CN118176836A - Electromagnetic wave shielding material, electronic component, and electronic device - Google Patents
Electromagnetic wave shielding material, electronic component, and electronic device Download PDFInfo
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- CN118176836A CN118176836A CN202280072645.9A CN202280072645A CN118176836A CN 118176836 A CN118176836 A CN 118176836A CN 202280072645 A CN202280072645 A CN 202280072645A CN 118176836 A CN118176836 A CN 118176836A
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Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides an electromagnetic wave shielding material, and an electronic component and an electronic device comprising the electromagnetic wave shielding material, wherein the electromagnetic wave shielding material is provided with more than 1 magnetic layer comprising magnetic particles and resin, and the peak top temperature of loss tangent Tan delta in dynamic viscoelasticity measurement at 1Hz is more than 0 ℃ and less than 60 ℃.
Description
Technical Field
The present invention relates to an electromagnetic wave shielding material, an electronic component, and an electronic device.
Background
Patent document 1 discloses a soft magnetic thin film mounted on a circuit board of an electronic device. Specifically, the 0095 of patent document 1 describes a technique that enables a soft magnetic thin film to be laminated on an antenna, a coil, or a circuit board having these formed on the surface thereof.
Technical literature of the prior art
Patent literature
Patent document 1: w02014/132880
Disclosure of Invention
Technical problem to be solved by the invention
In recent years, as a material for reducing the influence of electromagnetic waves in various electronic parts and various electronic devices, an electromagnetic wave shielding material has been attracting attention. The electromagnetic wave shielding material (hereinafter also referred to as "shielding material") can exhibit electromagnetic wave shielding performance (shielding ability) by reflecting electromagnetic waves incident on the shielding material and/or attenuating electromagnetic waves incident on the shielding material inside the shielding material with the shielding material. For example, the soft magnetic film described in patent document 1 can function as an electromagnetic wave shielding material.
The following 2 properties are examples of the desired properties of the electromagnetic wave shielding material.
First, a high shielding ability against electromagnetic waves can be exhibited. An electromagnetic wave shielding material exhibiting a high shielding ability against electromagnetic waves is preferable because it can contribute to a great reduction in the influence of electromagnetic waves in electronic parts and electronic devices.
Second, moldability is excellent. The electromagnetic wave shielding material can be processed into various shapes to be assembled into electronic parts or electronic devices. Excellent moldability may mean that defects such as shape defects and cracks are less likely to occur at the time of molding. The electromagnetic wave shielding material having excellent moldability is preferable in that cracking is less likely to occur in a molded article during three-dimensional molding (in other words, three-dimensional molding), for example. In patent document 1, the moldability as described above is not described at all.
In view of the above, an object of one embodiment of the present invention is to provide an electromagnetic wave shielding material that can exhibit high shielding ability against electromagnetic waves and is excellent in moldability.
Means for solving the technical problems
One embodiment of the present invention is as follows.
[1] An electromagnetic wave shielding material comprising 1 or more magnetic layers containing magnetic particles and a resin, and
The peak top temperature of the loss tangent Tan delta (hereinafter also referred to as "peak top temperature of Tan delta") in dynamic viscoelasticity measurement at 1Hz is 0 ℃ or higher and less than 60 ℃.
[2] The electromagnetic wave shielding material according to [1], which further has 1 or more adhesive layers.
[3] The electromagnetic wave shielding material according to [2], which further has a resin layer between 2 adhesive layers.
[4] The electromagnetic wave shielding material according to any one of [1] to [3], which further has 2 or more metal layers, and
Comprising more than 1 magnetic layer sandwiched between 2 metal layers.
[5] The electromagnetic wave shielding material according to any one of [1] to [4], wherein a storage modulus E' in a dynamic viscoelasticity measurement at 1Hz is 0.010GPa or more and less than 10.000GPa at 60 ℃.
[6] The electromagnetic wave shielding material according to any one of [1] to [5], wherein the magnetic layer contains a resin having a urethane structure.
[7] The electromagnetic wave shielding material according to any one of [1] to [6], wherein a peak top temperature of a loss tangent Tan δ in dynamic viscoelasticity measurement at 1Hz is 15 ℃ or more and less than 40 ℃, and
The storage modulus E' in a dynamic viscoelasticity measurement at 1Hz is 0.010GPa or more and less than 10.000GPa at 60 ℃.
[8] The electromagnetic wave shielding material according to any one of [1] to [7], wherein the magnetic layer contains flat-shaped metal particles as the magnetic particles.
[9] The electromagnetic wave shielding material according to any one of [1] to [8], which is sheet-like.
[10] An electronic part comprising the electromagnetic wave shielding material of any one of [1] to [9 ].
[11] An electronic device comprising the electromagnetic wave shielding material of any one of [1] to [9 ].
Effects of the invention
According to one aspect of the present invention, an electromagnetic wave shielding material that can exhibit high shielding ability against electromagnetic waves and has excellent moldability can be provided. Further, according to an aspect of the present invention, an electronic component and an electronic device including the electromagnetic wave shielding material can be provided.
Detailed Description
[ Electromagnetic wave shielding Material ]
An embodiment of the present invention relates to an electromagnetic wave shielding material having 1 or more magnetic layers containing magnetic particles and a resin, wherein the peak top temperature of loss tangent Tan delta in dynamic viscoelasticity measurement at 1Hz is 0 ℃ or more and less than 60 ℃.
In the present invention and the present specification, the "electromagnetic wave shielding material" refers to a material capable of exhibiting shielding ability against electromagnetic waves of at least one frequency or at least a part of a frequency band within a range. The "electromagnetic wave" includes magnetic field waves and electric field waves. The "electromagnetic wave shielding material" is preferably a material capable of exhibiting shielding ability against one or both of a magnetic field wave of a frequency band in a range of at least one frequency or at least a part thereof and an electric field wave of a frequency band in a range of at least one frequency or at least a part thereof.
In the present invention and in the present specification, "magnetic" means ferromagnetic (ferromagnetic property). Details of the magnetic layer will be described later.
< Peak top temperature of Tan delta >
The peak top temperature of the loss tangent Tan delta in the dynamic viscoelasticity measurement at 1Hz of the electromagnetic wave shielding material is 0 ℃ or more and less than 60 ℃. "Tan" is an abbreviation for Tangent. In the present invention and the present specification, the peak top temperature of the loss tangent Tan δ (dielectric loss tangent) is obtained by the dynamic viscoelasticity measurement described below.
The dynamic viscoelasticity measurement is performed using a dynamic viscoelasticity measurement device. As the dynamic viscoelasticity measuring device, for example, a dynamic viscoelasticity measuring device DMS6100 manufactured by HITACHI HIGH-TECH SCIENCE Corporation is used, and in the following examples, the device is used.
The measurement procedure was as follows.
A measurement sample having a length of 28mm by a width of 10mm was cut from an electromagnetic wave shielding material to be measured. In the dynamic viscoelasticity measuring device, the viscoelasticity of the measurement sample is measured under the following measurement conditions. The maximum point of the loss tangent Tan δ in the data of the temperature range of-50 ℃ to 100 ℃ thus measured was set as the peak top of the loss tangent Tan δ. When there are 2 or more of the maximum points in the data in the temperature range, the maximum point on the highest temperature side is set as the peak top of the loss tangent Tan δ. The peak top temperature thus determined was set as the peak top temperature of the loss tangent Tan δ. On the other hand, when the maximum point of the loss tangent Tan δ does not exist in the data in the above temperature range, it is determined that there is no peak top of Tan δ.
(Measurement conditions)
Chuck spacing: 10mm of
Measuring temperature range: -50 ℃ to 100 DEG C
Rate of temperature rise: 2 ℃/min
Sampling rate: 3 seconds
Measuring frequency: 1Hz
The peak top temperature of Tan delta of the electromagnetic wave shielding material is more than 0 ℃ and less than 60 ℃. The inventors speculate as follows: this contributes to the electromagnetic wave shielding material described above being able to exhibit excellent moldability. Regarding formability, forming performed without heating a forming object and/or a mold, or heating without excessively increasing temperature is generally called cold forming. The electromagnetic wave shielding material having a peak top temperature of Tan δ of 0 ℃ or higher and less than 60 ℃ is preferable from the viewpoint of suppressing cracking of a molded article obtained by three-dimensional molding by molding generally called cold molding. The inventors speculate as follows: this is because the peak top temperature of Tan δ can contribute to the electromagnetic wave shielding material exhibiting elongation suitable for cold forming in the above range. However, the present invention is not limited to the estimation described in the present specification. From the viewpoint of further improving moldability, the peak top temperature of Tan δ of the electromagnetic wave shielding material is preferably 58 ℃ or less, more preferably 55 ℃ or less, and further preferably 53 ℃ or less, 50 ℃ or less, 48 ℃ or less, 45 ℃ or less, 43 ℃ or less, 41 ℃ or less, 40 ℃ or less, less than 40 ℃, 38 ℃ or less, 35 ℃ or less, 33 ℃ or less, 30 ℃ or less in this order. On the other hand, the peak top temperature of Tan δ of the electromagnetic wave shielding material may be 0 ℃ or higher, for example, 1 ℃ or higher, 3 ℃ or higher, 5 ℃ or higher, 10 ℃ or higher, 12 ℃ or higher, 15 ℃ or higher, 17 ℃ or higher, or 20 ℃ or higher.
The peak top temperature of Tan δ can be controlled by the type of the layer constituting the electromagnetic wave shielding material, the type and content of the resin contained in the magnetic layer, and the like. In this regard, details will be described later.
The electromagnetic wave shielding material will be described in further detail below.
< Magnetic layer >
The electromagnetic wave shielding material has 1 or more magnetic layers containing magnetic particles and a resin. In one embodiment, the electromagnetic wave shielding material may be composed of only 1 magnetic layer or only 2 or more magnetic layers, and in another embodiment, the electromagnetic wave shielding material may include 1 or more of various layers described below.
