CN118142968A - Vacuum cleaning device and substrate cleaning method - Google Patents

Abstract

The invention discloses a vacuum cleaning device and a substrate cleaning method, wherein the device comprises the following steps: the vacuum cleaning device comprises an electromagnetic mechanism, a vacuum cleaning cavity, a hollow main shaft, a lifting mechanism and a base table; the electromagnetic mechanism is hermetically arranged at the top of the vacuum cleaning cavity and externally connected with a radio frequency power supply to excite the process gas to form plasma to clean the surface of the substrate; the movable end and the driving end of the lifting mechanism are respectively arranged inside and outside the vacuum cleaning cavity in a sealing way; the base table is arranged in the vacuum cleaning cavity, the bottom of the base table is connected with the hollow main shaft, the hollow main shaft penetrates through the bottom of the vacuum cleaning cavity in a sealing manner, and the lifting mechanism is positioned above the base table in the vacuum cleaning cavity so as to realize mutual transfer of the substrate between the manipulator and the base table; the side part of the vacuum cleaning cavity is provided with an air outlet hole, an air inlet device and a manipulator inlet, process gas enters and exits the vacuum cleaning cavity through the air inlet device and the air outlet hole, and substrate transmission in or out is realized through the manipulator inlet. The invention has the advantages of compact structure, simple operation, obvious cleaning effect, high compatibility and the like.

Description

Vacuum cleaning device and substrate cleaning method

Technical Field

The invention belongs to the technical field of semiconductor vacuum cleaning equipment, and particularly relates to a vacuum cleaning device and a substrate cleaning method.

Background

With the more advanced process nodes of integrated circuit manufacturing processes, new requirements are put forward on several links of actual manufacturing, and the importance of cleaning links is increasingly highlighted. The critical nature of cleaning is due to the fact that as feature sizes continue to shrink, semiconductors become more and more sensitive to impurity levels, and contaminants such as particles, organics, metals, and oxides are inevitably introduced during semiconductor fabrication. In order to reduce the influence of impurities on the chip yield, in practical production, not only the single cleaning efficiency needs to be improved, but also frequent cleaning needs to be performed before and after almost all the processes. Therefore, the vacuum cleaning device is a common device in semiconductor equipment, and is generally used for cleaning a wafer or a substrate before coating, epitaxy, exposure and other processes to remove some pollutants such as particles, organic matters, metals, oxides and the like on the surface of the wafer or the substrate.

Disclosure of Invention

Aiming at the problems of incomplete cleaning, incomplete cleaning and the like in the prior art, the invention provides the vacuum cleaning device and the substrate cleaning method which have compact structure, simple operation, remarkable cleaning effect and high compatibility.

In order to solve the technical problems, the invention adopts the following technical scheme:

a vacuum cleaning device comprising: the vacuum cleaning device comprises an electromagnetic mechanism, a vacuum cleaning cavity, a hollow main shaft, a lifting mechanism and a base table; the electromagnetic mechanism is hermetically arranged at the top of the vacuum cleaning cavity, and is externally connected with a radio frequency power supply to excite process gas in the vacuum cleaning cavity to ionize to form plasma so as to clean the surface of the substrate; the movable end of the lifting mechanism is arranged inside the vacuum cleaning cavity, the driving end of the lifting mechanism is arranged outside the vacuum cleaning cavity, and the joint of the lifting mechanism and the vacuum cleaning cavity is sealed; the base table is arranged in the vacuum cleaning cavity, the bottom of the base table is connected with the hollow main shaft, the hollow main shaft penetrates through the bottom of the vacuum cleaning cavity, the connection part of the hollow main shaft and the vacuum cleaning cavity is sealed, and the lifting mechanism is positioned above the base table in the vacuum cleaning cavity so as to realize mutual transfer of the substrate between the manipulator and the base table; the side part of the vacuum cleaning cavity is provided with an air outlet hole, an air inlet device and a manipulator inlet, process gas for cleaning the substrate enters and exits the vacuum cleaning cavity through the air inlet device and the air outlet hole, and the manipulator realizes that the substrate is transferred into or out of the vacuum cleaning cavity through the manipulator inlet.

As a further improvement of the invention, the vacuum cleaning device also comprises a substrate clamp, wherein the movable end of the substrate clamp is arranged inside the vacuum cleaning cavity, the driving end of the substrate clamp is arranged outside the vacuum cleaning cavity, and the substrate clamp is positioned above the lifting mechanism inside the vacuum cleaning cavity; the substrate clamp is used for clamping the substrate and driving the substrate to lift and rotate so as to realize double-sided cleaning of the substrate in the vacuum cleaning cavity.

As a further improvement of the invention, the inner side wall of the vacuum cleaning cavity is provided with an annular partition plate and an annular heater; when the vacuum cleaning cavity is self-cleaned, the annular partition plate is used for being connected with a radio frequency power supply; the annular heater is vertically distributed around the base table and is positioned between the inner wall of the vacuum cleaning cavity and the base table, and the annular heater is used for heating the inside of the vacuum cleaning cavity, the base table and process gas introduced into the vacuum cleaning cavity.

