CN1181688A - Covered copper plate fast printing method - Google Patents

Covered copper plate fast printing method Download PDF

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Publication number
CN1181688A
CN1181688A CN 97122343 CN97122343A CN1181688A CN 1181688 A CN1181688 A CN 1181688A CN 97122343 CN97122343 CN 97122343 CN 97122343 A CN97122343 A CN 97122343A CN 1181688 A CN1181688 A CN 1181688A
Authority
CN
China
Prior art keywords
copper
clad plate
transfer
paper
printing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 97122343
Other languages
Chinese (zh)
Other versions
CN1055194C (en
Inventor
陈庆喜
陈青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN SCIENCE AND TECHNOLOGY COMMITEE
Original Assignee
XIAMEN SCIENCE AND TECHNOLOGY COMMITEE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIAMEN SCIENCE AND TECHNOLOGY COMMITEE filed Critical XIAMEN SCIENCE AND TECHNOLOGY COMMITEE
Priority to CN97122343A priority Critical patent/CN1055194C/en
Publication of CN1181688A publication Critical patent/CN1181688A/en
Application granted granted Critical
Publication of CN1055194C publication Critical patent/CN1055194C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A transfer method for printed circuit board (PCB) includes drawing on the paper with transfer material (ink and copy paper), putting the transfer paper on copper coated board whose surface has been processed, thermotransferring at 180-210 deg. C for 15-30 seconds, etching and trimming, and features simple process and apparatus and saving labour and time. It is suitable for single-piece or small-batch production.

Description

The quick printing method of copper-clad plate
The method that the present invention relates to a kind of transfer printing and be used for printed circuit board.
Transfer materials such as quick transferring ink, printing ink and carbon paper are applied.
The existing method of copper-clad plate (or claim copper clad plate) printed circuit board of utilizing has: 1) photocopy direct exposure method, its technical process be picture base map-pinup picture (use adhesive tape) Gu-photograph-copper-clad plate on photoresists-sensitization-clean-dye color-oven dry-film-drying curing-colour-separation drafting-corrosion-demoulding-colour-separation drafting-silver-plated-last rosin.2) direct exposure silk screen method, its technical process are to choose chase-silk screen and upper ledge are tightened-by circuit black and white original text at photoresists-sensitization on the silk screen-development-drying-laying-down typing-reverse side enriching-inspection proof and prepare line map-colour-separation drafting-corrosion-demoulding-colour-separation drafting in thickener (paint vehicle)-silk screen process copper-clad plate-silver-plated-go up rosin.Equipment that above-mentioned process requires and technology are complicated, and the printing time is long, cost height, especially the 1st) the kind method only is suitable for professional factory and the very high situation of required precision.
The object of the present invention is to provide a kind of operation few, technology is simple, energy savings, reduced investment, the quick printing method of the copper-clad plate of wide adaptability.
Processing step of the present invention is 1) use transfer materials (as the transfer printing ink, transfer ink, transfer printing carbon paper) with required pattern, literal, symbol, mark are described or are printed on the paper, become transfer paper; 2) copper-clad plate is through surface treatment; 3) transfer paper is placed in the surface treated copper-clad plate, through blanching it is transferred in the copper-clad plate, blanching treatment time is 15~30S, best 18~25S, and temperature is 180~210 ℃, is preferably 185~190 ℃; 4) corrosion; 5) colour-separation drafting.As needs, can continue later process again, for example for printed circuit board, can carry out silver-platedly, operations such as last rosin can be painted to tourist souvenir, inlay, and operation such as frame up.
The surface treatment of copper-clad plate belongs to conventional method, mainly removes oxide layer, the sump oil dirt.
This method is compared with existing process, simplified production technology significantly, equipment, reduce the plate-making expense, reduce labor intensity, be particularly useful for the operation of single-piece, jobs or lots, satisfy scientific research institution, universities and colleges and medium-sized and small enterprises and practice midwifery, manufacture experimently voluntarily circuit board and operation, both shortened the operation of printing circuit board, cost saving is again improved the quality of products.Be specially adapted to design and research.Also be applicable to the printing of other workmanships, tourist souvenir, nameplate, advertisement etc.
Embodiment 1: printed circuit board.Directly be painted on paper on colored ink for transferring designed line map, become the transfer printing marble paper, again this transfer printing marble paper is covered in the appropriate copper-clad plate of clean, and blanching 15~18S thereon, 185~190 ℃ of temperature, the line map on its transfer printing marble paper promptly is transferred in the copper-clad plate.Again through the corrosion, colour-separation drafting, silver-plated, operations such as last rosin are promptly finished.
Embodiment 2: print the table board.Designed enterprise name plaque board figure is directly described or is printed on the paper with transfer ink, become transfer paper, this transfer paper is covered in the good copper-clad plate of chemical surface treatment again, and blanching 25~30S thereon, 180~190 ℃ of temperature, same, through corrosion, colour-separation drafting, operation such as tint is promptly finished.
Embodiment 3: letterpress plate-making.Operation is identical with embodiment 1, and heat iron temperature is 190~210 ℃, and blanching treatment time is 18~25S.
Embodiment 4: print tourist souvenir.With designed pattern, usefulness transfer printing colour duplicating papers such as literal are painted on the paper, or are printed on the paper with transfer ink, become transfer paper, transfer paper is covered in the surface treated copper-clad plate again, and blanching 20~24S thereon, temperature is 185~195 ℃, again through corrosion, colour-separation drafting, colouring is inlayed, and operation such as frame up is promptly finished.

