CN117979647A

CN117979647A - Adsorption refrigerating device

Info

Publication number: CN117979647A
Application number: CN202410160274.0A
Authority: CN
Inventors: 戴进成; 井萃汝; 贾晖
Original assignee: XFusion Digital Technologies Co Ltd
Current assignee: XFusion Digital Technologies Co Ltd
Priority date: 2024-02-04
Filing date: 2024-02-04
Publication date: 2024-05-03

Abstract

The embodiment of the application provides an adsorption refrigeration device, and relates to the technical field of liquid cooling. The adsorption refrigeration device comprises an adsorber, and a heat exchanger of the adsorber comprises a first heat exchange component and a second heat exchange component. The first heat exchange assembly comprises a first heat exchange flow channel, the second heat exchange assembly comprises a second heat exchange flow channel, the first heat exchange flow channel and the second heat exchange flow channel are mutually isolated flow channels, the inlet end of the first heat exchange flow channel is used for being connected with the outlet end of heat supply equipment, and the inlet end of the second heat exchange flow channel is used for being connected with the outlet end of cold source equipment. Thus, when the adsorption and desorption are alternately carried out, the mediums from the heat supply equipment and the cold source equipment are not easy to pollute each other.

Description

Adsorption refrigerating device

Technical Field

The embodiment of the application relates to the technical field of liquid cooling, in particular to an adsorption refrigeration device.

Background

Data centers often include communication equipment, storage equipment, power supply equipment, and the like, and data centers generate significant amounts of heat during operation. As the performance of electronic devices is continuously improved, the thermal density of the electronic devices is higher and higher, and the requirement for heat dissipation of the electronic devices is also higher and higher. In order to improve the heat dissipation efficiency of electronic devices, liquid cooling devices such as liquid cooling servers and liquid cooling cabinets have been developed.

In the related art, the data center may include an adsorber including a heat exchanger for flowing a medium for exchanging heat with the adsorbent. However, in the related art, the medium flowing through the heat exchanger is easily contaminated.

Disclosure of Invention

The embodiment of the application provides an adsorption refrigeration device, which is characterized in that two heat exchange channels which are isolated from each other are arranged in a heat exchanger of an absorber, and the two heat exchange channels are respectively connected with heating equipment and cold source equipment, so that mediums from the heating equipment and mediums from the cold source equipment are not easy to pollute each other when the absorber alternately performs adsorption and desorption.

The embodiment of the application provides an adsorption refrigeration device, which comprises an evaporator, a condenser and an adsorber. The adsorber comprises an adsorption cavity and a heat exchanger arranged in the adsorption cavity, wherein the outlet end of the adsorber is connected with the inlet end of the condenser, the outlet end of the condenser is connected with the inlet end of the evaporator, the outlet end of the evaporator is connected with the inlet end of the adsorber, and the inlet end of the adsorber and the outlet end of the adsorber are both communicated with the adsorption cavity.

The heat exchanger includes a first heat exchange assembly and a second heat exchange assembly. The first heat exchange assembly comprises a first heat exchange flow channel, the second heat exchange assembly comprises a second heat exchange flow channel, the first heat exchange flow channel and the second heat exchange flow channel are mutually isolated flow channels, the inlet end of the first heat exchange flow channel is used for being connected with the outlet end of heat supply equipment, and the inlet end of the second heat exchange flow channel is used for being connected with the outlet end of cold source equipment.

In the adsorption refrigeration device provided by the embodiment of the application, when the adsorption device is used for alternately desorbing and adsorbing, the medium from the heat supply equipment flows through the first heat exchange flow channel to supply heat to the adsorbate in the adsorption cavity, and the medium from the cold source equipment flows through the second heat exchange flow channel to supply cold to the adsorbate in the adsorption cavity, so that the first heat exchange flow channel and the second heat exchange flow channel are mutually isolated, and the medium from the heat supply equipment and the medium from the cold source equipment are not easy to pollute each other.

In one possible embodiment, the first heat exchange assembly comprises a plurality of first heat exchange plates arranged side by side in a first direction, the first heat exchange flow channels comprising first in-plate heat exchange flow channels in each first heat exchange plate, an inlet end of the first in-plate heat exchange flow channels being adapted to be connected to an outlet end of the heating apparatus. The second heat exchange assembly comprises a plurality of second heat exchange plates which are distributed side by side along the first direction, the second heat exchange flow channels comprise second plate inner heat exchange flow channels which are positioned in each second heat exchange plate, and the inlet ends of the second plate inner heat exchange flow channels are used for being connected with the outlet ends of the cold source equipment. The first heat exchange plates and the second heat exchange plates are alternately arranged in the first direction. The first direction is the thickness direction of the first heat exchange plate and the second heat exchange plate.

