CN118111377A - Solder paste detection threshold adjustment method, device and storage medium - Google Patents
Solder paste detection threshold adjustment method, device and storage medium Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 622
- 238000001514 detection method Methods 0.000 title claims abstract description 548
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000003860 storage Methods 0.000 title claims abstract description 34
- 238000009826 distribution Methods 0.000 claims abstract description 82
- 230000002950 deficient Effects 0.000 claims abstract description 45
- 238000007689 inspection Methods 0.000 claims description 15
- 238000004590 computer program Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 238000007476 Maximum Likelihood Methods 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/28—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring areas
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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Abstract
The embodiment of the invention provides a method, equipment and a storage medium for adjusting a solder paste detection threshold, and belongs to the technical field of industrial big data. The method comprises the following steps: acquiring solder paste detection data, wherein the solder paste detection data is generated when solder paste detection is carried out on a plurality of electronic products based on a current solder paste detection threshold value, and the solder paste detection data comprises solder paste detection values of the electronic products, defective rates of the plurality of electronic products and solder paste detection error rates; generating solder paste detection value distribution information of a plurality of electronic products according to solder paste detection values of the electronic products; determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate; and adjusting the current solder paste detection threshold according to the target solder paste detection value range. According to the scheme, the target solder paste detection value range for detecting the solder paste of the electronic product can be accurately obtained, the current solder paste detection threshold value is adjusted based on the target solder paste detection value range, and the accuracy of solder paste detection is greatly improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of industrial big data, in particular to a method, equipment and a storage medium for adjusting a solder paste detection threshold.
Background
In surface mounting technology (Surface Mounted Technology, SMT) commonly applied to electronic product manufacturing, the process includes procedures such as solder paste printing, solder paste detection (Solder Paste Inspection, SPI), chip mounting, reflow soldering, automatic optical inspection (Automated Optical Inspection, AOI) detection, etc., while solder paste printing is used as the first procedure of the SMT process flow, since the printing process is affected by various uncertain process parameters (such as doctor blade, printing speed, steel mesh, aperture ratio, area ratio, etc.), and there is a great relationship between parameter setting and professional knowledge and experience of operators, the SPI is a key link of quality control in the printing process, and can measure characteristic quantities such as solder paste thickness, solder paste area, solder paste volume and offset, etc., and detect defects such as multi-tin, few tin, solder paste bridging, etc. If the defects occur on the solder paste on the PCB, the PCB needs to be cleaned, and the solder paste is printed again, so that the production efficiency is greatly influenced. The amount of solder paste has a great relationship with defects such as cold solder joint and tin connection. Through carrying out reasonable optimization to SPI threshold value, monitor the state of solder paste on the PCB circuit board betterly, to the timely reworking of unusual solder paste point, can greatly reduce the cost of reprocessing, improved the qualification rate of PCB circuit board. Therefore, how to efficiently and accurately adjust the SPI threshold and improve the accuracy of solder paste detection is a problem to be solved.
Disclosure of Invention
The embodiment of the invention provides a method, equipment and a storage medium for adjusting a solder paste detection threshold, aiming at improving the efficiency and accuracy of SPI threshold adjustment.
In a first aspect, an embodiment of the present invention provides a method for adjusting a solder paste detection threshold, including:
Acquiring solder paste detection data, wherein the solder paste detection data is generated when a plurality of electronic products are subjected to solder paste detection based on a current solder paste detection threshold value, and the solder paste detection data comprises solder paste detection values of the electronic products, defective rates of the plurality of electronic products and solder paste detection error rates;
Generating solder paste detection value distribution information of the plurality of electronic products according to the solder paste detection values of the electronic products;
Determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate;
And adjusting the current solder paste detection threshold according to the target solder paste detection value range.
In a second aspect, embodiments of the present invention further provide a computer device, the computer device including a processor, a memory, a computer program stored on the memory and executable by the processor, and a data bus for enabling a connection communication between the processor and the memory, wherein the computer program, when executed by the processor, implements the steps of any of the solder paste detection threshold adjustment methods as provided in the present specification.
In a third aspect, an embodiment of the present invention further provides a storage medium, for storing a computer readable storage, where the storage medium stores one or more programs, where the one or more programs are executable by one or more processors to implement the steps of any solder paste detection threshold adjustment method as provided in the specification of the present invention.
The embodiment of the invention provides a method, equipment and a storage medium for adjusting a solder paste detection threshold, which are used for acquiring solder paste detection data, wherein the solder paste detection data are generated when a plurality of electronic products are subjected to solder paste detection based on the current solder paste detection threshold, and the solder paste detection data comprise solder paste detection values of the electronic products, defective rates of the plurality of electronic products and solder paste detection error rates; then according to the solder paste detection values of the electronic products, the solder paste detection value distribution information of a plurality of electronic products can be accurately generated; then determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate; and adjusting the current solder paste detection threshold according to the target solder paste detection value range. According to the scheme, the solder paste detection value can be dynamically analyzed in real time, so that the target solder paste detection value range for detecting the solder paste of the electronic product can be accurately obtained, the current solder paste detection threshold value is adjusted based on the target solder paste detection value range, the defect of accidental batches of the electronic product can be effectively prevented, and the accuracy of solder paste detection is greatly improved.
