CN118342668A - Processing equipment and method for wafer-level array optical element and die - Google Patents

Abstract

The invention relates to the technical field of ultra-precise machining of array optical elements, and aims to solve the problems of low efficiency, machining precision and unstable surface machining quality. In order to solve the technical problems, the invention provides a processing device and a processing method for a wafer-level array optical element and a die. The workpiece fixing module comprises a moving assembly connected to a machine tool base and a workpiece spindle connected to the moving assembly; the moving assembly and the workpiece spindle respectively drive the workpiece to move along the X axis and the Y axis and rotate along the axis of the workpiece spindle; the movable rotating component drives the processing cutter to rotate in a horizontal plane, move along a Z axis and rotate along a B axis rotary table; the tool spindle and the slide assembly drive the machining tool to rotate along the axis of the tool spindle and to move radially along the plane of rotation, respectively. The invention improves the processing efficiency and the processing precision and the stability of the surface processing quality.

Description

Processing equipment and method for wafer-level array optical element and die

Technical Field

The invention relates to the technical field of ultra-precise machining of array optical elements, in particular to machining equipment and method for wafer-level array optical elements and dies.

Background

The ultra-precise machining technology is an important field in mechanical manufacturing, and has important influence on the development of sophisticated technology and national defense technology. And the ultra-precision machining technology of optical elements is one of the important branches.

With development and application of ultra-precise machining technology, the traditional optical machining method breaks through, and the optical surface can be directly machined into submicron order surface shape precision and nanometer order surface roughness. The application of the existing ultra-precise machining technology in the optical element machining industry is mainly based on an ultra-precise single-point diamond lathe.

With the high-speed development of the optical industry, the optical surface shape design is more and more complex, and the optical surface shape design can be generally formed by random combination of asymmetric, irregular and complex free curved surfaces, so that higher requirements on processing are further provided. However, the prior art has the problems of low efficiency, unstable machining precision and unstable quality of the machined surface.

Disclosure of Invention

The technical problem to be solved by the present invention is to overcome the above problems in the prior art.

In order to solve the above technical problems, in one aspect, the present invention provides a processing apparatus for a wafer level array optical element and a die, including:

a machine tool base;

The workpiece fixing module comprises a moving assembly connected to the machine tool base and a workpiece spindle connected to the moving assembly; the axis of the workpiece spindle is parallel to the Z axis; the moving assembly and the workpiece spindle are respectively configured to drive the workpiece to move along the X axis and the Y axis and rotate along the axis of the workpiece spindle so as to switch different units of the workpiece array of the workpiece; the X axis, the Y axis and the Z axis form a three-dimensional coordinate system;

The tool fixing module comprises a movable rotating assembly connected to the machine tool base, a tool spindle connected with the movable rotating assembly, a sliding assembly connected to the end part of the tool spindle and a machining tool; the processing cutter is connected with the sliding component; the movable rotating assembly is configured to drive the processing tool to rotate in the horizontal plane of the B axis and move along the Z axis; the tool spindle and the slide assembly are configured to drive the machining tool to rotate along an axis of the tool spindle and to move radially along a plane in which the rotation lies, respectively, for effecting a variable diameter rotational movement of the machining tool.

In one embodiment of the invention, the tool holding module further comprises a turntable coaxially connected to the tool spindle, the machining tool being connected to the turntable by a sliding assembly.

In one embodiment of the invention, the sliding assembly comprises a driving part, a sliding block and a guide rail; the driving part and the guide rail are connected to the end part of the cutter spindle; the output end of the driving part is connected with a sliding block, and the sliding block is in sliding connection with the guide rail; the processing cutter is connected to the sliding block; the driving portion is configured to drive the slider and the machining tool to slide.

In one embodiment of the invention, the tool holding module further comprises a centrifugal force balancing mechanism connected to the turntable; and the centrifugal force balancing mechanism and the sliding component are respectively positioned at two sides of the axis of the cutter spindle along the radial direction of the turntable, and the centrifugal force balancing mechanism is used for counteracting the centrifugal force generated by eccentric rotation of the sliding component and the processing cutter.

In one embodiment of the invention, the tool fixing module further comprises a dynamic balancing mechanism connected to the turntable; on the turntable, the dynamic balancing mechanism is synchronous with the sliding block and moves in the opposite direction.

In one embodiment of the invention, the cutter fixing module further comprises a grating ruler, wherein a ruler body of the grating ruler is connected to one side of the sliding block, and a reading head of the grating ruler is connected to the turntable.

In one embodiment of the invention, the sliding assembly further comprises a slip ring coupled to the turntable.

