CN1195397C - Electric circuit board production and its repairing method - Google Patents

Electric circuit board production and its repairing method Download PDF

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Publication number
CN1195397C
CN1195397C CNB021159378A CN02115937A CN1195397C CN 1195397 C CN1195397 C CN 1195397C CN B021159378 A CNB021159378 A CN B021159378A CN 02115937 A CN02115937 A CN 02115937A CN 1195397 C CN1195397 C CN 1195397C
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slurry
laser
bonding
electric
metal powder
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CN1395462A (en
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曾晓雁
刘敬伟
祁晓敬
李祥友
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WUHAN NEW RESEARCH AND DEVELOPMENT LASER Co Ltd
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Huazhong University of Science and Technology
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Abstract

The present invention discloses an electric circuit board production and repairing method which comprises the procedures: (1) electronic slurry is preset into a preset layer of 3 to 100 micrometres on a base plate; (2) the base plate which is provided with the preset layer is dried to remove the organic solvent of the base plate; (3) the preset layer is scanned according to a set track by using a laser beam, and the preset layer is solidified or melted to coagulate by a bonding phase in the electronic slurry on the scanning track, so that electric conducting phases in the electronic slurry are bonded to form an electronic component; (4) the preset layer of the part which is not scanned is washed and removed. The present invention has the core that when laser process is used, the bonding in the electronic slurry is melted or softened in the process of laser action by controlling laser technology parameters; after a laser beam is removed, the bonding phase is coagulated or solidified again, and various ingredients are bonded into a whole to form an electric conducting circuit. The method has the advantages of simple technology and high reliability, and thus, the requirement of the direct operation of high precision can be satisfied.

Description

A kind of circuit board making and restorative procedure
Technical field
The invention belongs to circuit board making, recovery technique field and laser fine processing technique field.Specifically, be making and the reparation that the laser direct-writing technology is used for circuit board, i.e. a kind of making of circuit board and restorative procedure.
Background technology
Along with electric equipment products develops to ultralarge scale integration, digitlization, lightweight and small lot, diversified direction, traditional printed circuit board process for making comprises that photochemical method and template (or silk screen) method of biting (see " printed circuit technique ", the Shen Xikuan chief editor, Science Press) in small lot, high-precision occasion, more and more can not meet the demands.Be embodied in: manufacturing process is many, and high density, high accuracy printed circuit board are easily brought than mistake; Minimum feature and distance between centers of tracks are very limited; The electric conducting material of erosion removal is a lot, causes a large amount of wastes of noble metal; The solution that operations such as plating, corrosion are used causes very big pollution etc. to environment.Yet except serious environment pollution, the greatest weakness of above-mentioned technology is that also the flexibility degree is very low.Specifically comprise: the wiring board fabrication cycle is longer, processes finished product about 2 to the 7 day time of general need from finishing to be designed into, and will give professional manufacturing shop and finish, and can't effectively shorten the new product research and development cycle; Circuit board is in case the making completion can't be carried out necessary modification to designed conducting wire; For single-piece or small lot batch manufacture circuit board, manufacturing cost is higher.
For solving this difficult problem, the researcher constantly makes great efforts to develop the various wiring techniques of directly writing always both at home and abroad, as injecting type, ink jet type painting method, Digit Control Machine Tool control diamond cutter engraving method, hot padding (HeatEmbossing) and static printing technology, focused ion beam technology and laser processing technology etc.Wherein, the simplest technology that also has practical value most is, adopts minitype nozzle or claims miniature pen (micropen), according to the predetermined figure of CAD, directly writes the technology of wiring with injection or ink-jetting style coated with conductive slurry.Its detailed process is: electrocondution slurry is prepared according to certain ingredients and viscosity, be filled in the minitype nozzle storage bin hopper of (perhaps claiming miniature pen).Drive x-y two dimension numerical control table, NC table and move according to the track that CAD draws, during the jet velocity of control nozzle or the height between injecting type nib and the substrate, promptly can obtain needed figure.The later substrate of wiring is placed on sintering, curing in the stove of uniform temperature, just can obtains needed wiring board.Utilize this technology resistance, transistorized slurry can also be coated on substrate surface, directly make needed thick film circuit and thin film circuit behind the sintering.Because the middle manufacturing process of having omitted silk screen printing or template; therefore this method has that speed is fast, efficient is high (finishing the prototype of wiring board or hybrid circuit board in a few hours), the pattern change as required (only needing a few minutes) of preparation, does not need to make in advance mask or silk screen, saves characteristics such as precious metal; and can be used to repair expensive hybrid circuit board or mounted on surface substrate, the resistance of directly being write does not need fine setting etc.
