CN1192485A - Photoinduction method for surface metallation of insulator - Google Patents
Photoinduction method for surface metallation of insulator Download PDFInfo
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- CN1192485A CN1192485A CN97120323A CN97120323A CN1192485A CN 1192485 A CN1192485 A CN 1192485A CN 97120323 A CN97120323 A CN 97120323A CN 97120323 A CN97120323 A CN 97120323A CN 1192485 A CN1192485 A CN 1192485A
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Abstract
The insulator to be plated is covered with semi conductor film and is directly immersed in plating liquid. At the same time, under visible light or ultraviolet light, the semi-conductor film quickly generates electric charge sepn., the illumination intensity is 10-80 mw/sq.cm., and illumination time is 10-30 sec. The object to be plated can carry pattern previously or light mask, and is metallized in the plating liquid under direct light induction to form the pattern. The invented technology is simple easy to operate, low in cost, high in safety coefficient high inalhesive force of formed film.
Description
The invention belongs to the technical field of chemical plating, and particularly belongs to a method for metalizing the surface of a photoinduction insulator.
The traditional process flow for insulator surface metallization is as follows:
1. cleaning the surface of the insulator, namely decontaminating and deoiling;
2. surface roughening-obtaining a desired roughened surface by mechanical grinding or chemical etching, for the purpose of
Is to increase the adhesion strength;
3. sensitization-immersion of roughened insulator in SnCl2In solution, the molecular activity of the insulator surface material is activated
Increasing to increase the binding force between the plating layer and the insulator;
4. the activated and sensitized insulator is soaked in a noble metal salt solution to form a layer with catalysis on the surface of a plated part
An activated atomic metal. With PdCl2For example, Sn adsorbed on the surface2+With Pd in solution2+Take place as
Carrying out the following reaction;
a layer of active palladium is separated out;
5. the metal ions in the metallization-chemical plating solution are separated on the insulator under the catalytic action of metals such as Pd and the like
And (4) plating metal.
This method has the following disadvantages:
1. the process period is long, the operation is complex, and the utilization rate of raw materials is low;
2. tin and palladium are both noble metals, and the production cost is high;
3. the operation safety is poor, tin used in the sensitization process has considerable toxicity and tends to be eliminated in chemical plating;
4. the metal coating has poor firmness, poor compactness and uniformity, low resolution and failure in meeting the requirements of high speed and high speed
The requirement of high density circuit board wiring.
Recently, some patents have been: japanese patent: the method is improved by Japanese patent laid-open Nos. 4-17211 and 4-17213, but the activation by noble metal such as palladium is still needed, and the method still has the defects of high cost, low safety factor and the like.
The invention aims to overcome the defects of the existing chemical plating, and provides a novel chemical plating method, namely a photoinduction insulator surface metallization method, which replaces the traditional coarsening, sensitization and activation treatments with a semiconductor film, directly carries out light radiation induction in a metal plating solution, starts the metallization process, prepares an integral metal plating layer or a metal plating layer with special patterns on an insulator, and obtains workpieces with special purposes, such as electronics, buildings, decorations and the like.
The purpose of the invention is realized as follows:
directly immersing the insulator plated part covered with the semiconductor film into the plating solution, simultaneously adding visible light or ultraviolet illumination which can enable the semiconductor film to rapidly generate charge separation under illumination, wherein the illumination intensity is 10-80 milliwatts/square centimeter, the illumination time is 10-30 seconds, the semiconductor film on the plated part is pre-engraved with patterns, or a diaphragm is coated on the surface of the plated part, directly photoinduced metallization in a plating solution to form patterns, the insulator is made of glass, ceramics, plastics, stone or aluminum nitride which is temperature resistant (more than 100 ℃), the shape of the insulator is flat plate, cylinder, wave or polyhedron, the semiconductor film can rapidly generate charge separation under the irradiation of ultraviolet light or visible light, the semiconductor has certain stability in water solution, the semiconductor is metal oxide or sulfide, and the plating solution is copper, nickel, silver, chromium and gold.
Directly plating a layer of semiconductor film which is not only adhesive but also photosensitizer on the surface of the insulator, then directly illuminating in solution, making the semiconductor film produce charge separation, inducing reducing agent to provide electrons for metal ions to make them separate out metal atoms, finally obtaining the metal plating layer with strong adhesive force and good glossiness.