(Magnetic particles)
As the magnetic particles, 1 kind selected from the group consisting of magnetic particles generally called soft magnetic particles, such as metal particles and ferrite particles, or 2 or more kinds may be used in combination. Since the metal particles generally have a saturation magnetic flux density of about 2 to 3 times that of ferrite particles, they are not magnetically saturated even in a strong magnetic field, and thus can maintain relative permeability and exhibit shielding ability. Therefore, the magnetic particles contained in the magnetic layer are preferably metal particles. In the present invention and the present specification, a layer containing metal particles as magnetic particles corresponds to a "magnetic layer".
Metal particles
Examples of the metal particles of the magnetic particles include particles such as a sendust alloy (fe—si—al alloy), a permalloy (fe—ni alloy), a molybdenum permalloy (fe—ni—mo alloy), a fe—si alloy, a fe—cr alloy, an Fe-containing alloy generally called an iron-based amorphous alloy, a Co-containing alloy generally called a cobalt-based amorphous alloy, an alloy generally called a nanocrystalline alloy, iron, permendur (Fe-Co alloy), and the like. Among them, the sendust alloy exhibits high saturation magnetic flux density and relative permeability, and is therefore preferable. The metal particles may contain, in addition to constituent elements of the metal (including the alloy), elements contained in additives that can be added at random and/or elements contained in impurities that may be unintentionally mixed in during the production process of the metal particles. The content of the constituent element of the metal (including the alloy) in the metal particles is preferably 90.0 mass% or more, more preferably 95.0 mass% or more, and may be 100 mass% or less, 99.9 mass% or less, or 99.0 mass% or less.
In one embodiment, the ability of the electromagnetic wave shielding material to shield electromagnetic waves can be evaluated using the magnetic permeability (in detail, the real part of complex relative magnetic permeability) of the magnetic layer included in the electromagnetic wave shielding material as an index. A magnetic layer having a magnetic layer exhibiting high magnetic permeability (in detail, complex relative magnetic permeability real part) is preferable because it can exhibit high shielding ability against electromagnetic waves.
When complex relative permeability is measured by the permeability measuring device, a real part μ 'and an imaginary part μ' are generally displayed. The complex relative permeability real part in the present invention and the present specification means the real part μ'. Hereinafter, the real part of complex relative permeability at a frequency of 3MHz (megahertz) is also simply referred to as "permeability". The magnetic permeability can be measured by a commercially available magnetic permeability measuring device or a magnetic permeability measuring device of a known structure. From the viewpoint of exhibiting a further excellent electromagnetic wave shielding ability, the magnetic permeability (complex relative real part of permeability at a frequency of 3 MHz) of the magnetic layer included in the electromagnetic wave shielding material is preferably 40 or more, more preferably 100 or more, and even more preferably 120 or more. The magnetic permeability may be 500 or less, 300 or 200 or less, or may be higher than the values exemplified herein. The electromagnetic wave shielding material having high magnetic permeability is preferable because it can exhibit excellent electromagnetic wave shielding ability.
From the viewpoint of forming a magnetic layer exhibiting high magnetic permeability, the magnetic particles are preferably particles having a flat shape (flat-shaped particles), and more preferably metal particles having a flat shape. By arranging the long-side direction of the flat-shaped particles to be more nearly parallel to the in-plane direction of the magnetic layer so that the long-side direction of the particles is further aligned with the vibration direction of the electromagnetic wave that is incident perpendicularly to the electromagnetic wave shielding material, the demagnetizing field can be reduced, and therefore the magnetic layer can exhibit higher permeability. In the present invention and the present specification, the term "flat particles" means particles having an aspect ratio of 0.20 or less. The aspect ratio of the flat particles is preferably 0.15 or less, more preferably 0.10 or less. The aspect ratio of the flat particles may be, for example, 0.01 or more, 0.02 or more, or 0.03 or more. For example, the particles can be flattened by a known method. For the flat processing, for example, the description of japanese patent application laid-open publication No. 2018-131640 can be referred to, and for example, the description of paragraphs 0016, 0017 and examples of japanese patent application laid-open publication No. 2018-131640 can be referred to. As the magnetic layer exhibiting high magnetic permeability, a magnetic layer containing flat-shaped particles of an sendust alloy is exemplified.
As described above, from the viewpoint of forming a layer exhibiting high magnetic permeability as a magnetic layer, it is preferable that the longitudinal direction of the flat particles be arranged more parallel to the in-plane direction of the magnetic layer. From this point of view, the degree of orientation, which is the sum of the absolute value of the average value of the orientation angles of the flat particles with respect to the surface of the magnetic layer and the variance of the orientation angles, is preferably 30 ° or less, more preferably 25 ° or less, further preferably 20 ° or less, and still more preferably 15 ° or less. The degree of orientation may be, for example, 3 ° or more, 5 ° or more, or 10 ℃ or more, or may be lower than the values exemplified herein. The method of controlling the degree of orientation will be described later.
In the present invention and the present specification, the aspect ratio of the magnetic particles and the degree of orientation are obtained by the following method.
The cross section of the magnetic layer is exposed by a known method. With respect to the randomly selected region of the cross section, a cross section image was acquired as a scanning electron microscope (SEM: scanning Electron Microscope) image. The shooting condition is set to an acceleration voltage: 2kV and multiplying power: 1000 times, and an SEM image was obtained as a reflected electron image.
The second argument is set to 0 by using the cv2.imread () function of the image processing library OpenCV4 (Intel Corporation), the second argument is read out in gray scale, and a binary image is obtained by using the cv2.threshold () function with the intermediate luminance between the high luminance portion and the low luminance portion as the boundary. The white portion (high brightness portion) in the binarized image is determined as the magnetic particles.
For the obtained binarized image, a rotation circumscribed rectangle corresponding to a portion of each magnetic particle was obtained using a cv2.minarea rect () function, and a long-side length, a short-side length, and a rotation angle were obtained as return values of the cv2.minarea rect () function. When the total number of magnetic particles included in the binarized image is obtained, particles including only a part of the particles in the binarized image are also included. Regarding particles contained in the binarized image, only a part of the particles, the long-side length, the short-side length, and the rotation angle are obtained for the part contained in the binarized image. The ratio of the short side length to the long side length (short side length/long side length) thus obtained was set as the aspect ratio of each magnetic particle. In the present invention and the present specification, when the aspect ratio is 0.20 or less and the number of magnetic particles determined as flat-shaped particles is 10% or more based on the total number of magnetic particles included in the binary image, the magnetic layer is determined to be "a magnetic layer containing flat-shaped particles as magnetic particles". Then, an "orientation angle" is obtained as a rotation angle with respect to the horizontal plane (surface of the magnetic layer) based on the rotation angle obtained as described above.
Particles having an aspect ratio of 0.20 or less obtained in the binarized image are determined as flat particles. The sum of the absolute value and the variance of the average value (arithmetic average) is calculated for the orientation angles of all the flat-shaped particles included in the binarized image. The sum thus obtained is referred to as "degree of orientation". In addition, coordinates of the circumscribed rectangle are calculated using a cv2.Box points () function, an image obtained by overlapping the rotated circumscribed rectangle on the original image is created using a cv2. Drawconters () function, and the rotated circumscribed rectangle which is clearly erroneously detected is excluded from calculation of the aspect ratio and the degree of orientation. The average value (arithmetic average) of the aspect ratios of the particles specified as the flat particles is set as the aspect ratio of the flat particles contained in the magnetic layer to be measured. The aspect ratio is 0.20 or less, preferably 0.15 or less, and more preferably 0.10 or less. The aspect ratio may be, for example, 0.01 or more, 0.02 or more, or 0.03 or more.
The content of the magnetic particles in the magnetic layer may be, for example, 50 mass% or more, 60 mass% or more, 70 mass% or more, or 80 mass% or more, and may be, for example, less than 100 mass%, 99 mass% or less, 98 mass% or less, or 95 mass% or less, relative to the total mass of the magnetic layer. The content of each component in the magnetic layer can be obtained by a known method such as TG/DTA (Thermogravimetry/DIFFERENTIAL THERMAL ANALYSIS: thermogravimetric-differential thermal analysis) or extraction of each component using a solvent. In addition, "TG/DTA" is commonly referred to as thermogravimetric differential thermal analysis. When the composition of the composition for forming a magnetic layer is known, the content of each component in the magnetic layer can be determined from the known composition.
In one aspect, the magnetic layer may be an insulating layer. In the present invention and in the present specification, "insulating property" means that the electrical conductivity is less than 1S (Siemens: siemens)/m. The conductivity of a certain layer is calculated from the surface resistivity of the layer and the thickness of the layer by the following formula. The conductivity can be measured by a known method.
Conductivity [ S/m ] =1/(surface resistivity [ Ω ]. Times.thickness [ m ])
The inventors speculate as follows: the magnetic layer is preferably an insulating layer, since the electromagnetic wave shielding material exhibits a further high electromagnetic wave shielding ability. In this regard, the conductivity of the magnetic layer is preferably less than 1S/m, more preferably 0.5S/m or less, still more preferably 0.1S/m or less, and still more preferably 0.05S/m or less. The conductivity of the magnetic layer may be, for example, 1.0X10 -12 S/m or more or 1.0X10 -10 S/m or more.
(Resin)
The magnetic layer is a layer containing magnetic particles and a resin. The resin can function as a binder in the magnetic layer. In the present invention and the present specification, the layer containing both the magnetic particles and the resin corresponds to a "magnetic layer". The resin content of the magnetic layer may be, for example, 5 mass% or more, and is preferably 10 mass% or more, more preferably 15 mass% or more, from the viewpoint of further improving moldability. The resin content of the magnetic layer may be, for example, 50 mass% or less, and is preferably 45 mass% or less, more preferably 40 mass% or less, further preferably 35 mass% or less, still more preferably 30 mass% or less, and further preferably 25 mass% or less, with respect to the total mass of the magnetic layer, from the viewpoint of improving the magnetic permeability of the magnetic layer.
