CN118033830A

CN118033830A - Optical module

Info

Publication number: CN118033830A
Application number: CN202211364522.0A
Authority: CN
Inventors: 张加傲; 黄绪杰; 王欣南; 张晓廓; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-11-02
Filing date: 2022-11-02
Publication date: 2024-05-14

Abstract

The application provides an optical module, which comprises a circuit board, a first supporting piece, a laser component and a detector component, wherein one end of the front surface of the circuit board is provided with a golden finger, the other end of the front surface of the circuit board is provided with a signal pad, and the golden finger is electrically connected with the signal pad through a signal wire arranged on the front surface of the circuit board; one end of the first supporting piece supports and fixes the circuit board, a through hole is arranged on the first supporting piece, and the through hole is positioned below the circuit board; the laser component is arranged on the front surface of the first supporting piece and is electrically connected with the signal bonding pad through wire bonding; the detector component is arranged on the back of the circuit board, is positioned in the through hole, is electrically connected with the signal wiring arranged on the back of the circuit board and is used for converting received light into an electric signal, and the electric signal is transmitted through the signal wiring. According to the application, the first supporting piece is additionally arranged, the first supporting piece is in supporting connection with the circuit board, the first supporting piece and the circuit board are used as carriers, and the light emitting and receiving devices are directly arranged on the carriers, so that a BOX packaging structure is omitted, and the miniaturization development of the optical module is facilitated.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

The optical module generally comprises a shell, a circuit board arranged in the shell, an optical emission component and/or an optical receiving component, wherein the optical emission component and the optical receiving component are generally packaged through a tube shell respectively and then are respectively arranged on the circuit board or are respectively electrically connected with the circuit board through a flexible circuit board so as to realize signal transmission between the circuit board and the optical emission component and the optical receiving component. Or the light emitting component and the light receiving component are assembled in the same tube shell and are electrically connected with the circuit board through the flexible circuit board.

However, in either packaging method, the optical processing elements such as the laser chip, the detector chip, and the lens are assembled on a carrier, then connected to the circuit board, and finally assembled into the housing of the optical module. The packaging mode causes more structural parts, the production process is complex, the occupation of dead space in the optical module is relatively high, and the miniaturization and high-density integration development of the optical module are not facilitated.

Disclosure of Invention

The embodiment of the application provides an optical module, which is packaged in a new packaging mode, reduces the dead space ratio in the optical module and is beneficial to the miniaturization and high-density integration development of the optical module.

The application provides an optical module, comprising:

The circuit board is characterized in that one end of the front face of the circuit board is provided with a golden finger, the other end of the front face of the circuit board is provided with a signal pad, and the golden finger is electrically connected with the signal pad through a signal wire distributed on the front face of the circuit board; the back of the device is provided with a signal wiring;

A first supporting member having one end supporting and fixing the circuit board; the circuit board is provided with a through hole, and the through hole is positioned below the circuit board;

The laser component is arranged on the front surface of the first supporting piece and is close to the signal pad, and the laser component is electrically connected with the signal pad through wire bonding; for generating emitted light;

the detector component is arranged on the back surface of the circuit board, is positioned in the through hole and is electrically connected with the signal wire; for converting received light into an electrical signal, which is transmitted via the signal trace.

As can be seen from the above embodiments, the optical module provided by the embodiment of the present application includes a circuit board, a first supporting member, a laser component and a detector component, where one end of the front surface of the circuit board is provided with a gold finger, and the other end is provided with a signal pad, and the gold finger is electrically connected with the signal pad through a signal line arranged on the front surface of the circuit board; one end of the first supporting piece supports and fixes the circuit board so as to realize the supporting and fixing of the circuit board and the first supporting piece; the laser component is arranged on the front surface of the first supporting piece, is close to the signal pad on the circuit board, and is electrically connected with the signal pad through a wire so as to receive the electric signal transmitted by the circuit board and generate emitted light; thus, the laser component is directly arranged on the front surface of the first supporting piece, and a BOX packaging structure of the light emitting device can be omitted; the first supporting piece is provided with a through hole, and the through hole is positioned below the circuit board; the detector component is arranged on the back surface of the circuit board and is positioned in the through hole of the first supporting piece, the detector component is electrically connected with the signal wiring arranged on the back surface of the circuit board so as to convert external received light into electric signals, the electric signals are transmitted to the circuit board through the signal wiring, and therefore the detector component is arranged on the back surface of the circuit board, receives the external received light through the through hole, and can omit a BOX packaging structure of the light receiving device. According to the application, the first supporting piece is additionally arranged and is in supporting connection with the circuit board, the first supporting piece and the circuit board are used as carriers, and the light emitting device and the light receiving device are directly arranged on the carriers, so that the BOX packaging structure of the light emitting device and the light receiving device can be omitted, the number of packaging structural members can be reduced, the ineffective space in the optical module can be reduced, and the miniaturization and high-density integration development of the optical module are facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

fig. 2 is a block diagram of an optical module according to some embodiments;

Fig. 3 is a schematic diagram of an optical module according to some embodiments;

FIG. 4 is a partially exploded schematic illustration of an optical module according to some embodiments;

fig. 5 is an assembly schematic diagram of a circuit board, a first supporting member and a light emitting device in an optical module according to an embodiment of the present application;

fig. 6 is an assembly schematic diagram of a circuit board, a first supporting member and a light receiving device in an optical module according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a first supporting member in an optical module according to an embodiment of the present application;

Fig. 8 is a schematic structural diagram of a first supporting member in an optical module according to an embodiment of the present application;

Fig. 9 is a schematic diagram of a partial assembly of a circuit board, a first supporting member and a light receiving device in an optical module according to an embodiment of the present application;

fig. 10 is a partial assembled sectional view of a circuit board, a first supporting member and a light emitting device in an optical module according to an embodiment of the present application;

fig. 11 is a partial assembly sectional view of a circuit board, a first supporting member and a light receiving device in an optical module according to an embodiment of the present application;

fig. 12 is an exploded schematic view of a circuit board, a first supporting member, a light receiving device and a cover plate in an optical module according to an embodiment of the present application;

fig. 13 is a schematic structural diagram of a cover plate in an optical module according to an embodiment of the present application;

Fig. 14 is a partial assembly sectional view of a circuit board, a first supporting member, a light emitting device and a light receiving device in an optical module according to an embodiment of the present application;

fig. 15 is a schematic structural diagram of a lower housing in an optical module according to an embodiment of the present application;

