CN118116693A - Coupler, radio frequency front end module and terminal equipment - Google Patents
Coupler, radio frequency front end module and terminal equipment Download PDFInfo
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- 230000008878 coupling Effects 0.000 claims abstract description 330
- 238000010168 coupling process Methods 0.000 claims abstract description 330
- 238000005859 coupling reaction Methods 0.000 claims abstract description 330
- 230000005540 biological transmission Effects 0.000 claims abstract description 72
- 238000002955 isolation Methods 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 17
- 239000002344 surface layer Substances 0.000 claims description 14
- 238000010586 diagram Methods 0.000 description 35
- 238000004891 communication Methods 0.000 description 34
- 230000006854 communication Effects 0.000 description 34
- 230000006870 function Effects 0.000 description 24
- 230000005684 electric field Effects 0.000 description 20
- 238000007726 management method Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 230000005236 sound signal Effects 0.000 description 13
- 238000010295 mobile communication Methods 0.000 description 12
- 210000000988 bone and bone Anatomy 0.000 description 9
- 238000001514 detection method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 208000032370 Secondary transmission Diseases 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 238000013528 artificial neural network Methods 0.000 description 3
- 230000003313 weakening effect Effects 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000003416 augmentation Effects 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000036772 blood pressure Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000007175 bidirectional communication Effects 0.000 description 1
- 238000013529 biological neural network Methods 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001537 neural effect Effects 0.000 description 1
- 210000002569 neuron Anatomy 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002138 osteoinductive effect Effects 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000003238 somatosensory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000001755 vocal effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The application relates to the technical field of electronics, and provides a coupler, a radio frequency front end module and terminal equipment, wherein the coupler comprises: a dielectric plate, a main transmission line and a coupling inductor; the main transmission line and the coupling inductor are arranged on the dielectric plate; a first electrode of the coupling inductor is connected with a coupling end; the second electrode of the coupling inductor is connected with the ground reference through an isolation resistor; the first electrode and the second electrode are connected through a coil inside the coupling inductor; the main transmission line comprises an input part, a coupling part and an output part; two ends of the coupling part are respectively connected with the input part and the output part; the coupling part is used for generating electromagnetic coupling with the coil when transmitting radio frequency signals. The coupler is small in size.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a coupler, a radio frequency front end module and terminal equipment.
Background
With the rapid development of terminal equipment, the integration level of components is higher and higher, and the requirement on the volume of each component is also higher and higher. Besides meeting the performance requirements, the components are miniaturized as much as possible to adapt to the development of terminal equipment.
For example, a coupler is usually disposed in the terminal device to process the rf signal, and the rf front-end module often needs to use the coupler to couple the energy of the signal to achieve the functions of power detection or antenna tuning. Common types of couplers are integrated device couplers and microstrip couplers.
However, the volume of a typical coupler is large.
Disclosure of Invention
The application provides various couplers, a radio frequency front end module and terminal equipment, wherein the couplers are small in size and have the characteristic of miniaturization.
In a first aspect, there is provided a coupler comprising: a dielectric plate, a main transmission line and a coupling inductor; the main transmission line and the coupling inductor are arranged on the dielectric plate; a first electrode of the coupling inductor is connected with a coupling end; the second electrode of the coupling inductor is connected with the ground reference through an isolation resistor; the first electrode and the second electrode are connected through a coil inside the coupling inductor; the main transmission line comprises an input part, a coupling part and an output part; two ends of the coupling part are respectively connected with the input part and the output part; the coupling part is used for generating electromagnetic coupling with the coil when transmitting radio frequency signals.
Optionally, the coupling part is a transmission line in a straight shape.
Optionally, the coupling portion is a curved transmission line.
Optionally, the coupling part is a U-shaped transmission line.
Optionally, the coupling part is a transmission line in a concave shape.
Optionally, the coupling part is a wave-shaped transmission line.
Optionally, the direction in which the first electrode points to the second electrode and the direction in which the input end points to the output end are parallel.
Optionally, the direction in which the first electrode points to the second electrode is perpendicular to the direction in which the input end points to the output end.
Optionally, the input portion, the output portion, and the coupling portion are all located on a surface layer of the dielectric plate.
Optionally, the input portion and the output portion are located on a surface layer of the dielectric plate; the coupling part is positioned at the inner layer of the dielectric plate, and the coupling part is connected with the input part and the output part through a metallized via hole.
Optionally, the projection of the coupling portion on the first surface with the largest area of the dielectric plate and the projection of the coupling inductor on the first surface do not intersect.
Optionally, a projection of the coupling portion on the first surface of the dielectric plate with the largest area intersects a projection of the coupling inductor on the first surface.
Optionally, an included angle between the opening direction of the coil and the first surface with the largest area of the dielectric plate is smaller than a preset angle threshold.
Optionally, an angle between the opening direction of the coil and the first surface with the largest area of the dielectric plate is smaller than a preset angle threshold value.
In a second aspect, a radio frequency front end module is provided, comprising a coupler as in any of the above embodiments.
In a third aspect, a terminal device is provided comprising a coupler as in any of the embodiments above.
In a fourth aspect, a terminal device is provided, including a radio frequency front end module as in any one of the above embodiments.
Drawings
Fig. 1 is a schematic structural diagram of an example of a terminal device 100 according to an embodiment of the present application;
Fig. 2 is a schematic diagram of a coupler in a rf front-end module according to an embodiment of the present application;
FIG. 3 is a schematic diagram of an example of a microstrip coupler in the prior art;
FIG. 4 is a basic block diagram and an equivalent schematic diagram of an example coupler provided by an embodiment of the present application;
FIG. 5 is a schematic diagram of an example of a coupler according to an embodiment of the present application;
FIG. 6 is a perspective view of the internal structure of an example coupled inductor according to an embodiment of the present application;
FIG. 7 is a schematic diagram of an example of electric field coupling and magnetic field coupling provided by an embodiment of the present application;
FIG. 8 is a perspective view of the top of an example coupler provided by an embodiment of the present application;
FIG. 9 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 10 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 11 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 12 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 13 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 14 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 15 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 16 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 17 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 18 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 19 is a perspective view of the top of yet another example coupler provided by an embodiment of the present application;
FIG. 20 is a schematic diagram of electric field coupling and magnetic field coupling of a further example of a coupler structure provided by an embodiment of the present application;
Fig. 21 is a schematic diagram of electric field coupling and magnetic field coupling of a further example of a coupler structure according to an embodiment of the present application.
Reference numerals:
dielectric plate: 510;
a main transmission line: 520;
An input unit: 521;
coupling part: 522.
An output unit: 523;
Coupling inductor: 530;
A first electrode: 531;
a second electrode: 532;
a coil: 533 (533);
Non-magnetic ceramic: 534.
Isolation resistance: 540;
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. Wherein, in the description of the embodiments of the present application, unless otherwise indicated, "/" means or, for example, a/B may represent a or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present application, "plurality" means two or more than two.
The terms "first," "second," "third," and the like, are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", or a third "may explicitly or implicitly include one or more such feature.
The coupler provided by the embodiment of the application can be applied to terminal equipment such as mobile phones, tablet computers, wearable equipment, vehicle-mounted equipment, augmented reality (augmented reality, AR)/Virtual Reality (VR) equipment, notebook computers, ultra-mobile personal computer (UMPC), netbooks, personal digital assistants (personal DIGITAL ASSISTANT, PDA) and the like, and can be particularly applied to radio frequency front-end modules of the terminal equipment, and the embodiment of the application does not limit the specific types of the terminal equipment.
Fig. 1 is a schematic structural diagram of an exemplary terminal device 100 according to an embodiment of the present application. The terminal device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (universal serial bus, USB) interface 130, a charge management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, keys 190, a motor 191, an indicator 192, a camera 193, a display 194, and a subscriber identity module (subscriber identification module, SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyro sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.
It is to be understood that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the terminal device 100. In other embodiments of the application, terminal device 100 may include more or less components than illustrated, or certain components may be combined, or certain components may be split, or different arrangements of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.