In the present invention and in the present specification, "resin" means a polymer, and includes rubber and elastomer. The polymer includes a homopolymer (homopolymer) and a copolymer (copolymer). The rubber includes natural rubber and synthetic rubber. And, the elastomer is a polymer exhibiting elastic deformation. The resin contained in the magnetic layer may be a conventionally known thermoplastic resin, a thermosetting resin, an ultraviolet-curable resin, a radiation-curable resin, a rubber-based material, an elastomer, or the like. Specific examples thereof include polyester resins, polyethylene resins, polyvinyl chloride resins, polyvinyl butyral resins, polyurethane resins, polyester urethane resins, cellulose resins, ABS (acrylonitrile-butadiene-styrene) resins, nitrile-butadiene rubber, styrene-butadiene rubber, epoxy resins, phenolic resins, amide resins, silicone resins, styrene-based elastomers, olefin-based elastomers, vinyl chloride-based elastomers, polyester-based elastomers, polyamide-based elastomers, polyurethane-based elastomers, and acrylic-based elastomers. Among them, from the viewpoint of further improving moldability, a resin having a urethane structure such as a urethane resin, a polyester urethane resin, and a urethane elastomer is preferable. In the present invention and the present specification, the term "resin having a urethane structure" means a resin having a structure containing 1 or more urethane bonds (-nh—c (=o) O-). The type of the resin contained in the magnetic layer can be determined by, for example, organic analysis such as pyrolysis GC/MS (Gas Chromatography/Mass spectrometry: gas chromatography-mass spectrometry) or fourier transform infrared spectrometry. For example, when the isocyanate component residue and/or the polyol component residue is observed by pyrolysis GC/MS, it can be discriminated as a resin having a urethane structure.
The glass transition temperature Tg of the resin contained in the magnetic layer is preferably 50℃or lower, more preferably 40℃or lower, and further preferably 30℃or lower, 20℃or lower, 10℃or lower, 0℃or lower, and-10℃or lower in this order. The glass transition temperature Tg of the resin contained in the magnetic layer is preferably in the above range, and the peak top temperature of Tan δ of the electromagnetic wave shielding material is preferably controlled to be less than 60 ℃, and is also preferably from the viewpoint of imparting elongation to the electromagnetic wave shielding material more suitable for cold forming. The glass transition temperature Tg of the resin contained in the magnetic layer may be, for example, at least-50 ℃, at least-40 ℃, or at least-30 ℃. In the present invention and the present specification, the glass transition temperature Tg of the resin is a value obtained from the measurement result of the heat flow measurement using a differential scanning calorimeter as the baseline shift start temperature of the thermal flow chart at the time of temperature increase.
The magnetic layer may contain 1 or more of known additives such as a curing agent, a dispersing agent, a stabilizer, and a coupling agent in addition to the above components in any amount.
For example, as the curing agent, a compound having a crosslinkable group can be mentioned. In the present invention and the present specification, the "crosslinkable group" means a group capable of undergoing a crosslinking reaction, and specific examples thereof include isocyanate groups. The curing agent is preferably a compound having 2 or more (for example, 2 or more and 4 or less) crosslinkable groups in 1 molecule, and specific examples thereof include polyisocyanates. Polyisocyanates are compounds having 2 or more isocyanate groups in 1 molecule. In one embodiment, the resin contained in the magnetic layer is 100 parts by mass, and the magnetic layer preferably contains 1 part by mass or more of a curing agent, and more preferably contains 2.5 parts by mass or more of a curing agent. In one embodiment, the magnetic layer may contain 100 parts by mass or less of a curing agent or 40 parts by mass or less of a resin contained in the magnetic layer. In the case where the curing agent is a compound having a crosslinkable group, the curing agent may be contained in the magnetic layer containing the curing agent in a form after at least a part of the crosslinkable group undergoes a crosslinking reaction.
The electromagnetic wave shielding material may include at least 1 magnetic layer, specifically, may include only 1 magnetic layer, or may include 2 or more magnetic layers having the same composition and/or thickness.
In the case where the electromagnetic wave shielding material includes only 1 magnetic layer, the thickness of the 1 magnetic layer may be, for example, 5 μm or more, and is preferably 10 μm or more, more preferably 20 μm or more, from the viewpoint of further improving the shielding ability against electromagnetic waves. The thickness of the 1-layer magnetic layer may be, for example, 100 μm or less or 90 μm or less, and is preferably less than 90 μm, more preferably 80 μm or less, and even more preferably 70 μm or less from the viewpoint of further improving moldability.
In the case where the electromagnetic wave shielding material includes 2 or more magnetic layers, the thickness of each of these 2 or more magnetic layers (i.e., the thickness of each layer) may be, for example, 5 μm or more, and from the viewpoint of further improving the shielding ability against electromagnetic waves, it is preferably 10 μm or more, and more preferably 20 μm or more. The thickness of the 1-layer magnetic layer may be, for example, 100 μm or less or 90 μm or less, and is preferably less than 90 μm, more preferably 80 μm or less, from the viewpoint of further improving moldability. The respective thicknesses of the 2 or more magnetic layers may be the same thickness or different thicknesses.
The thicknesses of the respective layers included in the electromagnetic wave shielding material were obtained by taking a cross section exposed by a known method by a scanning electron microscope (SEM: scanning Electron Microscope) and taking an arithmetic average of the thicknesses at 5 points randomly selected in the obtained SEM image.
In one embodiment, the electromagnetic wave shielding material may be composed of only a single layer of the magnetic layer, and in another embodiment, the electromagnetic wave shielding material may include 1 or more magnetic layers and 1 or more other layers. Hereinafter, various layers that can be included in the electromagnetic wave shielding material will be described.
< Adhesive layer >
The electromagnetic wave shielding material may include 1 or more adhesive layers. In the above electromagnetic wave shielding material, at least 1 adhesive layer can be provided as a layer in direct contact with the magnetic layer. In the present invention and in the present specification, with respect to the layers of 2 layers, "direct contact" means that no other layer exists between the layers of these 2 layers. In the present invention and the present specification, the "adhesive layer" means a layer having adhesiveness on the surface at normal temperature. Here, "normal temperature" means 23 ℃. The layer adheres to the adherend by its adhesion when in contact with the adherend. The tackiness is generally a property of exhibiting tackiness in a short time after contacting an adherend with a very light force, and in the present invention and the present specification, "having tackiness" means that it is expressed in JIS Z0237: in the inclined ball adhesion test (measurement environment: temperature 23 ℃ C., relative humidity 50%) specified in 2009, the results were No.1 to No.32. When another layer is laminated on the surface of the adhesive layer, for example, the surface of the adhesive layer exposed by peeling the other layer can be subjected to the above test. When other layers are laminated on one surface and the other surface of the adhesive layer, the other layer on either surface side may be peeled off. The electromagnetic wave shielding material includes an adhesive layer, and it is preferable to control the peak top temperature of Tan δ of the electromagnetic wave shielding material to be less than 60 ℃, and it is also preferable to impart elongation to the electromagnetic wave shielding material more suitable for cold forming.
In one aspect, the adhesive layer may have a glass transition temperature Tg of, for example, less than 50 ℃,45 ℃ or less than 40 ℃, and may also be, for example, greater than-70 ℃. The glass transition temperature Tg of the adhesive layer was obtained as an intermediate temperature between the start point and the end point of the drop in the DSC (DIFF ERENTIAL SCANNING differential scanning calorimetry) chart from the measurement result of the heat flow measurement using the differential scanning calorimeter.
As the adhesive layer, an adhesive layer formed by applying an adhesive layer forming composition containing an adhesive such as an acrylic adhesive, a rubber adhesive, a silicone adhesive, or a urethane adhesive and processing the adhesive layer into a film can be used.
The composition for forming an adhesive layer may be applied to a support, for example. The coating can be performed using a known coating apparatus such as a blade coater or a die coater. The application may be performed in a so-called roll-to-roll manner, or may be performed in a batch manner.
Examples of the support to which the composition for forming an adhesive layer is applied include films of various resins such as polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic acid such as Polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone and polyimide. As the support, a support having a surface (coated surface) to which the composition for forming an adhesive layer is applied subjected to a peeling treatment by a known method can be used. One example of the method of the peeling treatment is to form a release layer. Further, as the support, a commercially available resin film having been subjected to a peeling treatment can be used. By using a support having a surface to be coated subjected to a peeling treatment, the pressure-sensitive adhesive layer and the support can be easily separated after film formation.
The electromagnetic wave shielding material in which the magnetic layer and the adhesive layer are laminated can also be produced by applying the adhesive layer-forming composition in which the adhesive is dissolved and/or dispersed in a solvent to the magnetic layer and drying the same.
In order to produce an electromagnetic wave shielding material having an adhesive layer, an adhesive tape including an adhesive layer can also be used. As the adhesive tape, a double-sided tape can be used. The double-sided tape is a double-sided tape in which adhesive layers are disposed on both sides of a support, and the double-sided adhesive layers can have adhesion at normal temperature. As the adhesive tape, an adhesive tape having an adhesive layer disposed on one surface of a support may be used. Examples of the support include films, nonwoven fabrics, papers, and the like of various resins such as polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic such as Polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, and the like. As the adhesive tape having the adhesive layer disposed on one or both sides of the support, commercially available ones can be used, and a double-sided adhesive tape produced by a known method can also be used.