Yet, adopt above-mentioned technology to have following some deficiency: the first, because capillary effect, the internal diameter of directly writing nib or nozzle can not be too thin, so the minimum dimension and the precision of the conducting wire of institute's cloth or other constituent element (as resistance etc.) are limited.For example, when adopting this method wiring to make the microwave circuit prototype, the minimum line molded dimension can only reach live width 50 μ m, high 12.5 μ m; The second, because the homogeneity of ingredients of electrocondution slurry changes with viscosity, it is bigger directly to write minimum dimension and the variation of repeatable accuracy front and back that nib or nozzle can reach, is difficult to guarantee to obtain stay-in-grade wiring board; The 3rd, adopt miniature pen or spray regime directly to write wiring, generally once (when coated material is a single kind) or repeatedly (when coated material is multiple class) enter in the stove and toast, solidify, program is more, and can't directly write wiring on the substrate that some soften or melt temperature is lower.These factors have limited the use of this technology in many cases.
Laser Direct Writing is the technology that adopts laser beam directly to connect up at substrate surface.Different according to the process of laser action and mode, Laser Direct Writing is divided into many types again, comprises that specifically laser chemical vapor deposition, Laser Induced Liquid-phase reactive deposition, induced with laser solid phase reaction deposit, LASER HEAT is spray deposited and laser melting coating is directly write wiring technique.
(Laser Chemical Vapor Deposition is to utilize the high temperature of laser beam or high energy efficiency should induce chemical reaction LCVD) to laser chemical vapor deposition, makes solid matter be deposited on the process that substrate surface forms conductive film.When laser beam scans on substrate by certain path, can deposit needed conductive pattern, finish the wiring task.Summary is got up, and the advantage of LCVD method is lead purity height, dense structure, line width (I reach 2 μ m), but its major defect is complete set of equipments costliness, cloth linear velocity low excessively (typical rate is 100 μ m/s) and conductor thickness is difficult to control.Therefore, be mainly used in the reparation of circuit in the VLSI (very large scale integrated circuit) chip and the manufacturing of micro mechanical system now.
The Laser Induced Liquid-phase reactive deposition claims that again (Laser InducedElectroless Plating LIEP), is to be immersed in substrate in the liquid chemical medium by the direct irradiation of laser beam to the induced with laser chemical plating, produces the selective reaction deposition.LIEP technology comes across 1979 the earliest, at present on original basis of directly inducing chemical plating, developed laser and preset crystal seed-chemical plating composite algorithm and laser direct irradiation constituency activation substrate-two kinds of technologies of chemical plating composite algorithm (being also referred to as two-step method), successively at Al 2O 3, ZrO 2, diamond, SiC, PPQ macromolecule surface prepare metal wires such as Al, Cu, Pt, Pd, Ni-P alloy, minimum feature can also reach 2 microns.The advantage of LIEP method be do not need vacuum, equipment investment than LCVD lack, wiring speed is than the fast nearly order of magnitude of LCVD.But, because substrate must immerse in the plating bath, numerous influencing factor (as parameters such as solution temperature, concentration) makes dimensional accuracy, repeatable accuracy and the quality stability of lead not good enough, add that the cloth linear velocity is still on the low side, chemical plating fluid is to the reasons such as severe contamination of environment, application prospect also the optimism of initial stage people expection occurs not as this technology.Professor Yu Zuzhan of department of chemistry of Fudan University adopts the method for induced with laser chemical plating to deposit plain conductors such as palladium, and in essence, this also belongs to a kind of laser direct-writing technology.But aspect the formation mechanism of lead, be to utilize the thermal effect of laser that the palladium film on the polyimides is decomposed, obtain the Metal Palladium line of direct plating.The maximum cloth linear velocity that such scheme is realized only is 0.2 mm/second, and this can not satisfy practical application far away.In addition, deposit employed metallorganic on the cost also than higher (seeing " on the polyimides deposition induced with laser directly plate palladium ", Ceng Xin, Wang Yamei, the profound applied chemistry p18-Vol.11 of strongly fragrant ancestral No.5 Oct 1994).
Mainly to depend on the atomic deposition process different with laser chemical vapor deposition and Laser Induced Liquid-phase deposition, the laser solid reaction process directly adopts the solids of conductive metal powder or its (organic) compound to mix mutually with organic adhesive and is preset in substrate surface, after the LASER HEATING solid particles is deposited on the substrate, thereby can fast speed ground deposition lead.1979, people such as the Suh of Massachusetts Institute Technology with metal oxides such as CuO, NiO be preset in the insulating substrate surface after organic substances such as epoxy resin mix, utilize CO 2Laser irradiation makes metal oxide reduction, form plain conductor, has opened beginning people such as (, U.S.Patent, No.4,159,414,1979) N.P.Suh that insulating material surface laser solid reaction process prepares plain conductor.But temperature that this arts demand is higher or longer reaction time just can make metal oxide be reduced into metal particle, therefore easily cause the substrate surface major injury.1987, people such as Soszek are at first at the whole one deck hot activation adhesive membrane (film of heat actuable adhesive) that applies of substrate surface, the methods such as roll-in, brushing that re-use are evenly spread the layer of metal powder at film surface, adopt LASER HEATING to activate adhesive membrane then, make metal dust and substrate bonding, to not with brush or cleaning fluid, the powder of irradiated site removes, form needed conductive pattern, at last the substrate that is stained with metal dust is put into about 900 ℃ stove sintering, form ganoid lead.The characteristics of this technology are to have avoided laser excessive damage substrate surface.But its operation is on the high side, and conductor size and precision are difficult to guarantee, and 900 ℃ of sintering of finishing operation need, therefore can only be used for dystectic ceramic substrate.1991, U.S. AT﹠amp; People such as the Kestenbaum of T company adopt lacquering technique to preset certain thickness metallo-organic compound conducting resinl earlier at substrate surface, make compound decomposition go out the simple metal particle after the laser irradiation.Minimum feature can reach about 1 μ m.But owing to must gradient increase laser power could control the metallo-organic compound decomposition rate, the maximal rate that therefore obtains coating is no more than 5 μ m/s.In addition, because induced with laser metallo-organic compound decomposition reaction velocity is slower, in coating, produce " burr " and " blast " phenomenon easily, make coating uniformity variation (people such as K.Bali, Materials Science and Engineering, B17 (1993), 101-), so people gradually adopt other material to replace metallo-organic compound in follow-up research.Nineteen ninety-five, people such as U.S. Castro are preset in substrate surface after slaine and amino-compound are mixed, having obtained live width after the laser irradiation is that 1-20 μ m, distance between centers of tracks are the lead of 3-50 μ m, but maximum cloth linear velocity also has only 100 μ m/s (people such as A.J.Castro e, U.S.Patent, NO:5378508,1995).1996, people such as Weigel utilize the laser constituency to shine cold organic membrane, brush metal dust (silver, copper, palladium etc.) after making it to become sticky, form conductive pattern, at last 850 ℃ of insulations about ten minutes, obtain the circuit board that surface-brightening, conductive layer thickness can reach 30 microns (people such as Weigel, U.S.Patent, No.5576074,1996).1998, human minitype nozzles such as the Maruyama of HIT will be coated in the wire break place as the conductive slurry of filler with submicron metal, make lead reconnect (people such as S.Maruyama, U.S.Patent after the laser radiation, No.5832595,1998).Obviously, though the induced with laser solid phase reaction method has had bigger improvement than induced with laser vapour deposition and induced with laser solid precipitation method in many aspects, but also have many deficiencies at deposition velocity, the basic aspects such as popularity that adapt to, so the industrial applications prospect is limited.
In addition, above-mentioned method mainly is limited to the preparation plain conductor, and can not be fabricated on the same wiring board elements such as resistance, electric capacity are integrated, and this makes the advantage of laser direct-writing can not get maximum performance.
Calendar year 2001, the people such as Miller of U.S. Optomec Design Company are used for the laser direct-writing wiring of hybrid circuit making and wiring board with the LASER HEAT spraying technology, and have obtained the United States Patent (USP) (patent No.: 6251488).Its cardinal principle is: after the material that needs are added makes it be in molten condition by the laser action district, directly be deposited on the surface of substrate.The material that adds in order to make can be realized deposition smoothly, and this specification requirement laser beam is wanted long enough along the hot spot of powder feeding direction, so as to prolong the material insert with laser beam when interactive chien shih its absorb enough laser energies, fully melt.This patent is declared, because deposition process mainly relies on the filler of molten state directly to be deposited on substrate surface (promptly being similar to thermal spray process), rather than resemble and need the laser melting and coating technique substrate surface little molten, therefore this technology can be deposited on any solid material any solid substrate surface in principle, form thick, thin film circuit, thereby cause " revolutionary advancement " of conventional art.But, anatomize the essential characteristic of this patent, be not difficult to find that this technology can't solve many intrinsic contradictions: first, this patent thinks that on the one hand the minimum resolution that live width can reach is 0.1 μ m, then require laser beam spot enough length will be arranged on the other hand at the filler heading, even for machining accuracy be tens of microns pattern like this, also can't realize the processing of enough accuracy around the corner smoothly; Second, for many materials (as Cu, Ag etc.), no matter its particle diameter how much, will with its in a short period of time fusion can not injure substrate, not only require to have sufficiently high laser power density (parameter requests such as this power stability to laser, beam quality are quite high), and the filler of being sent into must be enough fine and close (can not be powder), in order to avoid because light leak and wounded substrate; The 3rd, the LASER HEAT spraying as " thermal spraying " process, can't be avoided the bigger defect of the angle of divergence, and therefore prepared lead or other size of component will be very restricted.
Summary of the invention
The object of the invention aims to provide a kind of making and restorative procedure of circuit board, and it can directly prepare various electronic components fast at substrate surfaces such as pottery, glass and organic layer pressing plates, for example lead, resistance, electric capacity, inductance or the like, and technology is simple.
For achieving the above object, circuit board making and restorative procedure that the present invention proposes, the steps include: that (1) presets to the initialization layer of 3-100 micron with electric slurry on substrate, be used to prepare lead, inductance or electric capacity, perhaps at least two kinds combination in lead, inductance, electric capacity and the resistance;
When preparation lead or inductance, employed electric slurry is an electrocondution slurry, this electrocondution slurry is made up of good conductive metal powder, bonding phase, organic solvent, wherein the particle diameter of good conductive metal powder is 1nm-50 μ m, bonding is thermosetting polymer resin mutually, or softening temperature is that 200-450 ℃, its particle diameter are that the flux powder of 0.1-10 micron and/or fusing point are that 180-300 ℃, its particle diameter are the fusible metal powder of 0.1-10 micron, when bonding is flux powder and fusible metal powder mutually, also need add organic binder matter in the electrocondution slurry;
When preparation resistance, employed electric slurry is a resistance slurry;
When preparation electric capacity, the electric slurry that uses comprises electrocondution slurry and dielectric material, wherein said electrocondution slurry is used to do capacitance electrode, this electrocondution slurry is made up of good conductive metal powder, bonding phase and organic solvent, wherein the particle diameter of good conductive metal powder is 1nm-50um, bonding is thermosetting polymer resin mutually, or softening temperature is the fusible metal powder that 200-450 ℃ flux powder and/or fusing point are 180-300 ℃; Described dielectric material is used to do capacitance dielectric layer;
(2) oven dry has the substrate of initialization layer, removes organic solvent wherein;
(3) utilize laser beam by the track scanning initialization layer of setting, be scanned on the track bonding solidifying in the electric slurry or fusing-solidify, make the conductive phase bonding in the electric slurry, form electronic component;
(4) flush away removes the not initialization layer of sweep test.
Above-mentioned steps (1) adopts sol evenning machine that above-mentioned electric slurry evenly is preset in substrate surface or adopts miniature pen or micro nozzle that electric slurry is preset at substrate surface along needed track, forms initialization layer; The employed laser beam of step (2) is continuous wave laser or quasi-continuous pulse laser emitted laser bundle.
The present invention utilizes the method for laser direct-writing electric slurry directly to form electronic component at organic layer pressing plate, glass substrate and ceramic base plate surface first.Its core key is, when adopting laser treatment, passes through controlling laser process parameters, make that in the laser action process bonding in the electric slurry melts mutually or be softening, after laser beam is removed, bonding is solidified again mutually or is solidified, and various compositions is bonded together form the conducting wire.
Compared with prior art, the inventive method has following basic characteristics:
(1) compares with miniature pen or micro nozzle direct writing technology, the prepared component size of the inventive method depends mainly on the diameter of laser facula, there is not the restriction of nozzle diameter or miniature internal diameter capillary tube effect, the sensitivity that the composition of electric slurry and viscosity are changed is low, and almost can omit follow-up curing or sintering processes process, technology is simple, and therefore the reliability height can satisfy the demand that high accuracy is directly write.
(2) when the preparation lead, owing to contain the low melting point of certain ingredients or the constituent element of low softening temperature in the electrocondution slurry that is preset, therefore sweep speed very high (can from 0.1 millimeter per second to 100 millimeter per second) during laser treatment, lead live width adjustable range wide (can in 5 microns to 2 millimeters scopes, regulate) such as conductor width, thickness height (can by 3 microns to 100 microns) easy to control, the substrate wide ranges that is fit to (comprises ceramic substrate, glass substrate, organic epoxy substrate and plastic base etc.), the bond strength height of lead and substrate, the various defectives that easily produce when also not having induced with laser solid phase reaction deposition or LASER HEAT spraying etc.These all are that existing other Laser Direct Writing is incomparable.
Description of drawings
Fig. 1 is the making of circuit board of the present invention and the schematic flow sheet of restorative procedure (adopting sol evenning machine to preset electric slurry);
Fig. 2 is the making of circuit board of the present invention and the schematic flow sheet (nozzle that use has hot-air mouth presets electric slurry) of restorative procedure;
Fig. 3 is the photo figure of the circuit board of employing this method making.
Embodiment
The schematic flow sheet of the inventive method as shown in Figure 1 and Figure 2, Fig. 1 adopts sol evenning machine to preset electric slurry, Fig. 2 is to use nozzle to preset electric slurry, 1 expression substrate among the figure, 2 expression initialization layers, 3 expression laser beams, 4 expressions have the nozzle of hot-air mouth 5,6 expression lead or other elements.
Fig. 1 (a) expression adopts sol evenning machine that electric slurry is evenly applied at substrate surface, forms initialization layer 2, makes its drying by oven dry or mode such as dry naturally; Fig. 1 (b) expression utilizes laser beam along set track scanning initialization layer; Fig. 1 (c) expression not scanning area is removed, and forms lead or other electron component.
Fig. 2 (a) expression adopts the nozzle 4 that has hot-air mouth 5 that electric slurry directly is preset in substrate surface, and Fig. 2 (b), (c) and Fig. 1 (b), (c) are identical.
The present invention is when preparation lead and inductance, and the electrocondution slurry that is adopted is made up of good conductive metal powder, bonding phase, organic solvent.Wherein bonding is thermosetting polymer resin, low-melting glass and low-melting-point metal mutually; When bonding is flux powder and fusible metal powder mutually, also need add organic binder matter in the electrocondution slurry.Good conductive metal powder is metal dusts such as copper, silver, nickel, aluminium; Organic binder matter can be celluloid, ethyl cellulose, vistanex, polyisobutene, polyvinyl alcohol, polyvinyl acetate, poly alpha methylstyrene etc.Organic solvent can be alcohols and esters solvents such as terpinol, ethanol, acetate, tributyl citrate.Employed resistance slurry and dielectric material are commercial conventional, electric-resistance slurry and dielectric material when preparation resistance and electric capacity.
Embodiment 1-11,15 are used to such an extent that electric slurry is electrocondution slurry, are used to prepare lead, inductance; Embodiment 12-14 is preparation resistance, electric capacity embodiment.