The processor 110 may include one or more processing units, such as: the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor (IMAGE SIGNAL processor, ISP), a controller, a memory, a video codec, a digital signal processor (DIGITAL SIGNAL processor, DSP), a baseband processor, and/or a neural Network Processor (NPU), etc. Wherein the different processing units may be separate devices or may be integrated in one or more processors.
The controller may be a neural center and a command center of the terminal device 100. The controller can generate operation control signals according to the instruction operation codes and the time sequence signals to finish the control of instruction fetching and instruction execution.
A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to reuse the instruction or data, it can be called directly from the memory. Repeated accesses are avoided and the latency of the processor 110 is reduced, thereby improving the efficiency of the system.
In some embodiments, the processor 110 may include one or more interfaces. The interfaces may include an integrated circuit (inter-INTEGRATED CIRCUIT, I2C) interface, an integrated circuit built-in audio (inter-INTEGRATED CIRCUIT SOUND, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous receiver transmitter (universal asynchronous receiver/transmitter, UART) interface, a mobile industry processor interface (mobile industry processor interface, MIPI), a general-purpose input/output (GPIO) interface, a subscriber identity module (subscriber identity module, SIM) interface, and/or a universal serial bus (universal serial bus, USB) interface, among others.
The I2C interface is a bi-directional synchronous serial bus comprising a serial data line (SERIAL DATA LINE, SDA) and a serial clock line (derail clock line, SCL). In some embodiments, the processor 110 may contain multiple sets of I2C buses. The processor 110 may be coupled to the touch sensor 180K, charger, flash, camera 193, etc., respectively, through different I2C bus interfaces. For example: the processor 110 may be coupled to the touch sensor 180K through an I2C interface, so that the processor 110 and the touch sensor 180K communicate through an I2C bus interface to implement a touch function of the terminal device 100.
The I2S interface may be used for audio communication. In some embodiments, the processor 110 may contain multiple sets of I2S buses. The processor 110 may be coupled to the audio module 170 via an I2S bus to enable communication between the processor 110 and the audio module 170. In some embodiments, the audio module 170 may transmit an audio signal to the wireless communication module 160 through the I2S interface, to implement a function of answering a call through the bluetooth headset.
PCM interfaces may also be used for audio communication to sample, quantize and encode analog signals. In some embodiments, the audio module 170 and the wireless communication module 160 may be coupled through a PCM bus interface. In some embodiments, the audio module 170 may also transmit audio signals to the wireless communication module 160 through the PCM interface to implement a function of answering a call through the bluetooth headset. Both the I2S interface and the PCM interface may be used for audio communication.
The UART interface is a universal serial data bus for asynchronous communications. The bus may be a bi-directional communication bus. It converts the data to be transmitted between serial communication and parallel communication. In some embodiments, a UART interface is typically used to connect the processor 110 with the wireless communication module 160. For example: the processor 110 communicates with a bluetooth module in the wireless communication module 160 through a UART interface to implement a bluetooth function. In some embodiments, the audio module 170 may transmit an audio signal to the wireless communication module 160 through a UART interface, to implement a function of playing music through a bluetooth headset.
The MIPI interface may be used to connect the processor 110 to peripheral devices such as a display 194, a camera 193, and the like. The MIPI interfaces include camera serial interfaces (CAMERA SERIAL INTERFACE, CSI), display serial interfaces (DISPLAY SERIAL INTERFACE, DSI), and the like. In some embodiments, processor 110 and camera 193 communicate through a CSI interface to implement the photographing function of terminal device 100. The processor 110 and the display 194 communicate via a DSI interface to implement the display function of the terminal device 100.
The GPIO interface may be configured by software. The GPIO interface may be configured as a control signal or as a data signal. In some embodiments, a GPIO interface may be used to connect the processor 110 with the camera 193, the display 194, the wireless communication module 160, the audio module 170, the sensor module 180, and the like. The GPIO interface may also be configured as an I2C interface, an I2S interface, a UART interface, an MIPI interface, etc.
The USB interface 130 is an interface conforming to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, or the like. The USB interface 130 may be used to connect a charger to charge the terminal device 100, or may be used to transfer data between the terminal device 100 and a peripheral device. And can also be used for connecting with a headset, and playing audio through the headset. The interface may also be used to connect other terminal devices, such as AR devices, etc.
It should be understood that the interfacing relationship between the modules illustrated in the embodiment of the present application is only illustrative, and does not constitute a structural limitation of the terminal device 100. In other embodiments of the present application, the terminal device 100 may also use different interfacing manners, or a combination of multiple interfacing manners in the foregoing embodiments.
The charge management module 140 is configured to receive a charge input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charge management module 140 may receive a charging input of a wired charger through the USB interface 130. In some wireless charging embodiments, the charge management module 140 may receive wireless charging input through a wireless charging coil of the terminal device 100. The charging management module 140 may also supply power to the terminal device through the power management module 141 while charging the battery 142.
The power management module 141 is used for connecting the battery 142, and the charge management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and/or the charge management module 140 and provides power to the processor 110, the internal memory 121, the external memory, the display 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 may also be configured to monitor battery capacity, battery cycle number, battery health (leakage, impedance) and other parameters. In other embodiments, the power management module 141 may also be provided in the processor 110. In other embodiments, the power management module 141 and the charge management module 140 may be disposed in the same device.
The wireless communication function of the terminal device 100 can be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, a modem processor, a baseband processor, and the like.
The antennas 1 and 2 are used for transmitting and receiving electromagnetic wave signals. The structures of the antennas 1 and 2 in fig. 1 are only one example. Each antenna in the terminal device 100 may be used to cover a single or multiple communication bands. Different antennas may also be multiplexed to improve the utilization of the antennas. For example: the antenna 1 may be multiplexed into a diversity antenna of a wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.
The mobile communication module 150 may provide a solution including 2G/3G/4G/5G wireless communication applied to the terminal device 100. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (low noise amplifier, LNA), etc. The mobile communication module 150 may receive electromagnetic waves from the antenna 1, perform processes such as filtering, amplifying, and the like on the received electromagnetic waves, and transmit the processed electromagnetic waves to the modem processor for demodulation. The mobile communication module 150 can amplify the signal modulated by the modem processor, and convert the signal into electromagnetic waves through the antenna 1 to radiate. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be provided in the same device as at least some of the modules of the processor 110.
The modem processor may include a modulator and a demodulator. The modulator is used for modulating the low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used for demodulating the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then transferred to the application processor. The application processor outputs sound signals through an audio device (not limited to the speaker 170A, the receiver 170B, etc.), or displays images or video through the display screen 194. In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be provided in the same device as the mobile communication module 150 or other functional module, independent of the processor 110.
The wireless communication module 160 may provide solutions for wireless communication including wireless local area network (wireless local area networks, WLAN) (e.g., wireless fidelity (WIRELESS FIDELITY, wi-Fi) network), bluetooth (BT), global navigation satellite system (global navigation SATELLITE SYSTEM, GNSS), frequency modulation (frequency modulation, FM), near field communication (NEAR FIELD communication, NFC), infrared (IR), etc., applied on the terminal device 100. The wireless communication module 160 may be one or more devices that integrate at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, modulates the electromagnetic wave signals, filters the electromagnetic wave signals, and transmits the processed signals to the processor 110. The wireless communication module 160 may also receive a signal to be transmitted from the processor 110, frequency modulate it, amplify it, and convert it to electromagnetic waves for radiation via the antenna 2.
In some embodiments, antenna 1 and mobile communication module 150 of terminal device 100 are coupled, and antenna 2 and wireless communication module 160 are coupled, such that terminal device 100 may communicate with a network and other devices via wireless communication techniques. The wireless communication techniques can include the Global System for Mobile communications (global system for mobile communications, GSM), general packet radio service (GENERAL PACKET radio service, GPRS), code division multiple access (code division multiple access, CDMA), wideband code division multiple access (wideband code division multiple access, WCDMA), time division code division multiple access (time-division code division multiple access, TD-SCDMA), long term evolution (long term evolution, LTE), BT, GNSS, WLAN, NFC, FM, and/or IR techniques, among others. The GNSS may include a global satellite positioning system (global positioning system, GPS), a global navigation satellite system (global navigation SATELLITE SYSTEM, GLONASS), a beidou satellite navigation system (beidou navigation SATELLITE SYSTEM, BDS), a quasi zenith satellite system (quasi-zenith SATELLITE SYSTEM, QZSS) and/or a satellite based augmentation system (SATELLITE BASED AUGMENTATION SYSTEMS, SBAS).