The electromagnetic wave shielding material may have 1 or more adhesive layers, and more specifically, may have 1 adhesive layer alone or 2 or more adhesive layers having the same composition and/or thickness. The total number of layers of the adhesive layer included in the electromagnetic wave shielding material may be, for example, 1 layer or more and 4 layers or less, or may be 1 layer or 2 layers.
In the case where the electromagnetic wave shielding material includes only 1 adhesive layer, the thickness of the 1 adhesive layer may be, for example, 0.5 μm or more, preferably 1 μm or more, and more preferably 2 μm or more. The thickness of the 1-layer adhesive layer may be, for example, 20 μm or less or 10 μm or less.
In the case where the electromagnetic wave shielding material includes 2 or more adhesive layers, the thickness of each of these 2 or more adhesive layers (i.e., the thickness of each layer) may be, for example, 0.5 μm or more, preferably 0.8 μm or more, and more preferably 1.5 μm or more. The thickness of the 1-layer adhesive layer may be, for example, 10 μm or less or 5 μm or less. The respective thicknesses of the adhesive layers of 2 or more may be the same thickness or different thicknesses.
In one embodiment, the electromagnetic wave shielding material may be an electromagnetic wave shielding material composed of 2 layers of 1 magnetic layer and 1 adhesive layer. In another embodiment, the electromagnetic wave shielding material may be an electromagnetic wave shielding material composed of 3 layers of a magnetic layer, an adhesive layer, and a magnetic layer, and sequentially including the 3 layers. In another embodiment, the electromagnetic wave shielding material may have a resin layer between 2 adhesive layers. For example, the electromagnetic wave shielding material may include a laminated structure of the magnetic layer and a resin layer between 2 adhesive layers. In the laminated structure having the resin layer between the 2 adhesive layers, the resin layer may be a layer in direct contact with one or both of the 2 adhesive layers, preferably a layer in direct contact with both adhesive layers. In one embodiment, the electromagnetic wave shielding material may be an electromagnetic wave shielding material composed of 4 layers of a magnetic layer, an adhesive layer, a resin layer, and an adhesive layer, and sequentially including the 4 layers. In another aspect, the electromagnetic wave shielding material may have a laminated structure in which a resin layer is provided between 2 adhesive layers on both sides of the magnetic layer. As the electromagnetic wave shielding material having such a structure, there can be mentioned an electromagnetic wave shielding material which is composed of 7 layers of an adhesive layer, a resin layer, an adhesive layer, a magnetic layer, an adhesive layer, a resin layer, and an adhesive layer and sequentially includes these 7 layers. In another aspect, the electromagnetic wave shielding material may further include a metal layer in each layer structure.
The electromagnetic wave shielding material is preferably provided with a resin layer between 2 adhesive layers, from the viewpoint of imparting extensibility to the electromagnetic wave shielding material that is more suitable for cold forming. In the present invention and the present specification, the "resin layer" means a layer containing a resin, and may be a layer containing a resin as a main component. The main component is the component that occupies the largest amount on a mass basis among the components constituting the layer. The resin content of the resin layer is preferably 50 mass% or more, more preferably 70 mass% or more, and even more preferably 90 mass% or more, relative to the total mass of the resin layer. The content of the resin in the resin layer may be, for example, 100 mass% or less, less than 100 mass%, or 99 mass% or less, based on the total mass of the resin layer. The resin layer contains 1 or 2 or more kinds of resins, and may contain 1 or more kinds of known additives such as plasticizers, curing agents, dispersants, stabilizers, coupling agents, and the like in an arbitrary amount in addition to the resins.
As the resin layer, for example, a commercially available resin film which can be used as a plastic base material, a resin film produced by a known method, or the like can be used. Examples of the resin included in the resin layer include resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene, polypropylene, cellophane, cellulose acetate butyrate, triacetyl cellulose, acetyl cellulose butyrate, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, an ethylene-vinyl acetate copolymer, polystyrene, polycarbonate, polymethylpentene, polysulfone, polyether ether ketone, polyether sulfone, polyether imide, polyimide, a fluororesin, nylon, an acrylic resin, polyamide, cycloolefin, and polyether sulfone. Among them, a resin film of polyethylene terephthalate, polyethylene naphthalate, nylon or the like is preferable in view of high mechanical strength. One embodiment of the resin layer is a support of the double-sided tape.
The thickness of the resin layer is preferably 0.1 μm or more, more preferably 1 μm or more. The thickness of the resin layer is, for example, preferably 100 μm or less, more preferably 10 μm or less, and still more preferably less than 10 μm. The electromagnetic wave shielding material may include only 1 resin layer disposed between 2 adhesive layers, or may include 2 or more layers (for example, 2 or 3 layers).
The glass transition temperature Tg of the resin layer may be, for example, 50 ℃ or more, 60 ℃ or more, or 70 ℃ or more, and may be, for example, 150 ℃ or less, 130 ℃ or less, or 110 ℃ or less. The glass transition temperature Tg of the resin layer was obtained as an intermediate temperature between the start point and the end point of the drop in a DSC (DIFFERENTIAL SCANNING differential scanning calorimeter) chart from the measurement result of the heat flow measurement using a differential scanning calorimeter.
< Metal layer >
In the present invention and in the present specification, "metal layer" means a layer containing a metal. The metal layer may be a layer containing 1 or more metals, as a pure metal composed of a single metal element, as an alloy of 2 or more metal elements, or as an alloy of 1 or more metal elements and 1 or more nonmetallic elements.
The electromagnetic wave shielding material may further include 1 or 2 or more metal layers. In one embodiment, the composition and thickness of the 2 or more metal layers are the same, and in another embodiment, the composition and/or thickness of the 2 or more metal layers are different. In the electromagnetic wave shielding material including 2 or more metal layers, 1 or more magnetic layers can be disposed at positions sandwiched between 2 metal layers. Here, the magnetic layer sandwiched between 2 metal layers may be a layer in direct contact with one or both of the 2 metal layers, or may be a layer in indirect contact via 1 or more other layers (e.g., an adhesive layer). The metal layer may be, for example, the outermost layer of one or both of the electromagnetic wave shielding materials. In one embodiment, the electromagnetic wave shielding material may include a metal layer, the laminated structure (that is, a laminated structure including a resin layer between 2 adhesive layers), a magnetic layer, the laminated structure, and a metal layer in this order. In this embodiment, the electromagnetic wave shielding material may be, for example, an electromagnetic wave shielding material composed of 9 layers of a metal layer, an adhesive layer, a resin layer, an adhesive layer, a magnetic layer, an adhesive layer, a resin layer, an adhesive layer, and a metal layer, and sequentially including the 9 layers. The laminated structure may include a metal layer, the laminated structure (that is, a laminated structure including a resin layer between 2 adhesive layers), a magnetic layer, the laminated structure, a metal layer, the laminated structure, a magnetic layer, the laminated structure, and a metal layer in this order. In this embodiment, the electromagnetic wave shielding material may be, for example, an electromagnetic wave shielding material composed of 17 layers of a metal layer, an adhesive layer, a resin layer, an adhesive layer, a magnetic layer, an adhesive layer, a resin layer, an adhesive layer, and a metal layer, and sequentially including these 17 layers. The structure in which the magnetic layer is sandwiched by 2 metal layers is preferable from the viewpoint of improving the shielding ability against magnetic field waves having a frequency in the range of 0.01 to 100 MHz.
As the metal layer, a layer containing 1 or more metals selected from the group consisting of various pure metals and various alloys can be used. The metal layer can exert an attenuation effect in the shielding material. The larger the propagation constant is, the larger the attenuation effect is, and the larger the conductivity is, the larger the propagation constant is, and therefore the metal layer preferably contains a metal element having high conductivity. In this regard, the metal layer preferably contains a pure metal of Ag, cu, au or Al, or an alloy containing any of these as a main component. The pure metal is a metal composed of a single metal element, and can contain a trace amount of impurities. In general, a metal having a purity of 99.0% or more composed of a single metal element is called a pure metal. The purity is the quality standard. The alloy is usually composed of a pure metal to which 1 or more kinds of metal elements or nonmetal elements are added for corrosion resistance, strength improvement, and the like. The main component in the alloy is the highest component in terms of mass, and may be, for example, 80.0 mass% or more (for example, 99.8 mass% or less) of the alloy. From the viewpoint of economy, a pure metal of Cu or Al or an alloy containing Cu or Al as a main component is preferable, and from the viewpoint of high conductivity, a pure metal of Cu or an alloy containing Cu as a main component is more preferable.
The purity of the metal in the metal layer, that is, the content of the metal may be 99.0 mass% or more, preferably 99.5 mass% or more, and more preferably 99.8 mass% or more, relative to the total mass of the metal layer. Unless otherwise specified, the content of the metal in the metal layer refers to the content of the mass basis. For example, as the metal layer, a pure metal or alloy processed into a sheet shape can be used. For example, a commercially available metal foil or a metal foil manufactured by a known method can be used as the metal layer. As for pure metals of Cu, sheets (so-called copper foils) of various thicknesses are commercially available. For example, the copper foil can be used as a metal layer. Examples of the copper foil include an electrolytic copper foil obtained by depositing a copper foil on a cathode by electroplating from a production method thereof, and a rolled copper foil obtained by rolling an ingot to be thin by applying heat and pressure thereto. Any copper foil can be used as the metal layer of the electromagnetic wave shielding material. Further, for example, as for Al, sheets (so-called aluminum foils) having various thicknesses are also commercially available. For example, the aluminum foil can be used as the metal layer.