In one embodiment of the invention, the mobile swivel assembly comprises a B-axis turntable and a Z-axis mover that slides along a Z-axis; the B-axis rotary table is connected to the Z-axis moving part, and the Z-axis moving part is connected to the machine tool base through a guide rail.

In one embodiment of the invention, the workpiece fixture module further comprises a connection assembly connected to an end of the workpiece spindle, the connection assembly being configured to connect the workpiece to an end face of the workpiece spindle.

In one embodiment of the invention, the moving assembly comprises an X-axis moving member and a Y-axis moving member, wherein the X-axis moving member is connected to the machine tool base through a guide rail, and the Y-axis moving member is vertically connected to the table top of the X-axis moving member through the guide rail.

In another aspect, the present invention provides a processing method for a wafer level array optical element and a die, where the processing apparatus for a wafer level array optical element and a die in any one of the above embodiments is used for processing, the steps include:

installing a workpiece to be processed on a vacuum chuck at the end part of a workpiece spindle, and adjusting the workpiece spindle to be aligned with the cutter spindle preliminarily through a moving assembly;

mounting a machining tool on the slide assembly;

Adjusting the moving rotary assembly, correcting an initial relative included angle between the processing cutter and a processing plane of the processed workpiece, and moving the processing cutter to the processing plane of the processed workpiece;

the rotation center of the processed workpiece is adjusted to coincide with the rotation center of the cutter main shaft through a moving assembly;

The processed workpiece rotates along with the workpiece spindle and is driven by the X-axis moving part to do feeding motion, and the processing cutter is driven by the moving rotating component to do depth cutting motion along the Z-axis, so that the turning of the surface plane of the wafer is completed;

The moving assembly moves the center of the first array unit of the processed workpiece to a position coinciding with the rotation center of the cutter spindle;

Setting the rotating speed of a cutter main shaft and the feeding speed of a sliding component;

The tool spindle, the sliding assembly and the Z-axis moving member work to complete the processing of a single optical unit on the wafer.

Compared with the prior art, the technical scheme of the invention has the following advantages:

The processing equipment and the processing method for the wafer-level array optical element and the die can be used for processing a processed workpiece through the high-speed rotation of the processing cutter, so that the processing efficiency of the wafer-level array optical element and the die can be improved, and the manufacturing cost can be reduced; the rotation movement of the processed workpiece and the linkage of X, Y shafts are avoided in the processing process, so that inertial impact is avoided, the processing precision is ensured, and the stability of the quality of the processed surface is improved; in addition, the equipment and the method can be also used for high-efficiency and low-cost ultra-precise machining of curved surface array optical elements and molds.

Drawings

In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which

FIG. 1 is a three-dimensional schematic view of a processing apparatus for wafer level array optical elements and molds in accordance with a preferred embodiment of the invention;

FIG. 2 is a front view of FIG. 1;

FIG. 3 is a schematic view of the tool holding module of FIG. 1;

FIG. 4 is a schematic view of a wafer level array optical element and a die of the workpiece of FIG. 1;

FIG. 5 is a schematic view of the turning of the wafer level array optical element and the die of the workpiece of FIG. 1;

FIG. 6 is a schematic view of a wafer level array optical element and a die single optical unit of the workpiece of FIG. 1;

FIG. 7 is a schematic diagram showing the switching positioning of the wafer level array optical element and the die array unit of the workpiece shown in FIG. 1;

FIG. 8 is a schematic view of a curved array optical element and a mold of the workpiece shown in FIG. 1;

FIG. 9 is a schematic diagram of turning the curved surface of the curved surface array optical element and the mold of the workpiece shown in FIG. 1;

FIG. 10 is a schematic view of a first unit processing of a curved array optical element and a mold of the workpiece of FIG. 1;

FIG. 11 is a schematic view of a second unit processing of the curved array optical element and the mold of the workpiece of FIG. 1;

fig. 12 is a schematic diagram showing switching and positioning of array units of the curved array type optical element and the mold of the workpiece shown in fig. 1.

Description of the specification reference numerals: 100. a machine tool base;

200. a workpiece fixing module; 210. a workpiece spindle; 220. a connection assembly; 230. an X-axis moving member; 240. a Y-axis moving member;

300. A cutter fixing module; 310. a cutter spindle; 320. a sliding assembly; 321. a driving section; 322. a slide block; 323. a guide rail; 324. a guide rail fixing seat; 325. a slip ring; 330. machining a cutter; 340. a turntable; 350. moving the rotating assembly; 351. a B-axis rotary table; 352. a Z-axis moving member; 360. a cutter fine adjustment unit; 370. a centrifugal force balancing mechanism; 380. a dynamic balancing mechanism; 390. a grating ruler;

400. and (3) a workpiece.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.