Drawings
Fig. 1 is a schematic flow chart of a method for adjusting a solder paste detection threshold according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a scenario of solder paste on a PCB according to an embodiment of the present invention;
Fig. 3 is a schematic view of a scenario of a method for adjusting a solder paste detection threshold according to an embodiment of the present invention;
FIG. 4 is a histogram of solder paste detection values and the number of solder paste detection values according to an embodiment of the present invention;
FIG. 5 is a flow chart illustrating sub-steps of the solder paste detection threshold adjustment method of FIG. 1;
FIG. 6 is another histogram of solder paste detection values and the number of solder paste detection values according to the embodiment of the invention;
FIG. 7 is a flowchart illustrating another sub-step of the solder paste detection threshold adjustment method of FIG. 1;
FIG. 8 is a probability chart of solder paste detection values and the number of solder paste detection values according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of determining solder paste detection adjustment values from a probability map according to an embodiment of the present invention;
fig. 10 is a schematic block diagram of a computer device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The flow diagrams depicted in the figures are merely illustrative and not necessarily all of the elements and operations/steps are included or performed in the order described. For example, some operations/steps may be further divided, combined, or partially combined, so that the order of actual execution may be changed according to actual situations.
It is to be understood that the terminology used in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The embodiment of the invention provides a method, equipment and storage medium for adjusting a solder paste detection threshold. The solder paste detection threshold adjustment method can be applied to computer equipment, and the computer equipment can be electronic equipment such as a desktop computer, a notebook computer, a tablet computer, a mobile phone, a personal digital assistant and the like.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for adjusting a solder paste detection threshold according to an embodiment of the invention.
As shown in fig. 1, the solder paste detection threshold adjustment method includes steps S101 to S104.
Step S101, obtaining solder paste detection data, wherein the solder paste detection data are generated when solder paste detection is carried out on a plurality of electronic products based on a current solder paste detection threshold, and the solder paste detection data comprise solder paste detection values of the electronic products, defective rates of the plurality of electronic products and solder paste detection error rates.
The electronic product is a product for performing a surface mounting process, and the electronic product can be determined according to practical situations, which is not particularly limited in the embodiment of the invention, and for example, the electronic product can be a series of products needing to be soldered by printing solder paste, such as a printed circuit board (Printed circuit boards, PCB), an active antenna unit, a chip, an LED and the like. The solder paste detection value at least includes at least one of solder paste printing area, solder paste printing height, solder paste printing volume and solder paste printing offset distance, although the solder paste detection item may also have other detection items, which is not particularly limited in the embodiment of the present invention. It should be noted that, in the solder paste inspection of electronic products, the solder paste printing area at the same position in each electronic product is inspected, for example, as shown in fig. 2, there are solder paste 1, solder paste 2, solder paste 3, solder paste 4, solder paste 5 and solder paste 6 on the PCB in fig. 2, and when the object of the solder paste inspection is to inspect the solder paste 4, the solder paste 4 on each electronic product is inspected.
It should be noted that, the current solder paste detection threshold is a detection range value set based on a solder paste printing model, for example, the current solder paste detection threshold is 40% -250%, and the area of the solder paste printing model is 0.01 square centimeter, so that the current solder paste detection range is 0.004 square centimeter-0.025 square centimeter, and other detection items are also determined based on the solder paste printing model and the solder paste detection threshold.
It should be noted that, as shown in fig. 3, the production inspection apparatus 200 for inspecting solder paste during the production process of the electronic product includes a solder paste inspection apparatus 210, a solder joint appearance inspection apparatus 220, an X-ray inspection apparatus 230, and a board performance inspection apparatus 240, where the solder paste inspection apparatus 210 is used for inspecting at least one of a solder paste print area, a solder paste print height, a solder paste print volume, and a solder paste print offset distance, the solder joint appearance inspection apparatus 220 is used for inspecting the appearance of the solder paste, the X-ray inspection apparatus 230 is used for inspecting the solder paste inside the solder paste, and the board performance inspection apparatus 240 is used for inspecting whether the performance of the electronic product is normal. The solder paste detection device 210, the solder joint appearance detection device 220, the X-ray detection device 230 and the single board performance detection device 240 upload the data collected by each to the storage device 300 for storage, the storage device 300 obtains detection data packets based on a preset sampling rule, the extracted detection data packets are sent to the computer device 400, and the computer device 400 adjusts the solder paste detection threshold according to the detection data packets. Or at least one of the solder joint appearance detecting device 220, the X-ray detecting device 230 and the board performance detecting device 240 detects that the defective rate of the electronic product exceeds a preset threshold, the computer device 400 obtains a detection data packet from the storage device 300, and adjusts the solder paste detection threshold according to the obtained detection data packet. The storage device 300 may be configured according to practical situations, and the embodiment of the present invention is not limited thereto, for example, the storage device 300 is a hard disk, and of course, the storage device 300 may be a memory built in the computer device 400. The preset sampling rule may be set according to practical situations, which is not limited in the embodiment of the present invention, for example, sampling is performed at preset intervals.
