CN117986045A - Method for applying a metal layer on the surface of a ceramic body - Google Patents

Method for applying a metal layer on the surface of a ceramic body Download PDF

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Publication number
CN117986045A
CN117986045A CN202311462363.2A CN202311462363A CN117986045A CN 117986045 A CN117986045 A CN 117986045A CN 202311462363 A CN202311462363 A CN 202311462363A CN 117986045 A CN117986045 A CN 117986045A
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CN
China
Prior art keywords
ceramic body
layer
metal
metal powder
applying
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Pending
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CN202311462363.2A
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Chinese (zh)
Inventor
A·西格尔
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Phoenix Contact GmbH and Co KG
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Phoenix Contact GmbH and Co KG
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Filing date
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Publication of CN117986045A publication Critical patent/CN117986045A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/0036—Laser treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C04B41/90—Coating or impregnation for obtaining at least two superposed coatings having different compositions at least one coating being a metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B23K2103/26—Alloys of Nickel and Cobalt and Chromium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Composite Materials (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The invention describes a method for applying a metal layer on the surface of a ceramic body. By this method, it is thus possible to apply a metal layer on the surface of a ceramic body with low outlay, the method having the following steps: applying a layer of metal powder onto the surface of the ceramic body, structuring the contact geometry on the surface of the ceramic body by melting some areas of the metal powder using a laser beam, repeating the first two steps until a metal layer of a predetermined thickness is applied on the surface of the ceramic body.

