CN118131018A - Wafer needle test structure and wafer needle test equipment - Google Patents

Abstract

The invention discloses a wafer needle testing structure and wafer needle testing equipment, wherein the wafer needle testing structure comprises a probe card, a connector and a mounting plate, the probe card is provided with a first contact, and the probe card is used for being electrically connected with a wafer so as to detect the wafer; the connector is provided with a first contact, and the first contact is connected with the first contact so as to electrically connect the probe card and the connector; the mounting plate is detachably connected with the connector and is electrically connected with the probe card through the connector, and the mounting plate is used for being connected with a test host. The technical scheme of the invention aims to improve the transmission speed of the test signal of the wafer needle test structure, so that the wafer can be subjected to high-frequency test before packaging, the waste of the packaging process is avoided, and the production cost of the wafer is reduced.

Description

Wafer needle test structure and wafer needle test equipment

Technical Field

The present invention relates to wafer testing technology, and in particular, to a wafer probing structure and a wafer probing apparatus.

Background

A die, also called a die or die, is a small integrated circuit body fabricated from semiconductor material without packaging, and the intended function of the integrated circuit is realized on this small semiconductor.

In the related art, the high-frequency test of the wafer is usually performed after the finished product is finished, if the high-frequency test can be performed in the stage of testing the wafer, the wafer defect can be found early, the high-frequency test is performed after the finished product is prevented from being packaged, and the defect of the finished product is found at the moment, so that the waste of the working procedure is caused. In the wafer test stage, the detection signal of the wafer is usually connected with the test needle plate through a cable, the transmission signal transmitted by the cable is weaker, the signal is easy to attenuate, and the effect of high-frequency detection cannot be achieved.

Disclosure of Invention

The invention mainly aims to provide a wafer needle testing structure and wafer needle testing equipment, which aim to improve the transmission speed of a test signal of the wafer needle testing structure, so that a wafer can be subjected to high-frequency test before packaging, the waste of packaging procedures is avoided, and the production cost of the wafer is reduced.

In order to achieve the above object, the present invention provides a wafer probing structure, which includes:

The probe card is provided with a first contact and is used for being electrically connected with the wafer so as to detect the wafer;

A connector provided with a first contact, the first contact being connected with the first contact so as to electrically connect the probe card and the connector; and

The mounting plate is detachably connected with the connector and is electrically connected with the probe card through the connector, and the mounting plate is used for being connected with a test host.

In an embodiment of the present invention, the connector is integrally provided with the probe card, and the first contacts each include a plurality of first contacts and a plurality of first contacts are connected in one-to-one correspondence.

In an embodiment of the present invention, the connector is disposed separately from the probe card, and the first contacts each include a plurality of the first contacts and the plurality of the first contacts are disposed in one-to-many relation.

In an embodiment of the present invention, the connector includes a test board, a carrier board, and a probe holder, where the test board is connected to the mounting board, the carrier board is connected to the test board, the mounting board is electrically connected to the carrier board through the test board, the carrier board is provided with a second contact, and the probe holder is provided with a second contact, and the second contact is connected to the second contact, so that the probe holder and the carrier board are electrically connected.

In an embodiment of the present invention, the first contact and the second contact each include a plurality of first contacts and a plurality of second contacts, which are respectively disposed on two opposite sides of the probe seat, and the second contacts are disposed in one-to-one correspondence with the second contacts.

In an embodiment of the invention, the first contact and/or the second contact is a spring contact.

In an embodiment of the invention, the connector is provided with a third contact and a locking member, the mounting plate is provided with a locking part corresponding to the locking member, the locking member is connected to the locking part, the mounting plate is provided with a third contact corresponding to the third contact, and the third contact is connected to the third contact, so that the connector is connected to the mounting plate and is electrically connected with the mounting plate.

In one embodiment of the invention, the mounting board is provided with high speed FPGA field programmable gate array elements.

The invention also provides wafer needle testing equipment, which comprises a machine table, a driving mechanism and the wafer needle testing structure, wherein the machine table is provided with a test position, the driving mechanism is connected with the machine table corresponding to the test position, and the mounting plate of the wafer needle testing structure is connected with the output end of the driving mechanism.

In an embodiment of the invention, the wafer needle testing device further includes a fixing seat, the fixing seat is detachably disposed at the testing position of the machine, and the fixing seat is used for fixing a wafer.