Fig. 16 is an assembly schematic diagram of a lower housing, a circuit board, a light emitting device and a light receiving device in an optical module according to an embodiment of the present application;

Fig. 17 is an assembly schematic diagram of a circuit board, a first supporting member, a second supporting member, a light emitting device and an optical fiber adapter in an optical module according to an embodiment of the present application;

fig. 18 is a schematic diagram of an assembly structure of a first support and a second support in an optical module according to an embodiment of the present application;

fig. 19 is an exploded schematic view of a first support and a second support in an optical module according to an embodiment of the application;

Fig. 20 is a schematic structural diagram of a second support member in an optical module according to an embodiment of the application;

Fig. 21 is a schematic structural diagram of a second supporting member in an optical module according to an embodiment of the present application;

Fig. 22 is a schematic diagram of an emission light path in an optical module according to an embodiment of the present application;

Fig. 23 is a schematic diagram two of an emission light path in an optical module according to an embodiment of the present application;

Fig. 24 is a cross-sectional view of a second support member in an optical module according to an embodiment of the present application;

Fig. 25 is an assembly schematic diagram of a circuit board, a first supporting member, a second supporting member, a light receiving device and an optical fiber adapter in an optical module according to an embodiment of the present application;

fig. 26 is a schematic diagram of a receiving optical path in an optical module according to an embodiment of the application;

fig. 27 is a schematic diagram two of a receiving optical path in an optical module according to an embodiment of the application.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and the electric connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-range signal transmission, such as several kilometers (6 kilometers to 8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to achieve unlimited distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. Illustratively, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the mutual conversion between the optical signal and the electrical signal, it has no function of processing data, and the information is not changed during the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Illustratively, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits an electrical signal from the network cable 103 to the optical module 200, so that the optical network terminal 100, as a host computer of the optical module 200, can monitor the operation of the optical module 200. The upper computer of the Optical module 200 may include an Optical line terminal (Optical LINE TERMINAL, OLT) or the like in addition to the Optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal, and fig. 2 shows only the configuration of the optical network terminal 100 related to the optical module 200 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 propose a bi-directional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, and an optical component.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being covered on the lower housing 202 to form the above-mentioned housing having two openings; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate that is covered on both lower side plates of the lower case 202 to form the above-described case.

In some embodiments, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and the two upper side plates are combined with the two lower side plates to realize that the upper case 201 is covered on the lower case 202.

The direction in which the two openings 204 and 205 are connected may be the same as the longitudinal direction of the optical module 200 or may be different from the longitudinal direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical port, from which the golden finger of the circuit board 300 extends and is inserted into a host computer (e.g., the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 such that the external optical fiber 101 connects optical components inside the optical module 200.

The circuit board 300, the optical component and other devices are conveniently installed in the shell by adopting an assembly mode that the upper shell 201 and the lower shell 202 are combined, and the devices are encapsulated and protected by the upper shell 201 and the lower shell 202. In addition, when devices such as the circuit board 300 and the optical assembly are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are convenient to deploy, and the automatic production implementation is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located outside the housing thereof, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, with a snap-in member that mates with an upper computer cage (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a limiting amplifier (LIMITING AMPLIFIER), a clock data recovery (Clock and Data Recovery, CDR) chip, a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; when the optical component is positioned on the circuit board, the hard circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board. For example, a flexible circuit board connection may be employed between the rigid circuit board and the optical component.

The light assembly generally comprises a light emitting assembly and a light receiving assembly, the light emitting assembly and the light receiving assembly are generally packaged through tube shells respectively, namely, the light emitting assembly comprises a light emitting tube shell, a laser, a lens and other light emitting devices which are positioned in the light emitting tube shell, the light emitting assembly can be electrically connected with a circuit board through a flexible circuit board, so that signal transmission between the circuit board and the light emitting assembly is realized, and light emission is realized.

The light receiving component comprises a receiving tube shell, and light receiving devices such as a lens, a detector and the like which are positioned in the receiving tube shell, and can be electrically connected with the circuit board through the flexible circuit board so as to realize signal transmission between the circuit board and the light receiving component and realize light receiving.

However, in either packaging method, the optical processing elements such as the laser chip, the detector chip, and the lens are assembled on a carrier, then connected to the circuit board, and finally assembled into the housing of the optical module. The BOX packaging mode causes more structural parts, has complex production process, occupies higher dead space in the optical module, and is not beneficial to the miniaturization and high-density integration development of the optical module.

In order to solve the above problems, the optical module provided in the embodiment of the present application is additionally provided with the first supporting element, where the first supporting element is connected with the circuit board, so that the first supporting element and the circuit board form a carrier after being assembled, and the light emitting device and the light receiving device are placed on the carrier, so that a BOX packaging structure of the light emitting device and the light receiving device can be omitted, the number of packaging structural members is reduced, and the miniaturization and high-density integration development of the optical module are facilitated.

Fig. 5 is an assembly schematic diagram of a circuit board, a first supporting member and a light emitting device in an optical module according to an embodiment of the present application, and fig. 6 is an assembly schematic diagram of a circuit board, a first supporting member and a light receiving device in an optical module according to an embodiment of the present application. As shown in fig. 5 and 6, the optical module provided in the embodiment of the application includes a first support 400, and one end of the first support 400 is connected to the circuit board 300 to support and fix the circuit board 300.

When the first support 400 is connected with the circuit board 300, the circuit board 300 is disposed on the front surface of one end of the first support 400, so that the back surface of the circuit board 300 is in contact connection with the front surface of the first support 400 to support and fix the circuit board 300 through the first support 400.

The light emitting device includes a laser assembly directly disposed on the front surface of the first support 400, and electrically connected to the circuit board 300 through a wire to generate signal light according to an electrical signal transmitted from the circuit board 300, and the signal light is converged and emitted by an optical device on the front surface of the first support 400.

In some embodiments, a gold finger is disposed at one end of the front surface of the circuit board 300, a signal pad is disposed at the other end of the front surface of the circuit board 300, and the gold finger is electrically connected with the signal pad through a signal wire disposed on the front surface of the circuit board 300, so as to transmit an electrical signal received by the gold finger to the signal pad through the signal wire, and then transmit the electrical signal to the laser assembly through wire bonding, so as to drive the laser assembly to generate emitted light.

In some embodiments, a data processor (DSP chip) may also be disposed on the front side of the circuit board 300, one end of the DSP chip is electrically connected to the golden finger through a signal line, and the other end of the DSP chip is electrically connected to the signal pad through a signal line, so that the DSP chip provides an electrical signal to the laser assembly through the signal line and the signal pad to drive the laser assembly to generate an emitted light signal.