In some comparative examples, it is common to employ fly-cutting, slow-cutting servo, fast-cutting servo, etc. processes based on single point diamond lathes to meet the processing requirements of various optical elements. The fly cutter cutting is to fix a single-point diamond cutter on a main shaft (C axis) of a machine tool, and the cutter rotates along with the main shaft and simultaneously makes linear motion (X & Y axes) along a feeding direction. The workpiece is mounted on a table (Z axis), and a Z axis linear feed motion is performed along with the table in the main axis direction. When one tool path is completed, the fly cutter moves along the cutting interval direction along with the spindle for a certain distance to process the other tool path. The fly cutter cutting process is discontinuous, has low efficiency, and has unstable processing quality due to frequent impact of the cutter and the workpiece. Meanwhile, the array unit cannot be directly processed.

The slow cutter servo adopts linkage control to realize the synchronous linear motion axis (X & Y & Z) of the machine tool and the rotation of the main shaft, and the free-form surface machining motion track is realized by interpolation. The motion speed of each shaft is relatively slow in the multi-shaft linkage interpolation mode, and the rotation speed of the main shaft is required to be synchronous with the linear shaft, so that the rotation speed of the main shaft is relatively low, generally in the range of tens of rpm, and when an array optical element is processed, the cutting speed is far lower than a reasonable range due to the small caliber, so that the processing efficiency is low. Meanwhile, the X, Y, Z three shafts are loaded to a certain degree, and large inertial impact is easy to generate, so that the whole system generates additional vibration, and the machining precision is finally affected. The dynamic characteristics of the slow knife servo are poor, the efficiency is low and the precision cannot be ensured in mass production and processing.

The fast cutter servo means that in the turning process, a cutter is driven by a fast cutter servo micro-feeding mechanism arranged on a Z axis to perform high-frequency response and small-amplitude axial fast feeding motion, and the fast cutter servo is matched with a high-precision spindle and radial feeding to finish the turning process. Compared with the feeding frequency of a Z axis of tens of hertz, the feeding frequency of the fast-cutter servo micro-feeding mechanism can reach a few kilohertz or higher, thereby greatly improving the processing efficiency. The piezoelectric ceramic stroke of the fast knife servo is generally only a few micrometers to hundreds of micrometers, and is mainly used for processing the microstructure optical unit, and is not suitable for efficiently processing the wafer-level array type curved surface unit.

From this, it can be seen that the comparative example has the following problems: low efficiency, high cost, unstable quality of the processed surface, etc. In addition, when the traditional method is used for processing large-size wafer-level and array optical elements and dies, the main shaft drives the workpiece to rotate and is matched with X, Y linkage, the movement process is clumsy and inertial impact is easy to generate, so that the machine tool generates additional deformation or vibration, and finally the processing precision is reduced.

Referring to fig. 1 to 3, in order to solve the above problems, an embodiment of the present invention provides a processing apparatus for a wafer level array optical element and a die, including:

A machine tool base 100 horizontally arranged;

A workpiece fixing module 200 including a moving assembly coupled to the machine tool base 100 and a workpiece spindle 210 coupled to the moving assembly; the axis of the workpiece spindle 210 is parallel to the Z axis; the workpiece 400 is attached to the end of the workpiece spindle 210; workpiece spindle 210 rotates about a C-axis, which is parallel to the Z-axis. The moving assembly and the workpiece spindle 210 are configured to drive the workpiece 400 to move along the X-axis and the Y-axis and to rotate along the axis of the workpiece spindle 210, respectively, for switching different units of the workpiece array of the workpiece 400; the X axis and the Y axis and the Z axis form a three-dimensional rectangular coordinate system;

A tool fixing module 300 including a moving rotary assembly 350 coupled to the machine tool base 100, a tool spindle 310 coupled to the moving rotary assembly 350, and a sliding assembly 320 and a machining tool 330 coupled to an end of the tool spindle 310; the tool spindle 310 rotates about an a-axis, which is parallel to the Z-axis. The slide assembly 320 moves along a U-axis, which is radial to the tool spindle 310. The machining tool 330 is connected with the sliding assembly 320; the moving rotary assembly 350 is configured to rotate the machining tool 330 in the B-axis horizontal plane and move along the Z-axis; the tool spindle 310 and the slide assembly 320 are configured to drive the machining tool 330 to rotate along the axis of the tool spindle 310 and to move radially along the plane of rotation, respectively, for effecting variable diameter rotational movement of the machining tool 330.

Specifically, in the present embodiment, the workpiece 400 is processed by the high-speed rotation of the processing tool 330, so that the processing efficiency of the wafer-level and array optical elements and the die can be improved, and the manufacturing cost can be reduced; the rotation movement of the workpiece 400 and the linkage of X, Y shafts are avoided in the processing process, so that inertial impact is avoided, the processing precision is ensured, and the stability of the quality of the processed surface is improved. In addition, the equipment and the method can be also used for high-efficiency and low-cost ultra-precise machining of curved surface array optical elements and molds.

The application has wider applicability, and can realize the conventional single-point diamond cutting processing when the processing cutter 330 is fixed, and the processing of wafer level or array type surface type can be realized more efficiently when the processing is rotated.

Further, the tool-holding module 300 further includes a turntable 340, the turntable 340 being coaxially coupled to the tool spindle 310, and the machining tool 330 being coupled to the turntable 340 by the sliding assembly 320. In some embodiments, the turntable 340 is coaxially coupled to the tool spindle 310 via a coupling flange. The slider assembly 320 includes a driving portion 321, a slider 322, and a guide rail 323; the driving unit 321 and the guide rail 323 are connected to the turntable 340 at the end of the tool spindle 310; the guide rail 323 is connected to the turntable 340 through the guide rail fixing seat 324; the output end of the driving part 321 is connected with a sliding block 322, and the sliding block 322 is in sliding connection with a guide rail 323; the processing tool 330 is connected to the slider 322 through a tool fine adjustment unit 360; the driving portion 321 is configured to drive the slider 322 and the machining tool 330 to slide in a radial direction of the turntable 340, that is, to move radially while the machining tool 330 rotates, so that the machining tool 330 performs a rotational movement while changing a rotational diameter thereof. In some embodiments, the driving part 321 may be a piezoelectric ceramic motor or a linear motor with good motion performance. The guide rail 323 is an ultra-high precision cross roller guide rail.

In some embodiments, the tool spindle 310 may be a high precision, high stiffness, high load air bearing spindle that may be equipped with a high resolution optical angle encoder with high precision angular positioning capabilities, rotational speed 0-10000rpm, radial load >1800N, axial load >2200N, motion error <12nm. The tool spindle 310 can achieve high precision angular positioning with a rotational angle error of less than 5 ".

Since the slider 322 drives the machining tool 330 to linearly move away from the rotation center of the tool spindle 310, a large centrifugal force is generated by the slider 322, the tool fine adjustment unit 360 and the machining tool 330 under high-speed rotation, and if the generated centrifugal force is overcome by the driving motor, the whole mechanism is relatively huge due to the matching of the motor with high output power on the premise of ensuring high positioning accuracy and high motion characteristics. The tool holding module 300 of the present embodiment further includes a centrifugal force balancing mechanism 370 connected to the turntable 340; the centrifugal force balance mechanism 370 and the sliding assembly 320 are located at two sides of the axis of the tool spindle 310 along the radial direction of the turntable 340, respectively, and the centrifugal force balance mechanism 370 is used for counteracting the centrifugal force generated by the eccentric rotation of the sliding assembly 320 and the processing tool 330. Because centrifugal force is linear with distance of movement, in some embodiments, centrifugal force balancing mechanism 370 comprises a high quality rectangular helical compression spring, mechanical spring, electromagnetic spring or gas spring to counteract centrifugal force generated by eccentric rotation, reducing force requirements on the drive motor, thereby achieving a compact and lightweight device; meanwhile, the requirements of high-speed rotary cutting can be met.

Further, the tool fixing module 300 further includes a dynamic balancing mechanism 380, and the dynamic balancing mechanism 380 is connected to the turntable 340; on the turntable 340, the dynamic balancing mechanism 380 is synchronized with the slider 322 and moves in the opposite direction. This ensures that the center of gravity of the entire tool securing module 300 is on the axis of the tool spindle 310, so that the dynamic balance of the tool spindle 310 is not affected during high-speed rotation. The dynamic balance influence on the rotary motion of the tool spindle 310 caused by the motion of the processing tool 330 can be avoided, and the selected high-precision air-bearing spindle can exert the original precision level, thereby ensuring the processing precision.

Further, the tool fixing module 300 further includes a grating ruler 390, the ruler body of the grating ruler 390 is connected to one side of the slider 322, and the reading head of the grating ruler 390 is connected to the turntable 340. In some embodiments, grating scale 390 is an ultra-precise picometer scale grating scale, and the ultra-high precision motion of picometer scale minimum resolution, measured nanometer scale step distance is achieved by the drive of a closed-loop controlled piezoceramic motor (drive 321).

Further, the slider assembly 320 also includes a slip ring 325, the slip ring 325 being coupled to the turntable 340. The electrical parts of the driving part 321 and other parts are in communication connection with the machine tool control system through the slip ring 325, and the slip ring 325 is used for supplying power and transmitting signals to the driving part 321 and the high-precision grating ruler 390, so that the wiring and control problems of the electrical elements in the tool fixing module 300 can be solved. In some embodiments, the slip ring 325 may be a multi-channel conductive slip ring, which provides power input to the driving portion 321 and the grating ruler 390 on the turntable 340 and signal transmission between the grating ruler 390 and the control system, so as to meet the requirement of stable high-speed signal transmission of the grating ruler 390 when the tool spindle 310 rotates at a speed above 3000 rpm.

Further, the moving rotation assembly 350 includes a B-axis turntable 351 and a Z-axis mover 352 sliding along the Z-axis; the B-axis turntable 351 rotates around the B-axis, which is parallel to the Y-axis. The B-axis turntable 351 is connected to a Z-axis mover 352, and the Z-axis mover 352 is connected to the machine tool base 100 via a guide rail. In some embodiments, the Z-axis mover 352 is a linear slide module. The B-axis turntable 351 rotates in the B-axis horizontal plane, so that the initial relative angle between the machining tool 330 and the machining plane of the workpiece 400 can be adjusted. The Z-axis moving member 352 drives the processing tool 330 to feed the workpiece in the depth direction of the curved surface.

Further, the workpiece fixture module 200 further includes a connection assembly 220, the connection assembly 220 being connected to an end of the workpiece spindle 210, the connection assembly 220 being configured to connect the workpiece 400 to an end face of the workpiece spindle 210. In some embodiments, the workpiece spindle 210 is a vacuum chuck, which facilitates quick attachment and detachment of the workpiece 400 to and from the workpiece spindle 210, and additionally provides for secure attachment of the workpiece 400 to the workpiece spindle 210 during processing.

Further, the moving assembly includes an X-axis moving member 230 and a Y-axis moving member 240, the X-axis moving member 230 is connected to the machine tool base 100 through a guide rail, and the Y-axis moving member 240 is vertically connected to the table top of the X-axis moving member 230 through a guide rail. In some embodiments, the X-axis moving member 230 and the Y-axis moving member 240 are linear sliding modules. The X-axis mover 230 and the Y-axis mover 240 enable the workpiece spindle 210 to coincide with the axis of the tool spindle.

The application realizes high-speed and high-quality processing of a single optical unit by controlling the rotation of the cutter spindle 310, the rotation of the B-axis rotary table 351, the movement of the sliding component 320 and the movement of the Z-axis moving part 352 in a linkage manner. By controlling the movement of the X-axis moving part 230, the movement of the Y-axis moving part 240 and the rotation of the workpiece spindle 210, the rapid positioning switching and processing of different units of the workpiece array are realized, and finally the efficient and accurate processing of the wafer-level array optical element and the die is realized.

The invention can greatly improve the processing efficiency when processing the wafer-level array optical element and the die, ensure higher processing quality and consistency, and simultaneously meet the application of the conventional turning process based on the single-point diamond lathe.

In the application, on the aspect of having the function of the conventional turning process application based on the single-point diamond lathe, the continuous and stable change of the rotation diameter of the processing cutter 330 can be realized by driving and controlling the high-precision sliding component 320, and the high-efficiency processing of the wafer-level array optical unit and the die can be realized by matching the cutter spindle 310 rotating at a high speed, the high-precision indexing positioning B-axis rotary table 351 and the Z-axis moving part 352, meanwhile, the processing quality of the single optical unit and the consistency of the array unit are effectively ensured, and the application has wide application prospect.

The processing method for processing the workpiece 400 by using the processing apparatus is as follows:

S1: as shown in fig. 1 and 4; mounting the workpiece 400 on the vacuum chuck at the end of the workpiece spindle 210, and repeatedly adjusting and measuring by the moving assembly until the workpiece spindle 210 is preliminarily aligned with the tool spindle 310, i.e. the axis of the workpiece spindle 210 coincides with the axis of the tool spindle 310;

S2: selecting a proper single-point diamond machining tool 330 according to a machining drawing, mounting the machining tool 330 on a tool fine-tuning unit 360 on the sliding assembly 320, and enabling the initial position of the center of the tool tip of the machining tool 330 to coincide with the rotation center of the tool spindle 310 by adjusting the tool fine-tuning unit 360;

s3: adjusting the moving rotary assembly 350, namely correcting the initial relative included angle between the processing tool 330 and the processing plane of the workpiece 400 in the XZ plane through the B-axis rotary table 351; and moving the machining tool 330 to the machining plane of the workpiece 400 by the Z-axis mover 352;

s4: adjusting by a moving means to a position where the rotation center of the workpiece 400 coincides with the rotation center of the tool spindle 310;

S5: selecting proper rotation speed of the workpiece spindle 210 and feeding speed of the moving assembly on the X axis according to parameters such as the material of the workpiece 400, the caliber of a wafer, a single-point diamond cutter and the like; according to the plane shape requirement of the design drawing of the workpiece 400, controlling the moving assembly to move in the X axis, the moving rotating assembly 350 to move in the Z axis and the workpiece spindle 210 to rotate, and locking the moving assembly to move in the Y axis, the tool spindle 310 to rotate, the rotating assembly 350 to rotate and the sliding assembly 320 to slide; the workpiece 400 rotates along with the workpiece spindle 210 and performs feeding motion under the driving of the X-axis moving member 230, and the processing tool 330 performs depth cutting motion in the Z-axis under the driving of the moving rotating assembly 350, so as to finish turning of the wafer surface plane, as shown in fig. 5; s6: the movement assembly moves the center of the first array unit of the workpiece 400 to a position coinciding with the rotation center of the tool spindle 310;

S7: setting a proper rotation speed of the tool spindle 310 and a proper feeding speed of the sliding component 320 according to parameters such as a material of the workpiece 400, an aperture of an optical unit, a single-point diamond tool and the like;

S8: programming a linkage program of the cutter main shaft 310, the sliding component 320 and the Z-axis moving piece 352 according to design parameters of the optical units, and detecting positioning data and compensation in real time by driving three-axis linkage to finish the processing of a single optical unit on a wafer; the workpiece 400 is fixed, the machining tool 330 rotates along with the tool spindle 310 at a high speed, which can reach more than 3000rpm, and the synchronous sliding component 320 moves at a high precision with a high response variable diameter, so that the high-efficiency and high-precision machining of the optical unit is realized, as shown in fig. 6;

S9: detecting the surface shape precision and the surface roughness of the processed surface by using an optical detection instrument, comparing an actual measurement value with a theoretical value, compensating the equipment program according to the deviation, and correcting and processing the processed workpiece 400 again by the compensation program to finally reach the surface shape precision and the surface roughness required by design;

S10: as shown in fig. 7, the position of the workpiece 400 relative to the processing tool 330 is changed by the movement of the moving means, the rapid positioning switching between the array units is realized according to the path shown in the figure, and the processing procedures S7 to S9 are circulated, thereby realizing the efficient and high-precision processing of the wafer-level array optical element and the die.

The processing method for processing another workpiece 400 by using the present processing apparatus is as follows:

S11: as shown in fig. 1 and 8; mounting the workpiece 400 on the vacuum chuck at the end of the workpiece spindle 210, and repeatedly adjusting and measuring by the moving assembly until the workpiece spindle 210 is preliminarily aligned with the tool spindle 310, i.e. the axis of the workpiece spindle 210 coincides with the axis of the tool spindle 310;

S12: selecting a proper single-point diamond machining tool 330 according to a machining drawing, mounting the machining tool 330 on a tool fine-tuning unit 360 on the sliding assembly 320, and enabling the initial position of the center of the tool tip of the machining tool 330 to coincide with the rotation center of the tool spindle 310 by adjusting the tool fine-tuning unit 360;

S13: adjusting the moving rotary assembly 350, namely correcting the initial relative included angle between the processing tool 330 and the processing plane of the workpiece 400 through the B-axis rotary table 351; and moving the machining tool 330 to the machining curved surface of the workpiece 400 by the Z-axis moving member 352;

S14: adjusting by a moving means to a position where the rotation center of the workpiece 400 coincides with the rotation center of the tool spindle 310;

S15: selecting proper rotation speed of the workpiece spindle 210 and feeding speed of the moving assembly on the X axis according to parameters such as the material, caliber and single-point diamond cutter of the workpiece 400; according to the curved surface shape requirement of the design drawing of the workpiece 400, controlling the moving assembly to move in the X axis, the moving rotating assembly 350 to move in the Z axis and the workpiece spindle 210 to rotate, and locking the moving assembly to move in the Y axis, the tool spindle 310 to rotate, the rotating assembly 350 to rotate and the sliding assembly 320 to slide; the workpiece 400 rotates along with the workpiece spindle 210 and performs feeding motion under the drive of the X-axis moving member 230, and the machining tool 330 performs depth cutting motion in the Z-axis under the drive of the moving rotating assembly 350, so as to complete the integral turning of the curved surface of the workpiece, as shown in fig. 9;

