CN118020156A

CN118020156A - Display device including display module and method for manufacturing the same

Info

Publication number: CN118020156A
Application number: CN202280063680.4A
Authority: CN
Inventors: 洪淳珉; 李泽模; 金键佑; 申星焕
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2022-02-03
Filing date: 2022-12-28
Publication date: 2024-05-10

Abstract

According to the idea of the present disclosure, a display module includes: a substrate having a mounting surface on which a plurality of inorganic light emitting diodes are mounted and on which a TFT layer is formed, four side surfaces, and a rear surface opposite to the mounting surface; a side wiring electrically connected to the TFT layer and extending along a pair of the four side surfaces; a front cover coupled to the mounting surface in a first direction and covering the mounting surface; a metal plate bonded to the rear surface; a side cover covering the side wiring and the side surface; and a side member provided on a side of the side cover and grounded to the metal plate, wherein the side member is provided on only one of a pair of side surfaces along which the side wiring extends among the four side surfaces.

Description

Display device including display module and method for manufacturing the same

Technical Field

The present disclosure relates to a display device for displaying images by coupling a module in which a self-emitting inorganic light emitting diode is mounted on a substrate.

Background

The display device is an output device for visually displaying image and data information (e.g., characters, figures, etc.).

In general, as a display device, a liquid crystal panel including a backlight, or an Organic Light Emitting Diode (OLED) panel configured with an organic compound film that emits light by itself in response to a current has been widely used. However, the liquid crystal panel has a slow response time, high power consumption, and requires a backlight since it does not emit light itself. Therefore, it is difficult to reduce the size of the liquid crystal panel. In addition, the OLED panel does not require a backlight and can achieve a thin thickness because the OLED panel itself emits light. However, the OLED panel is susceptible to a burn-in phenomenon, i.e., when the OLED panel displays the same picture for a long time, since the life cycle of the sub-pixels is short, certain regions of the picture remain unchanged even after the picture is changed to another picture. For these reasons, as a new panel for replacing the liquid crystal panel and the OLED panel, a micro light emitting diode (micro LED or μled) panel in which an inorganic light emitting diode is mounted on a substrate and the inorganic light emitting diode itself is used as a pixel is being studied.

The micro light emitting diode panel (hereinafter referred to as micro LED panel) is a flat display panel configured with a plurality of inorganic LEDs each having a size of 100 micrometers or less.

Although the micro LED panel is a self-emission light emitting device, the micro LED panel does not cause a burn-in phenomenon of the OLED like an organic light emitting diode, and is excellent in brightness, resolution, power consumption, and durability.

Micro LED panels provide higher contrast, faster response time, and higher energy efficiency than LCD panels that require backlighting. Although both the organic LED and the micro LED, which is an inorganic light emitting diode, have higher energy efficiency, the micro LED has better brightness, luminous efficiency, and life cycle than the OLED.

Further, by arranging LEDs in units of pixels on a circuit board, substrate-level display modularization can be achieved, and various resolutions and screen sizes can be achieved according to consumer orders.

Disclosure of Invention

Technical problem

Provided are a display device and a method of manufacturing the same, and technical features related to electrostatic protection of a display module suitable for amplification and a display device including the same.

Technical proposal

According to an aspect of the present disclosure, a display module includes: a substrate having a mounting surface on which a plurality of inorganic light emitting diodes are mounted and on which a TFT layer is formed, four side surfaces, and a rear surface opposite to the mounting surface; a side wiring electrically connected to the TFT layer and extending along a first pair of side surfaces of the four side surfaces of the substrate; a front cover covering the TFT layer and the plurality of inorganic light emitting devices in a first direction; a metal plate disposed on a rear surface of the substrate; a side cover covering the side wiring and the four side surfaces; and a side member provided on a side of the side cover and grounded to the metal plate, wherein the side member is provided on a first side surface of a first pair of side surfaces along which the side wiring extends among the four side surfaces.

The side member may include: a first side member disposed on a first side surface of a first pair of side surfaces along which the side wiring extends; and a second side member provided on a second side surface of a second pair of side surfaces along which the side wiring does not extend among the four side surfaces.

The first side member and the second side member may be integrally formed as one piece and extend along the first side surface and the second side surface.

The side wirings may extend along four side surfaces, and the side members are disposed on a first side surface of a first pair of side surfaces and a second side surface of a second pair of side surfaces of the four side surfaces.

The side members located on the first side surface and the second side surface may be integrally formed as one body.

The electrical conductivity of the side member may be greater than that of the side cover.

The side member may be black in color.

The side members may comprise a metallic material.

According to an aspect of the present disclosure, a display device includes: a plurality of display modules arranged in an m×n matrix; and a frame configured to support a plurality of display modules, wherein each of the plurality of display modules includes: a substrate having a mounting surface on which a plurality of inorganic light emitting diodes are mounted and on which a TFT layer is formed, four side surfaces, and a rear surface opposite to the mounting surface; a side wiring electrically connected to the TFT layer and extending along a first pair of the four side surfaces; a front cover covering the plurality of inorganic light emitting diodes and the TFT layer in a first direction; a metal plate disposed on the rear surface; a side cover covering the side wiring and the four side surfaces; and a side member provided on a side of the side cover and grounded to the metal plate, and wherein the side member is provided on a first side surface of a first pair of side surfaces along which the side wiring extends among the four side surfaces.

The plurality of display modules may include a first display module and a second display module adjacent to the first display module in a direction in which the side wiring of the first display module extends, and the side member of the first display module may contact a second side surface of the second display module among the first pair of side surfaces along which the side wiring of the second display module extends, and the side member of the second display module is not disposed on the second side surface of the second display module.

The first display module may be positioned such that a second side surface of the first pair of side surfaces along which the side wiring extends is adjacent to an edge of the frame, and the side member is not located on the second side surface, and the frame may include a frame side member surrounding the second side surface of the first display module of the first pair of side surfaces along which the side wiring extends.

The frame side members may extend along edges of the frame.

Each of the plurality of display modules may be positioned such that a side surface on which the first side member and the second side member are not located among the four side surfaces is adjacent to an edge of the frame, respectively, and the frame may include a frame side member surrounding a side surface of each of the plurality of display modules on which the first side member and the second side member are not disposed.

The side wiring may extend along one and the other of the four side surfaces, and the side member may be additionally positioned on the side surface of the one and the other of the side surfaces.

The side member on the side surface of one of the pair of side surfaces and the side member on the side surface of the other pair of side surfaces may be integrated.

The first display module may be positioned such that side surfaces of the four side surfaces on which the side members are not positioned are adjacent to edges of the frame, respectively, and the frame may include frame side members configured to surround the side surfaces of the first display module on which the side members are not positioned.

The frame may be formed of a metallic material.

According to the concepts of the present disclosure, a display device includes: a display module array in which a plurality of display modules are horizontally arranged in an m×n matrix form; and a frame configured to support a plurality of display modules, wherein each of the plurality of display modules includes: a substrate including a mounting surface on which a plurality of inorganic light emitting diodes are mounted and on which a TFT layer is formed, four side surfaces, and a rear surface opposite to the mounting surface; a side wiring electrically connected to the TFT layer and extending along a pair of the four side surfaces; a front cover adhered to the mounting surface and covering the mounting surface in a first direction; a metal plate adhered to the rear surface; a side cover surrounding the side wiring and the side surface; and a side member grounded to the metal plate, wherein the side member is positioned on a side surface of a pair of side surfaces along which the side wiring lines extend among the four side surfaces, at least one display module among the plurality of display modules is positioned such that the side surface of the pair of side surfaces along which the side wiring lines extend is adjacent to an edge of the frame, wherein the side member is not positioned on the side surface, and the frame includes a frame side member configured to surround the side surface of at least one display module among the plurality of display modules of the pair of side surfaces along which the side wiring lines extend, wherein the side member is not positioned on the side surface of the at least one display module.

Advantageous effects

The display device according to the embodiments of the present disclosure may be sealed by the front cover of each display module in the forward direction, the side cover on the side surface of the display module, and the metal plate on the rear side of the display module, and may improve ESD withstand voltage of the display device by the side member additionally positioned on the side surface of the display module and grounded to the metal plate, preventing electrostatic discharge that may occur in the display module when the display module is manufactured and transported and after the display module is assembled into the display device.

The display device according to the embodiments of the present disclosure may have a seamless effect in which a seam between display modules is not visible by improving the arrangement of side members of the display modules to reduce a gap between the display modules.

Drawings

Fig. 1 illustrates a display device according to an embodiment of the present disclosure;

FIG. 2 is an exploded view of the major components of the display device of FIG. 1;

FIG. 3 is an enlarged cross-sectional view of some of the components of the display module shown in FIG. 1;

FIG. 4 is a rear perspective view of a display module of the display device shown in FIG. 1;

FIG. 5 is a perspective view of some components of the display module shown in FIG. 1;

FIG. 6 is a cross-sectional view showing some of the components of the display device of FIG. 1 in a third direction;

FIG. 7 is an enlarged cross-sectional view of some of the components shown in FIG. 6;

FIG. 8 schematically illustrates a front side of some components of the display device of FIG. 1;

FIG. 9 is a perspective view of some components of a display module according to another embodiment of the present disclosure;

fig. 10 is a cross-sectional view showing some components of a display device in a second direction according to another embodiment of the present disclosure;

FIG. 11 is an enlarged cross-sectional view of some of the components shown in FIG. 10; and

Fig. 12 schematically illustrates a front side of some components of a display device according to another embodiment of the present disclosure.

Detailed Description

The embodiments described in the present specification are merely examples of the present disclosure, and thus it should be understood that various equivalents or modified examples are included within the scope of the present disclosure.

It is to be understood that, as used in the following description, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. In the drawings, the shape, size, etc. of components are more or less exaggerated for easy understanding.

It will be understood that the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, figures, steps, operations, components, elements, or combinations thereof, but do not preclude the presence or addition of one or more other features, figures, steps, operations, components, elements, or groups thereof.

In addition, the meaning of "the same" in this specification includes that the attributes are similar or similar within a certain range. Furthermore, "identical" means "substantially identical". The meaning of "substantially identical" should be interpreted as having values that fall within the range of manufacturing errors or values that correspond to differences that fall within a nonsensical range relative to the reference values are included within the scope of "identical".

Hereinafter, example embodiments of the present disclosure will be described with reference to the accompanying drawings.

Fig. 1 illustrates a display device according to an embodiment of the present disclosure, fig. 2 is an exploded view illustrating major components of the display device of fig. 1, fig. 3 is an enlarged cross-sectional view of some components of the display module illustrated in fig. 1, fig. 4 is a rear perspective view of the display module of the display device illustrated in fig. 1, and fig. 5 is a perspective view of some components of the display module illustrated in fig. 1.

The components of the display device 1 including the plurality of inorganic light emitting diodes 50 shown in the drawings are components in micro units having a size of several μm to several hundred micrometers (μm), and the sizes of some components (the plurality of inorganic light emitting diodes 50, the black matrix 48, etc.) shown in the drawings are exaggerated for convenience of description.

The display apparatus 1 is a device that displays information, materials, data, and the like as characters, figures, charts, images, and the like, and may be implemented as a Television (TV), a Personal Computer (PC), a mobile device, a digital signage, and the like.

According to an embodiment of the present disclosure, as shown in fig. 1 and 2, the display apparatus 1 may include a display panel 20 for displaying an image, a power source for supplying power to the display panel 20, a main board 25 for controlling an overall operation of the display panel 20, a frame 15 supporting the display panel 20, and a rear cover 10 covering a rear surface of the frame 15.

The display panel 20 may include a plurality of display modules 30A to 30P, a driving board for driving the respective display modules 30A to 30P, and a Timing Controller (TCON) board for generating timing signals required to control the respective display modules 30A to 30P.

The rear cover 10 may support the display panel 20. The rear cover 10 may be mounted on the floor by a bracket or may be mounted on a wall by a hook.

The plurality of display modules 30A to 30P may be arranged adjacent to each other in a top-to-bottom direction and a left-to-right direction. The plurality of display modules 30A to 30P may be arranged in an mxn matrix. In the present embodiment, sixteen display modules 30A to 30P are arranged in a 4×4 matrix form, but there is no limitation on the number and arrangement of the plurality of display modules 30A to 30P.