As a further improvement of the invention, the air outlet holes and the manipulator inlets are respectively arranged on two opposite side walls of the vacuum cleaning cavity, and the air inlet devices are symmetrically distributed on two sides of the manipulator inlets; the air inlet device comprises an air inlet pipeline and an air flow controller which are connected with each other, an air inlet pipe interface of the air flow controller is provided with a second rotating motor, the second rotating motor is used for driving the air inlet pipe interface to rotate, an air baffle plate and a first rotating motor are arranged at an air outlet of the air flow controller, and the first rotating motor drives the air baffle plate to rotate so as to change the air inlet direction and the air flow in the vacuum cleaning cavity.

As a further improvement of the invention, the lifting mechanism comprises a bearing ring, a driving motor and a first corrugated pipe; the driving motor is arranged outside the vacuum cleaning cavity, the bearing ring is arranged inside the vacuum cleaning cavity, the output end of the driving motor is connected with the bearing ring through a transmission shaft, and the outer side of the transmission shaft is connected with the vacuum cleaning cavity in a sealing manner through a first corrugated pipe.

As a further improvement of the invention, the bearing ring is provided with a contact arc, and the contact arc is an inclined surface for supporting the substrate. One end of the bearing ring is symmetrically provided with two matching grooves, the other end of the bearing ring is provided with a limiting arc, and the matching grooves and the limiting arc are used for conveying and positioning the substrate.

As a further improvement of the invention, the hollow main shaft is internally provided with an air inlet pipe, an air outlet pipe, a water inlet pipe and a water outlet pipe; the base station includes: the cooling plate, the second corrugated pipe, the heating plate and the substrate table; the bottom of the cooling disc is connected with the hollow main shaft, the water inlet and the water outlet of the cooling disc are respectively connected with the water inlet pipe and the water outlet pipe, and the second corrugated pipe is sleeved on the periphery of the hollow main shaft so as to realize the sealing connection between the hollow main shaft and the base table and the vacuum cleaning cavity; the heating plate is arranged at the top of the cooling disc, the substrate table is arranged at the top of the heating plate, an air groove and a plurality of back argon air holes are formed in the substrate table, and an inlet and an outlet of the air groove are respectively communicated with the air inlet pipe and the air outlet pipe so as to realize that inert back argon gas enters and exits the substrate table; when the substrate is cleaned, the bearing ring for loading the substrate falls on the substrate table, a space for storing inert back argon gas is formed between the middle part of the substrate and the upper surface of the substrate table, and the substrate is heated by the heating plate, so that the substrate is uniformly heated.

As a further improvement of the present invention, the substrate holder includes an arc-shaped support plate, a motor spring, and a rotation shaft; the electric spring is arranged on the inner side of the arc-shaped supporting piece and is used for realizing that the arc-shaped supporting piece clamps two sides of the substrate; one end of the rotating shaft is connected with the arc-shaped supporting piece, and the other end of the rotating shaft penetrates through the side wall of the vacuum cleaning cavity in a sealing manner and is connected with an external driving mechanism; under the drive of the driving mechanism, the rotating shaft drives the arc-shaped supporting sheet to lift and rotate 90 degrees in the vacuum cleaning cavity so as to realize double-sided cleaning of the substrate.

As a further improvement of the present invention, the electromagnetic mechanism includes: the electromagnetic field device and the magnetic field detector are arranged in the shielding cover, the electromagnetic field device consists of two symmetrical electromagnet groups, the direction and the intensity of a magnetic field in the vacuum cleaning cavity are adjusted through control of an external radio frequency power supply, and the magnetic field intensity in the vacuum cleaning cavity is monitored in real time through the magnetic field detector.

As a general technical concept, the present invention also provides a substrate cleaning method based on the above vacuum cleaning apparatus, comprising the steps of:

step S1, before starting a substrate cleaning work, firstly balancing the pressure intensity between a vacuum cleaning cavity and a conveying cavity, then opening a valve at an inlet of a manipulator, and conveying the substrate into the vacuum cleaning cavity by the manipulator;

S2, driving the bearing ring to ascend by the driving motor, moving the substrate to the upper part of the manipulator, then withdrawing the manipulator from the vacuum cleaning cavity, and closing a valve at an inlet of the manipulator;

s3, driving the bearing ring to descend by the driving motor, wherein the bottom of the bearing ring is matched with the top of the substrate table to form a whole;

s4, determining the temperature and the back argon size of the cleaning process, and respectively adjusting the temperature of the heating plate and the gas flow of the back argon air hole;

s5, adjusting the air pressure in the vacuum cleaning cavity through the air flow controller to balance the air inlet and the air outlet, and realizing continuous updating of the air in the vacuum cleaning cavity while ensuring the starting of a power supply so as to remove impurities generated by cleaning the substrate;

s6, connecting a radio frequency power supply into the vacuum cleaning cavity through an electromagnetic field device to excite process gas ionization to form plasma, and cleaning the upper surface of the substrate;

Step S7, after the cleaning process is finished, firstly balancing the vacuum degree between the vacuum cleaning cavity and the conveying cavity, then opening a valve at an inlet of the manipulator, transferring the substrate from the base table to the conveying cavity through the cooperation of the lifting mechanism and the manipulator, and then transferring the substrate to the unloading cavity for the next process;

And S8, closing a valve at an inlet of the manipulator, connecting a radio frequency power supply to an annular partition plate in the vacuum cleaning cavity, and self-cleaning the vacuum cleaning cavity to remove pollutants remained in the substrate cleaning process.