In some embodiments, the optical module provided by the embodiment of the application further includes an optical fiber adapter, and the light emitting device can be connected with the optical fiber adapter through an internal optical fiber, so that an optical signal generated by the light emitting device is transmitted to the optical fiber adapter through the internal optical fiber, and is emitted through the optical fiber adapter.

Specifically, the light emitting device includes a first laser array 401, a first collimating lens array 402, a second laser array 403, and a second collimating lens array 404, where the first laser array 401 and the second laser array 403 are arranged side by side on the front surface of the first support 400, and the first laser array 401 and the second laser array 403 are close to the left side surface of the circuit board 300, and the wire bonding heights of the first laser array 401 and the second laser array 403 are flush with the front surface of the circuit board 300, so that the first laser array 401 and the second laser array 403 are electrically connected with the signal pads on the circuit board 300 through wire bonding, so that the electric signals transmitted by the circuit board 300 drive the first laser array 401 and the second laser array 403 to generate multiple paths of emitted light.

The first collimating lens array 402 and the second collimating lens array 404 are disposed on the front surface of the first support 400 side by side, and the first collimating lens array 402 is located in the light emitting direction of the first laser array 401 and is used for converting the emitted light generated by the first laser array 401 into collimated light; the second collimating lens array 404 is located in the light emitting direction of the second laser array 403, and is used for converting the emitted light generated by the second laser array 403 into collimated light.

In some embodiments, the first laser array 401 includes 4 lasers, the 4 lasers being disposed side by side on the front surface of the first support 400, each laser producing one path of emitted light, such that the first laser array 401 produces 4 paths of emitted light of different wavelengths; the first collimating lens array 402 includes 4 collimating lenses, one in the light exiting direction of each laser.

The second laser array 403 includes 4 lasers, where the 4 lasers are arranged side by side on the front surface of the first support 400, and each laser generates one path of emitted light, so that the second laser array 403 generates 4 paths of emitted light with different wavelengths; the second collimating lens array 404 includes 4 collimating lenses, one in the light-emitting direction of each laser.

Fig. 7 is a schematic structural diagram of a first supporting member in an optical module according to an embodiment of the present application, and fig. 8 is a schematic structural diagram of a second supporting member in an optical module according to an embodiment of the present application. As shown in fig. 7 and 8, in order to provide the light emitting device on the front surface of the first support 400, the first support 400 includes a first support surface 410 and a second support surface 420, the first support surface 410 and the second support surface 420 are disposed along the left-right direction, and the second support surface 420 is located at the left side of the first support surface 410. The circuit board 300 is disposed on the first supporting surface 410, so as to support and fix the circuit board 300 through the first supporting surface 410.

The second supporting surface 420 is provided with an opening towards one side of the upper housing 201, the first supporting surface 410 faces the circuit board 300, the front surface of the first supporting surface 410 is concave in the second supporting surface 420, a second connecting surface 440 is arranged between the first supporting surface 410 and the second supporting surface 420, and the front surface of the first supporting surface 410 is connected with the second supporting surface 420 through the second connecting surface 440; the back surface of the circuit board 300 is adhered to the front surface of the first supporting surface 410, such that the circuit board 300 is disposed on the first supporting surface 410, and the front surface of the circuit board 300 protrudes from the second supporting surface 420.

In some embodiments, when the back surface of the circuit board 300 is adhered to the first supporting surface 410, the left side surface of the circuit board 300 abuts against the second connecting surface 440, so as to limit the circuit board 300 through the second connecting surface 440.

The first laser array 401 and the second laser array 403 are arranged on the second supporting surface 420 side by side, the first collimating lens array 402 and the second collimating lens array 404 are arranged on the second supporting surface 420 side by side, the first collimating lens array 402 is located in the light emitting direction of the first laser array 401, and the second collimating lens array 404 is located in the light emitting direction of the second laser array 403.

In some embodiments, to emit the emitted light generated by the first laser array 401 and the second laser array 403, the light emitting device may further include a first optical fiber coupler and a second optical fiber coupler, where the first optical fiber coupler and the second optical fiber coupler are disposed on the second supporting surface 420 side by side, and the first optical fiber coupler is located in the light emitting direction of the first laser array 401 and the second optical fiber coupler is located in the light emitting direction of the second laser array 403.

The other ends of the first optical fiber coupler and the second optical fiber coupler are respectively connected with one end of an optical fiber ribbon, and the other end of the optical fiber ribbon is connected with an optical fiber adapter, so that the first optical fiber coupler couples the emission light emitted by the first collimating lens array 402 to the optical fiber ribbon, and the second optical fiber coupler couples the emission light emitted by the second collimating lens array 404 to the optical fiber ribbon, and then the emission light is transmitted to the optical fiber adapter through the optical fiber ribbon.

In some embodiments, the first support 400 may be a metal block fixedly connected to the lower housing 202 by a screw to ensure the stability of the first support 400, so that the first support 400 stably supports and fixes the circuit board 300 and the light emitting device.

When the first support 400 is a metal block, heat generated by the operation of the first laser array 401 and the second laser array 403 can be transmitted to the lower housing 202 through the metal block, so that the heat dissipation efficiency of the lasers is ensured.

The first support 400 is provided with a through hole 4101, and when the back surface of the circuit board 300 is placed on the first support surface 410, the through hole 4101 is located below the circuit board 300, so that an optoelectronic device can be disposed on the back surface of the circuit board 300 through the through hole 4101.

Specifically, the through hole 4101 on the first support 400 is disposed on the first support surface 410, and an opening is disposed on a side of the through hole 4101 facing the circuit board 300, and the opening extends to the right side surface of the first support surface 410, so that the first support surface 410 is composed of one connecting arm and two support arms, two ends of the connecting arm are respectively connected with the two support arms, and a gap exists between the two support arms.

In some embodiments, a connection plate 4102 is disposed within the opening, opposite sides of the connection plate 4102 being connected to the two support arms to ensure a gap between the two support arms through the connection plate 4102. The front surface of the connecting plate 4102 is recessed in the front surface of the first supporting surface 410, and the back surface of the connecting plate 4102 is flush with the back surface of the first supporting surface 410, so that when the back surface of the circuit board 300 is adhered to the first supporting surface 410, a gap exists between the back surface of the circuit board 300 and the front surface of the connecting plate 4102, so that the photoelectric chips and the signal wires can be conveniently arranged on the back surface of the circuit board 300, and the signal wires can pass through the gap between the front surface of the connecting plate 4102 and the back surface of the circuit board 300, thereby ensuring the layout space of the photoelectric chips on the circuit board 300.

