CN118235421A

CN118235421A - Camera device

Info

Publication number: CN118235421A
Application number: CN202280075596.4A
Authority: CN
Inventors: 金贤悴; 金中喆; 张玹准
Original assignee: LG Innotek Co Ltd
Current assignee: LG Innotek Co Ltd
Priority date: 2021-11-12
Filing date: 2022-10-24
Publication date: 2024-06-21
Also published as: KR20230069563A

Abstract

Embodiments relate to a camera apparatus performing Optical Image Stabilization (OIS) by moving an image sensor. The camera device may drive (that is, x-axis movement, y-axis movement, and z-axis scrolling) the image sensor along three axes, and includes: a base; a housing disposed on the base; an image sensor disposed in the base; a wire for movably supporting the image sensor; and a first damper connecting the housing and the wire, wherein the housing is fixed to the base.

Description

Camera device

Technical Field

The embodiment of the invention relates to a camera device.

Background

A camera apparatus is an apparatus that takes a picture or video of an object and is mounted in an optical device such as a smart phone, an unmanned plane, a vehicle, or the like.

In a camera apparatus, in order to improve image quality, an Optical Image Stabilization (OIS) function is required to compensate for image shake caused by user motion.

In the camera apparatus, an image stabilizing function is performed by moving the lens in a direction perpendicular to the optical axis. However, with the recent trend of higher pixels, the diameter of the lens increases, which increases the weight of the lens, and it is difficult to ensure that the electromagnetic force moves the lens in a limited space.

Disclosure of Invention

Technical purpose

Embodiments of the present invention are directed to a camera apparatus that performs an image stabilization function by moving an image sensor.

Embodiments of the present invention are directed to a camera device that drives an image sensor in three axes (x-axis movement, y-axis movement, and z-axis scrolling).

Technical proposal

The camera device according to an embodiment of the present invention includes: a base; a housing disposed on the base; the image sensor is arranged inside the base; a wire for movably supporting the image sensor; and a first damper connecting the housing and the wire, wherein the housing may be fixed to the base.

Comprising a first drive unit that moves the image sensor in a direction perpendicular to the optical axis, wherein the wire is arranged in the direction of the optical axis, wherein the housing comprises a hole or slot through which the wire passes, and wherein at least a part of the first damper may be arranged in the hole or slot of the housing.

The aperture or slot of the housing comprises: a first chamfer (chamfer, inclined surface) whose width in a direction perpendicular to the optical axis increases as it moves upward; and a second chamfer disposed below the first chamfer and having a width that increases in a direction perpendicular to the optical axis direction as it moves downward, wherein a length of the second chamfer in the optical axis direction may be longer than a length of the first chamfer in the optical axis direction.

The housing includes a groove formed in a corner region of an upper surface of the housing, wherein a dam (dam) is formed between an outer side surface of the housing and the groove of the housing through the groove of the housing, and wherein at least a portion of the first damper may be disposed inside the dam of the housing.

The camera device includes an upper elastic member coupled to the housing, wherein the first portion of the wire may be coupled to the upper elastic member.

The first damper may be spaced apart from the upper elastic member.

The camera device includes: a coil frame movably disposed inside the housing; and a second damper connecting the coil bobbin and the upper elastic member, wherein the upper elastic member includes: an outer portion coupled to the housing; an inner portion coupled to the bobbin; a connection portion connecting the outer portion and the inner portion; and a coupling portion extending from the outer portion and coupled to the wire, and wherein the second damper may be connected to the connection portion of the upper elastic member.

The bobbin includes a groove formed on an upper surface thereof, wherein the connection portion of the upper elastic member includes: a first portion connecting the outer portion and the inner portion; and a second portion extending from the first portion to a position corresponding to the slot of the bobbin, and wherein the second damper may connect the slot of the bobbin and the second portion of the connection portion of the upper elastic member.

The second portion of the connecting portion of the upper elastic member may be disposed closer to the outer portion of the upper elastic member than the inner portion of the upper elastic member.

The second portion of the connection portion of the upper elastic member is formed in a circular shape having a diameter larger than that of another portion of the second portion at an end of the second portion, wherein the second portion of the connection portion of the upper elastic member may include a hole formed at the end of the circular shape.

The bobbin includes a protrusion formed on an upper surface of the bobbin, wherein the third damper connects the protrusion of the bobbin and the first portion of the upper elastic member, and wherein the third damper may be connected to a portion between an outer portion of the first portion and the second portion of the upper elastic member.

The camera device includes: a first substrate in which a susceptor is disposed; a second substrate spaced apart from the first substrate and electrically connected to the image sensor; a connection substrate connecting the first substrate and the second substrate; a holder disposed in the second substrate; and a coupling member disposed in the holder, wherein the second portion of the wire may be coupled to the coupling member.

The camera device includes a holder coupled to the image sensor; and a coupling member made of metal and provided in the holder, and wherein the wire may be coupled to the coupling member.

The camera device may include a fourth damper connecting the coupling member and the base.

The base includes a groove formed on an upper surface thereof, wherein the coupling member may include: a coupling portion coupled to the wire; and an extension portion extending from the coupling portion toward the groove of the base to form an obtuse angle with the coupling portion.

At least a portion of the fourth damper is disposed within the slot of the base and is connectable to the extension of the linkage member.

Each of the first, second and third dampers may have viscosity.

An optical apparatus according to an embodiment of the present invention includes: a main body; a camera device disposed in the main body; and a display provided in the main body and outputting a video or image photographed by the camera device.

The camera device according to an embodiment of the present invention includes: a first substrate; a base disposed in the first substrate; a second substrate disposed in the first substrate; an image sensor electrically connected to the second substrate; a cover member disposed on the base and including an upper plate and a side plate; and a connection substrate disposed inside the cover member, connecting the first substrate and the second substrate, and including a terminal portion, wherein the base includes a first groove formed on an outer side surface of the base facing the side plate of the cover member, and wherein the terminal portion of the connection substrate may be disposed in the first groove of the base and spaced apart from the side plate of the cover member.

The connection substrate includes a connection portion connected to the second substrate, and an extension portion connecting the connection portion and the terminal portion, wherein the extension portion of the connection substrate may be spaced apart from the side plate of the cover member in a direction perpendicular to the optical axis direction.

The connection portion of the connection substrate may be disposed further inside than an outer side surface of the base.

The camera device includes a driving unit that moves the image sensor relative to the first substrate in a direction perpendicular to the optical axis, and the connection portion that connects the substrates is spaced apart from the side plate of the cover member by a distance greater than the stroke space in the direction perpendicular to the optical axis direction.

The base includes a hole formed larger than the image sensor at a position corresponding to the image sensor, and the base may include a first protruding portion protruding from an inner surface of the base at an opposite side of the first groove of the base.

The base includes a second protruding portion protruding from the first protruding portion, and the second substrate may overlap the second protruding portion in the optical axis direction without overlapping the first protruding portion.

The camera apparatus may include: a housing disposed in the base; the coil rack is arranged inside the shell; a holder disposed in the second substrate; an upper elastic member connecting the housing and the bobbin; a coupling member provided in the holder; and a wire connecting the upper elastic member and the coupling member.

The coupling member includes a coupling portion coupled to the holder and an extension portion bent and extended from the coupling portion, wherein the base includes a second groove formed on an upper surface of the base, and wherein the damper may be disposed in the second groove of the base and connected to the extension portion of the coupling member.

The base includes a third groove formed on an upper surface of the base and extending from the second groove in a direction perpendicular to the optical axis, wherein the second groove may be formed deeper from the upper surface of the base than the third groove.

The base includes a protruding portion protruding from an upper surface of the base, wherein the protruding portion of the base forms a first groove of the base, and wherein the terminal portion of the connection substrate may be fixed to the protruding portion of the base with an adhesive.

The base includes a stepped portion protruding from an outer side surface of the base, wherein a side plate of the cover member overlaps the stepped portion in the optical axis direction, and wherein the sealing member may be disposed between the stepped portion of the base and the side plate of the cover member.

The base includes a plurality of fourth grooves formed on a side surface of the stepped portion, wherein the side plate of the cover member includes grooves connected to at least a portion of the plurality of fourth grooves of the base, and wherein at least a portion of the sealing member may be disposed in the plurality of fourth grooves of the base and the grooves of the cover member.

The plurality of fourth grooves of the base may include a plurality of grooves provided on the first side surface of the base, wherein a sum of widths of the plurality of grooves may be 17% to 37% of a width of the first side surface of the base in a direction perpendicular to the optical axis direction.

The cover member includes a ground terminal extending downward from the side plate and coupled to the first substrate through the conductive member, wherein the base includes a fifth groove formed on a side surface of the stepped portion and deeper than a thickness of the side plate of the cover member, and wherein the ground terminal of the cover member may be disposed at a position corresponding to the fifth groove of the base or bent such that at least a portion of the ground terminal is disposed inside the fifth groove of the base.

Advantageous effects

By the embodiment of the invention, the image stabilizing function can be performed by moving the image sensor.

Further, in the embodiment of the present invention, the damper is applied to connect the wire moving during OIS driving with the housing as the fixing portion, so that the oscillation phenomenon during OIS driving can be prevented.

Alternatively, in the modified embodiment, by connecting the extension portion of the coupling member to the lower end of the wire and the damper of the base, the oscillation phenomenon during OIS driving may be prevented.

Further, in the embodiment of the present invention, a damper is applied between the upper elastic member and the bobbin to prevent the oscillation phenomenon during AF driving. Further, loss of the damper can be prevented by the damper tank structure (DAMPER TANK structure) of the bobbin. Further, by applying the damper connecting the upper elastic member and the bobbin to two or more positions, the dust-proof effect can be enhanced.

Further, in an embodiment of the present invention, the image sensor PCB assembly may be assembled through the central hole of the base in a state of the actuator assembly.

In addition, OIS dampers may be applied to the base.

Further, the base can be prevented from interfering with the extension portion of the coupling member.

In addition, a space for a driving stroke of a spacer (interposer) PCB may be secured by a groove structure of the base.

Further, inflow of foreign matter can be blocked by the sealing structure between the cover member and the base.

Further, a grounding structure for the cover member is provided, and interference from, for example, solder for connecting the cover member and the substrate can be prevented.

Drawings

Fig. 1 is a perspective view of a camera device according to an embodiment of the present invention.

Fig. 2 is a perspective view of a camera device according to an embodiment of the present invention with a cover member omitted.

Fig. 3 is a plan view of a camera device according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view taken along line A-A of fig. 3.

Fig. 5 is a sectional view taken along line B-B of fig. 3.

Fig. 6 is a sectional view taken along line C-C of fig. 3.

Fig. 7 is an exploded perspective view of a camera device according to an embodiment of the present invention.

Fig. 8 is an exploded perspective view of the camera device according to the embodiment of the present invention as viewed from a direction different from fig. 7.

Fig. 9 is an exploded perspective view of a first moving part and related components of a camera device according to an embodiment of the present invention.

Fig. 10 is an exploded perspective view of a second moving part and related components of the camera device according to an embodiment of the present invention.

Fig. 11 is a perspective view of a partial configuration of a connection substrate, a wire, and a second moving part of a camera device according to an embodiment of the present invention.

Fig. 12 is a perspective view showing a wire bonding structure of a camera device according to an embodiment of the present invention.

Fig. 13 is an enlarged view of a portion of fig. 12.

Fig. 14 is a perspective view showing a coupling structure of a connection substrate and a third substrate of a camera device according to an embodiment of the present invention.

Fig. 15 is an enlarged view showing a part of fig. 14.

Fig. 16 is a perspective view of a second substrate and a connection substrate of the camera device according to the modified embodiment.

Fig. 17 is a perspective view of a second substrate and a connection substrate of a camera device according to another modified embodiment.

Fig. 18 is a perspective view of a second substrate and a connection substrate of a camera device according to still another modified embodiment.

Fig. 19 is a perspective view showing a magnet and a coil of a camera device according to an embodiment of the present invention.

Fig. 20 is an exploded perspective view of a camera device according to an embodiment of the present invention.

Fig. 21 is a perspective view showing a wing portion of a case and a related configuration according to an embodiment of the present invention.

Fig. 22 is a cutaway perspective view showing a wing portion of a housing and related construction according to an embodiment of the present invention.

Fig. 23 is a sectional view showing a part of a camera device according to an embodiment of the present invention.

Fig. 24 is a cutaway perspective view showing the wing portions of the housing on the opposite side in fig. 22 and the associated construction.

Fig. 25 is a sectional view showing a part of the camera device opposite to fig. 23.

Fig. 26 is a perspective view of a housing of a camera device according to an embodiment of the present invention.

Fig. 27 is an exploded perspective view for explaining a coupling structure of lenses of a camera device according to an embodiment of the present invention.

Fig. 28 is a perspective view of a camera device according to an embodiment of the present invention, in which a cover member and a first substrate are removed.

Fig. 29 is a plan view of a camera device according to an embodiment of the present invention, in which a cover member and a first substrate are removed.

Fig. 30 is an enlarged view showing an application structure of first to fourth dampers of a camera device according to an embodiment of the present invention.

Fig. 31 is a sectional view showing an applied structure of a first damper and a fourth damper of a camera device according to an embodiment of the present invention.

Fig. 32 (a) is a plan view showing a structure for applying a damper to a bobbin and an upper elastic member according to an embodiment of the present invention, (b) is a plan view showing a structure for applying a damper to a bobbin and an upper elastic member according to a modified embodiment, and (c) is a plan view showing a structure for applying a damper to a bobbin and an upper elastic member according to another modified embodiment.

Fig. 33 is a sectional view showing an application structure of a fourth damper of the camera device according to the embodiment of the present invention.

Fig. 34 is a perspective view showing a structure in which a fourth damper is applied to a coupling member and a base of a camera device according to an embodiment of the present invention.

Fig. 35 is a bottom view of a partial configuration of a camera device according to an embodiment of the present invention.

Fig. 36 is a plan view of a partial configuration of the camera device in the state of fig. 35.

Fig. 37 is an enlarged view of a portion of fig. 36.

Fig. 38 is a plan view showing a coil and a magnet of a camera device according to an embodiment of the present invention.

Fig. 39 is a bottom view showing a coil and a magnet of the camera device according to the embodiment of the present invention.

Fig. 40 is a side view showing a coil and a magnet of a camera device according to an embodiment of the present invention.

Fig. 41 is a plan view of a holder of a camera device according to an embodiment of the present invention.

Fig. 42 is an enlarged side view showing a holder and related configuration of a camera device according to an embodiment of the present invention.

Fig. 43 is a perspective view of a holder of a camera device according to an embodiment of the present invention.

Fig. 44 and 45 are enlarged perspective views of a part of a holder of a camera device according to an embodiment of the present invention.

Fig. 46 is a bottom perspective view of a holder of a camera device according to an embodiment of the present invention.

Fig. 47 is a perspective view of a base of a camera device according to an embodiment of the present invention.

Fig. 48 (a) is a perspective view showing an arrangement structure of a coupling member and a base of a camera device according to an embodiment of the present invention, and (b) is a bottom perspective view.

Fig. 49 is a perspective view showing a coupled state of a base and a connection substrate according to an embodiment of the present invention.

Fig. 50 is a perspective view illustrating a state in which a connection substrate is removed from a base according to an embodiment of the present invention.

Fig. 51 is a perspective view illustrating a connection substrate coupled to a base according to an embodiment of the present invention.

Fig. 52 is a plan view and a partially enlarged view showing a partial configuration of the camera device in the state of fig. 49 as viewed from above.

Fig. 53 is a perspective view of a camera device according to an embodiment of the present invention.

Fig. 54 (a) is a bottom perspective view showing a ground terminal and a groove of a base of a camera device according to an embodiment of the present invention, and (b) is a bottom perspective view of a modified embodiment in which the ground terminal is bent.

Fig. 55 is a diagram for explaining an operation of an auto focus function of a camera device according to an exemplary embodiment of the present invention.

Fig. 56 to 58 are diagrams for explaining an image stabilizing function of driving the camera device according to the embodiment of the present invention. In more detail, fig. 56 is a diagram illustrating an image sensor driving a camera device moving along an x-axis according to an embodiment of the present invention. Fig. 57 is a diagram illustrating an image sensor driving a camera device moving along a y-axis according to an embodiment of the present invention. Fig. 58 is a diagram illustrating an image sensor driving a camera device scrolling around a z-axis according to an embodiment of the present invention.

Fig. 59 is a perspective view of an optical device according to an embodiment of the present invention.

Fig. 60 is a perspective view of an optical apparatus according to an embodiment of the present invention as viewed from a direction different from fig. 59.

Detailed Description

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments to be described, but may be implemented in various forms, and one or more constituent elements may be selectively combined or replaced between the embodiments within the scope of the technical idea of the present invention.

