CN118238289A - WLCSP (wafer level chip scale package) scribing cutter - Google Patents

Abstract

The invention provides a WLCSP (wafer level chip scale package) dicing blade, belonging to the technical field of blades, mainly aiming at the problem that the traditional dicing blade is easy to bend and deform due to external force, the invention provides the following technical scheme, which comprises a mounting part for being mounted on a wafer cutting machine, wherein one side of the mounting part is provided with a blade assembly, the bottom of the mounting part is provided with a groove, a rotating shaft is penetrated in the groove, the rotating shaft is sleeved with the blade assembly, the blade assembly comprises a first blade and a second blade, through holes are formed in the first blade and the second blade, the rotating shaft is penetrated in the through holes, and one end of the rotating shaft is also connected with the wafer cutting machine; through the setting of blade subassembly, realized the multilayer stack of blade, strengthened the mechanical strength of whole blade, can effectively resist the bending deformation under the exogenic action in the course of working, guarantee the stable cutting quality of blade, solved traditional cutting blade and taken place bending deformation's problem because of the exogenic action easily.

Description

WLCSP (wafer level chip scale package) scribing cutter

Technical Field

The invention belongs to the technical field of blades, and particularly relates to a WLCSP scribing blade.

Background

In the manufacturing process of semiconductor devices, a wafer needs to be cut, and a diamond blade or a blade made of other hard materials is generally adopted to realize the cutting of the wafer by means of high-speed rotation force; moreover, the quality of the dicing directly affects the performance and reliability of the semiconductor device.

According to the Chinese patent of the utility model with the patent number 201621121129.9, a diamond hub type slotting wafer scribing cutter is provided, the scribing cutter is provided with a circular cutter body, a plurality of groups of cutting edges and a plurality of groups of slotting, when in use, the circular cutter body is rotated to cut and process a wafer through the plurality of groups of cutting edges, and then the wafer is more convenient to remove chips through the plurality of groups of slotting; however, the conventional dicing blade is usually only one layer, the blade itself is very thin, and the mechanical strength is low, so that when the WLCSP chip dicing is performed, the blade is easily bent and deformed by an external force, and the processing quality is affected.

Disclosure of Invention

In order to solve the technical problems, the invention provides a WLCSP dicing blade, which aims to solve the technical problems that in the prior art, the traditional dicing blade is usually only one layer, the blade is very thin and has low mechanical strength, and when the WLCSP chip dicing processing is carried out, the blade is easy to bend and deform due to external force, so that the processing quality is influenced.

The invention discloses a WLCSP scribing blade, which is characterized by comprising the following specific technical means:

The utility model provides a WLCSP scribing blade, is including the installation department that is used for installing on the wafer cutting machine, installation department one side is provided with the blade subassembly, the recess is seted up to installation department bottom, wear to be equipped with the axis of rotation in the recess, the cover is equipped with in the axis of rotation the blade subassembly, the blade subassembly is including first blade and second blade, all seted up the through-hole on first blade and the second blade, the axis of rotation wears to establish in the through-hole, the one end of axis of rotation is also connected with the wafer cutting machine.

The technical scheme further comprises the following steps: the blade assembly further comprises a plurality of groups of scribing cutting edges, a plurality of groups of scribing cutting edges are arranged on the peripheral sides of the first blade and the second blade, and the plurality of groups of scribing cutting edges are uniformly distributed.

The technical scheme further comprises the following steps: and chip grooves are formed between the scribing cutting edges, one side of the second blade is provided with a polishing piece, and the polishing piece is also provided with a through hole corresponding to the rotating shaft.

The technical scheme further comprises the following steps: the first blade with the second blade reaches the piece of polishing passes through multiunit screw fixed connection, one side of the piece of polishing is provided with multiunit blade of polishing.

The technical scheme further comprises the following steps: the rotary shaft is provided with a plurality of groups of positioning columns, one side of the first blade is provided with a positioning ring, a plurality of groups of positioning grooves are formed in the positioning rings corresponding to the plurality of groups of positioning columns, and the plurality of groups of positioning columns are respectively clamped in the plurality of groups of positioning grooves.

The technical scheme further comprises the following steps: the fixed orifices have been seted up to axis of rotation one end, fixed orifices one side is provided with the fixed plate, the fixed plate pass through set screw with axis of rotation fixed connection.

The technical scheme further comprises the following steps: two groups of fixing grooves are formed in one side of the second blade, two groups of fixing pieces are correspondingly arranged on one side of the fixing plate, and the two groups of fixing pieces are respectively clamped in the two groups of fixing grooves.

The technical scheme further comprises the following steps: the mounting part is characterized in that a mounting groove is formed in the bottom of the mounting part, a bearing is arranged in the mounting groove, and the rotating shaft penetrates through the bearing.

The technical scheme further comprises the following steps: the bottom of the mounting groove is provided with a fixing seat, the fixing seat is fixedly connected with the mounting part through a plurality of groups of screws, and the bearing is clamped between the fixing seat and the mounting groove.

Compared with the prior art, the invention has the following beneficial effects:

1. Through the arrangement of the blade assembly, when the scribing blade is used, the first blade and the second blade are overlapped and fixed through a plurality of groups of positioning columns and positioning rings, so that the multilayer overlapping of the blades is realized; the mechanical strength of the whole blade is enhanced, the bending deformation under the action of external force can be effectively resisted in the processing process, the stable cutting quality of the blade is ensured, and the problem that the traditional cutting blade is easy to bend and deform due to the external force is solved; meanwhile, a plurality of groups of chip grooves are formed between the first blade and the second blade, so that the quick clearance of scraps during cutting is facilitated, and the machining efficiency is improved.

2. Through the arrangement of the polishing piece, when the scribing cutter blade is used, the cut chips can be polished finely through a plurality of groups of polishing cutting edges on the polishing piece, and cutting edges are effectively removed, so that the finish of a processing surface is improved; with traditional individual layer cutting blade simple structure, only realize cutting function different, this cutting blade has additionally accomplished this process of chip surface polishing on guaranteeing the basis of high-efficient cutting, has improved machining efficiency.

Drawings

Fig. 1 is a schematic structural view of a WLCSP dicing blade of the invention;

FIG. 2 is an exploded view of a WLCSP dicing blade according to the present invention;

FIG. 3 is a front view of a blade assembly in a WLCSP dicing blade according to the present invention;

FIG. 4 is a left side view of a blade assembly in a WLCSP dicing blade according to the present invention;

Fig. 5 is a schematic view of the assembled blade assembly of a WLCSP dicing blade;

FIG. 6 is a schematic view of the disassembled structure of FIG. 5;

FIG. 7 is a right side view of FIG. 5;

fig. 8 is a bottom view of a blade assembly in a WLCSP dicing blade of the invention.

In the figure, the correspondence between the component names and the drawing numbers is:

11. A mounting part; 12. a rotating shaft; 13. positioning columns; 14. a fixing hole; 15. a fixing plate; 16. a fixing screw; 17. a fixing member; 21. a first blade; 22. a second blade; 23. cutting a cutting edge; 24. a chip removal groove; 25. a polishing member; 26. polishing the cutting edge; 27. a positioning ring; 28. a positioning groove; 29. a fixing groove; 31. a mounting groove; 32. a bearing; 33. a fixing seat.

Detailed Description

Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.

Examples:

As shown in fig. 1 to 8:

The invention provides a WLCSP scribing blade, which comprises a mounting part 11, wherein the mounting part 11 is used for being mounted on a wafer cutting machine, one side of the mounting part 11 is provided with a structure for mounting a blade assembly, the bottom of the mounting part 11 is provided with a groove, and the groove is used for fixing a rotating shaft 12 so as to ensure that the blade can stably rotate; the blade assembly adopts a multi-layer structure, and is formed by superposing a first blade 21 and a second blade 22, and the two layers of blades are fixedly matched with a positioning ring 27 through a plurality of positioning columns 13, so that a firm and rigid integral structure is formed; the multilayer structure remarkably improves the mechanical strength of the whole blade assembly, can effectively resist bending deformation possibly generated under the action of external force in the cutting process, ensures the stability of the blade in high-speed rotation, and solves the problem frequently faced by the traditional single-layer blade, namely, the bending deformation is easily caused by external force, so that the instability of the cutting quality is affected.

Both the first blade 21 and the second blade 22 are provided with central holes which are present for fixing the rotation shaft 12. One end of the rotating shaft 12 is firmly installed in the groove of the installation part 11, and the other end is tightly connected with the wafer cutter, when the wafer cutter is started, power is transmitted to the whole blade assembly through the rotating shaft 12, and the blade assembly can operate in a high-speed rotating mode by the connection mode; the blade assembly rotating at high speed becomes an efficient cutting tool, the rotation speed and stability of the blade assembly are critical to the cutting quality of the wafer, the close combination between the rotating shaft 12 and the blade assembly is ensured by the opening of the central hole, and the possibility of vibration and deflection is reduced, so that the cutting precision is improved; in addition, the balance and stability of the blade during high-speed rotation are ensured, so that the gravity center of the blade is uniformly distributed, unnecessary vibration and noise are avoided, and the whole blade realizes the high-speed rotation capability by fixing the rotating shaft 12 in the groove of the mounting part 11 and connecting with the wafer cutting machine.

Referring to fig. 3, 5 and 6, in addition to the first blade 21 and the second blade 22, the blade assembly is further provided with a plurality of groups of dicing edges 23, the dicing edges 23 are disposed on the peripheral sides of the first blade 21 and the second blade 22, the plurality of groups of dicing edges 23 are uniformly disposed on the peripheral sides of the first blade 21 and the second blade 22 respectively, the plurality of groups of dicing edges 23 enable the blade assembly to rapidly dice the wafer under high-speed rotation, each dicing edge 23 bears dicing tasks, and they cooperate with each other to jointly achieve an ideal dicing effect; through the arrangement of the multiple groups of cutting edges 23, the wafers can be effectively cut in the high-speed rotation process, and the distribution uniformity of the cutting edges ensures that the cutting force can be uniformly applied to the surfaces of the wafers, so that the quality and the precision of cutting are improved, the multiple groups of cutting edges 23 can be adapted to wafers with different sizes and shapes, the wafers with different sizes or small sizes can be fully cut, and the consistency and the reliability of cutting are ensured; through setting up multiunit cutting edge 23, the blade subassembly can realize comprehensive and efficient cutting under high-speed rotation, and the effect of every cutting edge 23 is mutually cooperated, produces high-quality cutting effect jointly, has satisfied the strict requirement of modern wafer manufacturing, has improved the efficiency and the yield of wafer processing.

Referring to fig. 5 and 6, in order to more effectively remove the scraps generated during the cutting process, the scraps 24 are disposed between the plurality of groups of scribing cutting edges 23, so that the scraps can be rapidly discharged through the scraps 24 during the cutting process without being blocked between the cutting edges, thereby affecting the subsequent cutting operation; the wafer cutting device has the advantages that the processing efficiency is improved, the cutting process is smoother and more continuous, and the continuous and efficient wafer cutting process is realized through the perfect matching of the precise cutting of the cutting edge 23 and the rapid cleaning of the scraps by the chip grooves 24; the existence of the chip grooves 24 ensures that the scraps can be discharged in time, and the blockage among the cutting edges is avoided, so that not only is the resistance in the cutting process reduced, but also the influence of the scraps on the cutting quality is reduced, the rapid removal of the scraps is beneficial to keeping the cutting edges clean, and the service life of the cutting edges is prolonged; in addition, the arrangement of the plurality of groups of junk slots 24 can also prevent the accumulation of scraps, avoid unnecessary damage to equipment and wafers, timely discharge the scraps, reduce the workload of cleaning and maintenance, improve the working efficiency and reduce the cost, and the wafer cutting process becomes more reliable and efficient through the synergistic effect of the scribing cutting edge 23 and the junk slots 24.

In addition, in order to ensure that the rotating shaft 12 can be firmly fixed, one side of the second blade 22 is also provided with a polishing piece 25, the polishing piece 25 is aligned with a through hole in the center of the rotating shaft 12, the function of locking the axis is exerted, the stability of the whole blade assembly in the high-speed rotating process is further enhanced through perfect embedding of the polishing piece 25 and the through hole, the embedding design provides additional support and fixation, the loosening or deviation of the rotating shaft 12 in the high-speed rotating process is effectively prevented, the existence of the polishing piece 25 is like a firm defense line, reliable guarantee is provided for the stable operation of the cutting head, the force and vibration generated by high-speed rotation can be borne, and the accurate position and stable rotating state of the cutting head are ensured to be always kept; not only is the fixing requirement of the rotary shaft 12 considered, but the stability of the whole cutting head during high-speed rotation is further ensured.

Referring to fig. 3 and 6, the first blade 21, the second blade 22 and the polishing member 25 are tightly and fixedly connected together by a plurality of groups of screws, and the screws firmly fix the respective components, so that the structural stability of the whole blade assembly during high-speed rotation is ensured; a plurality of groups of polishing cutting edges 26 are arranged on one side of the polishing piece 25, and the polishing cutting edges 26 are responsible for finely polishing the cut chips; specifically, during dicing, some small dicing margins may remain on the chip, however, by fine polishing the chip surface with the polishing edge 26, these dicing margins can be effectively removed, resulting in a higher finish on the chip surface; compared with the traditional single-layer scribing blade, the structure is simple, and only the cutting function is different, the scribing blade additionally completes the key process of polishing the surface of the chip on the basis of guaranteeing high-efficiency cutting, so that the processing efficiency is improved, and a solid foundation is laid for improving the quality and performance of the chip; the traditional single-layer cutting blade can leave some surfaces with higher roughness after cutting, and additional processing steps are needed for improvement, and the novel cutting blade completes two key steps of cutting and polishing at one time through integrating a polishing function, so that the processing time and cost are reduced; in addition, the design and layout of the sharpening edge 26 is optimized to ensure uniform sharpening of the chip surface, to accommodate chips of different types and sizes, and to provide consistent and efficient sharpening; through the integrated design, the surface quality of the chip is obviously improved, the chip with the cutting edges removed has higher smoothness, and the difficulty and risk of subsequent processing can be reduced, so that the chip has great significance in improving the performance, reliability and yield of the chip, and the chip can be manufactured with higher added value by introducing a polishing function while meeting the basic cutting requirement.

Referring to fig. 2 and 5, in order to ensure that the first blade 21 can be stably mounted on the rotating shaft 12, a plurality of groups of positioning columns 13 are uniformly distributed on the rotating shaft 12, and the positioning columns 13 exist in an axially protruding manner and play an important role in positioning and fixing; correspondingly, one side of the first blade 21 is provided with a positioning ring 27, a plurality of groups of positioning grooves 28 corresponding to the number of the positioning columns 13 are formed in the positioning ring 27, and the positions of each positioning groove 28 are respectively corresponding to one positioning column 13; in the mounting process, the operation becomes simple and efficient, the accurate positioning of the first blade 21 and the rotating shaft 12 can be realized only by embedding each positioning column 13 into the corresponding positioning groove 28, a simple and reliable mounting mode is provided, the connection between the blade and the rotating shaft 12 is more stable, the matching of the positioning columns 13 and the positioning grooves 28 not only ensures the accurate mounting position of the blade, but also provides powerful support for the stability in the high-speed rotating process; they are mutually engaged, ensuring the firm fixation of the blade on the rotating shaft 12, and not easy to loose or deviate; the efficiency of installation is improved, errors and uncertainty in the installation process are reduced, an operator can install the device more conveniently, the risk of incorrect installation is reduced, and the overall reliability is improved; in addition, the positioning posts 13 and the positioning grooves 28 also consider the durability of long-term use, and can bear the force and vibration in the high-speed rotation and cutting process, so that the long-term stability of the whole system is ensured; by means of such a carefully designed positioning structure, the connection between the first blade 21 and the rotating shaft 12 becomes more reliable and stable, which lays a solid foundation for efficient running and accurate cutting of the blade, contributing to an improved machining quality and production efficiency.

Referring to fig. 2 and 8, in order to ensure that the rotating shaft 12 can be stably mounted on the main mechanical structure, a fixing hole 14 is specially formed at one end of the rotating shaft 12, the fixing hole 14 provides support for mounting, and in cooperation with this, a fixing plate 15 is disposed at one side of the fixing hole 14, and the fixing plate 15 is matched with the end of the rotating shaft 12, so as to tightly cover the opening position of the fixing hole 14; the fixed plate 15 effectively protects the fixed hole 14 from being disturbed by external factors, and meanwhile, the tight combination between the fixed plate 15 and the rotating shaft 12 further enhances the stability of the rotating shaft 12, so that a reliable mounting mode is provided, the possibility of vibration and looseness can be effectively reduced, and in actual operation, the fixed plate 15 can bear the force and vibration generated by the rotating shaft 12, and long-term stable operation of the fixed plate is ensured.

In the course of installation, we need to operate according to a specific procedure, firstly, placing the fixing plate 15 at the end of the rotating shaft 12, ensuring that the hole site under the fixing plate 15 is aligned with the fixing hole 14, then fastening the fixing plate 15 at the end of the rotating shaft 12 using the fixing screw 16, inserting the fixing screw 16 from under the fixing plate 15 and screwing into the fixing hole 14, ensuring a firm bond between the fixing plate 15 and the rotating shaft 12, by which the rotating shaft 12 is successfully and firmly installed on the main mechanical structure by the fixing plate 15; the fixing plate 15 plays a role in stabilizing and supporting, effectively preventing the rotation shaft 12 from moving axially during high-speed operation, and when the rotation shaft 12 can stably operate, the cutting process can be more accurate and consistent, cutting errors caused by movement of the shaft are avoided, and vibration and noise can be reduced due to the stability; the installation is advantageous not only in terms of reliability but also in terms of easy maintenance and repair, and if maintenance or replacement of the rotating shaft 12 is required, the fixing plate 15 and the rotating shaft 12 can be easily detached by loosening the fixing screw 16.

Referring to fig. 2 and 7, in order to ensure that the second blade 22 can be firmly mounted on the rotating shaft 12, two corresponding fixing grooves 29 are formed on one side of the second blade 22, and in matching with the two corresponding fixing grooves 29, two corresponding fixing pieces 17 are correspondingly formed on one side of the fixing plate 15, and the two corresponding fixing pieces 17 are just matched with the two corresponding fixing grooves 29, so that in the mounting process, the operation becomes simple and efficient, and the accurate positioning and firm fixing of the second blade 22 can be realized only by accurately inserting the two corresponding fixing pieces 17 into the two corresponding fixing grooves 29 respectively; the plug-in mounting mode is convenient and quick, the mounting accuracy and reliability are greatly improved, and after the two groups of fixing pieces 17 are embedded into the fixing groove 29, the second blade 22 can be effectively locked due to the special shape matching structure between the fixing pieces 17 and the fixing groove 29; even in the case of high-speed rotation, the second blade 22 is prevented from falling off or moving, ensuring safety and stability thereof; at the same time, the fixing member 17 is firmly connected with the rotating shaft 12 through the fixing plate 15, so as to provide a firm support for the installation of the second blade 22, and the connection mode enhances the stability of the whole structure, so that the second blade 22 can keep a good state in the working process, and the quality of cutting or other operations is effectively improved.

Referring to fig. 1 and 2, in order to ensure that the rotating shaft 12 can smoothly rotate in the mounting portion 11, a mounting groove 31 is formed at the bottom of the mounting portion 11, and the mounting groove 31 is formed to provide a stable mounting position for the bearing 32, wherein the bearing 32 is a key mechanical component, which can significantly reduce the friction between the rotating shaft 12 and the mounting portion 11, thereby creating an advantage for high-speed rotation of the rotating shaft 12; by installing the bearing 32 in the installation groove 31, a foundation is laid for smooth operation of the rotating shaft 12; next, one end of the rotating shaft 12 is accurately sleeved into the inner ring of the bearing 32, and the rotating shaft 12 can rotate in the mounting part 11 without hindrance under the support and protection of the bearing 32 due to the lubrication provided by the bearing 32, so that the lubrication effect not only reduces the energy loss, but also reduces the abrasion among components, and prolongs the service life of the whole system; in addition, periodic maintenance and inspection of the bearings 32 is also critical, including cleaning, lubrication, and inspection of wear of the bearings 32, to find and address potential problems in time, to avoid failure, and to ensure that the shaft 12 remains in good operation at all times.

Referring to fig. 2, in order to ensure that the bearing 32 can be stably mounted in the mounting groove 31 and avoid falling or moving under the high-speed rotation action, a fixing seat 33 is provided at the bottom of the mounting groove 31, the fixing seat 33 is used for providing additional support and fixing to ensure the stability of the bearing 32 in the working process, the fixing seat 33 is fixedly connected with the top of the mounting portion 11 through a plurality of groups of screws, so that the connection firmness between the fixing seat 33 and the mounting portion 11 is enhanced, and each group of screws is mounted and fastened, so that the fixing seat 33 can be firmly attached to the mounting portion 11 to form a stable whole; next, by using the gap formed between the fixing seat 33 and the mounting groove 31, the bearing 32 can be accurately clamped between the fixing seat 33 and the mounting groove, the fixing seat 33 provides a solid foundation, so that the bearing 32 can bear the force and vibration generated by high-speed rotation, and the risk of loosening or falling of the bearing 32 is reduced; secondly, the fixed connection mode of the plurality of groups of screws increases the stability of the whole structure, so that the whole structure can keep reliable performance in long-term operation; in addition, the installation and maintenance of the bearing 32 are facilitated, and if the bearing 32 needs to be replaced or maintenance operation is performed, the bearing 32 can be easily removed and replaced without affecting other components by just loosening the screws.

Specific use and action of the embodiment: firstly, mounting a mounting part 11 on a wafer cutting machine, ensuring that a blade assembly is correctly connected with a rotating shaft 12, and enabling the rotating shaft 12 to pass through a groove at the bottom of the mounting part 11 and be sleeved with the blade assembly; the blade assembly includes a first blade 21 and a second blade 22 which are connected to the rotation shaft 12 through a through hole and can move synchronously with the rotation of the rotation shaft 12; through the structure of the first blade 21 and the second blade 22, the multi-layer superposition of the blades is realized, the mechanical strength of the whole blade is enhanced, the bending deformation under the action of external force can be effectively resisted in the processing process, the stable cutting quality of the blades is ensured, and the problem that the traditional cutting blade is easy to bend and deform due to the external force is solved.