The light receiving device is directly disposed on the back surface of the circuit board 300 through the through hole 4101, and external received light transmitted by the optical fiber adapter is converged on the detector chip on the back surface of the circuit board 300, and is converted into an electrical signal by the detector chip, and the electrical signal is transmitted to the circuit board 300, thereby realizing light reception.

Fig. 9 is a schematic diagram illustrating a partial assembly of a circuit board, a first supporting member and a light receiving device in an optical module according to an embodiment of the application. As shown in fig. 9, the light receiving device includes a first detector group 320 and a second detector group 330, the first detector group 320 and the second detector group 330 are disposed side by side on the back surface of the circuit board 300, and the first detector group 320 and the second detector group 330 are located in the through hole 4101.

The back of the circuit board 300 is provided with signal wires, and the first detector group 320 and the second detector group 330 are respectively and electrically connected with the signal wires, so that the electric signals output by the first detector group 320 and the second detector group 330 are transmitted through the signal wires.

A transimpedance amplifier may be further disposed on the back of the circuit board 300, and one end of the transimpedance amplifier is electrically connected to the first detector set 320 and the second detector set 330, and is used for amplifying the electrical signals output by the first detector set 320 and the second detector set 330; the other end of the transimpedance amplifier is electrically connected with the signal wiring to transmit the amplified electric signal through the signal wiring.

The signal wiring arranged on the circuit board 300 can be connected with the DSP chip 310, so that the amplified electric signal output by the transimpedance amplifier is transmitted to the DSP chip 310 through the signal wiring, the DSP chip 310 processes the electric signal and then transmits the processed electric signal to the golden finger through the signal wire on the front surface of the circuit board 300, and the golden finger is transmitted to the upper computer, thereby realizing light receiving.

Since the first detector set 320 and the second detector set 330 are disposed on the back surface of the circuit board 300, the back surface of the circuit board 300 is adhered to the front surface of the first supporting surface 410, so that a height difference exists between the back surface of the first supporting member 400 and the back surface of the circuit board 300, and thus the received light transmitted by the optical fiber adapter cannot be emitted to the first detector set 320 and the second detector set 330.

Since the light receiving directions of the first detector group 320 and the second detector group 330 are perpendicular to the circuit board 300, and the received light transmitted by the optical fiber adapter is parallel to the circuit board 300, in order to inject the received light into the first detector group 320 and the second detector group 330, the light receiving device further includes a first reflecting mirror 407 and a second reflecting mirror 408, the light incident surfaces of the first reflecting mirror 407 and the second reflecting mirror 408 are opposite to the optical fiber adapter, the reflecting surface of the first reflecting mirror 407 is located directly above the first detector group 320, the reflecting surface of the second reflecting mirror 408 is located directly above the second detector group 330, so that part of the received light is reflected to the first detector group 320 by the first reflecting mirror 407, and the rest of the received light is reflected to the second detector group 330 by the second reflecting mirror 408.

In some embodiments, the received light transmitted by the fiber adapter is divergent light, and in order to ensure that multiple received light paths are reflected by the first mirror 407 to the first detector set 320, the light receiving device further includes a first collimating lens set 405, where the first collimating lens set 405 is located between the fiber adapter and the first mirror 407, and the first collimating lens set 405 converts multiple received light paths into multiple collimated light paths, and the multiple collimated light paths are reflected by the first mirror 407 to the first detector set 320.

Similarly, to ensure that the multiple divergent light beams are reflected by the second mirror 408 to the second detector set 330, the light receiving device further includes a second collimating lens set 406, where the second collimating lens set 406 is located between the fiber adapter and the second mirror 408, and the second collimating lens set 406 converts the multiple receiving light beams into multiple collimated light beams, and the multiple collimated light beams are reflected by the second mirror 408 to the second detector set 330.

In some embodiments, the light receiving device further includes a first condensing lens group 409 and a second condensing lens group 4010, the first condensing lens group 409 and the second condensing lens group 4010 are fixed on the back surface of the circuit board 300 through a support block, and the first condensing lens group 409 is located between the first reflecting mirror 407 and the first detector group 320, for condensing the received light reflected by the first reflecting mirror 407 into the first detector group 320. The second converging lens group 4010 is located between the second reflecting mirror 408 and the second detector group 330, and is used for converging the received light reflected by the second reflecting mirror 408 into the second detector group 330.

In some embodiments, since the first detector set 320 and the second detector set 330 are located in the through hole 4101, in order to achieve the receiving of the received light, the first collimating lens set 405, the second collimating lens set 406, the first reflecting mirror 407, and the second reflecting mirror 408 are also located in the through hole 4101.

In some embodiments, to position the first collimating lens group 405, the second collimating lens group 406, the first reflecting mirror 407, and the second reflecting mirror 408 within the through hole 4101, the first collimating lens group 405, the second collimating lens group 406 may be fixed on the first supporting surface 410 at the left edge of the through hole 4101, the first reflecting mirror 407 is fixed on the first collimating lens group 405, and the reflecting surface of the first reflecting mirror 407 is located directly above the first detector group 320; the second reflecting mirror 408 is fixed on the second collimating lens group 406, and the reflecting surface of the second reflecting mirror 408 is located directly above the second detector group 330.

Fig. 10 is a partial assembly sectional view of a circuit board, a first supporting member and a light emitting device in an optical module according to an embodiment of the present application, and fig. 11 is a partial assembly sectional view of a circuit board, a first supporting member and a light receiving device in an optical module according to an embodiment of the present application. As shown in fig. 10 and 11, the first laser array 401, the first collimating lens array 402, the second laser array 403, and the second collimating lens array 404 are disposed on the second supporting surface 420 of the first supporting member 400, and the DSP chip 310 on the front surface of the circuit board 300 is electrically connected to the first laser array 401 and the second laser array 403 through signal lines, so as to drive the first laser array 401 and the second laser array 403 to generate multiple optical signals with different wavelengths.

The optical fiber adapter can be arranged in the lower shell 202, multiple paths of optical signals with different wavelengths can be transmitted to the optical fiber adapter through the optical fiber belt and then emitted out through the optical fiber adapter, so that light emission is realized.