The defective rate is a ratio of the number of defective products to the number of total electronic products in the solder paste detection, the solder paste detection error rate comprises a solder paste detection erroneous judgment rate and a solder paste detection omission rate, the solder paste detection erroneous judgment rate is a ratio of the number of defective products to the number of total electronic products in the solder paste detection, and the solder paste detection omission rate is a ratio of the number of defective products to the number of total electronic products in the solder paste detection. For example, the total number of electronic products is 1000, and the misjudgment rate is 2/1000=0.2% when the number of genuine electronic products is misjudged as 2 inferior products; and if the number of the defective electronic products is 5, the missing judgment rate is 5/1000=0.5%.
In an embodiment, a current solder paste detection threshold is obtained, and solder paste detection is performed on a plurality of electronic products based on the current solder paste detection threshold to obtain solder paste detection data, wherein the solder paste detection data comprises solder paste detection values of the electronic products, defective rates of the electronic products and solder paste detection error rates. Based on the current solder paste detection threshold value, solder paste detection is carried out on a plurality of electronic products, defective electronic products can be accurately known, and quality control of the electronic products can be improved.
Step S102, generating solder paste detection value distribution information of the plurality of electronic products according to the solder paste detection values of the electronic products.
The solder paste detection value distribution information is obtained by carrying out solder paste detection on a plurality of electronic products to obtain solder paste detection values and dividing the solder paste detection values.
In an embodiment, according to the solder paste detection value of each electronic product and the number of each solder paste detection value, constructing a histogram of the solder paste detection value and the number of each solder paste detection value; and acquiring solder paste detection value distribution data from the histogram to obtain solder paste detection value distribution information of a plurality of electronic products. Based on the solder paste detection values of the electronic products and the number of the solder paste detection values, a histogram of the solder paste detection values and the number of the solder paste detection values is constructed, and the distribution information of the solder paste detection values can be accurately obtained from the histogram.
The method includes the steps of performing solder paste detection on a plurality of electronic products to obtain solder paste detection values of the electronic products, accumulating the number of the solder paste detection values by taking a numerical value corresponding to the solder paste detection values of the electronic products as an abscissa, and establishing a histogram by taking the accumulated numerical value as an ordinate to obtain a histogram of the solder paste detection values and the number of the solder paste detection values shown in fig. 4. And acquiring solder paste detection value distribution information of a plurality of electronic products from the histogram.
And step S103, determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate.
The target solder paste detection value range is a solder paste detection value of a genuine electronic product in which solder paste detection is performed on each electronic product within an acceptable error range, wherein the acceptable error range can be set according to practical situations, and the embodiment of the invention is not particularly limited.
In one embodiment, as shown in fig. 5, step S103 includes sub-steps S1031 to S1033.
And step S1031, under the condition that the defective rate is zero, acquiring a preset solder paste detection misjudgment rate of the electronic product for solder paste detection, wherein the preset solder paste detection misjudgment rate is an acceptable misjudgment rate set when the electronic product is subjected to solder paste detection.
In an embodiment, the actual defective rate of the plurality of electronic products is obtained, and under the condition that the actual defective rate of the plurality of electronic products is determined to be zero, a preset solder paste detection misjudgment rate of the electronic products for solder paste detection is obtained, wherein the preset solder paste detection misjudgment rate is an acceptable misjudgment rate set when the electronic products are subjected to solder paste detection, the preset solder paste detection misjudgment rate can be set according to actual conditions, and the embodiment of the invention is not particularly limited to this, for example, the preset solder paste detection misjudgment rate can be set to be 5%.
For example, in the case where it is determined that the defective rate of the plurality of electronic products is zero, in the case where the electronic products to be detected are 10 tens of thousands, in order to prevent the situation where the number of misjudged electronic products is excessive, it is necessary to set the preset solder paste detection misjudgment rate as small as possible, and set the preset solder paste detection misjudgment rate to 0.1%. For another example, in the case that the defective rate of the plurality of electronic products is determined to be zero, in the case that the number of electronic products to be detected is 1000, the number of electronic products to be detected is small, the preset solder paste detection misjudgment rate may be set to 5%.
And S1032, determining a solder paste detection adjustment value which meets the solder paste detection misjudgment rate and is smaller than or equal to a preset solder paste detection misjudgment rate according to the solder paste detection value distribution information.