For example, the plurality of display modules 30A to 30P according to the embodiments of the present disclosure may include the first display module 30A positioned at uppermost and leftmost positions. The plurality of display modules 30B to 30P may be arranged in a right direction or a lower direction with respect to the first display module 30A.

The plurality of display modules 30A to 30P may be mounted on the frame 15 by various known methods (e.g., magnetic force using a magnet, mechanical insertion structure, etc.). The rear cover 10 may be coupled with the rear side of the frame 15, and the rear cover 10 may form the rear appearance of the display device 1.

The rear cover 10 may include a metal material. Accordingly, heat generated from the plurality of display modules 30A to 30P and the frame 15 can be easily transferred to the rear cover 10 to improve heat dissipation efficiency of the display device 1.

In this way, the display apparatus 1 according to the embodiment of the present disclosure can realize a large screen by tiling the plurality of display modules 30A to 30P.

Alternatively, each of the plurality of display modules 30A to 30P may be applied to a display device. That is, the display modules 30A to 30P may be mounted in a unit of a single piece and applied to a wearable device, a portable device, or various electronic products or electronic parts that need to be displayed. In addition, as in the embodiments of the present disclosure, the display modules 30A to 30P may be applied to a display device, such as a PC monitor, a high resolution TV, a signage, an electronic display, or the like, by being assembled and arranged in a matrix form.

The plurality of display modules 30A to 30P may have the same configuration. Accordingly, the following description of any one display module will apply in the same manner to all other display modules.

Hereinafter, since the plurality of display modules 30A to 30P have the same configuration, the plurality of display modules 30A to 30P will be described based on the first display module 30A.

That is, in order to avoid repetitive description, the configuration of the plurality of display modules 30A to 30P will be described by representatively using the display module 30, the substrate 40, and the front cover 70.

Further, the first display module 30A of the plurality of display modules 30A to 30P, the third display module 30E adjacent to the first display module 30A in the second direction Y, or the second display module 30B adjacent to the first display module 30A in the third direction Z will be described as needed.

In addition, the following will be described as needed: a fifth display module 30I adjacent to the third display module 30E in the second direction Y and opposite to the first display module 30A with respect to the third display module 30E, a seventh display module 30M adjacent to the fifth display module 30I and opposite to the third display module 30E with respect to the fifth display module 30I, a fourth display module 30C adjacent to the second display module 30B in the third direction Z and opposite to the first display module 30A with respect to the second display module 30B, and a sixth display module 30D adjacent to the fourth display module 30C in the third direction Z and opposite to the second display module 30B with respect to the fourth display module 30C.

The first display module 30A of the plurality of display modules 30A to 30P may be formed in, for example, a quadrangular type. The first display module 30A may be set to a rectangular type or a square type.

Accordingly, the first display module 30A may include edges 31, 32, 33, and 34 positioned in the upper, lower, left, and right directions with respect to the first direction X, which is the front direction.

As shown in fig. 3, each of the plurality of display modules 30A to 30P may include a substrate 40 and a plurality of inorganic light emitting diodes 50 mounted on the substrate 40. A plurality of inorganic light emitting diodes 50 may be mounted on the mounting surface 41 of the substrate 40 toward the first direction X. In fig. 3, the thickness of the substrate 40 in the first direction X is exaggerated for convenience of description.

The substrate 40 may be formed in a quadrangular type. As described above, each of the plurality of display modules 30A to 30P may be provided in a quadrangular type, and the substrate 40 may be correspondingly formed in a quadrangular type.

The substrate 40 may be provided in a rectangular type or a square type.

Accordingly, the substrate 40 may include four edges E corresponding to the edges 31, 32, 33, and 34 of the first display module 30A, which are positioned in an upper direction, a lower direction, a left direction, and a right direction with respect to the first direction X as a front direction (see fig. 5).

The first display module 30A may include a right edge 31, an upper edge 32, a left edge 33, and a lower edge 34 with respect to a first direction X, which is a front direction of a screen displaying the first display module 30A. The right edge 31 may be opposite to the left edge 33 in a second direction Y, which is a left-right direction, and the upper edge 32 may be opposite to the lower edge 34 in a third direction Z, which is an up-down direction.

The substrate 40 may include a substrate body 42, a mounting surface 41 forming one surface of the substrate body 42, a rear surface 43 forming the other surface of the substrate body 42 and opposite to the mounting surface 41, and a side surface 45 positioned between the mounting surface 41 and the rear surface 43.

The side surfaces 45 may form sides of the substrate 40 in the second direction Y and the third direction Z orthogonal to the first direction X.

The substrate 40 may include a chamfer portion 49 formed between the mounting surface 41 and the side surface 45 and between the rear surface 43 and the side surface 45.

The chamfer portion 49 can prevent the plurality of display modules 30A to 30P from being damaged by collision with each other at the time of arrangement.

Each edge E of the substrate 40 may include a side surface 45 and a chamfer portion 49.

The substrate 40 may include a Thin Film Transistor (TFT) layer 44 formed on the substrate body 42 to drive the inorganic light emitting diode 50. The substrate body 42 may include a glass substrate. That is, the substrate 40 may include a Chip On Glass (COG) substrate. On the substrate 40, a first pad electrode 44a and a second pad electrode 44b may be formed to electrically connect the inorganic light emitting diode 50 with the TFT layer 44.

The TFTs constituting the TFT layer 44 are not limited to a specific structure or type, and may be configured as various embodiments. That is, the TFT of the TFT layer 44 according to the embodiment of the present disclosure may be implemented as a Low Temperature Polysilicon (LTPS) TFT, an oxide TFT, a Si (polysilicon or amorphous silicon) TFT, an organic TFT, or a graphene TFT.

Further, in the case where the substrate body 42 of the substrate 40 is provided as a silicon wafer, the TFT layer 44 may be replaced with a Complementary Metal Oxide Semiconductor (CMOS) type, an n-type MOSFET, or a p-type MOSFET transistor.

The plurality of inorganic light emitting diodes 50 may be formed of an inorganic material, and may include inorganic light emitting diodes each having a size of several μm to several tens of μm in width, length, and height. The shorter sides of the micro-inorganic light emitting device may have a length of 100 μm or less in width, length, and height. That is, the inorganic light emitting diode 50 may be picked up from a sapphire or silicon wafer and directly transferred onto the substrate 40. The plurality of inorganic light emitting diodes 50 may be picked up and transferred by an electrostatic method using an electrostatic head or a stamp (stamp) method using an elastic polymer material (e.g., PDMS or silicon) as a head.

Each of the plurality of inorganic light emitting diodes 50 may be a light emitting structure including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57 b.

For example, any one of the first contact electrodes 57a may be electrically connected to the second contact electrode 57b and the n-type semiconductor 58a, and the other one of the first contact electrodes 57a may be electrically connected to the p-type semiconductor 58 b.

The first contact electrode 57a and the second contact electrode 57b may be horizontally positioned, and may be of a flip chip type arranged toward the same direction (opposite direction to the light emitting direction).

Each of the inorganic light emitting devices 50 may have a light emitting surface 54 positioned toward the first direction X when mounted on the mounting surface 41, a side surface 55, and a bottom surface 56 opposite to the light emitting surface 54, wherein the first and second contact electrodes 57a and 57b may be formed on the bottom surface 56.

That is, the first contact electrode 57a and the second contact electrode 57b of the inorganic light emitting device 50 may be positioned on opposite sides of the light emitting surface 54, i.e., in opposite directions to the light emitting direction.

The first contact electrode 57a and the second contact electrode 57b may face the mounting surface 41 and be electrically connected with the TFT layer 44, wherein the light emitting surface 54 from which light is emitted may be positioned in a direction opposite to the direction in which the contact electrodes 57a and 57b are positioned.

Therefore, when light generated from the active layer 58c is irradiated in the first direction X through the light emitting surface 54, the light may be irradiated toward the first direction X without any interference of the first contact electrode 57a or the second contact electrode 57 b.

That is, the first direction X may be defined as a direction in which the light emitting surface 54 is positioned to irradiate light.

The first and second contact electrodes 57a and 57b may be electrically connected to the first and second pad electrodes 44a and 44b, respectively, formed on the mounting surface 41 of the substrate 40.

The inorganic light emitting device 50 may be directly connected to the first and second pad electrodes 44a and 44b through a bonding member such as an anisotropic conductive layer 47 or solder.

An anisotropic conductive layer 47 may be formed on the substrate 40 to mediate (mediate) electrical bonding between the first and second contact electrodes 57a and 57b and the first and second pad electrodes 44a and 44 b. The anisotropic conductive layer 47 may be formed by attaching an anisotropic conductive adhesive on the protective film, and has a structure in which conductive balls 47a are dispersed in an adhesive resin. Each conductive ball 47a may be a conductive sphere surrounded by a thin insulating film, and electrically connects one conductor with the other conductor due to the pressure to break the insulating film.

The anisotropic conductive layer 47 may include a film type Anisotropic Conductive Film (ACF) and a paste type Anisotropic Conductive Paste (ACP).

According to an embodiment of the present disclosure, the anisotropic conductive layer 47 may be provided as an anisotropic conductive film.

Accordingly, when a plurality of inorganic light emitting diodes 50 are mounted on the substrate 40, the insulating film of the conductive balls 47a may be broken by the pressure applied to the anisotropic conductive layer 47, and thus, the first and second contact electrodes 57a and 57b of the inorganic light emitting diodes 50 may be electrically connected with the first and second pad electrodes 44a and 44b of the substrate 40.

However, the plurality of inorganic light emitting diodes 50 may be mounted on the substrate 40 by solder instead of the anisotropic conductive layer 47. After the inorganic light emitting diode 50 is disposed on the substrate 40, a reflow process may be performed to bond the inorganic light emitting diode 50 with the substrate 40.

The plurality of inorganic light emitting diodes 50 may include a red light emitting device 51, a green light emitting device 52, and a blue light emitting device 53, and the inorganic light emitting diodes 50 may be mounted on the mounting surface 41 of the substrate 40 by grouping a series of the red light emitting device 51, the green light emitting device 52, and the blue light emitting device 53 into one unit. A series of the red light emitting device 51, the green light emitting device 52, and the blue light emitting device 53 may form one pixel. In this case, the red light emitting device 51, the green light emitting device 52, and the blue light emitting device 53 may form sub-pixels, respectively.

As in the current embodiment of the present disclosure, the red light emitting device 51, the green light emitting device 52, and the blue light emitting device 53 may be arranged in a line at preset intervals, or may be arranged in other types (e.g., a triangle type).

The substrate 40 may include a light absorbing layer 44c for absorbing external light to improve contrast. The light absorbing layer 44c may be formed on the entire mounting surface 41 of the substrate 40. The light absorbing layer 44c may be formed between the TFT layer 44 and the anisotropic conductive layer 47.

The plurality of display modules 30A to 30P may further include a black matrix 48 formed between the plurality of inorganic light emitting diodes 50.

The black matrix 48 may function to supplement the light absorbing layer 44c formed on the entire mounting surface 41 of the substrate 40. That is, the black matrix 48 may absorb external light so that the substrate 40 is displayed in black, thereby improving contrast of the screen.

The black matrix 48 may have black.

In the current embodiment of the present disclosure, the black matrix 48 may be positioned between pixels, each formed of a series of red, green, and blue light emitting devices 51, 52, and 53. However, unlike the current embodiment of the present disclosure, the black matrix 48 may be more finely formed in such a manner as to separate the red light emitting device 51, the green light emitting device 52, and the blue light emitting device 53 as sub-pixels.

The black matrix 48 may be formed in a lattice type having a horizontal pattern and a vertical pattern to be positioned between pixels.

The black matrix 48 may be formed by applying a light absorbing ink onto the anisotropic conductive layer 47 through an inkjet process and then hardening the light absorbing ink, or the black matrix 48 may be formed by coating the anisotropic conductive layer 47 with a light absorbing film.

That is, the black matrix 48 may be formed at a region between the plurality of inorganic light emitting diodes 50 on the anisotropic conductive layer 47 formed on the entire mounting surface 41, where the plurality of inorganic light emitting diodes 50 are not mounted.