The received light transmitted by the optical fiber adapter is transmitted to the light receiving device through the optical fiber ribbon, the received light is converted into collimated light through the first collimating lens group 405 and the second collimating lens group 406, the collimated light is reflected into collimated light perpendicular to the back surface of the circuit board 300 through the first reflecting mirror 407 and the second reflecting mirror 408, and the reflected collimated light is converged to the first detector group 320 and the second detector group 330 through the first converging lens group 409 and the second converging lens group 4010 respectively.

The first detector set 320 and the second detector set 330 convert the received optical signals into electrical signals, the electrical signals are transmitted to the DSP chip 310 through signal lines, the DSP chip 310 processes the electrical signals and then transmits the processed electrical signals to the golden finger through signal lines, and thus light reception is achieved.

Fig. 12 is an exploded schematic view of a circuit board, a first supporting member, a light receiving device and a cover plate in an optical module according to an embodiment of the present application, and fig. 13 is a schematic view of a structure of a cover plate in an optical module according to an embodiment of the present application. As shown in fig. 12 and 13, in order to fix the first collimating lens group 405, the second collimating lens group 406, the first reflecting mirror 407, and the second reflecting mirror 408, the optical module provided by the embodiment of the application may further include a cover plate 480, where the first collimating lens group 405, the second collimating lens group 406, the first reflecting mirror 407, and the second reflecting mirror 408 are all disposed on the cover plate 480, and the cover plate 480 is covered on the through hole 4101.

The cover plate 480 includes a first support block 4801, a second support block 4803, and a third support block 4802, the first support block 4801, the second support block 4803, and the third support block 4802 extend from the front surface of the cover plate 480 in the direction of the through hole 4101, and the third support block 4802 is located between the first support block 4801 and the second support block 4803. When the cover plate 480 is covered on the through hole 4101, the first support block 4801 and the second support block 4803 are respectively disposed on the back surface opposite to the first support surface 410 to support the fixed cover plate 480 by the first support 400.

In some embodiments, a boss 4103 is further disposed within the through hole 4101, the boss 4103 extending from a left side wall of the through hole 4101 toward the direction of the connection plate 4102, and the boss 4103 corresponding to the third support block 4802 of the cover 480. When the cover plate 480 is covered on the through hole 4101, the first support block 4801 and the second support block 4803 are disposed on the back surface of the first support 400, and the third support block 4802 is disposed on the boss 4103, so as to support and fix the cover plate 480 through the first support 400 and the boss 4103, thereby ensuring the connection and fixation of the cover plate 480 and the first support 400.

The front surface of cover plate 480 is partitioned into a first platform 4804 and a second platform 4805 by a first support block 4801, a second support block 4803, and a third support block 4802, the first platform 4804 being located between the first support block 4801 and the third support block 4802, and the second platform 4805 being located between the third support block 4802 and the second support block 4803.

In some embodiments, the first collimating lens group 405, the first reflecting mirror 407, and the second collimating lens group 406, and the second reflecting mirror 408 are disposed on the first stage 4804 along the light receiving direction, and the second stage 4805 along the light receiving direction, so that the first collimating lens group 405, the first reflecting mirror 407, the second collimating lens group 406, and the second reflecting mirror 408 are disposed in the through hole 4101 through the cover plate 480.

Fig. 14 is a partial assembly sectional view of a circuit board, a first supporting member, a light emitting device and a light receiving device in an optical module according to an embodiment of the present application. As shown in fig. 14, the first collimating lens group 405, the first reflecting mirror 407, the second collimating lens group 406, and the second reflecting mirror 408 are disposed on the cover plate 480, and then the assembled cover plate 480 is adhered to the back surface of the first support 400 and the boss 4103, so that the cover plate 480 covers the through hole 4101 to ensure a transmission light path of the received light.

In some embodiments, a transimpedance amplifier is further disposed on the back surface of the circuit board 300, and is connected to the detector through a wire, and the transimpedance amplifier is used for amplifying the electrical signal output by the detector.

Fig. 15 is a schematic structural diagram of a lower housing in an optical module according to an embodiment of the present application, and fig. 16 is an assembly schematic diagram of the lower housing, a circuit board, a light emitting device and a light receiving device in the optical module according to the embodiment of the present application. As shown in fig. 15 and 16, when the cover 480 is covered on the through hole 4101, since the back surface of the cover 480 protrudes from the back surface of the first support 400, the protruding cover 480 causes a larger space of the cavity between the upper case 201 and the lower case 202 when the circuit board 300, the first support 400, the light emitting device, the light receiving device, and the cover 480 are placed in the cavity formed by the upper case 201 and the lower case 202.

In order to reduce the space of the cavity between the upper case 201 and the lower case 202, a through-going escape hole 2021 is provided on the back surface of the lower case 202, the escape hole 2021 corresponds to the through hole 4101 of the first support 400, when the cover 480 is assembled, the cover 480 is embedded in the escape hole 2021, and the back surface of the cover 480 may be flush with the back surface of the lower case 202.

When the avoidance hole 2021 is used to avoid the cover plate 480 and the circuit board 300, the first support member 400, the light emitting device, the light receiving device, and the cover plate 480 are disposed in the cavity formed by the upper case 201 and the lower case 202, the thickness of the cavity in the up-down direction may be slightly greater than the thickness of the circuit board 300, the first support member 400, the light emitting device, and the light receiving device in the up-down direction, so that the overall thickness dimension of the optical module can be greatly reduced.

According to the application, the first supporting piece is additionally arranged, the first supporting piece is in supporting connection with the circuit board, the first supporting piece and the circuit board form a carrier, and the light emitting device and the light receiving device are directly arranged on the carrier, so that the BOX packaging structure of the light emitting device and the light receiving device can be omitted, the number of packaging structural members is reduced, the ineffective space in the optical module is reduced, and the miniaturization and high-density integration development of the optical module are facilitated.

In some embodiments, when the light emitting device and the light receiving device are connected to the plurality of optical fiber adapters through the optical fiber ribbon, one optical fiber in the optical fiber ribbon can transmit an optical signal with one wavelength, and the optical fiber ribbon makes the cavity in the optical module larger in size, so that multiplexing can be performed on multiple emitted lights emitted by the light emitting device and multiple received lights received by the light receiving device, and the number of the optical fiber adapters is reduced.

Fig. 17 is an assembly schematic diagram of a circuit board, a first support member, a second support member, a light emitting device and an optical fiber adapter in an optical module according to an embodiment of the present application. As shown in fig. 17, the optical module provided in the embodiment of the application further includes a second support 500, a first optical fiber adapter 600 and a second optical fiber adapter 700, wherein one end of the first support 400 is in support connection with the circuit board 300, and the other end of the first support 400 is inserted into the second support 500, so as to realize connection and fixation of the circuit board 300, the first support 400 and the second support 500.

The light emitting devices are directly disposed on the front surface of the first support 400 and the front surface of the second support 500, respectively, and the first optical fiber adapter 600 is inserted into the other end of the second support 500, so that the light emitting devices and the first optical fiber adapter 600 are sequentially assembled on the front surfaces of the first support 400 and the second support 500 along the light emitting direction. The laser assembly is electrically connected with the circuit board 300 to generate signal light according to the electrical signal transmitted by the circuit board 300, and the signal light is converged to the first optical fiber adapter 600 through the light emitting devices on the first support 400 and the second support 500, so that light emission is realized.

The light receiving devices are directly disposed on the rear surface of the second support 500 and the rear surface of the circuit board 300, respectively, and the second optical fiber adapter 700 is inserted into the other end of the second support 500 such that the second optical fiber adapter 700, the light receiving devices are sequentially assembled on the rear surface of the second support 500 and the rear surface of the circuit board 300 along the light receiving direction. The received light transmitted by the second optical fiber adapter 700 is transmitted to the back surface of the second supporting member 500, is processed by the light receiving device on the back surface of the second supporting member 500, and is converged on the detector assembly on the back surface of the circuit board 300, and is converted into an electrical signal by the detector assembly, and the electrical signal is transmitted to the circuit board 300, so that light reception is realized.

Fig. 18 is a schematic diagram of an assembly structure of a first support and a second support in an optical module according to an embodiment of the present application, and fig. 19 is an exploded schematic diagram of the first support and the second support in the optical module according to the embodiment of the present application. As shown in fig. 18 and 19, to achieve connection and fixation of the first support 400 and the second support 500, the first support 400 further includes a third support surface 430, the second support surface 420 is located between the third support surface 430 and the first support surface 410, the first support surface 410 faces the circuit board 300, and the third support surface 430 faces the second support 500.

The third supporting surface 430 is recessed in the second supporting surface 420, the second supporting surface 420 is connected to the third supporting surface 430 through the first connecting surface 4201, the second supporting member 500 is disposed on the third supporting surface 430, and the front surface of the second supporting member 500 is flush with the second supporting surface 420.

The first supporting element 400 further comprises a first limiting plate 450 and a second limiting plate 460, the first limiting plate 450 and the second limiting plate 460 are oppositely arranged, the first limiting plate 450 is connected with one side of the second supporting surface 420 and one side of the third supporting surface 430, the second limiting plate 460 is connected with the other side of the second supporting surface 420 and the other side of the third supporting surface 430, and therefore the first supporting element 400 is formed into a U-shaped plate by the second supporting surface 420, the third supporting surface 430, the first limiting plate 450 and the second limiting plate 460.

Fig. 20 is a schematic structural view of a first supporting member in an optical module according to an embodiment of the present application, and fig. 21 is a schematic structural view of a second supporting member in an optical module according to an embodiment of the present application. As shown in fig. 20 and 21, the second supporter 500 includes a main plate 510, a first protruding plate 520 and a second protruding plate 540, and the first protruding plate 520 and the second protruding plate 540 are connected to one side of the main plate 510 such that the first protruding plate 520 and the second protruding plate 540 extend from one side of the main plate 510 in the direction of the first supporter 400; the front surface of the first protrusion plate 520 is flush with the front surface of the main plate 510, the rear surface of the second protrusion plate 540 is flush with the rear surface of the main plate 510, a gap exists between the first protrusion plate 520 and the second protrusion plate 540, and one end of the first support 400 is inserted into the gap between the first protrusion plate 520 and the second protrusion plate 540 to connect the first support 400 and the second support 500 together.

Specifically, the main board 510 includes a front surface 5101, a back surface 5102, a first side surface 5103, a second side surface, a third side surface 5104, and a fourth side surface 5105, the first side surface 5103 faces the first support 400, and the first side surface 5103 is disposed opposite to the second side surface; the third side 5104 is connected to the front side 5101, the back side 5102, the first side 5103 and the second side, and the third side 5104 is disposed opposite to the fourth side 5105.

The first and second protrusion plates 520 and 540 extend from the first side 5103 toward the first supporter 400, and the length of the first protrusion plate 520 in the left-right direction is greater than the length of the second protrusion plate 540 in the left-right direction, so that the rear surface 5203 of the first protrusion plate 520 is in contact with the third supporting surface 430 and the front surface of the second protrusion plate 540 is in contact with the rear surface of the first supporter 400.

In some embodiments, the first protruding plate 520 includes a first contact surface 5201, a second contact surface, and a third contact surface 5202, the third contact surface 5202 being disposed opposite the first side 5103, the first contact surface 5201 being coupled to the third contact surface 5202, the first side 5103, a front side of the first protruding plate 520, and a back side 5203 of the first protruding plate 520, the first contact surface 5201 being disposed opposite the second contact surface.

The first contact surface 5201 is recessed in the third side surface 5104 and the second contact surface is recessed in the fourth side surface 5105 such that the width dimension of the first projection plate 520 in the front-rear direction is smaller than the width dimension of the main plate 510 in the front-rear direction.

When the first supporting member 400 is inserted between the first protruding plate 520 and the second protruding plate 540 of the second supporting member 500, the back surface of the first protruding plate 520 is in contact with the third supporting surface 430, the front surface of the second protruding plate 540 is in contact with the back surface of the first supporting member 400, the first contact surface 5201 of the first protruding plate 520 is in contact with the second limiting plate 460, the second contact surface is in contact with the first limiting plate 450, the left side surface of the first supporting member 400 is in contact with the first side surface 5103, and the third contact surface 5202 of the first protruding plate 520 is in contact with the first connecting surface 4201, so that the connection and fixation of the first supporting member 400 and the second supporting member 500 are realized.

Fig. 22 is a schematic diagram of a first emission light path in an optical module according to an embodiment of the present application, and fig. 23 is a schematic diagram of a second emission light path in an optical module according to an embodiment of the present application. As shown in fig. 22 and 23, the light emitting device further includes a first optical multiplexer 501, a second optical multiplexer 502, and a lens assembly, where the first optical multiplexer 501 and the second optical multiplexer 502 are disposed side by side on the front surface of the second support 500, the first optical multiplexer 501 is located in the light emitting direction of the first laser array 401, and the first optical multiplexer 501 is used for multiplexing the 4 paths of collimated light output by the first collimating lens array 402 into a first composite light. The second optical multiplexer 502 is located in the light emitting direction of the second laser array 403, and the second optical multiplexer 502 is configured to multiplex the 4 paths of collimated light output by the second collimating lens array 404 into a second composite light.