The terminal device 100 implements display functions through a GPU, a display screen 194, an application processor, and the like. The GPU is a microprocessor for image processing, and is connected to the display 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or change display information.
The display screen 194 is used to display images, videos, and the like. The display 194 includes a display panel. The display panel may employ a Liquid Crystal Display (LCD) CRYSTAL DISPLAY, an organic light-emitting diode (OLED), an active-matrix organic LIGHT EMITTING diode (AMOLED), a flexible light-emitting diode (FLED), miniled, microLed, micro-oLed, a quantum dot LIGHT EMITTING diode (QLED), or the like. In some embodiments, the terminal device 100 may include 1 or N display screens 194, N being a positive integer greater than 1.
The terminal device 100 may implement a photographing function through an ISP, a camera 193, a video codec, a GPU, a display screen 194, an application processor, and the like.
The ISP is used to process data fed back by the camera 193. For example, when photographing, the shutter is opened, light is transmitted to the camera photosensitive element through the lens, the optical signal is converted into an electric signal, and the camera photosensitive element transmits the electric signal to the ISP for processing and is converted into an image visible to naked eyes. ISP can also optimize the noise, brightness and skin color of the image. The ISP can also optimize parameters such as exposure, color temperature and the like of a shooting scene. In some embodiments, the ISP may be provided in the camera 193.
The camera 193 is used to capture still images or video. The object generates an optical image through the lens and projects the optical image onto the photosensitive element. The photosensitive element may be a charge coupled device (charge coupled device, CCD) or a Complementary Metal Oxide Semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, which is then transferred to the ISP to be converted into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV, or the like format. In some embodiments, the terminal device 100 may include 1 or N cameras 193, N being a positive integer greater than 1.
The digital signal processor is used for processing digital signals, and can process other digital signals besides digital image signals. For example, when the terminal device 100 selects a frequency bin, the digital signal processor is used to fourier transform the frequency bin energy, or the like.
Video codecs are used to compress or decompress digital video. The terminal device 100 may support one or more video codecs. In this way, the terminal device 100 can play or record video in various encoding formats, for example: dynamic picture experts group (moving picture experts group, MPEG) 1, MPEG2, MPEG3, MPEG4, etc.
The NPU is a neural-network (NN) computing processor, and can rapidly process input information by referencing a biological neural network structure, for example, referencing a transmission mode between human brain neurons, and can also continuously perform self-learning. Applications such as intelligent awareness of the terminal device 100 may be implemented by the NPU, for example: image recognition, face recognition, speech recognition, text understanding, etc.
The external memory interface 120 may be used to connect an external memory card, such as a Micro SD card, to realize expansion of the memory capability of the terminal device 100. The external memory card communicates with the processor 110 through an external memory interface 120 to implement data storage functions. For example, files such as music, video, etc. are stored in an external memory card.
The internal memory 121 may be used to store computer executable program code including instructions. The processor 110 executes various functional applications of the terminal device 100 and data processing by executing instructions stored in the internal memory 121. The internal memory 121 may include a storage program area and a storage data area. The storage program area may store an application program (such as a sound playing function, an image playing function, etc.) required for at least one function of the operating system, etc. The storage data area may store data (such as audio data, phonebook, etc.) created during use of the terminal device 100, and the like. In addition, the internal memory 121 may include a high-speed random access memory, and may further include a nonvolatile memory such as at least one magnetic disk storage device, a flash memory device, a universal flash memory (universal flash storage, UFS), and the like.
The terminal device 100 may implement audio functions through an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, an application processor, and the like. Such as music playing, recording, etc.
The audio module 170 is used to convert digital audio information into an analog audio signal output and also to convert an analog audio input into a digital audio signal. The audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be disposed in the processor 110, or a portion of the functional modules of the audio module 170 may be disposed in the processor 110.
The speaker 170A, also referred to as a "horn," is used to convert audio electrical signals into sound signals. The terminal device 100 can listen to music or to handsfree talk through the speaker 170A.
A receiver 170B, also referred to as a "earpiece", is used to convert the audio electrical signal into a sound signal. When the terminal device 100 receives a call or voice message, it is possible to receive voice by approaching the receiver 170B to the human ear.
Microphone 170C, also referred to as a "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or transmitting voice information, the user can sound near the microphone 170C through the mouth, inputting a sound signal to the microphone 170C. The terminal device 100 may be provided with at least one microphone 170C. In other embodiments, the terminal device 100 may be provided with two microphones 170C, and may implement a noise reduction function in addition to collecting sound signals. In other embodiments, the terminal device 100 may be further provided with three, four or more microphones 170C to collect sound signals, reduce noise, identify the source of sound, implement directional recording functions, etc.
The earphone interface 170D is used to connect a wired earphone. The earphone interface 170D may be a USB interface 130 or a 3.5mm open mobile terminal platform (open mobile terminal platform, OMTP) standard interface, a american cellular telecommunications industry association (cellular telecommunications industry association of the USA, CTIA) standard interface.
The pressure sensor 180A is used to sense a pressure signal, and may convert the pressure signal into an electrical signal. In some embodiments, the pressure sensor 180A may be disposed on the display screen 194. The pressure sensor 180A is of various types, such as a resistive pressure sensor, an inductive pressure sensor, a capacitive pressure sensor, and the like. The capacitive pressure sensor may be a capacitive pressure sensor comprising at least two parallel plates with conductive material. The capacitance between the electrodes changes when a force is applied to the pressure sensor 180A. The terminal device 100 determines the intensity of the pressure according to the change of the capacitance. When a touch operation is applied to the display 194, the terminal device 100 detects the intensity of the touch operation according to the pressure sensor 180A. The terminal device 100 may also calculate the position of the touch from the detection signal of the pressure sensor 180A. In some embodiments, touch operations that act on the same touch location, but at different touch operation strengths, may correspond to different operation instructions. For example: and executing an instruction for checking the short message when the touch operation with the touch operation intensity smaller than the first pressure threshold acts on the short message application icon. And executing an instruction for newly creating the short message when the touch operation with the touch operation intensity being greater than or equal to the first pressure threshold acts on the short message application icon.
The gyro sensor 180B may be used to determine a motion gesture of the terminal device 100. In some embodiments, the angular velocity of the terminal device 100 about three axes (i.e., x, y, and z axes) may be determined by the gyro sensor 180B. The gyro sensor 180B may be used for photographing anti-shake. Illustratively, when the shutter is pressed, the gyro sensor 180B detects the angle of the shake of the terminal device 100, calculates the distance to be compensated by the lens module according to the angle, and allows the lens to counteract the shake of the terminal device 100 by the reverse motion, thereby realizing anti-shake. The gyro sensor 180B may also be used for navigating, somatosensory game scenes.
The air pressure sensor 180C is used to measure air pressure. In some embodiments, the terminal device 100 calculates altitude from barometric pressure values measured by the barometric pressure sensor 180C, aiding in positioning and navigation.
The magnetic sensor 180D includes a hall sensor. The terminal device 100 can detect the opening and closing of the flip cover using the magnetic sensor 180D. In some embodiments, when the terminal device 100 is a folder, the terminal device 100 may detect opening and closing of the folder according to the magnetic sensor 180D. And then according to the detected opening and closing state of the leather sheath or the opening and closing state of the flip, the characteristics of automatic unlocking of the flip and the like are set.
The acceleration sensor 180E can detect the magnitude of acceleration of the terminal device 100 in various directions (typically three axes). The magnitude and direction of gravity may be detected when the terminal device 100 is stationary. The method can also be used for identifying the gesture of the terminal equipment, and is applied to the applications such as horizontal and vertical screen switching, pedometers and the like.
