CN118137283A

CN118137283A - Dual-chip laser light source

Info

Publication number: CN118137283A
Application number: CN202310836643.9A
Authority: CN
Inventors: 黎鹏志; 马图腾; 关广飞; 徐金磊
Original assignee: Nanjing Radium Photoelectric Co ltd
Current assignee: Nanjing Radium Photoelectric Co ltd
Priority date: 2023-07-07
Filing date: 2023-07-07
Publication date: 2024-06-04

Abstract

The invention discloses a double-chip laser light source, which comprises a ceramic substrate, wherein one end of the top of the ceramic substrate is provided with a bearing chip assembly, so that heat generated by a chip can be quickly conducted out; the other end of the top of the ceramic substrate is provided with an optical fiber array, the top of the ceramic substrate and one side of the ceramic substrate, which is positioned on the optical fiber array, are provided with thermistors, and the bearing chip assembly comprises a heat sink which is arranged at one end of the top of the ceramic substrate and is an aluminum nitride ceramic plate; the top intermediate position of heat sink is provided with two chip bars, and the top of heat sink and the one end that is located two chip bars are provided with MPD control detector. The invention greatly reduces the number of parts in the pump laser module, lightens the assembly process difficulty of the pump laser, reduces the cost of the parts and the assembly time, and is beneficial to the reduction of the size design of the products of the clients; meanwhile, the coupling equipment and the coupling working time are saved, and the coupling efficiency is improved.

Description

Dual-chip laser light source

Technical Field

The invention relates to the technical field of laser light sources, in particular to a double-chip laser light source.

Background

Compared with conventional light sources such as fluorescent lamps, LED light sources, etc., laser light sources have advantages of good coherence, narrow spectrum, large luminous intensity, etc., and generally, laser light sources are composed of semiconductor lasers. The semiconductor laser is a device that generates laser light by using a certain semiconductor material as a working substance, and the working principle is that the ion number inversion of unbalanced carriers is realized between the energy bands (conduction band and valence band) of the semiconductor substance or between the energy bands of the semiconductor substance and the energy levels of impurities (acceptor or donor) by a certain excitation mode, and when a large number of electrons and holes in the ion number inversion state are recombined, a stimulated emission effect is generated, and excitation light with high intensity can be generated.

Fig. 5 shows a top view of a conventional laser light source, which is composed of a substrate a, a heat sink b, a thermistor c, an MPD monitor detector d, a laser chip e, an optical fiber bracket f and an optical fiber g, wherein two pump laser chips and the MPD monitor detector are respectively attached to the two heat sinks to form 2 COS (light source parameters), then the 2 COS and the two optical fiber brackets are attached to the substrate, the laser is lightened, two optical fibers are adopted for dimming, and the two pump laser chips and the two MPD monitor detectors are fixed on the side surfaces of the optical fiber brackets by using UV glue after dimming.

However, in the existing design scheme, two lasers need to be respectively dimmed when in use, and the two optical fibers need to be separated by a certain distance to ensure that interference does not occur when dimming the second optical fiber, so that the overall packaging size of the lasers is larger, and when lasers with more chips are needed, the packaging size needs to be further enlarged, so that the small-size design requirement of the lasers cannot be well met.

For the problems in the related art, no effective solution has been proposed at present.

Disclosure of Invention

The present invention provides a dual-chip laser light source to solve the above-mentioned problems of the prior art.

For this purpose, the invention adopts the following specific technical scheme:

The double-chip laser light source comprises a ceramic substrate, wherein one end of the top of the ceramic substrate is provided with a bearing chip assembly, so that heat generated by a chip can be quickly conducted out; the other end of the top of the ceramic substrate is provided with an optical fiber array, and a thermistor is arranged at one side of the top of the ceramic substrate, which is positioned on the optical fiber array.

Furthermore, in order to quickly conduct the generated heat to the ceramic substrate and finally conduct the generated heat out, the bearing chip assembly comprises a heat sink arranged at one end of the top of the ceramic substrate, and the heat sink is an aluminum nitride ceramic plate; the middle position at the top of the heat sink is provided with a double-chip bar, the top of the heat sink and one end of the heat sink, which is positioned at the double-chip bar, are provided with an MPD monitoring detector, the double-chip bar and the MPD monitoring detector are welded at the top of the heat sink by soldering tin, the heat sink and the thermistor are welded at the top of the ceramic substrate by soldering tin, and the optical fiber array is fixed at the top of the ceramic substrate by adopting UV glue after dimming.

