CN118248598A - Temperature control device and cleaning system - Google Patents

Abstract

The embodiment of the application provides a temperature control device and a cleaning system, wherein the temperature control device comprises: the heat exchange chamber comprises a chamber main body and a chamber cover plate; a heat exchange cavity is formed in the side face of the cavity main body, a flow passage partition is arranged in the heat exchange cavity, and the flow passage partition partitions the heat exchange cavity into consecutive heat exchange flow passages; the cavity cover plate is arranged on one side of the cavity main body, provided with the heat exchange cavity, and is connected with the cavity main body to seal the heat exchange cavity; one side of the heat conducting plate is attached to the chamber cover plate; the heat conducting plate is used for exchanging heat with the heat exchange flow channel through the chamber cover plate and uniformly applying acting force to the chamber cover plate so as to enhance the pressure bearing capacity of the heat exchange chamber.

Description

Temperature control device and cleaning system

Technical Field

The embodiment of the application relates to the technical field of temperature control of liquid, in particular to a temperature control device and a cleaning system.

Background

In semiconductor device manufacturing, after completing chemical mechanical Polishing (CHEMICAL MECHANICAL Polishing), a wafer is generally cleaned with a chemical solution. The temperature of the chemical solution is one of the important factors affecting the Wafer (Wafer) cleaning effect, and the design of the chamber for performing the temperature adjustment process on the chemical solution is particularly important.

The chamber for performing temperature adjustment treatment on chemical liquid medicine in the related art generally comprises a cavity and a cover plate, into which liquid enters, and an intermediate sealing member such as a rubber sealing ring is arranged between the cavity and the cover plate so as to prevent the liquid in the cavity from flowing out from a gap between the cavity and the cover plate. However, this sealing method has some drawbacks, for example, due to the material of the middle sealing member, it usually generates precipitate, which causes pollution to the chemical liquid in the cavity, and when the middle sealing member is unevenly stressed, a gap is easily generated between the middle sealing member and the cover plate, which causes leakage of the chemical liquid, and so on.

Disclosure of Invention

In view of the above, embodiments of the present application provide a temperature control device and a cleaning system to at least partially solve the above-mentioned problems.

According to a first aspect of an embodiment of the present application, there is provided a temperature control apparatus including: the heat exchange chamber comprises a chamber main body and a chamber cover plate; a heat exchange cavity is formed in the side face of the cavity main body, a flow passage partition is arranged in the heat exchange cavity, and the flow passage partition partitions the heat exchange cavity into consecutive heat exchange flow passages; the cavity cover plate is arranged on one side of the cavity main body, provided with the heat exchange cavity, and is connected with the cavity main body to seal the heat exchange cavity; one side of the heat conducting plate is attached to the chamber cover plate; the heat conducting plate is used for exchanging heat with the heat exchange flow channel through the chamber cover plate and uniformly applying acting force to the chamber cover plate so as to enhance the pressure bearing capacity of the heat exchange chamber.

In one possible implementation manner, the heat exchange chamber includes two heat exchange flow passages, and the two heat exchange flow passages are respectively arranged on two opposite sides of the chamber main body.

In one possible implementation manner, the chamber main body is further provided with a liquid inlet, a liquid outlet, a first diversion hole and a second diversion hole; the first diversion holes are communicated with the liquid inlet, and the first diversion holes are respectively communicated with one ends of the two heat exchange flow channels; the second flow dividing holes are communicated with the liquid outlets, and the second flow dividing holes are respectively communicated with the other ends of the two heat exchange flow channels.

In one possible implementation manner, of the two heat exchange flow channels, the first heat exchange flow channel exchanges heat with the first heat conducting plate through the first chamber cover plate; the second heat exchange flow channel exchanges heat with the second heat conduction plate through the second chamber cover plate; and the first heat conducting plate and the second heat conducting plate are connected through a fastener, and the heat exchange cavity is clamped between the first heat conducting plate and the second heat conducting plate.

In one possible implementation manner, the temperature control device further comprises a temperature control execution unit, and the temperature control execution unit is attached to the heat conducting plate; the temperature control executing unit is used for releasing heat to the heat conducting plate or absorbing heat from the heat conducting plate.

