scale Atomic Clock

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination