CN118290040B - Quartz cavity gold plating device and gold plating method thereof - Google Patents
Quartz cavity gold plating device and gold plating method thereof Download PDFInfo
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- CN118290040B CN118290040B CN202410713728.2A CN202410713728A CN118290040B CN 118290040 B CN118290040 B CN 118290040B CN 202410713728 A CN202410713728 A CN 202410713728A CN 118290040 B CN118290040 B CN 118290040B
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- cylinder
- cleaning
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- 239000010453 quartz Substances 0.000 title claims abstract description 165
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 165
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 239000010931 gold Substances 0.000 title claims abstract description 39
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 39
- 238000007747 plating Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims abstract description 103
- 239000007788 liquid Substances 0.000 claims abstract description 54
- 238000007789 sealing Methods 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 19
- 230000000670 limiting effect Effects 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000007750 plasma spraying Methods 0.000 claims description 3
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 239000001509 sodium citrate Substances 0.000 claims description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000010290 vacuum plasma spraying Methods 0.000 claims description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims 2
- 230000000712 assembly Effects 0.000 abstract description 5
- 238000000429 assembly Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 11
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 6
- 235000017491 Bambusa tulda Nutrition 0.000 description 6
- 241001330002 Bambuseae Species 0.000 description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 6
- 239000011425 bamboo Substances 0.000 description 6
- 239000002775 capsule Substances 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- -1 tetramethyl ammonia hydroxide Chemical compound 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Cleaning In General (AREA)
Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a quartz cavity gold plating device and a gold plating method thereof, the device comprises a support frame, a cover cylinder is arranged in the middle of the lower part of the support frame, the cover cylinder is of a concave structure, a cavity is formed in the inner side of the cover cylinder, three liquid receiving ports are arranged on the rear side of the upper part of the support frame, the device is covered on the quartz cylinder cavity through the cover cylinder, then two second cleaning brushes are extruded on two ends of a quartz plate cavity through clamping assemblies, and then the first cleaning brushes can be driven to reciprocate on the quartz cylinder cavity and the second cleaning brushes can be driven to clean on the quartz plate cavity back and forth through the cooperation of the cleaning assemblies and a driving assembly.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a quartz cavity gold plating device and a gold plating method thereof.
Background
The quartz cavity is a container for laboratory and industrial application, is generally made of quartz or other materials with better high temperature resistance and corrosion resistance, is widely used in various experiments, tests and processes, particularly in the fields of semiconductors, optics and chemistry, wherein the gold-plated quartz cavity is applied to a flat-plate epitaxial furnace, the epitaxial furnace has the advantages of thickness uniformity, simultaneously has the advantages of small cavity, short production period, low cost and the like, and has optimal working efficiency and most economical use cost when epitaxial wafers with the thickness of 20-50 mu m are grown, therefore, in manufacturing the gold plating of the quartz cavity, the interior of the quartz cavity needs to be cleaned before the gold plating of the quartz cavity, the cleaning can help to improve the adhesiveness between a coating and the surface of the quartz cavity, the peeling or falling risk of the coating is reduced, and a gold plating device of the quartz cavity needs to be designed for improving the purity of the quartz cavity and the stability and the adhesive force of a metal film.
The traditional gold-plated quartz cavity device has the following defects in the use process: the conventional cleaning steps are that the mixed solution of H 2O2 and HCl is cleaned, the acid-base cleaning and the DI water flushing are sequentially cleaned by nitrogen, wherein the mixed solution of H 2O2 and HCl is cleaned by liquid, the acid-base cleaning and the DI water flushing are all cleaned by liquid, air contacts on the surface of the liquid, pollutants in the air enter the liquid and adhere to the surface of the quartz cavity again, particularly the pollutants in the air enter the inner surface of the quartz cavity in the process of cleaning and replacing the quartz cavity after the cleaning of the first step is completed, particularly the pollutants in the air enter the inner surface of the quartz cavity, and particularly the quartz cavity structure with a penetrating form, such as a quartz plate cavity 01 shown in a figure 1, clearly increases the air flowability, so that impurities or particles of the quartz cavity exist, the gold plating on the quartz surface in the later stage is uneven and has poor adhesive force, and the gold plating thickness and the oxidation resistance and the wear resistance in the later stage are poor.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a quartz cavity gold plating device and a gold plating method thereof, which solve the technical problems that in the process of cleaning a quartz cavity, H 2O2 and HCl mixed solution are cleaned, acid-base is cleaned, DI and air sundries are contacted, and the quartz cavity is contacted with air sundries in the process of replacing and cleaning, so that the cleaning efficiency is affected.
In order to achieve the above purpose, the present invention is realized by the following technical scheme:
The technical scheme adopted by the invention for solving the technical problems is that the gold plating device for the quartz cavity comprises a supporting frame, wherein the supporting frame comprises the supporting frame, a cover cylinder is arranged in the middle of the lower part of the supporting frame and is of a concave structure, a cavity is formed in the inner side of the cover cylinder, three liquid receiving ports are arranged on the rear side of the upper part of the supporting frame and are connected with the cover cylinder through liquid pipes, nitrogen equipment is arranged on the front side of the upper part of the supporting frame, the lower part of the nitrogen equipment is connected with the cover cylinder through an air pipe, a quartz plate cavity is arranged below the supporting frame, mounting frames are arranged at the left end and the right end of the quartz plate cavity, a quartz cylinder cavity is arranged in the middle of the top of the quartz plate cavity, a connecting pipe is arranged below the cover cylinder, one end of the connecting pipe slides through the lower part of a sealing cover and is arranged on the inner side of the quartz cylinder cavity, a clamping component is arranged below the supporting frame and is used for clamping the mounting frames, and a cleaning component is arranged on the opposite sides of the two cover blocks and is used for cleaning the inner sides of the quartz plate cavity and the quartz cylinder cavity.
Preferably, the clamping assembly comprises a double-end electric push rod arranged above the support frame, limiting holes are formed in the left end and the right end right of the support frame, connecting blocks are arranged at the left end and the right end of the double-end electric push rod, the bottoms of the two connecting blocks slide through the inner sides of the limiting holes and are provided with cover blocks, the cover blocks are extruded on the inner sides of the mounting frame, a plurality of water outlet tanks are formed in the lower sides of the opposite sides of the two cover blocks, a liquid discharge pipe communicated with the water outlet tanks is arranged below the two cover blocks, and a limiting assembly is arranged below the support frame and used for limiting a cavity of the quartz plate.
Preferably, the limiting assembly comprises four vertical plates and two transverse plates, the four vertical plates are fixedly connected in a rectangular array below the supporting frame, the transverse plates are fixedly connected in the middle of the vertical plates, the length dimension of the transverse plates is matched with the length phase of the cavity of the quartz plate, and the distance from the bottom surface of the transverse plates to the bottom surface of the vertical plates is matched with the height phase of the cavity of the quartz plate.
Preferably, the cleaning assembly comprises a first cleaning brush, the first cleaning brush is arranged on the inner side of the cover cylinder, a cleaning motor used for driving the first cleaning brush to rotate is arranged at the top of the support frame, one end of the first cleaning brush slides through the sealing cover and clings to the inner side of the cavity of the quartz cylinder, sliding rail grooves are formed in the upper sides of the two cover blocks, limiting notches communicated with the sliding rail grooves are formed in the opposite sides of the two cover blocks, the middle parts of the two sliding rail grooves are connected with motor bases in a sliding rail connection mode, second cleaning brushes are rotatably connected to the opposite sides of the two motor bases, the second cleaning brushes are connected in sliding mode in the limiting notches, and a driving assembly is arranged below the spring waterproof pad cover cylinder fixedly connected with the second cleaning brushes.
Preferably, the inner side of the cover cylinder is provided with a tightening spring, a sealing cover is arranged below the tightening spring, the sealing cover is tightly attached to the top surface of the cavity of the quartz cylinder, and rubber pads are arranged on the opposite side surfaces of the two cover blocks.
Preferably, the second cleaning brush arranged on the left side is arranged above the second cleaning brush arranged on the right side, and the second cleaning brush arranged above and the brush of the second cleaning brush arranged below are clung to the inner wall of the cavity of the quartz plate.
Preferably, the connecting pipes are distributed in an annular array below the sealing cover, and the lower ends of the connecting pipes are arranged at the edge of the cavity of the quartz cylinder.
Preferably, the driving assembly comprises a driving block arranged below the cover cylinder, grooves are formed in the left end and the right end of the driving block, a driven rod which slides through the inner side of the grooves is arranged above the motor base, and two expansion plates are arranged at the left end and the right end of the driving block.
Preferably, the middle of the left end and the right end of the driving block and the supporting frame are hinged with a first reset spring, and the driven rod and the connecting block are hinged with a second reset spring.
In addition, the invention also provides a gold plating method using the quartz cavity gold plating device, which comprises the following specific steps:
Firstly, conveying H 2O2 and HCl mixed liquid, TMAH cleaning liquid and DI liquid in a cover cylinder in sequence, sealing the opening end of a quartz cavity through the cover cylinder and a cover block, and driving a first cleaning brush and a second cleaning brush to clean sundries along the inner wall of the quartz cavity through a cleaning assembly and a driving assembly;
secondly, using quartz balls with diameters smaller than 2 mu m and chromium oxide, and fully and uniformly mixing manganese oxide to form a mixture;
Thirdly, spraying the mixture on the surface of the quartz cavity by adopting a plasma spraying method;
Fourthly, annealing the sprayed quartz cavity in an annealing furnace for 30 minutes at the temperature of more than 1000 ℃;
Fifthly, electroless gold plating is carried out in gold plating solution prepared by sodium citrate, sodium borohydride, potassium cyanide, sodium hydroxide and the like in proportion;
Sixthly, baking the gold-plated quartz cavity in a vacuum oven at a high temperature of 800-1000 ℃ for 8-12 hours;
Seventh, vacuum plasma spraying TiN nanometer protective layer on the baked quartz cavity.
The invention has the beneficial effects that:
(1) According to the invention, the cover cylinder is covered on the cavity of the quartz cylinder, then the two second cleaning brushes are extruded on the two ends of the cavity of the quartz plate by the clamping assemblies, and then the first cleaning brush can be driven to reciprocate on the cavity of the quartz cylinder and the second cleaning brush can be driven to clean on the cavity of the quartz plate by the matching of the cleaning assemblies and the driving assemblies, so that the cleaning efficiency of the invention is improved;
(2) The jacking spring and the sealing cover can be used as a damping device to absorb vibration and impact of a cleaning component in the quartz cavity, so that the sealing performance of the quartz cavity can be ensured, and the sealing cover is jacked on the quartz plate cavity by the jacking spring under the cooperation of the clamping component, so that the cleaning sealing performance of the quartz cavity is improved;
(3) Through setting up spacing subassembly to the quartz capsule cavity spacing is between the diaphragm, and this purpose can restrict the lateral movement of quartz capsule cavity, can restrict the vertical motion of quartz capsule cavity simultaneously, conveniently makes the lid at the inboard better spacing of mounting bracket, prevents that the lid centre gripping is unstable, leads to liquid and nitrogen gas to reveal.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of a quartz plate cavity and a quartz cylinder cavity of the present invention;
FIG. 2 is a schematic diagram of the overall structure of the present invention;
FIG. 3 is another angular schematic view of the overall structure of the present invention;
FIG. 4 is a schematic view of a quartz-free cavity of the present invention;
FIG. 5 is a cross-sectional view of a cleaning assembly of the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 5A;
FIG. 7 is a schematic diagram of a drive assembly according to the present invention;
Fig. 8 is a partial enlarged view of B in fig. 7.
In the figure:
01. A quartz plate cavity; 02. a mounting frame; 03. a quartz cylinder cavity;
1. a support frame; 11. a cover cylinder; 12. a cavity; 120. a connecting pipe; 13. a liquid receiving port; 14. nitrogen equipment; 15. a double-ended electric push rod; 16. a connecting block; 17. a cover block; 18. a water outlet tank; 19. a liquid discharge pipe; 110. sealing cover; 111. a spring is tightly propped;
2. A limit component; 21. a vertical plate; 22. a cross plate;
3. Cleaning the assembly; 30. cleaning a motor; 31. a first cleaning brush; 32. a slide rail groove; 33. a motor base; 34. a second cleaning brush; 341. a spring waterproof pad; 311. a driving block; 312. a groove; 313. a passive lever; 314. an expansion plate; 315. a first return spring; 316. and a second return spring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
As shown in fig. 1-8, a quartz cavity gold plating device, including support frame 1, the below middle part of support frame 1 is equipped with lid section of thick bamboo 11, lid section of thick bamboo 11 is concave form structure, cavity 12 has been seted up to lid section of thick bamboo 11 inboard, three liquid receiving mouth 13 is installed to the top rear side of support frame 1, three liquid receiving mouth 13 inside all installs the electronic valve, can single control liquid business turn over, be connected through the liquid pipe between three liquid receiving mouth 13 and the lid section of thick bamboo 11, nitrogen gas equipment 14 is installed to the top front side of support frame 1, be connected through the trachea between the below of nitrogen gas equipment 14 and the lid section of thick bamboo 11, the below of support frame 1 is equipped with quartz plate cavity 01, install mounting bracket 02 at the left and right sides both ends of quartz plate cavity 01, quartz plate cavity 03 installs quartz cylinder cavity 03 in the middle of the top of quartz plate cavity 01, connecting pipe 120 is installed to the below of lid section of thick bamboo 11, the one end slip of connecting pipe 120 passes sealed lid 110 below and establishes in quartz cylinder cavity 03 inboard, the centre gripping subassembly sets up in the below of support frame 1, be used for carrying out centre gripping to mounting bracket 02, be connected through the liquid pipe 15 through the liquid pipe, the top of two end blocks of two side of ram blocks of side 15 are installed in the side of support frame 1, two opposite side of ram blocks 17 have two side of ram blocks of side 17 are installed, two side blocks of ram blocks of side 17 are installed in the inside 17, the inside channel 18 is installed, the two side block of side 17 is installed in the inside side channel 17, the two side channel 17 is opposite side, the inside is installed and two side channel blocks of the side 17 has two side channel 17.
When the inner cavities of the quartz plate cavity 01 and the quartz cylinder cavity 03 are cleaned, firstly, H 2O2 (hydrogen peroxide) and HCl (hydrochloric acid) mixed liquid, TMAH (tetramethyl ammonia hydroxide) cleaning liquid and DI liquid are respectively connected into three liquid receiving nozzles 13, the quartz cylinder cavity 03 is sleeved on the inner side of the cover cylinder 11, then the double-head electric push rod 15 is driven to drive the connecting block 16 and the cover block 17 to clamp along the inner side of the mounting frame 02, so that the quartz plate cavity 01 and the quartz cylinder cavity 03 form a closed structure, then liquid enters the cavity 12 in the cover cylinder 11 through the liquid pipe, finally, the connecting pipe 120 enters the quartz cylinder cavity 03 until the liquid is filled in the quartz plate cavity 01 and the quartz cylinder cavity 03, further, the liquid is fully in sealing contact with the inner side of the quartz plate cavity 01 and the quartz cylinder cavity 03, and after the cleaning is finished, the reverse one-way valve in the inner side of the water outlet groove 18 is opened, so that the liquid enters the inner side of the cover block 17 and is discharged through the liquid discharge pipe 19.
The quartz cavity surface is cleaned with a mixture of H 2O2 (hydrogen peroxide) and HCl (hydrochloric acid) for a duration of 10-30 minutes, and then cleaned with TMAH (tetramethyl ammonia hydroxide) for a duration of 5-15 minutes, which facilitates further removal of residual dirt and impurities, the quartz cavity is rinsed with DI water to remove cleaning liquid, and then blown dry through the air tube into the quartz plate cavity 01 and the inside of the quartz cylinder cavity 03 using nitrogen equipment 14, and discharged through a drain 19.
As shown in fig. 3 and 4, a limiting component 2 is arranged below the support frame 1 and used for limiting the quartz plate cavity 01, the limiting component 2 comprises four vertical plates 21 and two transverse plates 22, the four vertical plates 21 are fixedly connected in a rectangular array below the support frame 1, the transverse plates 22 are fixedly connected in the middle of the vertical plates 21, the length dimension of the transverse plates 22 is matched with the length of the quartz plate cavity 01, and the distance from the bottom surface of the transverse plates 22 to the bottom surface of the vertical plates 21 is matched with the height of the quartz plate cavity 01.
Through the setting above to quartz capsule cavity 03 spacing is between diaphragm 22, and this purpose can restrict quartz capsule cavity 03 lateral movement, can restrict quartz capsule cavity 03 vertical movement simultaneously, conveniently makes lid 17 in the inboard better spacing of mounting bracket 02, prevents that lid 17 centre gripping from being unstable, leads to liquid and nitrogen gas to reveal.
Embodiment two:
As shown in fig. 4-8, the cleaning assembly 3 is disposed on opposite sides of two cover blocks 17, and is used for cleaning inside a quartz plate cavity 01 and a quartz cylinder cavity 03, the cleaning assembly 3 includes a first cleaning brush 31, the first cleaning brush 31 is mounted on the inner side of the cover cylinder 11, a cleaning motor 30 for driving the first cleaning brush 31 to rotate is mounted on the top of the support frame 1, one end of the first cleaning brush 31 slides through the sealing cover 110 and clings to the inner side of the quartz cylinder cavity 03, a sliding rail groove 32 is disposed above the two cover blocks 17, limit notches communicated with the sliding rail groove 32 are disposed on opposite sides of the two cover blocks 17, a motor seat 33 is connected to the middle of the two sliding rail grooves 32 in a sliding way, a second cleaning brush 34 is rotatably connected to opposite sides of the two motor seat 33, a servo motor for driving the second cleaning brush 34 to rotate is mounted on the inner side of the motor seat 33, a cleaning motor 30 for driving the first cleaning brush 31 to rotate is mounted on opposite sides of the second cleaning brush seat 33, a driving rod 311 is mounted on opposite sides of the two cover blocks 17 and is mounted on opposite sides of the second cleaning brush seat 34 and is tightly attached to the inner side of the quartz cylinder cavity 03, a driving rod 311 is mounted on opposite sides of the two cover blocks 17, and a driving rod 311 is mounted on opposite sides of the two cover blocks 311 and is mounted on opposite sides of the driving rod 313, and a driving rod 313 is mounted on opposite sides of the driving rod 311.
The cleaning motor 30 is driven to drive the first cleaning hairbrush 31 to rotate in the quartz cylinder cavity 03, and the servo motor in the motor seat 33 is used to drive the second cleaning hairbrush 34 to rotate in the quartz plate cavity 01, so that the cleaning liquid can be fully and uniformly mixed, and the cleaning liquid can be more easily discharged out of the quartz cavity, thereby being easier to carry out subsequent flushing and drying;
When the cover cylinder 11 rotates, the driving block 311 is driven by the driving block 311 to reciprocate along the linear direction of the sliding rail groove 32, so that the two driven rods 313 reciprocate back and forth in opposite directions, so as to drive the two second cleaning brushes 34 to rotate along the inner wall of the quartz cavity, and the two second cleaning brushes 34 can obviously improve the cleaning efficiency.
As shown in fig. 4 to 6, a tightening spring 111 is installed on the inner side of the cover cylinder 11, a sealing cover 110 is installed below the tightening spring 111, the sealing cover 110 is tightly attached to the top surface of the quartz cylinder cavity 03, and rubber pads are installed on the opposite side surfaces of the two cover blocks 17.
The tight spring 111 of top and sealed lid 110 can be used as damping device, absorbs the inside clearance subassembly 3 vibration and the impact of quartz cavity, can help guaranteeing the sealing performance of quartz cavity, and can be through under the cooperation of clamping assembly for tight spring 111 of top is tight sealed lid 110 top on quartz plate cavity 01, improves quartz cavity and washs the leakproofness.
As shown in fig. 5, the second cleaning brush 34 located at the left side is disposed above the second cleaning brush 34 located at the right side, and the brushes of the second cleaning brush 34 located above and the second cleaning brush 34 located below are closely attached to the inner wall of the quartz plate chamber 01.
Through the above arrangement, the cleaning brush 34 can be fully contacted with the inner wall of the quartz cavity in the cleaning process through the two second cleaning brushes, so that the cleaning to the difficult-to-reach area is ensured, and the cleaning efficiency is further improved.
The connecting pipes 120 are distributed in an annular array below the sealing cover 110, and the lower ends of the connecting pipes 120 are arranged at the edge of the quartz cylinder cavity 03.
Through the setting, can make the liquid along quartz plate cavity 01's inner wall landing, then under the clearance cooperation through first clearance brush 31, play the rapid cleaning effect to quartz plate cavity 01's inner wall dirt more, through the come in and go out of nitrogen gas simultaneously, can improve quartz cavity's dryness fast.
A first reset spring 315 is hinged between the middle of the left end and the right end of the driving block 311 and the supporting frame 1, and a second reset spring 316 is hinged between the driven rod 313 and the connecting block 16.
When the quartz cavity is cleaned, in order to replace the cleaning assembly 3 and the driving assembly of the next quartz cavity for normal use, the driving block 311 can be kept in a reset state by the release elasticity of the first reset spring 315 and the second reset spring 316, and meanwhile, the driven rod 313 can stay in the middle position of the cover block 17, so that the driven rod 313 can enter the groove 312 when the next quartz cavity is clamped, and normal use of the driving assembly is ensured.
In addition, the invention also provides a gold plating method using the quartz cavity gold plating device, which comprises the following specific steps:
Firstly, when the inner cavities of a quartz plate cavity 01 and a quartz cylinder cavity 03 are cleaned, firstly, H 2O2 and HCl mixed liquid, TMAH cleaning liquid and DI liquid are respectively connected into three liquid connecting ports 13, the quartz cylinder cavity 03 is sleeved on the inner side of a cover cylinder 11, then a double-head electric push rod 15 is driven to drive a connecting block 16 and a cover block 17 to clamp along the inner side of a mounting frame 02, so that the quartz plate cavity 01 and the quartz cylinder cavity 03 form a closed structure, then liquid enters a cavity 12 in the cover cylinder 11 through a liquid pipe, finally, the liquid enters the quartz cylinder cavity 03 through a connecting pipe 120 until the liquid is filled in the quartz plate cavity 01 and the quartz cylinder cavity 03, so that the liquid is fully in sealing contact with the inner side of the quartz plate cavity 01 and the quartz cylinder cavity 03, and after the cleaning is finished, a reverse check valve in the inner side of a water outlet tank 18 is opened, so that the liquid enters the inner side of the cover block 17 and is discharged through a liquid discharge pipe 19;
Secondly, when different solvents are introduced, the first cleaning hairbrush 31 can rotate in the quartz cylinder cavity 03 under the cooperation of the cleaning assembly 3 and the driving assembly, and meanwhile, the two second cleaning hairbrushes 34 can be driven to clean sundries along the inner wall of the quartz cavity in the opposite direction;
Thirdly, fully and uniformly mixing quartz spheres with the diameter smaller than 2 mu m with chromium oxide and manganese oxide to form a mixture, wherein the mixture is used for improving the uniformity of the gold film.
Fourthly, the mixture A is sprayed on the surface of the quartz cavity by adopting a plasma spraying method, so that the mixture A is uniformly coated on the quartz cavity, and the oxidation resistance and the wear resistance of the quartz cavity are improved.
Fifthly, placing the sprayed quartz cavity in an annealing furnace with the temperature of more than 1000 ℃ for 30 minutes of high-temperature treatment. Is beneficial to curing and improving the performance of the film.
Sixth, electroless gold plating is performed using a gold plating solution prepared in proportion of sodium citrate, sodium borohydride, potassium cyanide, sodium hydroxide, etc., which forms a metal film on the quartz chamber.