The process flow of photoinduction of insulator surface metallization is as follows:
the specific operations of cleaning the insulator surface- → plating the semiconductor thin film- → photo-induction insulator surface metallization are as follows:
1. cleaning the surface of the insulator:
a. alkali washing: and immersing the insulator into a NaOH solution with the concentration of 5-30%, ultrasonically cleaning for 5-20 minutes, taking out, and washing with distilled water.
b. Acid washing: and soaking the insulator subjected to alkali washing in potassium dichromate-concentrated sulfuric acid washing solution for 10-30 minutes, taking out, washing with distilled water, then ultrasonically washing with deionized water for 5-20 minutes, taking out, washing with deionized water, and drying for later use.
2. Plating a semiconductor film:
preparation of semiconductor thin film of metal oxide or sulfide: the preparation methods of the semiconductor thin film of the metal oxide or the sulfide are many and easy to operate, and the following methods are mainly used for forming the film.
A. Vacuum evaporation method:
the alumina crucible is filled with metal particles or oxidized metal powder or vulcanized metal powder (dosage)Depending on the area and thickness to be coated), the vacuum degree of the vacuum chamber reaches 1-5 × 10-3When heating is started, the metal particles or the oxidized metal powder or the vulcanized metal powder become vapor, and the vapor is cooled with the insulator to deposit a film of the metal oxide or sulfide.
And taking out the plated part, and continuously annealing for 1-3 hours at the temperature of 100-400 ℃ in a muffle furnace to obtain the semiconductor film of the metal oxide or sulfide, which has the light transmittance of 75-85%, is compact and uniform, and has the crystal orientation which tends to be single.
B. Spray pyrolysis method:
using organic metal such as metal acetate and the like as raw materials to prepare an ethanol solution with the concentration of 0.01-0.5 mol/L in a high-speed carrier gas (N)2He) is sprayed onto a high-temperature insulator at 300-450 ℃ under the action of negative pressure formed during flowing, the organic metal is instantaneously decomposed, and a semiconductor of metal oxide or sulfide is deposited. The insulator coated with the semiconductor film is continuously annealed for 1-3 hours at the temperature of 100-400 ℃ in the muffle furnace, so that the surface stress of the semiconductor film of the metal oxide or sulfide is eliminated, the crystal orientation is more consistent, and the bonding force with the insulator is stronger.
C. Solution gel method:
a. preparing a 10-20% acetic acid metal/ethanol solution.
b. Adding 1 part of metal acetate/ethanol solution into 2-5 parts of water for hydrolysis to generate turbidity and precipitate,
adding 0.1-3% of lactic acid untilthe generated precipitate is dissolved again and the solution is clear.
c. Dip-coating the solution on an insulator, and heating to 100-150 ℃ in an electric heating furnace at a heating speed
The degree is about 10 ℃/min. The half-thickness of 50 nm-0.1 mm can be prepared by repeating the processes of dip coating and heating
A conductor film.
3. Photoinduction of insulator surface metallization:
the plated piece covered with the semiconductor film of the metal oxide or the sulfide is directly immersed into the plating solution, ultraviolet illumination is simultaneously carried out, when the plated piece is 5-30 cm away from a light source, the light intensity is 10-80 milliwatts per square centimeter, the metal oxide or the sulfide is a semiconductor, charge separation occurs on the illumination part, a reducing agent is oxidized by a photoproduction hole, metal ions are reduced by photoproduction electrons, a layer of microcrystalline metal is firstly deposited on the surface of the semiconductor of the metal oxide or the sulfide, and the process lasts only 10-30 seconds. Thereafter, the light source can be removed and the metal ions can be deposited continuously under the catalysis of the microcrystalline metal to form a metal film, and the whole process lasts for 10 to 40 minutes. The prepared metal coating has good glossiness and strong adhesive force; no traces were scratched on the metal surface with a 2H pencil, indicating that the film had a comparable hardness.
If a certain pattern is required on the metal coating, two methods are available, one is to etch the pattern of the semiconductor film of metal oxide or sulfide first and then to induce the surface of the insulator to be metallized by light; the other method is to coat a diaphragm on the surface of a semiconductor of metal oxide or sulfide and directly carry out light-induced chemical plating in a plating solution to realize metallization.
The pattern etching of the semiconductor thin film of metal oxide or sulfide is as follows:
the method comprises the steps of tightly covering the surface of a semiconductor of metal oxide or sulfide with a specially-shaped diaphragm, immersing the semiconductor in a hydrochloric acid solution with the pH value of 1-4, irradiating with ultraviolet light for 10-40 minutes, taking out the semiconductor, washing with distilled water, and removing the diaphragm, wherein the semiconductor of the metal oxide or sulfide at the exposed part is dissolved, and the unexposed part is kept unchanged. Thus obtaining the plating part preparation which meets the requirements.