Furthermore, in order to achieve the effects of fast heat dissipation and light modulation of two chips simultaneously, the heat sink is an aluminum nitride ceramic plate, the double-chip bar is two groups of chips which are not cut, and the two groups of chips are mutually close to each other. The anodes of the two groups of chips are separated, and the anodes of the chips are respectively connected with anode tube legs at the top of the heat sink through gold wires, and the cathodes of the chips are connected and attached to the cathode tube legs of the heat sink.

Further, in order to be convenient for play the luminous and luminous intensity of monitoring chip, play the effect of detecting chip ambient temperature simultaneously, all pass through the gold thread connection between MPD monitor detector and the heat sink, between thermistor and the ceramic substrate.

Further, in order to adjust the light of two chips at the same time, the optical fiber array is a dual-fiber optical fiber array. The optical fiber array comprises a base arranged at the other end of the top of the ceramic substrate, and two groups of V-shaped grooves are symmetrically formed in two sides of the top of the base; the inside in V type groove all is provided with optic fibre, and optic fibre top is provided with the apron with base matched with.

Further, in order to be convenient for realize the installation and place optic fibre, the base includes vertical portion and horizontal portion, and the horizontal portion is installed in ceramic substrate's top, and the top one end of horizontal portion is provided with vertical portion, and two sets of V type grooves have been seted up to the top bilateral symmetry of vertical portion.

Further, in order to improve the coupling efficiency, the end portions of the optical fibers are ground into a lens shape, and the optical fibers are designed to protrude from the front end face of the optical fiber array.

The beneficial effects of the invention are as follows:

1) The invention greatly reduces the number of parts in the pump laser module, reduces the total number of the original 21 parts to 11 parts, simultaneously greatly reduces the difficulty of the pump laser assembly process, and reduces the part cost and the assembly working hours.

2) The invention completely closes the two chips together, and the dimming mode of the optical fiber array can design the packaging size of the whole laser module to the minimum, thereby being beneficial to the reduction of the product size design of the client.

3) The invention basically completes the coupling of the second chip while the first chip is coupled, thereby effectively saving the coupling equipment and the coupling man-hour, improving the coupling efficiency, and in addition, the invention provides possibility for designing more chips into a packaging box in future.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a dual chip laser light source according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a partial structure at A in FIG. 1;

FIG. 3 is a top view of FIG. 1;

FIG. 4 is a cross-sectional view of an array of optical fibers in a dual chip laser light source according to an embodiment of the present invention;

Fig. 5 is a top view of a conventional laser light source.

In the figure:

1. a ceramic substrate; 2. a heat sink; 3. a dual chip bar; 4. an MPD monitoring detector; 5. an optical fiber array; 51. a base; 511. a vertical portion; 512. a horizontal portion; 52. a V-shaped groove; 53. an optical fiber; 54. a cover plate; 6. a thermistor; 7. gold wire.

Detailed Description

For the purpose of further illustrating the various embodiments, the present invention provides the accompanying drawings, which are a part of the disclosure of the present invention, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present invention, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.

According to an embodiment of the present invention, a dual chip laser light source is provided.

The invention will be further described with reference to the accompanying drawings and the specific embodiments, as shown in fig. 1 to 4, a dual-chip laser light source according to an embodiment of the invention includes a ceramic substrate 1, where a carrier chip assembly is disposed at one end of the top of the ceramic substrate 1, so that heat generated by a chip can be quickly conducted away; the other end of the top of the ceramic substrate 1is provided with an optical fiber array 5, the top of the ceramic substrate 1 and one side of the optical fiber array 5 are provided with a thermistor 6 which is attached to the top of the ceramic substrate 1 and used for detecting the ambient temperature of the chip, and the ambient temperature of the chip is controlled in a specified range through a circuit.

By means of the technical scheme, the number of parts in the pump laser module is greatly reduced, the assembly process difficulty of the pump laser is also greatly reduced, the cost of the parts and the assembly time are reduced, the packaging size of the whole laser module can be designed to be minimum, and the design of the product size of the whole laser module is facilitated to be reduced by a client; meanwhile, the coupling equipment and the coupling working time are saved, the coupling efficiency is improved, and the possibility is provided for designing more chips (for example, 3 chips and 4 chips) into one packaging box in the future.

