CN118400902A - Manufacturing method of pin blind hole high-frequency board - Google Patents
Manufacturing method of pin blind hole high-frequency board Download PDFInfo
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- CN118400902A CN118400902A CN202410680198.6A CN202410680198A CN118400902A CN 118400902 A CN118400902 A CN 118400902A CN 202410680198 A CN202410680198 A CN 202410680198A CN 118400902 A CN118400902 A CN 118400902A
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- blind hole
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 229920002799 BoPET Polymers 0.000 claims abstract description 22
- 238000003475 lamination Methods 0.000 claims abstract description 16
- 238000005553 drilling Methods 0.000 claims abstract description 10
- 239000010408 film Substances 0.000 claims description 56
- 238000003825 pressing Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000002699 waste material Substances 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 4
- 239000013039 cover film Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 7
- 230000000903 blocking effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a pin blind hole high-frequency board, which comprises the steps of firstly manufacturing an inner core board, and performing one-time lamination, drilling, PTH (through hole) flow and graph manufacturing flow; then attaching the covering film and the PET film; and then, after the covering film is subjected to laser windowing, transferring the PET film to the position of the hole of the PCB, and tearing off the PET film. The invention realizes the matching of the blind hole plug-in components and different assembly requirements, improves the flexibility of wiring, and avoids the problem of glue overflow of the pin blind holes.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a manufacturing method of a pin blind hole high-frequency board.
Background
The circuit board is a mother of electronic products and is a key interconnection piece of the electronic products, and because the circuit board has the functions of bearing a base platform for installing electronic components and conducting circuits, the circuit board is designed into a single double-panel or multi-layer board according to the density requirement of wiring. The multi-layer board needs a plurality of core boards to be pressed together, and the layers need metallized holes to be conducted to form a network. Along with the development of electronic information technology to high speed, multifunction, large capacity, small volume and light and thin, in order to arrange more electronic components in a certain unit area and realize stronger functions, components are usually fixed by adopting modes such as surface mount pads, plug-in mounting hole plates and the like.
The electronic products are widely applied in various fields, the staged rapid development of the printed circuit board is promoted, and the functions of the electronic products are more and more powerful, and the manufacturing process is more and more complex from a simple single-sided or double-sided printed circuit board to a high-grade printed circuit board with more than tens of layers, an HDI (high-density interface) of any order, high-frequency mixed voltage and a high-end printed circuit board embedded with various components. In the case of a high-frequency board, since the wiring density is too high, the surface mounting pad space is small, the number of the interposer holes is large, and there is a problem that part of the interposer holes cannot be formed as through holes. Because the through hole can occupy the wiring space of partial layering, the through hole can pass the signal layer, and the circuit needs to avoid the through hole, so can only design blind hole plug-in components, and the blind hole plug-in components need to paste high temperature sticky tape and hinder the glue in inlayer core, take out high temperature sticky tape after the outer corresponding position accuse depth mills, but high temperature sticky tape buries and appears layering foaming phenomenon in the welding process easily in PCB inside, consequently needs the manual work to take out, if receive the aperture restriction unable time of taking out, then can't realize hinder the glue.
Disclosure of Invention
The invention aims to solve the technical problem of providing a manufacturing method of a pin blind hole high-frequency board, which aims to solve the problem of glue blocking of the pin blind hole caused by the limitation of a through hole plug-in the prior art.
In order to solve the above problems, the present invention provides a method for manufacturing a pin blind hole high frequency board, comprising the steps of:
Manufacturing an inner core plate;
manufacturing an upper sub-board and a lower sub-board;
laminating and pressing the upper sub-board, the inner core board and the lower sub-board in sequence from top to bottom.
Further, the manufacturing of the inner core plate includes:
And manufacturing the L5-L6 layer core board.
