KR20240136950A - 집적 디바이스들 사이에 스페이서들을 포함하는 패키지 - Google Patents

집적 디바이스들 사이에 스페이서들을 포함하는 패키지 Download PDF

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Publication number
KR20240136950A
KR20240136950A KR1020247022067A KR20247022067A KR20240136950A KR 20240136950 A KR20240136950 A KR 20240136950A KR 1020247022067 A KR1020247022067 A KR 1020247022067A KR 20247022067 A KR20247022067 A KR 20247022067A KR 20240136950 A KR20240136950 A KR 20240136950A
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South Korea
Prior art keywords
integrated device
interconnections
interconnects
package
integrated
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Pending
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KR1020247022067A
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English (en)
Korean (ko)
Inventor
양양 선
동밍 허
릴리 자오
Original Assignee
퀄컴 인코포레이티드
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Publication of KR20240136950A publication Critical patent/KR20240136950A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
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    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H01L24/16—
    • H01L23/481—
    • H01L23/485—
    • H01L24/13—
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    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
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    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07255—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in materials
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/253—Materials not comprising solid metals or solid metalloids, e.g. polymers or ceramics
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H10W72/267—Multiple bump connectors having different functions
    • H01L2224/13076—
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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    • H10W72/01251—Changing the shapes of bumps
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01257—Changing the shapes of bumps by reflowing
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    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
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    • H10W72/01933—Manufacture or treatment of bond pads using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01935—Manufacture or treatment of bond pads using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01951—Changing the shapes of bond pads
    • H10W72/01953—Changing the shapes of bond pads by etching
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
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    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
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    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
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    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/224—Bumps having multiple side-by-side cores
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W74/00—Encapsulations, e.g. protective coatings
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    • H10W90/26—Configurations of stacked chips the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape
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    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
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    • H10W99/00—Subject matter not provided for in other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020247022067A 2022-01-12 2022-12-15 집적 디바이스들 사이에 스페이서들을 포함하는 패키지 Pending KR20240136950A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/574,360 2022-01-12
US17/574,360 US11948909B2 (en) 2022-01-12 2022-01-12 Package comprising spacers between integrated devices
PCT/US2022/053063 WO2023136908A1 (en) 2022-01-12 2022-12-15 Package comprising spacers between integrated devices

Publications (1)

Publication Number Publication Date
KR20240136950A true KR20240136950A (ko) 2024-09-19

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ID=85174195

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247022067A Pending KR20240136950A (ko) 2022-01-12 2022-12-15 집적 디바이스들 사이에 스페이서들을 포함하는 패키지

Country Status (7)

Country Link
US (1) US11948909B2 (https=)
EP (1) EP4463886A1 (https=)
JP (1) JP2025501385A (https=)
KR (1) KR20240136950A (https=)
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