CN118301918A

CN118301918A - Electronic equipment

Info

Publication number: CN118301918A
Application number: CN202410545826.XA
Authority: CN
Inventors: 陈体军; 田付有; 高仙仙; 张秀
Original assignee: Spreadtrum Communications Shanghai Co Ltd
Current assignee: Spreadtrum Communications Shanghai Co Ltd
Filing date: 2024-04-30
Publication date: 2024-07-05

Abstract

An electronic device including a first plate portion and a second plate portion, the first plate portion and the second plate portion being hinged, the second plate portion being rotatable about a hinge axis relative to the first plate portion to switch the electronic device between an extended state and a collapsed state, further comprising: a first member provided in the first plate portion; a second member provided on the second plate portion; the first air duct is arranged on the first plate part and directly or indirectly passes through the first component; the second air duct is arranged on the second plate part and directly or indirectly passes through the second component; the fan part is arranged in the first air duct and used for driving the air in the first air duct to flow; the electronic equipment is in an unfolding state, and the first air duct is communicated with the second air duct; the electronic equipment is in a folded state, and the first air duct and the second air duct are independent. By adopting the technical scheme of the application, the efficient collaborative heat dissipation of the two plate parts of the foldable electronic equipment can be realized.

Description

Electronic equipment

Technical Field

The invention relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

With the rapid development of technology, intelligent electronic devices are continuously advancing toward miniaturization, large screen and high performance. In this context, foldable electronic devices are increasingly favored by the market for their unique advantages. The device not only meets the pursuit of the user on the large-screen visual experience, but also gives attention to portability, and the user can easily carry the device for traveling while enjoying convenience brought by science and technology.

However, with the continuous improvement of the performance and the pursuit of light and thin electronic products, the heat dissipation problem of the foldable electronic device is more and more remarkable. Due to the increase of power consumption of chips inside the device and the increasing abundance of product functions, the problem of heat dissipation has become a key factor for restricting the further development of the folding electronic device. On the chip layout, the traditional way of arranging the main heat generating components on one side of the foldable electronic device has gradually failed to meet the increasing performance requirements and the high standards of good heat experience for users. Along with the improvement of equipment performance, the heat generated by the heating component is correspondingly increased, but the traditional heat dissipation mode is difficult to effectively cope with, so that the equipment is easy to overheat in the operation process, and the user experience is affected.

To address this challenge, disposing heat generating components on both sides of a foldable electronic device appears to be a viable solution. However, this solution also presents new challenges. How to realize the efficient collaborative heat dissipation of two sides, ensure that the equipment can maintain good heat dissipation effect while running at high performance, and become a difficult problem before the foldable electronic equipment designer. Therefore, a solution capable of achieving efficient cooperative heat dissipation of two board portions of an electronic device is needed.

Disclosure of Invention

The invention solves the technical problem of providing a solution capable of realizing efficient collaborative heat dissipation of two plate parts of foldable electronic equipment.

To solve the above-mentioned technical problem, an embodiment of the present invention provides an electronic device, including a first board portion and a second board portion, where the first board portion and the second board portion are hinged, and the second board portion can rotate around a hinge axis relative to the first board portion to switch the electronic device between an unfolded state and a folded state, and further includes: a first member provided on the first plate portion; a second member provided on the second plate portion; the first air duct is arranged on the first plate part and directly or indirectly passes through the first component; the second air duct is arranged on the second plate part and directly or indirectly passes through the second component; the fan part is arranged in the first air duct and used for driving the air in the first air duct to flow; the electronic equipment is in the unfolded state, and the first air duct and the second air duct are communicated; and the electronic equipment in the folded state is characterized in that the first air duct and the second air duct are independent.

Optionally, the air conditioner further comprises a radiator, and the radiator is arranged in the first air duct and/or the second air duct.

Optionally, the heat sink includes a plurality of heat dissipation fins arranged at intervals along a direction perpendicular to the gas flow direction.

Optionally, an opening and closing mechanism is disposed in the second air duct, and is used for conducting or blocking the second air duct, wherein the conducting degree of the second air duct is determined according to the included angle between the first plate portion and the second plate portion.

Optionally, in response to detecting that the included angle between the first plate portion and the second plate portion is greater than a first preset opening and closing angle, the opening and closing mechanism turns on at least a portion of the second air duct.

Optionally, as the included angle between the first plate portion and the second plate portion increases, the conduction degree of the second air duct gradually increases under the action of the opening and closing mechanism.

Optionally, the electronic device further includes: the detection module is used for detecting an included angle between the first plate part and the second plate part; the control module is communicated with the detection module, and controls the opening and closing mechanism to operate according to the detected included angle so as to conduct or block the second air duct.

Optionally, the electronic device further includes: and the linkage part is linked with the hinge between the first plate part and the second plate part through the linkage part so as to conduct or block the second air duct along with the rotation of the hinge.

Optionally, the second plate portion is provided with a containing groove opened towards at least one side, the opening and closing mechanism comprises a driving portion and a baffle portion, the driving portion is used for driving the baffle portion to move relative to the containing groove so as to move between a first position and a second position, and the baffle portion located at the first position conducts the second air duct and closes the opening of the containing groove; the baffle portion in the second position at least partially leaves the receiving groove and blocks the second air duct.

Optionally, the baffle portion includes: a first wall extending in a direction perpendicular to a gas flow direction, the first wall being extendable or retractable from the accommodation groove toward the second air passage to block or communicate the second air passage; and a second wall, which has a non-zero included angle with the first wall, is movable in the accommodating groove, and is connected with the driving part.

Optionally, the first air channel includes first air intake and first air outlet, the second air channel includes second air intake and second air outlet, to the electronic equipment under the expansion state, first air outlet butt joint the second air intake.

Optionally, the electronic device has a first side and a second side opposite, wherein a grip area of the electronic device for gripping is closer to the second side than the first side, and the first air duct and the second air duct are closer to the first side than the second side.

Optionally, the first air inlet, the first air outlet, the second air inlet, and the second air outlet are closer to the first side than the second side.

Optionally, the first air inlet is formed in a wall, close to the first side, of the first plate portion.

Optionally, the first air inlet is formed in a wall of the first plate portion facing away from the second plate portion.

Optionally, the first air outlet is disposed on a wall of the first plate portion, which is close to the second plate portion.

Optionally, the second air inlet is formed in a wall of the second plate portion facing away from the first plate portion.

Optionally, the second air outlet is disposed on a wall of the second plate portion, which is close to the first plate portion.

Optionally, the rotation speed of the fan portion in the unfolded state is greater than the rotation speed of the fan portion in the folded state.

Optionally, the electronic device further includes: and one surface of the radiating fin is contacted with the first component and/or the second component, and the other opposite surface of the radiating fin is exposed to the first air duct and/or the second air duct.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:

According to the technical scheme, the electronic equipment distributes the heating components on the first plate part and the second plate part, and the air duct is flexibly adjusted according to the actual use state of the electronic equipment, so that the heat of the components in the running state can be discharged out of the electronic equipment through the corresponding air duct in time. Specifically, a single air duct can meet the heat dissipation requirement of the corresponding plate part upper part in the folded state, and the air cooling effect can be applied to any part on the two plate parts through the communication of the two air ducts in the unfolded state. The design effectively avoids the problem of heat dissipation caused by excessive concentration of a single heating component, and realizes uniform distribution and effective dissipation of heat through the communication of the air duct, thereby improving the heat dissipation performance of the equipment.

Further, the fan part is arranged in the first air channel of the first plate part, so that the air flow in the air channel can be actively promoted, and the heat dissipation effect is enhanced. Meanwhile, the rotating speed of the fan part is related to the temperature of the heating component and the unfolding state of the equipment, so that intelligent adjustment is realized. The design not only ensures the heat dissipation effect, but also avoids unnecessary energy consumption and improves the energy efficiency ratio of the equipment.

Furthermore, the radiator in the device adopts a design that a plurality of radiating fins are distributed at intervals, so that the radiating area is increased, and the radiating efficiency is improved. Meanwhile, the non-zero gaps among the radiating fins ensure that air can smoothly pass through, and the problem of air flow blockage is avoided. The radiator with the optimal design further improves the heat radiation performance of the equipment and ensures the stability and reliability of the equipment in high-load operation.

Drawings

FIG. 1 is a schematic view of an electronic device in an unfolded state according to an embodiment of the present invention;

FIG. 2 is a schematic view of the electronic device of FIG. 1 in a folded state;

FIG. 3 is a side view of the structure of FIG. 2;

FIG. 4 is a top view of the structure of FIG. 2;

FIG. 5 is a schematic view of the opening and closing mechanism of FIG. 1 in a state of conducting a second air duct;

Fig. 6 is a schematic view of the opening and closing mechanism in fig. 1 in a state of blocking the second air duct.

Detailed Description

As mentioned in the background, the problem of heat dissipation from foldable electronic devices (or "foldable electronic devices") has always been a problem that manufacturers attempt to solve. Arranging the heat generating components on both sides of the electronic device seems to be a viable solution. However, this solution also presents new challenges. How to realize the efficient collaborative heat dissipation of two sides, ensure that the equipment can maintain good heat dissipation effect while running at high performance, and become a difficult problem before the foldable electronic equipment designer.

Although the surface area of such electronic devices for natural heat dissipation is increased, flexible heat dissipation materials, such as flexible heat pipes, VC plates (Vapor Chamber), graphite, graphene, or the like, are currently used. This heat dissipation transfers heat from one side plate portion of the electronic device to the other, but the surface area of the electronic device housing still limits this natural heat dissipation capability. Compared with a passive heat dissipation mode, such as natural heat dissipation, an active heat dissipation mode can achieve a better heat dissipation effect, for example, air cooling heat dissipation is widely applied to small electronic devices.

The current miniature air-cooled heat dissipation is mainly applied to non-folding small portable electronic equipment, and is directly applied to folding electronic equipment, so that the advantage of air-cooled heat dissipation cannot be well exerted. Considering the heat dissipation requirements of both sides of the electronic equipment, development of a miniature air-cooling heat dissipation scheme combining the structural characteristics of the small portable folding electronic equipment is required. In short, the existing miniature air-cooled heat dissipation scheme of the non-folding electronic equipment cannot meet the heat dissipation requirements of the layout of the two sides of the heating component of the folding electronic equipment, and a new heat dissipation scheme is needed to solve the problem.

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

Fig. 1 is a schematic view of an electronic device 100 in an unfolded state, and fig. 2 is a schematic view of the electronic device 100 in a folded state shown in fig. 1 according to an embodiment of the present invention.

It should be noted that, to clearly show the internal structure of the electronic device 100, the illustration of the present application is shown in perspective or partial perspective.

Referring to fig. 1 and 2, the electronic device 100 may be, for example, a mobile phone with a folding screen (or "folding screen mobile phone"). The folding screen mobile phone in the market at present is a mobile phone designed by adopting a flexible material and a special hinge structure, and the screen can be converted between a smaller-size opening state and a larger-size opening state through folding and unfolding of the whole electronic equipment 100. The design breaks through the form of the traditional smart phone direct plate machine, so that a user can experience the advantage of fusion of the mobile phone and the flat plate when opening and closing the mobile phone, and a more comfortable and wide space is provided for operation and use.

In some embodiments, the outward surface of the first plate portion 1 or the second plate portion 2 in the folded state may also be provided with a screen, so as to meet the use requirement of the user in the folded state of the electronic device 100.

Further, the electronic device 100 includes a first plate portion 1 and a second plate portion 2, and the first plate portion 1 and the second plate portion 2 are hinged. For example, the first plate part 1 and the second plate part 2 are connected by a hinge. The second plate part 2 is rotatable relative to the first plate part 1 about a hinge axis 10 to switch the electronic device 100 between an unfolded state and a folded state.

The angle between the first plate portion 1 and the second plate portion 2 in the unfolded state may be 180 °, for example, and the screen located on the first plate portion 1 and the screen located on the second plate portion 2 may be spliced into a whole to form a whole screen.

At least a part of the first plate portion 1 and the second plate portion 2 in the folded state overlap.

In the embodiment shown in fig. 2, the first plate portion 1 has a size and shape that is identical to the size and shape of the second plate portion 2, and in the folded state the first plate portion 1 and the second plate portion 2 completely overlap.

In a variation of the above embodiment, the second plate 2 may also be smaller in size than the first plate 1, and the first plate 1 may be provided with a recess (not shown) for receiving the second plate 2, in which recess the second plate 2 is located in the folded state.

Further, in the embodiment shown in fig. 1 and 2, the screen of the electronic apparatus 100 may be provided on the face where the first plate portion 1 and the second plate portion 2 are attached to each other in the folded state. That is, in the folded state, the screen is folded and housed between the first plate portion 1 and the second plate portion 2.

Further, the electronic device 100 further includes a first member 11 provided to the first board portion 1 and a second member 21 provided to the second board portion 2.

Specifically, the first member 11 may include, for example: one or more of communication-related modules such as a main Chip SoC (System on a Chip), a main PMIC (PowerManagement IC, power management integrated circuit), NAND FLASH (memory module), DDR (Double Data Rate), RF (Radio Frequency) device, IC (INTEGRATED CIRCUIT ), PA (power amplifier), and the like.

The second part 21 may for example comprise: one or more of an audio device, a touch-sensitive sensor, an image processor, a WiFi module, etc.

It should be noted that the specific type, kind, number, etc. of the components provided on each of the first plate portion and the second plate portion may be arbitrarily adjusted according to actual needs, and the present embodiment is not limited herein.

Further, the first member 11 and the second member 21 generate heat to different extents when the electronic apparatus 100 is in an operating state. Therefore, the first member 11 and the second member 21 are provided on the first plate portion 1 and the second plate portion 2, respectively, so that the heat source can be effectively dispersed, and the heat radiation efficiency can be improved.

In some embodiments, the heat generation amount of the first component 11 may be higher than the heat generation amount of the second component 21.

Further, the electronic device 100 is further provided with a first air duct 12 and a second air duct 22. The first air duct 12 is disposed on the first plate portion 1, and the first air duct 12 directly or indirectly passes through the first component 11 to perform air cooling and heat dissipation on the first component 11; the second air duct 22 is disposed on the second plate 2, and the second air duct 22 directly or indirectly passes through the second component 21 to perform air cooling and heat dissipation on the second component 21.

Further, in the first air duct 12, a fan part 3 is further provided, and the fan part 3 is used for driving the air (or air flow) in the first air duct 12 to flow.

Further, when the electronic device 100 is in the unfolded state, the first air duct 12 and the second air duct 22 are communicated. The air in the first air duct 12 is further blown into the second air duct 22 by the fan section 3 to cool and dissipate the heat of the second member 21. In other words, after the first air duct 12 and the second air duct 22 are communicated, the cooperative heat radiation of the first plate portion 1 (specifically, the first member 11) and the second plate portion 2 (specifically, the second member 21) can be achieved.

Further, when the electronic device 100 is in the folded state, the first air duct 12 and the second air duct 22 are independent of each other, i.e., not in communication with each other. At this time, the fan unit 3 controls the flow of air in the first duct 12 to cool and dissipate heat of the first member 11.

In a typical application scenario, a user may interact with the electronic device 100 in a collapsed state. Since the first member 11 having a relatively high heat generation amount is provided in the first plate portion 1, the fan portion 3 can control the flow of the gas in the first air duct 12 to efficiently dissipate the heat of the first member 11.

In another application scenario, the electronic device 100 in the folded state may still be in an operating state in the first component 11 for controlling functions such as downloading, storing, communication, etc. even if interaction with a user is not required, resulting in heat generation of the first component 11. Therefore, when the electronic device 100 is in the folded state, the fan unit 3 is still operated to dissipate heat from the first component 11 according to the actual situation.

By the above, the heat dissipation design comprehensively considers the heat dissipation requirements of the electronic device 100 in different states, and through the communication and independence of the first air duct 12 and the second air duct 22, the efficient cooperative heat dissipation of the first plate part 1 (specifically, the first component 11) and the second plate part 2 (specifically, the second component 21) in the unfolded state is realized, and meanwhile, the independent heat dissipation effect of the first plate part 1 (specifically, the first component 11) can be maintained in the folded state. This design helps to ensure that the electronic device 100 is operating at high performance while maintaining good heat dissipation and extended life.

In some embodiments, with continued reference to fig. 1, the electronic device 100 may further include a heat sink 4 disposed in the first air duct 12 and the second air duct 22. Therefore, the radiator 4 cools the air in the first air duct 12 and the second air duct 22, which is helpful to improve the heat dissipation effect of the electronic device 100.

In some possible solutions of the above embodiments, the radiator 4 may also be provided in the first air duct 12 alone or in the second air duct 22 alone.

Further, the heat sink 4 includes a plurality of heat dissipation fins 41 arranged at intervals in a direction perpendicular to the gas flow direction. Further, a non-zero gap exists between any two adjacent heat fins 41 for the passage of gas. Thus, the space between the heat radiation fins 41 can form a small air flow passage, increasing the contact area of the air flow with the heat radiation fins 41. Meanwhile, the air flow can generate disturbance when passing through the radiating fins 41, so that the convection heat exchange effect is enhanced, and the radiating performance is further improved.

In some embodiments, referring to fig. 1 to 3, an opening and closing mechanism 5 is disposed in the second air duct 22, and is used for conducting or blocking the second air duct 22, where a conducting degree of the second air duct 22 is determined according to an included angle between the first plate portion 1 and the second plate portion 2.

Specifically, when the electronic device 100 is in the unfolded state, the included angle between the first plate portion 1 and the second plate portion 2 is relatively large (for example, 180 °), and at this time, the opening and closing mechanism 5 may conduct the second air duct 22, so that a smooth air flow channel can be formed between the first air duct 12 and the second air duct 22. Thus, the air driven by the fan part 3 can smoothly flow between the two air channels to take away the heat generated by the first component 11 and the second component 21, so that efficient cooperative heat dissipation is realized.

When the electronic device 100 is in the partially folded or fully folded state, the included angle between the first plate portion 1 and the second plate portion 2 is small (for example, less than 90 °), and even the electronic device may be completely fit (for example, 0 °), and the opening and closing mechanism 5 may partially block or completely block the second air duct 22. This is because the included angle between the first plate portion 1 and the second plate portion 2 is small, for example, when the electronic apparatus 100 is in the fully folded state, the first plate portion 1 and the second plate portion 2 of the electronic apparatus 100 are tightly attached, so that the air flow passage between the first air duct 12 and the second air duct 22 is blocked. At this time, even if the second air duct 22 is turned on, wind cannot be effectively blown into the second air duct 22. Thus, the opening and closing mechanism 5 automatically blocks the second air duct 22 in order to keep the interior of the device clean and to prevent dust from potentially damaging the internal components.

By adjusting the opening and closing mechanism 5, the electronic device 100 can conduct or block the second air duct 22 according to the use state, so as to achieve the functions of heat dissipation and dust prevention.

In some embodiments, the opening and closing mechanism 5 opens and closes at least a portion of the second air duct 22 in response to detecting that the included angle between the first plate portion 1 and the second plate portion 2 is greater than a first preset opening and closing angle.

Specifically, first, the magnitude of the included angle between the first plate portion 1 and the second plate portion 2 directly affects the circulation of the air flow. For example, when the included angle is small, such as when the device is in a folded state, the airflow within first duct 12 may hardly flow into second duct 22. At this time, the second air duct 22 is conducted, which not only cannot perform the heat dissipation function, but also may cause dust accumulation. Therefore, when the included angle is smaller than the first preset opening and closing angle, the opening and closing mechanism 5 can selectively block the second air duct 22, so as to achieve the effects of dust prevention and energy saving.

Further, as the angle between the first plate portion 1 and the second plate portion 2 increases, the apparatus is gradually expanded, and the circulation condition of the air flow is improved. In this case, in order to improve the heat radiation performance, the second duct 22 needs to be turned on to allow the wind to smoothly flow therethrough, thereby performing heat exchange with the second member 21. Therefore, when the included angle between the first plate portion 1 and the second plate portion 2 is larger than the first preset opening and closing angle, the opening and closing mechanism 5 will respond to the change to conduct at least a part of the second air duct 22.

The degree to which the second air duct 22 is conducted can be adjusted according to the actual size of the angle between the first plate portion 1 and the second plate portion 2. For example, the larger the included angle, the opening and closing mechanism 5 may conduct a larger portion of the second air duct 22 to allow more air to circulate, thereby improving the heat dissipation efficiency.

In some embodiments, the first preset opening and closing angle may be, for example, 0 °, that is, when the electronic device 100 is unfolded from the folded state, the opening and closing mechanism 5 turns on the second air duct 22.

In a preferred embodiment, the first preset opening and closing angle may be, for example, 90 °, that is, when the included angle between the first plate portion 1 and the second plate portion 2 increases to 90 °, the opening and closing mechanism 5 opens the second air duct 22.

In another preferred embodiment, the first preset opening and closing angle may be, for example, 150 °, that is, when the included angle between the first plate portion 1 and the second plate portion 2 increases to 150 °, the opening and closing mechanism 5 opens the second air duct 22. The determination of the first preset opening and closing angle requires comprehensive consideration of the heat dissipation requirement of the second member 21 and the dust prevention requirement of the second plate portion 2.

In some embodiments, the opening and closing mechanism 5 may be a gradual process to open and close the second air duct 22. For example, as the angle between the first plate portion 1 and the second plate portion 2 increases, the conduction degree of the second air duct 22 by the opening and closing mechanism 5 gradually increases.

In a variation, the opening and closing mechanism 5 may conduct the second air duct 22 in an instant. For example, as the included angle between the first plate portion 1 and the second plate portion 2 increases to a first preset opening and closing angle, the second air duct 22 is immediately conducted under the action of the opening and closing mechanism 5.

In some embodiments, the electronic device 100 may further include: a detection module (not shown in the figure) for detecting an angle between the first plate portion 1 and the second plate portion 2; and a control module (not shown in the figure) is in communication with the detection module, and the control module controls the operation of the opening and closing mechanism 5 according to the detected included angle so as to conduct or block the second air duct 22.

Further, the detection module may be, for example, a dual accelerometer, a dual inertial measurement unit, or a magnetic sensor (for example, an IST8309 three-axis hall sensor) in combination with a magnet, etc., so as to obtain the included angle between the first plate portion 1 and the second plate portion 2 in real time.

Further, the control module receives the information of the included angle between the first plate portion 1 and the second plate portion 2 from the detection module, and makes a decision according to a preset logic and algorithm to control the opening and closing mechanism 5 to conduct or block at least a part of the second air duct 22.

In some embodiments, as the included angle between the first plate portion 1 and the second plate portion 2 increases, the conduction degree of the second air duct 22 under the action of the opening and closing mechanism 5 may also be increased gradually by transmission and cooperation between physical structures.

For example, the electronic device 100 may further include: and the linkage part is used for linking the opening and closing mechanism 5 with the hinge between the first plate part 1 and the second plate part 2 through the linkage part so as to conduct or block the second air duct 22 along with the rotation of the hinge. Thus, the conduction and blocking of the second air duct 22 by means of physical transmission can avoid the increase of energy consumption of the electronic device 100 due to the addition of other electric components.

In a variation, the opening and closing mechanism 5 may also use a pressing mechanical baffle, where when the folding angle is 180 °, the first plate portion 1 and the second plate portion 2 press each other near the hinge, and at this time, a protrusion (not shown) may protrude from the first plate portion 1, so as to force the mechanical baffle to be pressed to a position that does not block the second air duct 22; when the folding angle is smaller than 180 °, the first plate portion 1 and the second plate portion 2 are not pressed against each other near the hinge, and the mechanical damper is restored to the position blocking the second air duct 22.

In some embodiments, referring to fig. 5 and 6, the second plate part 2 may be provided with a receiving groove 6 opened toward at least one side, the opening and closing mechanism 5 includes a driving part 51 and a shutter part 52, the driving part 51 is used for driving the shutter part 52 to move relative to the receiving groove 6 so as to move the shutter part 52 between a first position and a second position, wherein the shutter part 52 located at the first position conducts the second air duct 22 and closes the opening of the receiving groove 6; the shutter portion 52 in the second position at least partially leaves the accommodating groove 6 and blocks the second air passage 22.

Further, the driving part 51 may be, for example, a linear motor, and fig. 5 and 6 are combined, and two states of the driving part 51 (linear motor) are shown in fig. 5 and 6. Fig. 5 shows the shutter portion 52 retracted, and the driving portion 51 (linear motor) pulls the shutter portion 52 to move linearly along the shaft 53, pulling the shutter portion 52 back to a position nearest to the driving portion 51. At this time, the second air duct 22 is completely conducted, and the baffle portion 52 closes the opening of the accommodating groove 6, so as to isolate the second air duct 22 from the accommodating groove 6, and prevent dust from entering the accommodating groove 6 to affect the normal operation of the opening and closing mechanism 5. Fig. 6 shows the shutter portion 52 in an extended state, and the driving portion 51 pulls the shutter portion 52 by rotation to move linearly along the shaft 53, pushing the shutter portion 52 to the position farthest from the driving portion 51. At this time, the second air duct 22 is completely blocked.

Further, the opening of the accommodation groove 6 may be directed toward the first plate portion 1.

More specifically, the baffle portion 52 may include: a first wall 521 extending in a direction perpendicular to a gas flow direction, the first wall 521 being extendable or retractable from the accommodating groove 6 toward the second air passage 22 to block or communicate with the second air passage 22; a second wall 522 forms a non-zero angle with the first wall 521, the second wall 522 is movable in the accommodating groove 6, and the second wall 522 is connected to the driving part 51.

In some embodiments, the non-zero included angle between the first wall 521 and the second wall 522 may be, for example, 90 °, i.e., the first wall 521 is perpendicular to the second wall 522. Thereby, the contact area between the second wall 522 and the driving portion 51 can be increased, and the transmission effect can be ensured.

In some embodiments, referring to fig. 1 to 4, the first air duct 12 includes a first air inlet 121 and a first air outlet 122, the second air duct 22 includes a second air inlet 221 and a second air outlet 222, and the first air outlet 122 is abutted against the second air inlet 221 for the electronic device 100 in the unfolded state. Further, a rubber structure may be disposed around the first air outlet 122 to close a gap between the first air outlet 122 and the second air inlet 221 when they are in butt joint, so as to avoid air flow loss.

In some embodiments, the cross-sectional area of the second air inlet 221 may be greater than the cross-sectional area of the first air outlet 122. Thereby, the air flow loss at the first air outlet 122 can be further reduced.

In some embodiments, one or more of the first air inlet 121, the first air outlet 122, the second air inlet 221, and the second air outlet 222 may be implemented by forming a plurality of circular hole structures 104. Therefore, the air flow can be ensured to smoothly pass through, and the dustproof effect can be achieved, and the influence of the oversized opening on the overall aesthetic degree of the electronic equipment 100 is avoided.

Further, the electronic device 100 has opposite first and second sides 101, 102, wherein a grip area 103 of the electronic device 100 for gripping is closer to the second side 102 than the first side 101, and the first air duct 12 and the second air duct 22 are closer to the first side 101 than the second side 102.

In some embodiments, the first air inlet 121, the first air outlet 122, the second air inlet 221, and the second air outlet 222 are closer to the first side 101 than the second side 102. Therefore, when the electronic device 100 is used, the user can avoid blocking one or more of the first air inlet 121, the first air outlet 122, the second air inlet 221 and the second air outlet 222 by hands, and affecting the heat dissipation effect.

In particular, the first side 101 may for example refer to an upper side under the view of fig. 1, and the second side 102 may for example refer to a lower side under the view of fig. 2.

In one possible implementation of the above embodiment, the first air inlet 121 is provided on the wall of the first plate portion 1 adjacent to the first side 101.

In one possible version of the above embodiment, the first air inlet 121 is open at a wall of the first panel section 1 facing away from the second panel section 2.

In one possible implementation of the above embodiment, the first air outlet 122 is disposed on a wall of the first plate portion 1 adjacent to the second plate portion 2.

In one possible version of the above embodiment, the second air inlet 221 is open at the wall of the second plate portion 2 facing away from the first plate portion 1.

In one possible implementation of the above embodiment, the second air outlet 222 is disposed on the wall of the second plate 2 near the first plate 1.