In an embodiment, determining the number of electronic products that can be misjudged according to a preset misjudgment rate of solder paste detection and the number of electronic products that are subjected to solder paste detection based on a current solder paste detection threshold; and determining a solder paste detection value range of the electronic product which can be misjudged according to the solder paste detection value distribution information and the number of the electronic products which can be misjudged, and determining a solder paste detection adjustment value according to the solder paste detection value range. The solder paste detection value range of the electronic product which can be misjudged can be accurately determined through the solder paste detection value distribution information and the number of the electronic products which can be misjudged, and the solder paste detection adjustment value can be accurately obtained through the solder paste detection value range, so that the accuracy and the efficiency of determining the solder paste detection adjustment value are greatly improved.
In an embodiment, according to the solder paste detection value distribution information and the number of electronic products that can be misjudged, the manner of determining the solder paste detection value range of the electronic products that can be misjudged may be: according to the solder paste detection value distribution information, selecting a solder paste detection value range with the largest deviation degree from the solder paste detection value distribution area as an adjustment range, and determining the solder paste detection value range of the electronic product which can be misjudged from the adjustment range according to the number of the electronic products which can be misjudged.
As shown in fig. 4, the range of solder paste detection values with the greatest deviation from the histogram of the number of solder paste detection values is 84 to 108, the range of solder paste detection values 84 to 108 is determined as an adjustment range, the preset misjudgment rate of solder paste detection is 5%, the number of electronic products for solder paste detection with the current solder paste detection threshold is 1000, the number of misjudgment electronic products is 1000×5% =50, 50 solder paste detection values are sequentially selected from the range of solder paste detection values 84 to 108 from small to large, and if 50 solder paste detection values have been selected from the range of solder paste detection values 84 to 100, the solder paste detection adjustment value is 84 to 100.
As shown in fig. 6, for example, if the range of solder paste detection values with the greatest deviation from the histogram of the number of solder paste detection values is 84 to 108 and 180 to 204, the range of solder paste detection values 84 to 108 and 180 to 204 are determined as adjustment ranges, the preset misjudgment rate of solder paste detection is 5%, the number of electronic products for solder paste detection at the current solder paste detection threshold is 1000, the number of misjudged electronic products is 1000×5% =50, the range of solder paste detection values 84 to 108 and the range of solder paste detection values 180 to 204 are the same, for which, 25 solder paste detection values are sequentially selected from the range of solder paste detection values 84 to 108 from the small to the large, and 25 solder paste detection values are sequentially selected from the range of solder paste detection values 180 to 204 from the large to the small, and if 25 solder paste detection values have been selected from the range of solder paste detection values 84 to 95, and 25 solder paste detection values have been selected from the range of solder paste detection values 204 to 190, the range of solder paste detection values is 84 to 95.
It should be noted that, according to the distribution information of the solder paste detection values and the number of electronic products that can be misjudged, the manner of determining the solder paste detection value range of the electronic products that can be misjudged may be selected according to the actual situation, and other situations may be provided besides the selection situations in the above examples, which is not particularly limited in the embodiment of the present invention.
And step S1033, determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste detection adjustment value.
For example, the range of solder paste detection values in the solder paste detection value distribution information is 84 to 180, and the solder paste detection adjustment value is 84 to 100, and the range of the target solder paste detection value is 100 to 180. For another example, if the range of solder paste detection values in the solder paste detection value distribution information is 84 to 204, the solder paste detection adjustment value is 84 to 95 and 190 to 204, the target solder paste detection value range is 95 to 190.
In one embodiment, as shown in fig. 7, step S103 includes sub-steps S1034 to S1035.
And step S1034, under the condition that the defective rate is larger than zero, acquiring the solder paste fault types of defective electronic products in the plurality of electronic products.
The types of solder paste faults can be set according to actual conditions, and the embodiment of the invention is not limited in particular, and for example, the types of solder paste faults can include types of solder paste shortage, solder paste adhesion, solder paste pull tips, solder paste deviation and the like.
In an embodiment, under the condition that the defective rate of the detected electronic products is determined to be greater than zero, detecting each defective electronic product, counting the solder paste fault types of each electronic product, and obtaining the solder paste fault types of the secondary printing batch according to the solder paste fault types of each electronic product. It should be noted that, when printing is performed using the same solder paste printing model, the solder paste fault types are generally the same, and if there are a plurality of solder paste fault types, the type of the most number of times of faults is determined as the solder paste fault type of the defective electronic product.
Substep S1035, determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste fault type and the solder paste detection error rate.
In one embodiment, a probability map of the solder paste detection values and the number of each solder paste detection value is constructed according to the solder paste detection values and the number of each solder paste detection value in the solder paste detection value distribution information; determining a solder paste detection adjustment value from the probability map according to the solder paste fault type and the solder paste detection error rate; and determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste detection adjustment value. The kind of the probability map may be set according to practical situations, which is not limited in the embodiment of the present invention, for example, the probability map may be a parlay map. Through solder paste fault type and solder paste detection error rate, a solder paste detection adjustment value can be accurately determined from the probability map, and a target solder paste detection value range can be accurately obtained according to the solder paste detection adjustment value, so that the determination efficiency and accuracy of the target solder paste detection value range are greatly improved.
