CN118067282A - Pressure measurement assembly and pressure sensor - Google Patents

Abstract

A relatively high tightness pressure measurement assembly, comprising: the substrate is provided with pressure holes penetrating through the front side and the back side of the thickness direction of the substrate; a pressure sensitive element fixed on one side of the front surface of the substrate and sealing the pressure hole; a processing circuit disposed on the front side of the substrate and electrically connected to the pressure sensitive element; the first sealing cover is connected to one side of the substrate in a sealing way, and a first sealing cavity for accommodating the pressure sensitive element and the processing circuit is formed by the first sealing cover and the substrate in a surrounding way; the second sealing cover is connected to one side of the substrate in a sealing way, and a second sealing cavity for accommodating the first sealing cover is formed by the second sealing cover and the substrate in a surrounding way; and a plurality of relay terminals, one end of the inner side of each relay terminal is electrically connected to the processing circuit, and one end of the outer side of each relay terminal is hermetically penetrated with a via hole arranged on the first sealing cover and the second sealing cover towards the front side.

Description

Pressure measurement assembly and pressure sensor

Technical Field

The application relates to the technical field of sensors, in particular to a pressure measurement assembly and a pressure sensor.

Background

Pressure sensors are sensors for measuring the pressure of an environment or medium, which are currently implemented by MEMS (microelectromechanical systems), i.e. by the piezoresistive effect of semiconductors. The middle part of the silicon core body is provided with a film shape, the pressure applied to the silicon film on two sides changes the resistance value of the doped resistor on the silicon film, and a current or voltage signal output by a measuring circuit formed by connecting a plurality of resistors can be further processed by a conditioning circuit and then the measuring result is output. When a vacuum cavity is arranged on one side of the diaphragm in the silicon chip, the measured pressure is the pressure applied by the other side relative to the vacuum pressure, namely the absolute pressure; when atmospheric pressure is introduced into one side of the diaphragm, the measured pressure is the pressure relative to the atmosphere, namely gauge pressure; when other pressures are respectively introduced to the two sides of the diaphragm, the measured pressure is the difference between the pressures of the two sides, namely the differential pressure. In some other sensors, a temperature sensitive element may also be integrated to measure both the pressure and temperature of the medium.

In the case of an absolute pressure sensor, the internal pressure of a vacuum chamber surrounded by a silicon cap on the other side thereof is not strictly vacuum due to poor sealing property of a bonding process, thus easily causing measurement errors, and in addition, penetration of various process gases (e.g., hydrogen) in a silicon material during fabrication of a silicon wafer may cause zero drift during use. In some known techniques, a portion of the hydrogen is adsorbed by disposing some film-like hydrogen-absorbing material inside the vacuum chamber of the silicon lid. But at low pressures approaching vacuum the effect of the hydrogen absorbing material is still limited.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

Disclosure of Invention

In order to overcome the defects in the prior art, the application provides a pressure measurement assembly and a pressure sensor, so as to improve the tightness of the pressure measurement assembly and particularly improve the vacuum degree of reference vacuum.

In order to achieve the above purpose, the present application provides the following technical solutions: a pressure measurement assembly, comprising:

The substrate is provided with pressure holes penetrating through the front side and the back side of the thickness direction of the substrate;

a pressure sensitive element fixed on one side of the front surface of the substrate and sealing the pressure hole;

a processing circuit disposed on the front side of the substrate and electrically connected to the pressure sensitive element;

the first sealing cover is connected to one side of the substrate in a sealing way, and a first sealing cavity for accommodating the pressure sensitive element and the processing circuit is formed by the first sealing cover and the substrate in a surrounding way;

The second sealing cover is connected to one side of the substrate in a sealing way, and a second sealing cavity for accommodating the first sealing cover is formed by the second sealing cover and the substrate in a surrounding way;

And a plurality of relay terminals, one end of the inner side of each relay terminal is electrically connected to the processing circuit, and one end of the outer side of each relay terminal is hermetically penetrated with a via hole arranged on the first sealing cover and the second sealing cover towards the front side.