The technical scheme of the invention is that a first contact is arranged on a probe card of a wafer probe structure, and the probe card is used for being electrically connected with a wafer so as to detect the wafer; the connector of the wafer needle testing structure is provided with the first contact, the first contact is connected with the first contact, so that the probe card is electrically connected with the connector, the probe card and the mounting plate are prevented from being connected through the coaxial cable, the wiring length is reduced, the transmission speed of test data is improved, the test connector is close to a chip to be tested, the attenuation of transmission signals is reduced, and the wafer needle testing structure achieves the effect of high-frequency detection. The mounting plate of the wafer probing structure is detachably connected with the connector and is electrically connected with the probe card through the connector, and the mounting plate is used for being connected with a test host to transmit test signals. The wafer needle test structure enables the wafer to be subjected to high-frequency test before packaging, avoids the waste of packaging procedures, and reduces the production cost of the wafer.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a wafer probing structure according to an embodiment of the present invention;

FIG. 2 is a schematic view of a portion of a wafer probing structure according to an embodiment of the present invention;

FIG. 3 is a schematic view of a portion of a wafer probing structure according to another embodiment of the present invention.

Reference numerals illustrate:

The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout is meant to include three side-by-side schemes, for example, "a and/or B", including a scheme, or B scheme, or a scheme that is satisfied by both a and B. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

In the related art, a test head of a wafer probe structure is connected to a probe card through a coaxial cable, in order to ensure that the probe card is stressed uniformly, a horizontal position is ensured during testing, a cable of the test head avoids the middle position of the probe card and is connected inwards from the periphery of the probe card, so that the circuit of the wafer probe structure is tedious, a test signal transmitted by the cable is weak, the test signal is easy to attenuate, and the problem of limited test speed is caused.

Based on the above-mentioned conception and problems, please refer to fig. 1 to 3, the present invention proposes a wafer probing structure 100, wherein the wafer probing structure 100 comprises a probe card 1, a connector 2 and a mounting board 3, the probe card 1 is provided with a first contact 11, and the probe card 1 is used for electrically connecting with a wafer 4 to detect the wafer 4; the connector 2 is provided with a first contact 231, and the first contact 231 is connected with the first contact 11 so as to electrically connect the probe card 1 and the connector 2; the mounting board 3 is detachably connected with the connector 2 and electrically connected with the probe card 1 through the connector 2, and the mounting board 3 is used for connecting with a test host.

In this embodiment, the wafer probing structure 100 is composed of a probe card 1, a connector 2 and a mounting board 3, the mounting board 3 is provided with a test circuit and is connected with a test host for generating and receiving test signals, the probe card 1 is electrically connected with the mounting board 3 through the connector 2, the connector 2 is used for switching the probe card 1 and the mounting board 3 and transmitting the test signals between the probe card 1 and the mounting board 3, and the probe card 1 is provided with probes connected with bonding pads of a wafer 4 so that the test signals are transmitted between the test host and the wafer 4. The first contact 231 of the connector 2 is connected with the first contact 11 of the probe card 1, so that the connector 2 and the probe card 1 are electrically connected, the connection mode can be directly accessed from the middle position of the probe card 1, the path for electrically connecting the connector 2 and the probe card 1 is greatly reduced, the shorter the connection path is, the faster the signal transmission between the connector 2 and the probe card 1 is, the lower the attenuation degree of the test signal of the probe card 1 is reached, and thus the test speed of the wafer probe structure 100 can meet the requirement of high-frequency test. The wafer probing structure 100 can perform high-frequency test on the wafer 4 before packaging, so as to avoid the high-frequency test of the wafer 4 after packaging, and if the packaged wafer 4 is unqualified in the high-frequency test, the packaging process of the wafer 4 is wasted, so that the production cost of the wafer 4 is increased.

In an embodiment of the present invention, as shown in fig. 1 and 2, the connector 2 is integrally provided with the probe card 1, and the first contacts 231 and the first contacts 11 each include a plurality of first contacts 231 and a plurality of first contacts 11 connected in one-to-one correspondence.