When the substrate needs to be cleaned on two sides, the mechanical arm is used for conveying the substrate into the vacuum cleaning cavity, then the substrate is clamped and lifted by the substrate clamp and rotated by 90 degrees to be vertically placed, then the electromagnetic field direction is adjusted, two electromagnet groups of the electromagnetic field device are respectively aligned to two surfaces of the substrate, the annular heater is used for adjusting the temperature required in the vacuum cleaning cavity, then the radio frequency power supply is connected to the electromagnetic field device, and the two surfaces of the substrate are cleaned by using plasma; and after the substrate is cleaned, self-cleaning the vacuum cleaning cavity.

Compared with the prior art, the invention has the advantages that:

1. The vacuum cleaning device comprises a main body structure of the vacuum cleaning device, wherein the main body structure comprises an electromagnetic mechanism, a vacuum cleaning cavity, a hollow main shaft, a lifting mechanism and a base table; specifically, the side part of the vacuum cleaning cavity is provided with an air outlet hole, an air inlet device and a manipulator inlet, and process gas for cleaning the substrate enters and exits the vacuum cleaning cavity through the air inlet device and the air outlet hole, so that the substrate is automatically transferred into or out of the vacuum cleaning cavity by utilizing the cooperation of the manipulator and the manipulator inlet; the electromagnetic mechanism is hermetically arranged at the top of the vacuum cleaning cavity, the electromagnetic mechanism is externally connected with a radio frequency power supply, and the radio frequency power supply is utilized to excite the process gas in the vacuum cleaning cavity to ionize to form plasma, so that the surface of the substrate is cleaned, the cleaning quality of the substrate is improved, and secondary pollution to the substrate is avoided; the movable end of the lifting mechanism is arranged in the vacuum cleaning cavity in a sealing way, and the driving end of the lifting mechanism is arranged outside the vacuum cleaning cavity, so that the lifting mechanism can drive the substrate to move in the vacuum cleaning cavity, pollution to the interior of the vacuum cleaning cavity is avoided, and the cleanliness in the vacuum cleaning cavity is ensured; through setting up the base platform in vacuum cleaning intracavity portion, base platform bottom is connected with hollow main shaft, and hollow main shaft runs through in vacuum cleaning intracavity portion, has realized that the base platform is fixed in the installation of vacuum cleaning intracavity promptly to utilize the base platform to provide the support to the substrate, improved the connection reliability of substrate.

2. According to the vacuum cleaning device, the substrate clamp is arranged, and the substrate clamp is utilized to drive the substrate to lift and rotate in the vacuum cleaning cavity, so that the vacuum cleaning device has a double cleaning function, double-sided cleaning of the substrate in the vacuum cleaning cavity is realized, the cleaning effect of the surface of the substrate is greatly improved, and the influence of impurities on the back surface of the substrate on the substrate and the vacuum cleaning cavity is reduced. Meanwhile, the annular partition plate is arranged on the inner side wall of the vacuum cleaning cavity, and the radio frequency power supply is connected to the annular partition plate, so that the self-cleaning function of the vacuum cleaning cavity is realized, the influence of self-pollution of the cavity on the substrate is further reduced, and the cleaning quality of the substrate is improved.

3. According to the substrate cleaning method, firstly, the pressure intensity between the vacuum cleaning cavity and the conveying cavity is balanced, and then the substrate is conveyed into the vacuum cleaning cavity through the manipulator; then transferring the substrate to the top of the substrate table by a manipulator through a lifting mechanism, adjusting the process environment in a vacuum cleaning cavity according to a preset cleaning process, connecting a radio frequency power supply into the vacuum cleaning cavity through an electromagnetic field device to excite process gas ionization to form plasma, and cleaning the upper surface of the substrate; after the substrate cleaning process is finished, the radio frequency power supply is connected with the annular partition plate in the vacuum cleaning cavity to excite the process gas to form plasma, and the vacuum cleaning cavity is self-cleaned to remove the residual pollutants in the substrate cleaning process, so that the influence of the self-pollution of the cavity on the substrate is further reduced.

Drawings

Fig. 1 is a schematic structural diagram of a vacuum cleaning device according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of the vacuum cleaning device according to an embodiment of the present invention after the electromagnetic mechanism is removed.

Fig. 3 is a schematic structural diagram of an electromagnetic mechanism according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a vacuum cleaning chamber according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of an airflow control assembly according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a hollow spindle according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a lifting mechanism according to an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a carrier ring according to an embodiment of the present invention.

Fig. 9 is a schematic view of a partial structure of a carrier ring according to an embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a base table according to an embodiment of the present invention.

Fig. 11 is a schematic view of a substrate holder according to an embodiment of the present invention.

FIG. 12 is a schematic diagram of a substrate cleaning process in accordance with an embodiment of the invention.

Legend description: 1. an electromagnetic mechanism; 2. vacuum cleaning the cavity; 3. a hollow main shaft; 4. a lifting mechanism; 5. a base table; 6. a substrate holder; 11. a shield; 12. an electromagnetic field device; 13. a magnetic field detector; 21. an air outlet hole; 22. an air intake device; 221. a gas baffle; 222. a first rotating electric machine; 223. an air flow controller; 224. a second rotating electric machine; 23. a robot inlet; 24. a seal ring; 25. an annular partition plate; 26. an annular heater; 31. an air inlet pipe; 32. an air outlet pipe; 33. a water inlet pipe; 34. a water outlet pipe; 41. a carrier ring; 42. a driving motor; 43. a first bellows; 44. a contact arc; 45. a matching groove; 46. limiting arcs; 51. a back argon vent; 52. a cooling plate; 53. a second bellows; 54. a heating plate; 55. a substrate table; 61. an arc-shaped supporting piece; 62. an electric spring; 63. and (3) rotating the shaft.