Each of the plurality of display modules 30A to 30P may include a front cover 70, the front cover 70 being positioned on the mounting surface 41 in the first direction X to cover the mounting surface 41 of the display module 30A to 30P.

The plurality of front covers 70 may be formed on the plurality of display modules 30A to 30P, respectively, in the first direction X (see fig. 6 and 7).

After forming the respective front covers 70, a plurality of display modules 30A to 30P may be assembled. That is, in an example of the first display module 30A and the second display module 30B among the plurality of display modules 30A to 30P, the first front cover 70A may be formed on the mounting surface 41 of the first display module 30A, and the second front cover 70B may be formed on the mounting surface 41 of the second display module 30B.

The front cover 70 may cover the substrate 40 to protect the substrate 40 from external force or external moisture.

The layers of the front cover 70 may be provided as a functional film having optical properties. The details of this will be described below.

A portion of the plurality of layers of the front cover 70 may include a base layer formed of optically transparent resin (OCR). The base layer may support a plurality of other layers. OCR can be in a very transparent state with a transmittance of 90% or higher.

OCR can improve visibility and image quality by improving transmissivity through low reflection characteristics. That is, in a structure having an air gap, light loss may occur due to a difference between reflectances of a film layer and an air layer, whereas in a structure using OCR, light loss may be reduced by a small difference between reflectances, thereby improving visibility and image quality.

That is, OCR can protect the substrate 40 while improving image quality.

In the front cover 70, a portion of the plurality of layers may include an adhesive layer for adhering the front cover 70 to the mounting surface 41 of the substrate 40.

The front cover 70 may have a predetermined height or more in the first direction X in which the mounting surface 41 or the light emitting surface 54 faces.

The reason may be to sufficiently fill gaps that may be formed between the front cover 70 and the plurality of inorganic light emitting diodes 50 when the front cover 70 is formed on the substrate 40.

Each of the plurality of display modules 30A to 30P may include a metal plate 60 positioned on the rear surface 43 of the substrate 40.

Further, each of the plurality of display modules 30A to 30P may include a rear adhesive tape 61 positioned between the rear surface 43 and the metal plate 60 to adhere the metal plate 60 to the rear surface 43 of the substrate 40.

The rear adhesive tape 61 may be a double-sided adhesive tape, but is not limited thereto. However, an adhesive layer may be provided instead of the tape. That is, the rear adhesive tape 61 may be an embodiment of a medium for adhering the metal plate 60 to the rear surface 43 of the substrate 40, and may be one of various mediums, not limited to a tape.

The plurality of inorganic light emitting diodes 50 may be electrically connected to an upper wiring layer extending from the pixel driving wiring formed on the mounting surface 41 through the side surface 45 of the substrate 40, the upper wiring layer being formed as the pixel driving wiring.

The upper wiring layer may be formed under the anisotropic conductive layer 47. The upper wiring layer may be electrically connected to side wirings 46 formed on the side surface 45 of the substrate 40. The side wiring 46 may be provided as a thin film type. The side wiring 46 may include a coating member 46a surrounding the side wiring 46 to prevent the side wiring 46 exposed to the outside from being damaged (see fig. 7).

The side wiring 46 may extend in the third direction Z along the chamfer portion 49 of the substrate 40 and the side surface 45 to the rear surface 43 of the substrate 40. That is, the side wiring 46 may extend from the upper edge 32 and the lower edge 34 to the rear surface 43 of the substrate 40 along the chamfer portion 49 and the side surface 45 of the substrate 40.

The upper wiring layer may be connected to the side wirings 46 through upper connection pads formed at each edge E of the substrate 40.

The side wiring 46 may extend along the side surface 45 of the substrate 40 and be connected with the rear wiring layer 43b formed on the rear surface 43.

On the rear wiring layer 43b, an insulating layer 43c may be formed in a direction in which the rear surface 43 of the substrate 40 faces to cover the rear wiring layer 43b.

That is, the plurality of inorganic light emitting diodes 50 may be electrically connected to the upper wiring layer, the side wiring 46, and the rear wiring layer 43b in sequence.

In addition, as shown in fig. 4, the display module 30A may include a driving circuit board 80 for electrically controlling the plurality of inorganic light emitting diodes 50 mounted on the mounting surface 41. The driving circuit board 80 may be a printed circuit board. The driving circuit board 80 may be positioned on the rear surface 43 of the substrate 40 in the first direction X. The driving circuit board 80 may be positioned on the metal plate 60 adhered on the rear surface 43 of the substrate 40.

The display module 30A may include a flexible film 81 connecting the driving circuit board 80 with the rear wiring layer 43b to electrically connect the driving circuit board 80 with the plurality of inorganic light emitting diodes 50.

More specifically, one end of the flexible film 81 may be connected with the rear connection pad 43d positioned on the rear surface 43 of the substrate 40 and electrically connected with the plurality of inorganic light emitting diodes 50.

The rear connection pad 43d may be electrically connected with the rear wiring layer 43 b. Accordingly, the rear connection pad 43d can electrically connect the rear wiring layer 43b with the flexible film 81.

The flexible film 81 may be electrically connected with the rear connection pads 43d to transmit power and electric signals from the driving circuit board 80 to the plurality of inorganic light emitting diodes 50.

The flexible film 81 may be a Flexible Flat Cable (FFC), a Chip On Film (COF), or the like.

The flexible film 81 may include a first flexible film 81a and a second flexible film 81b positioned in upper and lower directions with respect to a first direction X as a front direction.

The first flexible film 81a and the second flexible film 81b may be positioned in at least two of a left direction and a right direction or an upper direction, a lower direction, a left direction and a right direction with respect to the first direction X, but are not limited thereto.

A plurality of second flexible films 81b may be provided, but is not limited thereto. However, the second flexible film 81b may be provided as a single piece, and a plurality of first flexible films 81a may also be provided.

The first flexible film 81a may transmit a data signal from the driving circuit board 80 to the substrate 40. The first flexible film 81a may be a COF.

The second flexible film 81b may transmit power from the driving circuit board 80 to the substrate 40. The second flexible film 81b may be an FFC.

However, the first flexible film 81a and the second flexible film 81b may be formed inversely.

The driving circuit board 80 may be electrically connected with the main board 25 (see fig. 2). The main board 25 may be positioned behind the frame 15, and the main board 25 may be connected to the driving circuit board 80 through a cable behind the frame 15.

On the rear surface of the metal plate 60, a fixing member 82 for adhering the display modules 30A to 30P to the frame 15 may be positioned. The fixing member 82 may be a double-sided tape. The metal plate 60 forming the rear side of the display modules 30A to 30P may be directly adhered to the frame 15 by the fixing member 82 such that the display modules 30A to 30P are supported by the frame 15.

As described above, the metal plate 60 may be in contact with the substrate 40. The metal plate 60 may be adhered to the substrate 40 by a rear adhesive tape 61 positioned between the rear surface 43 of the substrate 40 and the metal plate 60.

Fig. 5 shows the substrate 40, omitting some components such as the anisotropic conductive layer 47 for convenience of description. Further, the side wiring 46 may include a coating member 46a for protecting the side wiring 46 from the outside, and the coating member 46a is omitted for convenience of description.

The metal plate 60 may be formed of a metal material having high thermal conductivity. For example, the metal plate 60 may be formed of an aluminum material.

Heat generated from the TFT layer 44 and the plurality of inorganic light emitting diodes 50 mounted on the substrate 40 may be transferred to the metal plate 60 along the rear surface 43 of the substrate 40 through the rear adhesive tape 61.

Accordingly, heat generated from the substrate 40 can be easily transferred to the metal plate 60 to prevent the temperature of the substrate 40 from rising to a preset temperature or higher.

The plurality of display modules 30A to 30P may be arranged at respective positions in an mxn matrix form. The respective display modules 30A to 30P can be independently moved. In this case, each of the display modules 30A to 30P may include a metal plate 60 to maintain a certain level of heat dissipation performance regardless of the positions of the display modules 30A to 30P.

The plurality of display modules 30A to 30P may be arranged in various m×n matrix forms to realize various screen sizes of the display apparatus 1. Accordingly, the overall heat dissipation performance of the display device 1 can be improved to a greater extent by including the metal plate 60 in each of the display modules 30A to 30P to dissipate heat from the respective display modules 30A to 30P (as in the embodiments of the present disclosure) than by a single metal plate provided for temporary heat dissipation.

In the case where a single metal plate is positioned inside the display device 1, the metal plate may not exist at a position corresponding to the position of some display modules in the front-rear direction, but exist at a position where no display module is positioned, thereby causing deterioration in heat dissipation efficiency of the display device 1.

That is, all the individual display modules 30A to 30P can radiate heat through the metal plate 60 positioned in each of the display modules 30A to 30P, regardless of the position, which results in an improvement in the overall heat radiation performance of the display device 1.

The metal plate 60 may be provided in a quadrangular shape substantially corresponding to the shape of the substrate 40.

The area of the substrate 40 may be greater than or equal to the area of the metal plate 60. According to the parallel arrangement of the substrate 40 and the metal plate 60 in the first direction X, four edges E of the substrate 40 in a rectangular shape may correspond to four edges of the metal plate 60 with respect to the centers of the substrate 40 and the metal plate 60, or the four edges E of the substrate 40 may be positioned at a position (outer positioning) further outside than the four edges of the metal plate 60 with respect to the centers of the substrate 40 and the metal plate 60.

The four edges E of the substrate 40 may be positioned further outward than the four edges of the metal plate 60. That is, the area of the substrate 40 may be larger than the area of the metal plate 60.

The substrate 40 and the metal plate 60 may thermally expand when heat is transferred to the respective display modules 30A to 30P, wherein the expansion degree of the metal plate 60 may be greater than that of the substrate 40 because the metal plate 60 has a larger thermal expansion coefficient than that of the substrate 40.

In the case where the four edges E of the substrate 40 correspond to the four edges of the metal plate 60, or are positioned further inward than the four edges of the metal plate 60, the edges of the metal plate 60 may protrude outward from the substrate 40.

Accordingly, the length of the gap formed between the display modules 30A to 30P may become uneven due to thermal expansion of the metal plate 60 of each of the display modules 30A to 30P, and thus, the recognition of some seams may be increased, which impairs the uniformity of the screen of the display panel 20.

However, in the case where the four edges E of the substrate 40 are positioned at positions further outward than the four edges of the metal plate 60, the metal plate 60 does not protrude outward from the four edges E of the substrate 40 despite thermal expansion of the substrate 40 and the metal plate 60, and thus, the lengths of the gaps formed between the display modules 30A to 30P may be maintained uniform.

According to an embodiment of the present disclosure, the area of the substrate 40 may substantially correspond to the area of the metal plate 60. Accordingly, heat generated from the substrate 40 can be uniformly radiated over the entire area of the substrate 40 without being isolated at some areas.

The metal plate 60 may be adhered to the rear surface 43 of the substrate 40 by a rear adhesive tape 61.

The rear adhesive tape 61 may have a size corresponding to the metal plate 60. That is, the area of the rear adhesive tape 61 may correspond to the area of the metal plate 60. The shape of the metal plate 60 may be substantially quadrangular, and the shape of the rear adhesive tape 61 may be correspondingly quadrangular.

The edge of the metal plate 60 having a rectangular shape with respect to the centers of the metal plate 60 and the rear adhesive tape 61 may correspond to the edge of the rear adhesive tape 61.

Accordingly, the metal plate 60 and the rear adhesive tape 61 can be easily manufactured as a coupling assembly, which improves the overall manufacturing efficiency of the display device 1.

That is, in cutting the metal plate 60 from the plate into a plurality of units, the rear adhesive tape 61 may be first adhered to the metal plate 60 before cutting the metal plate 60, and then the rear adhesive tape 61 and the metal plate 60 may be cut together into a plurality of units, thereby reducing the number of processes.

The heat generated from the substrate 40 may be transferred to the metal plate 60 through the rear adhesive tape 61. Accordingly, the rear adhesive tape 61 may adhere the metal plate 60 to the substrate 40 while transferring heat generated from the substrate 40 to the metal plate 60.

Accordingly, the rear adhesive tape 61 may include a material having high heat dissipation performance.

Basically, the rear adhesive tape 61 can include an adhesive material to adhere the metal plate 60 to the substrate 40.