The insulator used in the invention is not limited in type, and can be any insulator which can resist the temperature of more than 100 ℃, such as glass, ceramics, plastics, stones, aluminum nitride and the like, and the shape of the insulator can be various, such as flat plate type, cylindrical type, wavy type or other insulators with special shapes.
The semiconductor used in the invention can be any semiconductor which can rapidly generate charge separation under the irradiation of ultraviolet light or visible light and has certain stability in aqueous solution, such as a semiconductor meeting the requirements in metal oxide or sulfide.
The light source can be light which can lead the semiconductor film to rapidly generate charge separation under illumination, such as ultraviolet light and visible light; the illumination time is determined by the intensity of the light source and the distance between the light source and the plated part.
The metal used to metallize the surface of the insulator is copper, nickel, silver, chromium, gold, or other metal that can be conventionally chemically plated. The types and the formulas of the plating solution are as follows:
when the weight of water is 250g, the metal ion oxidizing agent containing the coating is copper sulfate, nickel sulfate, chloroauric acid, silver nitrate and chromic acid, the weight is 5-50 g, the weight of a reducing agent is 1-40 g, a buffering agent is sodium hydroxide, potassium hydroxide, sodium carbonate and ammonia chloride, the weight is 1-50 g, a complexing agent is EDTA disodium salt, EDTA dipotassium salt, EDTA potassium sodium, sodium citrate, the weight is 0-30 g, and a stabilizing agent is polyethylene glycol, and the weight is 0.001-0.1 g. The complexing agent in the bath is to control the rate of metallization. Example (c): the formula of the copper plating solution is as follows:
amount of name and specification
20-50 g of copper sulfate analytically pure (A.R.)
EDTA disodium salt chemical purity (C.P.) 5-20 g
Sodium hydroxide chemical purity (C.P.) 1-50 g
10-40 g of analytically pure formaldehyde (A.R.)
Polyethylene glycol 400 is chemically pure (C.P.) in an amount of 0.001-0.02 g
The formula of the deionized water gold plating solution with 18 megohms and 250 g:
amount of name and specification
5-20 g of chloroauric acid analytically pure (A.R.)
Sodium carbonate chemical purity (C.P.) 1-10 g
1-10 g of glucose analytical reagent (A.R.)
Deionized water 18 mega ohm 250g
The polyethylene glycol 400 chemical purity (C.P.) is 0.001-0.01 g of nickel plating solution formula:
5-30 g of name specification dosage nickel sulfate analytical reagent (A.R.)
Sodium citrate analytical grade (A.R.) 1-10 g
Ammonium chloride chemical purity (C.P.) 20-40 g
Sodium carbonate chemical purity (C.P.) 1-10 g
Deionized water 18 mega ohm 250g
Polyethylene glycol 400 is chemically pure (C.P.) in an amount of 0.001-0.01 g
Sodium hypophosphite analytical purity (A.R.) 10-40 g
The invention relates to a novel chemical plating method, which replaces the traditional coarsening, sensitizing and activating treatment with a semiconductor film, and more importantly, introduces a photoinduction method during chemical plating to directly obtain a metal plating layer meeting the requirements. The semiconductor film not only can increase the bonding strength of the coating and the insulator, but also plays a catalytic role in the metallization process. Compared with the traditional method, the method has the advantages of convenient operation, simple process, strong adhesion of the plating metal, high spatial resolution and the like, and is a promising method for metalizing the surface of the insulator. It is especially suitable for building, decoration and printed circuit board wiring technology. The invention has the advantages that:
1. the metal plating layer is compact and uniform, has good glossiness, strong adhesive force (greater than 8kg/2mm □) and high scribing density.
2. Short process period, simple operation and high utilization rate of raw materials.
3. The safety coefficient is high, and the production cost is low.
The invention is further illustrated by the following examples: example (b): example 1: plating copper on plate glass
A semiconductor film of zinc sulfide of about 1 μm was prepared on a common glass slide by vacuum evaporation, as described above.