Detailed Description

The invention is further described below in connection with the drawings and the specific preferred embodiments, but the scope of protection of the invention is not limited thereby.

Example 1

As shown in fig. 1 to 11, the vacuum cleaning apparatus of the present invention includes: electromagnetic mechanism 1, vacuum cleaning chamber 2, hollow main shaft 3, elevating system 4 and base platform 5. The electromagnetic mechanism 1 is arranged at the top of the vacuum cleaning cavity 2 in a sealing way, and the electromagnetic mechanism 1 is externally connected with a radio frequency power supply to excite process gas in the vacuum cleaning cavity 2 to ionize and form plasma so as to clean the surface of the substrate. The movable end of elevating system 4 sets up inside vacuum cleaning chamber 2, and elevating system 4's drive end sets up in vacuum cleaning chamber 2 outsidely, and elevating system 4 seals the setting with the junction in vacuum cleaning chamber 2. The base platform 5 sets up inside vacuum cleaning chamber 2, and base platform 5 bottom is connected with hollow main shaft 3, and hollow main shaft 3 runs through in vacuum cleaning chamber 2 bottom, and hollow main shaft 3 seals the setting with the junction in vacuum cleaning chamber 2, and inside vacuum cleaning chamber 2, elevating system 4 is located base platform 5 top to realize that the substrate shifts each other between manipulator and base platform 5. The side part of the vacuum cleaning cavity 2 is provided with an air outlet hole 21, an air inlet device 22 and a manipulator inlet 23, process gas for cleaning the substrate enters and exits the vacuum cleaning cavity 2 through the air inlet device 22 and the air outlet hole 21, and the manipulator realizes that the substrate is transferred into or out of the vacuum cleaning cavity 2 through the manipulator inlet 23.

In this embodiment, the main structure of the vacuum cleaning apparatus is constituted by an electromagnetic mechanism 1, a vacuum cleaning chamber 2, a hollow main shaft 3, a lifting mechanism 4, and a base table 5. Specifically, the side of the vacuum cleaning chamber 2 is provided with an air outlet hole 21, an air inlet device 22 and a manipulator inlet 23, and process gas for cleaning the substrate enters and exits the vacuum cleaning chamber 2 through the air inlet device 22 and the air outlet hole 21, so that the substrate is automatically transferred into or out of the vacuum cleaning chamber by utilizing the cooperation of the manipulator and the manipulator inlet 23. The electromagnetic mechanism 1 is arranged at the top of the vacuum cleaning cavity 2 in a sealing way, the electromagnetic mechanism 1 is externally connected with a radio frequency power supply, and the radio frequency power supply is utilized to excite process gas in the vacuum cleaning cavity 2 to ionize so as to form plasma, so that the surface of the substrate is cleaned, the cleaning quality of the substrate is improved, and secondary pollution to the substrate is avoided. The movable end of the lifting mechanism 4 is arranged in the vacuum cleaning cavity 2 in a sealing way, and the driving end of the lifting mechanism 4 is arranged outside the vacuum cleaning cavity 2, so that the lifting mechanism 4 can drive the substrate to move in the vacuum cleaning cavity 2, pollution to the interior of the vacuum cleaning cavity 2 is avoided, and the cleanliness in the vacuum cleaning cavity 2 is ensured; through setting up base platform 5 inside vacuum cleaning chamber 2, base platform 5 bottom is connected with hollow main shaft 3, and hollow main shaft 3 runs through in vacuum cleaning chamber 2 bottom, has realized that base platform 5 is fixed in vacuum cleaning chamber 2 promptly to utilize base platform 5 to provide the support to the substrate, improved the connection reliability of substrate.

As shown in fig. 2, the present embodiment further includes a substrate holder 6, wherein the movable end of the substrate holder 6 is disposed inside the vacuum cleaning chamber 2, the driving end of the substrate holder 6 is disposed outside the vacuum cleaning chamber 2, and the substrate holder 6 is disposed above the movable end of the lifting mechanism 4 inside the vacuum cleaning chamber 2. The substrate clamp 6 is used for clamping the substrate and driving the substrate to lift and rotate so as to realize double-sided cleaning of the substrate in the vacuum cleaning cavity 2.

In this embodiment, through setting up substrate anchor clamps 6, utilize substrate anchor clamps 6 to drive the substrate and go up and down and rotate in vacuum cleaning chamber 2 for vacuum cleaning device has had dual cleaning function, has realized that the substrate carries out two-sided cleaning in vacuum cleaning chamber, has greatly improved the cleaning performance on substrate surface, and has reduced the influence of substrate back impurity to substrate and vacuum cleaning chamber.

As shown in fig. 4 and 5, in the present embodiment, the inner side wall of the vacuum cleaning chamber 2 is provided with an annular partition 25 and an annular heater 26. When the vacuum cleaning cavity 2 is self-cleaned, the annular partition plate 25 is used for being connected with a radio frequency power supply, so that the self-cleaning function of the vacuum cleaning cavity is realized, the influence of self-pollution of the cavity on the substrate is further reduced, and the cleaning quality of the substrate is improved. The annular heater 26 is formed by three layers of heating pipes, the annular heater 26 is vertically distributed around the base table 5 and is positioned between the inner wall of the vacuum cleaning cavity 2 and the base table 5, and the annular heater 26 is used for heating the inside of the vacuum cleaning cavity 2, the base table 5 and the process gas introduced into the vacuum cleaning cavity 2.