In one embodiment, the chip bearing assembly comprises a heat sink 2 arranged at one end of the top of the ceramic substrate 1, wherein the heat sink 2 is an aluminum nitride ceramic plate, so that the effect of bearing the dual-chip bar 3 and the MPD monitoring detector 4 can be achieved, and heat generated by the dual-chip bar 3 can be quickly conducted to the ceramic substrate 1 and finally conducted out; the middle position at the top of the heat sink 2 is provided with a double-chip bar 3, and one end of the top of the heat sink 2, which is positioned at the double-chip bar 3, is provided with an MPD monitoring detector 4, so that whether the chip emits light or not and the intensity of the light can be monitored. The dual-chip bar 3 and the MPD monitoring detector 4 are welded on the heat sink 2 by using soldering, the heat sink 2 and the thermistor 6 are also welded on the ceramic substrate 1 by using soldering, and the optical fiber array 5 is fixed on the ceramic substrate 1 by using UV glue after dimming and is heated for resolidification.

In one embodiment, the dual chip bar 3 is two sets of next to each other chips that are not cut apart. The anodes of the two groups of chips are separated, the anodes of the chips are respectively connected with anode tube legs (Pad) at the top of the heat sink 2 through gold wires 7, the cathodes of the chips are connected and attached to the cathode tube legs (Pad) of the heat sink 2, and as the distance precision between the two chips is very high (submicron level), the dimming of the two chips can be realized at the same time, and the MPD monitoring detector 4 and the heat sink 2 and the thermistor 6 and the ceramic substrate 1 are connected through the gold wires 7.

In one embodiment, the fiber array 5 is a dual fiber array. The optical fiber array 5 comprises a base 51 arranged at the other end of the top of the ceramic substrate 1, and two groups of V-shaped grooves 52 are symmetrically formed on two sides of the top of the base 51; the optical fibers 53 are arranged in the V-shaped grooves 52, the end parts of the optical fibers 53 are ground into a lens shape, the optical fibers 53 are designed to protrude out of the front end face of the optical fiber array 5, and a cover plate 54 matched with the base 51 is arranged on the top of the optical fibers 53. Because the optical fiber array 5 fixes the optical fiber position through the V-shaped groove 52, the position accuracy of the two optical fibers 53 can be controlled to be within 0.5um, so that the dimming of the two chips can be realized at the same time. The heads of the two optical fibers 53 of the optical fiber array 5 are ground into corresponding lenses according to the divergence angles of the chips, so that the coupling efficiency can be improved. Meanwhile, the two optical fibers 53 are designed to protrude from the front end face of the optical fiber array 5 by about 0.5mm, and the distance (about 0.4 mm) between the two optical fibers 53 is smaller than the length (about 1 mm) of the end face of the optical fiber array 5, so that possible interference between the end face of the optical fiber array 5 and the end face of the heat sink 2 during dimming can be reduced, and the coupling efficiency is improved.

In one embodiment, the base 51 includes a vertical portion 511 and a horizontal portion 512, the horizontal portion 512 is mounted on the top of the ceramic substrate 1, one end of the top of the horizontal portion 512 is provided with the vertical portion 511, two sets of V-shaped grooves 52 are symmetrically formed on two sides of the top of the vertical portion 511, and the mounting and placement of the optical fibers are facilitated through the cooperation design of the vertical portion 511 and the horizontal portion 512.

Compared with the traditional pump laser, the invention greatly reduces the number of parts in the pump laser module (as shown in the following table 1), and reduces the total 21 parts from original to 11 parts.

Table 1 design parts quantity table for laser light source

As can be seen from Table 1, the invention greatly reduces the number of parts in the pump laser module from 21 parts to 11 parts, and simultaneously greatly reduces the difficulty of the pump laser assembly process and the cost and man-hour of the parts.

According to the invention, a dual-chip bar is used for the first time to replace two independent 980 chips to make 980 pump lasers, so that the number of laser parts is greatly reduced; the optical fiber array is matched with the chip Bar to be used as a double-chip 980 pump laser for the first time, so that the dimming time is shortened; the optical fiber array is made of the lensed fiber for the first time and is applied to dimming of 980 pump lasers; the protruding type optical fiber array is designed for the first time and applied to 980 pump lasers, so that mutual interference among materials during dimming is reduced; can be applied to single-mode or multimode 980 pump lasers simultaneously.