Therefore, the medium flowing through the first heat exchange assembly and the medium flowing through the second heat exchange assembly have higher heat exchange efficiency with the adsorbate in the adsorption cavity. In addition, when the adsorber is used for adsorption and desorption, the cooling capacity or the heat quantity provided by the heat exchanger is relatively uniform.

In one possible embodiment, the heat exchanger further includes a first connection pipe and a second connection pipe, both ends of the first connection pipe extend along the first direction, both ends of the second connection pipe extend along the first direction, the inlet end and the outlet end of the heat exchange flow channel in the first plate are respectively located at both ends of the first heat exchange plate in the second direction, the first connection pipe and the second connection pipe are respectively located at both sides of the first heat exchange plate in the second direction, the first connection pipe and the second connection pipe are respectively fixedly connected with both ends of the first heat exchange plate in the second direction and are respectively communicated with the inlet end and the outlet end of the heat exchange flow channel in the first plate, the inlet end of the heat exchange flow channel in the first plate is used for being connected with the outlet end of the heat supply device through the first connection pipe or the second connection pipe, and all the heat exchange flow channels in the first plate are arranged in parallel. The second direction is the length direction of the first heat exchange plate and the second heat exchange plate.

In this way, the fixing of the plurality of first heat exchange plates arranged along the first direction and the connection of the inlet end and the outlet end of the heat exchange flow channel in the first plate in the plurality of first heat exchange plates arranged along the first direction with the heat supply equipment are facilitated. In addition, the heat in the medium in each first plate heat exchange flow channel is relatively balanced, so that the heat exchange between each part of the heat exchanger and the adsorbate in the adsorption cavity is relatively balanced.

In one possible embodiment, the heat exchanger further includes a third connecting pipe and a fourth connecting pipe, two ends of the third connecting pipe extend along the first direction, two ends of the fourth connecting pipe extend along the first direction, an inlet end and an outlet end of the second in-plate heat exchange flow channel are respectively located at two ends of the second heat exchange plate in the second direction, the third connecting pipe and the fourth connecting pipe are respectively located at two sides of the second heat exchange plate in the second direction, the third connecting pipe and the fourth connecting pipe are respectively fixedly connected with two ends of the second heat exchange plate in the second direction and are respectively communicated with the inlet end and the outlet end of the second in-plate heat exchange flow channel, the inlet end of the second in-plate heat exchange flow channel is used for being connected with the outlet end of the cold source equipment through the third connecting pipe or the fourth connecting pipe, and all the second in-plate heat exchange flow channels are arranged in parallel.

Thus, the fixing of the plurality of second heat exchange plates arranged along the first direction and the connection of the inlet end and the outlet end of the heat exchange flow channel in the second plate in the plurality of second heat exchange plates arranged along the first direction with the cold source equipment are facilitated. In addition, the heat in the medium in each second plate heat exchange flow channel is relatively balanced, so that the heat exchange between each part of the heat exchanger and the adsorbate in the adsorption cavity is relatively balanced.

In one possible embodiment, the first heat exchange plate includes a first main plate portion, a first connection portion and a second connection portion, the first connection portion and the second connection portion are located at two ends of the first heat exchange plate in the second direction respectively, the first main plate portion is located between the first connection portion and the second connection portion, one end of the first main plate portion in the second direction is fixedly connected with the first connection pipe through the first connection portion, and the other end of the first main plate portion in the second direction is fixedly connected with the second connection pipe through the second connection portion.

The second heat exchange plate comprises a second main plate part, a third connecting part and a fourth connecting part, wherein the third connecting part and the fourth connecting part are respectively positioned at two ends of the second heat exchange plate in the second direction, the second main plate part is positioned between the third connecting part and the fourth connecting part, one end of the second main plate part in the second direction is fixedly connected with a third connecting pipe through the third connecting part, and the other end of the second main plate part in the second direction is fixedly connected with a fourth connecting pipe through the fourth connecting part.

The first main board part and the second main board part are arranged side by side in the first direction, the first connecting part and the third connecting part are positioned on the same side of the first main board part and the second main board part in the second direction, and the second connecting part and the fourth connecting part are positioned on the same side of the first main board part and the second main board part in the second direction.

The size of the first connecting part in the third direction is smaller than that of the first main board part in the third direction, the size of the third connecting part in the third direction is smaller than that of the second main board part in the third direction, and the projection of the first connecting part in the first direction is located outside the projection of the third connecting part in the first direction; and/or the dimension of the second connecting part in the third direction is smaller than the dimension of the first main board part in the third direction, the dimension of the fourth connecting part in the third direction is smaller than the dimension of the second main board part in the third direction, and the projection of the second connecting part in the first direction is positioned outside the projection of the fourth connecting part in the first direction. The third direction is the width direction of the first heat exchange plate and the second heat exchange plate.