In a possible implementation, the temperature control device further comprises a control unit; the control unit is electrically connected with the temperature control execution unit; and the control unit is used for controlling the temperature of the temperature control execution unit.

In one possible implementation manner, the liquid inlet and the liquid outlet of the chamber main body are respectively provided with a temperature sensor, and the temperature sensors are electrically connected with the control unit; the control unit is used for adjusting the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor.

In one possible implementation manner, the connection between the chamber cover plate and the chamber main body is a welded connection, and the materials of the chamber cover plate and the chamber main body are fluoroplastic.

According to a second aspect of an embodiment of the present application, there is provided a cleaning system comprising: a circulation pump, a wash chamber and a temperature control device as described in any of the embodiments of the first aspect; the circulating pump is respectively communicated with the cleaning cavity and the temperature control device and is used for conveying liquid discharged from the temperature control device to the cleaning cavity; the cleaning cavity is used for cleaning the wafer through the liquid discharged by the temperature control device.

In a possible implementation, the circulation pump is further configured to transfer the liquid in the cleaning chamber back to the temperature control device for recycling the liquid in the cleaning chamber.

In the embodiment of the application, the side surface of the chamber main body is provided with the heat exchange cavity, and the heat exchange cavity is separated into coherent heat exchange channels by the channel partition. The cavity apron sets up in the cavity main part and has offered one side of heat transfer cavity, and the cavity apron can directly link to each other with the cavity main part to seal the heat transfer cavity, can avoid using intermediate seal spare such as rubber seal, thereby solve intermediate seal spare such as rubber seal and warp easily, easily produce the precipitate and produce the scheduling problem to the heat transfer cavity. In addition, the temperature control device provided by the embodiment of the application further comprises a heat conducting plate, wherein the heat conducting plate is attached to one side of the chamber cover plate, so that heat exchange can be carried out between the heat conducting plate and a heat exchange flow channel at the other side of the chamber cover plate; and the heat-conducting plate can uniformly apply force to the chamber cover plate, so that stress concentration is avoided when the force is applied to the chamber cover plate, and the pressure bearing capacity of the heat exchange chamber is enhanced.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.

FIG. 1 is a schematic diagram of a temperature control device according to an alternative embodiment of the present application;

FIG. 2 is a schematic view of a heat exchange chamber of a temperature control device according to an alternative embodiment of the present application;

FIG. 3 is a schematic diagram of a heat exchange chamber according to an alternative embodiment of the present application;

FIG. 4 is a schematic diagram of a chamber body of another heat exchange chamber provided in an alternative embodiment of the application;

FIG. 5 is a schematic view of another temperature control device according to an alternative embodiment of the present application;

FIG. 6 is a block diagram of a cleaning system according to an alternative embodiment of the present application;

FIG. 7 is a schematic illustration of a chemical flow process provided by an alternative embodiment of the present application;

FIG. 8 is a schematic illustration of another chemical flow process provided by an alternative embodiment of the present application.

Reference numerals:

100. A temperature control device; 110. a heat exchange chamber; 111. a chamber body; 1110. a heat exchange cavity; 1111. a flow passage partition; 1112. a heat exchange flow passage; 1113. a first tap hole; 1114. a second diversion aperture; 1115. a first conduit; 1116. a second conduit; 112. a chamber cover plate; 1121. a first chamber cover plate; 120. a heat conductive plate; 121. a first heat-conducting plate; 122. a second heat-conducting plate; 123. a mounting hole; 200. a cleaning system; 210. a circulation pump; 220. cleaning the cavity; 230. and (3) a wafer.

Detailed Description

In order to better understand the technical solutions in the embodiments of the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the present application, shall fall within the scope of protection of the embodiments of the present application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "in response to a determination" depending on the context.

According to a first aspect of embodiments of the present application, a temperature control device is provided to solve the above-mentioned problems.

A detailed description of a temperature control apparatus according to an embodiment of the present application will be given below with reference to the accompanying drawings.

As shown in fig. 1 and 2, an embodiment of the present application provides a temperature control apparatus 100, including: a heat exchange chamber 110 and a heat transfer plate 120.