In this embodiment, when the wafer probe structure 100 tests the wafer 4, the driving mechanism drives the mounting board 3 to approach the wafer 4 to be tested, and the connector 2 and the probe card 1 move along with the mounting board 3 until the probes of the probe card 1 are connected with the pads of the wafer 4, wherein the first contacts 231 of the connector 2 and the first contacts 11 of the probe card 1 are connected in one-to-one correspondence, so as to realize signal transmission from the wafer 4 to the probe card 1 to the connector 2 to the mounting board 3. In practical implementation, the connector 2 and the probe card 1 may be detachably connected integrally by a locking structure or a clamping structure, and the first contact 231 and the first contact 11 may abut or be soldered, which is not limited herein.

In one embodiment of the present invention, as shown in fig. 1 and 3, the connector 2 is provided separately from the probe card 1, and the first contacts 231 and the first contacts 11 each include a plurality of first contacts 231 and a plurality of first contacts 11 arranged in a one-to-many manner.

In this embodiment, when the wafer probe structure 100 tests the wafer 4, the probe card 1 is first combined with the wafer 4 to be tested, the probes of the probe card 1 are connected with the pads of the wafer 4, the probe card 1 is electrically connected with the wafer 4, and the driving mechanism drives the mounting board 3 to drive the connector 2 to approach the probe card 1 until the first contacts 231 of the connector 2 are connected with the first contacts 11 of the probe card 1, so that the connector 2 is electrically connected with the probe card 1. The first contacts 231 may be disposed corresponding to the plurality of first contacts 11, and at this time, the first contacts 11 of the probe card 1 may be connected with the first contacts 231 of the connector 2 in sequence in a region-by-region manner, so that the arrangement volume of the connector 2 may be reduced, and even if the wafer 4 is tested multiple times, only One test trace is left on the bonding pad of each die of the wafer 4, so as to realize One touch down test on the wafer 4, reduce the abrasion to the bonding pad of the wafer 4, and prolong the subsequent service life of the wafer 4.

In practical implementation, the probe card 1 may be detachably connected to the wafer fixing base by a locking mechanism or a card and structure, so that the probes of the probe card 1 are electrically connected to the pads of the wafer 4, and the probe card 1 and the connector 2 may be correspondingly provided with a positioning mechanism so that the first contacts 231 of the connector 2 are positioned and connected with the first contacts 11 of the probe card 1.

In an embodiment of the present invention, as shown in fig. 2 and 3, the connector 2 includes a test board 21, a carrier board 22 and a probe holder 23, the test board 21 is connected to the mounting board 3, the carrier board 22 is connected to the test board 21, the mounting board 3 is electrically connected to the carrier board 22 through the test board 21, the carrier board 22 is provided with a second contact 221, the probe holder 23 is provided with a second contact 232, and the second contact 232 is connected to the second contact 221, so that the probe holder 23 is electrically connected to the carrier board 22.

In this embodiment, the connector 2 is composed of a test board 21, a carrier board 22 and a probe seat 23, the test board 21 is connected to the mounting board 3, one surface of the carrier board 22 is connected to the test board 21, a second contact 221 is disposed on the other surface of the carrier board 22, the probe seat 23 is provided with a second contact 232 corresponding to the second contact 221, and the probe seat 23 and the carrier board 22 are electrically connected through the connection between the second contact 232 and the second contact 221, so that the signal transmission path is further reduced, and the speed and frequency of the connector 2 for transmitting test signals are improved.

In practical implementation, the test board 21 has a first connecting end and a second connecting end that are the contained angle setting, and first connecting end is connected in mounting panel 3, and the second connecting end is connected in loading board 22 to make mounting panel 3 and loading board 22 be the contained angle and connect, it can be understood that first connecting end and second connecting end can realize the physical connection, also can realize the electricity and connect, and mounting panel 3 and loading board 22 can be the perpendicular setting, and loading board 22, probe seat 23 and probe card 1 can be parallel arrangement, so that drive structure drive mounting panel 3 is close to or keeps away from the wafer 4 that awaits measuring through going up and down to drive probe card 1.

In an embodiment of the present invention, as shown in fig. 2 and 3, the first contacts 231 and the second contacts 232 each include a plurality of first contacts 231 and a plurality of second contacts 232 respectively disposed on opposite sides of the probe base 23, and the second contacts 221 are disposed in one-to-one correspondence with the second contacts 232.

In this embodiment, the second contacts 221 of the carrier plate 22 and the second contacts 232 of the probe holder 23 are disposed in one-to-one correspondence to achieve the electrical connection between the carrier plate 22 and the probe holder 23. It will be appreciated that the probe seat 23 and the carrier plate 22 may be detachably connected by a snap-fit structure or a locking structure, and the second contact 221 and the second contact 232 may abut or be welded, which is not specifically limited herein.