Seventh, the quartz cavity after gold plating is put into a vacuum oven for high-temperature baking, the temperature range is 800-1000 ℃, the time is 8-12 hours, and the high-temperature baking can improve the compactness, crystallinity and adhesive force of the gold plating layer and improve the oxidation resistance and wear resistance of the gold plating layer.
And eighth, finally, the vacuum plasma is used for spraying the TiN nanometer protective layer on the baked quartz cavity, which is beneficial to enhancing the adhesive force of the metal film so as to ensure the stability of the metal film during the use.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the foregoing examples, and that the foregoing description and description are merely illustrative of the principles of this invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a quartzy cavity gilt device, includes support frame (1), its characterized in that: the lower part of the support frame (1) is provided with a cover cylinder (11), the cover cylinder (11) is of a concave structure, the inner side of the cover cylinder (11) is provided with a cavity (12), three liquid connecting pipes (13) are arranged above the support frame (1), the three liquid connecting pipes (13) are connected with the cover cylinder (11) through liquid pipes, nitrogen equipment (14) is arranged above the support frame (1), the nitrogen equipment (14) is connected with the cover cylinder (11) through air pipes, the lower part of the support frame (1) is provided with a quartz plate cavity (01), the left end and the right end of the quartz plate cavity (01) are provided with mounting racks (02), the top of the quartz plate cavity (01) is provided with a quartz cylinder cavity (03), the lower part of the cover cylinder (11) is provided with a connecting pipe (120), and one end of the connecting pipe (120) slides through the sealing cover (110) and is arranged on the inner side of the quartz cylinder cavity (03);
The clamping assembly is arranged below the supporting frame (1) and used for clamping the mounting frame (02);
The cleaning assembly (3) is arranged on opposite sides of the two cover blocks (17) and is used for cleaning the inner sides of the quartz plate cavity (01) and the quartz cylinder cavity (03);
The clamping assembly comprises a double-end electric push rod (15) arranged above the support frame (1), a limit hole is formed in the support frame (1), a connecting block (16) is arranged on the double-end electric push rod (15), the lower parts of the two connecting blocks (16) slide through the inner sides of the limit holes and are provided with cover blocks (17), the cover blocks (17) are extruded on the inner sides of the mounting frames (02), a water outlet groove (18) is formed in one side of each cover block (17), a liquid discharge pipe (19) communicated with the water outlet groove (18) is arranged below each cover block (17), and a limit assembly (2) is arranged below the support frame (1) and used for limiting a quartz plate cavity (01);
the cleaning assembly (3) comprises a first cleaning brush (31), the first cleaning brush (31) is arranged on the inner side of the cover cylinder (11), a cleaning motor (30) used for driving the first cleaning brush (31) to rotate is arranged at the top of the supporting frame (1), one end of the first cleaning brush (31) slides through the sealing cover (110) and clings to the inner side of the cavity (03) of the quartz cylinder, a sliding rail groove (32) is formed in the upper portion of the two cover blocks (17), limit notches communicated with the sliding rail groove (32) are formed in the opposite sides of the two cover blocks (17), a motor base (33) is connected in the middle of the two sliding rail grooves (32) in a sliding rail connection mode, a second cleaning brush (34) is connected to the opposite sides of the two motor bases (33) in a sliding mode, a spring waterproof pad (341) fixedly connected with the second cleaning brush (34) is arranged on one side of the two cover blocks (17), and a driving assembly is arranged below the cover cylinder (11).
2. A quartz cavity gold plating apparatus according to claim 1, wherein: the limiting assembly (2) comprises four vertical plates (21) and two transverse plates (22), the four vertical plates (21) are fixedly connected in a rectangular array below the supporting frame (1), the transverse plates (22) are fixedly connected in the middle of the vertical plates (21), the lengths of the transverse plates (22) are matched with the length of the quartz plate cavity (01), and the distance from the bottom surface of the transverse plates (22) to the bottom surface of the vertical plates (21) is matched with the height of the quartz plate cavity (01).
3. A quartz cavity gold plating apparatus according to claim 2, wherein: the inner side of the cover cylinder (11) is provided with a jacking spring (111), the lower part of the jacking spring (111) is provided with a sealing cover (110), the sealing cover (110) is tightly attached to the top surface of the cavity (03) of the quartz cylinder, and one side surface of the cover block (17) is provided with a rubber pad.