From the viewpoint of weight reduction of the electromagnetic wave shielding material, one or both (preferably both) of the 2 metal layers included in the above-described multilayer structure are preferably metal layers containing a metal selected from the group consisting of Al and Mg. This is because the specific gravity of Al and Mg divided by the conductivity (specific gravity/conductivity) are small. The weight of the electromagnetic wave shielding material exhibiting high shielding ability can be reduced by using a metal having a smaller value. As the values calculated from the literature values, for example, values obtained by dividing specific gravities of Cu, al, and Mg by electric conductivity (specific gravities/electric conductivities) are as follows. Cu: 1.5X10 -7m/S,Al：7.6×10-8m/S,Mg：7.6×10-8 m/S. From the above values, al and Mg may be metals that are preferable from the viewpoint of weight reduction of the electromagnetic wave shielding material. In one aspect, the metal layer including a metal selected from the group consisting of Al and Mg may include only one of Al and Mg, and in another aspect, the metal layer including a metal selected from the group consisting of Al and Mg may include both. From the viewpoint of weight reduction of the electromagnetic wave shielding material, one or both (preferably both) of the 2 metal layers included in the multilayer structure are more preferably metal layers having a metal content of 80.0 mass% or more selected from the group consisting of Al and Mg, and still more preferably metal layers having a metal content of 90.0 mass% or more selected from the group consisting of Al and Mg. The metal layer containing at least Al in Al and Mg may be a metal layer having an Al content of 80.0 mass% or more, or may be a metal layer having an Al content of 90.0 mass% or more. The metal layer containing at least Mg in Al and Mg may be a metal layer having a Mg content of 80.0 mass% or more, or may be a metal layer having a Mg content of 90.0 mass% or more. The content of the metal selected from the group consisting of Al and Mg, the Al content and Mg content may be, for example, 99.9 mass% or less, respectively. The content of the metal selected from the group consisting of Al and Mg, the content of Al, and the content of Mg are content ratios with respect to the total mass of the metal layer, respectively.
< E' >, at 60 >
In view of the fact that the electromagnetic wave shielding material can exhibit elongation more suitable for cold forming, the storage modulus E' in the dynamic viscoelasticity measurement at 1Hz of the electromagnetic wave shielding material is preferably 0.010GPa or more, more preferably 0.020 or more at 60 ℃. The electromagnetic wave shielding material may have an E' of 11.000GPa or less at 60 ℃. The electromagnetic wave shielding material preferably has an E' of less than 10.000GPa at 60℃from the viewpoint that the electromagnetic wave shielding material can exhibit elongation more suitable for cold forming, more preferably 9.000GPa or less, and still more preferably 5.000GPa. In the present invention and the present specification, E' at 60℃of the electromagnetic wave shielding material is a value obtained by dynamic viscoelasticity measurement using the method described above for Tan delta. The E' at 60℃can be controlled by the type of the layer constituting the electromagnetic wave shielding material, the type and content of the resin contained in the magnetic layer, and the like. For example, as a method for controlling E' at 60 ℃ within the above-described range, an adhesive layer is included in the electromagnetic wave shielding material, a resin having a glass transition temperature within the above-described range is used as the resin of the magnetic layer, and the content of the resin in the magnetic layer is set within the above-described range.
< Method for producing electromagnetic wave shielding Material >
(Method for forming magnetic layer)
The magnetic layer can be produced, for example, by drying a coating layer provided by applying a composition for forming a magnetic layer. The composition for forming a magnetic layer may contain 1 or more solvents as desired, including the components described above. Examples of the solvent include various organic solvents, for example, ketone solvents such as acetone, methyl ethyl ketone, and cyclohexanone, acetate solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate, carbitol solvents such as cellosolve, butyl carbitol, aromatic hydrocarbon solvents such as toluene, and xylene, and amide solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. 1 solvent or 2 or more solvents selected in consideration of the solubility of components used in the preparation of the magnetic layer-forming composition can be mixed in an arbitrary ratio. The solvent content of the magnetic layer-forming composition is not particularly limited, and may be determined in consideration of the coatability of the magnetic layer-forming composition, and the like.
The composition for forming a magnetic layer can be prepared by mixing the various components sequentially or simultaneously in any order. If necessary, the dispersion treatment may be performed using a known dispersing machine such as a ball mill, a bead mill, a sand mill, or a roll mill, or the stirring treatment may be performed using a known stirring machine such as a vibration type stirring machine.
The composition for forming a magnetic layer can be applied to a support, for example. The coating can be performed using a known coating apparatus such as a blade coater or a die coater. The application may be performed in a so-called roll-to-roll manner, or may be performed in a batch manner.
Examples of the support to which the composition for forming a magnetic layer is applied include films of various resins such as polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic acid such as Polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone and polyimide. For these resin films, reference can be made to paragraphs 0081 to 0086 of Japanese patent application laid-open No. 2015-187260. As the support, a support having a surface (coated surface) to which the composition for forming a magnetic layer is applied subjected to a peeling treatment by a known method can be used. One example of the method of the peeling treatment is to form a release layer. For the release layer, refer to paragraph 0084 of Japanese patent application laid-open No. 2015-187260. Further, as the support, a commercially available resin film having been subjected to a peeling treatment can be used. By using a support having a surface to be coated subjected to a peeling treatment, the magnetic layer and the support can be easily separated after film formation.
In one embodiment, the adhesive layer may be used as a support, the adhesive tape having the adhesive layer may be used as a support, or a laminated structure having a resin layer between 2 layers may be used as a support, and the composition for forming a magnetic layer may be directly applied to the adhesive layer or the adhesive layer of the laminated structure.
The coating layer formed by applying the magnetic layer-forming composition can be dried by a known method such as heating or blowing hot air. The drying treatment can be performed under conditions that volatilize the solvent contained in the magnetic layer-forming composition, for example. For example, the drying treatment may be performed in a heated atmosphere at an atmosphere temperature of 80 to 150 ℃ for 1 minute to 2 hours.
The composition for forming a magnetic layer containing a curing agent in addition to the magnetic particles and the resin can be referred to as the curing agent. The magnetic layer formed using the composition for forming a magnetic layer can be subjected to a curing treatment with a curing agent at any stage. As the curing treatment, a heat treatment or a light irradiation treatment can be performed according to the kind of the curing agent. For example, in the case where the curing treatment is a heat treatment, the heat treatment may be performed before the pressure treatment described later, or the heat treatment may be performed after the pressure treatment described later. According to the studies of the present inventors, the following trends were found: when the heat treatment is performed after the pressure treatment, the magnetic permeability of the formed magnetic layer is improved. The heat treatment can be performed, for example, by keeping the magnetic layer before or after the pressure treatment in an atmosphere at a temperature of 35 ℃ or higher (for example, 35 ℃ or higher and 150 ℃ or lower). The holding time may be, for example, 3 to 72 hours.
The degree of orientation of the flat particles described above can be controlled by the type of solvent, the amount of solvent, the viscosity of the liquid, the thickness of the coating, and the like of the magnetic layer forming composition. For example, if the boiling point of the solvent is low, convection occurs due to drying, and the value of the degree of orientation tends to be large. If the amount of the solvent is small, the value of the degree of orientation tends to be large due to physical interference between the similar flat particles. On the other hand, if the liquid viscosity is low, the value of the degree of orientation tends to be small because rotation of the flat particles is likely to occur. When the coating thickness is made thinner, the value of the degree of orientation tends to be smaller. Further, the compression treatment described later can contribute to a reduction in the value of the degree of orientation. By adjusting the above-described various production conditions, the degree of orientation of the flat particles can be controlled within the above-described range.
(Pressure treatment of magnetic layer)
The magnetic layer may be subjected to a pressure treatment after film formation. By subjecting the magnetic layer containing the magnetic particles to a pressure treatment, the density of the magnetic particles in the magnetic layer can be increased, and higher magnetic permeability can be obtained. Further, the magnetic layer including the flat particles can be reduced in the value of the degree of orientation by the pressurization treatment, and can obtain higher magnetic permeability.
The pressurization treatment can be performed by applying pressure to the thickness direction of the magnetic layer using a flat press, a roll press, or the like. The flat press is capable of disposing a pressed object between flat 2 press plates disposed vertically, bonding the 2 press plates by mechanical or hydraulic pressure, and applying pressure to the pressed object. The roller press is capable of passing a pressed object between rotating pressing rollers arranged vertically, and applying pressure to the pressing rollers by applying mechanical or hydraulic pressure thereto or by making the distance between the pressing rollers smaller than the thickness of the pressed object.
The pressure during the pressurization treatment can be arbitrarily set. For example, in the case of a flat extruder, it is, for example, 1 to 50N (Newton)/mm 2. In the case of a roll extruder, for example, the line pressure is 20 to 400N/mm.
The pressurization time can be arbitrarily set. In the case of using a flat extruder, for example, it is 5 seconds to 4 hours. In the case of using a roll extruder, the pressing time can be controlled by the conveying speed of the object to be pressed, for example, the conveying speed is 10 cm/min to 200 m/min.
The material of the pressing plate and the pressing roller can be arbitrarily selected from metal, ceramic, plastic, rubber, and the like.
In the press treatment, for example, the heat and pressure treatment may be performed by applying a temperature to both the upper and lower sides of the plate-like press or to one side of the upper and lower rolls of the roll press. In the heating and pressurizing treatment, the magnetic layer can be softened by heating, whereby a high compression effect can be obtained when pressure is applied. The temperature at the time of heating can be arbitrarily set, and is, for example, 50 ℃ to 200 ℃. The temperature at the time of heating may be the internal temperature of the pressing plate or the roller. The temperature can be measured by a thermometer provided inside the squeeze plate or the roller. In one embodiment, the curing treatment using the heat treatment as the curing agent may be performed before the heat and pressure treatment or after the heat and pressure treatment. The heat treatment is as described above.
After the heat and pressure treatment by the plate-like extruder, the extrusion plate can be separated and the magnetic layer can be taken out, for example, in a state where the temperature of the extrusion plate is high. Alternatively, the squeeze plate may be cooled in a state of being kept under pressure by a method such as water cooling or air cooling, and then the squeeze plate may be separated and the magnetic layer may be taken out.
