CN118765470A - 发光器件以及VoS（硅上VCSEL）器件 - Google Patents

发光器件以及VoS（硅上VCSEL）器件 Download PDF

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Publication number
CN118765470A
CN118765470A CN202280091778.0A CN202280091778A CN118765470A CN 118765470 A CN118765470 A CN 118765470A CN 202280091778 A CN202280091778 A CN 202280091778A CN 118765470 A CN118765470 A CN 118765470A
Authority
CN
China
Prior art keywords
layer
solder
light emitting
emitting device
vehicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280091778.0A
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English (en)
Chinese (zh)
Inventor
青柳哲理
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
Original Assignee
Sony Semiconductor Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Publication of CN118765470A publication Critical patent/CN118765470A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18305—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
CN202280091778.0A 2022-02-22 2022-12-27 发光器件以及VoS（硅上VCSEL）器件 Pending CN118765470A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022025202 2022-02-22
JP2022-025202 2022-02-22
PCT/JP2022/048339 WO2023162463A1 (ja) 2022-02-22 2022-12-27 発光デバイスおよびＶｏＳ（ＶＣＳＥＬ ｏｎ Ｓｉｌｉｃｏｎ）デバイス

Publications (1)

Publication Number Publication Date
CN118765470A true CN118765470A (zh) 2024-10-11

Family

ID=87765590

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280091778.0A Pending CN118765470A (zh) 2022-02-22 2022-12-27 发光器件以及VoS（硅上VCSEL）器件

Country Status (5)

Country Link
EP (1) EP4485717A1 (https=)
JP (1) JPWO2023162463A1 (https=)
CN (1) CN118765470A (https=)
TW (1) TW202406255A (https=)
WO (1) WO2023162463A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5162909B2 (ja) * 2006-04-03 2013-03-13 豊田合成株式会社 半導体発光素子
JP2009021430A (ja) * 2007-07-12 2009-01-29 Fuji Xerox Co Ltd 面型光素子及び光モジュール
DE102016103862A1 (de) * 2016-03-03 2017-09-07 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem
JP7125327B2 (ja) * 2018-10-25 2022-08-24 浜松ホトニクス株式会社 発光素子及び発光装置
WO2021090670A1 (ja) 2019-11-06 2021-05-14 ソニーセミコンダクタソリューションズ株式会社 面発光レーザ装置

Also Published As

Publication number Publication date
TW202406255A (zh) 2024-02-01
JPWO2023162463A1 (https=) 2023-08-31
WO2023162463A1 (ja) 2023-08-31
EP4485717A1 (en) 2025-01-01

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