4. A quartz cavity gold plating apparatus according to claim 3, wherein: the second cleaning brush (34) positioned on the left side is arranged above the second cleaning brush (34) positioned on the right side, and the brushes of the second cleaning brush (34) positioned above and the second cleaning brush (34) positioned below are clung to the inner wall of the quartz plate cavity (01).
5. A quartz cavity gold plating apparatus according to claim 1, wherein: the connecting pipes (120) are distributed in an annular array below the sealing cover (110), and the lower ends of the connecting pipes (120) are arranged at the edge of the quartz cylinder cavity (03).
6. A quartz cavity gold plating apparatus according to claim 5, wherein: the driving assembly comprises a driving block (311) arranged below the cover cylinder (11), grooves (312) are formed in the left end and the right end of the driving block (311), a driven rod (313) which slides through the inner side of the grooves (312) is arranged above the motor base (33), and two expansion plates (314) are arranged at the left end and the right end of the driving block (311).
7. The quartz chamber gold plating apparatus of claim 6, wherein: a first reset spring (315) is hinged between the left end and the right end of the driving block (311) and the supporting frame (1), and a second reset spring (316) is hinged between the driven rod (313) and the connecting block (16).
8. A gold plating method using the quartz chamber gold plating apparatus of claim 7, characterized in that: the method comprises the following steps:
firstly, conveying H 2O2 and HCl mixed liquid, TMAH cleaning liquid and DI liquid in a cover cylinder (11) in sequence, sealing the opening end of a quartz cavity through the cover cylinder (11) and a cover block (17), and then driving a first cleaning brush (31) and a second cleaning brush (34) to clean sundries along the inner wall of the quartz cavity through a cleaning assembly (3) and a driving assembly;
secondly, using quartz balls with diameters smaller than 2 mu m and chromium oxide, and fully and uniformly mixing manganese oxide to form a mixture;
Thirdly, spraying the mixture on the surface of the quartz cavity by adopting a plasma spraying method;
Fourthly, annealing the sprayed quartz cavity in an annealing furnace for 30 minutes at the temperature of more than 1000 ℃;
fifthly, electroless gold plating is carried out in gold plating solution prepared by sodium citrate, sodium borohydride, potassium cyanide and sodium hydroxide according to the proportion;
Sixthly, baking the gold-plated quartz cavity in a vacuum oven at a high temperature of 800-1000 ℃ for 8-12 hours;
Seventh, vacuum plasma spraying TiN nanometer protective layer on the baked quartz cavity.
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| CN202410713728.2A CN118290040B (en) | 2024-06-04 | 2024-06-04 | Quartz cavity gold plating device and gold plating method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107433274A (en) * | 2016-05-25 | 2017-12-05 | 上海新昇半导体科技有限公司 | The cleaning method of quartz chamber body |
| CN107433275A (en) * | 2016-05-25 | 2017-12-05 | 上海新昇半导体科技有限公司 | The cleaning device and cleaning method of quartz chamber body |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040000327A1 (en) * | 2002-06-26 | 2004-01-01 | Fabio Somboli | Apparatus and method for washing quartz parts, particularly for process equipment used in semiconductor industries |
| US20050274396A1 (en) * | 2004-06-09 | 2005-12-15 | Hong Shih | Methods for wet cleaning quartz surfaces of components for plasma processing chambers |
| CN211217793U (en) * | 2019-08-13 | 2020-08-11 | 东海县通成石英材料科技有限公司 | Cleaning device for cleaning large-size quartz wafers |
| CN112676238B (en) * | 2021-03-18 | 2021-06-15 | 北京凯德石英股份有限公司 | Quartz cylinder for cleaning semiconductor wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107433274A (en) * | 2016-05-25 | 2017-12-05 | 上海新昇半导体科技有限公司 | The cleaning method of quartz chamber body |
| CN107433275A (en) * | 2016-05-25 | 2017-12-05 | 上海新昇半导体科技有限公司 | The cleaning device and cleaning method of quartz chamber body |
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