In the roll extruder, the magnetic layer can be cooled immediately after extrusion by water cooling, air cooling, or the like.
The pressurizing treatment may be repeated 2 or more times.
When the magnetic layer is formed on the release film, for example, the pressure treatment can be performed in a state of being laminated on the release film. Alternatively, the magnetic layer may be peeled from the release film and subjected to pressure treatment with a single layer of the magnetic layer.
(Lamination of various layers)
As described above, the adhesive layer may be bonded to the magnetic layer as an adhesive tape, or may be laminated to the magnetic layer by applying the adhesive layer-forming composition to the magnetic layer and drying the same.
The metal layer can be incorporated into the electromagnetic wave shielding material as a layer in direct contact with the adhesive layer by bonding to the adhesive layer, for example.
In the electromagnetic wave shielding material, for example, 2 adjacent layers can be bonded by pressure and heat application and pressure bonding. The press-bonding can use a flat extruder, a roll extruder, or the like. For example, in the case where the magnetic layer is arranged as a layer in direct contact with the metal layer, the magnetic layer is softened and contact with the surface of the metal layer is promoted in the pressure bonding step, so that 2 adjacent layers can be bonded. The pressure at the time of press-bonding can be arbitrarily set. In the case of a flat extruder, for example, it is 1 to 50N/mm2. In the case of a roll extruder, for example, the line pressure is 20 to 400N/mm. The pressing time at the time of press-bonding can be arbitrarily set. In the case of using a flat extruder, for example, the time is 5 seconds to 30 minutes. In the case of using a roll extruder, the transfer speed of the pressurized material can be controlled, for example, to 10 cm/min to 200 m/min. The temperature at the time of crimping can be arbitrarily selected. For example, 20 ℃ to 200 ℃.
The electromagnetic wave shielding material can be incorporated into an electronic component or an electronic device in any shape. The electromagnetic wave shielding material may be in the form of a sheet, and the size thereof is not particularly limited. In the present invention and the present specification, "sheet" and "film" have the same meaning. The electromagnetic wave shielding material may be a three-dimensional molded article obtained by three-dimensionally molding a sheet-shaped electromagnetic wave shielding material, or may be a sheet-shaped electromagnetic wave shielding material used for three-dimensional molding. As the three-dimensional molding method, various molding methods such as compression molding, vacuum molding, and pressure molding can be used. Among them, the electromagnetic wave shielding material is excellent in moldability against cold molding, and therefore cold molding such as drawing molding and stretch molding is preferably applied to the electromagnetic wave shielding material. The drawing forming method comprises the following steps: a sheet-shaped object to be molded is extruded using a pair of dies of a female die and a male die to form a bottomed container having various shapes such as a cylinder, a horn, a cone, and the like. In contrast, a method of forming a molded article having a curved surface stretched from a flat surface from a sheet-like molded object is stretch molding. The stretch forming can be performed by extrusion using only a male die without using a female die. The drawing molding is largely classified into deep drawing molding and shallow drawing molding. A molded article having a shallow depth is molded by shallow drawing, and a molded article having a deep depth (for example, a depth deeper than the diameter of a cylinder or a cone or the length of one side of a pyramid) is molded by deep drawing. The electromagnetic wave shielding material may be one which is not easily broken when molded by the stereolithography method. The stereolithography method can be applied to known techniques.
[ Electronic parts ]
One aspect of the present invention relates to an electronic component including the electromagnetic wave shielding material. Examples of the electronic component include various electronic components such as electronic components included in electronic devices such as mobile phones, mobile information terminals, and medical devices, semiconductor elements, capacitors, coils, and cables. The electromagnetic wave shielding material may be formed into an arbitrary shape according to the shape of the electronic component and disposed inside the electronic component, or may be formed into a shape of a covering material covering the outside of the electronic component and disposed as a covering material. Or can be disposed as a covering material which is three-dimensionally formed into a tube shape and covers the outside of the cable.
[ Electronic device ]
One aspect of the present invention relates to an electronic device including the electromagnetic wave shielding material. Examples of the electronic device include electronic devices such as mobile phones, mobile information terminals, and medical devices, electronic devices including various electronic components such as semiconductor elements, capacitors, coils, and cables, and electronic devices in which electronic components are mounted on a circuit board. The electronic device can contain the electromagnetic wave shielding material as a constituent member of an electronic component included in the device. The electromagnetic wave shielding material may be disposed inside the electronic device as a component of the electronic device, or may be disposed as a cover material covering the outside of the electronic device. Or can be disposed as a covering material which is three-dimensionally formed into a tube shape and covers the outside of the cable.
As an example of the use of the electromagnetic wave shielding material, a use of a semiconductor package on a printed board coated with the shielding material is given. For example, in "electromagnetic wave shielding technology in semiconductor package" (Toshiba review vol.67no.2 (2012) P.8), a method of performing ground wiring by electrically connecting a side via hole at an end portion of a package substrate with an inner side surface of a shielding material when coating the semiconductor package with the shielding material to obtain a high shielding effect is disclosed. In order to perform such wiring, the electronic component side outermost layer of the shielding material is preferably a metal layer. In one embodiment, the outermost layer of one or both of the electromagnetic wave shielding materials may be a metal layer, and thus can be preferably used in the case of wiring as described above.
Examples
Hereinafter, the present invention will be described in further detail with reference to examples. However, the present invention is not limited to the embodiments shown in the examples.
[ Resin of magnetic layer ]
The resins of the magnetic layers shown in table 1 are the following resins. In table 1, the polyester urethane resin is expressed as "polyester urethane", the silicone resin is expressed as "silicone", and the polyurethane resin is expressed as "polyurethane".
The polyester urethane resin having a glass transition temperature Tg of-30 ℃ is UR-6100 manufactured by TOYOBO CO.
Polyester urethane resins having a glass transition temperature Tg of-11 ℃ were prepared by mixing touobo co., ltd. UR-8300 and touobo co., ltd. UR-8700 at 1:3 mass ratio of the resin obtained by mixing.
The polyester urethane resin having a glass transition temperature Tg of 23 ℃ is UR-8300 manufactured by TOYOBO co.
The Silicone resin having a glass transition temperature Tg of-13 ℃ is a Silicone rubber KE-541-U manufactured by Shin-Etsu Silicone Co., ltd.
The polyester urethane resin having a glass transition temperature Tg of 73℃is UR-8200 manufactured by TOYOBO CO., ltd.
The polyurethane resin having a glass transition temperature Tg of-50 ℃ was Nipp oran5120 manufactured by TOSOH CORPORATION.
The glass transition temperatures of the resins shown in table 1 are values obtained by the following methods.
The same resin (granular or powdery sample) as that used in the preparation of the composition (coating liquid) for forming a magnetic layer was put in an aluminum sample pan, sealed in an extruder, and measured for heat flow by the following conditions using Q100 manufactured by TA Instruments as a differential scanning calorimeter. Based on the measurement results, the glass transition temperature of the resin was obtained as the baseline shift start temperature of the thermal flowchart at the time of temperature increase.
(Measurement conditions)
Scanning temperature: -80.0-200.0 DEG C
Heating rate: 10.0 ℃/min
Example 1
< Preparation of composition (coating liquid) for Forming magnetic layer >
Adding into plastic bottle
36G of Fe-Si-Al flat magnetic particles (MARKELYTICS SOLUTIONS INDIA A. Si/Al alloy MFS-SUH manufactured by Private Limited),
20G of a polyester urethane resin (refer to Table 1, solid content: 45% by mass),
0.45G of polyfunctional isocyanate (CORONATE 3041 manufactured by TOSOH CORPORATION) and 84g of cyclohexanone,
The mixture was mixed with a vibration mixer for 1 hour, thereby preparing a coating liquid.
< Preparation of magnetic layer >
(Film formation of magnetic layer)
The coating liquid was applied to the peeled surface of a PET film (PET 75TR made by Nippa Corporation, hereinafter referred to as "peeled film") after the peeling treatment by a blade coater having a coating gap of 300. Mu.m, and dried in a drying apparatus having an internal atmosphere temperature of 80℃for 60 minutes, thereby forming a film-like magnetic layer. After that, as a curing treatment, the magnetic layer on the release film was kept in a drying apparatus at an internal atmosphere temperature of 60 ℃ for 48 hours together with the release film and subjected to a heat treatment in order to crosslink the polyester urethane resin contained in the magnetic layer with the polyfunctional isocyanate.
(Pressure treatment of magnetic layer)
The upper and lower squeeze plates of a plate-like squeeze machine (YAMAMOTO ENG. WORKS Co,. LTD. Large scale heat squeeze machine TA-200-1W) were heated to 140℃and the magnetic layer on the release film was placed in the center of the squeeze plate together with the release film, and the pressure of 4.66N/mm 2 was applied for 10 minutes. After the upper and lower squeeze plates were cooled to 50 c (the internal temperature of the squeeze plates) with the pressure maintained, the magnetic layer was taken out together with the release film.
< Preparation of shielding Material >
As a double-sided tape having adhesive layers disposed on both sides of a support, MK6G manufactured by Iwatani Corpor ation (in table 1, "MK 6G") was used. The double-sided tape is composed of 5 layers of a release (light-release) polyethylene terephthalate (PET) film, an adhesive layer (an acrylic adhesive-containing layer), a PET film (a support (glass transition temperature Tg:70 ℃) obtained by the method described above as a method for measuring glass transition temperature of a resin layer)), an adhesive layer (an acrylic adhesive-containing layer), and a release (strong-release) PET film, and the 2 adhesive layers disposed on both sides of the support are layers corresponding to the adhesive layers described above.