S16: the movement assembly moves the center of the first array unit of the workpiece 400 to a position coinciding with the rotation center of the tool spindle 310;

S17: setting a proper rotation speed of the tool spindle 310 and a proper feeding speed of the sliding component 320 according to parameters such as a material of the workpiece 400, an aperture of an optical unit, a single-point diamond tool and the like;

S18: programming linkage programs of the cutter main shaft 310, the sliding component 320 and the Z-axis moving piece 352 according to design parameters of the optical units, and detecting positioning data and compensating in real time by driving three-axis linkage to finish machining of a single optical unit on a curved surface; the workpiece 400 is fixed, the machining tool 330 rotates along with the tool spindle 310 at a high speed, which can reach more than 3000rpm, and the synchronous sliding component 320 moves at a high precision with a high response variable diameter, so that the high-efficiency and high-precision machining of the optical unit is realized, as shown in fig. 10;

s19: detecting the surface shape precision and the surface roughness of the processed surface by using an optical detection instrument, comparing an actual measurement value with a theoretical value, compensating the equipment program according to the deviation, and correcting and processing the processed workpiece 400 again by the compensation program to finally reach the surface shape precision and the surface roughness required by design;

S20: as shown in fig. 11, the machining tool 330 is made parallel to the rotation axis of the second array unit of the workpiece 400 by moving the rotation assembly 350, that is, by the rotation of the B-axis rotary table 351; changing the position of the workpiece 400 relative to the machining tool 330 by the movement of the moving assembly X-axis so that the rotation axis of the second array unit coincides with the axis of the turntable 340 of the machining tool 330;

And S21, by writing a four-axis linkage program to drive the cutter spindle 310, the sliding component 320, the Z-axis moving part 352 and the X-axis moving part 230, positioning data and compensation are detected in real time, and high-efficiency and high-precision machining of the second array unit on the curved surface is completed.

S22, detecting the surface shape precision and the surface roughness of the processed surface by using an optical detection instrument, comparing the measured value with the theoretical value, compensating the equipment program according to the deviation, and correcting and processing the processed workpiece 400 again by using the compensation program, so as to finally reach the surface shape precision and the surface roughness required by design;

S23: as shown in fig. 12, the third to ninth array units are sequentially rotated to the same Y-value bit as the second array unit by rotation of the workpiece spindle 210 (C-axis); by moving the moving assembly X-axis, the position of the workpiece 400 relative to the processing tool 330 is changed, the rapid positioning switching between the array units is realized according to the path shown in the figure, and the processing procedures S21 to S22 are circulated, thereby realizing the efficient and high-precision processing of the curved surface array type optical element and the die shown in fig. 8.

The method can be used for ultra-precise machining of the plane array optical element and the die, and can also be used for ultra-precise machining of the curved surface array optical element and the die. The ultra-precise machining method for the curved surface array type optical element and the die comprises the following steps:

Mounting the workpiece 400 on a vacuum chuck at the end of the workpiece spindle 210, and adjusting the workpiece spindle 210 to be preliminarily aligned with the tool spindle 310 by a moving assembly;

mounting a machining tool 330 on the slide assembly 320;

adjusting the moving rotary assembly 350, correcting the initial relative included angle between the machining tool 330 and the machining plane of the workpiece 400, and moving the machining tool 330 to the machining curved surface of the workpiece 400;

Adjusting by a moving means to a position where the rotation center of the workpiece 400 coincides with the rotation center of the tool spindle 310;

The workpiece 400 rotates along with the workpiece spindle 210 and performs feeding motion under the drive of the X-axis moving part 230, and the processing tool 330 performs depth cutting motion on the Z-axis under the drive of the moving rotating assembly 350, so that turning of the whole curved surface of the workpiece is completed;

The movement assembly moves the center of the first array unit of the workpiece 400 to a position coinciding with the rotation center of the tool spindle 310;

setting the rotation speed of the tool spindle 310 and the feeding speed of the sliding assembly 320;

The tool spindle 310, X-axis mover 230, slide assembly 320, and Z-axis mover 352 work to complete the machining of a single optical unit on the curved surface of the workpiece.

It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.