Further, unless explicitly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted in the meanings commonly understood by those skilled in the art, and commonly used terms (such as terms defined in dictionaries) can be interpreted in consideration of the context of the related art.

Furthermore, the terminology used in the description presented herein is for the purpose of describing embodiments and is not intended to be limiting of the invention.

In this specification, unless specified otherwise in the phrase, the singular form may also include the plural form, and when described as "at least one (or more than one) of A, B and C" it may include one or more of all combinations that may be combined with A, B and C.

In addition, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), and the like may be used. These terms are only used to distinguish one element from another element and do not limit the nature, order, or sequence of the elements.

Also, when an element is described as being "connected," "coupled," or "interconnected" to another element, the element is not necessarily directly connected, coupled, or interconnected to the other element, but may also include the case of being "connected," "coupled," or "interconnected" due to the other element being between the other elements.

Further, when described as being formed or disposed "upper (upper)" or "lower (lower)" of each component, the "upper (upper)" or "lower (lower)" is intended to include not only the case where two components are in direct contact with each other but also the case where one or more other components are formed or disposed between the two components. Further, when expressed as "upper (above)" or "lower (below)", not only an upward direction with respect to one component but also a downward direction with respect to one component may be included.

Hereinafter, one of the "AF driving unit" and the "OIS driving unit" may be referred to as a "first driving unit", and the other may be referred to as a "second driving unit". Hereinafter, one of the "AF coil 430" and the "OIS coil 440" may be referred to as a "first coil", and the other may be referred to as a "second coil". Hereinafter, one of the "AF magnet 410", "OIS magnet 420", "sensing magnet 450", and "correction magnet 460" is referred to as a "first magnet", and the other is referred to as a "second magnet", and the other is referred to as a "third magnet", and the other is referred to as a "fourth magnet". Hereinafter, any one of the "first substrate 110", "second substrate 310", "sensor substrate 320", "third substrate 470", and "connection substrate 600" is referred to as a "first substrate", another is referred to as a "second substrate", yet another is referred to as a "third substrate", yet another is referred to as a "fourth substrate", and yet another may be referred to as a "fifth substrate".

Hereinafter, a camera device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

Fig. 1 is a perspective view of a camera apparatus according to an embodiment of the present invention; fig. 2 is a perspective view of a camera device according to an embodiment of the present invention with a cover member omitted; fig. 3 is a plan view of a camera device according to an embodiment of the present invention; FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3; FIG. 5 is a cross-sectional view taken along line B-B of FIG. 3; FIG. 6 is a cross-sectional view taken along line C-C of FIG. 3; fig. 7 is an exploded perspective view of a camera device according to an embodiment of the present invention; fig. 8 is an exploded perspective view of a camera device according to an embodiment of the present invention when viewed from a direction different from fig. 7; fig. 9 is an exploded perspective view of a first moving part and related components of a camera device according to an embodiment of the present invention; fig. 10 is an exploded perspective view of a second moving part and related components of a camera device according to an embodiment of the present invention; fig. 11 is a perspective view of a partial configuration of a connection substrate, a wire, and a second moving part of a camera device according to an embodiment of the present invention; fig. 12 is a perspective view showing a wire bonding structure of a camera device according to an embodiment of the present invention;

FIG. 13 is an enlarged view of a portion of FIG. 12; fig. 14 is a perspective view showing a coupling structure of a connection substrate and a third substrate of a camera device according to an embodiment of the present invention; fig. 15 is an enlarged view showing a portion of fig. 14; fig. 16 is a perspective view of a second substrate and a connection substrate of the camera device according to the modified embodiment; fig. 17 is a perspective view of a second substrate and a connection substrate of a camera device according to another modified embodiment; fig. 18 is a perspective view of a second substrate and a connection substrate of a camera device according to still another modified embodiment; fig. 19 is a perspective view showing a magnet and a coil of a camera device according to an embodiment of the present invention;

Fig. 20 is an exploded perspective view of a camera device according to an embodiment of the present invention; FIG. 21 is a perspective view showing a wing portion of a housing and associated construction according to an embodiment of the present invention; FIG. 22 is a cutaway perspective view illustrating a wing portion and associated construction of a housing according to an embodiment of the present invention; fig. 23 is a sectional view showing a part of a camera apparatus according to an embodiment of the present invention; FIG. 24 is a cutaway perspective view showing the wing portions of the housing and associated construction on the opposite side in FIG. 22; fig. 25 is a sectional view showing a part of the camera device opposite to fig. 23; fig. 26 is a perspective view of a housing of a camera device according to an embodiment of the present invention;

Fig. 27 is an exploded perspective view for explaining a coupling structure of lenses of a camera device according to an embodiment of the present invention; fig. 28 is a perspective view of a camera device according to an embodiment of the present invention, in which a cover member and a first substrate are removed; fig. 29 is a plan view of a camera device according to an embodiment of the present invention, in which a cover member and a first substrate are removed; fig. 30 is an enlarged view showing an application structure of first to fourth dampers of a camera device according to an embodiment of the present invention; fig. 31 is a sectional view showing an applied structure of a first damper and a fourth damper of a camera device according to an embodiment of the present invention; fig. 32 (a) is a plan view showing a structure in which a damper is applied to a bobbin and an upper elastic member according to an embodiment of the present invention, (b) is a plan view showing a structure in which a damper is applied to a bobbin and an upper elastic member according to a modified embodiment, and (c) is a plan view showing a structure in which a damper is applied to a bobbin and an upper elastic member according to another modified embodiment; fig. 33 is a sectional view showing an application structure of a fourth damper of the camera device according to the embodiment of the present invention; fig. 34 is a perspective view showing a structure in which a fourth damper is applied to a coupling member and a base of a camera device according to an embodiment of the present invention; fig. 35 is a bottom view of a partial configuration of a camera device according to an embodiment of the present invention; fig. 36 is a plan view of a partial configuration of the camera device in the state of fig. 35; FIG. 37 is an enlarged view of a portion of FIG. 36; fig. 38 is a plan view showing a coil and a magnet of a camera device according to an embodiment of the present invention; fig. 39 is a bottom view showing a coil and a magnet of a camera device according to an embodiment of the present invention; fig. 40 is a side view showing a coil and a magnet of a camera device according to an embodiment of the present invention; fig. 41 is a plan view of a holder of a camera device according to an embodiment of the present invention; fig. 42 is an enlarged side view showing a holder and related configuration of a camera device according to an embodiment of the present invention; fig. 43 is a perspective view of a holder of a camera device according to an embodiment of the present invention; fig. 44 and 45 are enlarged perspective views of a part of a holder of a camera device according to an embodiment of the present invention; fig. 46 is a bottom perspective view of a holder of a camera device according to an embodiment of the present invention; fig. 47 is a perspective view of a base of a camera device according to an embodiment of the present invention; fig. 48 (a) is a perspective view showing an arrangement structure of a coupling member and a base of a camera device according to an embodiment of the present invention, (b) is a bottom perspective view; fig. 49 is a perspective view showing a coupled state of a base and a connection substrate according to an embodiment of the present invention; fig. 50 is a perspective view showing a state in which a connection substrate is removed from a base according to an embodiment of the present invention; fig. 51 is a perspective view showing a connection substrate coupled to a base according to an embodiment of the present invention; fig. 52 is a plan view and a partially enlarged view showing a partial configuration of the camera device in the state of fig. 49 as viewed from above; fig. 53 is a perspective view of a camera apparatus according to an embodiment of the present invention; and (a) of fig. 54 is a bottom perspective view showing a ground terminal and a groove of a base of a camera device according to an embodiment of the present invention, and (b) is a bottom perspective view of a modified embodiment in which the ground terminal is bent.

The camera device 10 may take one or more images and video. The camera device 10 may be a camera. The camera device 10 may be a camera module. The camera device 10 may be a camera assembly. The camera device 10 may be a camera unit. The camera device 10 may include a lens driving device. The camera device 10 may include a sensor driving device. The camera device 10 may include a Voice Coil Motor (VCM). The camera device 10 may include an autofocus assembly. The camera device 10 may include an image stabilization component. The camera device 10 may include an autofocus device. The camera device 10 may include an image stabilization device. The camera device 10 may include an actuator. The camera device 10 may include a lens driving actuator. The camera device 10 may include a sensor driven actuator. The camera device 10 may include an autofocus actuator. The camera device 10 may include an image stabilization actuator.

The camera device 10 may include a fixing part 100. The fixed part 100 may be a relatively fixed part when the moving parts 200 and 300 move. The fixed part 100 may be a relatively fixed part when at least one of the first moving part 200 and the second moving part 300 moves. The fixed part 100 can accommodate the first moving part 200 and the second moving part 300. The fixed part 100 may be disposed outside the first moving part 200 and the second moving part 300.

Throughout the specification, the first substrate 110 is described as a part of the fixing part 100, but the first substrate 110 may be understood as a part separated from the fixing part 100. The fixing portion 100 may be disposed in the first substrate 110. The fixing portion 100 may be disposed on the first substrate 110. The fixing portion 100 may be disposed above the first substrate 110.

The camera device 10 may include a first substrate 110. The fixing portion 100 may include a first substrate 110. The first substrate 110 may be a main substrate. The first substrate 110 may be a substrate. The first substrate 110 may be a printed circuit board PCB. The first substrate 110 may be connected to a power supply of the optical device 1. The first substrate 110 may include a connector connected to a power source of the optical device 1. The first substrate 110 may be spaced apart from the second substrate 310.

The camera device 10 may include a base 120. The fixing portion 100 may include a base 120. The susceptor 120 may be disposed in the first substrate 110. The susceptor 120 may be disposed on the first substrate 110. The susceptor 120 may be disposed over the first substrate 110. The base 120 may be fixed to the first substrate 110. The susceptor 120 may be coupled to the first substrate 110. The base 120 may be attached to the first substrate 110 using an adhesive. The base 120 may be disposed between the first substrate 110 and the case 130. The susceptor 120 may be disposed to be in contact with an upper surface of the first substrate 110. The susceptor 120 may be disposed to be spaced apart above the first substrate 110.

The connection substrate 600 may be disposed in the base 120. The connection substrate 600 may be connected to the base 120. The connection substrate 600 may be fixed to the base 120. The connection substrate 600 may be coupled to the base 120. The connection substrate 600 may be attached to the base 120. The connection substrate 600 may be fixed to the base 120 using an adhesive. The connection substrate 600 may be in contact with the base 120.

The base 120 may include a protruding portion 121. The base 120 may include a protrusion portion 121 protruding upward. The protruding portion 121 may protrude from the upper surface of the base 120. The protruding portion 121 may protrude upward from an outer side surface of the base 120. The connection substrate 600 may be disposed in the protruding portion 121 of the base 120. The connection substrate 600 may be connected to the protruding portion 121 of the base 120. The connection substrate 600 may be fixed to the protruding portion 121 of the base 120. The connection substrate 600 may be coupled to the protruding portion 121 of the base 120. The connection substrate 600 may be attached to the protruding portion 121 of the base 120. The connection substrate 600 may be fixed to the protruding portion 121 of the base 120 using an adhesive. The connection substrate 600 may be in contact with the protruding portion 121 of the base 120. The protruding structure of the base 120 may be formed in the base 120 for assembling the connection substrate 600.

The terminal portion 630 of the connection substrate 600 may be disposed in the protruding portion 121 of the base 120. The terminal portion 630 of the connection substrate 600 may be connected to the protruding portion 121 of the base 120. The terminal portion 630 of the connection substrate 600 may be fixed to the protruding portion 121 of the base 120. The terminal portion 630 of the connection substrate 600 may be coupled to the protruding portion 121 of the base 120. The terminal portion 630 of the connection substrate 600 may be attached to the protruding portion 121 of the base 120. The terminal portion 630 of the connection substrate 600 may be fixed to the protruding portion 121 of the base 120 using an adhesive. The terminal portion 630 of the connection substrate 600 may be in contact with the protruding portion 121 of the base 120.

The base 120 may include a coupling protrusion 121a. The coupling protrusion 121a may be a boss. The coupling protrusion 121a may be coupled to the terminal portion 630 of the connection substrate 600. The coupling protrusion 121a may be coupled to a hole in the terminal portion 630 of the connection substrate 600. The coupling protrusion 121a may be inserted into a hole of the terminal portion 630 of the connection substrate 600. The coupling protrusion 121a may be formed in the protruding portion 121 of the base 120. The coupling protrusion 121a may be formed in an upper region of the outer surface of the protrusion portion 121 of the base 120. An assembly guide boss may be formed in the base 120 to increase the assembly position accuracy of the connection substrate 600. Holes coupled to the boss may be formed in the connection substrate 600.

The base 120 may include a slot 121b. The groove 121b may be an adhesive receiving groove. The groove 121b may be a binder coated groove. An adhesive may be disposed in the groove 121b. The adhesive disposed in the groove 121b may fix the terminal portion 630 of the connection substrate 600 to the base 120. The groove 121b may be formed in the protruding portion 121 of the base 120. The groove 121b may be formed on an outer surface of the protruding portion 121 of the base 120. The groove 121b may include a plurality of grooves. A bonding agent coating groove may be formed in the base 120 to increase the adhesion of the connection substrate 600.

At least a portion of an adhesive for attaching the connection substrate 600 and the base 120 may be disposed in the groove 121 b. The groove 121b may be formed on an outer side surface of the base 120. The groove 121b may be formed on an outer side surface of the protruding portion 121. The groove 121b may be formed on the outer surface of the protruding portion 121 by recessing. The groove 121b may be upwardly open. With this structure, the adhesive can be injected into the groove 121b from above. The groove 121b may include: a first portion extending in an optical axis direction; and a second portion connected obliquely to the first portion.

The plurality of grooves 122, 123, 124, 126, and 127 of the base 120 may be referred to as "first to seventh grooves" to distinguish them from each other.

The base 120 may include a slot 122. The slot 122 may be a terminal receiving slot. The groove 122 may be formed on a side surface of the base 120. The terminal portion 630 of the connection substrate 600 may be disposed in the groove 122. The stroke space of the extension portion 620 of the connection substrate 600 may be determined by the recessed depth of the groove 122. The groove 122 may be formed on an outer side surface of the base 120 facing the side plate 142 of the cover member 140. The groove 122 may be formed by the protruding portion 121. In other words, the groove 122 may be formed by a step between the concave outer side surface of the protruding portion 121 and the outer side surface of the base 120. In the embodiment of the present invention, in order to secure a stroke space of the connection substrate 600, an assembling surface of the terminal portion 630 of the connection substrate 600 may be formed in the groove 122 recessed from the outer edge of the base 120.

The base 120 may include a slot 123. The groove 123 may be a damper receiving groove. The groove 123 may be formed on the upper surface of the base 120. The slot 123 may receive at least a portion of the fourth damper 940. A fourth damper 940 may be provided in the groove 123. A stopper structure is formed in the base 120 through the groove 123, and the fourth damper 940 may be disposed inside the stopper. Thereby, the loss of the fourth damper 940 can be prevented. The damper is disposed in the slot 123 and may be coupled to the extension 383 of the coupling member 380. The base 120 may be provided with a slot structure so that OIS dampers may be applied.

The base 120 may include a slot 124. The slot 124 may be a coupling member interference prevention slot. The groove 124 may be formed on the upper surface of the base 120. Slot 124 may extend from slot 123. The groove 124 may extend from the groove 123 in a direction perpendicular to the optical axis direction. The groove 124 may prevent the welding portion connecting the coupling member 380 and the wire 800 from interfering with the base 120 when the second moving part 300 moves. When the second moving part 300 moves, the groove 124 may prevent the extension part 383 of the coupling member 380 and the base 120 from interfering with each other. The groove 123 may be formed deeper than the groove 124 from the upper surface of the base 120. That is, the groove 123 as the damper accommodating groove may be recessed deeper than the groove 124 (as the coupling member interference preventing groove). Base 120 may include a relief structure to prevent interference with the welded portion of coupling member 380 with the damper spring during OIS actuation.

The base 120 may include a stepped portion 125. The stepped portion 125 may protrude from an outer side surface of the base 120. The cover member 140 may be disposed in the stepped portion 125. The side plate 142 of the cover member 140 may be disposed in the stepped portion 125. The step portion 125 may overlap with the side plate 142 of the cover member 140 in the optical axis direction.

The camera device 10 may include a sealing member. The sealing member may prevent foreign substances from entering the inside of the camera device 10. A sealing member may be disposed between the cover member 140 and the base 120. The sealing member may seal the gap between the cover member 140 and the base 120. The sealing member may be disposed between the stepped portion 125 of the base 120 and the side plate 142 of the cover member 140. At least a portion of the sealing member may be disposed in the plurality of fourth grooves 126 of the base 120 and the grooves 143 of the cover member 140.

The base 120 may include a slot 126. The groove 126 may be a seal groove. The groove 126 may be formed on a side surface of the stepped portion 125. A groove 126 may be formed on an upper surface of the stepped portion 125. The slot 126 may include a plurality of slots. The grooves 126 may be formed as five grooves on one side surface of the base 120. A seal groove structure may be applied to the base 120 to prevent foreign objects from entering the actuator. Five grooves may be formed on one side surface of the lower end portion of the base 120.

The plurality of grooves 126 of the base 120 may include a plurality of grooves provided on any one of four side surfaces of the base 120. The plurality of slots 126 of the base 120 may include a plurality of slots disposed on a first side surface of the base 120. At this time, the sum of the widths of the plurality of grooves 126 in the direction perpendicular to the optical axis direction may be 17% to 37% of the width of the first side surface of the base 120. The sum of the widths of the plurality of grooves 126 may be 22% to 32% of the width of the first side surface of the base 120 in the direction perpendicular to the optical axis direction. The sum of the widths of the plurality of grooves 126 may be 25% to 29% of the width of the first side surface of the base 120 in the direction perpendicular to the optical axis direction.

The base 120 may include a slot 127. The slot 127 may be a ground terminal interference prevention slot. The groove 127 may be recessed deeper than the thickness of the side plate 142 of the cover member 140 on the side surface of the stepped portion 125. The groove 127 may be formed at a position corresponding to the ground terminal 144 of the cover member 140.

In a modified embodiment, the slot 127 may receive at least a portion of the ground terminal 144a of the cover member 140. The slot 127 may receive at least a portion of the ground terminal 144a bent inward from the side plate 142 of the cover member 140. The ground terminal 144 may be applied to the cover member 140 so that it may be grounded to the first substrate 110. In the modified embodiment, a receiving groove capable of avoiding bending of the ground terminal 144 may be formed in the base 120.

The base 120 may include an aperture 128. The hole 128 may be formed at a position corresponding to the image sensor 330. The aperture 128 may be formed larger than the image sensor 330. The image sensor 330 may be assembled through the aperture 128 of the base 120. The image sensor assembly connected to the image sensor 330, the sensor substrate 320, the sensor base 350, the filter 360, and the plate member 370 is inserted through the hole 128 of the base 120 to be coupled to the second substrate 310.

The base 120 may include a first protruding portion 129-1. The first protruding portion 129-1 may be formed at opposite sides of the first groove 122 of the base 120. The first protruding portion 129-1 may protrude from an inner side surface of the base 120. The second substrate 310 may not overlap the first protruding portion 129-1 in the optical axis direction.

In the embodiment of the present invention, a hole for inserting the image sensor assembly is formed at the center of the base 120, and a groove 122 for disposing the terminal portion 630 of the connection substrate 600 is formed in the outer portion of the base 120. The groove 122 of the base 120 may be recessed inward to secure a stroke space of the extension portion 620, but there is a problem in that the thickness of the base 120 in a direction perpendicular to the optical axis direction may be thinned in the groove 122 portion of the base 120 due to the hole 128 in the base 120. In the embodiment of the present invention, the strength of the base 120 can be maintained by securing the thickness of the base 120 by the first protruding portion 129-1. The second protruding portion 129-2 may also protrude inward from some areas of the first protruding portion 129-1.

The base 120 may include a second protruding portion 129-2. The second protruding portion 129-2 may protrude from the first protruding portion 129-1. The second protruding portion 129-2 may further protrude from the first protruding portion 129-1. The second protruding portion 129-2 may protrude more inward than the first protruding portion 129-1. The second substrate 310 may overlap the second protruding portion 129-2 in the optical axis direction.

The camera device 10 may include a housing 130. The fixing portion 100 may include a housing 130. The housing 130 may be disposed in the base 120. The housing 130 may be disposed on the base 120. The housing 130 may be disposed above the base 120. The housing 130 may be fixed to the base 120. The housing 130 may be fixed to the cover member 140. The housing 130 may be coupled to the base 120. The housing 130 may be attached to the base 120 with an adhesive. The case 130 may be disposed on the first substrate 110. The case 130 may be disposed over the first substrate 110. The housing 130 may be formed as a separate member from the base 120. The housing 130 may be provided on the holder 340. The housing 130 may be disposed between the base 120 and the cover member 140. The housing 130 may remain fixed without moving during AF driving. During OIS actuation, the housing 130 may remain stationary and not move.

The housing 130 may include: a first side surface and a second side surface disposed opposite to each other; and third and fourth side surfaces disposed opposite each other. The wing portion 131 may be formed on each of the first and second side surfaces of the case 130. The protruding portion 132 may be formed on each of the third and fourth side surfaces of the case 130.

The housing 130 may include wing portions 131. The wing portion 131 may be disposed between the connection substrate 600 and the side plate 142 of the cover member 140. At least a portion of the terminal portion 630 of the connection substrate 600 may be disposed between the protruding portion 121 of the base 120 and the wing portion 131 of the case 130. The wing part 131 may have a wing structure. The wing portions 131 may block foreign objects from entering between the connection substrate 600 and the side plate 142 of the cover member 140. The wing portions 131 may reduce external impact applied to the side plates 142 of the cover member 140. The housing 130 may be formed of an insulating member. The wing portion 131 may be a bulkhead portion. The wing portion 131 may be a sealing portion. The wing part 131 may be a compensation part. The wing portion 131 may be an extension portion. The wing portion 131 may include a horizontally extending portion and a vertically extending portion extending downward from the horizontally extending portion. The wing portion 131 may include a first portion extending in a first direction and a second portion extending from the first portion in a second direction different from the first direction. The wing portion 131 may be spaced apart from the protruding portion 121 of the base 120. The wing portion 131 may be spaced apart from the protruding portion 121 of the base 120 within a tolerance range. Or the wing portion 131 may be in contact with the protruding portion 121 of the base 120. The wing portion 131 may be coupled to the protruding portion 121 of the base 120. The horizontal width of the upper portion of the wing portion 131 may correspond to the width of the shortest portion among the horizontal widths of the terminal portions 630 of the connection substrate 600. Or the upper horizontal width of the wing portion 131 may be longer than the horizontal width of the terminal portion 630 of the connection substrate 600. The horizontal width of the upper portion of the wing portion 131 may be shorter than the width of the shortest portion among the horizontal widths of the terminal portions 630 of the connection substrate 600. The wing portion 131 may be provided to seal only on the exposed side of the terminal portion 630.

In the sensor-moving OIS actuator using the FPCB connected to the substrate 600, a separation distance required to drive the FPCB may be required. At this time, the required separation distance may be a separation distance between the FPCB and the stopper. In other words, a separation distance susceptible to foreign matter may be generated. However, since it is difficult to apply the separation distance sealing structure, a defect that is susceptible to foreign matter may occur.

In the embodiment of the present invention, the wing portion 131, which is a wing structure lowered from the housing 130, may be interposed between the cover member 140 serving as a side stopper and the connection substrate 600. In a modified embodiment, separate spacer members may be provided instead of the wing portions 131 extending downward from the housing 130.

The sealing structure may be formed by inserting a wing structure (as a basic fixing structure) unfolded from the case 130 into a space between the connection substrate 600 and the side plate 142 of the cover member 140. Thereby, the product can be protected from external impact and introduction of foreign matter.

The base 120, the connection substrate 600, the wing portion 131 of the case 130, and the side plate 142 of the cover member 140 may be sequentially disposed in a direction perpendicular to the optical axis direction. The distance between the connection substrate 600 and the side plate 142 of the cover member 140 in the direction perpendicular to the optical axis direction may be equal to the thickness of the wing portion 131 of the case 130. The distance between the connection substrate 600 and the side plate 142 of the cover member 140 in the direction perpendicular to the optical axis direction may correspond to the thickness of the wing portion 131 of the case 130. However, in consideration of manufacturing errors, assembly tolerances, and the like, when the thickness of the wing portion 131 of the case 130 is greater than 90% of the distance between the connection substrate 600 and the side plate 142 of the cover member 140, it may be considered to be equal. Or when introduction of foreign matter can be blocked, the thickness of the wing portion 131 of the case 130 can be considered to be equal to the distance between the connection substrate 600 and the side plate 142 of the cover member 140.

The wing portion 131 of the housing 130 may include a groove 131a. The third substrate 470 may be disposed in the groove 131a. The groove 131a may be formed in a shape corresponding to the third substrate 470.

In a modified embodiment, the wing portion 131 of the housing 130 may be omitted. In this case, a spacer member may be provided instead of the function of the wing portion 131 of the housing 130. The spacing member may be a space. The spacing member may be a spacing member. The spacing member may be a sealing member. The spacing member may be a compensating member. The spacing member may be disposed between the connection substrate 600 and the side plate 142 of the cover member 140. The space between the base 120 and the cover member 140 may be sealed by the wing portions 131 or the interval member.

The housing 130 may include a protruding portion 132. The protruding portion 132 may protrude outward from the housing 130. The protruding portion 132 may protrude outward from each of the third and fourth side surfaces of the case 130. The protruding portion 132 may be in contact with the cover member 140. The protruding portion 132 may be fixed to the cover member 140. The protruding portion 132 may provide an assembly guide for the cover member 140. By the protruding portion 132, a stroke space in which the extension portion 620 of the connection portion material 600 moves can be ensured.

The housing 130 may include a hole 133. The protruding portion 121 of the base 120 may be inserted into the hole 133. The hole 133 may be formed adjacent to the wing portion 131. The hole 133 may be formed to penetrate the housing 130 in the optical axis direction.

The housing 130 may include an aperture 134. The aperture 134 may be a wire passing aperture. The wire 800 may be disposed in the bore 134. The wire 800 may be passed through the aperture 134. The wire 800 may pass through the through-hole 134. The hole 134 may be formed to have a larger diameter than the wire 800 so as not to interfere with the wire 800.

The housing 130 may include a slot 135. The groove 135 may be formed on the upper surface of the housing 130. The groove 135 may be formed in a corner region of the upper surface of the case 130. The groove 135 may be formed to be spaced apart from an outer side surface of the case 130. The slot 135 may be disposed adjacent to the aperture 134. The damper may be disposed in the slot 135.

The housing 130 may include a stop 136. The stopper 136 may be formed between an outer side surface of the housing 130 and the groove 135 of the housing 130 through the groove 135 of the housing 130. The blocking member 136 may prevent the first damper 910 provided inside the blocking member 136 from leaking to the outside.

The bore 134 of the housing 130 may include a chamfer. The hole 134 may prevent the wire 800 from passing through the chamfer. The hole 134 of the housing 130 may include a first chamfer 134a whose width in a direction perpendicular to the optical axis increases as it moves upward. The hole 134 of the housing 130 may include a second chamfer 134b, which second chamfer 134b is disposed below the first chamfer 134a and whose width in a direction perpendicular to the optical axis increases as it moves downward. The length of the second chamfer 134b in the optical axis direction may be longer than the length of the first chamfer 134a in the optical axis direction. The length of the second chamfer 134b in the optical axis direction may be different from the length of the first chamfer 134a in the optical axis direction. The first damper 910 may be disposed from the first chamfer 134a to the second chamfer 134 b. The chamfer shape of the hole 134 may be formed in a stepped shape. The aperture 134 may include a stepped shape.

The camera device 10 may include a cover member 140. The fixing portion 100 may include a cover member 140. The cover member 140 may be disposed in the base 120. The cover member 140 may be disposed on the base 120. The cover member 140 may be fixed to the base 120. The cover member 140 may be coupled to the base 120. The cover member 140 may be coupled to the housing 130. The cover member 140 may be coupled to the first substrate 110. The cover member 140 may be fixed to the base 120. The cover member 140 may be fixed to the housing 130. The cover member 140 may be fixed to the first substrate 110. The cover member 140 may cover at least a portion of the base 120. The cover member 140 may cover at least a portion of the housing 130. The cover member 140 may accommodate the case 130 therein.

The cover member 140 may be a "cover box" or a "shield box". The cover member 140 may be formed of a metal material. The cover member 140 may block electromagnetic interference (EMI). The cover member 140 may be electrically connected to the first substrate 110. The cover member 140 may be grounded to the first substrate 110.

The cover member 140 may include an upper plate 141. The cover member 140 may include a hole formed in the upper plate 141. Holes may be formed at positions corresponding to the lenses 220. The cover member 140 may include a side plate 142. The side plate 142 may include a plurality of side plates. The side plate 142 may include four side plates. The side plate 142 may include first to fourth side plates. The side plate 142 may include first and second side plates disposed opposite to each other and third and fourth side plates disposed opposite to each other. The cover member 140 may include a plurality of corners between the plurality of side plates.

The cover member 140 may include a slot 143. The groove 143 may be a sealing member arrangement groove. The sealing member may be disposed in the groove 143. The groove 143 may be formed in the side plate 142 of the cover member 140. Slot 143 may be connected to slot 126 of base 120. The slot 143 may be connected to one or more of the plurality of slots 126 of the base 120. The slot 143 may be provided at a position corresponding to the slot 126 of the base 120. A groove 143 may be formed at a lower end of the side plate 142 of the cover member 140. The slot 143 may include a plurality of slots. The slots 143 may be formed in a smaller number than the slots 126 of the base 120. In a modified embodiment, the grooves 143 may be formed in the same number as the grooves 126 of the base 120.

The cover member 140 may include a ground terminal 144. The ground terminal 144 may extend downward from the side plate 142. The ground terminal 144 may be coupled to the first substrate 110. The ground terminal 144 may be connected to the first substrate 110. The ground terminal 144 may be electrically connected to the first substrate 110. The ground terminal 144 may be coupled to the first substrate 110 by a conductive member. The ground terminal 144 may be soldered to a terminal of the first substrate 110. The cover member 140 may be electrically connected to the first substrate 110. The cover member 140 may be grounded to the first substrate 110.

The ground terminal 144 of the cover member 140 may be disposed at a position corresponding to the slot 127 of the base 120. Or in a modified embodiment, the ground terminal 144a may be curved. The ground terminal 144a may be bent inward. At least a portion of the ground terminal 144a may be bent inward and disposed in the slot 127 of the base 120.

Throughout the specification, the cover member 140 is described as a component of the fixing portion 100, but the cover member 140 may be understood as a component separate from the fixing portion 100. The cover member 140 may be combined with the fixing portion 100. The cover member 140 may cover the first moving part 200.

The camera device 10 may include a control unit. The control unit may be disposed in the first substrate 110. The control unit may be disposed adjacent to the cover member 140. The control unit may comprise a single shielding cage which may be smaller than the cover member 140. The control unit may include a driver IC. The control unit may control the operation of the camera apparatus 10.

The camera apparatus 10 may include a first moving part 200. The first moving part 200 can move with respect to the fixed part 100. The first moving portion 200 is movable in the optical axis direction with respect to the fixed portion 100. The first moving part 200 may be disposed inside the fixed part 100. The first moving part 200 may be movably disposed inside the fixed part 100. The first moving portion 200 may be provided inside the fixed portion 100 so as to be movable in the optical axis direction. When the first moving part 200 moves in the optical axis direction with respect to the fixed part 100, an Auto Focus (AF) function may be performed. The first moving part 200 may be disposed on the second moving part 300.

The camera device 10 may include a coil former 210. The first moving part 200 may include a bobbin 210. The bobbin 210 may be disposed on the first substrate 110. The bobbin 210 may be disposed above the first substrate 110. The bobbin 210 may be disposed to be spaced apart above the first substrate 110. The bobbin 210 may be disposed inside the housing 130. The bobbin 210 may be disposed inside the housing 130. At least a portion of the bobbin 210 may be accommodated in the case 130. The bobbin 210 may be movably disposed in the housing 130. The bobbin 210 may be movably disposed in the housing 130 to be movable in the optical axis direction. The bobbin 210 may be coupled with a lens 220. The coil former 210 may be hollow or include holes. The lens 220 may be disposed in a hollow or hole of the bobbin 210. The outer circumferential surface of the lens 220 may be coupled to the inner circumferential surface of the bobbin 210.

The camera device 10 may include a lens 220. The first moving part 200 may include a lens 220. Lens 220 may be coupled to bobbin 210. The lens 220 may be fixed to the bobbin 210. The lens 220 may be integrally moved with the bobbin 210. Lens 220 may be threadably coupled to coil form 210. The lens 220 may be attached to the bobbin 210 using an adhesive. The lens 220 may be disposed at a position corresponding to the image sensor 330. The optical axis of lens 220 may coincide with the optical axis of image sensor 330. The optical axis may be the z-axis. Lens 220 may include a plurality of lenses. Lens 220 may comprise a five-element or six-element lens.

The camera device 10 may include a lens module. The lens module may be coupled to the bobbin 210. The lens module may include a lens barrel and one or more lenses 220 disposed inside the lens barrel.

The bobbin 210 may include a protrusion 211 protruding from an inner circumferential surface of the bobbin 210. The lens 220 may include a groove 221 formed on an outer circumferential surface of the lens 220. The groove 221 of the lens 220 may include a first groove 221a extending from a lower surface of the lens 220 in the optical axis direction. The groove 221 of the lens 220 may include a second groove 221b extending from the first groove 221a in a direction perpendicular to the optical axis and spaced apart from a lower end of the first groove 221a. At least a portion of the protrusion 211 of the bobbin 210 may be disposed in the second groove 221b of the lens 220.

The coil former 210 may include a slot 212. The slot 212 may be formed on the upper surface of the bobbin 210. The slot 212 may be a damper box. The slot 212 may be described as being formed such that a portion of the upper surface of the bobbin 210 is concave. Or the slot 212 may be described as the remainder of the protrusion of a portion of the upper surface of the bobbin 210. The damper may be disposed in the slot 212. The slot 212 may include a side surface that is a curved surface surrounding the damper.

The bobbin 210 may include a protrusion 213. The protrusion 213 may be formed on the upper surface of the bobbin 210. The protrusion 213 may protrude from the upper surface of the bobbin 210. The protrusion 213 may protrude from one surface of the bobbin 210. The protrusion 213 may protrude upward from the bobbin 210. The third damper 930 may be applied to the protrusion 213.

The bobbin 210 may include a sensing magnet mounting portion 214. The sensing magnet mounting portion 214 may protrude from an outer circumferential surface of the bobbin 210. The sensing magnet mounting portion 214 may protrude from an outer side surface of the bobbin 210. The induction magnet mounting part 214 may protrude more from the outer circumferential surface of the bobbin 210 than the AF coil 430. The sensing magnet 450 may be disposed in the sensing magnet mounting portion 214. The sensing magnet mounting portion 214 may include a slot. At least a portion of the sensing magnet 450 may be disposed in a slot of the sensing magnet mounting portion 214. The sensing magnet 450 may be fixed to the sensing magnet mounting portion 214 with an adhesive.

The bobbin 210 may include a correction magnet mounting portion 215. The correction magnet mounting portion 215 may protrude from the outer circumferential surface of the bobbin 210. The correction magnet mounting portion 215 may protrude from an outer side surface of the bobbin 210. The correction magnet mounting portion 215 may protrude more from the outer circumferential surface of the bobbin 210 than the AF coil 430. The correction magnet 460 may be provided in the correction magnet mounting portion 215. The correction magnet mounting portion 215 may include a groove. At least a portion of the correction magnet 460 may be disposed in a slot of the correction magnet mounting portion 215. The correction magnet 460 may be fixed to the correction magnet mounting portion 215 using an adhesive.

The lens 220 may be inserted from the upper side of the bobbin 210. At this time, the protrusion 211 of the bobbin 210 may pass through the first groove 221a of the lens 220. When the protrusion 211 of the bobbin 210 is caught at the upper end of the first groove 221a of the lens 220, the lens 220 can rotate with respect to the bobbin 210. At this time, the protrusion 211 of the bobbin 210 may be inserted into the second groove 221b of the lens 220. When the protrusion 211 of the bobbin 210 is inserted into the second groove 221b of the lens 220, the movement of the lens 220 with respect to the bobbin 210 in the optical axis direction is restricted. The lens 220 may be fixed to the bobbin 210 using an adhesive.

In the embodiment of the present invention, the protrusion 211 is formed in the bobbin 210 and the groove 221 is formed in the lens 220, but in a modified embodiment, the bobbin 210 may include the groove and the lens 220 may include the protrusion coupled to the groove of the bobbin 210.

The camera apparatus 10 may include a second moving part 300. The second moving part 300 can move with respect to the fixed part 100. The second moving part 300 may move in a direction perpendicular to the optical axis direction based on the fixed part 100. The second moving part 300 may be disposed inside the fixed part 100. The second moving part 300 may be movably disposed within the fixed part 100. The second moving part 300 may be movably disposed inside the fixed part 100 in a direction perpendicular to the optical axis direction. The image stabilization (OIS) function may be performed by the second moving part 300 moving in a direction perpendicular to the optical axis direction with respect to the fixed part 100. The second moving part 300 may be disposed between the first moving part 200 and the first substrate 110.

The camera device 10 may include a second substrate 310. The second moving part 300 may include a second substrate 310. The second substrate 310 may be a substrate. The second substrate 310 may be a Printed Circuit Board (PCB). The second substrate 310 may be spaced apart from the first substrate 110. The second substrate 310 may be disposed between the first moving part 200 and the first substrate 110. The second substrate 310 may be disposed between the bobbin 210 and the first substrate 110. The second substrate 310 may be disposed between the lens 220 and the first substrate 110. The second substrate 310 may be spaced apart from the fixing portion 100. The second substrate 310 may be spaced apart from the fixing portion 100 in the optical axis direction and in a direction perpendicular to the optical axis direction. The second substrate 310 may move in a direction perpendicular to the optical axis. The second substrate 310 may be electrically connected to the image sensor 330. The second substrate 310 may move integrally with the image sensor 330. The second substrate 310 may include a hole. The image sensor 330 may be disposed in the hole of the second substrate 310. The second substrate 310 may be coupled to an upper surface of the sensor substrate 320. The second substrate 310 may be disposed on an upper surface of the sensor substrate 320. The second substrate 310 may be fixed to an upper surface of the sensor substrate 320. The second substrate 310 may be spaced apart from the housing 130. The second substrate 310 may be disposed in the holder 340.

The second substrate 310 may include a terminal 311. The terminal 311 may be disposed on a lower surface of the second substrate 310. The terminal 311 may be coupled with a terminal 321 of the sensor substrate 320. The second substrate 310 may be formed separately from the sensor substrate 320. The second substrate 310 may be separately formed and coupled with the sensor substrate 320. The terminal 321 of the sensor substrate 320 may be soldered to the terminal 311 of the second substrate 310.

The camera device 10 may include a sensor substrate 320. The second moving part 300 may include a sensor substrate 320. The sensor substrate 320 may be a substrate. The sensor substrate 320 may be a Printed Circuit Board (PCB). The sensor substrate 320 may be coupled with the image sensor 330. The sensor substrate 320 may be coupled to the second substrate 310.

The sensor substrate 320 may include holes. The holes may be hollow. The image sensor 330 may be disposed in a hole of the sensor substrate 320. A portion of the plate member 370 may be disposed in the hole of the sensor substrate 320. The protruding portion 374 of the plate member 370 may be disposed in a hole of the sensor substrate 320. The aperture of the sensor substrate 320 may be formed in a size and shape corresponding to the protruding portion 374 of the plate member 370.

The sensor substrate 320 may include terminals 321. The terminal 321 of the sensor substrate 320 may be coupled to the terminal 311 of the second substrate 310. The sensor substrate 320 may be coupled to a lower surface of the second substrate 310. The sensor substrate 320 may be disposed under the second substrate 310. The sensor substrate 320 may be coupled under the second substrate 310 using the image sensor 330 coupled thereto.

The camera device 10 may include an image sensor 330. The second moving part 300 may include an image sensor 330. The image sensor 330 may be disposed in the sensor substrate 320. The image sensor 330 may be disposed between the sensor substrate 320 and the sensor base 350. The image sensor 330 may be disposed inside the base 120. The image sensor 330 may be electrically connected to the second substrate 310. The image sensor 330 may move integrally with the second substrate 310. The image sensor 330 may be disposed under the lens 220. The image sensor 330 may be disposed in the plate member 370 and electrically connected to the sensor substrate 320 through wire bonding. The image sensor 330 may be movably disposed. The image sensor 330 may be movable in a direction perpendicular to the optical axis. The image sensor 330 may rotate about the optical axis.

Light passing through the lens 220 and the filter 360 may be incident on the image sensor 330 to form an image. The image sensor 330 may be electrically connected to the sensor substrate 320, the second substrate 310, and the first substrate 110. The image sensor 330 may include an effective image area. The image sensor 330 may convert light irradiated to an effective image area into an electrical signal. The image sensor 330 may include one or more of a Charge Coupled Device (CCD), a Metal Oxide Semiconductor (MOS), a CPD, and a CID.

The camera device 10 may include a holder 340. The second moving part 300 may include a holder 340. The holder 340 may be formed of an insulating material. The holder 340 may be disposed in the second substrate 310. The holder 340 may be disposed on the second substrate 310. The holder 340 is disposed above the second substrate 310. The holder 340 may be fixed to the second substrate 310. The holder 340 may be coupled to the second substrate 310. The holder 340 may include a hollow or a hole in which the image sensor 330 is disposed. OIS coil 440 may be disposed in holder 340. The holder 340 may include a protrusion around which the OIS coil 440 is wound. The retainer 340 may include an aperture in which the sensor 445 is disposed. The retainer 340 may be spaced apart from the housing 130. The holder 340 may be moved in a direction perpendicular to the optical axis or rotated around the optical axis by the interaction of the driving magnet and OIS coil 440 with the image sensor 330. The holder 340 is a member in which the OIS coil 440 is disposed and may be a coil holder.

The connection substrate 600 may be disposed in the holder 340. The connection substrate 600 may be connected to the holder 340. The connection substrate 600 may be fixed to the holder 340. The connection substrate 600 may be coupled to the holder 340. The connection substrate 600 may be attached to the holder 340. The connection substrate 600 may be fixed to the holder 340 using an adhesive. The connection substrate 600 may be in contact with the holder 340.

The retainer 340 may include a protruding portion 341. The protruding portion 341 may protrude from the upper surface of the holder 340. The protruding portion 341 may protrude upward from an outer side surface of the holder 340. The connection substrate 600 may be disposed in the protruding portion 341 of the holder 340. The connection substrate 600 may be connected to the protruding portion 341 of the holder 340. The connection substrate 600 may be fixed to the protruding portion 341 of the holder 340. The connection substrate 600 may be coupled to the protruding portion 341 of the holder 340. The connection substrate 600 may be attached to the protruding portion 341 of the holder 340. The connection substrate 600 may be fixed to the protruding portion 341 of the holder 340 using an adhesive. The connection substrate 600 may be in contact with the protruding portion 341 of the holder 340.

The retainer 340 may include a protrusion 342. The protrusion 342 may protrude from an upper surface of the holder 340. The protrusion 342 may be disposed inside the OIS coil 440. The protrusion 342 may protrude above the OIS coil 440. OIS coil 440 may be provided by wrapping around protrusion 342 of holder 340.

The protrusion 342 of the holder 340 may overlap with the driving magnet in the optical axis direction. The OIS coil 440 may overlap with the driving magnet in the optical axis direction. The distance between the OIS coil 440 and the driving magnet in the optical axis direction may be longer than the distance between the protrusion 342 of the holder 340 and the driving magnet in the optical axis direction. When the holder 340 moves upward, the protrusion 342 of the holder 340 may contact the driving magnet. At this time, the OIS coil 440 may be spaced apart from the driving magnet. That is, the retainer 340 and the protrusion 342 are in contact with the driving magnet before the OIS coil 440 is in contact therewith, thereby preventing the OIS coil 440 from being in contact with the driving magnet.

The protrusion 342 may include a plurality of protrusions. The protrusions 342 may be formed to correspond to the number of OIS coils 440. The protrusion 342 may include first to fourth protrusions corresponding to the 1 st-1 st coil 441-1, the 1 st-2 nd coil 441-2, the 2 nd-1 coil 442-1, and the 2 nd-2 coil 442-2. At this time, each of the first to fourth protrusions of the holder 340 may include four protrusions spaced apart from each other. That is, four protrusions may be provided inside each of the 1 st-1 st coil 441-1, the 1 st-2 nd coil 441-2, the 2 nd-1 coil 442-1, and the 2 nd-2 coil 442-2, respectively. Four protrusions may be arranged in a row.

The retainer 340 may include a first stop portion 343. The first stop portion 343 may be a lateral stop. The first stopper 343 may protrude outward from the extension 620 of the connection substrate 600. The distance between the extension portion 620 of the connection substrate 600 and the cover member 140 may be longer than the distance between the first stop portion 343 of the holder 340 and the cover member 140 in the direction perpendicular to the optical axis. The first stop portion 343 may be disposed on a side surface of the holder 340 closer to a corner of the holder 340 than a center of the side surface of the holder 340.

The retainer 340 may include a second stop portion 344. The second stop portion 344 may be a lower stop. The second stopper 344 may contact the base 120 when the holder 340 moves downward. The second stopper 344 may protrude below the coupling protrusion 345.

The holder 340 may include a coupling protrusion 345. The coupling protrusion 345 may protrude from the lower surface of the holder 340. The coupling protrusion 345 may be coupled with the coupling member 380. The coupling protrusion 345 may be coupled to the hole of the coupling member 380. Coupling protrusion 345 may be inserted into a hole of coupling member 380. In a modified embodiment, the coupling protrusion 345 may be replaced with a groove. That is, instead of the coupling protrusion 345, a groove may be formed at a corresponding position. In this case, an adhesive may be provided in the groove of the holder 340 to fix the coupling protrusion 345.

The retainer 340 may include a protruding portion 346. The protruding portion 346 may include two protruding portions 346 protruding more downward than the second substrate 310. The connection portion 610 of the connection substrate 600 may be disposed between the two protruding portions 346. The protruding portion 346 of the retainer 340 may protrude more downward than the second stopper portion 344.

The retainer 340 may include a hole 347. The aperture 347 may be a sensor relief aperture. A sensor 445 may be disposed in the aperture 347. At least a portion of the sensor 445 may be disposed in the aperture 347 of the retainer 340.

Retainer 340 may include a slot 348. The groove 348 may be formed on an outer circumferential surface of the holder 340. The slot 348 may be formed by recessing from the outside surface of the retainer 340. A groove 348 may be formed between the protruding portion 341 and the first stopping portion 343. The groove 348 may be formed between the connection substrate 600 and the first stopper 343. The groove 348 prevents the bending portion of the connection substrate 600 from interfering with the holder 340.

At least a portion of the connection portion 610 and the extension portion 620 of the connection substrate 600 may be disposed in the protruding portion 341 of the holder 340. At least a portion of the connection portion 610 and the extension portion 620 of the connection substrate 600 may be connected to the protruding portion 341 of the holder 340. At least a portion of the connection portion 610 and the extension portion 620 of the connection substrate 600 may be fixed to the protruding portion 341 of the holder 340. At least a portion of the connection portion 610 and the extension portion 620 of the connection substrate 600 may be coupled to the protruding portion 341 of the holder 340. At least a portion of the connection portion 610 and the extension portion 620 of the connection substrate 600 may be attached to the protruding portion 341 of the holder 340. At least a portion of the connection portion 610 and the extension portion 620 of the connection substrate 600 may be fixed to the protruding portion 341 of the holder 340 using an adhesive. At least a portion of the connection portion 610 and the extension portion 620 of the connection substrate 600 may be in contact with the protruding portion 341 of the holder 340.

The retainer 340 may include a hole. The wire 800 may pass through the hole of the holder 340. The hole of the holder 340 may be formed to have a larger diameter than the wire 800 so that the holder 340 does not interfere with the wire 800 when the holder 340 moves. The damper may be disposed in the hole of the holder 340.

The retainer 340 may include a slot. The slot may be an adhesive receiving slot. At least a portion of the adhesive attaching the connection substrate 600 and the holder 340 may be disposed in the groove. The groove may be formed on an outer side surface of the holder 340. A groove may be formed on an outer side surface of the protruding portion 341. The groove may be formed by recessing on the outer surface of the protruding portion 341. The upper side of the slot may be open. With this structure, the adhesive can be injected into the groove from above. The slot may comprise a plurality of slots. The slot may include a step 342a. The portion from the connection substrate 600 to the portion fixed to the holder 340 may be referred to as a connection portion 610.

The retainer 340 may include a slot. A groove may be formed on the lower surface of the holder 340. The groove may be recessed from the lower surface of the retainer 340. The groove may be provided at a position corresponding to the bent portion of the connection portion 610 of the connection substrate 600. The groove may be disposed adjacent to the bent portion of the connection portion 610 of the connection substrate 600. An adhesive may be disposed in the slot.

The retainer 340 may include a slot. The groove may be recessed from the outer circumferential surface of the retainer 340. The groove may be provided at one side of the protruding portion 341. Grooves may be formed to prevent interference with the connection substrate 600.

The camera device 10 may include a sensor base 350. The second moving part 300 may include a sensor base 350. The sensor base 350 may be disposed in the sensor substrate 320. The sensor base 350 may include holes formed at positions corresponding to the image sensor 330. The sensor base 350 may include a slot in which the optical filter 360 is disposed.

The camera device 10 may include an optical filter 360. The second moving part 300 may include a filter 360. The optical filter 360 may be disposed between the lens 220 and the image sensor 330. The optical filter 360 may be disposed in the sensor base 350. The filter 360 may block light having a specific frequency band among the light passing through the lens 220 from entering the image sensor 330. The filter 360 may include an infrared blocking filter. The filter 360 may block infrared rays from being incident on the image sensor 330.

The camera device 10 may include a plate member 370. The second moving part 300 may include a plate member 370. The plate member 370 may be SUS. The plate member 370 may be formed of SUS. The plate member 370 may be formed of a copper alloy. The plate member 370 may include copper. The plate member 370 may be a reinforcing plate. The plate member 370 may be a stiffener. The plate member 370 may be coupled to a lower surface of the sensor substrate 320. The plate member 370 may be disposed on a lower surface of the sensor substrate 320. The plate member 370 may be in contact with the lower surface of the sensor substrate 320. The plate member 370 may be fixed to the lower surface of the sensor substrate 320. The plate member 370 may be attached to the lower surface of the sensor substrate 320 using an adhesive.

In an embodiment of the present invention, the image sensor 330 may be directly disposed in the plate member 370. Meanwhile, the plate member 370 may manage flatness more easily than the sensor substrate 320. Thereby, the flatness of the mounting surface of the image sensor 330 can be easily managed. The image sensor 330 may be electrically connected to the sensor substrate 320 through wire bonding. The image sensor 330 may be electrically connected to the sensor substrate 320.

The plate member 370 may include a protruding portion 374. The protruding portion 374 may protrude from the upper surface of the plate member 370. At least a portion of the protruding portion 374 may be disposed in the aperture of the sensor substrate 320. The protruding portion 374 of the plate member 370 may overlap the sensor substrate 320 in a direction perpendicular to the optical axis direction. The image sensor 330 may be disposed in the protruding portion 374 of the plate member 370. The image sensor 330 may be disposed on the protruding portion 374 of the plate member 370. The image sensor 330 may be in contact with the protruding portion 374 of the plate member 370. The image sensor 330 may be fixed to the protruding portion 374 of the plate member 370. The image sensor 330 may be attached to the protruding portion 374 of the plate member 370 using an adhesive.

The plate member 370 may include a support region. The support region may be coupled with the sensor substrate 320. The support region may be a support portion. The support region may be disposed outside of the protruding portion 374. The support region may form an edge. The protruding portion 374 may protrude from the support region. The thickness of the protruding portion 374 may be less than the thickness of the sensor substrate 320. At this time, the thickness of the protruding portion 374 may be a thickness from the upper surface of the support region to the upper surface of the protruding portion 374. That is, the thickness from the upper surface of the support region to the upper surface of the protruding portion 374 may be less than the thickness of the sensor substrate 320.

The upper surface of the image sensor 330 disposed in the plate member 370 may be disposed at the same height as the upper surface of the sensor substrate 320. The thickness of the image sensor 330 may be thinner than the thickness of the sensor substrate 320. The height of the seating surface of the image sensor 330 of the plate member 370 may be lower than the height of the upper surface of the sensor substrate 320.

Camera device 10 may include a coupling member 380. The second moving part 300 may include a coupling member 380. Coupling member 380 may be disposed in holder 340. Coupling member 380 may be coupled to wire 800. Coupling member 380 may be connected to wire 800 by welding. Coupling member 380 may be formed of metal. Coupling member 380 may include an aperture for passage of wire 800. Coupling member 380 may include shock absorbing portions to mitigate shock. Coupling member 380 may include a shape that is bent multiple times. Coupling member 380 may include a plurality of terminals. Coupling member 380 may include four terminals disposed in four corner regions of retainer 340. Coupling member 380 may be a metal plate. Coupling member 380 may be formed of metal. Coupling member 380 may be a plate. Coupling member 380 may be a terminal member. Coupling member 380 may be a terminal.

Coupling member 380 may include apertures 381. Coupling member 380 may include an aperture 381 in which wire 800 is disposed. Coupling member 380 may include an aperture 381 for passage of wire 800. The diameter of the hole 381 of the coupling member 380 may be different from the diameter of the hole 714a of the upper elastic member 710. The diameter of the hole 381 of the coupling member 380 (see D1 of fig. 13) may be greater than the diameter of the hole 714a of the upper elastic member 710 (see D2 of fig. 13). Thereby, the assembly concentricity of the wire 800 can be improved. Further, operability in coupling the wire 800 to the upper elastic member 710 and the coupling member 380 can be improved. In a modified embodiment, the diameter of the hole 381 of the coupling member 380 may be smaller than the diameter of the hole 714a of the upper elastic member 710.

Coupling member 380 may include apertures 382. The hole 382 may be formed in a portion of the circumference of the portion coupled to the wire 800. The aperture 382 may be configured to prevent the wire 800 from breaking.

Coupling member 380 may include coupling portion 380a. Coupling portion 380a may be coupled to wire 800. Coupling portion 380a may be coupled to retainer 340.

Coupling member 380 may include an extension 383. Extension 383 may extend from coupling portion 380a toward slot 123 of base 120. Extension 383 may form an obtuse angle with coupling portion 380 a. Or extension 383 may form a right angle with coupling portion 380 a. Or extension 383 may form an acute angle with coupling portion 380 a. Extension 383 may extend from coupling portion 380 a. Extension 383 may extend in a direction different from the arrangement direction of coupling portion 380 a. The extension 383 may be bent and extended. A fourth damper 940 provided in the base 120 may be connected to the extension 383.

In a modified embodiment, coupling member 380 may be omitted. For example, the lower end of the wire 800 may be coupled to the base 120. The base 120 may include surface electrodes for coupling to the leads 800. The lower end of the wire 800 may be soldered to the surface electrode of the base 120.

The camera apparatus 10 may include a driving unit. The driving unit may move the moving parts 200 and 300 with respect to the fixed part 100. The driving unit may perform an Auto Focus (AF) function. The driving unit may perform an image stabilization (OIS) function. The driving unit may move the lens 220. The driving unit may move the image sensor 330. The driving unit may include a magnet and a coil. The drive unit may comprise a Shape Memory Alloy (SMA).

The drive unit may comprise a drive magnet. The drive magnet may be disposed in the housing. The drive magnet may comprise a plurality of magnets. The driving magnets may include a first magnet 401, a second magnet 402, a third magnet 403, and a fourth magnet 404. The driving magnet may include a first magnet 401 and a second magnet 402 disposed at opposite sides to each other. The driving magnet may include a third magnet 403 and a fourth magnet 404 disposed opposite to each other.

The distance between the first magnet 401 and the third magnet 403 may be different from the distance between the first magnet 401 and the fourth magnet 404. The distance between the first magnet 401 and the third magnet 403 may be greater than the distance between the first magnet 401 and the fourth magnet 404. The distance between the second magnet 402 and the fourth magnet 404 may be different from the distance between the second magnet 401 and the third magnet 403. The distance between the second magnet 402 and the fourth magnet 404 may be greater than the distance between the second magnet 401 and the third magnet 403. In a modified embodiment, the distance between the first magnet 401 and the third magnet 403 may be shorter than the distance between the first magnet 401 and the fourth magnet 404. The distance between the second magnet 402 and the fourth magnet 404 may be shorter than the distance between the second magnet 401 and the third magnet 403.

The sensing magnet 450 may be disposed between the first magnet 401 and the third magnet 403. The sensing magnet 450 may overlap with the first magnet 401 and the third magnet 403 in a direction perpendicular to the optical axis. The sensing magnet 450 may overlap with the first magnet 401 in a direction perpendicular to the optical axis. The sensing magnet 450 may overlap with the third magnet 403 in a direction perpendicular to the optical axis. The sensing magnet 450 may overlap the first magnet 401 and the third magnet 403 in a first direction perpendicular to the optical axis direction. The sensing magnet 450 may be disposed on a virtual straight line connecting the first magnet 401 and the third magnet 403.

The sensing magnet 450 may overlap with the third magnet 403 in a direction perpendicular to the inner surface of the first magnet 401. The sensing magnet 450 may overlap with the first magnet 401 in a direction perpendicular to the inner surface of the first magnet 401.

The correction magnet 460 may be disposed between the second magnet 402 and the fourth magnet 404. The correction magnet 460 may overlap the second magnet 402 and the fourth magnet 404 in a direction perpendicular to the optical axis direction. The correction magnet 460 may overlap the second magnet 402 in a direction perpendicular to the optical axis direction. The correction magnet 460 may overlap with the fourth magnet 404 in a direction perpendicular to the optical axis direction. The correction magnet 460 may overlap the second magnet 402 and the fourth magnet 404 in a first direction perpendicular to the optical axis direction. The correction magnet 460 may be disposed on an imaginary straight line connecting the second magnet 402 and the fourth magnet 404.

The correction magnet 460 may overlap with the fourth magnet 404 in a direction perpendicular to the inner surface of the second magnet 402. The correction magnet 460 may overlap the second magnet 402 in a direction perpendicular to the inner surface of the second magnet 402.

Each of the first to fourth magnets 401, 402, 403, and 404 may include an AF magnet 410 disposed corresponding to the position of the AF coil 430. Each of the first to fourth magnets 401, 402, 403, and 404 may include an OIS magnet 420 disposed at a position corresponding to the OIS coil 440.

Each of the first to fourth magnets 401, 402, 403, and 404 may include a first width, which is a length between the inner surface and the outer surface, and a second width, which is a length between the two side surfaces. The first width of the first magnet 401 and the first width of the third magnet 403 may be the same. The first width of the second magnet 402 and the first width of the fourth magnet 404 may be the same. The first width of the first magnet 401 and the first width of the second magnet 403 may be the same. The first to fourth magnets 401, 402, 403, and 404 may each have the same first width, which is a length between the inner surface and the outer surface.

The second width of the first magnet 401 may be different from the second width of the third magnet 403. The second width (see W1 in fig. 38) of the first magnet 401 may be longer than the second width (see W2 in fig. 38) of the third magnet 403. The second width of the second magnet 402 may be longer than the second width of the fourth magnet 404. In a modified embodiment, the second width of the first magnet 401 may be shorter than the second width of the third magnet 403. The second width of the second magnet 402 may be shorter than the second width of the fourth magnet 404.

The second width of the first magnet 401 may be greater than the width of the 1 st-1 coil 441-1 in the corresponding direction. The second width of the third magnet 403 may be equal to or smaller than the width of the second coil 442-1 in the corresponding direction. As another example, the second width of the first magnet 401 is greater than the width of the first coil 441 in the corresponding direction by a first length, and when the second width of the third magnet 403 is greater than the width of the 2-1 coil 442-1 in the corresponding direction by a second length, the first length may be greater than the second length. That is, the first magnet 401 may be larger than the third magnet 403 with a larger difference when compared to the corresponding coil.

The housing 130 may include first and second corners disposed at opposite sides to each other, and third and fourth corners disposed at opposite sides to each other. The first magnet 401 may be disposed between the first corner and the fourth corner of the case 130. The first magnet 401 may be disposed closer to the first corner of the housing 130 than the fourth corner. The second magnet 402 may be disposed between the second corner and the third corner of the housing 130. The second magnet 402 may be disposed closer to the second corner of the housing 130 than the third corner. The third magnet 403 may be disposed between the third corner and the first corner of the housing 130. The third magnet 403 may be disposed closer to a third corner of the housing 130 than the first corner. The fourth magnet 404 may be disposed between the second corner and the fourth corner of the housing 130. The fourth magnet 404 may be disposed closer to the fourth corner of the housing 130 than the second corner.

The distance between the first magnet 401 and the fourth corner may be different from the distance between the third magnet 403 and the first corner. The distance between the first magnet 401 and the fourth corner may be shorter than the distance between the third magnet 403 and the first corner. The distance between the first magnet 401 and the first corner may be the same as the distance between the third magnet 403 and the third corner. In a modified embodiment, the distance between the first magnet 401 and the fourth corner may be longer than the distance between the third magnet 403 and the first corner.

The distance between the second magnet 402 and the third corner may be different than the distance between the fourth magnet 404 and the second corner. The distance between the second magnet 402 and the third corner may be shorter than the distance between the fourth magnet 404 and the second corner. The distance between the second magnet 402 and the second corner may be the same as the distance between the fourth magnet 404 and the third corner. In a modified embodiment, the distance between the first magnet 401 and the fourth corner may be longer than the distance between the third magnet 403 and the first corner.

OIS coil 440 may include: 1 st-1 st coil 441-1 corresponding to first magnet 401; 1-2 st coil 441-2 corresponding to second magnet 402; a 2-1 nd coil 442-1 corresponding to the third magnet 403; and a 2-2 nd coil 442-2 corresponding to the fourth magnet 404. The 1-1 st coil 441-1, the 1-2 nd coil 441-2, the 2-1 st coil 442-1, and the 2-2 nd coil 442-2 may be formed to be the same size. The 1-1 st coil 441-1, the 1-2 nd coil 441-2, the 2-1 st coil 442-1, and the 2-2 nd coil 442-2 may be wound with the same number of turns.

The camera apparatus 10 may include an AF driving unit. The AF driving unit may be an auto-focus driving unit. The AF driving unit may be a driving unit for auto-focus driving. The AF driving unit may move the first moving part 200 in the optical axis direction. The AF driving unit may move the bobbin 210 in the optical axis direction. The lens 220 is movable in the optical axis direction. The lens 220 may move in the optical axis direction with respect to the image sensor 330. The AF driving unit may perform an Auto Focus (AF) function. The AF driving unit may move the first moving part 200 in the optical axis direction. The AF driving unit may move the first moving part 200 downward in the optical axis direction.

The camera apparatus 10 may include an OIS driving unit. The OIS driving unit may be an image stabilizing driving unit. The OIS driving unit may be a driving unit for driving image stabilization. The OIS driving unit may move the second moving part 300 in a direction perpendicular to the optical axis direction. The OIS driving unit may move the second substrate 310 in a direction perpendicular to the optical axis direction. The OIS driving unit may move the sensor substrate 320 in a direction perpendicular to the optical axis direction. The OIS driving unit may move the image sensor 330 in a direction perpendicular to the optical axis direction. The OIS driving unit may move the image sensor 330 with respect to the first substrate 110 in a direction perpendicular to the optical axis direction. The OIS driving unit may move the holder 340 in a direction perpendicular to the optical axis direction. The OIS driving unit may move the sensor base 350 in a direction perpendicular to the optical axis direction. The OIS driving unit may move the filter 360 in a direction perpendicular to the optical axis direction. The OIS driving unit may perform an image stabilization (OIS) function.

The OIS driving unit may move the second moving part 300 in a first direction perpendicular to the optical axis direction. The OIS driving unit may move the second moving part 300 in the second direction and the first direction perpendicular to the optical axis direction. The OIS driving unit may rotate the second moving part 300 around the optical axis.

In an embodiment of the present invention, the AF driving unit may include an AF coil 430. The OIS driving unit may include an OIS coil 440. The AF driving unit may include an AF magnet 410. The OIS drive unit may include OIS magnets 420. In a modified embodiment, the AF drive unit and OIS drive unit may include drive magnets that are commonly used to interact with the AF coil 430 and OIS coil 440. That is, the AF driving unit and OIS driving unit may include coils and a common magnet that are controlled separately.

The camera device 10 may include an AF magnet 410. The driving unit may include an AF magnet 410. The AF magnet 410 may be a magnet. The AF magnet 410 may be a permanent magnet. The AF magnet 410 may be a common magnet. The AF magnet 410 may be used for auto-focusing (AF).

The AF magnet 410 may be provided in the fixing portion 100. The AF magnet 410 may be fixed to the fixing portion 100. The AF magnet 410 may be coupled to the fixing portion 100. The AF magnet 410 may be attached to the fixing portion 100 by an adhesive. The AF magnet 410 may be disposed in the housing 130. The AF magnet 410 may be fixed to the housing 130. The AF magnet 410 may be coupled to the housing 130. The AF magnet 410 may be attached to the housing 130 using an adhesive. The AF magnet 410 may be disposed at a corner of the case 130. The AF magnet 410 may be disposed to be biased toward a corner of the housing 130.

The AF magnet 410 may be a two-pole magnetized magnet including one N-pole region and one S-pole region. In a modified embodiment, the AF magnet 410 may be a quadrupole magnetization magnet including two N pole regions and two S pole regions.

The AF magnet 410 may include a plurality of magnets. The AF magnet 410 may include four magnets. The AF magnet 410 may include first to fourth magnets. The first to fourth magnets may be symmetrically disposed with respect to the optical axis. The first to fourth magnets may be formed to have the same size and shape.

The camera device 10 may include OIS magnets 420. The drive unit may include OIS magnets 420.OIS magnet 420 may be a magnet. OIS magnet 420 may be a permanent magnet. OIS magnet 420 may be a common magnet. OIS magnet 420 may be used for image stabilization (OIS).

OIS magnet 420 may be disposed in fixed portion 100.OIS magnet 420 may be fixed to fixed portion 100.OIS magnet 420 may be coupled to fixture 100.OIS magnet 420 may be attached to mount 100 with an adhesive. OIS magnet 420 may be disposed in housing 130.OIS magnet 420 may be secured to housing 130.OIS magnet 420 may be coupled to housing 130.OIS magnet 420 may be attached to housing 130 with an adhesive. OIS magnets 420 may be disposed at corners of the housing 130.OIS magnet 420 may be disposed offset to a corner of housing 130.

OIS magnet 420 may be a two-pole magnetized magnet including an N-pole region and an S-pole region. In a modified embodiment, OIS magnet 420 may be a quadrupole magnetized magnet including two N pole regions and two S pole regions.

OIS magnet 420 may include a plurality of magnets. OIS magnet 420 may include four magnets. OIS magnet 420 may include first through fourth magnets. The first to fourth magnets may be symmetrically disposed with respect to the optical axis. The first to fourth magnets may be formed to have the same size and shape.

OIS magnet 420 may be disposed below AF magnet 410. OIS magnet 420 may be disposed on the lower surface of AF magnet 410. OIS magnet 420 may be in contact with the lower surface of AF magnet 410. OIS magnet 420 may be fixed to the lower surface of AF magnet 410. OIS magnet 420 may be bonded to the lower surface of AF magnet 410 with an adhesive. The OIS magnet 420 may have a length in the optical axis direction shorter than that of the AF magnet 410. The OIS magnet 420 may be of a shorter size than the length of the AF magnet 410.

The camera apparatus 10 may include an AF coil 430. The driving unit may include an AF coil 430. The AF coil 430 may be disposed in the first moving part 200. The AF coil 430 may be fixed to the first moving part 200. The AF coil 430 may be coupled to the first moving part 200. The AF coil 430 may be attached to the first moving part 200 using an adhesive. The AF coil 430 may be disposed in the bobbin 210. The AF coil 430 may be fixed to the bobbin 210. The AF coil 430 may be coupled to the bobbin 210. The AF coil 430 may be attached to the bobbin 210 using an adhesive. The AF coil 430 may be electrically connected to the driver IC 480. The AF coil 430 may be electrically connected to the lower elastic member 720, the third substrate 470, and the driver IC 480. The AF coil 430 may receive current from the driver IC 480.

The AF coil 430 may be disposed at a position corresponding to the AF magnet 410. The AF coil 430 may be disposed in the bobbin 210 at a position corresponding to the AF magnet 410. The AF coil 430 may face the AF magnet 410. The AF coil 430 may include a surface facing the AF magnet 410. The AF coil 430 may be disposed adjacent to the AF magnet 410. The AF coil 430 may interact with the AF magnet 410. The AF coil 430 may electromagnetically interact with the AF magnet 410.

The AF coil 430 may move the first moving part 200 in the optical axis direction. The AF coil 430 may move the bobbin 210 in the optical axis direction. The AF coil 430 may move the lens 220 in the optical axis direction. The AF coil 430 may move the first moving part 200 in the optical axis direction. The AF coil 430 may move the bobbin 210 upward in the optical axis direction. The AF coil 430 may move the lens 220 upward in the optical axis direction. The AF coil 430 may move the first moving part 200 downward in the optical axis direction. The AF coil 430 may move the bobbin 210 downward in the optical axis direction. The AF coil 430 may move the lens 220 downward in the optical axis direction. The AF magnet 410 and the AF coil 430 may move the lens 220 in the optical axis direction.

The camera device 10 may include an OIS coil 440. The driving unit may include an OIS coil 440. The OIS coil 440 may be disposed in the second moving part 300. The OIS coil 440 may be fixed to the second moving part 300. The OIS coil 440 may be coupled to the second moving part 300. The OIS coil 440 may be attached to the second moving part 300 using an adhesive. OIS coil 440 may be disposed in holder 340.OIS coil 440 may be secured to holder 340.OIS coil 440 may be coupled to holder 340.OIS coil 440 may be attached to holder 340 with an adhesive. OIS coil 440 may be provided by winding around a protrusion of holder 340.OIS coil 440 may be disposed in holder 340.OIS coil 440 may be disposed on an upper surface of holder 340.OIS coil 440 may be disposed in the second substrate 310. The OIS coil 440 may be electrically connected to the second substrate 310. Both ends of the OIS coil 440 may be soldered to the second substrate 310.OIS coil 440 may be electrically connected to driver IC 495. The OIS coil 440 may be electrically connected to the second substrate 310 and the driver IC 495.OIS coil 440 may receive current from driver IC 495.

The OIS coil 440 may be disposed at a position corresponding to the OIS magnet 420.OIS coil 440 may be disposed in a position corresponding to the drive magnet. OIS coil 440 may be disposed in holder 340 at a position corresponding to OIS magnet 420. The OIS coil 440 may face the OIS magnet 420.OIS coil 440 may include a surface facing OIS magnet 420.OIS coil 440 may be disposed adjacent OIS magnet 420.OIS coil 440 may interact with OIS magnet 420.OIS coil 440 may electromagnetically interact with OIS magnet 420.

The OIS coil 440 may move the second moving part 300 in a direction perpendicular to the optical axis direction. The OIS coil 440 may move the second substrate 310 in a direction perpendicular to the optical axis direction. The OIS coil 440 may move the sensor substrate 320 in a direction perpendicular to the optical axis direction. The OIS coil 440 may move the image sensor 330 in a direction perpendicular to the optical axis direction. The OIS coil 440 may move the holder 340 in a direction perpendicular to the optical axis direction. The OIS coil 440 may rotate the second moving part 300 around the optical axis. The OIS coil 440 may rotate the second substrate 310 about the optical axis. OIS coil 440 may rotate sensor substrate 320 about the optical axis. OIS coil 440 may rotate image sensor 330 about the optical axis. OIS coil 440 may rotate holder 340 about the optical axis. The OIS magnet 420 and OIS coil 440 may move the image sensor 330 relative to the base 120 in a direction perpendicular to the optical axis direction.

OIS coil 440 may include a plurality of coils. OIS coil 440 may include four coils. OIS coil 440 may include a coil for x-axis movement. OIS coil 440 may include a coil for y-axis movement.

OIS coil 440 may include a first coil 441. The first coil 441 may be a first sub-coil. The first coil 441 may be a coil for x-axis movement. The first coil 441 may move the second moving portion 300 in the x-axis direction. The first coil 441 may be disposed longitudinally along the y-axis direction. The first coil 441 may include a plurality of coils. The first coil 441 may include two coils. The two coils of the first coil 441 may be electrically connected to each other. The first coil 441 may include a connection coil connecting two coils. In this case, the two coils of the first coil 441 may receive current together. Or the two coils of the first coil 441 are electrically separated from each other and may receive current separately.

OIS coil 440 may include a second coil 442. The second coil 442 may be a second sub-coil. The second coil 442 may be a coil for y-axis movement. The second coil 442 may move the second moving part 300 in the y-axis direction. The second coil 442 may be disposed longitudinally along the x-axis. The first coil 441 may include a plurality of coils. The second coil 442 may include two coils. The two coils of the second coil 442 may be electrically connected to each other. The second coil 442 may include a connection coil connecting the two coils. In this case, the two coils of the second coil 442 may together receive current. Or the two coils of the second coil 442 are electrically separated from each other and may receive current separately.

The camera device 10 may include a sensor 445. The sensor 445 may be disposed in the second substrate 310. The sensor 445 may be disposed in a hole of the retainer 340. The sensor 445 may comprise a hall sensor. The sensor 445 may include a hall element (hall IC). The sensor 445 may detect OIS magnet 420. The sensor 445 may detect the magnetic force of the OIS magnet 420. The sensor 445 may face the OIS magnet 420. The sensor 445 may be disposed at a position corresponding to the OIS magnet 420. The sensor 445 may be disposed adjacent to the OIS magnet 420. The sensor 445 may detect the position of the second moving part 300. The sensor 445 may detect the movement of the second moving part 300. The sensor 445 may be disposed in the hollow of the OIS coil 440. The sensed value detected by sensor 445 may be used to feed back the image stabilization operation. The sensor 445 may be electrically connected to the driver IC 495.

The sensor 445 may include a plurality of sensors. The sensor 445 may include three sensors. The sensor 445 may include first to third sensors. The first sensor may detect a displacement of the second moving part 300 in the y-axis direction. The second sensor may detect a displacement of the second moving part 300 in the y-axis direction. The third sensor may detect rotation of the second moving part 300 about the z-axis alone or together with one or more of the first and second hall sensors. Each of the first to third sensors may include a hall sensor.

The camera device 10 may include a sensing magnet 450. The sensing magnet 450 may be disposed in the first moving part 200. The sensing magnet 450 may be fixed to the first moving part 200. The sensing magnet 450 may be coupled to the first moving part 200. The sensing magnet 450 may be attached to the first moving part 200 using an adhesive. The sensing magnet 450 may be disposed in the bobbin 210. The sensing magnet 450 may be fixed to the bobbin 210. Sensing magnet 450 may be coupled to coil former 210. The sensing magnet 450 may be attached to the bobbin 210 with an adhesive. The sensing magnet 450 may be formed in a smaller size than the AF magnet 410. The sensing magnet 450 may be formed in a smaller size than the OIS magnet 420. Thus, the influence of the sensing magnet 450 on the driving can be minimized.

The sensing magnet 450 may be disposed on the opposite side of the correction magnet 460. The sensing magnet 450 and the correction magnet 460 may be disposed at both sides opposite to each other in the first moving part 200. The sensing magnet 450 and the correction magnet 460 may be disposed at opposite sides of each other in the bobbin 210.

The camera device 10 may include a correction magnet 460. The correction magnet 460 may be a bucking magnet. The correction magnet 460 may be disposed in the first moving part 200. The correction magnet 460 may be fixed to the first moving part 200. The correction magnet 460 may be coupled to the first moving part 200. The correction magnet 460 may be attached to the first moving part 200 using an adhesive. The correction magnet 460 may be disposed in the bobbin 210. The correction magnet 460 may be fixed to the bobbin 210. The correction magnet 460 may be coupled to the bobbin 210. The corrective magnet 460 may be attached to the bobbin 210 with an adhesive. The correction magnet 460 may be formed in a smaller size than the AF magnet 410. The correction magnet 460 may be formed to a smaller size than the OIS magnet 420. Thereby, the influence of the correction magnet 460 on the driving can be minimized. In addition, a correction magnet 460 may be disposed at a side opposite to the sensing magnet 450 to form a magnetic force balance with the sensing magnet 450. Thus, tilting that may be caused by the sensing magnet 450 can be prevented.

The camera device 10 may include a third substrate 470. The third substrate 470 may be a substrate. The third substrate 470 may be a Printed Circuit Board (PCB). The third substrate 470 may be a soft substrate. The third substrate 470 may be an FPCB. The third substrate 470 may be coupled with the first substrate 110. The third substrate 470 may be connected to the first substrate 110. The third substrate 470 may be electrically connected to the first substrate 110. The third substrate 470 may be soldered to the first substrate 110. The third substrate 470 may be disposed in the case 130. The third substrate 470 may be fixed to the housing 130. The third substrate 470 may be coupled to the housing 130. The housing 130 may include a groove or hole having a shape corresponding to the third substrate 470. The third substrate 470 may be disposed in a slot or hole of the housing 130. The third substrate 470 may be connected to the terminals of the connection substrate 600 after being bent.

A portion of the third substrate 470 may be disposed between the connection substrate 600 and the wing portion 131 of the case 130 in a direction perpendicular to the optical axis direction. The third base plate 470 may be disposed in the groove 131a of the wing portion 131 of the case 130.

The third substrate 470 may include a first terminal 471 connected to the connection substrate 600. The first terminal 471 may be connected to the connection substrate 600 by soldering. The third substrate 470 may include a second terminal 472 connected to the upper elastic member 710. The second terminal 472 may be coupled to the upper elastic member 710 by welding.

The third substrate 370 may include a first portion 473 on which the driver ICs 480 are disposed. The third substrate 370 may include a second portion 474 coupled to the terminal portion 630 of the connection substrate 600. The third substrate 370 may include a third portion 475 connecting the first portion 473 and the second portion 474. The first portion 473 of the third substrate 370 may be disposed further inward than the second portion 474.

The camera apparatus 10 may include a driver IC 480. The driver IC 480 may be an AF driver IC. The driver IC 480 may be electrically connected to the AF coil 430. The driver IC 480 may apply a current to the AF coil 430 to perform AF driving. The driver IC 480 may apply power to the AF coil 430. The driver IC 480 may apply a current to the AF coil 430. The driver IC 480 may apply a voltage to the AF coil 430. The driver IC 480 may be disposed in the third substrate 470. The driver IC 480 may be disposed at a position corresponding to the sensing magnet 450. The driver IC 480 may be disposed to face the sensing magnet 450. The driver IC 480 may be disposed adjacent to the sense magnet 450.

The driver IC 480 may include a sensor. The sensor may include a hall element (hall IC). The sensor may be disposed at a position corresponding to the sensing magnet 450. The sensor may be disposed to face the sensing magnet 450. The sensor may be disposed adjacent to the sensing magnet 450. The sensor may detect the sensing magnet 450. The sensor may detect the magnetic force of the sensing magnet 450. The sensor may detect the position of the first moving part 200. The sensor may detect the movement of the first moving part 200. The detection value detected by the sensor may be used as feedback for the autofocus operation. The sensor may be provided inside the driver IC 480. The sensor may be embedded in the driver IC 480. The sensor may be included in the driver IC 480. The sensor may be a component of the driver IC 480. The sensor may be disposed in the third substrate 470.

The camera device 10 may include a gyro sensor 490. The gyro sensor 490 may be disposed in the first substrate 110. The gyro sensor 490 may detect shake of the camera apparatus 10. The gyro sensor 490 may sense an angular velocity or a linear velocity caused by shake of the camera apparatus 10. The gyro sensor 490 may be electrically connected to the driver IC 495. The shake of the camera apparatus 10 detected by the gyro sensor 490 may be used for OIS driving.

The camera apparatus 10 may include a driver IC 495. The driver IC 495 may be an OIS driver IC. The driver IC 495 may be electrically connected to the OIS coil 440. The driver IC 495 may apply a current to the OIS coil 440 to perform OIS driving. The driver IC 495 may apply power to the OIS coil 440. The driver IC 495 may apply a current to the OIS coil 440. The driver IC 495 may apply a voltage to the OIS coil 440. The driver IC 495 may be disposed in the second substrate 310.

The camera device 10 may include a coupling member. The coupling member may be a spacer. The coupling member may support the movement of the second moving part 300. The coupling member may movably support the second moving part 300. The coupling member may connect the second moving part 300 and the fixed part 100. The coupling member may connect the first substrate 110 and the second substrate 310. The coupling member may electrically connect the first substrate 110 and the second substrate 310. The coupling member may connect the first substrate 110 and the second moving part 300. The coupling member may guide the movement of the second moving part 300. The coupling member may guide the second moving part 300 to move in a direction perpendicular to the optical axis direction. The coupling member may guide the second moving part 300 to rotate about the optical axis. The coupling member may restrict the movement of the second moving part 300 in the optical axis direction.

The coupling member may include a connection substrate 600. The coupling member may include an elastic member connecting the fixed part 100 and the second moving part 300. The coupling member may include a leaf spring. The coupling member may include a wire 800. The coupling member may include a ball (ball) disposed between the fixed part 100 and the second moving part 300. The coupling member may include a conductive member. The coupling member may comprise an electrically conductive strap. The coupling member may include an EMI tape.

The camera device 10 may include a connection substrate 600. The connection substrate 600 may be a connection portion. The connection substrate 600 may be a coupling member. The connection substrate 600 may be a flexible substrate. The connection substrate 600 may be a flexible substrate. The connection substrate 600 may be a flexible printed circuit board. The connection substrate 600 may be a Flexible Printed Circuit Board (FPCB). The connection substrate 600 may be flexible in at least a portion. The second substrate 310 and the connection substrate 600 may be integrally formed.

The connection substrate 600 may support the second moving part 300. The connection substrate 600 may support the movement of the second moving part 300. The connection substrate 600 may movably support the second moving part 300. The connection substrate 600 may connect the second moving part 300 and the fixed part 100. The connection substrate 600 may connect the first substrate 110 and the second substrate 310. The connection substrate 600 may electrically connect the first substrate 110 and the second substrate 310. The connection substrate 600 may guide the movement of the second moving part 300. The connection substrate 600 may guide the second moving part 300 to move in a direction perpendicular to the optical axis direction. The connection substrate 600 may guide the second moving part 300 to rotate around the optical axis. The connection substrate 600 may restrict the movement of the second moving part 300 in the optical axis direction. A portion of the connection substrate 600 may be coupled to the base 120. The connection substrate 600 may movably support the image sensor 330. The connection substrate 600 may be disposed inside the cover member 140.