Description

Method for applying a metal layer on the surface of a ceramic body
The invention relates to a method for applying at least one metal layer on the surface of a ceramic body, in particular on the surface of a ceramic resistor. In addition, the invention relates to a ceramic body having a metal layer on at least one surface.
Ceramic bodies having a metal layer on at least one surface of the ceramic body are known, for example, as ceramic resistors or gas-filled overvoltage protectors. In the case of gas-filled overvoltage protectors, which generally have a cylindrical ceramic body, metal contacts are applied to both end faces, which are welded to the metallized surfaces of these end faces, in order to contact the overvoltage protector. The metallizations of the surfaces of the two end faces can be performed in different ways.
One known and widely used way of metallizing ceramic surfaces is so-called "sputtering", also called cathode sputtering. Here, the material to be deposited is first sputtered by plasma ion bombardment and converted into the gas phase. The particulate vapors condense on the ceramic body to be coated in the form of a thin and firmly adhering layer. For this purpose, a vacuum as well as a high electric field are required to accelerate the plasma ions.
Alternative coating methods, which are also physical vapor deposition (physical vapor deposition) processes, are evaporation and ion plating. Even though these methods are widely used, they are technically demanding and complex processes due to the necessary vacuum techniques and optionally the required electric acceleration fields.
DE 102015101430 discloses a composite body made of a ceramic element and a metal electrode. The document also describes a method of manufacturing a metal electrode-ceramic-composite comprising the step of bonding a metal electrode to a ceramic element by applying heat and/or voltage to the metal electrode and the ceramic element. The second method of manufacturing the metal electrode-ceramic-composite includes a step of forming a thin metal film on the surface of the ceramic element by sputtering, PLD, or evaporation.
A method for producing a three-dimensional object, which consists of a thick-layer and thin-layer structure, is known from DE 10201004130 A1. For this purpose, at least two coating heads are moved relative to the workpiece, one of the coating heads producing a thick structure and the second coating head depositing a thin layer. The thick structure may for example consist of ceramic, while the thin layer may be a metal layer. Thereby a three-dimensional ceramic body with embedded conductor strips can be produced.
The object of the invention is to provide a method which can be used for applying a metal layer on the surface of a ceramic body, in particular on the surface of a ceramic resistor, with as low a cost as possible.
This object is achieved by the features of claim 1. The inventive method for applying a metal layer on the surface of a ceramic body has at least the following steps. Applying a layer of metal powder onto the surface of the ceramic body, and subsequently structuring the contact geometry on the surface of the ceramic body by melting at least one region of the metal powder using a laser beam, wherein the first two steps are repeated until a metal layer of a predetermined thickness is applied on the surface of the ceramic body.
When the metal powder of at least one region is melted using a laser beam, the metal powder is bonded to the surface of the ceramic body, thereby forming good and durable contact with the ceramic body. Another advantage of the method according to the invention is that by melting the metal powder with a laser beam, different contact geometries can be produced in a simple manner and type. Thus, it is possible to melt not only a sub-region or a plurality of individual regions of the metal powder, but also the entire layer of metal powder applied on the surface of the ceramic body using a laser beam. Data for directing the laser beam to construct the contact geometry on the surface of the ceramic body may be generated using software. The computational steps required for this are known to those skilled in the art of 3D printing.
If the thickness of the metal layer on the surface of the ceramic body after the metal powder of the selected region is melted is not equal to the desired thickness, a thin layer of the metal powder is again applied to the surface of the ceramic body in the next step, and then the newly applied metal powder of the corresponding region is melted using a laser beam. The two steps of applying and subsequently melting the metal powder are repeated here so frequently that the metal layer thus produced on the surface of the ceramic body has reached the desired thickness.
The metal layer applied on the surface of the ceramic body using the method of the invention need not be made of only a single metal powder. Thus, it is possible that the metal powder applied to the surface of the ceramic body used is a combination or mixture of different metal powders.
Furthermore, the applied metal layer may also consist of at least two separate layers stacked on top of each other. In this case, at least one first layer of a first metal powder is first applied to the surface of the ceramic body, and then the contact geometry is formed by melting the first metal powder of at least one region using a laser beam. Subsequently, at least one layer of a second metal powder is applied onto the previously applied first layer, and then the contact geometry of the second layer is constructed by melting the at least one region of the second metal powder using a laser beam. Accordingly, a third layer or another layer may then also be applied.
It is thus possible to replace a plurality of coating steps in one process by the method of the invention. It is thus possible to apply three-or more-layers made of different metals on the surface of the ceramic substrate. For example, a copper layer may be applied directly on the surface of the ceramic substrate as a first layer, then a nickel layer as a second layer, and a gold layer as a third layer on the nickel layer. At this time, the intermediate nickel layer acts as a barrier layer between the copper layer and the gold layer so that copper does not diffuse into the gold layer and thus adversely affects the gold layer by deteriorating its solderability.
According to an advantageous embodiment of the method, the ceramic body is positioned and fixed in the printing chamber of the 3D metal printer in a first step, which is carried out before the two steps described above, applying a layer of metal powder and structuring the contact geometry. The inventive method can thus be advantageously implemented using 3D metal printers, which can be obtained by different embodiments. A further advantage of arranging the ceramic body in the printing chamber of a 3D metal printer is that the inventive method can advantageously take place under a protective gas atmosphere. Here, for example, argon or nitrogen may be used as the shielding gas. An additional advantage of arranging the ceramic body in the printing chamber of the 3D metal printer is that the air humidity in the printing chamber can be kept low.