In order to implement the foregoing embodiments, the shapes of the first air duct 12 and the second air duct 22 in the embodiment of the present application may be adaptively designed.

In some embodiments, the second air outlet 222 may also be disposed on a surface of the second plate portion 2 that faces outward in the folded state of the electronic device 100.

For example, both first air path 12 and second air path 22 may be configured as linear paths to reduce resistance to air flow within the air paths. At least one of the first air duct 12 and the second air duct 22 may also adjust the direction and shape according to the arrangement positions of the first component 11 and the second component 21, so as to achieve the heat dissipation effect of air cooling to the greatest extent. Further, rounded structures may be provided at the bends of the first duct 12 or the second duct 22 to reduce resistance to air flow within the duct. Thus, the non-linear design of the first air duct 12 and the second air duct 22 facilitates flexible arrangement of the first component 11 and the second component 21 in the electronic device 100, and provides a higher degree of flexibility for the design of the whole machine.

In some embodiments, the rotation speed of the fan section 3 may also be adjusted according to the folded state or the unfolded state of the electronic device 100.

For example, the rotational speed of the fan section 3 in the unfolded state is greater than the rotational speed of the fan section 3 in the folded state.

Or the electronic device 100 is further provided with a temperature sensing module (not shown in the figure), and the control module can determine the rotation speed of the fan section 3 according to the temperature of the first component 11 and the second component 21 sensed by the temperature sensing module, and the higher the temperature of the first component 11 and the second component 21, the greater the rotation speed of the fan section 3 can be.

It should be noted that the rotation speed of the fan portion 3 is positively related to the power of the fan portion 3, so that the power of the fan portion 3 is not more than 0.5W (watt) at maximum, so as to avoid that the endurance of the electronic device 100 is affected by excessive power consumption of the fan portion 3. In a preferred embodiment, the power of the fan section 3 can be adjusted at around 0.25W.

In some embodiments, the electronic device 100 may further include: a heat sink (not shown) having one face in contact with at least one of the second parts 21 of the first part 11 and an opposite face exposed to the corresponding first air duct 12 or second air duct 22. Thereby, the first air duct 12 and the second air duct 22 indirectly pass through the first member 11 and the second member 21 through the heat radiating fins to enhance heat exchange and heat radiating effect.

Further, heat conducting materials such as heat pipes, VC plates, copper foils, graphite or graphene uniform heat films, heat conducting gel, heat conducting pads and the like can be further arranged between the first component 11 and the second component 21 and the corresponding first air duct 12 and second air duct 22, so that heat exchange between the first component 11 and the second component 21 and air flows in the first air duct 12 and the second air duct 22 is enhanced, and the heat dissipation effect is further enhanced.

By adopting the technical scheme of the application, the electronic equipment 100 distributes the heating components on the first plate part 1 and the second plate part 2, and the air duct is flexibly adjusted according to the actual use state of the electronic equipment 100, so that the heat of the components in the running state can be discharged out of the electronic equipment 100 through the corresponding air duct in time. Specifically, a single air duct can meet the heat dissipation requirement of the corresponding plate part upper part in the folded state, and the air cooling effect can be applied to any part on the two plate parts through the communication of the two air ducts in the unfolded state. The design effectively avoids the problem of heat dissipation caused by excessive concentration of a single heating component, and realizes uniform distribution and effective dissipation of heat through the communication of the air duct, thereby improving the heat dissipation performance of the equipment.

Further, the electronic device 100 includes the fan portion 3 in the first air duct 12 of the first plate portion 1, so as to actively promote air flow in the air duct and enhance the heat dissipation effect. Meanwhile, the rotating speed of the fan part 3 is related to the temperature of the heating component and the unfolding state of the equipment, so that intelligent adjustment is realized. The design not only ensures the heat dissipation effect, but also avoids unnecessary energy consumption and improves the energy efficiency ratio of the equipment.

Further, the radiator 4 in the device adopts a design that the plurality of radiating fins 41 are distributed at intervals, so that the radiating area is increased, and the radiating efficiency is improved. At the same time, the non-zero gaps between the heat fins 41 ensure that air can pass smoothly, avoiding the problem of air flow blockage. The radiator 4 with the optimal design further improves the heat radiation performance of the equipment and ensures the stability and reliability of the equipment in high-load operation.

The above embodiments of the present application are all illustrated in the electronic device 100 according to the lateral folding manner shown in fig. 1 to 4, and it should be understood that the solutions provided in the embodiments of the present application may be equally applicable to electronic devices that are folded vertically. I.e., neither the text description of the embodiments nor the figures, should be taken as any limitation on the manner in which the electronic device 100 is folded.

It should be understood that the term "and/or" is merely an association relationship describing the associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In this context, the character "/" indicates that the front and rear associated objects are an "or" relationship. The term "plurality" as used in the embodiments of the present application means two or more.

Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the disclosure, even where only a single embodiment is described with respect to a particular feature. The characteristic examples provided in this disclosure are intended to be illustrative, not limiting, unless stated differently. In the specific implementation, the technical features of one or more dependent claims may be combined with the technical features of the independent claims and the technical features from the respective independent claims may be combined in any suitable manner and not merely by the specific combinations enumerated in the claims.

The term "plurality" as used in the embodiments of the present application means two or more. The first, second, etc. descriptions in the embodiments of the present application are only used for illustrating and distinguishing the description objects, and no order is used, nor is the number of the devices in the embodiments of the present application limited, and no limitation on the embodiments of the present application should be construed.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.

Claims

1. An electronic device including a first plate portion and a second plate portion, the first plate portion and the second plate portion being hinged to each other, the second plate portion being rotatable about a hinge axis with respect to the first plate portion to switch the electronic device between an unfolded state and a folded state, the electronic device being characterized by further comprising:

a first member provided on the first plate portion;

A second member provided on the second plate portion;

the first air duct is arranged on the first plate part and directly or indirectly passes through the first component;

the second air duct is arranged on the second plate part and directly or indirectly passes through the second component;

The fan part is arranged in the first air duct and used for driving the air in the first air duct to flow;

the electronic equipment is in the unfolded state, and the first air duct and the second air duct are communicated;

and the electronic equipment in the folded state is characterized in that the first air duct and the second air duct are independent.

2. The electronic device of claim 1, further comprising a heat sink disposed in the first air duct and/or the second air duct.

3. The electronic device of claim 2, wherein the heat sink comprises a plurality of heat sink fins arranged at intervals in a direction perpendicular to a direction of gas flow.

4. The electronic device of claim 1, wherein an opening and closing mechanism is disposed in the second air duct for conducting or blocking the second air duct, wherein a conducting degree of the second air duct is determined according to an included angle between the first plate portion and the second plate portion.

5. The electronic device of claim 4, wherein the opening and closing mechanism opens at least a portion of the second air duct in response to detecting that an included angle between the first plate portion and the second plate portion is greater than a first predetermined opening and closing angle.

6. The electronic device of claim 5, wherein as the angle between the first plate portion and the second plate portion increases, the degree of conduction of the second air duct by the opening and closing mechanism gradually increases.

7. The electronic device of claim 5, further comprising:

the detection module is used for detecting an included angle between the first plate part and the second plate part;

the control module is communicated with the detection module, and controls the opening and closing mechanism to operate according to the detected included angle so as to conduct or block the second air duct.

8. The electronic device of claim 5, further comprising: and the linkage part is linked with the hinge between the first plate part and the second plate part through the linkage part so as to conduct or block the second air duct along with the rotation of the hinge.

9. The electronic apparatus according to claim 4, wherein the second plate portion is provided with a housing groove opened toward at least one side, the opening-closing mechanism includes a driving portion for driving the shutter portion to move relative to the housing groove to move between a first position and a second position, wherein the shutter portion located at the first position opens the second air duct and closes an opening of the housing groove;

The baffle portion in the second position at least partially leaves the receiving groove and blocks the second air duct.

10. The electronic device of claim 9, wherein the baffle portion comprises:

a first wall extending in a direction perpendicular to a gas flow direction, the first wall being extendable or retractable from the accommodation groove toward the second air passage to block or communicate the second air passage;

And a second wall, which has a non-zero included angle with the first wall, is movable in the accommodating groove, and is connected with the driving part.

11. The electronic device of claim 1, wherein the first air duct comprises a first air inlet and a first air outlet, the second air duct comprises a second air inlet and a second air outlet, and the first air outlet interfaces with the second air inlet for the electronic device in the deployed state.

12. The electronic device of claim 11, wherein the electronic device has opposite first and second sides, wherein a grip area of the electronic device for gripping is closer to the second side than the first side, the first and second air ducts being closer to the first side than the second side; and/or the first air inlet, the first air outlet, the second air inlet and the second air outlet are closer to the first side than the second side.

13. The electronic device of claim 12, wherein the first air inlet is open at a wall of the first panel portion proximate the first side; and/or the number of the groups of groups,

The first air inlet is formed in the wall, away from the second plate part, of the first plate part; and/or the first air outlet is arranged on the wall, close to the second plate, of the first plate; and/or the second air inlet is formed in the wall, away from the first plate, of the second plate; and/or the second air outlet is arranged on the wall, close to the first plate, of the second plate.

14. The electronic device of claim 1, wherein a rotational speed of the fan portion in the unfolded state is greater than a rotational speed of the fan portion in the folded state.

15. The electronic device of claim 1, further comprising: and one surface of the radiating fin is contacted with the first component and/or the second component, and the other opposite surface of the radiating fin is exposed to the first air duct and/or the second air duct.