The lens assembly includes a first lens 504 and a second lens 506, the first lens 504 and the second lens 506 are disposed on the front surface of the main board 510 in the second supporting member 500, the first lens 504 is disposed opposite to the first light-passing hole 5601, and the first lens 504 is located in the light-emitting direction of the first optical multiplexer 501, and the first composite light output by the first optical multiplexer 501 is directly transmitted through the first lens 504. The second lens 506 is located in the light emitting direction of the second optical multiplexer 502, the second composite light output by the second optical multiplexer 502 is reflected at the second lens 506, the reflected second composite light is sent to the first lens 504, the reflected second composite light is reflected again at the first lens 504, and the reflected second composite light and the first composite light transmitted through the first lens 504 are combined to output one path of composite light.

In some embodiments, when the first composite light emitted from the first optical multiplexer 501 is incident on the first lens 504, due to a change of the transmission medium, the first composite light is easy to be partially reflected at the light incident surface of the first lens 504, and the partially reflected first composite light may return to the first laser array 401 along the original path, so as to affect the light emitting performance of the first laser array 401.

In this way, the front surface of the main board 510 is further provided with the first isolator 503, where the first isolator 503 is located between the first lens 504 and the first optical multiplexer 501, and the first isolator 503 is used to isolate the part of the reflected light of the first composite light reflected at the first lens 504, so as to avoid the return of the reflected light to the first laser array 401, and ensure the light emitting performance of the first laser array 401.

Similarly, a second isolator 505 is further disposed on the front surface of the main board 510, where the second isolator 505 is located between the second optical multiplexer 502 and the second lens 506, and the second isolator 505 is used to isolate a part of reflected light reflected by the second composite light at the second lens 506, so as to avoid the reflected light from returning to the second laser array 403 in the original path, and ensure the light emitting performance of the second laser array 403.

In some embodiments, the first light hole 5601 is provided with the light window 610, and the first optical fiber adapter 600 is provided with the converging lens 620, so that the composite light output by the first lens 504 sequentially passes through the first light hole 5601 and the light window 610, and the transmitted composite light is converged and coupled to the first optical fiber adapter 600 by the converging lens 620, so as to realize the emission of the same-fiber multi-wavelength emitted light.

Fig. 24 is a cross-sectional view of a second support in an optical module according to an embodiment of the present application. As shown in fig. 24, a second side of the main board 510 is provided with a baffle 550, and the baffle 550 protrudes from the front surface 5101 and the back surface 5102 of the main board 510; the baffle 550 is provided with a mounting plate 560, and the mounting plate 560 is provided with a first light-passing hole 5601 and a second light-passing hole 5602, and the first light-passing hole 5601 and the second light-passing hole 5602 are located above the front surface of the main board 510. The first optical fiber adapter 600 is connected to the second support member 500 through the first light-passing hole 5601, so that the first optical fiber adapter 600 is connected to the second support member 500 through the first light-passing hole 5601.

The second fiber optic adapter 700 is connected to the second support 500 through the second light aperture 5602 such that the second fiber optic adapter 700 is positioned above the front face of the second support 500. Since the light receiving device is disposed at the rear surface of the second support 500 and the rear surface of the circuit board 300, the received light transmitted from the second optical fiber adapter 700 should be transmitted to the rear surface of the second support 500.

Since the second optical fiber adapter 700 is located above the front surface of the second supporting member 500, in order to transmit the received light transmitted by the second optical fiber adapter 700 from the front surface of the second supporting member 500 to the back surface of the second supporting member 500, the assembly plate 560 is provided with a light-transmitting slot, the light-transmitting slot does not penetrate through the assembly plate 560, and an opening is provided on a side of the light-transmitting slot facing the main board 510, a turning prism is disposed in the light-transmitting slot, the light incident surface of the turning prism corresponds to the second light-transmitting hole 5602, the light emergent surface of the turning prism is located below the back surface of the main board 510, so that the received light transmitted by the second optical fiber adapter 700 is emitted to the turning prism through the second light-transmitting hole 5602, the received light reflected by the turning prism is twice, and the received light reflected twice is located below the back surface of the main board 510.

Specifically, the light-passing grooves include a first light-passing groove 5603, a second light-passing groove 5604, and a third light-passing groove 5605, the second light-passing groove 5604 is located between the first light-passing groove 5603 and the third light-passing groove 5605, the first light-passing groove 5603 is located above the front surface of the main board 510, and the first light-passing groove 5603 is communicated with the second light-passing hole 5602; the third light-passing groove 5605 is located below the back surface of the main plate 510, and the third light-passing groove 5605 communicates with the first light-passing groove 5603 through the second light-passing groove 5604.

The light incident surface of the turning prism is located in the first light-transmitting groove 5603, the light emergent surface of the turning prism is located in the third light-transmitting groove 5605, so that the received light transmitted by the second optical fiber adapter 700 is incident into the light incident surface of the turning prism through the second light-transmitting hole 5602, the received light is reflected twice by the turning prism and then is emitted from the light emergent surface, and the emitted received light is located below the back surface of the main board 510.

Fig. 25 is an assembly schematic diagram of a circuit board, a first supporting member, a second supporting member, a light receiving device and an optical fiber adapter in an optical module according to an embodiment of the present application, fig. 26 is a schematic diagram of a light receiving path in an optical module according to an embodiment of the present application, and fig. 27 is a schematic diagram of a light receiving path in an optical module according to an embodiment of the present application. As shown in fig. 25, 26 and 27, the light receiving device further includes an optical demultiplexer 507, the optical demultiplexer 507 is disposed on the back surface of the main board 510, and an optical inlet of the optical demultiplexer 507 corresponds to the third optical slot 5605, so that the received light emitted from the turning prism 720 enters the optical demultiplexer 507, and the optical demultiplexer 507 demultiplexes one received light into multiple light beams.

The second optical fiber adapter 700 is located above the front surface of the second support member 500 through the second light through hole 5602, the collimating lens 710 is disposed in the second optical fiber adapter 700, the turning prism 720 is disposed in the light through groove, the light incident surface of the turning prism is opposite to the collimating lens 710, and the light emergent surface of the turning prism 720 is located below the back surface of the second support member 500, so that the received light transmitted by the second optical fiber adapter 700 is converted into collimated light by the collimating lens 710, and the collimated light is reflected to the back surface of the second support member 500 from the front surface of the second support member 500 through the turning prism 720.