In this embodiment, the vacuum cleaning chamber 2 is nearly trapezoidal, and the air inlet end is wider, and the air outlet end is smaller, is favorable to wasing the emission of impurity more. The air outlet holes 21 and the manipulator inlets 23 are respectively arranged on two opposite side walls of the vacuum cleaning cavity 2, and the air inlet devices 22 are symmetrically distributed on two sides of the manipulator inlets 23. The gas inlet device 22 comprises a gas inlet pipeline and a gas flow controller 223 which are connected with each other, and the gas inlet pipeline is also connected with an external process gas source cabinet so as to realize the process gas input into the vacuum cleaning cavity 2. The air inlet pipe interface of the air flow controller 223 is provided with a second rotating motor 224, the second rotating motor 224 is used for driving the air inlet pipe interface to rotate, the air outlet of the air flow controller 223 is provided with an air baffle 221 and a first rotating motor 222, and the first rotating motor 222 drives the air baffle 221 to rotate so as to change the air inlet direction and the air flow in the vacuum cleaning cavity 2.

In this embodiment, the first rotating motor 222 drives the air baffle 221 to rotate so as to change the air inlet direction and size, and the second rotating motor 224 can drive the air inlet pipe interface to rotate, so that the air flow direction can be controlled in a large range by combining with the rotation of the air baffle 221, and the impurities in the vacuum cleaning chamber 2 are driven to leave from the air outlet hole 21.

As shown in fig. 7 to 9, in the present embodiment, the lifting mechanism 4 includes a carrier ring 41, a drive motor 42, and a first bellows 43. The driving motor 42 is arranged outside the vacuum cleaning cavity 2, the bearing ring 41 is arranged inside the vacuum cleaning cavity 2, the output end of the driving motor 42 is connected with the bearing ring 41 through a transmission shaft (not shown in the figure), and the outer side of the transmission shaft is connected with the vacuum cleaning cavity 2 in a sealing way through a first corrugated pipe 43. The driving motor 42 drives the carrying ring 41 to move in the vertical direction, so that the substrates can be mutually transferred between the manipulator and the base table 5.

Further, the carrier ring 41 is provided with a contact arc 44, and the contact arc 44 is an inclined surface for supporting the substrate. Two matching grooves 45 are symmetrically formed in one end of the bearing ring 41, a limiting arc 46 is arranged at the other end of the bearing ring 41, the limiting arc 46 is arranged on the contact arc 44, and the matching grooves 45 and the limiting arc 46 are used for conveying and positioning the substrate.

As shown in fig. 6 and 10, in the present embodiment, an air inlet pipe 31, an air outlet pipe 32, an air inlet pipe 33 and an air outlet pipe 34 are provided inside the hollow main shaft 3. The base table 5 includes: a cooling plate 52, a second bellows 53, a heating plate 54, and a substrate table 55. The bottom of the cooling disc 52 is connected with the hollow main shaft 3, and the water inlet and the water outlet of the cooling disc 52 are respectively connected with the water inlet pipe 33 and the water outlet pipe 34, and the second corrugated pipe 53 is sleeved on the periphery of the hollow main shaft 3 so as to realize the sealing connection between the hollow main shaft 3 and the base table 5 and the vacuum cleaning cavity 2. The cooling disc 52 reduces the temperature of the base table 5 by means of the circulation of cooling water between the inlet pipe 33 and the outlet pipe 34, ensuring an effective sealing at the second bellows 53.

In this embodiment, the heating plate 54 is composed of a plurality of layers of uniformly distributed heating electrodes, and is located between the top of the cooling plate 52 and the bottom of the substrate table 55, so as to uniformly heat the substrate on the substrate table 55, and quickly reach the temperature required by the cleaning process. The substrate table 55 is provided with an air groove (not shown) and a plurality of back argon holes 51, the inlet and outlet of the air groove are respectively communicated with the air inlet pipe 31 and the air outlet pipe 32, the inert back argon gas is enabled to enter the substrate table 55 through the air inlet pipe 31, and the air outlet pipe 32 is communicated with a vacuum pipeline, so that the inert back argon gas is enabled to be pumped out of the substrate table 55. When the substrate cleaning is performed, the carrier ring 41 for loading the substrate is dropped on the substrate stage 55, a space for storing an inert back argon gas is formed between the middle of the substrate and the upper surface of the substrate stage 55, and the substrate is heated by the heating plate 54 to uniformly heat the substrate.

As shown in fig. 11, in the present embodiment, the substrate holder 6 includes an arc-shaped support piece 61, a motor spring 62, and a rotation shaft 63. The motor spring 62 is disposed inside the arc-shaped supporting piece 61 for realizing the clamping of the arc-shaped supporting piece 61 to both sides of the substrate. One end of the rotating shaft 63 is connected with the arc-shaped supporting piece 61, and the other end of the rotating shaft 63 penetrates through the side wall of the vacuum cleaning cavity 2 in a sealing mode and is connected with an external driving mechanism. Driven by the driving mechanism, the rotating shaft 63 drives the arc-shaped supporting piece 61 to lift and rotate 90 degrees in the vacuum cleaning cavity 2, so that double-sided cleaning of the substrate is realized. Specifically, the driving mechanism may include a lift motor and a rotation motor as long as the substrate holder 6 can be driven to lift and rotate.