Embodiment 1
Bonding mutually for organic high molecular compound in the electrocondution slurry that present embodiment adopted specifically selected phenolic resins for use.Its composition proportion and manufacturing process are: after formaldehyde, phenol and hexamethylenetetramine mass ratio were 1: 1: 0.2 even mixing, 75 ℃ of-85 ℃ of water-baths made in one hour in there-necked flask.Conductive phase silver powder, maximum particle size are less than 10 microns, and the ratio of bonding phase and conductive phase is 3 to 7.Solvent is an alcohols solvent, and as terpinol, alcohol, ethylene glycol etc., content is 10% of bonding phase and conductive phase total weight.Additive contains defoamer, activating agent, levelling agent etc., and content is 1% of solvent.
The electrocondution slurry of gained is preset to 20 microns initialization layer, 120 ℃ of oven dry through sol evenning machine on epoxy laminate.Use the continuous CO of peak power output as 35W 2Laser.Laser beam is preset pulp layer after by the track scanning oven dry of design, about 100 microns of laser spot diameter, sweep speed is 100mm/s, laser power 35W.Then, remove without the electrocondution slurry of crossing laser treatment, prepared conductor width is 150 microns, and resistivity is 5 * 10 -5Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 2
Electrocondution slurry and substrate such as embodiment 1 by regulating the viscosity of electrocondution slurry, adopt sol evenning machine with the initialization layer of the even whirl coating of electrocondution slurry to 60 microns of thickness, behind drying substrates, adopt laser treatment.Laser scanning speed is 0.1mm/s, used CO 2Laser power is 20W, and spot diameter is 1.8 millimeters, removes that obtained conductor width is 2 millimeters behind the unnecessary slurry, and resistivity is 5 * 10 -5Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 3
Electrocondution slurry and substrate such as embodiment 1, laser scanning speed are 10mm/s, and power is 10W, 0.4 millimeter of spot diameter.Obtained conductor width is 500 microns, and resistivity is 5 * 10 -5Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 4
It is as follows to get the quality percentage composition: antimony oxide: 66%, and silicon dioxide: 2.0%, lead oxide: 12.0%, boron oxide: 8.5%, potassium oxide: 10%, sodium oxide molybdena: 1%, lithia: 0.5%.After the mentioned component mixing, be positioned in the porcelain crucible, make its complete fusion in 550 ℃ of-700 ℃ of following meltings of temperature.The glass of fusion poured into carries out shrend in the water, the oven dry back with ball mill grinding to the 1-3 micron.The glass transition temperature that makes is about 350 ℃.The conductive phase flake silver powder of 1-6 micron, its content is 6 to 4 with the ratio of above-mentioned glass quality, organic bond is added a small amount of castor oil and defoamer after mixing by 19 to 1 with terpinol and ethyl cellulose, and wherein castor oil is used to improve the catalyst and the viscosity of improving slurry of slurry.Mentioned component is mixed, fully stir into homogeneous, still slurry.Used laser such as embodiment 1, substrate are simple glass.Power is 20W, and sweep speed is 10mm/s, and making conductor width is 300 μ m, and resistivity is 3 * 10 -5Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
The electrocondution slurry inventor that present embodiment adopted has applied for the patent of invention of " a kind of electrocondution slurry that is used for laser direct-writing " by name simultaneously.