Claims (4)

1. the quick printing method of copper-clad plate is characterized in that its processing step is
1) with transfer materials with required pattern, literal, symbol, mark is described, and is printed on the paper, becomes transfer paper, said transfer materials is the transfer printing ink, transfer ink, transfer printing carbon paper;
2) copper-clad plate is through surface treatment;
3) transfer paper is placed in the surface treated copper-clad plate, again through blanching, it is transferred in the copper-clad plate, blanching treatment time is 15~30S, and heat iron temperature is 180~210 ℃;
4) corrosion;
5) colour-separation drafting.
2. the quick printing method of copper-clad plate as claimed in claim 1 is characterized in that said blanching treatment time is 18~25S, and heat iron temperature is 185~190 ℃.
3. the quick printing method of copper-clad plate as claimed in claim 1 is characterized in that painting after the said colour-separation drafting, inlays, and frames up.
4. the quick printing method of copper-clad plate as claimed in claim 1, it is characterized in that carrying out after the said colour-separation drafting silver-plated, last rosin.
CN97122343A 1997-11-21 1997-11-21 Covered copper plate fast printing method Expired - Fee Related CN1055194C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN97122343A CN1055194C (en) 1997-11-21 1997-11-21 Covered copper plate fast printing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN97122343A CN1055194C (en) 1997-11-21 1997-11-21 Covered copper plate fast printing method

Publications (2)

Publication Number Publication Date
CN1181688A true CN1181688A (en) 1998-05-13
CN1055194C CN1055194C (en) 2000-08-02

Family

ID=5176783

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97122343A Expired - Fee Related CN1055194C (en) 1997-11-21 1997-11-21 Covered copper plate fast printing method

Country Status (1)

Country Link
CN (1) CN1055194C (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102427669A (en) * 2011-11-15 2012-04-25 华南理工大学 Manufacture method of dual-sided printed circuit board
CN104902687A (en) * 2015-06-18 2015-09-09 镇江华印电路板有限公司 Anti-crack printed circuit board
CN106413270A (en) * 2016-11-04 2017-02-15 大连大学 Aluminum nitride ceramic circuit board and preparation method thereof
CN110861423A (en) * 2019-11-19 2020-03-06 江苏上达电子有限公司 Transfer printing ink processing technology for printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8728865D0 (en) * 1987-12-10 1988-01-27 Versatronics Ltd Apparatus & method for manufacture of printed circuit board & prototypes
US5209814A (en) * 1991-09-30 1993-05-11 E. I. Du Pont De Nemours And Company Method for diffusion patterning

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102427669A (en) * 2011-11-15 2012-04-25 华南理工大学 Manufacture method of dual-sided printed circuit board
CN102427669B (en) * 2011-11-15 2013-05-08 华南理工大学 Manufacture method of dual-sided printed circuit board
CN104902687A (en) * 2015-06-18 2015-09-09 镇江华印电路板有限公司 Anti-crack printed circuit board
CN106413270A (en) * 2016-11-04 2017-02-15 大连大学 Aluminum nitride ceramic circuit board and preparation method thereof
CN106413270B (en) * 2016-11-04 2019-04-05 大连大学 A kind of aluminium nitride ceramics circuit board and preparation method
CN110861423A (en) * 2019-11-19 2020-03-06 江苏上达电子有限公司 Transfer printing ink processing technology for printed circuit board

Also Published As

Publication number Publication date
CN1055194C (en) 2000-08-02

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