Preferably, the circuit further comprises a relay terminal, wherein one end of the relay terminal is electrically connected to the processing circuit; the other end of the relay terminal is provided with a first sealing cover and a second sealing cover in a sealing way towards the front side, or is provided with a substrate in a sealing way towards the back side.

Preferably, the through hole of the first sealing cover extends towards one side of the front surface to form a first enclosing wall, the through hole of the second sealing cover extends towards one side of the back surface to form a second enclosing wall, the second enclosing wall and the first enclosing wall are coaxially sleeved, a gap is reserved between the second enclosing wall and the first enclosing wall, and sintered glass is filled in the gap between the relay terminal and the first enclosing wall and the gap between the second enclosing wall and the first enclosing wall in a sealing way; one end of the inner side of the relay terminal is electrically connected to the processing circuit through an electrical connector.

Preferably, the electrical connector is an elastic member, and an end of the elastic member, which is close to the processing circuit, is electrically connected to the processing circuit by a contact manner.

Preferably, the elastic contact member is a spring or a spring piece, and an end thereof remote from the processing circuit is fixed to an inner end of the relay terminal.

Preferably, the substrate, the first seal cap and the second seal cap are all made of a metal material, and the first seal cap and the second seal cap are welded to the substrate.

Preferably, the substrate is made of a ceramic material, the first sealing cover and the second sealing cover are made of metal materials, and the first sealing cover and the second sealing cover are welded to the two metal plating rings on the substrate in a one-to-one correspondence manner.

Preferably, the substrate is made of a ceramic material, the first and second sealing caps are made of glass, and the first and second sealing caps are welded to the substrate by glass frit.

Preferably, the joint of the first sealing cover and the substrate is covered with sealant, and/or the joint of the second sealing cover and the substrate is covered with sealant.

The application also claims a pressure sensor comprising: the pressure measurement assembly described above; the shell is provided with a pressure guiding channel which is at least communicated with the pressure sensitive element, and the substrate is blocked at one end of the inner side of the pressure guiding channel; and a terminal fixed to the housing, an inner end of which is electrically connected to an outer end of the relay terminal.

Drawings

FIG. 1 is a schematic diagram of a pressure sensor according to a first embodiment of the present application;

FIG. 2 is a schematic diagram of a pressure measurement assembly according to a first embodiment of the present application;

FIG. 3 is a schematic view of a pressure measurement assembly according to a second embodiment of the present application;

FIG. 4 is a schematic diagram of a pressure sensor according to a third embodiment of the present application;

FIG. 5 is a schematic view of a pressure measurement assembly according to a third embodiment of the present application;

reference numerals illustrate: 100. a pressure sensor; 110. a pressure interface; 111. a thin wall portion; 112. edge pressing; 113. sealing grooves; 114. a pressure guiding channel; 11. a first housing; 120. an electrical connector; 121. a step surface; 12. a second housing; 13. a terminal; 140. a pressure sensitive element; 141. a substrate; 142. a circuit board; 143. a first lead; 144. other electronic components; 145. a first seal cap; 146. a second seal cap; 147. a relay terminal; 148a, annular positioning portion; 148. sintering glass; 149. a second electrical connection; 14a, pressure holes; 14b, thickening the flange; 14c, a concave cavity; 14d, a second enclosure wall; 14e, a first enclosure wall; 14. a pressure measurement assembly; 15. a first electrical connection; 19a, a first sealing ring; 19b, a second sealing ring; 19c, a gasket; 200. a pressure sensor; 210. a pressure interface; 214. a pressure guiding channel; 21. a first housing; 220. an electrical connector; 20. a second housing; 23. a terminal; 240. a pressure sensitive element; 241. a substrate; 242. a circuit board; 243. a first lead; 244. other electronic components; 245. a first seal cap; 246. a second seal cap; 247. a relay terminal; 248. sintering glass; 249. a second electrical connection; 24a, pressure holes; 24. a pressure measurement assembly; 25. a first electrical connection; 29a, a first sealing ring; 21a, a first glue groove; 20a, flanges; 21b, a first adhesive sealant; 21d, a second glue groove; 26. a second adhesive sealant; 21c, a third glue groove; 23a, one end; 23b, the other end;

Detailed Description

The technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings. The following examples are illustrative only and are not to be construed as limiting the application. In the following description, the same reference numerals are used to designate the same or equivalent elements, and duplicate descriptions are omitted.