For example, the solder paste detection is performed on a plurality of electronic products to obtain solder paste detection values of each electronic product, the number of the solder paste detection values of each electronic product is sequentially accumulated from small to large by taking the value corresponding to the solder paste detection value of each electronic product as an abscissa, and a probability map is established by taking the ratio of the total number of the solder paste detection values to the total number of the solder paste detection values as an ordinate, so as to obtain a probability map of the solder paste detection values and the number of each solder paste detection value as shown in fig. 8.
Illustratively, the manner of determining the solder paste detection adjustment value from the probability map may be according to the solder paste failure type and the solder paste detection error rate: and under the condition that the solder paste fault type is solder paste adhesion, determining that the solder paste of the electronic product is excessive, namely, a solder paste detection value is large, and determining a solder paste detection value interval matched with the solder paste detection error rate from the probability map in a large-to-small mode as a solder paste detection adjustment value. For example, as shown in fig. 9, in the case where the solder paste failure type is solder paste, the solder paste detection error rate is 10%, and a solder paste detection adjustment value is determined by selecting a 10% match of solder paste detection value intervals from large to small in the probability map, that is, solder paste detection value intervals 159.9 to 180 are determined as solder paste detection adjustment values.
Illustratively, the manner of determining the solder paste detection adjustment value from the probability map may be according to the solder paste failure type and the solder paste detection error rate: and under the condition that the solder paste fault type is insufficient solder paste, determining that the solder paste of the electronic product is excessive, namely, a solder paste detection value is smaller, and selecting a solder paste detection value interval matched with the solder paste detection error rate from the probability map in a small-to-large mode to determine the solder paste detection adjustment value.
And step S104, adjusting the current solder paste detection threshold according to the target solder paste detection value range.
Illustratively, the current solder paste detection threshold is 80 to 180, the target solder paste detection value range is 80 to 160, and the current solder paste detection threshold 80 to 180 is adjusted to 80 to 160. The current solder paste detection threshold value is adjusted through the target solder paste detection value range, so that the accuracy of solder paste detection is greatly improved.
In one embodiment, a normal distribution of solder paste detection values is constructed according to the solder paste detection value distribution information and the preset confidence; updating preset confidence coefficient of normal distribution of the solder paste detection values based on a preset interval estimation algorithm, generating a target confidence interval, and determining the target confidence interval as a solder paste detection check value range. The preset interval estimation algorithm may be selected according to practical situations, which is not limited in the embodiment of the present invention, for example, the preset interval estimation algorithm may be chi-square distribution, maximum likelihood value, least square method, bayesian decision, and the like. By means of the solder paste detection value distribution information and the preset confidence, normal solder paste detection value distribution is constructed, and the solder paste detection check value range is determined based on the set interval estimation algorithm, so that the efficiency of determining the solder paste detection check value range is greatly improved.
Exemplary, the variance of the solder paste detection values of the plurality of electronic products obtained from the solder paste detection value distribution information is S 2, the preset interval estimation algorithm is chi-square distribution, the solder paste detection value normal distribution is constructed according to the solder paste detection value distribution information, and the relationship between the solder paste detection value normal distribution and the chi-square distribution is thatN is the number of solder paste detection values, χ 2 is chi-square distribution, and based on the preset confidence coefficient of 1-, the relation between the normal distribution of the solder paste detection values and the chi-square distribution is simplified to obtain/>And is opposite to Solving to obtain a confidence interval of 1-asWill/>And determining a solder paste detection check value range.
In an embodiment, after determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate, determining whether the target solder paste detection value range meets a solder paste detection value range setting requirement; under the condition that the target solder paste detection value range meets the set requirement of the solder paste detection value range, executing the adjustment of the current solder paste detection threshold according to the target solder paste detection value range; and under the condition that the target solder paste detection value range does not meet the set requirement of the solder paste detection value range, re-acquiring solder paste detection data, and re-determining the target solder paste detection value range according to the re-acquired solder paste detection data. By checking the target solder paste detection value range, the accuracy of determining the target solder paste detection range can be improved, so that the accuracy of solder paste detection of electronic products is improved.
In one embodiment, the manner of determining whether the target solder paste detection value range meets the solder paste detection value range setting requirement may be: under the condition that the solder paste detection check value range is larger than or equal to the target solder paste detection value range, determining that the target solder paste detection value range meets the solder paste detection value range setting requirement; and under the condition that the solder paste detection check value range is smaller than the target solder paste detection value range, determining that the target solder paste detection value range does not meet the set requirement of the solder paste detection value range. By comparing the range of the target solder paste detection value determined from the solder paste detection value distribution information with the range of the solder paste detection check value determined by the preset interval estimation algorithm, whether the range of the target solder paste detection value meets the requirements can be accurately determined, and the accuracy of the range of the target solder paste detection value is greatly improved.