The heat exchange chamber 110 includes a chamber body 111 and a chamber cover 112. A heat exchange cavity 1110 is formed in the side surface of the chamber main body 111, and a flow passage partition 1111 is provided in the heat exchange cavity 1110. In the heat exchange cavity 1110, the flow channel partitions 1111 divide the heat exchange cavity 1110 into consecutive heat exchange flow channels 1112.

The chamber cover 112 is disposed at a side of the chamber body 111 where the heat exchange cavity 1110 is formed, and the chamber cover 112 is connected to the chamber body 111 to seal the heat exchange cavity 1110, so that the liquid entering the heat exchange chamber 110 can flow only in the heat exchange flow channel 1112 formed in the heat exchange cavity 1110. The height of the flow channel partition 1111 can be the same as the depth of the heat exchange cavity 1110, so that the top surface of the flow channel partition 1111 is flush with the top of the cavity wall of the heat exchange cavity 1110, and the cavity cover plate 112 can be attached to the cavity main body 111 and the flow channel partition 1111 at the same time, so that the sealing effect of the cavity cover plate 112 on the heat exchange cavity 1110 is ensured. In the embodiment of the present application, the liquid processed by the temperature control device 100 may be a chemical liquid for cleaning a wafer, or may be other suitable chemical liquid, and the type of the liquid is not limited in the embodiment of the present application.

Alternatively, the width of the heat exchange flow channel 1112 may be set to 20-40mm, and the depth of the heat exchange flow channel 1112 or the heat exchange chamber 110 may be set to 2-3mm; or the ratio of the width to the depth of the heat exchange flow channel 1112 may be set between 20/3 and 20, for example, the ratio of the width to the depth of the heat exchange flow channel 1112 may be 20/3, 10, 40/3 or 20, so as to ensure that the width of the heat exchange flow channel 1112 is far greater than the depth thereof, so as to increase the contact area between the liquid in the heat exchange flow channel 1112 and the chamber cover plate 112, improve the heat exchange efficiency of the liquid and the space utilization of the heat exchange chamber 110, be beneficial to reducing the volume of the heat exchange chamber 110, and realize miniaturization of the temperature control device 100.

One side of the heat conducting plate 120 is attached to the chamber cover 112, and the heat conducting plate 120 is used for exchanging heat with the heat exchanging channels 1112 through the chamber cover 112 and for applying force to the chamber cover 112 uniformly to enhance the pressure bearing capacity of the heat exchanging chamber. The heat conductive plate 120 of the embodiment of the present application may be a structural member as the temperature control apparatus 100, thereby improving the structural strength of the temperature control apparatus 100. In addition, since the heat-conducting plate 120 is attached to the chamber cover 112, the heat-conducting plate 120 can uniformly apply a force to the chamber cover 112, so that stress concentration is avoided when the force is applied to the chamber cover 112, the upper limit of the force applied to the chamber cover 112 can be increased, and the pressure bearing capacity of the chamber cover 112 and the heat exchange chamber 110 can be enhanced.

It should be appreciated that the other side of the heat conductive plate 120 may be provided with heating or cooling elements, such as heating wires, thermoelectric chips, etc. The thermoelectric chip may be made of a semiconductor thermoelectric material so that a refrigerating effect can be generated by the semiconductor thermoelectric material using electric energy to heat or cool the liquid in the heat exchange chamber 110 through the heat conductive plate 120, thereby realizing a more comprehensive temperature control function.

In the embodiment of the present application, a heat exchange cavity 1110 is formed on the side surface of the chamber main body 111, and the heat exchange cavity 1110 is divided into consecutive heat exchange channels 1112 by a channel partition 1111. The chamber cover plate 112 is arranged on one side of the chamber main body 111 where the heat exchange cavity 1110 is formed, and the chamber cover plate 112 can be directly connected with the chamber main body 111 to seal the heat exchange cavity 1110, so that intermediate sealing elements such as rubber sealing rings can be avoided, and the problems that the intermediate sealing elements such as the rubber sealing rings are easy to deform and easy to cause precipitates to pollute the heat exchange cavity 1110 are solved. In addition, the temperature control device 100 provided by the embodiment of the application further includes a heat conducting plate 120, and the heat conducting plate 120 is attached to one side of the chamber cover plate 112, so that heat exchange can be performed between the heat conducting plate 120 and the heat exchange flow channel 1112 on the other side of the chamber cover plate 112; and the heat-conducting plate 120 can uniformly apply the force to the chamber cover plate 112, so that stress concentration is avoided when the force is applied to the chamber cover plate 112, and the pressure-bearing capacity of the heat exchange chamber 110 is enhanced.

In the related art, a coating of PFA (Polyfluoroalkoxy, soluble polytetrafluoroethylene) or the like is usually sprayed in a chamber for performing temperature adjustment treatment on a chemical liquid to prevent the liquid to be treated in the chamber from being corroded, but the sprayed PFA is generally mixed with other substances such as an adhesive, and the sprayed PFA has corrosion resistance, but is often contaminated with the liquid to be treated due to the presence of precipitates due to the mixing of other substances.

In some alternative embodiments, the connection between the chamber cover 112 and the chamber body 111 is a welded connection, and the materials of the chamber cover 112 and the chamber body 111 may be fluoroplastic.

The fluoroplastic is made of fluororesin and has better high-temperature and corrosion resistance, and the fluoroplastic adopted in the embodiment of the application can be PTFE (Polytetrafluoroethylene), PFA (Polytetrafluoroethylene), FEP (Fluorinated ethylene propylene ) and the like.

The edge of the chamber cover plate 112 can be connected with the chamber main body 111 through a welding mode, so that good integrity is achieved between the chamber cover plate 112 and the chamber main body 111, the sealing effect of the chamber cover plate 112 on the heat exchange cavity 1110 is guaranteed, intermediate sealing elements such as rubber sealing rings can be reduced, and the intermediate sealing elements are prevented from generating precipitates to pollute liquid in the heat exchange flow channel 1112 of the heat exchange cavity 1110. In addition, because the material of the chamber cover plate 112 and the chamber main body 111 is fluoroplastic, compared with the prior art, other substances such as adhesives are not present, so that the precipitation of pollutants can be avoided on the basis of ensuring corrosion resistance, and the temperature of the liquid entering the heat exchange chamber 110 can be better controlled.

As a possible implementation manner, the chamber cover plate 112 and the flow channel partition 1111 in the heat exchange cavity 1110 may be connected by welding, or may be bonded and connected only under the action of the heat conducting plate 120, so that the liquid entering the heat exchange cavity 1110 may flow only in the heat exchange flow channel 1112 along the extending direction of the heat exchange flow channel 1112, but cannot flow across the heat exchange flow channel 1112 beyond the flow channel partition 1111, so that the liquid entering the heat exchange cavity 1110 has enough time to exchange heat, and the effect of controlling the temperature of the liquid is ensured. In addition, in the embodiment of the present application, besides the welding connection, the cavity cover plate 112 and the cavity main body 111 may be integrally formed by adopting a 3d printing manner, so as to directly eliminate the gap at the connection position between the cavity cover plate 112 and the cavity main body 111, and further improve the sealing effect on the heat exchange cavity 1110 and the heat exchange flow channel 1112.

In some alternative embodiments, the heat exchange chamber 110 includes two heat exchange channels 1112, the two heat exchange channels 1112 being disposed on opposite sides of the chamber body 111.

As shown in fig. 2 and 3, heat exchange cavities 1110 may be formed on both left and right sides of the chamber main body 111 of the heat exchange chamber 110, and corresponding heat exchange channels 1112 may be formed in each heat exchange cavity 1110 by using channel partitions 1111, so that the space on the side of the chamber main body 111 may be fully utilized to form the heat exchange channels 1112. In addition, by providing the heat exchange flow channels 1112 on both opposite sides of the chamber body 111, the heat exchange area of the heat exchange chamber 110 can be increased as much as possible, and the efficiency of heat exchange after the liquid enters the heat exchange chamber 110 can be improved.

In some alternative embodiments, as shown in fig. 2-4, the chamber body 111 is further provided with a liquid inlet, a liquid outlet, a first diversion hole 1113, and a second diversion hole 1114. The first split hole 1113 is communicated with the liquid inlet, and the first split hole 1113 is respectively communicated with one ends of the two heat exchange flow channels 1112; the second flow dividing holes 1114 are communicated with the liquid outlet, and the second flow dividing holes 1114 are respectively communicated with the other ends of the two heat exchange flow channels 1112. Wherein, the two heat exchange channels 1112 are the heat exchange channels 1112 on two sides of the upper chamber body 111.