Further, the manufacturing of the upper and lower sub-boards includes:
Manufacturing an upper sub-board, performing first lamination on the L1-L4 layers, and then performing drilling, electroplating through holes and circuit pattern manufacturing on the L1-L4 layers after the first lamination;
And manufacturing a lower sub-board, performing first lamination on the L7-L10 layers, and then performing drilling, electroplating through holes and circuit pattern manufacturing on the L7-L10 layers after the first lamination.
Further, the expansion coefficients of the upper sub-board, the inner core board and the lower sub-board are consistent.
Further, the laminating and pressing the upper sub-board, the inner core board and the lower sub-board in sequence from top to bottom includes:
manufacturing a PET carrier film;
Fixing the PET carrier film on the L5 layer and the L6 layer of the inner core plate in a MARK point alignment mode, pre-pasting the edges of the inner core plate by using an electric soldering iron, then pressing the inner core plate by using a vacuum quick press, tearing off the PET protective film, and finishing transfer pasting of the cover film;
manufacturing a PP upper window;
and the two parts are sequentially arranged according to the sequence of the pressing structure, the rivet is used for fixing in an alignment mode, the deviation of the position of the PP windowing is avoided, and the secondary pressing is performed.
Further, the making of the PET carrier film includes:
And sticking the covering film and the PET film together, making hole-shaped covering film small pieces by using a laser blind cutting mode, removing unnecessary covering film waste areas, keeping the hole-shaped small pieces, sticking the hole-shaped small pieces on the PET film, and forming the PET carrier film stuck with the hole-shaped covering film.
Further, using a film pressing machine to adhere the covering film and the PET film together, controlling the temperature of the film pressing machine to be 100 ℃ and the speed to be 0.2m/min, and pressing the covering film and the PET film;
The laser blind cutting parameters are adjusted to control cutting through the covering film and not cutting through the PET film, so that the waste material area of the covering film is removed, and the needed hole shape is reserved.
Further, the PTE carrier film had a thickness of 0.1mm.
Further, when the vacuum fast press is pressed, the temperature is kept at 170 ℃ for 3 minutes, and the vacuum degree is 650mmHG.
Further, the manufacturing of the PP up-opening window includes: and windowing is carried out on the PP layer between the L4 layer and the L5 layer, and windowing is carried out on the PP layer between the L6 layer and the L7 layer.
Compared with the prior art, the invention ensures that the pin blind holes are free of gummosis through the way of PP windowing and film covering film hole sealing design, the film covering film is designed to be attached to the PET film preferentially, then the PET film is transferred to the PCB board to cover the PTH holes, and then the window is windowed on the core board PP below the plug-in holes, thereby preventing the PP gummosis from entering the holes. The invention changes the limitation of the traditional through hole plug-in, realizes the matching of the requirement of the blind hole plug-in and different assembly requirements, improves the flexibility of wiring, and avoids the problem of glue overflow of the pin blind hole.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic layer structure of a pin blind hole high frequency board of the present invention.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
The invention provides a manufacturing method of a pin blind hole high-frequency board, which takes 10 layers as an example in the embodiment for illustration.
As shown in fig. 1, fig. 1 is a schematic layer structure of a pin blind hole high frequency board according to the present embodiment. The novel printed circuit board comprises L1-L10 layers, wherein L5-L6 layers are inner core plates, an upper sub-board formed by laminating L1-L4 layers is arranged above the L5 layers, blind holes 2 formed by corresponding drilling and electroplating are formed in the upper sub-board, and pins 1 are correspondingly arranged in the corresponding blind holes 2.
Correspondingly, a lower sub-board formed by laminating L7-L10 layers is positioned below the L6 layer, blind holes are correspondingly formed on the lower sub-board after drilling and electroplating, and pins are arranged in the corresponding blind holes.
The manufacturing method corresponding to the embodiment specifically comprises the following steps:
And manufacturing an inner core board, wherein the inner core board is an L5-L6 layer core board, and the L5-L6 layer core board is subjected to the processes of one-time lamination, drilling, PTH (point-to-point) process, circuit pattern manufacturing and the like, so that the inner core board is communicated with L5 and L6.