According to a particularly preferred embodiment of the process according to the invention, the metal powder used is copper powder having a particle size of 10 to 60. Mu.m, preferably 15 to 50. Mu.m. By using a small particle size metal powder, the laser power required to melt the metal powder is reduced. The advantage of using copper as metal powder is that a high conductivity of the resulting metal layer can thereby be achieved. Thus, other metals, such as silver or gold, may also be used as the metal powder. Depending on the purpose of use, it is also possible to use powders made of aluminium, nickel or tin and combinations of at least two metals.
The ceramic body to which the metal layer is applied on at least one of its faces preferably consists of a metal oxide or suboxide, in particular a metal oxide or suboxide based on tin or titanium. Such ceramic bodies are particularly useful as ceramic resistors. The metal oxide for the ceramic body can also be doped with other materials.
According to a further advantageous embodiment of the method, the ceramic body is lowered by a predetermined amount after the contact geometry has been constructed, and then a new layer of metal powder is applied to the surface of the ceramic body. It is thereby ensured that the distance between the layer of metal powder applied on the surface of the ceramic body and the laser does not become small if the first metal layer has been applied on the surface of the ceramic body by melting. The amount by which the ceramic body drops is therefore preferably equal to the layer thickness of the metal powder.
As mentioned at the outset, the invention relates not only to a method for applying a metal layer to a surface of a ceramic body, but also to a ceramic body having a metal layer on at least one surface.
In the case of the ceramic body according to the invention, the metal layer is applied to the surface by the method according to the invention described above, according to claim 8. By arranging or applying said metal layer on the surface of the ceramic body, the ceramic body can advantageously be designed such that it can subsequently be soldered to another component, in particular a printed circuit board, using soldering. The ceramic body, which is correspondingly provided with a metal layer, is thus suitable for SMD assembly.
The metal layer may also consist of at least two layers of different metal materials stacked on top of each other, as described previously in relation to the method of the invention. For example, the first layer applied directly on the surface of the ceramic body may be composed of copper and the second layer composed of tin. The copper layer ensures good electrical conductivity, while a good solderable surface is achieved by the tin layer.
According to one advantageous embodiment, the ceramic body is a ceramic resistor having two end faces opposite to each other, wherein a metal layer is applied on the two end faces or adjacent to the two end faces on the top or bottom face of the ceramic body, respectively. The metal layer may cover the entire end face of the ceramic resistor. Alternatively, however, it is also possible to cover only a subregion or individual region of the end face of the ceramic resistor with a metal layer. The metal powder constituting the metal layer on the end face of the ceramic resistor is preferably composed of copper powder having a particle size of 15 to 50 μm.
Advantageous embodiments of the method or ceramic body according to the invention are described in the dependent claims. In particular, there are a number of possible ways for designing the method or the ceramic body. Reference is made to the following description of the preferred embodiments taken in conjunction with the accompanying drawings. In the drawings show
Figure 1 is a side perspective view of a first embodiment of a ceramic body,
Figure 2 is a side perspective view of another embodiment of a ceramic body,
FIG. 3 is a perspective view from the side of a third embodiment of a ceramic body, and
Fig. 4 is a side view of a fourth embodiment of a ceramic body.
The figures show various simplified embodiments of ceramic bodies 1, each having at least one metal layer 2 on the surface of the ceramic body 1. In the embodiment shown, the ceramic body 1 has a rectangular basic shape, respectively, so that the ceramic body 1 has a top surface 3, a bottom surface 4 opposite to the top surface 33, two end surfaces 5, 6 opposite to each other and two longitudinal surfaces 7, 8 likewise opposite to each other.
In the first exemplary embodiment according to fig. 1, the metal layer 2 is applied in each case to two opposite end faces 5, 6 according to the method of the invention. In the second embodiment of the ceramic body 1 according to fig. 2, two metal layers 2 are present on the top surface 3 of the ceramic body 1 adjacent to the two end faces 5, 6, respectively. In the third embodiment of the ceramic body 1 according to fig. 3, the metal layer 2 is applied on both end faces 5, 6 and on the top 3 adjacent to both end faces 5, 6, respectively.
In a fourth embodiment of the ceramic body 1 according to fig. 4, similar to fig. 2, two metal layers 2 are applied to the top surface 3 of the ceramic body 1, wherein the two metal layers 2 are here also arranged adjacent to the two end surfaces 5, 6. The difference from the embodiment according to fig. 2 is that the metal layer 2 is composed of three layers 2a, 2b and 2c, which are each stacked on top of one another, wherein the layers 2a, 2b, 2c are composed of different metal materials. The lowermost layer 2a applied directly on the top surface 3 of the ceramic body 1 consists of copper, for example, and the uppermost layer 2c consists of gold. Between these two layers 2a, 2c, an intermediate layer 2b made of nickel is furthermore arranged, which forms a barrier layer between the lower layer 2a and the upper layer 2c. The intermediate nickel layer prevents copper from diffusing into the overlying gold layer and thus deteriorating solderability of the gold layer.
According to the arrangement shown in fig. 4, it is of course also possible to superimpose only two layers or more than two layers on top of each other. The layers are applied here in each case one after the other according to the method of the invention. For this purpose, at least one first layer 2a of metal powder is first applied to the respective surface of the ceramic body 1, and then the contact geometry is constructed by melting at least one region of metal powder using a laser beam. If after this the first layer 2a has not yet had the desired thickness on the surface of the ceramic body 1, the two steps described above are repeated correspondingly frequently.
Subsequently, at this point, a second metal powder of at least one layer 2b is applied onto the first layer 2a, and the contact geometry is constructed by melting the second metal powder of at least one region using a laser beam. The two steps of applying the metal powder and structuring the contact geometry can also be repeated accordingly, if the layer thickness of the second layer 2b has not yet reached the predetermined thickness. Accordingly, an optional third layer or another layer may then be applied to the respective previous layer.