A distance sensor 180F for measuring a distance. The terminal device 100 may measure the distance by infrared or laser. In some embodiments, the terminal device 100 may range using the distance sensor 180F to achieve fast focusing.
The proximity light sensor 180G may include, for example, a Light Emitting Diode (LED) and a light detector, such as a photodiode. The light emitting diode may be an infrared light emitting diode. The terminal device 100 emits infrared light outward through the light emitting diode. The terminal device 100 detects infrared reflected light from a nearby object using a photodiode. When sufficient reflected light is detected, it can be determined that there is an object in the vicinity of the terminal device 100. When insufficient reflected light is detected, the terminal device 100 may determine that there is no object in the vicinity of the terminal device 100. The terminal device 100 can detect that the user holds the terminal device 100 close to the ear to talk by using the proximity light sensor 180G, so as to automatically extinguish the screen for the purpose of saving power. The proximity light sensor 180G may also be used in holster mode, pocket mode to automatically unlock and lock the screen.
The ambient light sensor 180L is used to sense ambient light level. The terminal device 100 may adaptively adjust the brightness of the display 194 based on the perceived ambient light level. The ambient light sensor 180L may also be used to automatically adjust white balance when taking a photograph. The ambient light sensor 180L may also cooperate with the proximity light sensor 180G to detect whether the terminal device 100 is in a pocket to prevent false touches.
The fingerprint sensor 180H is used to collect a fingerprint. The terminal device 100 can utilize the collected fingerprint characteristics to realize fingerprint unlocking, access an application lock, fingerprint photographing, fingerprint incoming call answering and the like.
The temperature sensor 180J is for detecting temperature. In some embodiments, the terminal device 100 performs a temperature processing strategy using the temperature detected by the temperature sensor 180J. For example, when the temperature reported by the temperature sensor 180J exceeds a threshold, the terminal device 100 performs a reduction in the performance of a processor located near the temperature sensor 180J in order to reduce power consumption to implement thermal protection. In other embodiments, when the temperature is below another threshold, the terminal device 100 heats the battery 142 to avoid the low temperature causing the terminal device 100 to shut down abnormally. In other embodiments, when the temperature is below a further threshold, the terminal device 100 performs boosting of the output voltage of the battery 142 to avoid abnormal shutdown caused by low temperatures.
The touch sensor 180K, also referred to as a "touch panel". The touch sensor 180K may be disposed on the display screen 194, and the touch sensor 180K and the display screen 194 form a touch screen, which is also called a "touch screen". The touch sensor 180K is for detecting a touch operation acting thereon or thereabout. The touch sensor may communicate the detected touch operation to the application processor to determine the touch event type. Visual output related to touch operations may be provided through the display 194. In other embodiments, the touch sensor 180K may also be disposed on the surface of the terminal device 100 at a different location than the display 194.
The bone conduction sensor 180M may acquire a vibration signal. In some embodiments, bone conduction sensor 180M may acquire a vibration signal of a human vocal tract vibrating bone pieces. The bone conduction sensor 180M may also contact the pulse of the human body to receive the blood pressure pulsation signal. In some embodiments, bone conduction sensor 180M may also be provided in a headset, in combination with an osteoinductive headset. The audio module 170 may analyze the voice signal based on the vibration signal of the sound portion vibration bone block obtained by the bone conduction sensor 180M, so as to implement a voice function. The application processor may analyze the heart rate information based on the blood pressure beat signal acquired by the bone conduction sensor 180M, so as to implement a heart rate detection function.
The keys 190 include a power-on key, a volume key, etc. The keys 190 may be mechanical keys. Or may be a touch key. The terminal device 100 may receive key inputs, generating key signal inputs related to user settings and function controls of the terminal device 100.
The motor 191 may generate a vibration cue. The motor 191 may be used for incoming call vibration alerting as well as for touch vibration feedback. For example, touch operations acting on different applications (e.g., photographing, audio playing, etc.) may correspond to different vibration feedback effects. The motor 191 may also correspond to different vibration feedback effects by touching different areas of the display screen 194. Different application scenarios (such as time reminding, receiving information, alarm clock, game, etc.) can also correspond to different vibration feedback effects. The touch vibration feedback effect may also support customization.
The indicator 192 may be an indicator light, may be used to indicate a state of charge, a change in charge, a message indicating a missed call, a notification, etc.
The SIM card interface 195 is used to connect a SIM card. The SIM card may be contacted and separated from the terminal apparatus 100 by being inserted into the SIM card interface 195 or by being withdrawn from the SIM card interface 195. The terminal device 100 may support 1 or N SIM card interfaces, N being a positive integer greater than 1. The SIM card interface 195 may support Nano SIM cards, micro SIM cards, and the like. The same SIM card interface 195 may be used to insert multiple cards simultaneously. The types of the plurality of cards may be the same or different. The SIM card interface 195 may also be compatible with different types of SIM cards. The SIM card interface 195 may also be compatible with external memory cards. The terminal device 100 interacts with the network through the SIM card to realize functions such as call and data communication. In some embodiments, the terminal device 100 employs esims, namely: an embedded SIM card. The eSIM card can be embedded in the terminal device 100 and cannot be separated from the terminal device 100.
The software system of the terminal device 100 may employ a layered architecture, an event driven architecture, a micro-core architecture, a micro-service architecture, or a cloud architecture. In the embodiment of the application, taking an Android system with a layered architecture as an example, a software structure of the terminal device 100 is illustrated.
Fig. 2 is a simplified schematic structural diagram of the rf front-end module in the terminal device 100, which is intended to illustrate the position and use of the coupler in the rf front-end module. When the transmitting signal is output from the radio frequency chip (not shown in fig. 2), the transmitting signal enters a Power Amplifier (PA) of the radio frequency front end module, the PA amplifies the transmitting signal under the impedance tuning action of the matching network, then filters the stray signal through a filter on the transmitting path, then enters an antenna switch through a coupler, and finally is switched to an antenna for radiation through the antenna switch. In the receiving state, the antenna receives a receiving signal, the receiving signal enters a receiving passage through the switching of an antenna switch, spurious signals carried by the receiving signal are filtered by a filter on the receiving passage, the spurious signals enter a low noise amplifier (low noise amplifier, LNA) for amplification, and the amplified receiving signal enters a radio frequency chip for processing. The coupler comprises an input end, an output end, a coupling end and an isolation end. The input end is used for inputting radio frequency signals, and the output end is used for outputting radio frequency signals. The coupling end can input the coupled signal to the detection circuit for detection, and is used for detecting whether the transmitting path is intact. Of course, the application scenario of the coupler shown in fig. 2 is an example, and the coupler may be used in other scenarios where signals need to be coupled, and the coupled signals may be used for power detection, antenna tuning, and so on.
Along with the rapid development of terminal equipment, the integration level of components is higher and higher, and the volume requirement on each component is also higher and higher. Besides meeting the performance requirements, the components need to be miniaturized as much as possible to adapt to the development of terminal equipment. In the embodiment shown in fig. 2, the volume of the coupler also directly affects the volume of the rf front-end module, thereby affecting the layout of the rf front-end module in the whole machine. Common types of couplers are integrated couplers, such as low temperature co-fired ceramic (low temperature co-FIRED CERAMIC, LTCC)) couplers, and also microstrip couplers. The common coupler occupies a large area, which is not beneficial to layout.
Fig. 3 shows a schematic structure of a conventional microstrip coupler, in which energy coupling is achieved through a slot in two microstrip lines that are close to each other. The a-diagram in fig. 3 is a perspective view of the microstrip coupler from the top, from which it can be seen that the two microstrip lines are interleaved. As can be seen from the b-diagram in fig. 3, the two microstrip lines are located in different layers, so that they are not directly connected, and energy coupling can be performed through a slot in the two microstrip lines.
In order to clearly understand the technical scheme of the application, the working principle and indexes of the coupler are described in detail by combining the structure of the coupler.