A sample for evaluation of the following magnetic permeability measurement and conductivity measurement was cut from a part of the magnetic layer after the release film was peeled off. One side of the magnetic layer after dicing the sample sheet was brought into contact with the adhesive layer exposed by peeling the light-peeled PET film from the double-sided tape, and the double-sided tape was bonded to the magnetic layer. After that, the strongly peeled PET film of the double-sided tape was peeled off, whereby a sheet-like electromagnetic wave shielding material composed of 4 layers of a magnetic layer, an adhesive layer, a PET film (resin layer), and an adhesive layer and having these 4 layers in this order was obtained. The PET film contained in the obtained electromagnetic wave shielding material contains a resin as a main component, and the resin content is 90 mass% or more.
< Measurement of permeability >
The magnetic layer was cut into a rectangular shape having a size of 28mm×10mm, and the permeability was measured by using a permeability measuring device (PER 01 manufactured by KEY COM Corporation), and the real part (μ ') of the complex relative permeability was obtained as the real part (μ') of the complex relative permeability at a frequency of 3 MHz. The obtained permeability was the value shown in table 1. The magnetic permeability evaluation results A, C and D shown in table 1 are based on the following evaluation criteria.
A: magnetic permeability μ' of 100 or more
C: the magnetic permeability mu' is more than 40 and less than 100
D: permeability μ' less than 40
< Measurement of conductivity >
A cylindrical main electrode having a diameter of 30mm was connected to the negative electrode side of a digital super-insulation resistor (TAKEDA RIKEN Industry Co., ltd. TR-811A), a ring electrode having an inner diameter of 40mm and an outer diameter of 50mm was connected to the positive electrode side, the main electrode was provided on a sample piece of the magnetic layer cut into a size of 60mm by 60mm, and a ring electrode was provided at a position surrounding the main electrode, and a voltage of 25V was applied to both electrodes, whereby the surface resistivity of the magnetic layer alone was measured. The conductivity of the magnetic layer was calculated from the surface resistivity and the following formula. The calculated conductivity was 1.1X10 -2 S/m.
As the thickness, the thickness of the magnetic layer obtained by the following method was used.
Conductivity [ S/m ] =1/(surface resistivity [ Ω ]. Times.thickness [ m ])
< Acquisition of Cross-sectional image of Shielding Material >
The cross-sectional processing for exposing the cross-section of the shielding material of example 1 was performed by the following method.
The shield material cut to a size of 3mm×3mm was resin-embedded, and a cross section of the shield material was cut using an ion milling device (HITACHI HIGH-IM 4000PLUS manufactured by Tech Corporation).
The cross section of the shielding material exposed as above was observed under an acceleration voltage of 2kV and a magnification of 100 times using a scanning electron microscope (HITACHI HIGH-SU 8220 manufactured by Tech Corporation), thereby obtaining a reflected electron image. From the obtained image, the thicknesses at 5 positions were measured for each of the 4 layers of the magnetic layer, the adhesive layer, the PET film (resin layer), and the adhesive layer, based on the scale, and the arithmetic average was set to the thickness of the magnetic layer, the thickness of each of the 2 adhesive layers, and the thickness of the PET film (resin layer). The thickness of the magnetic layer was 30 μm, the thickness of the 2 adhesive layers was 2 μm, and the thickness of the PET film (resin layer) was 2 μm, respectively.
< Acquisition of magnetic layer sectional image >
In the same manner as described above, in the cross section of the shielding material of example 1 in which the cross section was processed so as to be exposed, a part of the magnetic layer was observed under an acceleration voltage of 2kV and a magnification of 1000 times by using a scanning electron microscope (SU 8220 manufactured by HITACHI HIGH-Tech Corporation), thereby obtaining a reflected electron image.
< Measurement of aspect ratio of magnetic particles and degree of orientation of Flat-shaped particles >
Using the reflected electron image obtained as described above, the aspect ratio of the magnetic particles was obtained by the method described above, and the flat-shaped particles were determined from the value of the aspect ratio. When it is determined as described above whether or not the magnetic layer contains flat-shaped particles as magnetic particles, it is determined that the magnetic layer contains flat-shaped particles. The magnetic particles defined as flat particles were 13 ° when the degree of orientation was determined by the method described above. The average value (arithmetic average) of the aspect ratios of all the particles specified as flat particles is obtained as the aspect ratio of the flat particles contained in the magnetic layer. The aspect ratio was found to be 0.071.
< Peak top temperature of Tan delta, E' >, at 60 degreeC
A measurement sample having a length of 28 mm. Times.10 mm was cut from the electromagnetic wave shielding material, and dynamic viscoelasticity was measured by the above-described measurement procedure using a dynamic viscoelasticity measuring device DMS6100 manufactured by HITACHI HIGH-TECH SCIENCE Corporation as a dynamic viscoelasticity measuring device. The peak top temperature of the loss tangent Tan. Delta. In the dynamic viscoelasticity measurement at 1Hz and E' at 60℃were obtained from the obtained measurement results.
< Moldability >
The electromagnetic wave shielding material was deep-drawn using a die (AMADA co., ltd.) composed of a male die and a female die, without heating and in a room temperature (25 ℃) environment, to thereby produce a hemispherical three-dimensional molded article. Whether or not the three-dimensional molded article produced was broken was visually confirmed, and based on the confirmation result, moldability was evaluated according to the following evaluation criteria.
(Evaluation criterion)
A: a three-dimensional molded article having a depth of 3cm can be molded without cracking by using a hemispherical mold having a depth of 3 cm.
B: a three-dimensional molded article having a depth of 2cm can be molded without cracking by using a hemispherical mold having a depth of 2 cm.
When a hemispherical mold having a depth of 3cm was used, cracking was observed in the obtained three-dimensional molded article having a depth of 3cm, or the three-dimensional molded article having a depth of 3cm was not obtained.
C: a three-dimensional molded article having a depth of 1cm can be molded without cracking by using a hemispherical mold having a depth of 1 cm.
When a hemispherical mold having a depth of 2cm was used, cracking was observed in the obtained three-dimensional molded article having a depth of 2cm, or the three-dimensional molded article having a depth of 2cm was not obtained.
D: the three-dimensional molded article having a depth of 1cm obtained by using a hemispherical mold having a depth of 1cm had a fracture.
< Tensile test (elongation) >
A measuring sheet having a length of 50mm by a width of 10mm was cut from the electromagnetic wave shielding material. The elongation was determined by performing a tensile test of the sheet for measurement under the following measurement conditions using a Tensilon Universal Material tester (RTF-1310) manufactured by A & D Company, limited as a tensile tester. Regarding the elongation, the longest elongation of the test sheet stretched in the tensile test (i.e., the amount of elongation displacement in the longitudinal direction at the time of breaking at least 1 layer in the measurement sheet) was taken as L, and taken as the elongation [ unit: the%o=100×l/collet spacing. At least 1 layer fracture can be determined by stress reduction of stress-strain curve, visual observation, or the like.
The elongation thus obtained is preferably 1.0% or more, more preferably 2.0% or more, still more preferably 5.0% or more, and still more preferably 10.0% or more, from the viewpoint of moldability (e.g., moldability in cold molding). The elongation may be, for example, 90.0% or less, 80.0% or less, 70.0% or less, or 60.0% or less, or may be higher than the values exemplified herein.
(Measurement conditions)
Chuck spacing: 25mm of
Measurement environment: the temperature is 23 ℃ and the relative humidity is 50%
Load cell: 500N (Newton)
Stretching speed: 1 mm/min
Stretching direction: in the length direction
Examples 2 to 11, comparative examples 2 and 3
Except for the point where the items shown in table 1 were changed as shown in table 1 and the point where the amount of the polyfunctional isocyanate blended in the preparation of the magnetic layer-forming composition was adjusted to an amount of 5 mass% relative to the solid content of the resin used (i.e., 5 mass parts relative to 100 mass parts of the resin), the preparation of the electromagnetic wave shielding material and various evaluations were performed by the method described in example 1.
In examples and comparative examples in which the resin content of the magnetic layer was different from example 1, the resin content of the magnetic layer was changed by changing the amount of the resin in the above-described composition for forming a magnetic layer.
The thickness of each layer was the same as that obtained in example 1 when the thickness of each layer was obtained by the method described above for the electromagnetic wave shielding materials of example 2, example 3, examples 6 to 8, example 10, example 11, and comparative example 2.
The electromagnetic wave shielding materials of examples 5, 9 and 3, which are described as "none" in the columns of the adhesive sheets of table 1, are electromagnetic wave shielding materials composed of only 1 magnetic layer. In the above examples and comparative examples, the thickness of the magnetic layer was 30 μm when the thickness was obtained by the method described above.
The adhesive tape used in example 4 was adhesive tape NCF-D692 (5) made of LINTEC Corporation (in Table 1, "D692"). The adhesive tape is an adhesive tape of a 3-layer structure having an adhesive layer (acrylic adhesive-containing layer) between 2 release films, and does not include a support. The adhesive layer of the adhesive tape is a layer corresponding to the adhesive layer described above. In example 4, a magnetic layer was produced as described in example 1, and a sample piece for evaluation of the magnetic permeability measurement was cut from a part of the magnetic layer after the peeling of the peeled film. One side of the magnetic layer after dicing the sample sheet is brought into contact with the exposed adhesive layer by peeling one of the release films of the adhesive tape, thereby bonding the adhesive tape to the magnetic layer. After that, another release film was peeled off, whereby an electromagnetic wave shielding material of example 4 composed of 2 layers of a magnetic layer and an adhesive layer was obtained. When the thickness of each layer was determined by the method described above, the thickness of the magnetic layer was 30 μm and the thickness of the adhesive layer was 5 μm.
Example 12
Except for the point where the magnetic layer was formed by the following method, the electromagnetic wave shielding material was produced and various evaluations were performed by the method described in example 1. In the electromagnetic wave shielding material of example 12, when the thickness of each layer was obtained by the method described above, the thickness of each layer was the same as the value obtained in example 1.