In addition, the rear adhesive tape 61 may include a material having higher heat dissipation performance than a general adhesive material. Accordingly, the rear adhesive tape 61 can efficiently transfer heat between the substrate 40 and the metal plate 60.

In addition, the adhesive material of the rear adhesive tape 61 may be formed of a material having a higher heat dissipation performance than that of an adhesive material configured of a normal adhesive.

The material having a higher heat dissipating material may be a material having high thermal conductivity, high heat transfer performance, and low specific heat to efficiently transfer heat.

For example, the rear adhesive tape 61 may include a graphite material, but is not limited thereto. However, the rear adhesive tape 61 may be any material having high heat dissipation performance.

The flexibility of the rear adhesive tape 61 may be greater than the flexibility of the substrate 40 and the metal plate 60. Accordingly, the rear adhesive tape 61 may be a material having adhesiveness, heat dissipation property, and high flexibility. The rear adhesive tape 61 may be an inorganic material double-sided adhesive tape. Since the rear adhesive tape 61 is an inorganic material double-sided adhesive tape, as described above, the rear adhesive tape 61 may be formed as a single layer without any material for supporting adhesion to one surface of the substrate 40 and adhesion to the other surface of the metal plate 60.

Since the rear adhesive tape 61 does not include a material interfering with heat transfer, heat dissipation performance can be improved. However, the rear adhesive tape 61 is not limited to the inorganic material double-sided adhesive tape, and may be a heat dissipation adhesive tape having a higher heat dissipation performance than a normal double-sided adhesive tape.

The rear adhesive tape 61 may be formed of a material having high flexibility to absorb external force transmitted from the substrate 40 and the metal plate 60. More specifically, the flexibility of the rear adhesive tape 61 may be greater than the flexibility of the substrate 40 and the metal plate 60.

Accordingly, when an external force generated by a dimensional change of the substrate 40 and the metal plate 60 due to heat transferred to the substrate 40 and the metal plate 60 is transferred to the rear adhesive tape 61, the rear adhesive tape 61 itself may be deformed, thereby preventing the external force from being transferred to other components.

The rear adhesive tape 61 may have a preset thickness in the first direction X. When the metal plate 60 expands or contracts due to heat transferred to the metal plate 60, the metal plate 60 may expand or contract in a direction orthogonal to the first direction X and in the first direction X, and thus, an external force may be transferred to the substrate 40.

Since the metal plate 60 is formed to have a size corresponding to the substrate 40 to cover the entire rear surface 43 of the substrate 40, as described above, the fixing member 82 may be positioned on the rear surface of the metal plate 60, but is not limited thereto.

However, the fixing member 82 may be positioned on the rear surface 43 of the substrate 40. In this case, the substrate 40 may be directly adhered to the frame 15 by the fixing member 82.

Unlike the embodiments of the present disclosure, the metal plate 60 may cover a portion of the rear surface 43 of the substrate 40, and the fixing member 82 may be adhered to an area of the metal plate 60 not covering the rear surface 43 of the substrate 40.

The fixing member 82 may be a double-sided tape.

Hereinafter, the front cover 70, the side cover 90, and the side member 100 will be described in detail.

Fig. 6 is a sectional view showing some components of the display device of fig. 1 in a third direction, fig. 7 is an enlarged sectional view of some components shown in fig. 6, and fig. 8 schematically shows a front side of some components of the display device of fig. 1.

The front cover 70 may protect the substrate 40 from an external force, reduce recognition of a seam formed by the gap G between the plurality of display modules 30A to 30P, and improve color deviation between the plurality of display modules 30A to 30P.

Each of the plurality of display modules 30A to 30P may include a side cover 90, and when the plurality of display modules 30A to 30P are arranged, the side cover 90 is positioned in a gap G formed between the plurality of display modules 30A to 30P.

In order to absorb light reflected from the gap G between the plurality of display modules 30A to 30P, the front cover 70 of each of the plurality of display modules 30A to 30P may extend outwardly from the substrate 40 of each of the plurality of display modules 30A to 30P. The side 75 of the front cover 70 may extend to a position further outward than the mounting surface 41.

More specifically, the front cover 70 may extend to a position further outward than the edge (side) 41S of the mounting surface 41 of the substrate 40 in the second direction Y and the third direction Z.

Basically, the gap between the display modules 30A to 30P may be formed between the side surfaces 45 of the substrates 40 of the display modules 30A to 30P, however, according to an embodiment of the present disclosure, the gap G may be a non-display region that may be formed between the display modules 30A to 30P. Accordingly, the gap G formed between the plurality of display modules 30A to 30P may be interpreted as a gap formed between the edge 41S of the mounting surface 41 of the substrate 40 of the display module 30A to 30P and the edge 41S of the mounting surface 41 of the substrate 40 of another display module 30A to 30P adjacent to the corresponding display module 30A to 30P.

Accordingly, the gap G formed between the plurality of display modules 30A to 30P may be a gap formed between the edge 41S of the mounting surface 41 of the display module 30A to 30P and the edge 41S of the mounting surface 41 of another display module 30A to 30P adjacent to the corresponding display module 30A to 30P in the second direction Y or the third direction Z.

In the gap G between the plurality of display modules 30A to 30P, the front cover 70 extending from each of the display modules 30A to 30P may be positioned to absorb light irradiated to the gap G or light reflected in the gap G, thereby reducing the recognition of the seam.

Further, the side cover 90 (the side cover 90 positioned in the gap G) of each of the plurality of display modules 30A to 30P may absorb light irradiated to the gap G, thereby reducing the visibility of the joint, which will be described below.

As shown in fig. 6 and 7, the front cover 70 may extend to a position further outward than the substrate 40 in the third direction Z. More specifically, the front cover 70 may extend to a position further outward than the side surface 45 and the chamfer portion 49 in the third direction Z.

According to an embodiment of the present disclosure, one edge of the substrate 40 corresponding to the lower edge 34 of the first display module 30A will be described, however, the front cover 70 may extend to a position further outside than the four edges E of the substrate 40 in the second direction Y or the third direction Z.

That is, the side portion 75 of the front cover 70 corresponding to the edge of the front cover 70 may extend to an outer position of the substrate 40 in the second direction Y or the third direction Z, more specifically, to a position further outside than the four edges E of the mounting surface 41 of the substrate 40.

The front cover 70 may include multiple layers having different optical characteristics. The plurality of layers may have a structure created by stacking layers in the first direction X.

The multiple layers may be joined in a first direction X to form the front cover 70.

One of the layers may be an antiglare layer, but is not limited thereto. However, the layer may be an antireflection layer or a combination of an antiglare layer and an antireflection layer.

Another layer of the plurality of layers may be a transmission rate adjusting layer, but is not limited thereto. However, the other layer may be a layer having another physical property, another material, or another function. For example, the further layer may be a circularly polarizing layer.

Alternatively, in another embodiment, a single layer may be used instead of multiple layers. A single layer may be a layer that is capable of functionally implementing all of the functions of multiple layers.

The front cover 70 may include an adhesive layer as described above. The adhesive layer may be positioned at the lowest position of the plurality of layers in the first direction X and adhered to the mounting surface 41. The adhesive layer may have a predetermined height or more in the first direction X facing the mounting surface 41 or the light emitting surface 54 to sufficiently fill a gap that may be formed between the adhesive layer and the inorganic light emitting diode 50 when the adhesive layer is adhered to the substrate 40.

The adhesive layer is not limited to the embodiments of the present disclosure, and the adhesive layer may be provided as a separate component from the front cover 70 and positioned between the front cover 70 and the mounting surface 41 to adhere the front cover 70 to the mounting surface 41.

Accordingly, since the front cover 70 is closely adhered to the mounting surface 41 to protect components mounted on the mounting surface 41, the display module 30 can directly adhere the front cover 70 to the substrate 40 without an additional mold component formed between the front cover 70 and the substrate 40.

The front cover 70 may diffuse and reflect incident light from the outside to prevent the incident light from being reflected to the eyes of the user.

By diffusing and reflecting incident light from the outside, a glare effect can be reduced, and thus, the contrast of a screen displayed on the display panel 20 can be improved.

Further, the front cover 70 may reduce transmittance of incident external light or external light reflected from the substrate 40 and the gap G.

The front cover 70 according to an embodiment of the present disclosure may include a material that reduces transmittance of light to absorb at least a portion of light transmitted toward the substrate 40 or reflected light reflected from the substrate 40 and traveling in the first direction X.

In the case of manufacturing a plurality of substrates, some of the substrates may have different colors due to errors in the manufacturing process. Thus, substrates having different unique colors may be tiled to form a single display panel.

As described above, the front cover 70 according to the embodiment of the present disclosure may absorb at least a portion of light reflected from the substrate 40 and transmitted to the outside, thereby improving the uniformity of the screen of the display panel 20.

That is, the front cover 70 may reduce color deviation of the plurality of display modules 30A to 30P generated in the process for the display modules 30A to 30P by reducing transmittance with respect to external light.

The front cover 70 may improve the contrast of a screen displayed on the display panel 20 by preventing external light entering the display panel 20 from the outside from being transmitted to the substrate 40 and additionally absorbing a portion of the light entering the display panel 20 from the outside or absorbing a portion of the external light reflected from the substrate 40 and transmitted to the outside of the display panel 20. Such different optical effects may be achieved by the multiple layers described above.

That is, the front cover 70 may be positioned in front of the substrate 40 in the first direction X to improve contrast that may be deteriorated by external light in a screen displayed on the display panel 20.

In the display module 30 according to the embodiment of the present disclosure, the front cover 70 may extend from the substrate 40 to an external position along the third direction Z as described above.

Accordingly, a portion of light entering the gap G formed between the plurality of display modules 30A to 30P may be blocked by at least a portion of the front cover 70 positioned above the gap G, and at least a portion of external light entering the gap G or external light reflected in the gap G may be absorbed by the front cover 70 positioned above the gap G, thereby preventing transmission to the outside. Accordingly, the recognition degree of the seam formed in the gap G may be reduced, and according to the reduction of the recognition degree of the seam, the uniformity of the screen displayed on the display panel 20 may be improved.

More specifically, the side portion 75 of the front cover 70 in the third direction Z may be positioned at a position further outward than the edge 41S of the mounting surface 41 in the third direction Z, or above the gap G.

Accordingly, the front cover 70 may include a first region 71 and a second region 72, the first region 71 being positioned further outward than the edge 41S of the mounting surface 41 in the third direction Z or above the gap G, the second region 72 being positioned on the mounting surface 41.

The first region 71 and the second region 72 of the front cover 70 may be divided by the gap G in the third direction Z.

The first region 71 of the front cover 70 may be positioned above the gap G to block external light irradiated toward the gap G or to prevent light reflected in the gap G from being irradiated to the outside, thereby reducing recognition of seams that are boundaries of the plurality of display modules 30A to 30P and may be formed by the gap G, which results in an improvement in uniformity of the display panel 20.

The front cover 70 may extend to a position further outward than the four edges 41S of the mounting surface 41 of the substrate 40, as described above, resulting in a reduction in the recognition of seams that may be formed at the edges of the plurality of display modules 30A to 30P.

For example, in the first display module 30A and the second display module 30B, the first region 71A of the first front cover 70A of the first display module 30A (the first region 71A extends from the first display module 30A) may be positioned in the gap G formed between the first display module 30A and the second display module 30B.

Above the gap G, a side 75A of the first front cover 70A of the first display module 30A and a side 75B of the second front cover 70B of the second display module 30B adjacent to the first display module 30A may be positioned.

In addition, in the gap G, the side surface 45 and the chamfer portion 49 of each of the first display module 30A and the second display module 30B may be positioned.

The second region 72A of the first front cover 70A of the first display module 30A may be positioned on the mounting surface 41 of the first display module 30A.

The first region 71B of the second front cover 70B of the second display module 30B (the first region 71B extends from the second display module 30B) may be positioned above the gap G formed between the first display module 30A and the second display module 30B, and the second region 72B of the second front cover 70B of the second display module 30B may be positioned on the mounting surface 41 of the second display module 30B.

That is, over the gap G formed between the first display module 30A and the second display module 30B, the first region 71A of the first front cover 70A of the first display module 30A and the first region 71B of the second front cover 70B of the second display module 30B may be aligned in the third direction Z.

Each of the first areas 71A and 71B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B may extend in the third direction Z by a length about half or less of the length of the gap G.

Accordingly, when the first areas 71A and 71B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B are aligned in the third direction Z, the sum of the lengths of the first areas 71A and 71B may be substantially equal to or less than the length of the gap G.

According to an embodiment of the present disclosure, when the first areas 71A and 71B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B are aligned in the third direction Z, a certain interval may be formed between the side 75A of the first front cover 70A of the first display module 30A and the side 75B of the second front cover 70B of the second display module 30B. The spacing may be formed by the side member 100 positioned at the side of each of the display modules 30A to 30P. The side member 100 will be described below.

As described above, the first region 71A of the first front cover 70A of the first display module 30A and the first region 71B of the second front cover 70B of the second display module 30B may be positioned above the gap G between the first display module 30A and the second display module 30B.

The external light entering the display panel 20 may be transmitted through the first areas 71A and 71B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B and diffused and reflected to the outside of the display panel 20, or a portion of the external light may be absorbed in the first areas 71A and 71B. Accordingly, the amount of light reaching the gap G may be reduced, and the degree of recognition of the boundary formed between the first display module 30A and the second display module 30B due to the gap G may be reduced.

Further, light reflected in the gap G and traveling toward the outside of the display panel 20 may be transmitted through the first areas 71A and 71B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B and diffused and reflected to the outside of the display panel 20, or a portion of the light may be absorbed in the first areas 71A and 71B. Accordingly, the amount of light transmitted to the outside of the display panel 20 may be reduced, and the degree of recognition of the boundary formed between the first display module 30A and the second display module 30B due to the gap G may be reduced.

That is, by reducing the amount of external light entering the gap G formed between the plurality of display modules 30A to 30P while absorbing at least a portion of the external light reflected in the gap G, the uniformity of the display panel 20 can be improved.

In addition, since at least a portion of external light reflected from the substrates 40A and 40B to be displayed to the outside is absorbed by the first and second front covers 70A and 70B of the first and second display modules 30A and 30B, so that although the substrate 40A of the first display module 30A and the substrate 40B of the second display module 30B have different colors, unique colors of the substrates 40A and 40B are not recognized from the outside, it is possible to improve the sense of unity of the display panel 20.

The first display module 30A may include a side cover 90, the side cover 90 being positioned under the front cover 70 in a direction in which the mounting surface 41 faces and formed on the side surface 45 of the substrate 40.

More specifically, the side cover 90 may be positioned in a space defined by the lower surface 76 of the first region 71 of the front cover 70 in the first direction X, the lower surface of the anisotropic conductive layer 47, and the side surface of the substrate 40 in the third direction Z.

Further, the side 47S of the anisotropic conductive layer 47 of the display module 30 may be aligned with the side 75 of the front cover 70 in the first direction X. In this case, the side cover 90 may be positioned in a space defined by a lower surface of the anisotropic conductive layer 47 in the first direction X and a side surface of the substrate 40 in the third direction Z.

Further, the side 47S of the anisotropic conductive layer 47 of the display module 30 may be aligned with the edge 41S of the mounting surface 41 in the first direction X. In this case, the side cover 90 may be positioned in a space defined by the lower surface 76 of the first region 71 of the front cover 70 in the first direction X and the side surface of the substrate 40 in the third direction Z.

The side cover 90 may be adhered to the lower surface 76 of the first region 71, the side surface 45, and at least a portion of the metal plate 60. The side cover 90 may be adhered to the entire lower surface 76 of the first region 71. Also, the side cover 90 may cover the entire area of the side surface 45.

The lower surface 76 of the first region 71 may be at least one region of the entire lower surface of the front cover 70, and may be a rear surface of an adhesive layer formed at the lowermost position of the front cover 70.

In addition, the side cover 90 may cover a pair of chamfer portions 49 positioned along the front-rear direction of the side surface 45 in the first direction X.

The side cover 90 may surround the entire chamfer portion 49 formed between the mounting surface 41 and the side surface 45.

Since the side cover 90 surrounds the chamfer portion 49 formed between the mounting surface 41 and the side surface 45, the side cover 90 may fill a space that may be formed between the substrate 40 and the front cover 70.

Accordingly, the side cover 90 may prevent foreign substances or water from entering the space between the substrate 40 and the front cover 70 from the outside.

Further, since the side cover 90 surrounds the chamfer portion 49 formed between the rear surface 43 and the side surface 45, the side cover 90 can fill the space that can be formed between the substrate 40 and the metal plate 60.

Accordingly, the side cover 90 may prevent foreign substances or water from entering the space between the substrate 40 and the metal plate 60 from the outside.

The side cover 90 may contact the lower surface 76 of the first region 71, the chamfer portion 49 of the substrate 40, and the side surface 45. Accordingly, the side cover 90 may support the lower surface 76 of the first region 71, the chamfer portion 49 of the substrate 40, and the side surface 45.

As described above, the front cover 70 may be adhered to the substrate 40 through the front cover 70, and the side cover 90 may enhance adhesion between the front cover 70 and the substrate 40. Accordingly, the side cover 90 may prevent the front cover 70 from being separated from the substrate 40.

That is, the reliability of the first display module 30A may be improved by the side cover 90.

In addition, the metal plate 60 may be adhered to the substrate 40 through the rear adhesive tape 61, and the side cover 90 may enhance adhesion between the metal plate 60 and the substrate 40. Accordingly, the side cover 90 can prevent the metal plate 60 from being separated from the substrate 40.

The side surface 45 of the substrate 40 may correspond to the four edges 41S of the mounting surface 41, and the first region 71 of the front cover 70 may extend to a position further outside than the four edges 41S of the mounting surface 41 in the second direction Y and the third direction Z in which the mounting surface 41 extends.

The side cover 90 may surround the lower surface 76 of the first region 71 along the perimeter of the four edges 41S of the mounting surface 41 and the side surface 45 corresponding to each of the four edges 41S of the mounting surface 41.

That is, the side cover 90 may seal the entire edge of the portion where the substrate 40 is adhered to the front cover 70.

The side cover 90 may cover the lower surface 76 and the side surface 45 of the first region 71 in all directions orthogonal to the first direction X.

Accordingly, the coupling between the front cover 70 and the substrate 40 may be improved, and the side surfaces 45 of the front cover 70 and the substrate 40 may be protected from external forces.

Further, as described above, the side cover 90 may prevent external water or foreign matter from entering between the substrate 40 and the front cover 70. In addition, the side cover 90 may prevent external water or foreign matter from entering a gap formed between the substrate 40 and the front cover 70 due to low adhesion.

The side cover 90 may surround four edges E of the substrate 40 along the side surface 45 of the substrate 40 to seal between the substrate 40, the front cover 70, and the metal plate 60.

Accordingly, the side cover 90 can prevent foreign matters or water entering from various directions from entering the substrate 40 and the front cover 70.

As described above, since the lowermost end of the front cover 70 in the first direction X is provided as an adhesive layer, the lower surface 76 of the first region 71 may be provided as a rear surface of the adhesive layer.

Accordingly, when the lower surface 76 of the first region 71 is exposed to the outside, foreign substances existing in the outside may adhere to the lower surface 76 of the first region 71.

When the plurality of display modules 30A to 30P are arranged in a state in which foreign matter adheres to the lower surface 76 of the first region 71, the recognition degree of the seam generated between the plurality of display modules 30A to 30P may increase due to the foreign matter adhering to the lower surface 76 of the first region 71.

However, since the display module 30A according to the embodiment of the present disclosure includes the side cover 90 and the side cover 90 covers the lower surface 76 of the first region 71, it is possible to prevent foreign substances from adhering to the lower surface 76 of the first region 71.

Accordingly, it is possible to reduce the visibility of the seam generated between the plurality of display modules 30A to 30P caused by the foreign matter adhering to the front cover 70 when the plurality of display modules 30A to 30P are arranged.

In addition, current may enter a plurality of electronic components mounted on the substrate 40 due to electrostatic discharge that may occur on the display modules 30A to 30P, thereby damaging the electronic components, which will be described below. The side cover 90 may prevent charges generated by electrostatic discharge from entering the substrate 40 by sealing the substrate 40 from the outside to prevent the electronic components from being damaged.

That is, since the substrate 40 is sealed by the front cover 70 and the side cover 90 to prevent charges generated by electrostatic discharge from passing through the front cover 70 and the side cover 90, the charges can be prevented from flowing to the substrate 40, and the charges flowing on the front cover 70 and the side cover 90 can be guided to the metal plate 60 in contact with the side cover 90, thereby providing a current path of electrostatic discharge. Accordingly, the ESD withstand voltage of the electronic component mounted on the substrate 40 can be improved.

As described above, the first display module 30A may be positioned under the front cover 70 in a direction in which the mounting surface 41 faces. That is, the side cover 90 may not be positioned above the lower surface 76 in the first direction X.

The foremost surface of the side cover 90 in the first direction X may be in contact with the lower surface 76 of the first region 71, and may not be positioned forward of the lower surface 76 of the first region 71 in the first direction X.

The reason may be that the side cover 90 is not positioned on the traveling path of the light radiated from the plurality of inorganic light emitting diodes 50.

In the case where at least a portion of the side cover 90 is positioned in front of the lower surface 76 or in front of the front cover 70 in the first direction X, the side cover 90 may be positioned on a path of light traveling through the front cover 70 in the forward direction.

That is, the side cover 90 may absorb or diffuse and reflect a portion of the traveling light to distort certain areas of the image displayed in the display module 20.

However, since the side cover 90 according to the embodiment of the present disclosure is positioned behind the front cover 70 in the first direction X, the side cover 90 does not restrict movement of light radiated by the plurality of inorganic light emitting diodes 50, thereby improving image quality of the display panel 20.

The side portion 75 of the front cover 70 in the third direction Z and the side portion 91 of the side cover 90 in the third direction Z may be substantially aligned in the first direction X.

The reason may be because the front cover 70 and the side cover 90 are cut simultaneously in the process of manufacturing the display module 30A. Further, the side member 100 may be adhered to the side portion 75 of the front cover 70 and the side portion 91 of the side cover 90 that are substantially aligned in the first direction X.

That is, the pitch formed between the plurality of display modules 30A to 30P when the plurality of display modules 30A to 30P are arranged can be reduced, and the seam that can be recognized by the pitch between the plurality of display modules 30A to 30P can be reduced.

The side cover 90 may include a material that absorbs light. For example, the side cover 90 may be formed of an opaque material or a translucent material.

In addition, the side cover 90 may include a photosensitive material. For example, the side cover 90 may be formed of photo-OCR. Depending on the irradiation of external light (e.g., ultraviolet (UV)) having another wavelength than the visible wavelength to the photosensitive material, the photosensitive material may change physical characteristics to exhibit a dark color.

Accordingly, the side cover 90 may be formed of a material colored in a dark color when the side cover 90 is irradiated with Ultraviolet (UV) light to absorb light during the manufacturing process.

The side cover 90 may have a dark color. The side cover 90 may have a darker color than the front cover 70.

The side cover 90 may have a color similar to that of the black matrix 48.

Accordingly, light entering the side cover 90 may be absorbed in the side cover 90 by the light absorbing material without being reflected.

When the plurality of display modules 30A to 30P are arranged, the side cover 90 may be positioned in the gap G formed between the plurality of display modules 30A to 30P together with the first region 71 of the front cover 70.

Accordingly, the side cover 90 may absorb light entering the gap G to reduce light entering the gap G, reflected, and then emitted to the outside. Accordingly, the recognition of the seam formed by the gap G formed between the plurality of display modules 30A to 30P can be reduced.

For example, in the first display module 30A and the second display module 30B, the side cover 90A of the first display module 30A and the side cover 90B of the second display module 30B may be positioned in the gap G formed between the first display module 30A and the second display module 30B together with the first region 71A of the first front cover 70A of the first display module 30A and the first region 71B of the second front cover 70B of the second display module 30B.

In the gap G, the side portion 91S of the side cover 90A of the first display module 30A and the side portion 91B of the side cover 90B of the second display module 30B may be positioned together with adjacent side portions 75A and 75B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B.

Adjacent side portions 75A and 75B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B and adjacent side portions 91A and 91B of the side covers 90A and 90B of the first and second display modules 30A and 30B may face each other. Adjacent side portions 75A and 75B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B and adjacent side portions 91A and 91B of the side covers 90A and 90B of the first and second display modules 30A and 30B may be positioned parallel to each other.

That is, in the gap G formed between the first display module 30A and the second display module 30B, the first areas 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B and the side covers 90A and 90B of the first and second display modules 30A and 30B may be aligned in the third direction Z.

Each of the side covers 90A and 90B of the first and second display modules 30A and 30B may extend in the third direction Z by about half or less of the gap G to correspond to the first areas 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B.

In the gap G between the first display module 30A and the second display module 30B, the first region 71A of the first front cover 70A of the first display module 30A and the first region 71B of the second front cover 70B of the second display module 30B may be positioned, and the side covers 90A and 90B of the first display module 30A and the second display module 30B may be positioned behind the first regions 71A and 71B in the first direction X.

As described above, the external light entering the display panel 20 may be transmitted through the first and second regions 71A and 71B of the first and second front covers 70A and 70B of the first and second display modules 30A and 30B and then diffused and reflected to the outside of the display panel 20, or a portion of the external light may be absorbed in the first regions 71A and 71B. Therefore, the amount of light reaching the gap G can be reduced.

In addition, light reaching the gap G may be absorbed by the side covers 90A and 90B of the first and second display modules 30A and 30B positioned in the gap G, and thus, the degree of recognition of the boundary between the first and second display modules 30A and 30B may be reduced.

That is, by reducing the amount of external light entering the gap G formed between the plurality of display modules 30A to 30P while additionally absorbing light reaching the gap G, the uniformity of the screen of the display panel 20 can be improved.

In addition, light reflected from the side covers 90A and 90B of the first and second display modules 30A and 30B and traveling to the outside of the display panel 20 without being absorbed by the side covers 90A and 90B may be transmitted through the first areas 71A and 71B of the first and second front covers 70A and 70B to be diffused and reflected to the outside of the display panel 20, or a portion of the light may be absorbed in the first areas 71A and 71B. Accordingly, the amount of light transmitted to the outside of the display panel 20 may be reduced, thereby reducing the recognition of the boundary formed between the first display module 30A and the second display module 30B due to the gap G.

Since the side cover 90 is disposed in the gap G formed between the plurality of display modules 30A to 30P when the plurality of display modules 30A to 30P are disposed, as described above, the side cover 90 may absorb light reaching the gap G to reduce the visibility of the seam that may be recognized due to the gap G.

According to the above-described example, the front cover 70 may reduce the amount of light reaching the substrate 40 by diffusing and reflecting, absorbing, or circularly polarizing a portion of light entering the display module 20 or changing the reflection direction of the light, although the embodiment is not limited thereto.

However, the front cover 70 may be formed of a transparent material that transmits light without twisting the light. In this case, the side cover 90 positioned between the plurality of display modules 30A to 30P may also reduce the recognition of the boundary formed between the plurality of display modules 30A to 30P due to the gap G.

Since the side cover 90 is formed of a material that absorbs light, as described above, in a case where at least a portion of the side cover 90 is positioned in front of the front cover 70 in the first direction X, a portion of light radiated from the plurality of inorganic light emitting diodes 50 may be absorbed by the side cover 90. Accordingly, the area of the screen displayed on the display module 20 may be displayed dark.

However, since the side cover 90 according to the embodiment of the present disclosure is positioned below the front cover 70, more particularly, below the lower surface 76 of the first region 71, the side cover 90 may not absorb light radiated from the plurality of inorganic light emitting diodes 50, and thus, the brightness of an image displayed on the display module 20 may become uniform.

The anisotropic conductive layer 47 may be an anisotropic conductive film. The anisotropic conductive layer 47 may be bonded to the TFT layer 44 in the form of a film on the TFT layer 44.

The anisotropic conductive layer 47 may be formed in a film type, and the area of the anisotropic conductive layer 47 may be larger than that of the substrate 40.

Accordingly, after the anisotropic conductive layer 47 is bonded with the TFT layer 44, a process of cutting the anisotropic conductive layer 47 may be performed such that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40.

The dicing process may be to dice the anisotropic conductive layer 47 by laser dicing or the like so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40.

The anisotropic conductive layer 47 may have an area corresponding to the area of the mounting surface 41. However, since the anisotropic conductive layer 47 is formed as an anisotropic conductive film, as described above, it may not be easy to make the area of the anisotropic conductive film correspond to the area of the mounting surface 41. In addition, when an anisotropic conductive film corresponding to the area of the mounting surface 41 is adhered to the mounting surface 41, the anisotropic conductive film may have a smaller portion than the mounting surface 41 due to manufacturing tolerances, resulting in deterioration of the reliability of the display module 30.

Accordingly, the anisotropic conductive layer 47 may be formed by adhering an anisotropic conductive film having a larger area than the mounting surface 41 to the substrate 40 and then cutting the anisotropic conductive film into an area corresponding to the area of the substrate 40.

The side surface 45 of the substrate 40 may be positioned further outside than the mounting surface 41 by the chamfer portion 49. The anisotropic conductive film may be cut in the third direction Z based on the side of the coating member 46a, the side of the coating member 46a forming the side of the side wiring 46.

The reason may be because there is a risk of damaging the side surface 45, the chamfer portion 49, or the side wiring 46 of the substrate 40 when the anisotropic conductive film is cut based on the mounting surface 41.

However, the anisotropic conductive film may be cut together with the front cover 70 to form the anisotropic conductive layer 47. In this case, the side 47S of the anisotropic conductive layer 47 may be aligned with the side 75 of the front cover 70 in the first direction X.

In this case, the side portion 47S of the anisotropic conductive layer 47 may be exposed to the outside and damaged by static electricity. However, ESD reliability can be ensured by the side member 100 to be described below.

Therefore, the side portion 47S of the anisotropic conductive layer 47 can be positioned at a position further outside than the mounting surface 41 when cutting the anisotropic conductive film. More specifically, since the anisotropic conductive film is cut based on the side surface 45 or the side portion 46S of the side wiring 46, as described above, the side portion 47S of the anisotropic conductive layer 47 may be aligned with the side surface 45 or the side portion 46S of the side wiring 46 in the first direction X. Further, the side 47S of the anisotropic conductive layer 47 may be positioned at a position more outside than the side surface 45 or the side 46S of the side wiring 46 due to manufacturing tolerances or burrs formed in the anisotropic conductive film at the time of dicing.

However, in order to prevent the substrate 40 from being damaged in the actual dicing process, the dicing position of the anisotropic conductive film may be a position further outside than the side surface 45 or the side portion 46S of the side wiring 46.

Accordingly, the side portion 47S of the anisotropic conductive layer 47 may be formed outside the substrate 40. Specifically, the side portion 47S of the anisotropic conductive layer 47 may be positioned at a position further outside than the side cover 90.

The side cover 90 may cover the outside of the side surface 45 in the second direction Y and the outside of the side surface 45 of the substrate 40 in the third direction Z, as shown in fig. 7.

That is, the side cover 90 may surround all four edges E of the substrate 40, as described above.

Accordingly, the mounting surface 41, which is the front surface of the substrate 40, may be covered by the front cover 70, the rear surface 43 of the substrate 40 may be covered by the metal plate 60, and the side surfaces 45 and the chamfer portions 49 of the substrate 40 may be covered by the side covers 90.

The front cover 70 may be formed of a non-conductive material that does not transfer electric charges.

The side cover 90 may be formed of a non-conductive material that does not transfer electric charges.

Since the front cover 70 and the side cover 90 are formed of a non-conductive material, a major portion of the current applied to the front cover 70 or the side cover 90 can flow on the front cover 70 and the side cover 90 without being transmitted through the front cover 70 and the side cover 90.

The metal plate 60 may be formed of a material having a large capacitance, and serves as a ground. Therefore, the metal plate 60 can be kept at a constant potential when a current is applied to the metal plate 60. The current applied to the metal plate 60 may be absorbed in the metal plate 60, and no current may flow to the substrate 40 through the metal plate 60.

In addition, the entire side wiring 46 of the substrate 40 may be surrounded by the side cover 90, and thus, the side wiring 46 may be sealed not to be exposed to the outside. Therefore, static electricity discharged from the side surface 45 of the substrate 40 does not enter the side wiring 46 due to the side cover 90.

In a manufacturing process of a display device implementing a display panel having display modules, the display panel may be formed by tiling a plurality of display modules. During a process for forming a display panel having a display module, when the display module is manufactured and transported, current generated by electrostatic discharge may enter the inside of the display module, which may damage electronic components mounted inside the display module.

In particular, side wirings extending along side surfaces of the substrate may be exposed to the outside due to faults generated during a manufacturing process of the display module, or a space may be formed between the anisotropic conductive layer and the front cover or the substrate, and a space may be formed inside the side cover during a process of applying and hardening the side cover. In this case, due to a process failure caused by electrostatic discharge, current may enter an electronic component such as a side wiring mounted on a substrate, thereby damaging the electronic component.

Each of the display modules 30A to 30P may include a component configured to prevent a current generated by electrostatic discharge from entering the component mounted on the substrate 40, and thus, the current generated by electrostatic discharge may be easily guided to the metal plate 60, which is a ground component, along the front cover 70 and the side cover 90 sealing the substrate 40 on each of the display modules 30A to 30P without entering the component mounted on the substrate 40.

The display device 1 according to the embodiment of the present disclosure may further include a side member 100, the side member 100 being positioned outside the side cover 90 of the display module 30 in the third direction Z and formed of a material having higher conductivity than the side cover 90 to prevent current from flowing to (specifically) the side wiring 46 due to electrostatic discharge.

Because the side wiring 46 is positioned on the side surface 45 corresponding to each of the upper edge 32 and the lower edge 34 positioned in the third direction Z, as described above, the side member 100 may be positioned on the outside of the side cover 90 formed in the third direction Z in which the side wiring 46 is positioned.

Although the display modules 30A to 30P are not completely sealed due to manufacturing failure, the side members 100 may easily guide static electricity to the metal plate 60.

The side member 100 may cover the outside of the side surface 45 of the substrate 40 in the third direction, as shown in fig. 7. That is, the side members 100 may be positioned on a pair of edges 32 and 34 of the four edges E of the substrate 40. More specifically, the side member 100 may be formed on one side surface 45 of the side surfaces 45 corresponding to the pair of edges 32 and 34 where the side wiring 46 is positioned, to reduce the width of the gap G formed between the display modules 30A to 30P when the display modules 30A to 30P are arranged. This will be described in detail below.

For the first display module 30A, the side member 100 may be positioned on the side surface 45 corresponding to the lower edge 34 of the first display module 30A. In addition, the side member 100 may not be disposed on the side surface 45 corresponding to the upper edge 32 of the first display module 30A.

For the second display module 30B, the side member 100 may be positioned only on the side surface 45 corresponding to the lower edge of the second display module 30B, as with the first display module 30A, and for the fourth and sixth display modules 30C and 30D, the side member 100 may also be positioned only on the side surface 45 corresponding to the lower edge of each of the fourth and sixth display modules 30C and 30D.

The side member 100 may be formed of a metal material having higher conductivity than the side cover 90. The side member 100 may be coated on the side cover 90 to be positioned on the side portion 91 of the side cover 90.

Accordingly, when the display modules 30A to 30P are arranged, the side member 100 may be positioned in the gap G formed between the display modules 30A to 30P.

One end of the side member 100 may be in contact with the metal plate 60, and the other end of the side member 100 may be positioned on the side portion 91 of the side cover 90. That is, the side member 100 may cover at least a portion of the metal plate 60 and at least a portion of the side cover 90 in the third direction Z.

The side member 100 may be a film. The reason may be because the side member 100 is positioned in the gap G formed between the display modules 30A to 30A when the display modules 30A to 30P are tiled. In the case where the side member 100 is thick, the gap G formed between the display modules 30A to 30P may be widened due to the thickness of the side member 100, which may result in recognition of the seam between the display modules 30A to 30P.