Alternatively, the chamber body 111 may be connected with a first duct 1115 and a second duct 1116, wherein the first duct 1115 communicates with the liquid inlet and the second duct 1116 communicates with the liquid outlet, so that the liquid to be treated may be introduced into the liquid inlet through the first duct 1115 and the treated liquid may be discharged from the liquid outlet through the second duct 1116.

In the embodiment of the present application, the chamber body 111 is further provided with a liquid inlet, a liquid outlet, a first diversion hole 1113 and a second diversion hole 1114. The first diversion hole 1113 is communicated with the liquid inlet, and the first diversion hole 1113 is respectively communicated with one ends of the two heat exchange flow channels 1112, so that after liquid to be treated enters the first diversion hole 1113 through the liquid inlet, the liquid can uniformly disperse into the heat exchange flow channels 1112 on two sides of the chamber main body 111 through the first diversion hole 1113, and the heat exchange flow channels 1112 on two sides of the chamber main body 111 can be fully utilized for heat exchange. The second flow dividing holes 1114 are communicated with the liquid outlets, and the second flow dividing holes 1114 are respectively communicated with the other ends of the two heat exchange flow passages 1112, so that liquid in the heat exchange flow passages 1112 on two sides of the chamber main body 111 can be collected to one liquid outlet through the second flow dividing holes 1114 for removal, two liquid outlets are not needed to be arranged for the heat exchange flow passages 1112 on two sides of the chamber main body 111, and the structure of the heat exchange chamber can be greatly simplified.

As a possible implementation manner, the two heat exchange channels 1112 disposed on both sides of the chamber body 111 may be a first heat exchange channel and a second heat exchange channel, respectively. The chamber cover 112 may include a first chamber cover and a second chamber cover. The heat conductive plate 120 may include a first heat conductive plate and a second heat conductive plate.

In some alternative embodiments, the first heat exchange flow channel may exchange heat with the first heat conducting plate through the first chamber cover plate; the second heat exchange flow passage can exchange heat with the second heat conduction plate through the second chamber cover plate. The first heat conducting plate and the second heat conducting plate are connected through a fastener, and the heat exchange cavity is clamped between the first heat conducting plate and the second heat conducting plate. Alternatively, the fastener may be a detachable fastener or a non-detachable fastener, which are all within the scope of the embodiments of the present application.

Illustratively, as shown in fig. 5, the first and second heat conductive plates 121 and 122 may be provided with mounting holes 123, and after the heat exchange chamber 110 is placed between the first and second heat conductive plates 121 and 122, the first and second heat conductive plates 121 and 122 may be connected by passing fasteners such as bolts through the mounting holes 123 so that the heat exchange chamber 110 is clamped between the first and second heat conductive plates 121 and 122. Thus, the first heat conductive plate 121 and the second heat conductive plate 122 may be brought close to each other by turning the bolts so that the first heat conductive plate 121 and the first chamber cover 1121 are closely attached and the second heat conductive plate 122 and the second chamber cover are closely attached.

In addition, if the chamber cover plate is not directly connected with the flow passage partition in the heat exchange cavity, the first heat conducting plate 121 can apply force to the first chamber cover plate 1121 and the second heat conducting plate 122 can apply force to the second chamber cover plate through the knob bolts, so that the first chamber cover plate 1121 and the second chamber cover plate are in bonding connection with the corresponding flow passage partition 1111.

In the embodiment of the application, the heat exchange chamber 110 may be disposed between the first heat conducting plate 121 and the second heat conducting plate 122, and the first heat conducting plate 121 and the second heat conducting plate 122 are connected by a fastener, so that a structure for generating the above acting force is not required to be provided for each heat conducting plate 120, and the heat exchange chamber 110 between the first heat conducting plate 121 and the second heat conducting plate 122 can be clamped by adjusting the fastener, so that the first heat conducting plate 121 and the first chamber cover plate 1121 are tightly attached, the second heat conducting plate 122 and the second chamber cover plate are tightly attached, and therefore, the heat exchange efficiency of the first heat conducting plate 121 and the first heat exchange flow passage through the first chamber cover plate 1121 and the heat exchange efficiency of the second heat conducting plate 122 and the second heat exchange flow passage through the second chamber cover plate are improved. And the detachable fastening members can be used to facilitate the detachment of the first and second heat conductive plates 121 and 122, thereby improving the flexibility of the combination of the heat conductive plates 120 and the heat exchange chamber 110.