The optical demultiplexer 507 is disposed on the back surface of the second support 500, the first collimating lens group 405, the first reflecting mirror 407, the second collimating lens group 406, and the second reflecting mirror 408 are disposed on the cover plate 480, the cover plate 480 is covered in the through hole 4101 of the first support 400, the first converging lens group 409 and the second converging lens group 4010 are fixed on the back surface of the circuit board 300 through support blocks, and the first detector group 320 and the second detector group 330 are disposed on the back surface of the circuit board 300.

In this way, the received light transmitted by the second optical fiber adapter 700 is converted into collimated light by the collimating lens 710, the collimated light is reflected by the turning prism 720 and then is injected into the optical demultiplexer 507, the optical demultiplexer 507 demultiplexes one path of received light into multiple paths of collimated light, the multiple paths of collimated light is respectively converted into multiple paths of collimated light by the first collimating lens group 405 and the second collimating lens group 406, the multiple paths of collimated light are reflected by the first reflecting mirror 407 and the second reflecting mirror 408 into multiple paths of reflected light on the back surface of the vertical circuit board 300, the multiple paths of reflected light are converged to the first detector group 320 and the second detector group 330 by the first converging lens group 409 and the second converging lens group 4010, and the multiple paths of light are converted into electric signals by the first detector group 320 and the second detector group 330.

In some embodiments, the electrical signals output by the first detector set 320 and the second detector set 330 are amplified by a transimpedance amplifier, the amplified electrical signals are transmitted to the DSP chip 310 through signal wires arranged on the back surface of the circuit board 300, the DSP chip 310 processes the electrical signals, and the processed electrical signals are transmitted to an upper computer through a golden finger, so that light reception is realized.

In some embodiments, since the first support 400 is a metal block, the second support 500 may also be a metal block in order to ensure the connection stability of the first support 400, the second support 500, the first fiber optic adapter 600 and the second fiber optic adapter 700.

The optical module provided by the embodiment of the application comprises a circuit board, a first supporting piece, a second supporting piece, a first optical fiber adapter, a second optical fiber adapter, a light emitting device and a light receiving device, wherein one end of the first supporting piece is connected with the circuit board, so that the first supporting piece is in supporting connection with the circuit board; the other end of the first supporting piece is inserted into one end of the second supporting piece, so that the first supporting piece is fixedly connected with the second supporting piece; the first optical fiber adapter is inserted into the other end of the second supporting piece and is used for emitting signal light, namely, the light emitted by the light emitting device is emitted out through the first optical fiber adapter; the second optical fiber adapter is inserted into the other end of the second supporting piece and is used for transmitting received light, namely, external received light is transmitted to the second supporting piece through the second optical fiber adapter; the light emitting device comprises a laser component, a light multiplexer and a lens component, wherein the laser component is arranged on the front surface of the first supporting piece and is electrically connected with the circuit board for generating emitted light; the optical multiplexer and the lens component are arranged on the front surface of the second supporting piece and are used for multiplexing and reflecting and converging the emitted light to the first optical fiber adapter, so that the light emitting device is directly arranged on the first supporting piece and the second supporting piece, and a BOX packaging structure of the light emitting device can be omitted; the light receiving device comprises a turning prism, an optical demultiplexer, a reflecting mirror and a detector assembly, wherein the turning prism is arranged on the second supporting piece and is used for reflecting received light transmitted by the second optical fiber adapter from the front surface to the back surface of the second supporting piece so as to change the transmission direction of the received light; the optical demultiplexer is arranged on the back surface of the second supporting piece and is used for demultiplexing the reflected received light into multiple paths of light splitting; be provided with the through-hole on the first support piece, the speculum is located the through-hole, and the detector module sets up on the back of circuit board, and multichannel beam split is reflected to the detector module through the speculum, can realize the receipt of light, and so light receiving device arranges in on first support piece, second support piece, the circuit board, can save the BOX packaging structure of light receiving device.

According to the application, the first supporting piece and the second supporting piece are additionally arranged, the first supporting piece is in supporting connection with the circuit board, the second supporting piece is fixedly connected with the first supporting piece, the second supporting piece and the circuit board form a carrier, and the light emitting device and the light receiving device are directly arranged on the carrier, so that a BOX packaging structure of the light emitting device and the light receiving device can be omitted, the number of packaging structural members is reduced, the ineffective space in the optical module is reduced, and the miniaturization and high-density integration development of the optical module are facilitated.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, comprising:

2. The optical module of claim 1, wherein the first support comprises a first support surface and a second support surface, the first support surface being recessed from the second support surface, the first support surface supporting and securing the circuit board, the laser assembly being disposed on the second support surface.

3. The optical module of claim 2, wherein the front surface of the circuit board protrudes from the second supporting surface, and the wire bonding height of the laser assembly is flush with the front surface of the circuit board.

4. A light module as recited in claim 3, wherein a second connection surface is provided between the first support surface and the second support surface, the first support surface being connected to the second support surface by the second connection surface, one end of the circuit board being in abutment with the second connection surface.

5. The optical module according to claim 2, wherein an opening is arranged on one side of the through hole facing away from the second supporting surface, a connecting plate is arranged in the opening, and the connecting plate is connected with two side walls of the opening;

the front surface of the connecting plate is recessed in the first supporting surface, and the back surface of the connecting plate is flush with the back surface of the first supporting piece.

6. The optical module of claim 5, wherein a transimpedance amplifier is further disposed on the back side of the circuit board, one end of the transimpedance amplifier is electrically connected to the detector assembly, and the other end of the transimpedance amplifier is electrically connected to the signal trace;

the signal wiring is arranged in a gap between the back surface of the circuit board and the front surface of the connecting plate.

7. The optical module of claim 6, wherein a boss is disposed in the through hole, the boss extends from a sidewall of the through hole toward the connecting plate, and the detector assemblies are disposed on both sides of the boss, respectively.

8. The light module of claim 1 further comprising a collimating lens group and a mirror, the collimating lens group disposed on a back surface of the first support at the edge of the through hole for converting received light on the back surface of the first support into collimated light;

The reflector is fixedly connected with the collimating lens and is used for reflecting the collimated light to the detector assembly.

9. The light module of claim 1 wherein the first support member is a metal member.