In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships in which the product of the present application is conventionally put in use, or the directions or positional relationships in which those skilled in the art conventionally understand are merely for convenience of describing the present application and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present application.

In addition, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art.

It should be further understood that the term "and/or" as used in the present description and the corresponding claims refers to any and all possible combinations of one or more of the listed items.

Please refer to fig. 1-2 in combination. The pressure measurement assembly 14 of the present embodiment mainly includes a substrate 141, a pressure sensor 140, a processing circuit (not labeled), a first sealing cover 145, and a second sealing cover 146. The substrate 141 is provided with pressure holes 14a penetrating through both sides in the thickness direction (vertical direction in the drawing). The pressure sensitive element 140 is fixed to the pressure sensitive element 140 on the front side of the substrate 141 and seals the pressure hole 14a. The processing circuitry is disposed on the front side of the substrate 141 and is electrically connected to the pressure sensitive element 140. The first sealing cover 145 is hermetically connected to the front side of the substrate 141, and encloses a first sealing cavity with the substrate 141 for accommodating the pressure sensitive element 140 and the processing circuit. The second sealing cover 146 is hermetically connected to the front side of the substrate 141, and encloses a second sealing cavity with the substrate 141 for accommodating the first sealing cover 145. The tightness of the pressure measurement assembly 14 of the present embodiment is high, especially in the case of vacuum in the first and second sealed chambers.

The pressure measurement assembly 14 of the present embodiment may further include a plurality of relay terminals 147 for electrical connection with the outside. The relay terminal 147 has an inner end electrically connected to the processing circuit and an outer end hermetically penetrating through vias (not shown) provided in the first and second sealing caps 145 and 146 toward the front side, thereby electrically connecting the processing circuit in the first sealing cap 145 to the outside.

The processing circuit of the present embodiment may be disposed on a front side of a circuit board 142, and a back side of the circuit board 142 is attached to the front side of the substrate 141. The circuit board 142 may be provided with a notch or window exposing the pressure sensitive element 140 to a side of the underside of the circuit board 142, the pressure sensitive element 140 being electrically connected to the processing circuit by a first lead 143. The processing circuitry may also include other electronic components 144, such as conditioning chips and the like.

In other embodiments, the via hole of the first sealing cap 145 preferably extends toward the front side to form the first enclosure wall 14e. The via hole of the second sealing cap 146 is formed with a second surrounding wall 14d on the opposite side. The second wall 14d and the first wall 14e are coaxially sleeved with a gap therebetween. The gap between the relay terminal 147 and the first surrounding wall 14e, and the gap between the second surrounding wall 14d and the first surrounding wall 14e are filled with sintered glass in a sealing manner. The inner end of the relay terminal 147 is electrically connected to the processing circuit through an electrical connector 149. In this way, a reliable seal can be formed by sintering the glass simultaneously with the first sealing cap 145 and the second sealing cap 146.

The electrical connector 149 is preferably a flexible member, and an end thereof adjacent to the processing circuit is electrically connected to the processing circuit by contact. Further, the elastic contact element 149 is a spring or a spring piece, wherein an end of the spring away from the processing circuit can be welded, sleeved or otherwise fixed to an inner end of the relay terminal 147, and an end of the spring piece away from the processing circuit can be welded, integrally connected or otherwise fixed to an inner end of the relay terminal 147.