In this embodiment, the initial substrate is transferred into the vacuum cleaning chamber 2 by a manipulator, when the substrate is transferred to a preset position, the substrate is clamped by the inner side of the arc-shaped supporting plate 61 under the action of the electric spring 62, and after the standby manipulator moves out of the vacuum cleaning chamber 2, the substrate clamp 6 is driven by the driving mechanism to drive the substrate to lift and rotate by 90 degrees, so that the double-sided cleaning of the substrate is realized. Further, both side portions of the arc-shaped supporting piece 61 are chamfered, so that shielding of the arc-shaped supporting piece 61 to the edge of the substrate can be reduced to the greatest extent.

As shown in fig. 3, in the present embodiment, the electromagnetic mechanism 1 includes: a shielding 11, an electromagnetic field device 12 and a magnetic field detector 13. The bottom of the shielding cover 11 is in sealing connection with the top of the vacuum cleaning cavity 2 through a sealing ring 24, the electromagnetic field device 12 and the magnetic field detector 13 are both arranged in the shielding cover 11, the electromagnetic field device 12 consists of two symmetrical electromagnet groups, the single electromagnet group consists of 8 semi-annular electromagnets, the direction and the intensity of a magnetic field in the vacuum cleaning cavity 2 are adjusted through the control of an external radio frequency power supply, the intensity of the magnetic field in the vacuum cleaning cavity 2 is monitored in real time through the magnetic field detector 13, and a reference basis is provided for the selection of a cleaning process.

Example 2

As shown in fig. 12, the substrate cleaning method of the present invention is carried out based on the vacuum cleaning apparatus in embodiment 1, and comprises the steps of:

step S1, before starting a substrate cleaning work, firstly balancing the pressure between a vacuum cleaning cavity 2 and a conveying cavity, then opening a valve of a manipulator inlet 23, and conveying the substrate into the vacuum cleaning cavity 2 by a manipulator;

step S2, driving the bearing ring 41 to ascend by the driving motor 42, moving the substrate to the upper part of the manipulator, then withdrawing the manipulator from the vacuum cleaning cavity 2, and closing a valve of the manipulator inlet 23;

Step S3, driving the bearing ring 41 to descend by the driving motor 42, wherein the bottom of the bearing ring 41 is matched with the top of the substrate table 55 to form a whole;

step S4, determining the temperature and the back argon of the cleaning process, and respectively adjusting the temperature of the heating plate 54 and the gas flow of the back argon hole 51;

Step S5, the air pressure in the vacuum cleaning cavity 2 is regulated through the air flow controller 223, so that the air inlet and the air outlet are balanced, the continuous update of the air in the vacuum cleaning cavity 2 is realized while the power supply is started, and impurities generated by the substrate cleaning are removed conveniently;

s6, a radio frequency power supply is connected into the vacuum cleaning cavity 2 through the electromagnetic field device 12 so as to excite the process gas to ionize and form plasma, and the upper surface of the substrate is cleaned;

Step S7, after the cleaning process is finished, firstly balancing the vacuum degree between the vacuum cleaning cavity 2 and the conveying cavity, then opening a valve of a manipulator inlet 23, transferring the substrate from the base table 5 to the conveying cavity through the cooperation of the lifting mechanism 4 and the manipulator, and then transferring the substrate to the unloading cavity for the next process;

and S8, closing a valve of the mechanical arm inlet 23, connecting a radio frequency power supply to the annular partition plate 25 in the vacuum cleaning cavity 2, and self-cleaning the vacuum cleaning cavity 2 to remove pollutants remained in the substrate cleaning process.

In other embodiments, dual cleaning may be desirable if the backside of the substrate also requires cleaning or the cleaning requirements are very high. After a substrate is sent into the vacuum cleaning cavity 2 by a manipulator, the substrate is clamped and lifted by the substrate clamp 6 and rotated by 90 degrees to be vertically placed, then the electromagnetic field direction is adjusted, two electromagnet groups of the electromagnetic field device 12 are respectively aligned to two surfaces of the substrate, the required temperature in the vacuum cleaning cavity 2 is adjusted by the annular heater 26, then a radio frequency power supply is switched to the electromagnetic field device 12, and the two surfaces of the substrate are cleaned by plasma; after the substrate is cleaned, the hollow cleaning cavity 2 is self-cleaned.

In the embodiment, the pressure between the vacuum cleaning cavity 2 and the conveying cavity is balanced firstly, and then the substrate is conveyed into the vacuum cleaning cavity 2 through the manipulator; then transferring the substrate to the top of the substrate table 55 by a manipulator through a lifting mechanism 4, adjusting the process environment in the vacuum cleaning cavity according to a preset cleaning process, connecting a radio frequency power supply into the vacuum cleaning cavity 2 through an electromagnetic field device 12 to excite process gas ionization to form plasma, and cleaning the upper surface of the substrate, if the substrate needs to be cleaned on both sides, driving the substrate to lift and rotate through a substrate clamp 6, adjusting the electromagnetic field direction, and cleaning the two surfaces of the substrate by using the plasma, thereby realizing high-efficiency and high-quality cleaning of the substrate; when the substrate cleaning process is finished, the radio frequency power supply is connected with the annular partition plate 25 in the vacuum cleaning cavity 2 to excite the process gas to form plasma, and the vacuum cleaning cavity 2 is self-cleaned to remove the residual pollutants in the substrate cleaning process, so that the influence of the self-pollution of the cavity on the substrate is further reduced.