As shown in a diagram a of fig. 4, the coupler includes four ports, input (port 1), output (port 2), coupled (port 3) and isolated (port 4). The equivalent schematic of the coupler can be seen from figure 4, b. As shown in fig. 4, the signal is input from port 1, most of the signal (embodied as currents I 1 and I 2) is transmitted along the main transmission line (transmission line of port 1-port 2) to port 2; a small portion of the signal (embodied as currents I c1 and I c2) is coupled through the slot to the secondary transmission line (port 3-port 4 transmission line). Coupling may include electric field coupling, which is equivalent to capacitive coupling, and magnetic field coupling, which is equivalent to inductive coupling. Currents I c1 and I c2, which are capacitively coupled to the secondary transmission line, are transmitted to ports 3 and 4, respectively. The current I l inductively coupled to the secondary transmission line can only be transmitted to port 3. The two currents I c1 and I c2 are added in the same direction at the port 3, and can output signals outwards to form a coupling end; the two currents I c1 and I c2 are subtracted in opposite directions at port 4. When port 4 is grounded through the matched impedance, the two currents I c1 and I c2 cancel at port 4, so that port 4 has no output, forming an isolated terminal.
In general, the performance index of a coupler can be described in terms of coupling, isolation, directivity, path loss, and return loss. The method comprises the following steps:
1. degree of coupling: the ratio of the input power P1 of port 1to the output power P3 of port 3 is the coupling degree C, expressed as:
Wherein S 31 is the transmission coefficient of port 1 to port 3.
2. Isolation degree: the ratio of the input power P1 of port 1to the output power P4 of port 4 is isolation I, expressed as:
Wherein S 41 is the transmission coefficient of port 1 to port 4.
3. Directionality: the ratio of the output power P3 of port 3 to the output power P4 of port 4 is directivity D, expressed as:
Wherein S 31 is the transmission coefficient of port 1 to port 3, and S 41 is the transmission coefficient of port 1 to port 4.
4. Path loss: the transmission coefficient from port 2 to port 1 is the path loss (IL), also known as insertion loss or insertion loss, denoted as S 12:
5. Return loss: the reflection coefficient of port 1 is the return loss, denoted as S 11.
During the use of the coupler, it is desirable that the via loss be as small as possible, the isolation be as large as possible, and the directivity be as large as possible. The coupling degree can be adjusted according to the requirement, the too large coupling degree can cause the large insertion loss of the passage of the coupler, and the too small coupling degree can cause the small output coupling signal, so that the sensitivity of the detection circuit is not high during detection. Typically, the coupling degree of the coupler used in the terminal device may be between-25 dB and 30 dB.
The indexes of the coupler are introduced above, and the structure and implementation principle of the coupler provided by the embodiment of the application will be described in detail below with reference to the accompanying drawings.
Fig. 5 is a schematic diagram of a coupler according to an embodiment of the present application, including: dielectric plate 510, main transmission line 520, and coupled inductor 530. The main transmission line 520 and the coupled inductor 530 are both disposed against the dielectric plate 510. The coupled inductor 530 may be soldered to the surface of the dielectric plate 510, or glued to the surface of the dielectric plate 510 using a conductive material. The main transmission line 520 may be crimped on the dielectric plate 510 or bonded on the dielectric plate 510, which is not limited to the embodiment of the present application. The dielectric plate 510 may be a circuit substrate made of dielectric material, which is used to provide physical support for a circuit, and the dielectric material used for the dielectric plate 510 is not limited in the embodiment of the present application.
The coupled inductor 530 includes a first electrode 531 and a second electrode 532 disposed at both ends. In general, the first electrode 531 and the second electrode 532 may also be welding sites of the coupled inductor 530. The coupled inductor 530 may be a patch inductor, and the coupled inductor 530 may be a patch inductor of 0201 package (2 mm×1mm package), or a patch inductor of 01005 package (1 mm×0.5 mm package), which is not limited in this embodiment of the present application. A coil 533 is further provided inside the coupling inductor 530, and the first electrode 531 and the second electrode 532 are connected through the coil 533. Fig. 6 is a perspective view illustrating a structure of a coupling inductor 530 according to an embodiment of the present application. As shown in fig. 6, the coupled inductor 530 includes a coil 533, and a non-magnetic ceramic 534 is filled around the coil 533. The coupled inductor 530 further includes a first electrode 531 and a second electrode 532 connected across the coil 533. Wherein the first electrode 531 is connected to a coupling end of the coupler for outputting a coupling signal coupled to from the main transmission line 520. A second electrode 532 of the coupled inductor 530 is connected to one end of an isolation resistor 540, and the other end of the isolation resistor 540 is connected to ground. Alternatively, the isolation resistor 540 may be a 50 ohm chip resistor.
The main transmission line 520 includes an input 521, a coupling 522, and an output 523. The two ends of the coupling portion 522 are respectively connected to the input portion 521 and the output portion 523, so as to form a complete signal path, which can be used for transmitting radio frequency signals. The coupling part 522 may be disposed near the coupling inductor 530, and electromagnetically coupled to the coil 533 when the radio frequency signal is transmitted on the main transmission line 520, and the coupling part 522 forms a coupling signal by electromagnetic coupling with the coupling inductor 530 and then is output through the coupling terminal.
Based on the coupler shown in fig. 5, the coupling path can be seen in fig. 7. When the coupling inductor 530 and the coupling part 522 are close to a distance, electric field coupling and magnetic field coupling are generated. Wherein the magnetic field coupling may be equivalently inductive coupling, and the schematic diagram of the magnetic inductance line of the magnetic field coupling may be shown in fig. 7a, where the circuit between the coupling portion 522 and the coil 533 is equivalently inductive, and the magnetic inductance line of the magnetic field generated in the coil 533 by the radio frequency signal transmitted on the coupling portion 522 passes through the coil 533, and a current is generated in the coil 533 due to the magnetic field coupling. The electric field coupling may be equivalent to capacitive coupling, and the electric field coupling schematic diagram may be referred to as b diagram in fig. 7, and the circuit between the coupling portion 522 and the coil 533 may be equivalent to capacitance. The radio frequency signal transmitted on the coupling 522 generates a current in the coil 533 of the coupling inductor 530 due to electric field coupling.
It should be noted that, the coupling degree may be changed by adjusting the inductance value of the coupling inductor 530, and the larger the inductance value is, the larger the magnetic flux in the coil 533 is, the larger the coupling degree is; the smaller the inductance value, the smaller the magnetic flux in the coil 533, the smaller the degree of coupling. The coupling degree can also be adjusted by changing the distance between the coupling part 522 and the coupling inductor 530, and the larger the distance is, the weaker the electric field coupling is, and the smaller the coupling degree is; the smaller the spacing, the stronger the electric field coupling and the greater the degree of coupling. The coupling degree can also be changed by changing the line width of the coupling part 522, and the wider the line width is, the stronger the electric field coupling is, and the larger the coupling degree is; the narrower the line width, the weaker the electric field coupling, and the smaller the coupling degree. The coupling degree can also be changed by changing the length of the coupling portion 522, and the longer the coupling portion 522 is, the greater the coupling degree is; the shorter the coupling portion 522 is, the smaller the degree of coupling is. FIG. 8 a is a schematic diagram of magnetic inductance lines of magnetic field coupling after decreasing the inductance value of the coupled inductor 530, and broken lines indicate the weakening of the magnetic field coupling; fig. 8 b is a schematic diagram of electric field coupling after the linewidth of the coupling portion 522 is reduced, and the capacitance indicated by the broken line indicates that the electric field coupling is reduced. Both the weakening of the electric field coupling and the weakening of the magnetic field coupling can result in a decrease in the degree of coupling. In the case of adjusting the magnetic field coupling and the electric field coupling strength, the index of optimization can be realized not by adjusting the magnetic field coupling and the electric field coupling strength in a single aspect. For example, increasing the inductance increases the magnetic field coupling strength, but after increasing the magnetic field coupling strength by a certain amount, the electric field coupling and the magnetic field coupling are unbalanced, resulting in a deterioration of the directivity of the coupler. Therefore, in the debugging process of the coupler, the electric field coupling and the magnetic field coupling are required to be simultaneously used for debugging, so that good directivity can be obtained.