Preferably, the substrate 141, the first sealing cap 145 and the second sealing cap 146 are all made of metal materials. The first and second sealing caps 145 and 146 are welded to the substrate 141; or the substrate 141 is made of a ceramic material, the first sealing cover 145 and the second sealing cover 146 are made of metal materials, and the first sealing cover 145 and the second sealing cover 146 are welded to two metal plating rings (which can be attached to the surface of the substrate 141 by a plating technique such as vacuum plating) on the substrate 141 in a one-to-one correspondence manner; or the substrate 141 is made of a ceramic material, the first sealing cap 145 and the second sealing cap 146 are made of glass, and the first sealing cap 145 and the second sealing cap 146 are welded to the substrate 141 by glass frit. When both the first and second sealing caps 145 and 146 are made of a metal material, they can also function as electromagnetic shielding to prevent interference of an external electromagnetic field with a measurement signal.

In other aspects, it is preferable that the connection of the first sealing cap 145 and the substrate 141 is covered with a sealant (not shown), and/or the connection of the second sealing cap 146 and the substrate 141 is covered with a sealant (not labeled). This can further improve the sealability.

The first sealing cover 145 and the substrate 141 enclose a first sealed cavity, which is preferably vacuum, and the pressure sensor 140 may be an absolute pressure chip or a differential pressure chip. The second sealing cover 146 and the substrate 141 may enclose a second sealing chamber therein.

The pressure sensor 100 of the present embodiment includes the pressure measurement assembly 14 described above, and further includes a housing accommodating the pressure measurement assembly 14 described above. The housing includes a first housing 11 and a second housing 12, the first housing 11 having a pressure introduction passage 114 for introducing pressure, the pressure introduction passage 114 having an inner end communicating with the pressure sensitive element 140 to apply pressure or pressure medium to be measured to the pressure sensitive element 140. The substrate 141 is plugged at one end of the inner side of the pressure guiding channel 114 to isolate other components from the pressure or pressure medium to be measured. The pressure sensor 100 further includes a terminal 13 fixed to the second housing 12, and an inner end thereof is electrically connected to an outer end of the relay terminal 147 through the first electrical connector 15. The pressure introduction passage 114 is provided in a pressure port 110 formed at the lower end of the first housing 11, the pressure port 110 being for connection with a container containing a pressure medium.

Preferably, the front side of the pressure sensitive element 140 is disposed upward. The second housing 12 is located at an upper end of the first housing 11. The second housing 12 has an upper portion formed with an electrical connector 120 for connection to an external device, and the terminal 13 is fixed to the second housing 12, with its upper end projecting into the electrical connector 120, and its lower end penetrating the electrical connector 120 in a sealed manner with the lower end facing downward, and is electrically connected to the relay terminal 147 through the first electrical connector 15. Wherein the first electrical connection 15 may be a flexible member, such as a flexible board. The upper end of the first housing 11 may form a circle of thin wall portion 111, the upper end of the thin wall portion 111 is rolled inwards to form a pressing edge 112, the pressing edge 112 is pressed down on an upward step surface 121 formed at the lower part of the second housing 12, the lower end edge of the second housing 12 is pressed down on the edge of the substrate 141, and the substrate 141 and the first housing 11 are sealed by a second sealing ring 19 b. The outside of the first housing 11 is formed with a groove (not shown) in which a first seal ring 19a is provided to facilitate sealing with a container containing a pressure medium. The second sealing ring 19b is guided into a sealing groove 113 formed on the end face of the pressure-measuring cell 114 facing the pressure measuring cell 14.

In the manufacturing process, the relay terminal 147 and the first sealing cover 145 may be fixed together by melted glass frit (forming the sintered glass 148); the edge of the first sealing cover 145 is welded in a cavity 14c formed by recessing the front surface of the substrate 141 inwards in a sealing manner by laser welding or the like (a circle of thickened flanges 14b facing upwards are formed at the periphery of the cavity 14 c); a ring of annular positioning parts 148a formed on the second sealing cover 146 are sleeved at the opening of the thickened flange 14b to position the two parts, and the edges of the annular positioning parts 148a are welded to the front surface of the substrate 141; finally, a portion of the frit is refilled between the relay terminal 147 and the second enclosure wall 14d and melted to form another portion of the sintered glass 148.