In some alternative embodiments, temperature control device 100 further includes a temperature control actuator unit that is in registry with heat-conductive plate 120; the temperature control performing unit is used to release heat from the heat conductive plate 120 or absorb heat from the heat conductive plate 120.

In the embodiment of the present application, the temperature control executing unit may include a heating element such as an electric heating wire for heating by electric energy, a cooling element such as a thermoelectric chip for cooling by electric energy, etc., so that when the liquid in the heat exchange runner 1112 needs to be heated, the temperature control executing unit is used to release heat to the heat conducting plate 120, so that the heat conducting plate 120 heats the liquid in the heat exchange runner 1112 through the corresponding chamber cover plate 112. When the liquid in the heat exchange chamber 110 needs to be cooled, the temperature control execution unit is utilized to absorb heat from the heat conducting plate 120, so that the heat conducting plate 120 cools the liquid in the heat exchange runner 1112 through the corresponding chamber cover plate 112, and the function of controlling the liquid temperature of the temperature control device 100 is realized.

In some alternative embodiments, temperature control device 100 further includes a control unit; the control unit is electrically connected with the temperature control execution unit; and the control unit is used for controlling the temperature of the temperature control execution unit.

In the embodiment of the present application, the control unit may be configured to control the power of the heating element and the cooling element in the temperature control executing unit, and adjust the temperature of the temperature control executing unit by adjusting the power of the heating element and the cooling element in the temperature control executing unit, so that the temperature control executing unit may release heat from the heat conducting plate 120 or absorb heat from the heat conducting plate 120. The control unit can automatically adjust the temperature of the temperature control execution unit by executing a corresponding automatic program, so that the automatic control of the control execution unit is realized, and the manual operation is reduced. The temperature of the temperature control execution unit can be adjusted under the control of a technician by receiving a manually input control instruction, so that the manual control of the temperature control execution unit is realized, and the flexibility of temperature control is improved.

In some alternative embodiments, the liquid inlet and the liquid outlet of the chamber body 111 may be provided with temperature sensors, respectively, which are electrically connected to the control unit; the control unit is used for adjusting the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor.

The initial temperature value when the liquid enters the chamber body 111 and the outflow temperature value out of the chamber body 111 can be detected by the temperature sensors of the liquid inlet and the liquid outlet of the chamber body 111. The control unit may obtain the initial temperature value and the outflow temperature value of the liquid by electrically connecting the temperature sensor, so as to adjust the temperature of the temperature control execution unit according to the difference between the target temperature value and the initial temperature value that the liquid needs to reach, so as to adjust the temperature of the liquid in the chamber main body 111 until the outflow temperature value detected by the temperature sensor is stabilized to the target temperature.

The control unit of the embodiment may further include a temperature display unit, where the temperature display unit displays an initial temperature value when the liquid enters the chamber main body 111 and an outflow temperature value when the liquid flows out of the chamber main body 111 in real time, so that a technician can control the change of the liquid temperature in real time.

In the embodiment of the present application, the liquid inlet and the liquid outlet of the chamber main body 111 may be respectively provided with a temperature sensor, and the temperature sensor is electrically connected with the control unit. The control unit may be configured to adjust the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor, so that the temperature of the liquid flowing out from the liquid outlet of the chamber main body 111 is maintained at the target temperature, and the temperature of the liquid flowing through the chamber main body 111 can be controlled more accurately, and the effect of temperature control is ensured.

As shown in fig. 6, according to a second aspect of the embodiment of the present application, there is provided a cleaning system 200, including: a circulation pump 210, a cleaning chamber 220 and a temperature control device 100 as provided in any of the embodiments of the first aspect. The circulation pump 210 is respectively communicated with the cleaning chamber 220 and the temperature control device 100 for transferring the liquid discharged from the temperature control device 100 to the cleaning chamber 220. The cleaning chamber 220 is used for cleaning the wafer by the liquid discharged from the temperature control apparatus 100.