Claims (10)

1. A method of applying a metal layer on the surface of a ceramic body,
The method is characterized by comprising the following steps of:
Applying a layer of metal powder to the surface of the ceramic body,
The contact geometry on the surface of the ceramic body is structured by melting the metal powder of at least one region using a laser beam,
The first two steps are repeated until a metal layer of a predetermined thickness is applied on the surface of the ceramic body.
2. The method of claim 1, wherein after applying at least one first layer of a first metal powder to the surface of the ceramic body and configuring the contact geometry by melting at least one region of the first metal powder using a laser beam, applying at least one layer of a second metal powder to the first layer and configuring the contact geometry by melting at least one region of the second metal powder using a laser beam.
3. Method according to claim 1 or 2, characterized in that the ceramic body is lowered by a predetermined amount after structuring the contact geometry, in particular by the layer thickness of the metal powder, and then a new layer of metal powder is applied to the surface of the ceramic body.
4. A method according to any one of claims 1 to 3, characterized in that the metal powder used is a powder made of copper, gold, tin or nickel or a combination of different metal powders, the particle size of which is 10-60 μm, in particular 15-50 μm.
5. The method according to any one of claims 1 to 4, characterized in that the ceramic body consists of a metal oxide, in particular a metal oxide based on tin or titanium.
6. The method according to any one of claims 1 to 5, wherein the ceramic body is positioned and fixed in a printing chamber of a 3D metal printer in a first step.
7. The method of claim 6, wherein applying at least one layer of metal powder onto the surface of the ceramic body and subsequently melting some areas of the metal powder using a laser beam is performed in a protective gas atmosphere within a printing chamber of a 3D metal printer.
8. Ceramic body (1) having a metal layer (2) on at least one surface (3-8), wherein the metal layer (2) is applied to said surface according to the method of any one of claims 1 to 7.
9. Ceramic body (1) according to claim 8, characterized in that said metal layer (2) consists of at least two layers (2 a, 2b, 2 c) made of different metal materials, superimposed on each other.
10. Ceramic body (1) according to claim 8 or 9, characterized in that the ceramic body (1) is a ceramic resistor having two end faces (5, 6) opposite to each other, and wherein a metal layer (2) is applied on the two end faces (5, 6) or adjacent to the two end faces (5, 6) on the top face (3), on the bottom face (4) or on one of the two longitudinal faces (7, 8) of the ceramic body (1), respectively.
CN202311462363.2A 2022-11-03 2023-11-03 Method for applying a metal layer on the surface of a ceramic body Pending CN117986045A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022129023.9 2022-11-03
DE102022129023.9A DE102022129023A1 (en) 2022-11-03 2022-11-03 Method for applying a metallic layer to a surface of a ceramic body

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Publication Number Publication Date
CN117986045A true CN117986045A (en) 2024-05-07

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DE (1) DE102022129023A1 (en)

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Publication number Priority date Publication date Assignee Title
DE102015101430A1 (en) 2015-01-31 2016-08-04 BEAPLAS GmbH Three-dimensional hybrid coating systems

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