Based on this, in the embodiment shown in fig. 5, by generating electromagnetic coupling (including electric field coupling and such field coupling) between the coupling portion 522 and the coil 533 of the coupling inductor 530, a coupling signal is formed at the coupling end, and compared with a microstrip line coupler of the same size, the electromagnetic coupling generated by the coil 533 in the coupling inductor 530 of the embodiment has larger coupling energy than that of the microstrip line slot coupling, so that the coupler shown in fig. 5 has smaller size based on the same size, and has a simple structure and easy processing.
In order to more clearly describe the structure of the embodiments of the present application, the structure of the coupler is shown below in a top perspective view of the coupler.
Alternatively, the coupling portion 522 may have a variety of different shapes. For example, may be a straight transmission line, i.e., main transmission line 520 may be a straight transmission line. As shown in fig. 9, fig. 9 is a schematic diagram of a coupler in which the coupling portion 522 is in a straight shape. Fig. 9 a is a schematic diagram of parallel arrangement of the coupled inductor 530 and the main transmission line 520, and fig. 9 b is a schematic diagram of perpendicular arrangement of the coupled inductor 530 and the main transmission line 520. The direction of the coupled inductor 530 may be defined as the direction in which the first electrode 531 points to the second electrode 532. In the structure shown in fig. 9, the coupling ends may be provided in the left-right direction or in the up-down direction, and the isolation ends may be provided in the left-right direction or in the up-down direction, and the orientations of the isolation ends and the coupling ends are not limited in this embodiment as long as connection can be achieved and no collision is caused during layout. The upper, lower, left and right in this embodiment can be referred to as indication in fig. 9. It should be noted that, the direction of the coupling inductor 530 may be parallel to the direction in which the input terminal points to the output terminal, that is, the arrangement shown in a diagram of fig. 9; the direction perpendicular to the direction in which the input end points to the output end, that is, the arrangement mode shown in the b diagram in fig. 9, or the arrangement mode may be obliquely arranged, that is, in a state between parallel and perpendicular, which is not limited by the embodiment of the present application. In this structure, when the main transmission line 520 transmits the rf signal, the rf signal flow coupling portion 522 generates electromagnetic coupling with the coil 533 in the coupling inductor 530 to form a coupling signal. The strength of electromagnetic coupling generated by the coil 533 in the coupling inductor 530 of the present embodiment is greater than that of the slot coupling using the microstrip line, and thus the size of the coupler is smaller based on the same size. And the transmission line of a straight shape has simple structure, small insertion loss and easy processing.
Alternatively, the coupling part 522 may be a bent transmission line. For example, referring to fig. 10, the coupling portion 522 is a transmission line with a curved arc shape, the curvature and shape of the arc are not limited in this embodiment, and the coupling inductor 530 may be located in a concave direction of the arc as shown in fig. 10a and b. The degree to which the coupling inductor 530 is in the arc of the arc is not limited in this embodiment, as long as the coupling inductor can couple the energy output coupling signal. The direction of the coupled inductor 530 may be parallel to the direction in which the input ends are directed to the output ends, i.e., the arrangement shown in a diagram in fig. 10; or the direction perpendicular to the direction of the input end pointing to the output end, namely the arrangement mode shown in the b diagram in fig. 10; and may be disposed obliquely, i.e., in a state intermediate between parallel and vertical, which is not limited in the embodiment of the present application. In this structure, when the main transmission line 520 transmits the rf signal, the rf signal flow coupling portion 522 generates electromagnetic coupling with the coil 533 in the coupling inductor 530 to form a coupling signal. In some embodiments, the isolated terminal may also be connected to the second electrode 532 through an inner layer trace and a metallized via, facilitating layout of the coupler. In this embodiment, since the coupling inductor 530 and the coupling portion 522 are formed such that the coupling portion 522 is formed in a larger size, the energy of electromagnetic coupling generated by the coil 533 in the coupling inductor 530 is larger, and thus the coupling degree is larger. The curved coupling portion 522 may be configured to match impedance in a wide band range by a curved shape and a curved size, and to adjust the uniformity of the index of the coupler in the wide band range.
In some embodiments, the degree of curvature of the curve may also be increased, i.e., the degree of curvature of the curve may be increased, and the coupled inductor 530 may be located deeper within the degree of curvature of the curved coupling portion 522, as shown, for example, in fig. 11. The deeper the coupling inductor 530 is located at the curved coupling portion 522, and the longer the coupling size of the coupling portion 522, the stronger the electromagnetic induction, and the coupling degree of the coupler can be improved. The direction of the coupled inductor 530 may be parallel to the direction in which the input terminal points to the output terminal, i.e., the arrangement shown in a diagram in fig. 11; or the direction perpendicular to the direction of the input end pointing to the output end, namely the arrangement mode shown in the b diagram in fig. 11; and may be disposed obliquely, i.e., in a state intermediate between parallel and vertical, which is not limited in the embodiment of the present application.
Alternatively, the coupling 522 may be a U-shaped transmission line. For example, referring to the shape shown in fig. 12, the coupling inductor 530 may be located inside the U-shaped transmission line or most of the coupling inductor 530 may be located inside the U-shaped transmission line as shown in fig. 12, a and b. The direction of the coupled inductor 530 may be parallel to the direction in which the input points to the output, i.e. the arrangement shown in figure 12 a; or the direction perpendicular to the direction of the input end pointing to the output end, namely the arrangement mode shown in the b diagram in fig. 12; and may be disposed obliquely, i.e., in a state intermediate between parallel and vertical, which is not limited in the embodiment of the present application. In this structure, when the main transmission line 520 transmits the rf signal, the coupling portion 522 is electromagnetically coupled to the coil 533 of the coupling inductor 530 to form a coupled signal. In some embodiments, the isolated terminal may also be connected to the second electrode 532 by an inner layer trace and a metallized via, facilitating layout of the coupler. In this embodiment, since the coupling inductor 530 and the coupling portion 522 generate a further increase in the size of the coupling portion 522, the energy of the electromagnetic coupling generated by the coil 533 in the coupling inductor 530 is larger, and thus the coupling degree is larger.
Alternatively, the coupling portion 522 may be a concave transmission line, i.e. a rectangle with one end open, for example, see the shape shown in fig. 13. The coupling inductor 530 may be located inside the concave transmission line or most of the coupling inductor 530 is located inside the U-shaped transmission line as shown in fig. 13 a and b. The direction of the coupled inductor 530 may be parallel to the direction in which the input points to the output, i.e. the arrangement shown in figure 13 a; or the direction perpendicular to the direction of the input end pointing to the output end, namely the arrangement mode shown in the b diagram in fig. 13; and may be disposed obliquely, i.e., in a state intermediate between parallel and vertical, which is not limited in the embodiment of the present application. In this configuration, when the main transmission line 520 transmits a radio frequency signal, electromagnetic coupling is generated with the coil 533 in the coupling inductor 530, forming a coupled signal. In some embodiments, the isolated terminal may also be connected to the second electrode 532 by an inner layer trace and a metallized via, facilitating layout of the coupler. In this embodiment, since the coupling inductor 530 and the coupling portion 522 generate a further increase in the size of the coupling portion 522, the energy of the electromagnetic coupling generated by the coil 533 in the coupling inductor 530 is larger, and thus the coupling degree is larger.
Alternatively, the coupling portion 522 may be a wavy transmission line, for example, see the shape shown in fig. 14, and the coupling inductor 530 may be located inside the concave region of the wavy transmission line or most of the coupling inductor 530 may be located inside the concave region, as shown in fig. 14 a and b. The direction of the coupled inductor 530 may be parallel to the direction in which the input points to the output, i.e., the arrangement shown in a-diagram in fig. 14; or the direction perpendicular to the direction of the input end pointing to the output end, namely the arrangement mode shown in the b diagram in fig. 14; and may be disposed obliquely, i.e., in a state intermediate between parallel and vertical, which is not limited in the embodiment of the present application. In this structure, when the main transmission line 520 transmits the rf signal, the coupling portion 522 is electromagnetically coupled to the coil 533 of the coupling inductor 530 to form a coupled signal. In some embodiments, the isolated terminal may also be connected to the second electrode 532 by an inner layer trace and a metallized via, facilitating layout of the coupler. In this embodiment, the wavy coupling portion 522 may further increase the size of the coupling portion 522 generated by the coupling inductor 530 and the coupling portion 522, and the electromagnetic coupling energy generated by the coil 533 in the coupling inductor 530 is greater, so that the coupling degree may be greater within a limited size.