The temperature control device 100 in the embodiment of the application is used for processing chemical liquid for cleaning a wafer, and controlling the temperature of the chemical liquid, so that the cleaning chamber 220 cleans the wafer by using the chemical liquid with proper temperature. The circulation pump 210 may or may not be provided between the washing chamber 220 and the temperature control device 100, as long as the chemical liquid can be pushed to flow between the temperature control device 100 and the washing chamber 220. The chemical liquid is discharged from the temperature control apparatus 100 by being introduced into the temperature control apparatus 100 by suction/pushing force of the circulation pump 210 until being transferred to the cleaning chamber 220.

The cleaning system 200 of the present embodiment is based on the same inventive concept as the embodiment of the temperature control device 100, and the chemical solution processed by the temperature control device 100 is used for cleaning the wafer, and the specific implementation and the beneficial effects thereof can be referred to the above embodiments, and will not be described herein.

In the embodiment of the present application, the cleaning chamber may be the cleaning chamber 220 shown in fig. 7, and the wafer 230 is cleaned by using a shower nozzle for rinsing; the cleaning chamber shown in fig. 8 may be used to immerse the wafer 230 with a chemical solution and clean the wafer 230 by ultrasonic vibration. Of course, the cleaning chamber 220 may also clean the wafer in other suitable manners, such as by using a roller brush to clean the wafer, etc.

In some alternative embodiments, as shown in FIG. 7, the temperature T1 of the chemical solution before entering the temperature control device 100 may be detected by a temperature sensor at a fluid inlet or other suitable location of the temperature control device 100 before the chemical solution enters the temperature control device 100. When the chemical liquid flows out of the temperature control device 100, the temperature T2 of the chemical liquid flowing out of the temperature control device 100 can be detected by a liquid outlet of the temperature control device 100 or a temperature sensor at other proper positions, and the size of the T2 can be controlled by the temperature control device 100, so that the chemical liquid entering the cleaning cavity 220 can keep a proper temperature. The chemical solution may be a new solution configured in a related factory, or may be a used circulating solution flowing out of the cleaning chamber 220, as long as the requirement of cleaning the wafer is satisfied. It should be appreciated that in embodiments of the present application, the circulation pump 210 may be disposed between the "chemical liquid" and the temperature control device 100 in fig. 7, or between the temperature control device 100 and the cleaning chamber 220.

In some alternative embodiments, the circulation pump 210 is also used to transfer the liquid in the wash chamber 220 back to the temperature control device 100 for recycling the liquid in the wash chamber 220.

The liquid outlet of the temperature control device 100 may be connected to the liquid inlet of the cleaning chamber 220, and the liquid inlet of the temperature control device 100 may be connected to the liquid outlet of the cleaning chamber 220. As shown in fig. 8, the chemical liquid flowing out from the liquid outlet of the cleaning chamber 220 can be transferred back to the temperature control device 100 by the circulation pump 210, so that the chemical liquid remained in the cleaning chamber 220 can be recycled, and the cleaning cost of the wafer can be reduced. In addition, the chemical liquid flowing out of the cleaning chamber 220 may be precipitated and filtered and then transferred back to the temperature control device 100, so as to reduce impurities in the chemical liquid and prevent the cleaning effect of the wafer from being affected by the impurities in the chemical liquid.

It should be noted that, according to implementation requirements, each component/step described in the embodiments of the present application may be split into more components/steps, or two or more components/steps or part of operations of the components/steps may be combined into new components/steps, so as to achieve the objects of the embodiments of the present application.

The methods or steps according to embodiments of the present application described above may be implemented in hardware, firmware, or as software or computer code storable in a recording medium such as a CD-ROM, RAM, floppy disk, hard disk, or magneto-optical disk, or as computer code originally stored in a remote recording medium or a non-transitory machine-readable medium and to be stored in a local recording medium downloaded through a network, so that the methods described herein may be processed by such software on a recording medium using a general purpose computer, special purpose processor, or programmable or special purpose hardware such as an Application SPECIFIC INTEGRATED Circuit (ASIC) or field programmable or gate array (Field Programmable GATE ARRAY, FPGA). It is understood that a computer, processor, microprocessor controller, or programmable hardware includes a Memory component (e.g., random access Memory (Random Access Memory, RAM), read-Only Memory (ROM), flash Memory, etc.) that can store or receive software or computer code that, when accessed and executed by the computer, processor, or hardware, performs the methods described herein. Furthermore, when a general purpose computer accesses code for implementing the methods illustrated herein, execution of the code converts the general purpose computer into a special purpose computer for performing the methods illustrated herein.