The prepared glass plating piece is immersed in a copper plating solution, a 400w high-pressure mercury lamp is used as a light source, the radiation distance is 10cm, the light intensity is 60 milliwatts per square centimeter, and black copper appears on the surface of zinc sulfide after 20 seconds. Removing the light source, continuously precipitating copper on the surface of the zinc sulfide, taking out the plated piece after 20 minutes, and rinsing the plated piece by using distilled water, wherein the copper layer has good luster and the adhesive force of 10kg/2mm □. If a thick metal layer is desired, electroplating may continue to be employed. The formula of the copper plating solution is as follows:
name Specification dosage copper sulfate analytically pure (A.R.) 20g EDTA sodium salt chemically pure (C.P.) 10g sodium hydroxide chemically pure (C.P.) 10g sodium hydroxide
Formaldehyde analytically pure (A.R.) 30g polyethylene glycol 400 chemically pure (C.P.) 0.005g deionized water 18 megohms 250g example 2: copper wire coated on plate glass
A ZnO film having a thickness of about 1.2 μm was prepared on a common glass slide by vacuum evaporation, and annealed at 300 ℃ for 2 hours. A diaphragm with a space of 100 μm between the etching lines was closely coated on the surface of ZnO, and the surface was immersed in a hydrochloric acid solution (pH 1 to 4) and irradiated with ultraviolet light for 10 minutes, and then taken out, washed with distilled water, and the diaphragm was removed, so that ZnO in the exposed portion was dissolved and the unexposed portion remained unchanged. Thus obtaining the plating part preparation which meets the requirements.
Immersing the prepared glass plated piece into a copper plating solution, irradiating the surface of ZnO with ultraviolet light, wherein the light intensity is 10 milliwatts per square centimeter and the time is 30 seconds, removing a light source after microcrystalline copper appears, taking out the plated piece after 40 minutes, rinsing the plated piece with distilled water, and obtaining a compact and clear copper layer with good glossiness on the part with zinc oxide and strong adhesive force.
The formula of the copper plating solution is as follows:
amount of name and specification
Copper sulfate analytically pure (A.R.) 50g
EDTA disodium salt chemical purity (C.P.) 30g
Sodium hydroxide chemical purity (C.P.) 20g
Formaldehyde analytical grade (A.R.) 40g
Polyethylene glycol 400 chemically pure (C.P.) 0.1g
Deionized water 18 mega ohm 250g example 3: ceramic gold plating
A ZnO film having a thickness of about 0.8 μm was prepared on a plate ceramic by a spray pyrolysis method. Then immersing in gold plating solution, and irradiating the surface of the plated piece by using an ultraviolet light source. And taking out after 30 minutes, washing with distilled water, and plating a bright gold film on the surface of the ceramic. The formula of the gold plating solution is as follows:
amount of name and specification
Analytically pure chloroauric acid (A.R.) 5g
Sodium carbonate chemically pure (C.P.) 5g
Glucose assay pure (A.R.) 10g
Deionized water 18 mega ohm250g
Polyethylene glycol 400 was chemically pure (C.P.) 0.002g of example 4: inner wall nickel plating of coarse glass tube
A crude glass tube is cleaned, a zinc oxide film with the thickness of about 1 mu m is prepared on the inner surface of the glass tube by a solution gel method, the glass tube is immersed in prepared nickel plating solution, simultaneously, an ultraviolet lamp is used for irradiating for 20 seconds, the light intensity is 30 milliwatts/square centimeter, the temperature of the plating solution is kept constant (30 +/-1 ℃), and after 20 minutes, a plating piece is taken out, and the inner wall can be seen to be plated with a layer of bright nickel. The formula of the nickel plating solution is as follows:
amount of name and specification
Analytically pure nickel sulfate (A.R.) 25g
Sodium citrate analytically pure (A.R.) 2g
Ammonium chloride chemically pure (C.P.) 20g
Sodium carbonate chemically pure (C.P.) 5g
Sodium hypophosphite analytical pure (A.R.) 40g
Polyethylene glycol 400 (C.P.) is chemically pure (0.005 g)
Deionized water 18 mega ohm 250g example 5: nickel wire on flat aluminium nitride
A layer of metallic zinc oxide semiconductor film with the thickness of about 1 mu m is prepared on the surface of an AlN plate by a spray pyrolysis method, and the AlN plate is annealed for 2 hours at a high temperature of 400 ℃. A diaphragm with a space of 100 μm between the etching lines was closely covered on the surface of a zinc oxide semiconductor, immersed in a 15% hydrochloric acid solution (pH 1 to 4), and irradiated with ultraviolet light for 20 minutes, and then taken out. The photoresist was washed with distilled water to remove the diaphragm, and the zinc oxide semiconductor in the exposed portion was dissolved while the unexposed portion remained unchanged, and the zinc oxide showed a good pattern.