On the basis of the above embodiment, impedance tuning in a wide band range can be performed by adjusting the size and the curved shape of the curved coupling portion 522, so that impedance matching in a wide band can be realized for ensuring the uniformity of the index of the coupler in the wide band range.
The coupling portions 522 in the above embodiments are all in the form of traces on the surface layer, and in some embodiments, the coupling portions 522 may also be located on the inner layer of the dielectric plate 510, that is, in the form of inner layer traces. Alternatively, the coupling portion 522 and the input portion 521, the output portion 523 may be connected by a metallized via. Fig. 15 is a schematic diagram of the coupling portion 522 based on fig. 13 as an inner trace. Fig. 16 is a schematic diagram of the coupling portion 522 based on fig. 14 as an inner trace. The implementation mode can reduce the distribution of the wires on the surface layer and reduce the risk of the damage of the wires on the surface layer. Alternatively, in fig. 15 and 16, the wiring connecting the isolation resistor 540 and the second electrode 532 at the isolation end may be a surface layer or an inner layer. When the inner layer is moved, the coupling portion 522 is not located in the same layer, so long as collision does not occur, and the embodiment of the present application is not limited thereto.
It should be noted that, the manner in which the coupling portion 522 is located in the inner layer of the dielectric plate 510 may also be applied to the foregoing embodiments of the coupling portion 522 with other shapes, so as to achieve the principle and technical effects described in the embodiments of fig. 15 and 16, which are not repeated herein.
The coupled inductor 530 may be a miniaturized surface mount inductor. For application in the rf band, the coupling inductor 530 may be an inductor of about 3nH, for example, 2.7nH, 3.3nH, etc. The inductance of the inductor may be adjusted according to the frequency, the dielectric constant of the dielectric plate 510, and the like. When the coupling portion 522 is disposed around the coupling inductor 530, the distance from the coupling inductor 530 is generally less than 0.1 mm, for example, 0.05 mm or 0.06 mm. FIG. 17 is a graph of S-parameters simulated in an embodiment of the application, wherein the coupling is 29-41dB and the isolation is below-45 dB in the frequency range of 0.7-3 GHz. In this embodiment, the directivity is 15dB. The insertion loss (S12) curve can be seen in fig. 18, with insertion loss less than 0.1dB. Therefore, the index of the coupler of the embodiment of the application meets the use condition.
The above embodiment shows the case where the projection of the coupling part 522 on the first surface where the area of the dielectric plate 510 is the largest and the projection of the coupling inductor 530 on the first surface do not intersect. The first surface may be the surface of dielectric plate 510 for surface-mount coupled inductor 530, or other surface parallel to that surface. Alternatively, the projection of the coupling portion 522 on the first surface where the area of the dielectric plate 510 is largest may also intersect the projection of the coupling inductor 530 on the first surface. That is, the coupling portion 522 passes from below the coupling inductor 530 (below here is the direction in which the dielectric plate 510 is located in the coupling inductor 530). Based on the embodiment shown in fig. 13, the coupling 522 is seen from below the coupling inductor 530 in a perspective view through the top of the inner layer as shown in fig. 19.
In the above embodiment, the patch directions of the coupling inductors 530 are all angles between the opening direction of the coil 533 and the first surface of the dielectric plate 510 with the largest area, and the angle difference between the angles and ninety degrees is smaller than the preset angle threshold, that is, the opening direction of the coil 533 is close to vertical or perpendicular to the first surface, so that the coupling portion 522 and the coil 533 can be electromagnetically coupled, and a coupling signal is output.
In addition to the embodiment of fig. 19, the coupling portion 522 may be disposed so as to pass through the surface layer from below the coupling inductor 530 (from below in the direction in which the dielectric plate 510 is located in the coupling inductor), as long as it does not interfere with the bonding pads of the first electrode 531, the second electrode 532, and the isolation resistor 540. The implementation of the coupling portion 522 that may be disposed by a surface layer and pass through the lower portion of the coupling inductor 530 (the lower portion herein is the direction in which the dielectric plate 510 is located in the coupling inductor) is not limited to the shape of the coupling portion 522 shown in fig. 19, but may be other shapes in the foregoing embodiments, which will not be described herein.
When the coupling portion 522 passes from below the coupling inductor 530 (below here, the direction in which the dielectric plate 510 is located in the coupling inductor), that is, in the case where the projection of the coupling portion 522 on the first surface where the area of the dielectric plate 510 is largest and the projection of the coupling inductor 530 on the first surface intersect, this way, in the condition of having the multilayer board wiring, the area of the coupler can be further reduced.
When the coupling portion 522 passes below the coupling inductor 530 (herein, below, the dielectric plate 510 is located in the direction of the coupling inductor), the coupling inductor 530 may also change the direction, and the coupling inductor 530 is adjusted such that the opening direction of the coil 533 and the dielectric plate 510 are approximately parallel or parallel, that is, the angle between the opening direction of the coil 533 and the first surface with the largest area of the dielectric plate 510 is smaller than the preset angle threshold, taking the embodiment shown in fig. 19 as an example. It should be noted that, the predetermined angle threshold may be a small angle, for example, 5 degrees, 10 degrees, etc., so long as the angle is within the range of the angle difference, that is, the opening direction of the coil 533 and the dielectric plate 510 are nearly parallel or parallel, that is, the coupling portion 522 and the coil 533 are not affected by electromagnetic coupling, and the coupling portion 522 located below the coupling inductor 530 and the coil 533 may generate electromagnetic coupling to form a coupling signal, as shown in fig. 20. The technical effects of this method may be described with reference to the embodiment of fig. 9, and will not be described here again.
Alternatively, on the basis of the embodiment shown in fig. 20 described above, it is also possible to select the coupling inductors 530 in which the opening directions of the coils 533 are different. As in the coupled inductor 530 shown in fig. 21, the opening direction of the coil 533 in fig. 21 is changed from a direction approximately perpendicular or perpendicular to the coupled inductor (i.e., a direction in which the first electrode 531 points toward the second electrode 532) shown in fig. 20 to a direction approximately parallel or parallel to the coupled inductor 530. In selecting such a coupling inductor 533 shown in fig. 21, the routing of the coupling portion 522 may be from below the coupling inductor 530 as shown in fig. 21, and the routing direction of the coupling portion 522 may be changed from a direction approximately parallel to or parallel to the coupling inductor 530 as shown in fig. 20 to a direction approximately perpendicular to or perpendicular to the coupling inductor 530. The direction of the coupled inductor is that the first electrode points to the second electrode. In this embodiment, the trace of the coupling 522 may trace the inner layer. The technical effects of this method may also be described with reference to the embodiment of fig. 9, and will not be described here again. The included angle between the opening direction of the nearly flat coil 533 and the first surface of the dielectric plate 510 having the largest area is smaller than the predetermined angle threshold; the angle between the opening direction of the nearly vertical coil 533 and the first surface of the dielectric plate 510 having the largest area is less than a predetermined angle threshold. The description of the preset angle threshold may be referred to the previous embodiments, and will not be repeated here.
Fig. 20 and 21 show the structures of the portions different from the other embodiments, and the portions identical to the other embodiments are not shown, and reference may be made to the description of the foregoing embodiments and the drawings.
The application also provides a radio frequency front end module, which comprises any coupler in the following embodiments:
The coupler includes: dielectric plate 510, main transmission line 520, and coupled inductor 530; a main transmission line 520 and a coupled inductor 530 are disposed on the dielectric plate 510; a first electrode 531 of the coupling inductor 530 is connected to the coupling terminal; a second electrode 532 of the coupled inductor 530 is connected to ground through an isolation resistor 540; the first electrode 531 and the second electrode 532 are connected through a coil 533 inside the coupling inductor 530; the main transmission line 520 includes an input portion 521, a coupling portion 522, and an output portion 523; both ends of the coupling portion 522 are connected to the input portion 521 and the output portion 523, respectively; a coupling portion 522 for generating electromagnetic coupling with the coil 533 when transmitting the radio frequency signal.