The connection substrate 600 may include two connection substrates 600 spaced apart from each other and symmetrically formed. The two connection substrates 600 may be disposed at both sides of the second substrate 310. The connection substrate 600 may be bent a total of six times to connect the first substrate 110 and the second substrate 310.

The connection substrate 600 may include a first region connected to the second substrate 310 and bent in the optical axis direction. The first region is connected to the second substrate 310 and may be bent in the optical axis direction. The first region is connected to the second substrate 310 and may extend in the optical axis direction. The first region is connected to the second substrate 310, and may be bent and extended in the optical axis direction. The connection substrate 600 may include a second region extending from the first region. The connection substrate 600 may include a third region bent in a direction perpendicular to the optical axis direction in the second region. The third region may be curved in a direction perpendicular to the optical axis direction. The third region may extend from the second region in a direction perpendicular to the optical axis direction. The third region may be curved and extended from the second region in a direction perpendicular to the optical axis direction.

The connection substrate 600 may include a connection portion 610 including a first region. The connection substrate 600 may include an extension portion 620 including a second region and a third region. The connection substrate 600 may include a connection portion 610 connected to the second substrate 310. The connection substrate 600 may include an extension portion 620 extending from the connection portion 610. The connection substrate 600 may include a terminal portion 630 connected to the extension portion 620 and including a terminal.

The connection substrate 600 may include a connection portion 610. The connection portion 610 may be connected to the second moving part 300. The connection portion 610 may be coupled to the second moving part 300. The connection portion 610 may be fixed to the second moving part 300. The connection portion 610 may be connected to the second substrate 310. The connection portion 610 may be coupled to the second substrate 310. The connection portion 610 may be fixed to the second substrate 310. The connection portion 610 may include a first bending region bent in the optical axis direction. The connection portion 610 may include a first region bent in the optical axis direction with respect to the second substrate 310 and a second region extending from the first region and bent in a direction perpendicular to the optical axis direction. The connection portion 610 may be a first connection substrate. The connection portion 610 may be connected to the image sensor 330 by welding.

The connection portion 610 of the connection substrate 600 may be disposed further inside than the outer side surface of the base 120. The outer side surface of the base 120 may be disposed at a position corresponding to the inner surface of the side plate 142 of the cover member 140. The connection portion 610 of the connection substrate 600 may be provided on the inner surface of the side plate 142 of the cover member 140. The connection portion 610 of the connection substrate 600 may be spaced apart from the inner surface of the side plate 142 of the cover member 140. The connection portion 610 of the connection substrate 600 may be spaced apart from the side plate 142 of the cover member 140 in a direction perpendicular to the optical axis direction by a distance greater than the stroke space. The terminal portion 630 and the connection portion 610 of the connection substrate 600 may be disposed to be spaced apart from the side plate 142 of the cover member 140 by the groove 122 of the base 120. The groove 122 of the base 120 may be recessed such that the connection portion 610 of the connection substrate 600 is spaced apart from the side plate 142 of the cover member 140 by a travel space greater than the connection portion 610. The wing portions 131 of the housing 130 may be disposed in the slots 122 of the base 120. The wing portion 131 of the case 130 may be disposed between the terminal portion 630 of the connection substrate 600 disposed in the groove 122 of the base 120 and the side plate 142 of the cover member 140.

The connection portion 610 and the extension portion 620 may be connected by a curved portion 615. The curved portion 615 may have a curved shape. As shown in fig. 16, in a modified embodiment, the connection substrate 600 may include a hole 601 provided in the curved portion 615. Or the connection substrate 600 may include a hole 601 provided at a position overlapping the curved portion 615 in the optical axis direction. The hole 601 may be provided together with the curved portion 615 and is provided at a position overlapping the curved portion 615 in the optical axis direction. The hole 601 may be a circular hole. A hole 601 may be provided in a central region of the curved portion 615. The connection portion 610 may include a first portion disposed on one side of the hole 601 and a second portion disposed on the other side of the hole 601.

In another modified embodiment, as shown in fig. 17, the connection substrate 600 may include a hole 602. The hole 602 may be provided in the curved portion 615 of the connection substrate 600. The hole 602 may be provided at a position overlapping the curved portion 615 of the connection substrate 600 in the optical axis direction. The hole 602 may extend from the curved portion 615 to a position overlapping the curved portion 615 in the optical axis direction. The width of the hole 602 of the connection substrate 600 in the optical axis direction may be longer than the width in the direction perpendicular to the optical axis direction. The aperture 602 may have an oval shape.

As shown in fig. 18, the connection substrate 600 may include a plurality of connection substrates. The connection substrate 600 may include four connection substrates spaced apart from each other. The connection substrate 600 may include first to fourth connection substrates 600a-1, 600a-2, 600a-3, and 600a-4. The first to fourth connection substrates 600a-1, 600a-2, 600a-3 and 600a-4 may be symmetrically formed with respect to the optical axis. The first to fourth connection substrates 600a-1, 600a-2, 600a-3 and 600a-4 may be spaced apart from each other. The first to fourth connection substrates 600a-1, 600a-2, 600a-3 and 600a-4 may be electrically separated from each other.

The connection substrate 600 may include an extension portion 620. The extension portion 620 may connect the connection portion 610 and the terminal portion 630. The extension portion 620 may extend from the connection portion 610. The extension portion 620 may include a second bending region bent in a direction perpendicular to the optical axis direction. The extension portion 620 of the connection substrate 600 may be spaced apart from the side plate 142 of the cover member 140. The extension portion 620 of the connection substrate 600 may be spaced apart from the side plate 142 of the cover member 140 in a direction perpendicular to the optical axis direction. The width of the extension portion 620 may be smaller than the width of the terminal portion 630. The extension 620 may be a second connection substrate. The second connection substrate may connect the first connection substrate and the third connection substrate. The extension part 620 may be a part that moves when the second moving part 200 moves. The extension 620 may be a moving part. The extension 620 may be spaced apart from the wing portion 131 of the housing 130. The extension portion 620 may move in a direction perpendicular to the optical axis direction in a space between the inner surfaces of the side plates 142 of the cover member 140 (see L in fig. 52).

The connection substrate 600 may include a terminal portion 630. The terminal portion 630 may be coupled to the fixing portion 100. The terminal portion 630 may be fixed to the fixing part 100. The terminal portion 630 may be coupled to the first substrate 110. The terminal portion 630 may be connected to the first substrate 110. The terminal portion 630 may be soldered to the first substrate 110. The terminal portion 630 may be fixed to the first substrate 110. The terminal portion 630 may be coupled to the base 120. The terminal portion 630 may be fixed to the base 120. The terminal portion 630 may be disposed in the optical axis direction. The terminal portion 630 may include a terminal. The terminal may be coupled to the first substrate 110. A plurality of terminals may be provided at the lower end of the terminal portion 630 of the connection substrate 600. The plurality of terminals of the connection substrate 600 may be disposed inside the wing portion 131 of the housing 130. The terminal portion 630 may be a third connection substrate. The terminal portion 630 may be connected to the first substrate 110 by soldering.

The terminal portion 630 of the connection substrate 600 may be disposed in the first groove 122 of the base 120. The terminal portion 630 of the connection substrate 600 may be spaced apart from the side plate 142 of the cover member 140. Thereby, a stroke space of the extension portion 620 of the connection substrate 600 can be secured inside the cover member 140.

The terminal portion 630 may include a first terminal 631. The first terminal 631 may be connected to the first substrate 110. The first terminal 631 may be electrically connected to the first substrate 110. The first terminal 631 may be coupled to the first substrate 110. The first terminal 631 may be coupled to the first substrate 110 through a conductive member. The first terminal 631 may be coupled to the first substrate 110 by soldering.

The terminal portion 630 may include a second terminal 632. The second terminal 632 may be connected to the third substrate 470. The second terminal 632 may be electrically connected to the third substrate 470. The second terminal 632 may be coupled with the third substrate 470. The second terminal 632 may be coupled to the third substrate 470 through a conductive member. The second terminal 632 may be connected to the third substrate 470 by soldering. The second terminal 632 of the connection substrate 600 may overlap with the first terminal 631 of the connection substrate 600 in the optical axis direction. The second terminal 632 may be disposed above the first terminal 631. The second terminal 632 may be spaced apart from the first terminal 631. The second terminal 632 may be disposed higher than the first terminal 631.

The first terminal 631 of the connection substrate 600 may include a plurality of first terminals 631. The second terminal 632 of the connection substrate 600 may include a plurality of second terminals 632. The intervals between the plurality of second terminals 632 may be larger than the intervals between the plurality of first terminals 631 in the direction perpendicular to the optical axis direction. The intervals between the plurality of second terminals 632 may be different from the intervals between the plurality of first terminals 631 in the direction perpendicular to the optical axis direction. The second terminal 632 of the connection substrate 600 may include four second terminals.

In an embodiment of the present invention, the camera device 10 may include a flexible substrate. The flexible substrate may connect the fixed part 100 and the second moving part 300. The flexible substrate may include: a connection portion 610 connected to the second moving part 300; an extension portion 620 extending from the connection portion 610; and a terminal portion 630 connected to the extension portion 620 and including a terminal.

In an embodiment of the present invention, the connection substrate 600 may include a first portion coupled to the first substrate 110, a second portion coupled to the second substrate 310, and a third portion connecting the first and second portions. The third portion may be arranged at least partially parallel to the optical axis. The third portion may be formed such that a length in the optical axis direction is longer than the thickness. The second portion of the connection substrate 600 may be disposed at least partially parallel to the second substrate 310. The third portion of the connection substrate 600 may be disposed at least partially perpendicular to the second portion. The third portion of the connection substrate 600 may be smoothly curved at a portion corresponding to a corner of the second substrate 310. The second substrate 310 may include: a first side surface and a second side surface disposed on opposite sides from each other; and third and fourth side surfaces disposed on opposite sides from each other. The second portion of the connection substrate 600 may be coupled with the first side surface and the second side surface of the second substrate 310. The first portion of the connection substrate 600 may be coupled to portions of the first substrate 110 corresponding to the third and fourth side surfaces of the second substrate 310.

The camera apparatus 10 may include a shielding member. The shielding member may be disposed on one surface of the connection substrate 600. The shielding member may be a conductive tape. The shielding member may be an EMI tape. In a modified embodiment, the shielding member may be provided separately and independently from the connection substrate 600. The camera device 10 may include a conductive strap. The coupling member may comprise an electrically conductive strap. The connection substrate 600 may include a conductive tape. However, the conductive tape may be understood as a separate component from the connection substrate 600. The conductive tape may include an electromagnetic interference (EMI) tape. The conductive strip may be a metal member. The conductive strip may be a metal member. The conductive strip may be a metal layer. The conductive strip may be a thin metal film. The conductive strip may be formed of metal. The conductive strip may be formed of an alloy. The conductive strip may be formed of a conductive material. The conductive tape may have adhesive properties. The conductive tape may be distinguished from the conductive layer 602 of the connection substrate 600. The conductive tape may be formed of a different material than the conductive layer 602 of the connection substrate 600.

The conductive tape may be disposed in the connection substrate 600. The conductive tape may be coupled to the connection substrate 600. The conductive tape may be fixed to the connection substrate 600. The conductive tape may be integrally formed with the connection substrate 600. The conductive tape may have elasticity. The conductive tape may be attached to an outer surface of the connection substrate 600. Or a conductive tape may be attached to the inner surface of the connection substrate 600.

The length of the conductive strip in the optical axis direction is at least partially equal to the length of the extension 620. The conductive tape may extend the same length as the extension 620 in the optical axis direction. The thickness of the conductive tape may be thinner than the thickness of the connection substrate 600. The thickness of the conductive tape may be the same as the thickness of the connection substrate 600. The conductive strip may be Grounded (GND) and used for impedance matching and noise suppression.

At least a portion of the conductive tape may be disposed in the extension 620 of the connection substrate 600. The extension 620 may include a bending region bent in a direction perpendicular to the optical axis direction. At this time, the conductive tape may be disposed in the bending region. A conductive strip may be disposed on an inner surface of the extension 620. A conductive strip may be disposed on an outer surface of the extension 620.

The conductive strip may be formed of a conductive material. The conductive tape may be electrically connected to the second substrate 310. The conductive strip may be electrically connected to the image sensor 330. The conductive tape may be electrically connected to the driver IC 495. The conductive tape may be connected to the terminal 631 of the connection substrate 600. The conductive tape may be electrically connected to the terminal 631 of the connection substrate 600. The conductive tape may be in direct contact with the terminal 631 of the connection substrate 600. The conductive strip may be used as Ground (GND). The conductive tape may be connected to a ground terminal of the connection substrate 600. The conductive tape may be electrically connected to the first substrate 110. In this case, the number of power connection modes of the connection substrate 600 may be reduced. The conductive strip may be electrically connected to a ground terminal of the image sensor 330.

The camera device 10 may include an elastic member 700. The elastic member 700 may be a support member. The elastic member 700 may connect the fixed part 100 and the first moving part 200. The elastic member 700 may elastically connect the fixed part 100 and the first moving part 200. The elastic member 700 may connect the bobbin 210 and the case 130. The elastic member 700 may elastically connect the bobbin 210 and the case 130. The elastic member 700 may movably support the first moving part 200 with respect to the fixed part 100. When the first moving part 200 moves, the elastic member 700 may be deformed. When the movement of the first moving part 200 is terminated, the elastic member 700 may position the first moving part 200 to the initial position by a restoring force (elastic force). The elastic member 700 may include a plate spring. The elastic member 700 may include a spring. The elastic member 700 may be at least partially elastic. The elastic member 700 may provide a restoring force (elastic force) to the first moving part.

The camera device 10 may include an upper elastic member 710. The elastic member 700 may include an upper elastic member 710. The upper elastic member 710 may be an upper spring. The upper elastic member 710 may be disposed above the lower elastic member 720. The upper elastic member 710 may connect the housing 130 and the bobbin 210. The upper elastic member 710 may be coupled to the housing 130. The upper elastic member 710 may be coupled to the bobbin 210.

The upper elastic member 710 may include a plurality of upper elastic units. The upper elastic member 710 may include two upper elastic units. The upper elastic member 710 may include a first upper elastic unit 710-1 and a second upper elastic unit 710-2. The first upper elastic unit 710-1 and the second upper elastic unit 710-2 may be spaced apart from each other. The first and second upper elastic units 710-1 and 710-2 may electrically connect the third substrate 470 and the AF coil 430. In a modified embodiment, the lower elastic member 720 may include a plurality of lower elastic units. The lower elastic member 720 may include two lower elastic units.

The driver IC 480 may be disposed on an inner surface of the third substrate 470. The first upper elastic unit 710-1 may be coupled to an inner surface of the third substrate 470. The second upper elastic unit 710-2 may be coupled to an outer surface opposite to an inner surface of the third substrate 470.

The upper elastic member 710 may include an outer portion 711 coupled to the housing 130. An outer portion 711 of the upper elastic member 710 may be coupled to an upper portion of the housing 130. An outer portion 711 of the upper elastic member 710 may be disposed on an upper surface of the housing 130. The upper elastic member 710 may include an inner portion 712 coupled to the bobbin 210. An inner portion 712 of the upper elastic member 710 may be coupled to an upper portion of the bobbin 210. An inner portion 712 of the upper elastic member 710 may be disposed on an upper surface of the bobbin 210. The upper elastic member 710 may include a connection portion 713 connecting the outer portion 711 and the inner portion 712. The connection portion 713 may have elasticity.

The connection portion 713 of the upper elastic member 710 may include a first portion 713a connecting the outer portion 711 and the inner portion 712. The connection portion 713 of the upper elastic member 710 may include a second portion 713b extending from the first portion 713a to a position corresponding to the slot 212 of the bobbin 210. The second portion 713b of the connection portion 713 of the upper elastic member 710 may be disposed closer to the outer portion 711 of the upper elastic member 710 than the inner portion 712 of the upper elastic member 710. The distance between the second portion 713b and the outer portion 711 may be shorter than the distance between the second portion 173b and the inner portion 712.

In the embodiment of the present invention, as shown in fig. 32 (a), the second portion 713b of the connection portion 713 of the upper elastic member 710 may be formed in a circular shape having a diameter larger than that of the other portion of the second portion 713b located at the end of the second portion 713 b. Thereby, the contact area with the second damper 920 increases, and the loss of the second damper 920 can be minimized.