< Preparation of composition (coating liquid) for Forming magnetic layer >
Adding into plastic bottle
12G of Fe-Si-Al flat magnetic particles (MARKELYTICS SOLUTIONS INDIA A. Si/Al alloy MFS-SUH manufactured by Private Limited),
1G of silicone resin (see Table 1),
Curing agent (Shin-Etsu Silicone Co., ltd. C-8) 0.02g,
14G of methyl ethyl ketone,
14G of cyclohexanone and the like, wherein the cyclohexanone is prepared from the following components,
The mixture was mixed with a vibration mixer for 12 hours, thereby preparing a coating liquid.
< Preparation of magnetic layer >
(Film formation of magnetic layer)
The coating liquid was applied to the peeled surface of the peeled PET film (Nippa Corporation PET75 TR) by a knife coater having a coating gap of 300. Mu.m, and dried in a drying apparatus having an internal atmosphere temperature of 80℃for 30 minutes, and the internal atmosphere temperature in the drying apparatus was set to 150℃and cured for 12 hours, whereby a film-like magnetic layer was formed.
Example 13
Except for the point that the magnetic layer was produced by the method described below, production of the electromagnetic wave shielding material and various evaluations were performed by the method described in example 1. In the electromagnetic wave shielding material of example 13, when the thickness of each layer was obtained by the method described above, the thickness of each layer was the same as the value obtained in example 1.
< Preparation of composition (coating liquid) for Forming magnetic layer >
Adding into plastic bottle
12G of Fe-Si-Al flat magnetic particles (MARKELYTICS SOLUTIONS INDIA A. Si/Al alloy MFS-SUH manufactured by Private Limited),
3.3G of polyurethane resin (Nipporan 5120, 30% by mass of solid content concentration; TOSOH CORPORATION),
0.40G of a polyfunctional isocyanate (TAKENATE D E, solid content concentration 75% by mass, manufactured by Mitsui Chemicals, inc.),
25G of cyclohexanone and the like,
The mixture was mixed with a vibration mixer for 12 hours, thereby preparing a coating liquid. The amount of the polyfunctional isocyanate in the prepared composition for forming a magnetic layer was 30 parts by mass based on 100 parts by mass of the resin.
< Preparation of magnetic layer >
(Film formation of magnetic layer)
The coating liquid was applied to the peeled surface of the peeled PET film (PET 75 to JOL manufactured by Nippa Corporation) by a knife coater having a coating gap of 300. Mu.m, and dried in a drying apparatus having an internal atmosphere temperature of 80℃for 30 minutes, whereby a film-like magnetic layer was formed on the peeled PET film.
(Pressure treatment and heat treatment of magnetic layer)
The upper and lower squeeze plates of a plate-like squeeze press (TOYO SEIKI co., MINI TEST PRESS manufactured by ltd. Were heated to 140 ℃ (the internal temperature of the squeeze plates), and the magnetic layer of the PET film from which the peeling treatment was completed was sandwiched and peeled by 2 teflon (registered trademark) sheets having a thickness of 1mm, and held in a state where a pressure of 30N/mm 2 was applied for 10 minutes. After the upper and lower squeeze plates were cooled to 50 deg.c (the internal temperature of the squeeze plates) with the pressure maintained, the magnetic layer was taken out from between 2 teflon (registered trademark) sheets.
Thereafter, in order to crosslink the polyurethane resin and the polyfunctional isocyanate contained in the magnetic layer, the magnetic layer was kept in a drying apparatus at an internal atmosphere temperature of 60 ℃ for 48 hours and subjected to heat treatment, thereby obtaining a magnetic layer.
Example 14
Before the pressurization treatment of the magnetic layer, the magnetic layer was kept in a drying apparatus at an internal atmosphere temperature of 60 ℃ for 48 hours and subjected to a heat treatment in order to crosslink the polyurethane resin contained in the magnetic layer with the polyfunctional isocyanate. After this heat treatment, the magnetic layer was subjected to a pressure treatment by the method described in example 13, and the heat treatment after the pressure treatment was not performed.
In addition to the above, the electromagnetic wave shielding material was produced and various evaluations were performed by the method described in example 13. In the electromagnetic wave shielding material of example 14, when the thickness of each layer was obtained by the method described above, the thickness of each layer other than the magnetic layer was the same as the value obtained in example 13, and the thickness of the magnetic layer was 34 μm.
Comparative example 1
The noise suppression sheet product name flexield (model IFL16-30 NB) manufactured by TDK Corporation has a magnetic sheet, a double-sided tape, and a release liner in this order. As an electromagnetic wave shielding material of comparative example 1, a material from which a release liner was removed from the sheet was used, and various evaluations were made by the above-described methods.
The above results are shown in table 1. As the evaluation results shown in the column of the comprehensive evaluation in table 1, lower evaluation results were adopted among the evaluation results of formability and the evaluation results of magnetic permeability. For example, when the 2 evaluation results are a and C, the evaluation result of the overall evaluation is C.
From the results shown in table 1, it was confirmed that the magnetic layer of the electromagnetic wave shielding material of the example was high in magnetic permeability and excellent in shielding ability, and also excellent in moldability.
An electromagnetic wave shielding material composed of 4 layers of a magnetic layer, an adhesive layer, a PET film, and an adhesive layer was obtained by the method described in example 1.
The surface of the magnetic layer of the electromagnetic wave shielding material, which is not bonded to the adhesive layer, was brought into contact with the adhesive layer exposed by peeling the light-release PET film from the double-sided tape (MK 6G manufactured by Iwatani Corporation), thereby bonding the double-sided tape to the magnetic layer.
After the strongly peeled PET film of the double-sided tape was peeled, copper foil (alloy No. C1100R, copper content: 99.90 mass% or more according to JIS H3100:2018) having a thickness of 10 μm was bonded to the adhesive layers on the outermost layers on both sides, respectively.
Thus, an electromagnetic wave shielding material composed of 9 layers of a metal foil (metal layer), an adhesive layer, a PET film (resin layer), an adhesive layer, a magnetic layer, an adhesive layer, a PET film (resin layer), an adhesive layer, a metal foil (metal layer) and sequentially comprising these 9 layers was obtained. When the shielding ability of the obtained electromagnetic wave shielding material was evaluated by the method described below, it was found that the shielding ability against magnetic field waves was excellent, with 14.5dB at a frequency of 100kHz and 73.2dB at a frequency of 10 MHz. In addition, when the moldability of the obtained electromagnetic wave shielding material was evaluated as described above, the same evaluation results as in example 1 were obtained.
< Evaluation of Shielding Capacity (KEC method) >)
A shielding material cut into a size of 150mm by 150mm was placed between antennas of a KEC method evaluation device including a signal generator, an amplifier, a pair of magnetic field antennas, and a spectrum analyzer, and the ratio of the received signal strength when the shielding material was not present at a frequency of 100kHz and a frequency of 10MHz was obtained and used as a shielding capability. These were applied to the magnetic field antenna, and the magnetic field wave shielding ability was obtained. In addition, KEC is an abbreviation for the center of vibration of the Guangxi electronic industry.
Industrial applicability
The embodiments of the present invention are useful in the technical fields of various electronic components and various electronic devices.
Claims (11)
1. An electromagnetic wave shielding material comprising 1 or more magnetic layers containing magnetic particles and a resin, and
The peak top temperature of the loss tangent Tan delta in dynamic viscoelasticity measurement at 1Hz is 0 ℃ or more and less than 60 ℃.
2. The electromagnetic wave shielding material according to claim 1, wherein the electromagnetic wave shielding material further has 1 or more adhesive layers.
3. The electromagnetic wave shielding material according to claim 2, wherein the electromagnetic wave shielding material further has a resin layer between 2 adhesive layers.
4. The electromagnetic wave shielding material according to any one of claims 1 to 3, wherein the electromagnetic wave shielding material further has 2 or more metal layers, and
Comprising more than 1 magnetic layer sandwiched between 2 metal layers.
5. The electromagnetic wave shielding material according to any one of claims 1 to 3, wherein,
The storage modulus E' in a dynamic viscoelasticity measurement at 1Hz is 0.010GPa or more and less than 10.000GPa at 60 ℃.
6. The electromagnetic wave shielding material according to any one of claims 1 to 3, wherein,
The magnetic layer includes a resin having a urethane structure.
7. The electromagnetic wave shielding material according to any one of claims 1 to 3, wherein,
Peak top temperature of loss tangent Tan delta in dynamic viscoelasticity measurement at 1Hz is 15 ℃ or more and less than 40 ℃, and
The storage modulus E' in a dynamic viscoelasticity measurement at 1Hz is 0.010GPa or more and less than 10.000GPa at 60 ℃.
8. The electromagnetic wave shielding material according to any one of claims 1 to 3, wherein,
The magnetic layer contains flat-shaped metal particles as the magnetic particles.
9. The electromagnetic wave shielding material according to any one of claims 1 to 3, wherein the electromagnetic wave shielding material is sheet-shaped.
10. An electronic part comprising the electromagnetic wave shielding material according to any one of claims 1 to 3.
11. An electronic device comprising the electromagnetic wave shielding material according to any one of claims 1 to 3.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-178043 | 2021-10-29 | ||
| JP2022068024 | 2022-04-18 | ||
| JP2022-068024 | 2022-04-18 | ||
| PCT/JP2022/039510 WO2023074617A1 (en) | 2021-10-29 | 2022-10-24 | Electromagnetic shielding material, electronic component and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118176836A true CN118176836A (en) | 2024-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280072645.9A Pending CN118176836A (en) | 2021-10-29 | 2022-10-24 | Electromagnetic wave shielding material, electronic component, and electronic device |
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| Country | Link |
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| CN (1) | CN118176836A (en) |
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- 2022-10-24 CN CN202280072645.9A patent/CN118176836A/en active Pending
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