In one embodiment of the present invention, as shown in fig. 2 and 3, the first contact 231 and/or the second contact 232 are elastic contacts.

In this embodiment, the elastic contact comprises sheath and contact pin, and the contact pin wears to locate in the sheath for the sheath forms the parcel to the contact pin, and the material of sheath can be rubber or plastics, so forms the buffer layer in the contact pin outside, reduces the risk of contact pin fracture, still forms the insulating layer in the contact pin outside simultaneously, guarantees to realize the stability of electric connection, and sheath and contact pin accessible block structure can dismantle the connection or bond, does not do specifically limit here.

In practical implementation, the contact pin is composed of a needle tube, a needle head and an elastic piece, the elastic piece is limited in a through cavity formed by the needle tube, the cross-sectional area of the through cavity formed by enclosing of the needle tube can be gradually reduced from the bottom of the groove to the opening, the shape of the bottom of the needle head is consistent with that of one end of the through cavity, which is close to the opening, so that the needle head is limited in the through cavity and at least partially stretches out of the opening of the through cavity, the needle head is elastically connected with the needle tube through the elastic piece, when the elastic contact head is electrically connected, the needle head abuts against the first contact point 11 or the second contact point 221, the elastic piece is compressed, the needle head always abuts against the first contact point 11 or the second contact point 221, and therefore the stability of the electrical connection of the connector 2 and the electrical connection of the probe board is improved. It will be appreciated that the surface of the needle is smoothly transitioned to the interior wall of the cavity so that the needle can be held in abutment with the needle cannula while also being slidable along the interior wall of the cavity so as to compress the resilient member.

In an embodiment of the present invention, as shown in fig. 1, the connector 2 is provided with a third contact and a locking member, the mounting plate 3 is provided with a locking portion corresponding to the locking member, the locking member is connected to the locking portion, the mounting plate 3 is provided with a third contact corresponding to the third contact, and the third contact is connected to the third contact, so that the connector 2 is connected to the mounting plate 3 and electrically connected to the mounting plate 3.

In the present embodiment, the connector 2 and the mounting board 3 are physically connected by the fitting of the locking piece and the locking portion, while the electrical connection is achieved by the fitting of the third contact and the third contact. It will be appreciated that the locking portion may be provided on the connector 2, the locking member may be provided on the mounting plate 3, the locking member and the locking portion may be a screw and a threaded hole, and the third contact may be welded to the third contact, which is not particularly limited herein.

In one embodiment of the invention, as shown in FIG. 1, mounting board 3 is provided with a high speed FPGA field programmable gate array element 31.

In this embodiment, the mounting board 3 is provided with the high-speed FPGA field programmable gate array element 31, and a tester can change parameters of a test program in real time according to the test requirement of the wafer 4 through the high-speed FPGA field programmable gate array element 31, so that the wafer probing structure 100 has a controllable test program, and the test parameters of the wafer probing structure 100 are convenient to adjust. It will be appreciated that the high speed FPGA field programmable gate array element 31 may be integrated on the mounting board 3 to improve the tamper resistance of the wafer probing structure 100.

The invention also provides wafer needle testing equipment, which comprises a machine table, a driving mechanism and a wafer needle testing structure 100, wherein the specific structure of the wafer needle testing structure 100 refers to the embodiment, and the wafer needle testing equipment at least has all beneficial effects brought by the technical schemes of the embodiment because the wafer needle testing equipment adopts all the technical schemes of the embodiment, and the description is omitted herein.

Wherein, the machine is equipped with the test position, and the corresponding test position of actuating mechanism is connected in the machine, and the mounting panel 3 of wafer needle survey structure 100 is connected in actuating mechanism's output.

In this embodiment, as shown in fig. 1, the wafer probing apparatus is composed of a machine, a driving mechanism, and a wafer probing structure 100. The driving mechanism is connected to the machine table, and the mounting plate 3 of the wafer needle measurement structure 100 is connected to the output end of the driving mechanism; the driving mechanism drives the wafer probing structure 100 to approach the wafer 4 to be tested, so that the probe board is electrically connected with the wafer 4 to be tested, the wafer probing structure 100 tests the wafer 4 to be tested, and after the test is completed, the driving mechanism drives the wafer probing structure 100 to be far away from the wafer 4, so that the wafer 4 is replaced.