Preferably, the space between the bottom of the second housing 12 and the inner side of the first housing 11 at the thin wall portion 111 is sealed by a gasket 19 c.

Please refer to fig. 3. In the pressure measurement assembly 14 according to the second embodiment of the present application, the edge of the second sealing cover 146 extends to the side of the base plate 141 and is connected with the side of the base plate 141 in a sealing manner, and the base plate 141, the first sealing cover 145 and the second sealing cover 146 are preferably circular. In other embodiments, the edge of the first sealing cap 145 may also extend to the side of the substrate 141 and be sealed to the side of the substrate 141.

Please refer to fig. 4 and fig. 5 in combination. The pressure measurement assembly 24 of the present embodiment mainly includes a substrate 241, a pressure sensor 240, a processing circuit (not labeled), a first sealing cover 245 and a second sealing cover 246. The substrate 241 is provided with pressure holes 24a penetrating through both sides in the thickness direction (vertical direction in the drawing). The pressure sensitive element 240 is fixed to the pressure sensitive element 240 on the front side of the substrate 241 and seals the pressure hole 24a. The processing circuitry is disposed on the front side of the substrate 241 and is electrically connected to the pressure sensitive element 240. The first sealing cover 245 is hermetically connected to the front side of the substrate 241, and encloses a first sealing cavity with the substrate 241 for accommodating the pressure sensitive element 240 and the processing circuit. The second sealing cover 246 is hermetically connected to the front side of the substrate 241, and encloses a second sealing cavity with the substrate 241 for accommodating the first sealing cover 245. The tightness of the pressure measurement assembly 24 of the present embodiment is high, particularly in the case of vacuum in the first and second sealed chambers.

The pressure measurement assembly 24 of the present embodiment further includes a plurality of relay terminals 247 for electrical connection with the outside. The relay terminal 247 has an inner end electrically connected to the processing circuit, and an outer end hermetically penetrating a via (not shown) formed in the substrate 241 toward the opposite side, and a sintered glass 248 may be disposed in the via to seal the second electrical connector 249 and the substrate 241, thereby electrically connecting the processing circuit in the first sealing cap 245 to the outside.

The processing circuit of the present embodiment may be disposed on the front side of the substrate 241, the substrate 241 may be made of an insulating material such as ceramic, or the substrate 241 may be made of a conductive material such as metal and the processing circuit thereof may be disposed on a layer of insulating layer disposed on the front side of the substrate 241. The pressure sensitive element 240 is electrically connected to the processing circuit by a first lead 243. The circuit board 242 may also include other electronic components 244, such as conditioning chips and the like.

One end of the inner side of the relay terminal 247 is electrically connected to the processing circuit through an electrical connector 149. The electrical connector 149 may be a lead, and two ends of the lead are electrically connected to one end of the inner side of the electrical connector 149 and the processing circuit, respectively.

Preferably, the substrate 241, the first sealing cover 245 and the second sealing cover 246 are all made of metal materials. The first and second sealing caps 245 and 246 are welded to the substrate 241; or the substrate 241 is made of a ceramic material, the first sealing cover 245 and the second sealing cover 246 are made of metal materials, and the first sealing cover 245 and the second sealing cover 246 are welded to two metal plating rings (which can be attached to the surface of the substrate 241 by a plating technique such as vacuum plating) on the substrate 241 in a one-to-one correspondence manner; or the substrate 241 is made of a ceramic material, the first and second sealing caps 245 and 246 are made of glass, and the first and second sealing caps 245 and 246 are welded to the substrate 241 by glass frit.

In other aspects, it is preferable that the connection of the first sealing cap 245 and the substrate 241 is covered with a sealant (not shown), and/or the connection of the second sealing cap 246 and the substrate 241 is covered with a sealant (not labeled). This can further improve the sealability.

The first sealed housing 245 and the substrate 241 enclose a first sealed cavity, which is preferably vacuum, and the pressure sensor 240 may be an absolute pressure chip or a differential pressure chip. The second sealing cover 246 and the substrate 241 may enclose a second sealed cavity therein.

