CN1181634A - 光电元件 - Google Patents

光电元件 Download PDF

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Publication number
CN1181634A
CN1181634A CN97120614A CN97120614A CN1181634A CN 1181634 A CN1181634 A CN 1181634A CN 97120614 A CN97120614 A CN 97120614A CN 97120614 A CN97120614 A CN 97120614A CN 1181634 A CN1181634 A CN 1181634A
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CN
China
Prior art keywords
photoelectric cell
socket
optical fiber
coupling
plug
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN97120614A
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English (en)
Inventor
阿尔温·戈特
克劳斯·亚当
维尔纳·雷姆
马提雅兹·弗罗雅恩斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALKATAR ARSTOM Co
Alcatel Lucent SAS
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ALKATAR ARSTOM Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by ALKATAR ARSTOM Co filed Critical ALKATAR ARSTOM Co
Publication of CN1181634A publication Critical patent/CN1181634A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/4257Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/4262Details of housings characterised by the shape of the housing
    • G02B6/4265Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4272Cooling with mounting substrates of high thermal conductivity

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

本发明提出一种能够以简单的方式进行光学连接和电气连接的光电模件。它包括一个用于电气连接的SMD组件和一个用于光学连接的与一个MT插头相配合的插座。SMD组件适合于MT插头。它包括一个含有光电界面并确定地固定在组件中的插座。

Description

说明书 光电元件
本发明涉及一种至少具有一个电气接头和至少一个光学接头的光电元件。
这种元件在光学通信系统中的需求越来越大。因此,本发明将要解决的技术问题是设计一种光电元件,使其能够高效地生产和装配并且成本低廉。
根据本发明,通过借助一个SMD组件上的外接头形成至少一个电气接头及借助一个和MT插头相兼容的插座形成至少一个光学接头来解决该技术问题。
这种光电元件制造成本低并且便于安装。
本发明的有利细节述于权利要求2到9。
下面参照附图详细说明本发明,其中:
图1是根据本发明的光电元件的俯视图;
图2是图1所示元件的纵剖视图;
图3是表示元件细节的立体图;
图4是插座的纵剖视图;
图5是插座的俯视图。
在图1所示的实施例中,假定光电元件包含有一光电界面,即,元件可和光纤配合,光纤的光学信号在元件中被转换为电信号。
如图1所示,元件具有一个带有外接头2的壳体1。所示的壳体采用SMD技术来实现,即,壳体可置于平板印刷电路板上,外接头2可焊接在印刷电路板上的导电槽上。与伸入到壳体1中的外接头2的端部(图1中未示出)相连的是含有光电元件工作所必需的电子电路4(图2)的印刷电路板3。
外接头2的部分内端部也可和高导热板或类似物相连,用以将热量从置于板上的部件传送走。
固定于壳体1中的是包含光纤6的末端部分的插座5。插座5和MT插头相配合。MT插头是公知的,它们由例如位于英国Merseyside L35IRZ,Whiston的欧洲光学有限公司提供。MT插头被设计为使至少一个光纤同另一个同样含有一个光纤的部件相结合。为此,光纤固定于MT插头中的一个小孔中;以使其末端和MT插头的外表面齐平。MT插头在其外表面光纤终止处具有两个导销。
光纤6终止于一光学元件7、例如一个激光二极管处,在该光学元件中,由光纤传送的光学信号被转换为电信号。
在图2中,和图1所示部分相同的部分用同样的标号标注。可以看到,插头5有一固定在其上的基底8,光纤6的末端固定在基底8上的适当位置,基底8支承住光学元件7及光学元件工作所必需的电气元件。
图3更详细地示出了带有置于其上的光学元件以及和光学元件相连接的光纤6的基底8。光纤6被牢固地限制在基底8上的V型槽中。将基底8插入并固定在插座5中的凹槽9中,从而使得光纤6的自由端位于从凹槽9延伸到插座5的端面10的小孔11中,并且光纤自由端的末端和端面10齐平。此外,终止于插座5的端面10的小孔12用于插入MT插头的导销。
插座5远离端面10的端部在其侧面和下部带有对应于壳体1中的凹槽14的台阶13。它们的作用是将插座5正确地固定于壳体1中。另外,插座5可焊接到壳体1上。同样也可以仅把插座5焊接到壳体上。
图4和图5表示了插座的细节。它们示出了基底8固定于其中的凹槽9的形状。台阶15用来限制基底8的纵向移动。用于插入光纤的小孔11和台阶13的形状也清晰可见。