However, although the side member 100 is a thin film, a certain interval between adjacent ones of the display modules 30A to 30P may be formed by the side member 100. In order to reduce a certain interval between the adjacent display modules 30A to 30P, a single side member 100 may be disposed between the side portions 91 of the side covers 90 of the adjacent display modules 30A to 30P, which will be described in detail below.

The side member 100 may be formed of a material having high conductivity. For example, the side member 100 may be formed of metal, conductive polymer, conductive fabric, or the like to be electrically grounded to the metal plate 60.

The side member 100 may be formed of a material having higher conductivity than the side cover 90. Also, the side member 100 may be formed of a material having higher conductivity than the front cover 70.

Accordingly, since the current is not transmitted through the front cover 70 or the side cover 90, the current generated on the front cover 70 or the side cover 90 by the electrostatic discharge does not enter the substrate 40, and the current may enter the side member 100 while flowing on the front cover 70.

Because the side member 100 is in contact with the metal plate 60 to be grounded to the ground assembly, the current flowing to the side member 100 may flow to the metal plate 60 through the side member 100.

That is, the side member 100 may provide a current path along which current generated on the front cover 70 or the side cover 90 by electrostatic discharge flows to the metal plate 60 provided as a grounding assembly. The side member 100 may direct the charge generated by the electrostatic discharge to ground.

Accordingly, since a large part of the current generated on the front cover 70 or the side cover 90 by the electrostatic discharge flows to the metal plate 60 through the side member 100 having high conductivity, the ESD withstand voltage of the electronic component mounted on the substrate 40 can be improved, although some of the current flows to the substrate 40.

In addition, the electrostatic current transferred to the metal plate 60 may be discharged to the external ground through components (e.g., a bridging plate, a cable, etc.) in contact with the metal plate 60.

The side member 100 may have a dark color. The side member 100 may have a black color. The side member 100 may be darker in color than the front cover 70.

The side member 100 may be of a color similar to the black matrix 48 or the side cover 90. Accordingly, light entering the side member 100 may be absorbed in the side member 100 without being reflected.

As described above, each of the display modules 30A to 30P may independently include the front cover 70, the side cover 90, the metal plate 60, and the side member 100 to prevent current penetration due to electrostatic discharge.

As described above, the side member 100 may be positioned on only one side surface 45 of the pair of side surfaces 45 along which the side wiring 46 extends.

For example, in the first display module 30A and the second display module 30B, the side member 100A may be positioned on the side surface 45 of the first display module 30A adjacent to the second display module 30B in the third direction Z.

No side member may be positioned on the side surface 45 of the second display module 30B adjacent to the first display module 30A in the third direction Z. Accordingly, the side member 100A of the first display module 30A may face the side portion 91B of the side cover 90 of the second display module 30B in contact with the side portion 91B.

Accordingly, the interval T between the side portions 91A and 91B of the first and second display modules 30A and 30B may have a length corresponding to the thickness T of the side member 100.

In the case where the two side members 100 are positioned on the pair of side surfaces 45 in the first and second display modules 30A and 30B, respectively, on which the side wirings 46 are formed, the space T between the side portions 91A and 91B of the first and second display modules 30A and 30B may have a length corresponding to the total thickness 2T of the two side members 100. Accordingly, the interval T may have a longer length to further increase the gap G between the first display module 30A and the second display module 30B, which improves the recognition of the seam.

However, according to an embodiment of the present disclosure, only one side member 100A may be positioned between the side portion 91A of the first display module 30A and the side portion 91B of the second display module 30B, as described above. Accordingly, the space T between the side portions 91A and 91B of the first and second display modules 30A and 30B may be reduced, resulting in reduced visibility of the seam between the display modules 30A and 30B.

However, the side member 100 may be positioned on the side surface 45 corresponding to the upper edge 32 instead of being positioned on the side surface 45 corresponding to the lower edge 34. In this case, the side member 100 may be positioned on the side surface 45 corresponding to the upper edge 32 of the second display module 30B between the first display module 30A and the second display module 30B, and no side member 100 may be positioned on the first display module 30A between the first display module 30A and the second display module 30B.

In this way, although only one side member 100 of the first display module 30A is positioned between the first display module 30A and the second display module 30B, a current generated between the first display module 30A and the second display module 30B through electrostatic discharge and entering the side cover 90B of the second display module 30B may be guided through the side member 100 of the first display module 30A in contact with the side 91B of the side cover 90B of the second display module 30B, resulting in high reliability of the second display module 30B against ESD.

That is, although the side member 100A is positioned on the first display module 30A between the first display module 30A and the second display module 30B adjacent to each other in the third direction Z among the display modules 30A to 30P, both the first display module 30A and the second display module 30B may be in contact with the side member 100A, and thus, although a current is generated between the first display module 30A and the second display module 30B by electrostatic discharge, reliability against ESD of the first display module 30A and the second display module 30B may be improved by the side member 100A.

As described above, the first display module 30A may be positioned at the uppermost position of the display panel 20, and the side member 100A may be positioned only on the side surface 45 corresponding to the lower edge 34 in the third direction Z. Thus, no side member 100 may be positioned on the upper edge 32.

In addition, in the second, fourth and sixth display modules 30B, 30C and 30D, the side member 100 may not be positioned on the side surface 45 corresponding to the upper edges 32 of the second, fourth and sixth display modules 30B, 30C and 30D, and the side members 100B, 100C and 100D may be positioned on the side surface 45 corresponding to the lower edges 34 of the second, fourth and sixth display modules 30B, 30C and 30D, respectively.

In this case, although the side members 100B, 100C and 100D of the second, fourth and sixth display modules 30B, 30C and 30D are not positioned on the side surfaces 45 corresponding to the respective upper edges 32, the side members 100A, 100B and 100C of the first, second and fourth display modules 30A, 30B and 30C adjacent to the second, fourth and sixth display modules 30B, 30C and 30D in the third direction Z may be positioned on the side surfaces 45 corresponding to the upper edges 32 of the second, fourth and sixth display modules 30B, 30C and 30D. Therefore, although none of the side members 100B, 100C, and 100D is positioned on the side surface 45 corresponding to the upper edges 32 of the second, fourth, and sixth display modules 30B, 30C, and 30D, reliability against ESD may be improved by the side members 100A, 100B, and 100C of the adjacent first, second, and fourth display modules 30A, 30B, and 30C.

However, since there is no display module adjacent to the side surface 45 corresponding to the upper edge 32 of the first display module 30A in the third direction Z, when electrostatic discharge occurs on the side surface 45 corresponding to the upper edge 32 of the first display module 30A, current may enter the side surface 45, thereby damaging the side wiring 46 and the electronic components of the first display module 30A.

In order to prevent such damage, the display device 1 according to the embodiment of the present disclosure may include a frame side member 200 positioned on the frame 15, the frame side member 200 being in contact with a side surface 45 corresponding to the upper edge 32 of the first display module 30A supported on the frame 15 and grounded to the frame 15.

The frame 15 may be formed of a metallic material and serves as a grounding component on the circuit.

The frame side member 200 may be formed of a material having higher conductivity than the side cover 90. For example, the frame side member 200 may be formed of metal, conductive polymer, conductive fabric, or the like to be electrically grounded to the metal plate 60.

The frame side member 200 may be formed at a region adjacent to the upper edge of the frame 15 in the third direction Z. The frame side member 200 may extend in the second direction Y to cover all side surfaces 45 corresponding to the third, fifth and seventh display modules 30E, 30I and 30M aligned with the first display module 30A in the second direction Y and the upper edge 32 of the first display module 30A.

That is, in order to protect the side surfaces 45 corresponding to the upper edges 32 of the third, fifth and seventh display modules 30E, 30I and 30M and the first display module 30A, the frame side member 200 may cover at least a portion of the side covers 90 of the first, third, fifth and seventh display modules 30A, 30E, 30I and 30M, wherein no side member 100 is positioned on the side cover 90 formed on the side surface 45 corresponding to the upper edge 32.

Accordingly, when a current caused by electrostatic discharge is applied to the side surfaces 45 corresponding to the upper edges 32 of the first, third, fifth and seventh display modules 30A, 30E, 30I and 30M, the current may flow to the frame 15 through the frame side member 200.

Therefore, although in each of the display modules 30A to 30P, the side member 100 is positioned only on any one side surface 45 of the pair of side surfaces 45 on which the side wiring 46 extends, as described above, the ESD reliability of the other side surface 45 on which the side member 100 is not provided can be improved by the side member 100 or the frame side member 200 of another display module adjacent to the corresponding display module in the third direction Z.

In addition, since in each of the display modules 30A to 30P, the side member 100 is positioned only on any one side surface 45 of the pair of side surfaces 45 on which the side wiring 46 extends, the length of the gap between the display modules adjacent to each other in the third direction Z may be reduced, resulting in a reduction in the degree of recognition of the seam between the display modules 30A to 30P.

However, in the case where the side member 100 is positioned on the side surface 45 corresponding to the lower edge 34 (not the upper edge 32) of each of the display modules 30A to 30P in the third direction Z, the frame side member 200 may extend in the second direction at a region of the frame 15 adjacent to the lower edge 34.

In this case, the frame side member 200 may cover the side cover 90 formed on the side surface 45 corresponding to the lower edge 34 of the sixth display module 30D, and the side cover 90 formed on the side surface 45 corresponding to the lower edges 34 of the display modules 30H, 30L, and 30P aligned with the sixth display module 30D in the second direction Y.

In addition, the side member 100 may be positioned only on any one of the pair of side surfaces 45 on which no side wiring 46 extends (i.e., the side surface 45 corresponding to the left edge 33 or the right edge 31 opposite to each other in the second direction Y).

The reason may be to prevent current from entering the side cover 90 formed on the side surface 45 corresponding to the left edge 33 or the right edge 31 to damage the electronic components of the corresponding display module, although no side wiring 46 is positioned on the side surface 45.

In this case, the side member 100 may be positioned on any one of the pair of side surfaces 45 in the second direction Y. On the side surface 45 where the side member 100 is not positioned in the second direction Y in each of the display modules 30A to 30P, the side member 100 of another display module adjacent to the corresponding display module in the second direction Y may be positioned to improve ESD reliability.

The side member 100 positioned in the second direction Z and the side member 100 positioned in the second direction Y may be integrated, and thus, the side member 100 may have a shape surrounding two adjacent side surfaces 45 among the four side surfaces 45 of each of the display modules 30A to 30P. For example, the side member 100 may surround the side cover 90 formed on the side surface 45 corresponding to the right edge 31 and the lower edge 34.

Further, in the case where the side member 100 is additionally positioned on the side surface 45 corresponding to the right edge 31 of each of the display modules 30A to 30P in the second direction Y, the display apparatus 1 may further include a frame side member 200 extending in the third direction Z at a region adjacent to the left edge of the frame 15.

Hereinafter, the display modules 30A to 30P according to another embodiment of the present disclosure will be described. The remaining components except for the side wiring 46 formed in the second direction Y, which will be described below, are the same as the corresponding components of the display device 1 according to the embodiment of the present disclosure described above, and thus, repetitive description thereof will be omitted. Specifically, the arrangement of the display modules 30A to 30P in the third direction Z according to another embodiment of the present disclosure is the same as the arrangement of the display modules 30A to 30P in the third direction Z of the display device 1 shown in fig. 6 and 7, and therefore, the arrangement of the display modules 30A to 30P in the second direction Y will be described.

Fig. 9 is a perspective view of some components of a display module according to another embodiment of the present disclosure, fig. 10 is a cross-sectional view showing some components of a display device according to another embodiment of the present disclosure in a second direction, fig. 11 is a cross-sectional view of some components shown in fig. 10, and fig. 12 schematically shows a front side of some components of a display device according to another embodiment of the present disclosure.

For convenience of description, fig. 9 shows the substrate 40 in which components such as the anisotropic conductive layer 47 are excluded. In addition, the side wiring 46 may include a coating member 46a (see fig. 7) for protecting the side wiring 46 from the outside, and illustration of the coating member 46a is omitted for convenience of description.

As shown in fig. 9, the side wirings 46 may be positioned on all four side surfaces 45 corresponding to the four edges 31, 32, 33, and 34 of the display module 30.