In a modified embodiment, as shown in (b) of fig. 32, the second portion 713c of the connection portion 713 of the upper elastic member 710 may be formed in a straight line. That is, compared to the embodiment of the present invention, the circular portion of the circle may be omitted.

In another modified embodiment, as shown in (c) of fig. 32, the second portion 713d of the connection portion 713 of the upper elastic member 710 may include a hole 713e formed in a circular end. The hole 713e may be formed in a circular shape. The circular shape of the second portion 713d and the circular shape of the hole 713e may be concentric. The effect of preventing the loss of the damper can be improved through the hole 713e of the second portion 713 d.

The upper elastic member 710 may include a coupling portion 714. The coupling portion 714 may be coupled to the wire 800. Coupling portion 714 may extend from outer portion 711. Coupling portion 714 may include aperture 714a. The upper elastic member 710 may include a hole 714a in which the wire 800 is disposed. The upper elastic member 710 may include a hole 714a through which the wire 800 passes.

The upper elastic member 710 may include a terminal portion 715. The terminal portion 715 may be coupled with the third substrate 470. The terminal portion 715 may be connected to a terminal of the third substrate 470. The terminal portion 715 may be coupled to the second terminal 472 of the third substrate 470 by a conductive member.

The camera device 10 may include a lower elastic member 720. The elastic member 700 may include a lower elastic member 720. The lower elastic member 720 may be a lower spring. The lower elastic member 720 may be disposed under the upper elastic member 710. The lower elastic member 720 may connect the housing 130 and the bobbin 210. The lower elastic member 720 may be coupled to the housing 130. The lower elastic member 720 may be coupled to the bobbin 210.

The lower elastic member 720 may include an outer portion coupled to the housing 130. An outer portion of the lower elastic member 720 may be coupled to a lower portion of the housing 130. An outer portion of the lower elastic member 720 may be disposed on a lower surface of the case 130. The lower elastic member 720 may include an inner portion coupled to the bobbin 210. An inner portion of the lower elastic member 720 may be coupled to a lower portion of the bobbin 210. An inner portion of the lower elastic member 720 may be disposed on a lower surface of the bobbin 210. The lower elastic member 720 may include a connection portion connecting the outer portion and the inner portion. The connection portion may have elasticity.

The camera device 10 may include a wire 800. The wire 800 may be a wire spring. The wire 800 may be an elastic member. In a modified embodiment, the wire 800 may be a plate spring. The wire 800 may connect the fixed part 100 and the second moving part 300. The wire 800 may elastically connect the fixed part 100 and the second moving part 300. The wire 800 may connect the case 130 and the second substrate 310. The wire 800 may elastically connect the case 130 and the second substrate 310. The wire 800 may movably support the second moving part 300. The wire 800 may movably support the second moving part 300 with respect to the fixed part 100. The wire 800 may support the movement of the image sensor 330. The wire 800 may movably support the image sensor 330. The wire 800 may be disposed in the optical axis direction. The wire 800 may support the second moving part 300 to move or rotate in a direction perpendicular to the optical axis direction. The wire 800 may connect the upper elastic member 710 and the coupling member 380. Wire 800 may electrically connect upper elastic member 710 and coupling member 380. The wire 800 may be coupled to the upper elastic member 710 by welding. Wire 800 may be coupled to coupling member 380 by welding.

The wire 800 may include a first portion coupled to the upper elastic member 710. At this time, the first portion may be an upper end of the wire 800. However, the first portion may be spaced apart from the upper end of the wire 800. Wire 800 may include a second portion coupled to coupling member 380. At this time, the second portion may be a lower end of the wire 800. However, the second portion may be spaced apart from the lower end of the wire 800.

The camera apparatus 10 may include a first damper 910. The first damper 910 may be an OIS damper. The first damper 910 may prevent an oscillation phenomenon during OIS operation. The first damper 910 may have viscosity. The first damper 910 may connect the housing 130 and the wire 800. The first damper 910 may be disposed between the housing 130 and the wire 800. A first damper 910 may be applied between the housing 130 and the wire 800. The first damper 910 may be in contact with the housing 130. The first damper 910 may be in contact with the hole 134 of the housing 130. The first damper 910 may be in contact with the wire 800. At least a portion of the first damper 910 may be disposed in the aperture 134 of the housing 130. At least a portion of the first damper 910 may be disposed inside the barrier 136 of the housing 130. The first damper 910 may connect the housing 130 as a fixing portion and the wire 800.

The camera apparatus 10 may include a second damper 920. The second damper 920 may be an AF damper. The second damper 920 may prevent an oscillation phenomenon during an AF operation. The second damper 920 may have viscosity. The second damper 920 may connect the coil bobbin 210 and the upper elastic member 710. The second damper 920 may be connected to the connection portion 713 of the upper elastic member 710. The second damper 920 may connect the groove 212 of the bobbin 210 and the second portion 713b of the connection portion 713 of the upper elastic member 710. The second damper 920 may be disposed closer to the outer portion 711 than the inner portion 712 of the upper elastic member 710. The second damper 920 may be disposed between the groove 212 of the bobbin 210 and the second portion 713b of the connection portion 713 of the upper elastic member 710. The second damper 920 may be applied between the groove 212 of the bobbin 210 and the second portion 713b of the connection portion 713 of the upper elastic member 710. The second damper 920 may be in contact with the slot 212 of the bobbin 210. The second damper 920 may be in contact with the second portion 713b of the connection portion 713 of the upper elastic member 710.

The camera apparatus 10 may include a third damper 930. The third damper 930 may be an AF damper. The third damper 930 may prevent an oscillation phenomenon during the AF operation. In addition to the second damper 920, a third damper 930 may be provided. Or in the case where the second damper 920 is not provided, the third damper 930 may be provided. That is, one or more of the second damper 920 and the third damper 930 may be provided. The third damper 930 may have viscosity. The third damper 930 may be disposed closer to the outer portion 711 than the inner portion 712 of the upper elastic member 710. The distance between the third damper 930 and the outer portion 711 of the upper elastic member 710 may be shorter than the distance between the second damper 920 and the outer portion 711 of the upper elastic member 710. The third damper 930 may be disposed between the second damper 920 and the outer portion 711 of the upper elastic member 710.

The third damper 930 may connect the bobbin 210 and the upper elastic member 710. The third damper 930 may connect the protrusion 213 of the bobbin 210 and the upper elastic member 710. The third damper 930 may connect the coil bobbin 210 and the connection portion 713 of the upper elastic member 710. The third damper 930 may connect the bobbin 210 and the first portion 713a of the upper elastic member 710. The third damper 930 may connect the protrusion 213 of the bobbin 210 and the first portion 713a of the upper elastic member 710. The third damper 930 may be connected to a portion between the outer portion 711 and the second portion 713b of the first portion 713a of the upper elastic member 710. The third damper 930 may be disposed between the protrusion 213 of the bobbin 210 and the first portion 713a of the upper elastic member 710. The third damper 930 may be applied between the protrusion 213 of the bobbin 210 and the first portion 713a of the upper elastic member 710. The third damper 930 may be in contact with the protrusion 213 of the bobbin 210. The third damper 930 may be in contact with the first portion 713a of the upper elastic member 710.

The camera apparatus 10 may include a fourth damper 940. The fourth damper 940 may be an OIS damper. The fourth damper 940 may prevent an oscillation phenomenon during OIS operation. A fourth damper 940 may be provided in addition to the first damper 910. Or in the case where the first damper 910 is not provided, the fourth damper 940 may be provided. That is, one or more of the first damper 910 and the fourth damper 940 may be provided. The fourth damper 940 may have viscosity. A fourth damper 940 may connect the coupling member 380 and the base 120. A fourth damper 940 may be disposed between the coupling member 380 and the base 120. A fourth damper 940 may be applied between coupling member 380 and base 120. Fourth damper 940 may be in contact with coupling member 380. The fourth damper 940 may be in contact with the base 120. At least a portion of the fourth damper 940 may be disposed in the groove 123 of the base 120. The fourth damper 940 may be connected to the extension 383 of the union member 380. The fourth damper 940 may be in contact with the welding portion. The fourth damper 940 may cover a portion of the welded portion. In addition to extension 383, fourth damper 940 may also contact coupling portion 380a.

Each of the first to fourth dampers 910, 920, 930, and 940 is an independent component, and one or more of the first to fourth dampers 910, 920, 930, and 940 may be omitted. The first to fourth dampers 910, 920, 930 and 940 may be provided as one or a combination of two or more.

Hereinafter, an operation of the camera apparatus according to the embodiment of the present invention will be described with reference to the accompanying drawings.

When power is applied to the AF coil 430 of the camera apparatus 10 according to the embodiment of the present invention, an electromagnetic field is formed in the AF coil 430, and the AF coil 430 can be moved in the optical axis direction (z-axis direction) by electromagnetic interaction with the AF magnet 410. At this time, the AF coil 430 may move in the optical axis direction together with the first moving part 200 including the lens 220. In this case, the lens 220 is far from or near the image sensor 330, and thus the focus of the subject can be adjusted. To apply power to the AF coil 430, one or more of current and voltage may be applied.

When a current in a first direction is applied to the AF coil 430 of the camera apparatus 10 according to an embodiment of the present invention, the AF coil 430 may move in an upward direction of the optical axis by electromagnetic interaction with the AF magnet 410 (see a in fig. 55). At this time, the AF coil 430 may move the lens 220 upward in the optical axis direction away from the image sensor 330.

When a current in a second direction opposite to the first direction is applied to the AF coil 430 of the camera apparatus 10 according to an embodiment of the present invention, the AF coil 430 may move in a downward direction (see b in fig. 55) of the optical axis direction by electromagnetic interaction with the AF magnet 410. At this time, the AF coil 430 may move the lens 220 in a downward direction of the optical axis direction to be closer to the image sensor 330.

Fig. 56 to 58 are diagrams for explaining an image stabilizing function of driving the camera device according to the embodiment of the present invention.

When power is applied to the OIS coil 440 of the camera apparatus 10 according to an embodiment of the present invention, an electromagnetic field is formed in the OIS coil 440, and the OIS coil 440 may be moved in a direction perpendicular to the optical axis direction by electromagnetic interaction with the OIS magnet 420. Further, the OIS coil 440 may rotate about the optical axis by electromagnetic interaction with the OIS magnet 420. At this time, the OIS coil 440 may move or rotate together with the second moving part 300 including the image sensor 330. In an embodiment of the present invention, OIS coil 440 may move image sensor 330 to compensate for the shake of camera device 10 detected by gyro sensor 490.

Fig. 56 is a diagram illustrating driving of an image sensor of a camera device in which the camera device moves along an x-axis according to an embodiment of the present invention.

When a current in a first direction is applied to the first coil 441 of the camera apparatus 10 according to the embodiment of the present invention, the first coil 441 may be moved in one direction (see a in fig. 56) of a first direction (x-axis direction) perpendicular to the optical axis direction by electromagnetic interaction with the OIS magnet 420. At this time, the first coil 441 may move the image sensor 330 in one direction of a first direction perpendicular to the optical axis direction. In contrast, when a current in a second direction opposite to the first direction is applied to the first coil 441, the first coil 441 may be moved in the other direction (x-axis direction) of the first direction perpendicular to the optical axis direction by electromagnetic interaction with the OIS magnet 420. At this time, the first coil 441 may move the image sensor 330 in the other direction of the first direction perpendicular to the optical axis direction.

Fig. 57 is a diagram illustrating driving of an image sensor of a camera device according to an embodiment of the present invention in which the image sensor is moved along the y-axis.

When a current in a first direction is applied to the second coil 442 of the camera apparatus 10 according to an embodiment of the present invention, the second coil 442 may be moved in one direction (see b in fig. 57) of a second direction (y-axis direction) perpendicular to the optical axis direction by electromagnetic interaction with the OIS magnet 420. At this time, the second coil 442 may move the image sensor 330 in one of the second directions perpendicular to the optical axis direction. In contrast, when a current in a second direction opposite to the first direction is applied to the second coil 442, the second coil 442 may move in the other direction of the second direction (y-axis direction) perpendicular to the optical axis direction by electromagnetic interaction with the OIS magnet 420. At this time, the second coil 442 may move the image sensor 330 in the other direction of the second direction perpendicular to the optical axis direction.

Fig. 58 is a diagram illustrating driving of an image sensor of a camera device in which the image sensor scrolls around a z-axis according to an embodiment of the present invention.

When a current in a first direction is applied to the first and second coils 441 and 442 of the camera apparatus 10 according to the embodiment of the present invention, the first and second coils 441 and 442 may be rotated in one direction about the optical axis by electromagnetic interaction with the OIS magnet 420 (see c in fig. 58). At this time, the first and second coils 441 and 442 may rotate the image sensor 330 in one direction about the optical axis. At this time, one direction is counterclockwise. In contrast, when a current in a second direction opposite to the first direction is applied to the first and second coils 441 and 442, the first and second coils 441 and 442 may be rotated in other directions about the optical axis by electromagnetic interaction with the OIS magnet 420. At this time, the first and second coils 441 and 442 may rotate the image sensor 330 in the other direction about the optical axis. At this time, the other direction may be clockwise.

Hereinafter, an optical apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 59 is a perspective view of an optical device according to an embodiment of the present invention; and fig. 60 is a perspective view of an optical apparatus according to an embodiment of the present invention as viewed from a direction different from fig. 59.

The optical apparatus 1 may include any one or more of a cellular phone, a mobile phone, a portable terminal, a mobile terminal, a smart phone, a smart tablet, a portable smart device, a digital camera, a laptop computer, a digital broadcast terminal, and a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), and a navigation device. The optical device 1 may comprise any means for taking an image or a photo.

The optical device 1 may comprise a body 20. The optical apparatus 1 may comprise a camera device 10. The camera apparatus 10 may be disposed in the main body 20. The camera device 10 may capture an object. The optical device 1 may comprise a display 30. A display 30 is provided in the main body 20, and the display 30 may output one or more videos or images photographed by the camera apparatus 10. The display 30 may be disposed on the first surface of the main body 20. The camera device 10 may be disposed on one or more of a first surface and a second surface opposite to the first surface of the main body 20.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can implement the present invention in other specific forms without changing the technical spirit or essential characteristics thereof. Accordingly, it should be understood that the above embodiments are illustrative and not restrictive in all aspects.

Claims

1. A camera apparatus, comprising:

a base;

A housing disposed on the base;

An image sensor disposed in the base;

a wire movably supporting the image sensor; and

A first damper connecting the housing and the wire,

Wherein the housing is secured to the base.

2. The camera device of claim 1, comprising: a first driving unit configured to move the image sensor in a direction perpendicular to an optical axis direction,

Wherein the lead is disposed in the optical axis direction,

Wherein the housing includes a hole or slot for the wire to pass through, and

Wherein at least a portion of the first damper is disposed in a bore or slot of the housing.

3. The camera device of claim 2, wherein the aperture or slot of the housing comprises: a first chamfer whose width in a direction perpendicular to the optical axis direction increases as the first chamfer moves upward; and a second chamfer disposed below the first chamfer and having a width in a direction perpendicular to the optical axis direction that increases as the second chamfer moves downward, and

Wherein the length of the second chamfer in the optical axis direction is longer than the length of the first chamfer in the optical axis direction.

4. The camera device of claim 1, wherein the housing includes a groove formed on a corner region of an upper surface of the housing,

Wherein a stopper is formed between an outer side surface of the housing and the groove of the housing through the groove of the housing, and

Wherein at least a portion of the first damper is disposed within the barrier of the housing.

5. The camera device of claim 1, comprising an upper resilient member coupled to the housing,

Wherein the first portion of the wire is coupled to the upper resilient member.

6. The camera device of claim 5, wherein the first damper is spaced apart from the upper elastic member.

7. The camera device of claim 5, comprising:

A coil bobbin movably disposed in the housing; and

A second damper connecting the bobbin and the upper elastic member,

Wherein the upper elastic member includes an outer portion coupled with the housing, an inner portion coupled with the bobbin, a connecting portion connecting the outer portion and the inner portion, and a coupling portion extending from the outer portion and coupled with the wire, and

Wherein the second damper is connected with the connection portion of the upper elastic member.

8. The camera device of claim 7, wherein the bobbin includes a groove formed on an upper surface of the bobbin,

Wherein the connection portion of the upper elastic member includes: a first portion connecting the outer portion and the inner portion; and a second portion extending from the first portion to a position corresponding to a slot of the bobbin, and

Wherein the second damper connects the groove of the bobbin and the second portion of the connection portion of the upper elastic member.

9. The camera device according to claim 8, wherein the second portion of the connection portion of the upper elastic member is disposed closer to an outer portion of the upper elastic member than an inner portion of the upper elastic member.

10. An optical device, comprising:

A main body;

The camera device of claim 1, disposed on the body; and

A display provided on the main body and configured to output a video or image photographed by the camera device.