While the invention has been described with reference to preferred embodiments, it is not intended to be limiting. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present invention or equivalent embodiments using the method and technical solution disclosed above without departing from the spirit and technical solution of the present invention. Therefore, any simple modification, equivalent substitution, equivalent variation and modification of the above embodiments according to the technical substance of the present invention, which do not depart from the technical solution of the present invention, still fall within the scope of the technical solution of the present invention.

Claims (11)

1. A vacuum cleaning device, comprising: the vacuum cleaning device comprises an electromagnetic mechanism (1), a vacuum cleaning cavity (2), a hollow main shaft (3), a lifting mechanism (4) and a base table (5); the electromagnetic mechanism (1) is arranged at the top of the vacuum cleaning cavity (2) in a sealing way, and the electromagnetic mechanism (1) is externally connected with a radio frequency power supply to excite process gas in the vacuum cleaning cavity (2) to ionize to form plasma so as to clean the surface of the substrate; the movable end of the lifting mechanism (4) is arranged inside the vacuum cleaning cavity (2), the driving end of the lifting mechanism (4) is arranged outside the vacuum cleaning cavity (2), and the joint of the lifting mechanism (4) and the vacuum cleaning cavity (2) is sealed; the base table (5) is arranged in the vacuum cleaning cavity (2), the bottom of the base table (5) is connected with the hollow main shaft (3), the hollow main shaft (3) penetrates through the bottom of the vacuum cleaning cavity (2), the joint of the hollow main shaft (3) and the vacuum cleaning cavity (2) is sealed, and the lifting mechanism (4) is positioned above the base table (5) in the vacuum cleaning cavity (2) so as to realize mutual transfer of substrates between the manipulator and the base table (5); the side part of the vacuum cleaning cavity (2) is provided with an air outlet hole (21), an air inlet device (22) and a manipulator inlet (23), process gas for cleaning the substrate enters and exits the vacuum cleaning cavity (2) through the air inlet device (22) and the air outlet hole (21), and the manipulator realizes that the substrate is transferred into or out of the vacuum cleaning cavity (2) through the manipulator inlet (23).

2. The vacuum cleaning device according to claim 1, further comprising a substrate holder (6), wherein the movable end of the substrate holder (6) is disposed inside the vacuum cleaning chamber (2), the driving end of the substrate holder (6) is disposed outside the vacuum cleaning chamber (2), and the substrate holder (6) is located above the lifting mechanism (4) inside the vacuum cleaning chamber (2); the substrate clamp (6) is used for clamping the substrate and driving the substrate to lift and rotate so as to realize double-sided cleaning of the substrate in the vacuum cleaning cavity (2).

3. Vacuum cleaning device according to claim 2, characterized in that the inner side wall of the vacuum cleaning chamber (2) is provided with an annular partition (25) and an annular heater (26); when the vacuum cleaning cavity (2) is self-cleaned, the annular partition plate (25) is used for being connected with a radio frequency power supply; the annular heater (26) is vertically distributed around the base table (5) and is positioned between the inner wall of the vacuum cleaning cavity (2) and the base table (5), and the annular heater (26) is used for heating the inside of the vacuum cleaning cavity (2), the base table (5) and process gas introduced into the vacuum cleaning cavity (2).

4. Vacuum cleaning device according to claim 2, characterized in that the air outlet holes (21) and the manipulator inlets (23) are respectively arranged on two opposite side walls of the vacuum cleaning cavity (2), and the air inlet devices (22) are symmetrically distributed on two sides of the manipulator inlets (23); the air inlet device (22) comprises an air inlet pipeline and an air flow controller (223) which are connected with each other, an air inlet pipe interface of the air flow controller (223) is provided with a second rotating motor (224), the second rotating motor (224) is used for driving the air inlet pipe interface to rotate, an air baffle plate (221) and a first rotating motor (222) are arranged at an air outlet of the air flow controller (223), and the first rotating motor (222) drives the air baffle plate (221) to rotate so as to change the air inlet direction and the air flow in the vacuum cleaning cavity (2).

5. Vacuum cleaning device according to claim 2, characterized in that the lifting mechanism (4) comprises a carrier ring (41), a drive motor (42) and a first bellows (43); the driving motor (42) is arranged outside the vacuum cleaning cavity (2), the bearing ring (41) is arranged inside the vacuum cleaning cavity (2), the output end of the driving motor (42) is connected with the bearing ring (41) through a transmission shaft, and the outer side of the transmission shaft is in sealing connection with the vacuum cleaning cavity (2) through a first corrugated pipe (43).

6. Vacuum cleaning device according to claim 5, characterized in that the carrier ring (41) is provided with a contact arc (44), the contact arc (44) being an inclined surface for supporting the substrate; two matching grooves (45) are symmetrically formed in one end of the bearing ring (41), a limiting arc (46) is arranged at the other end of the bearing ring (41), and the matching grooves (45) and the limiting arc (46) are used for conveying and positioning the substrate.