That is, according to the above-described embodiments of the present disclosure, the side wirings 46 may be positioned only on the pair of side surfaces 45 of the display module 30. However, according to another embodiment of the present disclosure, the side wirings 46 may be formed on all four side surfaces 45.

Accordingly, the side member 100 may be formed on one side surface 45 of the pair of side surfaces 45 opposite to each other in the third direction Z and one side surface 45 of the pair of side surfaces 45 opposite to each other in the second direction Y.

The side member 100 may cover the outside of the side surface 45 of the substrate 40 in the second direction Z, as shown in fig. 10 and 11. More specifically, the side members 100 may be positioned on the side surfaces 45 corresponding to one 34 of the two edges 32 and 34 positioned in the third direction Z among the four edges E of the substrate 40, and the side surfaces 45 corresponding to one 31 of the two edges 31 and 33 positioned in the second direction Y, respectively.

The reason may be to reduce the width of the gap G formed between the display modules 30A to 30P when the display modules 30A to 30P are arranged.

For the first display module 30A, the side member 100 may be positioned on the side surface 45 corresponding to the right edge 31 of the first display module 30A. Further, the side member 100 may not be positioned on the side surface 45 corresponding to the left edge 33 of the display module 30A.

In the third display module 30E, the side member 100 may be positioned only on the side surface 45 corresponding to the right edge of the third display module 30E, similar to the first display module 30A, and in each of the fifth display module 30I and the seventh display module 30M, the side member 100 may also be positioned only on the side surface 45 corresponding to the right edge 31.

The side member 100 may cover at least a portion of the metal plate 60 and at least a portion of the side cover 90 in the second direction Y.

For example, in the first display module 30A and the third display module 30E, the side member 100A may be positioned on a side surface 45 of the first display module 30A, the side surface 45 being adjacent to the third display module 30E in the second direction Y.

The side member 100A may not be positioned on the side surface 45 of the third display module 30E, the side surface 45 being adjacent to the first display module 30A in the second direction Y. Accordingly, the side member 100A of the first display module 30A may face the side portion 91E of the side cover 90 of the third display module 30E in contact with the side portion 91E.

Accordingly, the interval T between the side portions 91A and 91E of the first and third display modules 30A and 30E may have a length corresponding to the thickness T of the side member 100.

Accordingly, the space T between the side portions 91A and 91E of the first and third display modules 30A and 30E may be reduced, which results in a reduction in the degree of recognition of the seam between the first and third display modules 30A and 30E.

However, the side member 100 may be positioned on the side surface 45 corresponding to the left edge 33, instead of being positioned on the side surface 45 corresponding to the right edge 31. In this case, the side member 100 may be positioned on the side surface 45 corresponding to the left edge 33 of the third display module 30E between the first display module 30A and the third display module 30E, and the side member 100A of the first display module 30A may not be positioned between the first display module 30A and the third display module 30E.

Accordingly, although only one side member 100A of the first display module 30A is positioned between the first display module 30A and the third display module 30E, a current generated between the first display module 30A and the third display module 30E through electrostatic discharge and entering the side cover 90E of the third display module 30E may be guided through the side member 100A of the first display module 30A in contact with the side 91E of the side cover 90E of the third display module 30E, resulting in high reliability of the third display module 30E against ESD.

That is, although the side member 100A of the first display module 30A is positioned between the first display module 30A and the third display module 30E adjacent to each other in the second direction Y among the display modules 30A to 30P, both the adjacent first display module 30A and third display module 30E may be in contact with the side member 100A, and thus, although a current is generated between the first display module 30A and the third display module 30E by electrostatic discharge, reliability against ESD of both the first display module 30A and the third display module 30E may be improved by one side member 100A.

As described above, the first display module 30A may be positioned at the leftmost position of the display panel 20, and the side member 100A may be positioned only on the side surface 45 corresponding to the right edge 31 in the second direction Y. Thus, no side member 100 may be positioned on the left edge 33.

In addition, in the third, fifth and seventh display modules 30E, 30I and 30M, the side member 100 may not be positioned on the side surface 45 corresponding to the left edges 33 of the third, fifth and seventh display modules 30E, 30I and 30M, and the side members 100E, 100I and 100M may be positioned on the side surface 45 corresponding to the right edges 31 of the third, fifth and seventh display modules 30E, 30I and 30M, respectively.

In this case, although the side members 100E, 100I and 100M of the third, fifth and seventh display modules 30E, 30I and 30M are not positioned on the side surface 45 corresponding to the left edge 33, the side members 100A, 100E and 100I of the first, third and fifth display modules 30E, 30E and 30I adjacent to the third, fifth and seventh display modules 30E, 30I and 30M in the second direction Y may be positioned on the side surface 45 corresponding to the left edge 33 of the third, fifth and seventh display modules 30E, 30I and 30M. Therefore, although none of the side members 100E, 100I, and 100M is positioned on the side surface 45 corresponding to the left edge 33 of the third, fifth, and seventh display modules 30E, 30I, and 30M, reliability against ESD may be improved by the side members 100A, 100E, and 100I of the adjacent first, third, and fifth display modules 30A, 30E, and 30I.

However, since there is no display module adjacent to the side surface 45 corresponding to the left edge 33 of the first display module 30A in the second direction Y, when electrostatic discharge occurs on the side surface 45, current may enter the side surface 45 corresponding to the left edge 33 of the first display module 30A, thereby damaging the side wiring 46 and the electronic components of the first display module 30A.

In order to prevent such damage, the display device 1 according to the embodiment of the present disclosure may include a frame side member 200, the frame side member 200 including: a first frame side member 210 positioned on the frame 15, contacting a side surface 45 corresponding to the upper edge 32 of the first display module 30A supported on the frame 15, and grounded to the frame 15; and a second frame side member 220 that contacts the side surface 45 corresponding to the left edge 33 and is grounded to the frame 15.

The frame side member 200 according to the above-described embodiment of the present disclosure may extend in the second direction Y at a region adjacent to the upper edge of the frame 15, however, in the frame side member 200 according to another embodiment of the present disclosure, the first frame side member 210 extending in the second direction Y at a region adjacent to the upper edge of the frame 15 and the second frame side member 220 extending in the third direction Z at a region adjacent to the left edge of the frame 15 may be positioned on the frame 15, respectively.

The second frame side member 220 may extend in the third direction Z to cover all side surfaces 45 corresponding to the second, fourth and sixth display modules 30B, 30C and 30D aligned with the first display module 30A in the third direction Z and the left edge 33 of the first display module 30A.

That is, in order to protect the side surfaces 45 corresponding to the left edges 33 of the second, fourth and sixth display modules 30B, 30C and 30D and the first display module 30A, the frame side member 200 may cover at least a portion of the side covers 90 of the first, second, fourth and sixth display modules 30A, 30B, 30C and 30D, wherein no side member 100 is positioned on the side cover 90 formed on the side surface 45 corresponding to the left edge 33.

Therefore, as described above, although in each of the display modules 30A to 30P, the side member 100 is positioned only on any one side surface 45 of the pair of side surfaces 45 on which the side wiring 46 extends, the ESD reliability of the other side surface 45 on which the side member 100 is not positioned can be improved by the side member 100 or the frame side member 200 of another display module adjacent to the corresponding display module in the second direction Y.

In addition, since the side member 100 is positioned only on any one of the pair of side surfaces 45 on which the side wiring 46 extends in each of the display modules 30A to 30P, the length of the gap G between display modules adjacent to each other in the third direction Z may be reduced, resulting in a reduction in the degree of recognition of the seam between the display modules 30A to 30P.

However, in the case where the side member 100 is positioned on the side surface 45 corresponding to the left edge 33 (not the right edge 31) of each of the display modules 30A to 30P in the second direction Y, the frame side member 200 may extend in the third direction Z at a region of the frame 15 adjacent to the right edge 31.

In this case, the frame side member 200 may cover the side cover 90 formed on the side surface 45 corresponding to the right edge 31 of the seventh display module 30M, and the side cover 90 formed on the side surface 45 corresponding to the right edges 31 of the display modules 30N, 30O, and 30P aligned with the seventh display module 30M in the third direction Z.

The side member 100 positioned in the third direction Z and the side member 100 positioned in the second direction Y may be integrated, and thus, the side member 100 may have a shape surrounding two adjacent side surfaces 45 among the four side surfaces 45 of each of the display modules 30A to 30P.

For example, in the first display module 30A, the side member 100 may surround the side cover 90 formed on the side surface 45 corresponding to the right edge 31 and the lower edge 34.

To this end, although the technical concept of the present disclosure has been described based on specific embodiments, the scope of the claims of the present disclosure is not limited to these embodiments. It should be understood that various embodiments modified or changed by those skilled in the art without departing from the gist of the present disclosure as a technical concept of the present disclosure as defined in the claims also fall within the scope of the claims of the present disclosure.

Claims

1. A display module, comprising:

a substrate having a mounting surface on which a plurality of inorganic light emitting diodes are mounted and on which a TFT layer is formed, four side surfaces, and a rear surface opposite to the mounting surface;

a side wiring electrically connected to the TFT layer and extending along a first pair of the four side surfaces of the substrate;

a front cover covering the TFT layer and the plurality of inorganic light emitting devices in a first direction;

A metal plate disposed on the rear surface of the substrate;

a side cover covering the side wiring and the four side surfaces; and

A side member provided on a side portion of the side cover and grounded to the metal plate,

Wherein the side member is provided on a first side surface of the first pair of side surfaces along which the side wiring extends among the four side surfaces.

2. The display module of claim 1, wherein the side member comprises: a first side member provided on the first side surface of the first pair of side surfaces along which the side wiring extends; and a second side member provided on a second side surface of a second pair of side surfaces along which the side wiring does not extend, of the four side surfaces.

3. The display module of claim 2, wherein the first and second side members are integrally formed as one piece and extend along the first and second side surfaces.

4. The display module of claim 1, wherein the side wiring extends along the four side surfaces, and

Wherein the side member is provided on the first one of the first pair of side surfaces and the second one of the second pair of side surfaces.

5. The display module of claim 4, wherein the side members on the first and second side surfaces are integrally formed as one piece.

6. The display module of claim 1, wherein the side member has a conductivity greater than a conductivity of the side cover.

7. The display module of claim 1, wherein the side member is black in color.

8. The display module of claim 1, wherein the side member comprises a metallic material.

9. A display device, comprising:

a plurality of display modules arranged in an m×n matrix; and

A frame configured to support the plurality of display modules,

Wherein each of the plurality of display modules comprises:

A side wiring electrically connected to the TFT layer and extending along a first pair of the four side surfaces;

a front cover covering the plurality of inorganic light emitting diodes and the TFT layer in a first direction;

A metal plate disposed on the rear surface;

a side cover covering the side wiring and the four side surfaces; and

A side member provided on a side portion of the side cover and grounded to the metal plate, and

10. The display device according to claim 9, wherein the plurality of display modules includes a first display module, and a second display module adjacent to the first display module in a direction in which the side wiring of the first display module extends, and

Wherein the side member of the first display module contacts a second side surface of the second display module of the first pair of side surfaces along which the side wiring of the second display module extends, and the side member of the second display module is not disposed on the second side surface of the second display module.

11. The display device according to claim 10, wherein a first display module of the plurality of display modules is positioned such that a second side surface of the first pair of side surfaces along which the side wiring extends is adjacent to an edge of the frame, and the side member is not located on the second side surface, and

Wherein the frame includes a frame side member surrounding the second side surface of the first display module of the first pair of side surfaces along which the side wiring extends.

12. The display device of claim 11, wherein the frame side member extends along the edge of the frame.

13. The display device according to claim 9, wherein the side member includes: a first side member provided on the first side surface of the first pair of side surfaces along which the side wiring extends; and a second side member provided on a second side surface of a second pair of side surfaces along which the side wiring does not extend, of the four side surfaces.

14. The display device of claim 13, wherein the first and second side members are integrally formed as one piece and extend along the first and second side surfaces.

15. The display device of claim 13, wherein each of the plurality of display modules is positioned such that a side surface of the four side surfaces on which the first and second side members are not located is adjacent to an edge of the frame, respectively, and

Wherein the frame includes a frame side member surrounding the side surface of each of the plurality of display modules on which the first and second side members are not disposed.