Embodiment 5
Make the low-melting glass powder with potassium oxide and bismuth oxide by 9.7 to 90.3, by 4 to 6 mixed, add organic solvent then, ball milling 2 hours by this mixed-powder and copper powder.With sol evenning machine electrocondution slurry is got rid of into the uniform coating of 30 μ m at glass baseplate surface.With behind the substrate low temperature drying, can carry out laser treatment again.Used laser such as embodiment 1, substrate are simple glass.Power is 20W, and sweep speed is 10mm/s, and spot diameter is 250 μ m, and obtained conductor width is 300 μ m, and resistivity is 3 * 10 -5Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 6
Metallic tin powder and metal nickel powder are mixed by 4 to 6, add organic solvent then, ball milling 2 hours, the viscosity of the 4～5PaS that makes it to reach.Then electrocondution slurry is coated in Al 2O 3On the substrate, get rid of into the uniform coating of 30 μ m through sol evenning machine.Used laser such as embodiment 1, power 35W, sweep speed 2mm/s, spot diameter 400 μ m, making conductor width is 500 μ m, resistivity 3 * 10 -4Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 7
Bonding mutually and organic solvent such as embodiment 1, conducting metal is a copper nano powder, particle diameter is 20-80nm, make electrocondution slurry after, ball milling 2 hours makes it to reach the viscosity of 4～5PaS.Slurry is placed on the single crystalline Si substrate then, gets rid of into the uniform coating of 2～3 μ m through sol evenning machine.Used laser is Ar +Laser, power output 4W, spot diameter 6 μ m, sweep speed is 50mm/s.After the laser treatment, make the wide lead of 5 μ m.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 8
Present embodiment is bonding to be the Sn63/Pb37 low-melting alloy mutually, and the powder diameter is 1～3 μ m.The conductive phase flake silver powder of 1-6 μ m, its content is 7 to 3 with the ratio of metal Sn opaque amount, organic solvent is a terpinol, organic binder matter is that terpinol and ethyl cellulose are by 19 to 1 mixtures, add a small amount of castor oil and defoamer, wherein castor oil is used to improve the catalyst and the viscosity of improving slurry of slurry.Mentioned component is mixed, be stirred well to homogeneous, still electrocondution slurry.Used laser is the 50WNd:YAG laser, pulse frequency 20kHz, and power 40W, sweep speed 10mm/s (vibration mirror scanning), the gained live width is 400 microns.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 9
Electrocondution slurry such as embodiment 1 evenly coat this slurry on the defectiveness circuit board of (opening circuit), slurry thickness is a little more than the thickness of circuit board upper conductor.Utilize CO 2Laser, selected laser power (20W), spot diameter (150 μ m) and the sweep speed (10mm/s) that is fit to scans the place of needs conducting, and it is solidified, and just can finish the reparation of circuit board.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 10
Used electrocondution slurry such as embodiment 1, CO 2Laser power 20W, sweep speed 8mm/s, 20 microns of initialization layer thickness, substrate are epoxy resin organic layer pressing plate.After the laser treatment, remove the not slurry of active region of laser, prepared circuitous pattern such as Fig. 3.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 11
Used electrocondution slurry such as embodiment 1, adopt miniature pen or micro nozzle that electrocondution slurry is coated on substrate surface in advance according to the designed track of CAD, coat thickness is 20 microns, through 120 ℃ of oven dry, heated drying air dries up or dry naturally the back carry out laser treatment along above-mentioned same track.Laser power 35W, about 100 microns of spot diameter, sweep speed is 100mm/s.Then, remove without the electrocondution slurry of crossing laser treatment, prepared conductor width is 150 microns, and resistivity is 5 * 10 -5Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Present embodiment is saved slurry more than the method that adopts sol evenning machine to preset.
Embodiment 12
Press mass ratio with palladium oxide powder, silver powder and glass and mix at 22: 33: 45, the preparation technology of glass adds the organic solvent that contains organic binder matter then with embodiment 4, and ball milling was made resistance slurry after 2 hours again.With micro nozzle resistance slurry is coated on substrate surface in advance according to the designed track of CAD, coat thickness is 20 microns.With behind the substrate low temperature drying, can carry out laser treatment again.Used laser such as embodiment 1, substrate are simple glass.Power is 20W, and sweep speed is 10mm/s, and spot diameter is 250 μ m, and obtained resistance is wide to be 300 μ m, and square resistance is 0.8 Ω/.Defectives such as resistive surface is continuous, even, pore-free, crackle.
Embodiment 13
Press mass ratio with palladium oxide powder, silver powder and glass and mix at 13: 6.5: 80.5, the preparation technology of glass adds the organic solvent that contains organic binder matter then with embodiment 4, and ball milling was made resistance slurry after 2 hours again.With micro nozzle resistance slurry is coated on substrate surface in advance according to the designed track of CAD, coat thickness is 20 microns.With behind the substrate low temperature drying, can carry out laser treatment again.Used laser such as embodiment 1, substrate are simple glass.Power is 20W, and sweep speed is 10mm/s, and spot diameter is 250 μ m, and obtained resistance is wide to be 300 μ m, and square resistance is 100k Ω/.Defectives such as resistive surface is continuous, even, pore-free, crackle.
