CN118511260A - 包括集成器件之间的间隔件的封装件 - Google Patents

包括集成器件之间的间隔件的封装件 Download PDF

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Publication number
CN118511260A
CN118511260A CN202280087090.5A CN202280087090A CN118511260A CN 118511260 A CN118511260 A CN 118511260A CN 202280087090 A CN202280087090 A CN 202280087090A CN 118511260 A CN118511260 A CN 118511260A
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Prior art keywords
integrated device
interconnects
package
integrated
coupled
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Pending
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CN202280087090.5A
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English (en)
Chinese (zh)
Inventor
孙洋洋
D·何
L·赵
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Qualcomm Inc
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Qualcomm Inc
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Publication of CN118511260A publication Critical patent/CN118511260A/zh
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    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07255—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in materials
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CN202280087090.5A 2022-01-12 2022-12-15 包括集成器件之间的间隔件的封装件 Pending CN118511260A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/574,360 2022-01-12
US17/574,360 US11948909B2 (en) 2022-01-12 2022-01-12 Package comprising spacers between integrated devices
PCT/US2022/053063 WO2023136908A1 (en) 2022-01-12 2022-12-15 Package comprising spacers between integrated devices

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CN118511260A true CN118511260A (zh) 2024-08-16

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US (1) US11948909B2 (https=)
EP (1) EP4463886A1 (https=)
JP (1) JP2025501385A (https=)
KR (1) KR20240136950A (https=)
CN (1) CN118511260A (https=)
TW (1) TW202335200A (https=)
WO (1) WO2023136908A1 (https=)

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KR20240135232A (ko) * 2023-03-03 2024-09-10 삼성전자주식회사 반도체 패키지

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