The pressure sensor 200 of the present embodiment includes the pressure measurement assembly 24 described above, and further includes a housing accommodating the pressure measurement assembly 24 described above. The housing includes a first housing 21 and a second housing 20, the first housing 21 having a pressure introduction passage 214 for introducing pressure, and an inner end of the pressure introduction passage 214 being sealingly connected to the pressure sensitive element 240 to apply pressure or pressure medium to be measured to the pressure sensitive element 240. The substrate 241 is plugged at one end of the inner side of the pressure guiding channel 214 to isolate other components from the pressure or pressure medium to be measured. The second housing 20 is adhered to an opening on the first housing 21 from the front side, for example, the second housing 20 may be adhered and sealed directly around the opening of the first housing 21, or further, the periphery of the opening of the first housing 21 is recessed downward to form a circle of first adhesive groove 21a, correspondingly, the edge of the second housing 20 protrudes downward to form a circle of flange 20a, and after the flange 20a is inserted into the first adhesive groove 21a, the flange 20a is filled with the first adhesive sealant 21b.

One end of the pressure guiding channel 214 is hermetically connected to the pressure sensitive element 240 to apply the pressure of the medium to be measured to the pressure sensitive element 240 through the pressure hole 24a on the substrate 241, for example, an end surface of the pressure guiding channel 214 facing the pressure measuring component 14 is provided with a second glue groove 21d. The second case 12 is sealed and bonded to the back surface of the substrate 241 by the second adhesive sealant 26 filled in the second adhesive groove 21d.

The pressure sensor 200 may further include a terminal 23 fixed to the housing, with an inner end thereof electrically connected to an outer end of the relay terminal 247. The pressure introduction passage 214 is provided in a pressure port 210 formed at the lower end of the first housing 21, the pressure port 210 being for connection with a container containing a pressure medium. The relay terminal 247 is located outside the second glue groove 21 d. The relay terminal 247 may be L-shaped and include a long arm and a short arm which are vertically connected, the short arm extends up and down and is sealed with a via hole on the substrate 241 by the sintered glass 248, and the upper end of the short arm is electrically connected with the processing circuit by a second electrical connector 249; one end 23a of the long arm, which is far from the short arm, extends horizontally in a direction far from the second glue groove 21d, and the other end 23b thereof is electrically connected by a first electrical connector 25 (e.g., aluminum wire, aluminum sheet, etc.).

Preferably, the front side of pressure sensitive element 240 is disposed facing upward. The first housing 21 is formed with an electrical connector 220 extending parallel to the substrate 241 to be connected to an external device, and the terminal 23 is fixed to the second housing 20, one end of which extends into the electrical connector 220, and the other end of which passes through the electrical connector 220 hermetically inward and is electrically connected to the relay terminal 247 through the first electrical connector 25. Wherein the first electrical connector 25 may be a flexible member, such as a flexible board.

The outside of the first housing 21 is formed with a groove (not shown) in which a first seal ring 29a is provided to facilitate sealing with a container containing a pressure medium. The first casing 21 may be provided with a third glue groove 21c facing upwards and opposite to the first electrical connector 25, and the third glue groove 21c is filled with a protective glue, and the protective glue covers the other end 23b and/or the first electrical connector 25.

In fabricating the pressure measurement assembly 24, the relay terminal 247 and the substrate 241 may be first fixed together by melted glass frit (forming sintered glass 248) and the relay terminal 247 may be electrically connected to the processing circuit by the first electrical connector 25; then, the edge of the first sealing cover 245 is welded on the front surface of the substrate 241 in a sealing way by laser welding and the like; the second sealing case 246 is then welded to the front surface of the substrate 241.

When the interior of the sealing cavity is vacuum, the sealing cavity can be sealed in a vacuum chamber environment.

The scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.