Claims (10)

1. A tooling for wafer level array optical elements and molds, comprising:

a machine tool base;

The workpiece fixing module comprises a moving assembly connected to the machine tool base and a workpiece spindle connected to the moving assembly; the axis of the workpiece spindle is parallel to the Z axis; the moving assembly and the workpiece spindle are respectively configured to drive a workpiece to move along an X axis and a Y axis and rotate along the axis of the workpiece spindle so as to switch different units of a workpiece array of the workpiece; the X axis, the Y axis and the Z axis form a three-dimensional coordinate system;

The tool fixing module comprises a movable rotating assembly connected to the machine tool base, a tool spindle connected with the movable rotating assembly, a sliding assembly connected to the end part of the tool spindle and a machining tool; the processing cutter is connected with the sliding component; the moving and rotating assembly is configured to drive the machining tool to rotate in a horizontal plane of a B axis and move along the Z axis; the tool spindle and the slide assembly are configured to drive the machining tool to rotate along an axis of the tool spindle and to move radially along a plane of rotation, respectively, for effecting variable diameter rotational movement of the machining tool.

2. The processing apparatus for wafer level array optical elements and dies of claim 1, wherein: the tool fixing module further comprises a rotary table, the rotary table is coaxially connected with the tool spindle, and the machining tool is connected to the rotary table through the sliding assembly.

3. The processing apparatus for wafer level array optical elements and dies of claim 2, wherein: the sliding component comprises a driving part, a sliding block and a guide rail; the driving part and the guide rail are connected to the end part of the cutter spindle; the output end of the driving part is connected with the sliding block, and the sliding block is in sliding connection with the guide rail; the processing cutter is connected to the sliding block; the driving portion is configured to drive the slider and the machining tool to slide.

4. A processing apparatus for wafer level array optical elements and dies as claimed in claim 3, wherein: the cutter fixing module further comprises a centrifugal force balancing mechanism connected to the turntable; along the radial direction of the turntable, the centrifugal force balancing mechanism and the sliding component are respectively positioned at two sides of the axis of the cutter spindle, and the centrifugal force balancing mechanism is used for counteracting the centrifugal force generated by eccentric rotation of the sliding component and the processing cutter.

5. A processing apparatus for wafer level array optical elements and dies as claimed in claim 3, wherein: the cutter fixing module further comprises a dynamic balancing mechanism, and the dynamic balancing mechanism is connected to the turntable; on the turntable, the dynamic balancing mechanism is synchronous with the sliding block and moves in the opposite direction.

6. A processing apparatus for wafer level array optical elements and dies as claimed in claim 3, wherein: the cutter fixing module further comprises a grating ruler, a ruler body of the grating ruler is connected to one side of the sliding block, and a reading head of the grating ruler is connected to the rotary disc.

7. A processing apparatus for wafer level array optical elements and dies as claimed in claim 3, wherein: the sliding assembly further comprises a slip ring, and the slip ring is connected to the turntable.

8. The processing apparatus for wafer level array optical elements and dies of claim 1, wherein: the moving and rotating assembly comprises a B-axis rotary table and a Z-axis moving piece sliding along the Z axis; the B-axis rotary table is connected to the Z-axis moving part, and the Z-axis moving part is connected to the machine tool base.

9. The processing apparatus for wafer level array optical elements and dies of claim 1, wherein: the moving assembly comprises an X-axis moving part and a Y-axis moving part, wherein the X-axis moving part is connected to the machine tool base, and the Y-axis moving part is vertically connected to the table top of the X-axis moving part.

10. A processing method for a wafer-level array optical element and a die is characterized in that: processing with the processing equipment for wafer-level array optical elements and dies as claimed in any one of claims 1 to 9, comprising the steps of:

installing a workpiece to be processed on a vacuum chuck at the end part of a workpiece spindle, and adjusting the workpiece spindle to be aligned with the cutter spindle preliminarily through a moving assembly;

mounting a machining tool on the slide assembly;

Adjusting the moving rotary assembly, correcting an initial relative included angle between the processing cutter and a processing plane of the processed workpiece, and moving the processing cutter to the processing plane of the processed workpiece;

the rotation center of the processed workpiece is adjusted to coincide with the rotation center of the cutter main shaft through a moving assembly;

The processed workpiece rotates along with the workpiece spindle and is driven by the X-axis moving part to do feeding motion, and the processing cutter is driven by the moving rotating component to do depth cutting motion along the Z-axis, so that the turning of the surface plane of the wafer is completed;

The moving assembly moves the center of the first array unit of the processed workpiece to a position coinciding with the rotation center of the cutter spindle;

Setting the rotating speed of a cutter main shaft and the feeding speed of a sliding component;

The tool spindle, the sliding assembly and the Z-axis moving member work to complete the processing of a single optical unit on the wafer.