Manufacturing an upper sub-board and a lower sub-board, wherein the upper sub-board is an L1-L4 laminate, first laminating the L1-L4 layers, and then drilling holes, electroplating through holes and manufacturing circuit patterns on the L1-L4 layers after the first lamination to form the upper sub-board;
The lower sub-board is an L7-L10 laminate, and similarly, the L7-L10 layer is pressed for the first time, and then the L7-L10 layer after the first pressing is drilled, plated through holes and circuit patterns are manufactured to form the lower sub-board.
The expansion coefficients of the upper sub-board, the inner core board and the lower sub-board are kept consistent, so that deviation in the subsequent second pressing process is avoided.
The method comprises the steps of manufacturing a PET carrier film, firstly, sticking a covering film and the PET film together by using a film pressing machine, controlling the temperature of the film pressing machine to be 100 ℃ and the speed to be 0.2m/min, pressing the covering film and the PET film, and then, adjusting blind cutting parameters of laser to control cutting through the covering film instead of cutting through the PET film so as to remove a waste material area of the covering film, keeping a needed hole shape to be stuck on the PET film, and forming the PET carrier film stuck with the hole-shaped covering film with the thickness of 0.1 mm;
Setting 4 MARK points on each plate of the inner core plate L5 layer and the inner core plate L6 layer for alignment, fixing a PET carrier film on the inner core plate L5 layer and the inner core plate L6 layer in a MARK point alignment mode, heating and pre-pasting the plate edges by using an electric soldering iron, controlling the temperature of a vacuum quick press to 170 ℃ for 3 minutes, and carrying out lamination with the vacuum degree of 650mmHG, tearing off the PET protective film after lamination is completed, and completing transfer pasting of the cover film on the inner core plate L5 layer and the inner core plate L6 layer;
Manufacturing a PP upper window, and windowing a PP layer between an L4 layer and an L5 layer and a PP layer between an L6 layer and an L7 layer; wherein the aperture of the PP corresponding to the windowed window is 3.15mm;
according to the laminated structure sequence, 8 rivet pattern holes are correspondingly designed on the plate edges, the aperture of the core plate is 3.175mm, rivets are used for fixing in an alignment mode, the deviation of the position of the PP windowing is avoided, and the second lamination is carried out.
And after the second pressing, forming a pin blind hole for protection, and before etching the outer layer, attaching a dry film with the thickness of 50 mu m for protection, wherein the dry film is 0.15mm larger than Kong Shanbian mm, so that the biting of liquid medicine in the blind hole is avoided.
The invention firstly makes the process of one-time lamination, drilling and PTH of the inner core plate; then attaching the covering film and the PET film; then, carrying out laser windowing on the covering film, transferring the covering film from the PET film to the hole position of the inner core plate, tearing off the PET film, and covering the PTH hole through the covering film; and then windowing on the PP between the inner core plate and the upper and lower sub-plates to form corresponding PP holes, and then laminating according to the lamination sequence. The invention uses the covering film to be pre-adhered at the orifice position for blocking glue, avoids the problem of taking out, does not generate layering and foaming phenomenon in the welding process, can also be used for manufacturing other types of pin blind hole plates, improves the production and manufacturing efficiency, improves the flexibility of a PCB design end, can simultaneously meet the diversification of SMT surface adhesion, through hole plug-in components and blind hole plug-in components, and can realize the glue blocking effect and reliability of any shape by arranging the auxiliary PET carrier film for covering film transfer on the plate.
The embodiments of the invention have been described in detail above, but they are merely examples, and the invention is not limited to the embodiments described above. It will be apparent to those skilled in the art that any equivalent modifications or substitutions to this invention are within the scope of the invention, and therefore, all equivalent changes and modifications, improvements, etc. that do not depart from the spirit and scope of the principles of the invention are intended to be covered by this invention.