7. Vacuum cleaning device according to claim 5, characterized in that the hollow spindle (3) is internally provided with an air inlet pipe (31), an air outlet pipe (32), an air inlet pipe (33) and an air outlet pipe (34); the base table (5) includes: a cooling plate (52), a second bellows (53), a heating plate (54) and a substrate table (55); the bottom of the cooling disc (52) is connected with the hollow main shaft (3), a water inlet and a water outlet of the cooling disc (52) are respectively connected with the water inlet pipe (33) and the water outlet pipe (34), and a second corrugated pipe (53) is sleeved on the periphery of the hollow main shaft (3) so as to realize the sealing connection between the hollow main shaft (3) and the base table (5) and the vacuum cleaning cavity (2); the heating plate (54) is arranged at the top of the cooling disc (52), the substrate table (55) is arranged at the top of the heating plate (54), the substrate table (55) is provided with an air groove and a plurality of back argon holes (51), and the inlet and the outlet of the air groove are respectively communicated with the air inlet pipe (31) and the air outlet pipe (32) so as to realize that inert back argon gas enters and exits the substrate table (55); when the substrate is cleaned, the bearing ring (41) for loading the substrate falls on the substrate table (55), a space for storing inert back argon gas is formed between the middle part of the substrate and the upper surface of the substrate table (55), and the substrate is heated by the heating plate (54) so as to realize uniform heating of the substrate.

8. Vacuum cleaning device according to any of claims 2 to 7, characterized in that the substrate holder (6) comprises an arc-shaped support sheet (61), a motor spring (62) and a rotation shaft (63); the electric spring (62) is arranged on the inner side of the arc-shaped supporting piece (61) and is used for realizing that the arc-shaped supporting piece (61) clamps two sides of the substrate; one end of the rotating shaft (63) is connected with the arc-shaped supporting piece (61), and the other end of the rotating shaft (63) penetrates through the side wall of the vacuum cleaning cavity (2) in a sealing mode and is connected with an external driving mechanism; under the drive of the driving mechanism, the rotating shaft (63) drives the arc-shaped supporting sheet (61) to lift and rotate by 90 degrees in the vacuum cleaning cavity (2) so as to realize double-sided cleaning of the substrate.

9. Vacuum cleaning device according to any one of claims 1 to 7, characterized in that the electromagnetic mechanism (1) comprises: the vacuum cleaning device comprises a shielding cover (11), an electromagnetic field device (12) and a magnetic field detector (13), wherein the bottom of the shielding cover (11) is in sealing connection with the top of a vacuum cleaning cavity (2), the electromagnetic field device (12) and the magnetic field detector (13) are arranged in the shielding cover (11), the electromagnetic field device (12) is composed of two symmetrical electromagnet groups, the direction and the intensity of a magnetic field in the vacuum cleaning cavity (2) are adjusted through control of an external radio frequency power supply, and the magnetic field intensity in the vacuum cleaning cavity (2) is monitored in real time through the magnetic field detector (13).

10. A substrate cleaning method based on the vacuum cleaning apparatus according to any one of claims 1 to 9, comprising the steps of:

step S1, before starting a substrate cleaning work, firstly balancing the pressure intensity between a vacuum cleaning cavity (2) and a conveying cavity, then opening a valve of a manipulator inlet (23), and conveying the substrate into the vacuum cleaning cavity (2) by a manipulator;

S2, driving the bearing ring (41) to ascend by the driving motor (42), moving the substrate to the upper part of the manipulator, then withdrawing the manipulator from the vacuum cleaning cavity (2), and closing a valve of the manipulator inlet (23);

s3, driving the bearing ring (41) to descend by the driving motor (42), wherein the bottom of the bearing ring (41) is matched with the top of the substrate table (55) to form a whole;

S4, determining the temperature and the back argon of the cleaning process, and respectively adjusting the temperature of a heating plate (54) and the gas flow of a back argon hole (51);

S5, adjusting the air pressure in the vacuum cleaning cavity (2) through the air flow controller (223) to balance the air inlet and the air outlet, and realizing continuous updating of the air in the vacuum cleaning cavity (2) while starting the power supply so as to remove impurities generated by cleaning the substrate;

S6, a radio frequency power supply is connected into the vacuum cleaning cavity (2) through the electromagnetic field device (12) so as to excite the process gas to ionize and form plasma, and the upper surface of the substrate is cleaned;

Step S7, after the cleaning process is finished, firstly balancing the vacuum degree between the vacuum cleaning cavity (2) and the conveying cavity, then opening a valve of a manipulator inlet (23), transferring the substrate from the base table (5) to the conveying cavity through the cooperation of the lifting mechanism (4) and the manipulator, and then transferring the substrate to the unloading cavity for the next process;

and S8, closing a valve of the mechanical arm inlet (23), connecting a radio frequency power supply to an annular partition plate (25) in the vacuum cleaning cavity (2), and performing self-cleaning on the vacuum cleaning cavity (2) to remove pollutants remained in the substrate cleaning process.

11. The substrate cleaning method according to claim 10, wherein when the substrate is required to be cleaned on both sides, after the substrate is fed into the vacuum cleaning chamber (2) by the robot, the substrate is held and lifted by the substrate holder (6) and rotated by 90 ° to be placed vertically, then the electromagnetic field direction is adjusted, the two electromagnet groups of the electromagnetic field device (12) are aligned to the two surfaces of the substrate, the temperature required in the vacuum cleaning chamber (2) is adjusted by the ring heater (26), then the radio frequency power supply is switched to the electromagnetic field device (12), and the two surfaces of the substrate are cleaned by the plasma; and after the substrate is cleaned, self-cleaning is carried out on the vacuum cleaning cavity (2).