In addition, in some special applications, customers use multimode chips and multimode fiber output, the design scheme can also realize that compared with single-mode fibers, the multimode fiber has higher coupling efficiency, has higher tolerance to alignment errors of the fiber and the chips, has little influence on the coupling efficiency due to slight dislocation (such as 2-3 microns), and is easier to realize product development.

In order to facilitate understanding of the above technical solutions of the present invention, the following describes in detail the working principle or operation manner of the present invention in the actual process.

The dimming lights one of the two chips bar 3, couples the laser into the optical fiber 53, then lights the second chip, confirms the power of the chip coupled to the second optical fiber 53, and if the power is lower, adjusts the relative positions of the chip and the optical fiber 53 in a small range, and finally maximizes the total power of the two optical fibers 53.

In summary, by means of the technical scheme of the invention, the number of parts in the pump laser module is greatly reduced, the total number of 21 parts is reduced to 11 parts, meanwhile, the difficulty of the pump laser assembly process is greatly reduced, and the part cost and assembly working hours are reduced.

In addition, the two chips are completely close together, and the light modulation mode of the optical fiber array is used, so that the packaging size of the whole laser module can be designed to be minimum, and the size design of products of the laser module is reduced by a client.

In addition, the invention basically completes the coupling of the second chip while the first chip is coupled, thereby effectively saving the coupling equipment and the coupling man-hour, improving the coupling efficiency, and in addition, the invention provides possibility for designing more chips (such as 3 chips and 4 chips) into a packaging box.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.

Claims

1. The double-chip laser light source comprises a ceramic substrate (1) and is characterized in that one end of the top of the ceramic substrate (1) is provided with a bearing chip assembly;

the optical fiber array (5) is arranged at the other end of the top of the ceramic substrate (1), and the thermistor (6) is arranged at the top of the ceramic substrate (1) and positioned at one side of the optical fiber array (5).

2. A dual chip laser light source as claimed in claim 1, wherein the carrier chip assembly comprises a heat sink (2) provided at one end of the top mounted on the ceramic substrate (1);

the heat sink is characterized in that a double-chip bar (3) is arranged at the middle position of the top of the heat sink (2), and an MPD monitoring detector (4) is arranged at one end of the double-chip bar (3) at the top of the heat sink (2).

3. The dual-chip laser light source according to claim 2, characterized in that the dual-chip bar (3) and the MPD monitor detector (4) are both solder-welded on top of the heat sink (2);

the heat sink (2) and the thermistor (6) are welded at the top of the ceramic substrate (1) by adopting soldering tin, and the optical fiber array (5) is fixed at the top of the ceramic substrate (1) by adopting UV glue after dimming.

4. A dual chip laser light source according to claim 2, characterized in that the heat sink (2) is an aluminium nitride ceramic plate, the dual chip bar (3) is two groups of chips which are not cut apart, and the two groups of chips are mutually close.

5. The dual chip laser light source of claim 4, wherein anodes of the two groups of chips are separated, anodes of the chips are respectively connected with anode tube legs at the top of the heat sink (2) through gold wires (7), and cathodes of the chips are connected and attached to cathode tube legs of the heat sink (2).

6. The dual-chip laser light source according to claim 2, wherein the MPD monitoring detector (4) and the heat sink (2) and the thermistor (6) and the ceramic substrate (1) are connected by the gold wires (7).

7. A dual chip laser light source according to claim 1, characterized in that the optical fiber array (5) is a dual fiber optical fiber array.

8. The dual-chip laser light source according to claim 7, wherein the optical fiber array (5) comprises a base (51) arranged at the other end of the top of the ceramic substrate (1), and two groups of V-shaped grooves (52) are symmetrically formed on two sides of the top of the base (51);

The inside of V type groove (52) all is provided with optic fibre (53), the top of optic fibre (53) be provided with base (51) matched with apron (54).

9. The dual-chip laser light source according to claim 8, wherein the base (51) comprises a vertical portion (511) and a horizontal portion (512), the horizontal portion (512) is mounted on the top of the ceramic substrate (1), the vertical portion (511) is disposed at one end of the top of the horizontal portion (512), and two groups of V-shaped grooves (52) are symmetrically formed on two sides of the top of the vertical portion (511).

10. A dual chip laser light source according to claim 8, characterized in that the ends of the optical fibers (53) are ground into a lens shape and the optical fibers (53) are designed to protrude from the front end face of the optical fiber array (5).