Embodiment 14
The preparation of capacity cell need divide for three steps:
(1) preparation of bottom electrode.Make electrocondution slurry with embodiment 4, the place in that needs are made electric capacity is coated on substrate surface with micro nozzle in advance with electrocondution slurry, and coat thickness is 20 microns.Laser treatment will be carried out again behind the coat low temperature drying.Used laser such as embodiment 1, substrate are simple glass.Power is 20W, and sweep speed is 10mm/s, and spot diameter is 100 μ m, and obtained lead is wide to be 150 μ m, resistivity 3 * 10 -5Ω cm.
(2) preparation of dielectric layer.Preset one deck dielectric material on the electrode that makes in (1).Dielectric material is BaTiO 3Ceramic powders and BaTiO 3The devitrified glass powder mixes with mass ratio at 9: 1, adds organic solvent and organic binder matter then, and ball milling promptly made required dielectric material in 1 hour again.With micro nozzle dielectric material is coated on substrate surface, will carries out laser treatment behind the coat low temperature drying again.This dielectric material is at 25 ℃, and the dielectric coefficient under the 1kHz condition is 1800, and specific volume is 5500pf/cm 2, dielectric loss is 150 * 10 -4
(3) making of top electrodes, the dielectric layer that makes with (2) is a substrate, and same step (1) is made top electrodes, and the parameter that obtains electrode is with (1).
Embodiment 15
With specific embodiment 11, the designed track of CAD is a multi-circle spiral flow shape, promptly makes needed inductance, and its inductance value is 1-3 μ H.
As complete circuit plate that comprises lead, electric capacity, resistance, inductance of needs preparation, can on substrate, arrange lead according to embodiment 1-11 earlier, again according to embodiment 12-15, prepare elements such as electric capacity, resistance, inductance in the place that has designed in advance.

Claims (3)

1. circuit board making and restorative procedure the steps include:
(1) electric slurry is preset to the initialization layer of 3-100 micron on substrate, is used to prepare lead, inductance or electric capacity, perhaps at least two kinds combination in lead, inductance, electric capacity and the resistance:
When preparation lead or inductance, employed electric slurry is an electrocondution slurry, this electrocondution slurry is made up of good conductive metal powder, bonding phase, organic solvent, wherein the particle diameter of good conductive metal powder is 1nm-50 μ m, bonding is thermosetting polymer resin mutually, or softening temperature is that 200-450 ℃, its particle diameter are that the flux powder of 0.1-10 micron and/or fusing point are that 180-300 ℃, its particle diameter are the fusible metal powder of 0.1-10 micron, when bonding is flux powder and fusible metal powder mutually, also need add organic binder matter in the electrocondution slurry;
When preparation resistance, employed electric slurry is a resistance slurry;
When preparation electric capacity, the electric slurry that uses comprises electrocondution slurry and dielectric material, wherein said electrocondution slurry is used to do capacitance electrode, this electrocondution slurry is made up of good conductive metal powder, bonding phase and organic solvent, wherein the particle diameter of good conductive metal powder is 1nm-50 μ m, bonding is thermosetting polymer resin mutually, or softening temperature is the fusible metal powder that 200-450 ℃ flux powder and/or fusing point are 180-300 ℃; Described dielectric material is used to do capacitance dielectric layer;
(2) dry or dry initialization layer, remove organic solvent wherein;
(3) utilize laser beam by the track scanning initialization layer of setting, be scanned bonding solidifying in the electric slurry on the track or fusing-solidify, make the conductive phase bonding in the electric slurry form element;
(4) the not initialization layer of sweep test is removed in cleaning, promptly obtains required circuit board.
2, method according to claim 1 is characterized in that: step (1) is that the employing sol evenning machine evenly is preset in substrate surface with above-mentioned electric slurry or adopts miniature pen or micro nozzle that electric slurry is preset at substrate surface along needed track.
3. method according to claim 1 and 2 is characterized in that: described laser beam is continuous wave laser or quasi-continuous pulse laser institute emitted laser bundle.
CNB021159378A 2002-06-06 2002-06-06 Electric circuit board production and its repairing method Expired - Lifetime CN1195397C (en)

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