Immersing the prepared AlN pre-plated piece into a nickel plating solution, keeping the temperature of the solution within the range of 30 +/-1 ℃, irradiating the surface of a zinc oxide semiconductor by using ultraviolet light, taking out the plated piece after 40 minutes, and rinsing the plated piece by using distilled water to obtain a clear nickel layer with strong adhesive force and good glossiness on the surface of the zinc oxide. If the nickel layer needs to be thickened, the electroplating process can be continuously used for completing the process. The formula of the nickel plating solution is as follows:
name specification amounts nickel sulfate analytically pure (A.R.) 10g sodium citrate analytically pure (A.R.) 8g ammonium chloride chemically pure (C.P.) 40g sodium carbonate chemically pure (C.P.) 10g sodium hypophosphite analytically pure (A.R.) 10g polyethylene glycol 400 chemically pure (C.P.) 0.01g deionized water 18 mega ohm m 250g
Claims (8)
1. A method for light-induced insulator surface metallization is characterized by comprising the following steps: the insulator plating part covered with the semiconductor film is directly immersed into the plating solution, and simultaneously visible light or ultraviolet light which can enable the semiconductor film to rapidly generate charge separation under the irradiation of light is added.
2. The method according to claim 1, wherein the semiconductor thin film on the plated article is pre-patterned, or the surface of the plated article is coated with alight barrier, and the metallization is directly photo-induced in the plating solution to form a pattern.
3. The method of claim 1, wherein the irradiation intensity is 10 to 80 mw/cm and the irradiation time is 10 to 30 seconds.
4. The method of claim 1, wherein the insulator is selected from the group consisting of glass, ceramic, plastic, stone, and aluminum nitride.
5. A method according to claim 1 or 4, wherein the insulator is shaped as a flat plate, a cylinder, a wave or a polyhedron.
6. The method of claim 1, wherein the semiconductor thin film is a semiconductor that undergoes rapid charge separation under UV or visible light irradiation and has a certain stability in aqueous solution.
7. A method according to claim 1 or 6, wherein the semiconductor is a metal oxide or sulfide.
8. The method according to claim 1, wherein the plating solution is a copper, nickel, silver, chromium, or gold plating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97120323A CN1053713C (en) | 1997-12-08 | 1997-12-08 | Photoinduction method for surface metallation of insulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97120323A CN1053713C (en) | 1997-12-08 | 1997-12-08 | Photoinduction method for surface metallation of insulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1192485A true CN1192485A (en) | 1998-09-09 |
| CN1053713C CN1053713C (en) | 2000-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97120323A Expired - Fee Related CN1053713C (en) | 1997-12-08 | 1997-12-08 | Photoinduction method for surface metallation of insulator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102605355A (en) * | 2012-02-21 | 2012-07-25 | 北京化工大学 | Copper film on surface of substrate as well preparation method and application thereof |
| CN104073799A (en) * | 2014-06-27 | 2014-10-01 | 深圳市开天源自动化工程有限公司 | Method for forming antibacterial optical copper plating film on surface of plastic carrier |
| CN107796858A (en) * | 2017-08-29 | 2018-03-13 | 苏州荣磐医疗科技有限公司 | A kind of preparation method of metal electrode |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5534312A (en) * | 1994-11-14 | 1996-07-09 | Simon Fraser University | Method for directly depositing metal containing patterned films |
| CN1049019C (en) * | 1996-01-30 | 2000-02-02 | 中国科学技术大学 | Method for preparing metal nickel film by gamma ray irradiation |
-
1997
- 1997-12-08 CN CN97120323A patent/CN1053713C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102605355A (en) * | 2012-02-21 | 2012-07-25 | 北京化工大学 | Copper film on surface of substrate as well preparation method and application thereof |
| CN102605355B (en) * | 2012-02-21 | 2014-07-02 | 北京化工大学 | Copper film on surface of substrate as well preparation method and application thereof |
| CN104073799A (en) * | 2014-06-27 | 2014-10-01 | 深圳市开天源自动化工程有限公司 | Method for forming antibacterial optical copper plating film on surface of plastic carrier |
| CN107796858A (en) * | 2017-08-29 | 2018-03-13 | 苏州荣磐医疗科技有限公司 | A kind of preparation method of metal electrode |
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| Publication number | Publication date |
|---|---|
| CN1053713C (en) | 2000-06-21 |
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Owner name: CHEMISTRY INSTITUTE, CHINESE ACADEMY OF SCIENCES Free format text: FORMER OWNER: INST. OF PHOTOGRAPHIC CHEMISTRY, CHINESE ACADEMY OF SCIENCES Effective date: 20030411 |
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Effective date of registration: 20030411 Address after: 100080 No. 2 North First Street, Haidian District, Beijing, Zhongguancun Patentee after: Institute of Chemistry, Chinese Academy of Sciences Address before: 100101 Beijing city Chaoyang District Datun Road No. 3 Patentee before: Photosensitive Chemical Inst., China Academy of Sciences |
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