In practical implementation, the wafer probing apparatus further has a test host electrically connected to the driving mechanism and the wafer probing structure 100, and a tester can adjust the operation of the driving mechanism and the wafer probing structure 100 and adjust the test parameters of the wafer 4 through the test host. The test host may receive and display the test results of wafer 4.

In an embodiment of the present invention, the driving mechanism includes a sensor and a stepper motor, the test site is used for placing the wafer 4 to be tested, the stepper motor is connected to the machine, the wafer probing structure 100 is connected to the output end of the stepper motor, and the sensor is disposed on the wafer probing structure 100 corresponding to the test site.

In this embodiment, the driving mechanism is composed of a sensor and a stepper motor, and the sensor is used for sensing the distance between the probe card and the wafer 4 to be tested, i.e. the current position of the probe card. The sensor transmits a position signal of the probe card to the test host, and the test host controls the running state and the running direction of the stepping motor through the position signal. In practical implementation, the sensor may be a laser sensor, a contact position sensor, a photoelectric sensor, a non-contact sensor, or a combination of the above sensors.

In an embodiment of the present invention, the wafer probing apparatus further includes a fixing base, where the fixing base is detachably disposed at the test position of the machine, and the fixing base is used for fixing the wafer 4.

In this embodiment, the fixing base can fix the wafer 4 to be tested through vacuum adsorption, and the fixing base is detachably connected to the machine table through a clamping fit or locking mechanism locking mode, so that the fixing base can be detached independently. In practical implementation, the fixing base may also fix the wafer 4 to be tested through a clamping structure, which is not limited herein.

The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the specification and drawings of the present invention or direct/indirect application in other related technical fields are included in the scope of the present invention.

Claims (10)

1. The wafer needle survey structure, its characterized in that, wafer needle survey structure includes:

The probe card is provided with a first contact and is used for being electrically connected with the wafer so as to detect the wafer;

A connector provided with a first contact, the first contact being connected with the first contact so as to electrically connect the probe card and the connector; and

The mounting plate is detachably connected with the connector and is electrically connected with the probe card through the connector, and the mounting plate is used for being connected with a test host.

2. The wafer probing structure as recited in claim 1 wherein the connector is integrally disposed with the probe card, the first contacts and the first contacts each comprising a plurality of one-to-one connections.

3. The wafer probing structure as recited in claim 1 wherein the connector is disposed separately from the probe card, the first contacts and the first contacts each comprising a plurality, the plurality of first contacts and the plurality of first contacts being disposed one-to-many.

4. A wafer probing structure as recited in any one of claims 1 to 3 wherein the connector comprises a test plate, a carrier plate and a probe mount, the test plate being connected to the mounting plate, the carrier plate being connected to the test plate, the mounting plate being electrically connected to the carrier plate through the test plate, the carrier plate being provided with a second contact, the probe mount being provided with a second contact, the second contact being connected to the second contact so as to electrically connect the probe mount and the carrier plate.

5. The wafer probing structure as recited in claim 4 wherein the first and second contacts each comprise a plurality of first and second contacts disposed on opposite sides of the probe mount, the second contacts being disposed in one-to-one correspondence with the second contacts.

6. The wafer probing structure as recited in claim 4 wherein the first contact and/or the second contact are resilient contacts.

7. The wafer probing structure as recited in claim 1 wherein the connector is provided with a third contact and a locking member, the mounting plate is provided with a locking portion corresponding to the locking member, the locking member is connected to the locking portion, the mounting plate is provided with a third contact corresponding to the third contact, and the third contact is connected to the third contact so that the connector is connected to the mounting plate and electrically connected to the mounting plate.

8. The wafer prober of claim 1, wherein the mounting plate is provided with a high speed FPGA field programmable gate array element.

9. A wafer needle testing device, characterized in that the wafer needle testing device comprises a machine table, a driving mechanism and the wafer needle testing structure according to any one of claims 1 to 8, wherein the machine table is provided with a test position, the driving mechanism is connected with the machine table corresponding to the test position, and the mounting plate of the wafer needle testing structure is connected with the output end of the driving mechanism.

10. The wafer prober of claim 9, further comprising a holder detachably mounted to the test station of the machine, the holder for holding a wafer.