Alternatively, the coupling 522 is an in-line transmission line.
Optionally, coupling 522 is a curved transmission line.
Optionally, the coupling 522 is a U-shaped transmission line.
Alternatively, the coupling 522 is a transmission line in a concave shape.
Optionally, the coupling 522 is a wavy transmission line.
Optionally, the direction in which the first electrode 531 points to the second electrode 532 is parallel to the direction in which the input end points to the output end.
Alternatively, the direction in which the first electrode 531 points to the second electrode 532 and the direction in which the input end points to the output end are perpendicular.
Alternatively, the input portion 521, the output portion 523, and the coupling portion 522 are all located on the surface layer of the dielectric sheet 510.
Alternatively, the input portion 521 and the output portion 523 are located on the surface layer of the dielectric plate 510; the coupling portion 522 is located at an inner layer of the dielectric plate 510, and the coupling portion 522 and the input portion 521 and the output portion 523 are connected by way of metallized vias.
Alternatively, the projection of the coupling portion 522 on the first surface where the area of the dielectric plate 510 is largest does not intersect with the projection of the coupling inductor 530 on the first surface.
Alternatively, the projection of the coupling portion 522 on the first surface where the area of the dielectric plate 510 is largest intersects with the projection of the coupling inductor 530 on the first surface.
Optionally, an angle between the opening direction of the coil 533 and the first surface of the dielectric plate 510 having the largest area is smaller than a preset angle threshold.
Optionally, the angle between the opening direction of the coil 533 and the first surface of the dielectric plate 510 with the largest area is smaller than a preset angle threshold.
The application also provides a terminal device, which comprises any coupler in the following embodiments:
The coupler includes: dielectric plate 510, main transmission line 520, and coupled inductor 530; a main transmission line 520 and a coupled inductor 530 are disposed on the dielectric plate 510; a first electrode 531 of the coupling inductor 530 is connected to the coupling terminal; a second electrode 532 of the coupled inductor 530 is connected to ground through an isolation resistor 540; the first electrode 531 and the second electrode 532 are connected through a coil 533 inside the coupling inductor 530; the main transmission line 520 includes an input portion 521, a coupling portion 522, and an output portion 523; both ends of the coupling portion 522 are connected to the input portion 521 and the output portion 523, respectively; a coupling portion 522 for generating electromagnetic coupling with the coil 533 when transmitting the radio frequency signal.
Alternatively, the coupling 522 is an in-line transmission line.
Optionally, coupling 522 is a curved transmission line.
Optionally, the coupling 522 is a U-shaped transmission line.
Alternatively, the coupling 522 is a transmission line in a concave shape.
Optionally, the coupling 522 is a wavy transmission line.
Optionally, the direction in which the first electrode 531 points to the second electrode 532 is parallel to the direction in which the input end points to the output end.
Alternatively, the direction in which the first electrode 531 points to the second electrode 532 and the direction in which the input end points to the output end are perpendicular.
Alternatively, the input portion 521, the output portion 523, and the coupling portion 522 are all located on the surface layer of the dielectric sheet 510.
Alternatively, the input portion 521 and the output portion 523 are located on the surface layer of the dielectric plate 510; the coupling portion 522 is located at an inner layer of the dielectric plate 510, and the coupling portion 522 and the input portion 521 and the output portion 523 are connected by way of metallized vias.
Alternatively, the projection of the coupling portion 522 on the first surface where the area of the dielectric plate 510 is largest does not intersect with the projection of the coupling inductor 530 on the first surface.
Alternatively, the projection of the coupling portion 522 on the first surface where the area of the dielectric plate 510 is largest intersects with the projection of the coupling inductor 530 on the first surface.
Optionally, an angle between the opening direction of the coil 533 and the first surface of the dielectric plate 510 having the largest area is smaller than a preset angle threshold.
Optionally, the angle between the opening direction of the coil 533 and the first surface of the dielectric plate 510 with the largest area is smaller than a preset angle threshold.
The application also provides a terminal device comprising any radio frequency front end module as described in the above embodiment.
Examples of couplers provided by the present application are described in detail above. It can be understood that, in order to implement the above functions, the corresponding terminal device rf front-end module and the terminal device include corresponding hardware structures for executing each function. The principle and the beneficial effects of the implementation of the radio frequency front end module and the terminal device can be referred to the description of the embodiments of the display device, and are not repeated here.
In the several embodiments provided in the present application, it should be understood that the disclosed structure may be implemented in other manners. For example, the structural embodiments described above are merely illustrative, e.g., the division of modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another apparatus, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and the parts shown as units may be one physical unit or a plurality of physical units, may be located in one place, or may be distributed in a plurality of different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (16)
1. A coupler, comprising: a dielectric plate, a main transmission line and a coupling inductor;
The main transmission line and the coupling inductor are arranged on the dielectric plate;
A first electrode of the coupling inductor is connected with a coupling end;
the second electrode of the coupling inductor is connected with the ground reference through an isolation resistor;
the first electrode and the second electrode are connected through a coil inside the coupling inductor;
the main transmission line comprises an input part, a coupling part and an output part;
Two ends of the coupling part are respectively connected with the input part and the output part;
the coupling part is used for generating electromagnetic coupling with the coil when transmitting radio frequency signals.
2. The coupler of claim 1, wherein the coupling portion is a line-shaped transmission line.
3. The coupler of claim 1, wherein the coupling portion is a curved transmission line.
4. A coupler according to claim 3, wherein the coupling portion is a U-shaped transmission line.
5. A coupler according to claim 3, wherein the coupling portion is a transmission line in the shape of a letter.
6. A coupler according to claim 3, wherein the coupling portion is a wave-shaped transmission line.
7. The coupler according to any one of claims 1 to 6, wherein the direction in which the first electrode points to the second electrode and the direction in which the input end points to the output end are parallel.
8. The coupler according to any one of claims 1 to 6, wherein the direction in which the first electrode points to the second electrode and the direction in which the input end points to the output end are perpendicular.
9. The coupler of any one of claims 1 to 8, wherein the input portion, the output portion, and the coupling portion are all located on a surface layer of the dielectric plate.
10. The coupler according to any one of claims 1 to 8, wherein the input and output portions are located on a surface layer of the dielectric plate;
The coupling part is positioned at the inner layer of the dielectric plate, and the coupling part is connected with the input part and the output part through a metallized via hole.
11. The coupler of any one of claims 1 to 10, wherein the projection of the coupling portion onto the first surface of the dielectric plate having the largest area does not intersect with the projection of the coupling inductor onto the first surface.
12. The coupler according to any one of claims 1 to 10, wherein the projection of the coupling portion onto the first surface of the dielectric plate having the largest area intersects the projection of the coupling inductor onto the first surface.
13. The coupler of claim 12, wherein an angle between an opening direction of the coil and a first surface of the dielectric plate having a largest area is less than a preset angle threshold.
14. The coupler according to any one of claims 1 to 12, wherein an angle between an opening direction of the coil and a first surface of the dielectric plate having a largest area is less than a preset angle threshold from ninety degrees.
15. A radio frequency front end module comprising a coupler as claimed in any one of claims 1 to 14.
16. A terminal device comprising a coupler according to any one of claims 1 to 14; or comprises a radio frequency front end module as claimed in claim 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211521954.8A CN118116693A (en) | 2022-11-30 | 2022-11-30 | Coupler, radio frequency front end module and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211521954.8A CN118116693A (en) | 2022-11-30 | 2022-11-30 | Coupler, radio frequency front end module and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118116693A true CN118116693A (en) | 2024-05-31 |
Family
ID=91219772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211521954.8A Pending CN118116693A (en) | 2022-11-30 | 2022-11-30 | Coupler, radio frequency front end module and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118116693A (en) |
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2022
- 2022-11-30 CN CN202211521954.8A patent/CN118116693A/en active Pending
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