The peripheral sides of the first blade 21 and the second blade 22 are respectively provided with a plurality of groups of cutting edges 23, the cutting edges 23 can carry out cutting operation on a wafer in the rotating process, chip grooves 24 are arranged among the groups of cutting edges 23 and are used for discharging chips generated in the cutting process, so that the quality and the efficiency of cutting are ensured; one side of the blade assembly is provided with a polishing piece 25 which is connected with the rotating shaft 12 through a fixing piece 17, and a plurality of groups of polishing cutting edges 26 on the polishing piece 25 can polish and repair the surface of a wafer, so that the flatness and the smoothness of the wafer are improved, and the processing quality is improved.

In use, the wafer cutter drives the rotatable shaft 12 to rotate at high speed, and the blade assembly rotates therewith and cuts and polishes the wafer. The scribing edge 23 acts to cut the wafer and the grinding edge 26 is used to finish the surface and the junk slots 24 remove the chips. The scribing blade can efficiently complete the processing process of the wafer, and the production efficiency and the product quality are improved.

The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (9)

1. A WLCSP dicing blade characterized by: including being used for installing installation department (11) on the wafer cutting machine, installation department (11) one side is provided with the blade subassembly, the recess is seted up to installation department (11) bottom, wear to be equipped with axis of rotation (12) in the recess, the cover is equipped with on axis of rotation (12) the blade subassembly, the blade subassembly is including first blade (21) and second blade (22), all seted up the through-hole on first blade (21) and the second blade (22), axis of rotation (12) wear to establish in the through-hole, the one end of axis of rotation (12) is also connected with the wafer cutting machine.

2. A WLCSP dicing blade as recited in claim 1, wherein: the blade assembly further comprises a plurality of groups of scribing cutting edges (23), a plurality of groups of scribing cutting edges (23) are arranged on the peripheral sides of the first blade (21) and the second blade (22), and the plurality of groups of scribing cutting edges (23) are uniformly distributed.

3. A WLCSP dicing blade as recited in claim 2, wherein: chip grooves (24) are formed between the plurality of groups of scribing cutting edges (23), a polishing piece (25) is arranged on one side of the second blade (22), and a through hole is formed in the polishing piece (25) corresponding to the rotating shaft (12).

4. A WLCSP dicing blade as recited in claim 3, wherein: the first blade (21), the second blade (22) and the polishing piece (25) are fixedly connected through a plurality of groups of screws, and a plurality of groups of polishing cutting edges (26) are arranged on one side of the polishing piece (25).

5. A WLCSP dicing blade as recited in claim 1, wherein: the rotary shaft (12) is provided with a plurality of groups of positioning columns (13), one side of the first blade (21) is provided with a positioning ring (27), the positioning ring (27) corresponds to a plurality of groups of positioning columns (13) and is provided with a plurality of groups of positioning grooves (28), and a plurality of groups of positioning columns (13) are respectively clamped in a plurality of groups of positioning grooves (28).

6. A WLCSP dicing blade as recited in claim 5, wherein: the fixed plate (15) is arranged on one side of the fixed hole (14), and the fixed plate (15) is fixedly connected with the rotating shaft (12) through a fixed screw (16).

7. A WLCSP dicing blade as recited in claim 6, wherein: two groups of fixing grooves (29) are formed in one side of the second blade (22), two groups of fixing pieces (17) are correspondingly arranged on one side of the fixing plate (15), and the two groups of fixing pieces (17) are respectively clamped in the two groups of fixing grooves (29).

8. A WLCSP dicing blade as recited in claim 1, wherein: the mounting part (11) bottom has seted up mounting groove (31), be provided with bearing (32) in mounting groove (31), axis of rotation (12) wear to establish in bearing (32).

9. A WLCSP dicing blade as recited in claim 8, wherein: the bottom of the mounting groove (31) is provided with a fixing seat (33), the fixing seat (33) is fixedly connected with the mounting part (11) through a plurality of groups of screws, and the bearing (32) is clamped between the fixing seat (33) and the mounting groove (31).