According to the method for adjusting the solder paste detection threshold in the embodiment, solder paste detection data are obtained, the solder paste detection data are generated when solder paste detection is carried out on a plurality of electronic products based on the current solder paste detection threshold, and the solder paste detection data comprise solder paste detection values of the electronic products, defective rates of the plurality of electronic products and solder paste detection error rates; then according to the solder paste detection values of the electronic products, the solder paste detection value distribution information of a plurality of electronic products can be accurately generated; then determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate; and adjusting the current solder paste detection threshold according to the target solder paste detection value range. According to the scheme, the solder paste detection value can be dynamically analyzed in real time, so that the target solder paste detection value range for detecting the solder paste of the electronic product can be accurately obtained, the current solder paste detection threshold value is adjusted based on the target solder paste detection value range, the defect of accidental batches of the electronic product can be effectively prevented, and the accuracy of solder paste detection is greatly improved.
Referring to fig. 10, fig. 10 is a schematic block diagram of a computer device according to an embodiment of the present invention.
As shown in FIG. 10, a computer device 500 includes a processor 501 and a memory 502, the processor 501 and the memory 502 being connected by a bus 503, such as an I2C (Inter-INTEGRATED CIRCUIT) bus.
In particular, the processor 501 is used to provide computing and control capabilities to support the operation of the overall computer device. The Processor 501 may be a central processing unit (Central Processing Unit, CPU), the Processor 501 may also be other general purpose processors, digital signal processors (DIGITAL SIGNAL Processor, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), field-Programmable gate array (Field-Programmable GATE ARRAY, FPGA) or other Programmable logic device, discrete gate or transistor logic device, discrete hardware components, etc. Wherein the general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
Specifically, the Memory 502 may be a Flash chip, a Read-Only Memory (ROM) disk, an optical disk, a U-disk, a removable hard disk, or the like.
It will be appreciated by those skilled in the art that the structure shown in FIG. 10 is merely a block diagram of some of the structures associated with the present inventive arrangements and is not limiting of the computer device to which the present inventive arrangements may be applied, and that a particular computer device may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.
The processor is used for running a computer program stored in the memory, and implementing any one of the solder paste detection threshold adjustment methods provided by the embodiment of the invention when the computer program is executed.
In an embodiment, the processor 501 is configured to execute a computer program stored in a memory, and when executing the computer program, implement the following steps:
Acquiring solder paste detection data, wherein the solder paste detection data is generated when a plurality of electronic products are subjected to solder paste detection based on a current solder paste detection threshold value, and the solder paste detection data comprises solder paste detection values of the electronic products, defective rates of the plurality of electronic products and solder paste detection error rates;
Generating solder paste detection value distribution information of the plurality of electronic products according to the solder paste detection values of the electronic products;
Determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate;
And adjusting the current solder paste detection threshold according to the target solder paste detection value range.
In one embodiment, the processor 501 may be configured to implement the solder paste detection error rate to include a solder paste detection error rate; and when determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate, the method is used for realizing:
Under the condition that the defective rate is zero, acquiring a preset solder paste detection misjudgment rate of solder paste detection of the electronic product, wherein the preset solder paste detection misjudgment rate is an acceptable misjudgment rate set when the solder paste detection is carried out on the electronic product;
according to the solder paste detection value distribution information, determining a solder paste detection adjustment value which accords with the solder paste detection misjudgment rate and is smaller than or equal to a preset solder paste detection misjudgment rate;
and determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste detection adjustment value.
In an embodiment, when the processor 501 determines, according to the solder paste detection value distribution information, that the solder paste detection misjudgment rate is less than or equal to the solder paste detection adjustment value of the preset solder paste detection misjudgment rate, the processor is configured to:
determining the number of electronic products which can be misjudged according to the preset misjudgment rate of solder paste detection and the number of electronic products for solder paste detection based on the current solder paste detection threshold;
and determining a solder paste detection value range of the electronic product capable of being misjudged according to the solder paste detection value distribution information and the number of the electronic product capable of being misjudged, and determining the solder paste detection adjustment value according to the solder paste detection value range.
In an embodiment, when implementing the determining, according to the defective rate and the solder paste detection error rate, a target solder paste detection value range from the solder paste detection value distribution information, the processor 501 is configured to implement:
under the condition that the defective rate is larger than zero, obtaining the solder paste fault types of defective electronic products in a plurality of electronic products;
And determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste fault type and the solder paste detection error rate.
In one embodiment, when implementing the determining, according to the solder paste fault type and the solder paste detection error rate, the processor 501 is configured to implement:
constructing a probability map of the solder paste detection values and the number of each solder paste detection value according to the solder paste detection values and the number of each solder paste detection value in the solder paste detection value distribution information;
determining a solder paste detection adjustment value from the probability map according to the solder paste fault type and the solder paste detection error rate;
and determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste detection adjustment value.
In an embodiment, when implementing the generating, by the processor 501, the solder paste detection value distribution information of the plurality of electronic products according to the solder paste detection values of the electronic products, the method is used to implement:
Constructing a histogram of the solder paste detection values and the number of the solder paste detection values according to the solder paste detection values of the electronic products and the number of the solder paste detection values;
and acquiring solder paste detection value distribution data from the histogram to obtain solder paste detection value distribution information of the plurality of electronic products.