Claims (10)

1. A pressure measurement assembly (14, 24) comprising:

A base plate (141,241) provided with pressure holes (14 a,24 a) penetrating through both sides in the thickness direction;

A pressure sensitive element (140, 240) fixed to the front side of the substrate (141,241) and sealing the pressure hole (14 a,24 a);

processing circuitry disposed on a front side of the substrate (141,241) and electrically connected to the pressure sensitive element (140, 240);

a first sealing cap (145, 245) sealingly connected to one side of the base plate (141,241), which encloses a first sealed cavity with the base plate (141,241) for accommodating the pressure sensitive element (140, 240) and the processing circuitry;

A second sealing cover (146,246) which is connected with one side of the base plate (141,241) in a sealing way, and a second sealing cavity which is used for accommodating the first sealing covers (145, 245) is formed by the second sealing cover and the base plate (141,241);

And a plurality of relay terminals (147,247) having one end electrically connected to the processing circuit and one end of the outside thereof penetrating the via holes provided in the first sealing caps (145, 245) and the second sealing caps (146,246) in a sealed manner toward the front side.

2. The pressure measurement assembly (14, 24) of claim 1, further comprising a relay terminal (147,247), one end of the relay terminal (147,247) being electrically connected to the processing circuit; the other end of the relay terminal 147,247 is provided with a first sealing cover 145,245 and a second sealing cover 146,246 in a sealing manner toward the front side or a substrate 141,241 in a sealing manner toward the back side.

3. The pressure measurement component (14) of claim 1, wherein the via hole of the first sealing cap (145) extends toward the front side to form a first enclosure wall (14 e), the via hole of the second sealing cap (146) extends toward the back side to form a second enclosure wall (14 d), the second enclosure wall (14 d) and the first enclosure wall (14 e) are coaxially sleeved with a gap therebetween, and the gap between the relay terminal (147) and the first enclosure wall (14 e) and the gap between the second enclosure wall (14 d) and the first enclosure wall (14 e) are hermetically filled with a sintered glass (148); an inner end of the relay terminal (147,247) is electrically connected to the processing circuit through an electrical connector (149,249).

4. A pressure measurement assembly (14, 24) according to claim 3, wherein the electrical connection (149,249) is a resilient member, the end of which adjacent the processing circuit is electrically connected to the processing circuit by contact.

5. The pressure measurement assembly (14, 24) of claim 4, wherein the resilient contact (149,249) is a spring or leaf spring, the end thereof remote from the processing circuitry being secured to the inner end of the relay terminal (147,247).

6. The pressure measurement assembly (14, 24) of claim 1, wherein the base plate (141,241), the first seal cap (145, 245), and the second seal cap (146,246) are each made of a metallic material, and the first seal cap (145, 245) and the second seal cap (146,246) are each welded to the base plate (141,241).

7. The pressure measurement assembly (14, 24) of claim 1, wherein the base plate (141,241) is made of a ceramic material, the first (145, 245) and second (146,246) seal caps are each made of a metallic material, and the first (145, 245) and second (146,246) seal caps are welded to the two metal plating rings on the base plate (141,241) in a one-to-one correspondence.

8. The pressure measurement assembly (14, 24) of claim 1, wherein the base plate (141,241) is made of a ceramic material, the first and second seal caps (145, 245, 146,246) are each made of glass, and the first and second seal caps (145, 245, 146,246) are each welded to the base plate (141,241) by a frit.

9. The pressure measurement assembly (14, 24) of claim 1, wherein the connection of the first sealing cap (145, 245) to the substrate (141,241) is covered with a sealant and/or the connection of the second sealing cap (146,246) to the substrate (141,241) is covered with a sealant.

10. A pressure sensor, comprising:

a pressure measurement assembly as claimed in any one of claims 1 to 8;

A housing having a pressure-inducing channel (114, 214) connected to at least the pressure-sensitive element (140, 240), the substrate (141,241) being blocked at one end of the inner side of the pressure-inducing channel (114, 214);

and terminals (13, 23) fixed to the housing, the inner ends of which are electrically connected to the outer ends of the relay terminals (147,247).