Those of ordinary skill in the art will appreciate that the elements and method steps of the examples described in connection with the embodiments disclosed herein can be implemented as electronic hardware, or as a combination of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the embodiments of the present application.

The above embodiments are only for illustrating the embodiments of the present application, but not for limiting the embodiments of the present application, and various changes and modifications may be made by one skilled in the relevant art without departing from the spirit and scope of the embodiments of the present application, so that all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of the embodiments of the present application should be defined by the claims.

Claims (10)

1. A temperature control apparatus, comprising:

the heat exchange chamber comprises a chamber main body and a chamber cover plate; a heat exchange cavity is formed in the side face of the cavity main body, a flow passage partition is arranged in the heat exchange cavity, and the flow passage partition partitions the heat exchange cavity into consecutive heat exchange flow passages; the cavity cover plate is arranged on one side of the cavity main body, provided with the heat exchange cavity, and is connected with the cavity main body to seal the heat exchange cavity;

One side of the heat conducting plate is attached to the chamber cover plate; the heat conducting plate is used for exchanging heat with the heat exchange flow channel through the chamber cover plate and uniformly applying acting force to the chamber cover plate so as to enhance the pressure bearing capacity of the heat exchange chamber.

2. The apparatus of claim 1, wherein the heat exchange chamber comprises two heat exchange flow passages, the two heat exchange flow passages being disposed on opposite sides of the chamber body.

3. The device of claim 2, wherein the chamber body is further provided with a liquid inlet, a liquid outlet, a first tap hole and a second tap hole;

the first diversion holes are communicated with the liquid inlet, and the first diversion holes are respectively communicated with one ends of the two heat exchange flow channels; the second flow dividing holes are communicated with the liquid outlets, and the second flow dividing holes are respectively communicated with the other ends of the two heat exchange flow channels.

4. The apparatus of claim 2, wherein the device comprises a plurality of sensors,

The first heat exchange flow channel exchanges heat with the first heat conduction plate through the first cavity cover plate in the two heat exchange flow channels; the second heat exchange flow channel exchanges heat with the second heat conduction plate through the second chamber cover plate; and

The first heat conducting plate and the second heat conducting plate are connected through a fastener, and the heat exchange cavity is clamped between the first heat conducting plate and the second heat conducting plate.

5. The apparatus of any one of claims 1-4, wherein the temperature control apparatus further comprises a temperature control actuator unit that is in engagement with the thermally conductive plate;

the temperature control executing unit is used for releasing heat to the heat conducting plate or absorbing heat from the heat conducting plate.

6. The apparatus of claim 5, wherein the temperature control apparatus further comprises a control unit;

The control unit is electrically connected with the temperature control execution unit; and the control unit is used for controlling the temperature of the temperature control execution unit.

7. The device according to claim 6, wherein the liquid inlet and the liquid outlet of the chamber body are respectively provided with a temperature sensor, and the temperature sensors are electrically connected with the control unit;

the control unit is used for adjusting the temperature of the temperature control execution unit according to the temperature value output by the temperature sensor.

8. The apparatus of any one of claims 1-4, wherein the connection between the chamber cover and the chamber body is a welded connection, and wherein the chamber cover and the chamber body are made of fluoroplastic.

9. A cleaning system, comprising: a circulation pump, a cleaning chamber and a temperature control device according to any one of claims 1 to 8;

The circulating pump is respectively communicated with the cleaning cavity and the temperature control device and is used for conveying liquid discharged from the temperature control device to the cleaning cavity;

The cleaning cavity is used for cleaning the wafer through the liquid discharged by the temperature control device.

10. The cleaning system of claim 9, wherein the circulation pump is further configured to transfer liquid from the cleaning chamber back to the temperature control device for recycling the liquid from the cleaning chamber.