In an embodiment, the processor 501 is further configured to implement:
according to the solder paste detection value distribution information and the preset confidence, constructing solder paste detection value normal distribution;
updating the preset confidence coefficient of the normal distribution of the solder paste detection values based on a preset interval estimation algorithm, generating a target confidence interval, and determining the target confidence interval as a target solder paste detection value range.
In an embodiment, after the determining the target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate, the processor 501 is further configured to implement:
Determining whether the target solder paste detection value range meets the solder paste detection value range setting requirement;
Executing adjustment of the current solder paste detection threshold according to the target solder paste detection value range under the condition that the target solder paste detection value range meets the solder paste detection value range setting requirement;
And under the condition that the target solder paste detection value range does not meet the set requirement of the solder paste detection value range, re-acquiring solder paste detection data, and re-determining the target solder paste detection value range according to the re-acquired solder paste detection data.
In one embodiment, when implementing the determining whether the target solder paste detection value range meets a solder paste detection value range setting requirement, the processor 501 is configured to implement:
Determining whether the solder paste detection check value range is greater than or equal to a target solder paste detection value range;
Under the condition that the solder paste detection check value range is larger than or equal to a target solder paste detection value range, determining that the target solder paste detection value range meets the solder paste detection value range setting requirement;
and under the condition that the solder paste detection check value range is smaller than the target solder paste detection value range, determining that the target solder paste detection value range does not meet the solder paste detection value range setting requirement.
It should be noted that, for convenience and brevity of description, a person skilled in the art may clearly understand that, for the specific working process of the above-described computer device, reference may be made to a corresponding process in the foregoing embodiment of the solder paste detection threshold adjustment method, which is not described herein again.
Embodiments of the present invention also provide a storage medium for computer readable storage, where the storage medium stores one or more programs that can be executed by one or more processors to implement the steps of any of the solder paste detection threshold adjustment methods as provided in the present specification.
The storage medium may be an internal storage unit of the computer device according to the foregoing embodiment, for example, a hard disk or a memory of the computer device. The storage medium may also be an external storage device of the computer device, such as a plug-in hard disk provided on the computer device, a smart memory card (SMART MEDIA CARD, SMC), a Secure Digital (SD) card, a flash memory card (FLASH CARD), or the like.
Those of ordinary skill in the art will appreciate that all or some of the steps, systems, functional modules/units in the apparatus, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. In a hardware implementation, the division between the functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed cooperatively by several physical components. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.
It should be understood that the term "and/or" as used in the present specification refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments. While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention.
Claims (11)
1. The solder paste detection threshold adjustment method is characterized by comprising the following steps:
Acquiring solder paste detection data, wherein the solder paste detection data is generated when a plurality of electronic products are subjected to solder paste detection based on a current solder paste detection threshold value, and the solder paste detection data comprises solder paste detection values of the electronic products, defective rates of the plurality of electronic products and solder paste detection error rates;
Generating solder paste detection value distribution information of the plurality of electronic products according to the solder paste detection values of the electronic products;
Determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate;
And adjusting the current solder paste detection threshold according to the target solder paste detection value range.
2. The method according to claim 1, wherein the solder paste detection error rate includes a solder paste detection misjudgment rate; the determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate includes:
Under the condition that the defective rate is zero, acquiring a preset solder paste detection misjudgment rate of solder paste detection of the electronic product, wherein the preset solder paste detection misjudgment rate is an acceptable misjudgment rate set when the solder paste detection is carried out on the electronic product;
according to the solder paste detection value distribution information, determining a solder paste detection adjustment value which accords with the solder paste detection misjudgment rate and is smaller than or equal to a preset solder paste detection misjudgment rate;
and determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste detection adjustment value.
3. The method for adjusting a solder paste detection threshold according to claim 2, wherein determining, according to the solder paste detection value distribution information, a solder paste detection adjustment value that meets a solder paste detection misjudgment rate being less than or equal to a preset solder paste detection misjudgment rate includes:
determining the number of electronic products which can be misjudged according to the preset misjudgment rate of solder paste detection and the number of electronic products for solder paste detection based on the current solder paste detection threshold;
and determining a solder paste detection value range of the electronic product capable of being misjudged according to the solder paste detection value distribution information and the number of the electronic product capable of being misjudged, and determining the solder paste detection adjustment value according to the solder paste detection value range.
4. The method according to claim 1, wherein determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate comprises:
under the condition that the defective rate is larger than zero, obtaining the solder paste fault types of defective electronic products in a plurality of electronic products;
And determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste fault type and the solder paste detection error rate.
5. The method according to claim 4, wherein determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste failure type and the solder paste detection error rate comprises:
constructing a probability map of the solder paste detection values and the number of each solder paste detection value according to the solder paste detection values and the number of each solder paste detection value in the solder paste detection value distribution information;
determining a solder paste detection adjustment value from the probability map according to the solder paste fault type and the solder paste detection error rate;
and determining a target solder paste detection value range from the solder paste detection value distribution information according to the solder paste detection adjustment value.