Claims (10)
1. The manufacturing method of the pin blind hole high-frequency plate is characterized by comprising the following steps of:
Manufacturing an inner core plate;
manufacturing an upper sub-board and a lower sub-board;
laminating and pressing the upper sub-board, the inner core board and the lower sub-board in sequence from top to bottom.
2. The method for manufacturing the pin blind hole high frequency board according to claim 1, wherein the manufacturing the inner core board comprises:
And manufacturing the L5-L6 layer core board.
3. The method for manufacturing the pin blind hole high frequency board according to claim 2, wherein the manufacturing of the upper sub-board and the lower sub-board comprises:
Manufacturing an upper sub-board, performing first lamination on the L1-L4 layers, and then performing drilling, electroplating through holes and circuit pattern manufacturing on the L1-L4 layers after the first lamination;
And manufacturing a lower sub-board, performing first lamination on the L7-L10 layers, and then performing drilling, electroplating through holes and circuit pattern manufacturing on the L7-L10 layers after the first lamination.
4. The method for manufacturing the pin blind hole high-frequency board according to claim 3, wherein the expansion coefficients of the upper sub-board, the inner core board and the lower sub-board are identical.
5. The method for manufacturing a pin blind hole high frequency board according to claim 4, wherein the laminating and pressing the upper sub-board, the inner core board and the lower sub-board in the order from top to bottom comprises:
manufacturing a PET carrier film;
Fixing the PET carrier film on the L5 layer and the L6 layer of the inner core plate in a MARK point alignment mode, pre-pasting the edges of the inner core plate by using an electric soldering iron, then pressing the inner core plate by using a vacuum quick press, tearing off the PET protective film, and finishing transfer pasting of the cover film;
manufacturing a PP upper window;
and the two parts are sequentially arranged according to the sequence of the pressing structure, the rivet is used for fixing in an alignment mode, the deviation of the position of the PP windowing is avoided, and the secondary pressing is performed.
6. The method for manufacturing a pin blind hole high frequency board according to claim 5, wherein the manufacturing of the PET carrier film comprises:
And sticking the covering film and the PET film together, making hole-shaped covering film small pieces by using a laser blind cutting mode, removing unnecessary covering film waste areas, keeping the hole-shaped small pieces, sticking the hole-shaped small pieces on the PET film, and forming the PET carrier film stuck with the hole-shaped covering film.
7. The method for manufacturing a pin blind hole high frequency board according to claim 6, wherein,
Sticking the covering film and the PET film together by using a film pressing machine, controlling the temperature of the film pressing machine to be 100 ℃ and the speed to be 0.2m/min, and pressing the covering film and the PET film;
The laser blind cutting parameters are adjusted to control cutting through the covering film and not cutting through the PET film, so that the waste material area of the covering film is removed, and the needed hole shape is reserved.
8. The method for manufacturing a pin blind hole high frequency board according to claim 5, wherein the PTE carrier film has a thickness of 0.1mm.
9. The method for manufacturing the pin blind hole high-frequency board according to claim 5, wherein the vacuum fast press is kept at 170 ℃ for 3 minutes and has a vacuum degree of 650mmHG.
10. The method for manufacturing the pin blind hole high frequency board according to claim 5, wherein the manufacturing the PP up-window comprises:
and windowing is carried out on the PP layer between the L4 layer and the L5 layer, and windowing is carried out on the PP layer between the L6 layer and the L7 layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410680198.6A CN118400902A (en) | 2024-05-29 | 2024-05-29 | Manufacturing method of pin blind hole high-frequency board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410680198.6A CN118400902A (en) | 2024-05-29 | 2024-05-29 | Manufacturing method of pin blind hole high-frequency board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118400902A true CN118400902A (en) | 2024-07-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410680198.6A Pending CN118400902A (en) | 2024-05-29 | 2024-05-29 | Manufacturing method of pin blind hole high-frequency board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118400902A (en) |
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2024
- 2024-05-29 CN CN202410680198.6A patent/CN118400902A/en active Pending
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