Claims (9)

1.一种光电元件,它带有至少一个电气接头和至少一个光学接头,其特征在于,所述的至少一个电气接头由SMD组件(1)上的外接头(2)形成,所述的至少一个光学接头由和MT插头相兼容的插座(5)形成。
2.如权利要求1所述的光电元件,其特征在于,外接头(2)采用SO技术实现(SO表示sma11outline)。
3.如权利要求1所述的光电元件,其特征在于,外接头(2)采用BGA技术实现(BGA表示ba11 grid array)。
4.如权利要求1和2或3所述的光电元件,其特征在于,插座(5)是一模制件,它确定和/或非确定地固定在组件(1)中。
5.如权利要求4所述的光电元件,其特征在于,插座(5)具有一个支承光电转换器和/或无源光学元件的基底(8)。
6.如权利要求5所述的光电元件,其特征在于,插座(5)带有包含基底(8)的凹槽(9),它具有光电界面。
7.如权利要求6所述的光电元件,其特征在于,光电界面包括至少一个和一光学元件(7)连接的光纤(6)。
8.如权利要求7所述的光电元件,其特征在于,光纤(6)远离连接点的末端置于模制件(10)上的位于凹槽(9)与模制件(10)的一个端面之间的小孔(11)中。
9.如权利要求8所述的光电元件,其特征在于,组件(1)包含支承光学元件(7)操作所需的电子电路的印刷电路板(3)。
CN97120614A 1996-10-18 1997-10-17 光电元件 Pending CN1181634A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19643072.0 1996-10-18
DE19643072A DE19643072A1 (de) 1996-10-18 1996-10-18 Optoelektronisches Bauelement

Publications (1)

Publication Number Publication Date
CN1181634A true CN1181634A (zh) 1998-05-13

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CN97120614A Pending CN1181634A (zh) 1996-10-18 1997-10-17 光电元件

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KR (1) KR19980032936A (zh)
CN (1) CN1181634A (zh)
CA (1) CA2216759A1 (zh)
DE (1) DE19643072A1 (zh)
TW (1) TW376589B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246567A (zh) * 2011-11-30 2014-12-24 3M创新有限公司 包括光纤移动控制的有源光缆组件
CN111223849A (zh) * 2020-01-13 2020-06-02 中国电子科技集团公司第四十四研究所 多通道集成制冷单光子雪崩光电二极管器件

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29717271U1 (de) * 1997-09-26 1997-11-06 Phoenix Contact Gmbh & Co Anschlußvorrichtung mit Steckanschlüssen
EP1111420A3 (fr) * 1999-12-20 2001-09-19 Talltec Sensors S.A. Dispositif de connexion optique
DE10034865B4 (de) 2000-07-18 2006-06-01 Infineon Technologies Ag Optoelektronisches oberflächenmontierbares Modul
FR2815138B1 (fr) * 2000-10-05 2003-01-31 Cit Alcatel Structure interne a faible contrainte pour boitier optoelectrique
CN102722006B (zh) * 2012-05-25 2014-06-11 华为技术有限公司 光纤连接器的小型可插拔模块

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5199093A (en) * 1990-05-22 1993-03-30 Bicc Plc. Multi-part optical fibre connectors
DE69318900T2 (de) * 1992-08-11 1998-10-01 Sumitomo Electric Industries Optisches Modul mit verbesserter Erdung eines optischen Elements
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246567A (zh) * 2011-11-30 2014-12-24 3M创新有限公司 包括光纤移动控制的有源光缆组件
CN104246567B (zh) * 2011-11-30 2016-12-14 3M创新有限公司 包括光纤移动控制的有源光缆组件
CN111223849A (zh) * 2020-01-13 2020-06-02 中国电子科技集团公司第四十四研究所 多通道集成制冷单光子雪崩光电二极管器件

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KR19980032936A (ko) 1998-07-25
CA2216759A1 (en) 1998-04-18
DE19643072A1 (de) 1998-04-23
TW376589B (en) 1999-12-11

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Applicant after: Alcatel N. V.

Applicant before: Alcatel Alsthom Compagnie Generale D'Electricite

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Free format text: CORRECT: APPLICANT; FROM: ALCATEL ALSTHOM COMPAGNIE GENERALE D ELECTRICITE TO: ALCATEL CORP.

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