6. The method of claim 1, wherein generating solder paste detection value distribution information of the plurality of electronic products according to solder paste detection values of the electronic products comprises:
Constructing a histogram of the solder paste detection values and the number of the solder paste detection values according to the solder paste detection values of the electronic products and the number of the solder paste detection values;
and acquiring solder paste detection value distribution data from the histogram to obtain solder paste detection value distribution information of the plurality of electronic products.
7. The solder paste inspection threshold adjustment method according to any one of claims 1 to 6, further comprising:
according to the solder paste detection value distribution information and the preset confidence, constructing solder paste detection value normal distribution;
updating the preset confidence coefficient of the normal distribution of the solder paste detection values based on a preset interval estimation algorithm, generating a target confidence interval, and determining the target confidence interval as a solder paste detection check value range.
8. The method according to claim 7, wherein after determining a target solder paste detection value range from the solder paste detection value distribution information according to the defective rate and the solder paste detection error rate, further comprising:
Determining whether the target solder paste detection value range meets the solder paste detection value range setting requirement;
Executing adjustment of the current solder paste detection threshold according to the target solder paste detection value range under the condition that the target solder paste detection value range meets the solder paste detection value range setting requirement;
And under the condition that the target solder paste detection value range does not meet the set requirement of the solder paste detection value range, re-acquiring solder paste detection data, and re-determining the target solder paste detection value range according to the re-acquired solder paste detection data.
9. The method of claim 8, wherein determining whether the target solder paste detection value range meets a solder paste detection value range setting requirement comprises:
Determining whether the solder paste detection check value range is greater than or equal to a target solder paste detection value range;
Under the condition that the solder paste detection check value range is larger than or equal to a target solder paste detection value range, determining that the target solder paste detection value range meets the solder paste detection value range setting requirement;
and under the condition that the solder paste detection check value range is smaller than the target solder paste detection value range, determining that the target solder paste detection value range does not meet the solder paste detection value range setting requirement.
10. A computer device, characterized in that it comprises a processor, a memory, a computer program stored on the memory and executable by the processor, and a data bus for enabling a connection communication between the processor and the memory, wherein the computer program, when being executed by the processor, implements the steps of the solder paste detection threshold adjustment method according to any of claims 1 to 9.
11. A storage medium for computer-readable storage, characterized in that the storage medium stores one or more programs executable by one or more processors to implement the steps of the solder paste detection threshold adjustment method of any of claims 1 to 9.
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| CN202211482264.6A CN118111377A (en) | 2022-11-24 | 2022-11-24 | Solder paste detection threshold adjustment method, device and storage medium |
| PCT/CN2023/097219 WO2024108956A1 (en) | 2022-11-24 | 2023-05-30 | Solder paste inspection threshold adjustment method, device, and storage medium |
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| LT2840874T (en) * | 2013-08-19 | 2019-10-25 | Asm Assembly Sys Gmbh & Co Kg | Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board |
| KR20170092529A (en) * | 2014-09-09 | 2017-08-11 | 마이크로닉 아베 | Method and device for applying solder paste flux |
| CN106079892B (en) * | 2016-07-12 | 2019-01-25 | 重庆大学 | A kind of PCB paste solder printing procedure quality intelligent monitor system and method |
| KR20190084167A (en) * | 2017-12-21 | 2019-07-16 | 주식회사 고영테크놀러지 | Printed circuit board inspecting apparatus, method for determining fault type of screen printer and computer readable recording medium |
| CN108960306B (en) * | 2018-06-22 | 2022-03-04 | 西安电子科技大学 | Solder paste detection threshold value optimization method based on SMT big data |
| CN111742214B (en) * | 2019-01-22 | 2023-10-20 | 株式会社高迎科技 | Substrate inspection apparatus and defect type determination method for screen printer |
| CN111766253A (en) * | 2019-03-15 | 2020-10-13 | 鸿富锦精密电子（成都）有限公司 | Solder paste printing quality detection method, data processing device, and computer storage medium |
| CN112009079B (en) * | 2019-05-31 | 2022-07-01 | 富联精密电子(天津)有限公司 | PCB printing system and PCB printing method |
| CN110533278B (en) * | 2019-07-15 | 2022-03-22 | 西安电子科技大学 | SMT production line detection threshold setting method based on particle swarm optimization algorithm |
| CN112801328B (en) * | 2019-11-14 | 2023-10-31 | 富联精密电子(天津)有限公司 | Product printing parameter setting device, method and computer readable storage medium |
| CN112434738A (en) * | 2020-11-24 | 2021-03-02 | 英业达(重庆)有限公司 | Decision tree algorithm-based solder paste detection method, system, electronic device and medium |
| CN112419274B (en) * | 2020-11-24 | 2024-04-26 | 英业达(重庆)有限公司 | Solder paste detection method, system, electronic equipment and medium |
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