CN118056117A - 压力传感器构造和压力传感器装置 - Google Patents

压力传感器构造和压力传感器装置 Download PDF

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Publication number
CN118056117A
CN118056117A CN202280066663.6A CN202280066663A CN118056117A CN 118056117 A CN118056117 A CN 118056117A CN 202280066663 A CN202280066663 A CN 202280066663A CN 118056117 A CN118056117 A CN 118056117A
Authority
CN
China
Prior art keywords
pressure sensor
diaphragm plate
layer
insulating film
sensor structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280066663.6A
Other languages
English (en)
Chinese (zh)
Inventor
丹羽亮介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN118056117A publication Critical patent/CN118056117A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0029—Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
CN202280066663.6A 2021-10-05 2022-10-04 压力传感器构造和压力传感器装置 Pending CN118056117A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-164256 2021-10-05
JP2021164256 2021-10-05
PCT/JP2022/037173 WO2023058660A1 (ja) 2021-10-05 2022-10-04 圧力センサ構造および圧力センサ装置

Publications (1)

Publication Number Publication Date
CN118056117A true CN118056117A (zh) 2024-05-17

Family

ID=85803489

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280066663.6A Pending CN118056117A (zh) 2021-10-05 2022-10-04 压力传感器构造和压力传感器装置

Country Status (4)

Country Link
US (1) US20240246811A1 (https=)
JP (1) JP7718498B2 (https=)
CN (1) CN118056117A (https=)
WO (1) WO2023058660A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4124867B2 (ja) * 1998-07-14 2008-07-23 松下電器産業株式会社 変換装置
FI126999B (en) * 2014-01-17 2017-09-15 Murata Manufacturing Co Improved pressure sensor
WO2022019167A1 (ja) * 2020-07-21 2022-01-27 株式会社村田製作所 圧力センサ構造、圧力センサ装置および圧力センサ構造の製造方法

Also Published As

Publication number Publication date
JPWO2023058660A1 (https=) 2023-04-13
WO2023058660A1 (ja) 2023-04-13
JP7718498B2 (ja) 2025-08-05
US20240246811A1 (en) 2024-07-25

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