Like this, the integrated level after being connected between first connecting pipe, second connecting pipe, third connecting pipe, fourth connecting pipe, first heat exchange component and the second heat exchange component is higher, occupation space is less.

In one possible embodiment, the first heat exchange component and the second heat exchange component are connected through a heat conducting structure, so that the first heat exchange component and the second heat exchange component can exchange heat through the heat conducting structure.

Like this, when adsorption and desorption, the adsorber all can be used for carrying out the heat exchange with the adsorbate with first heat transfer subassembly and second heat transfer subassembly, and the utilization ratio to first heat transfer subassembly and second heat transfer subassembly is higher, and can make to flow into the medium in the heat exchanger and have higher heat exchange efficiency between the adsorbate in the adsorption cavity. In addition, the adsorbents arranged at the first heat exchange assembly and the second heat exchange assembly can be fully utilized, so that the utilization rate of the adsorbents is high, and the adsorption capacity of the adsorbers to the adsorbents is high.

In one possible embodiment, a space is formed between the adjacent first heat exchange plate and the adjacent second heat exchange plate of the heat exchanger, the heat conducting structure comprises heat exchange fins arranged in the space, and two ends of each heat exchange fin are respectively connected with the adjacent first heat exchange plate and the adjacent second heat exchange plate on two sides, so that the adjacent first heat exchange plate and the adjacent second heat exchange plate can exchange heat through the heat exchange fins arranged between the adjacent first heat exchange plate and the adjacent second heat exchange plate.

Therefore, the medium flowing through the first plate inner flow channel and the second plate inner flow channel and the adsorbate in the adsorption cavity have higher heat exchange efficiency.

In one possible embodiment, the surface of the first heat exchange assembly, the surface of the second heat exchange assembly, and the surface of the heat transfer structure of the heat exchanger are each attached with a first adsorbent.

Thus, the heat exchange efficiency between the adsorbent at the first adsorbent and the heat exchanger is higher, and the adsorption and desorption efficiency of the adsorbent in the adsorption cavity is higher.

In one possible embodiment, a second adsorbent is filled between the first heat exchange assembly and the second heat exchange assembly.

Thus, the amount of the second adsorbent that can be filled is large, and the adsorption amount of the adsorbent by the adsorber can be made large. In addition, the adsorbate at the second adsorbent can exchange heat with the medium flowing through the first heat exchange flow channel and the medium flowing through the second heat exchange flow channel, and the utilization efficiency of the second adsorbent is higher.

In one possible embodiment, the inlet end of the adsorber is connected to the outlet end of the evaporator by a first valve, which is used to control the flow path between the inlet end of the adsorber and the outlet end of the evaporator. The outlet end of the absorber is connected with the inlet end of the condenser through a second valve, and the second valve is used for controlling the on-off of a flow path between the outlet end of the absorber and the inlet end of the condenser.

Thus, the flow path of the adsorbate during adsorption and desorption of the adsorber can be controlled by the first valve and the second valve, so that the adsorbate in the adsorption cavity flows into the condenser when the medium flowing through the first heat exchange flow passage supplies heat to the adsorber, and the adsorbate in the evaporator flows into the adsorption cavity when the medium flowing through the second heat exchange flow passage supplies cold to the adsorber.

In one possible embodiment, the adsorption refrigeration device comprises at least 2 adsorbers, the inlet end of each adsorber being connected to the outlet end of the evaporator by a respective first valve, and the outlet end of each adsorber being connected to the inlet end of the condenser by a respective second valve.

Thus, by controlling the first valve and the second valve connected to each adsorber, adsorption and desorption can be alternately performed by a plurality of adsorbers.

Drawings

Fig. 1 is a schematic diagram of an adsorption refrigeration device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a data center according to an embodiment of the present application;

FIG. 3 is a schematic flow path diagram of a data center according to an embodiment of the present application;

FIG. 4 is a schematic view of a heat exchanger according to an embodiment of the present application;

FIG. 5 is a schematic view of another view of the heat exchanger of FIG. 4;

FIG. 6 is a schematic view of the heat exchanger of FIG. 4 from yet another perspective;

Fig. 7 is a schematic view of a first heat exchange plate of a heat exchanger according to an embodiment of the present application;

Fig. 8 is a schematic view of a second heat exchange plate of a heat exchanger according to an embodiment of the present application;

Fig. 9 is a schematic view of a heat exchanger provided in an embodiment of the present application at adjacent first and second heat exchange plates;

fig. 10 is a schematic view of another heat exchanger according to an embodiment of the present application, where the first heat exchange plate and the second heat exchange plate are adjacent to each other;

FIG. 11 is a schematic diagram illustrating an assembly of a heat exchanger and a bracket according to an embodiment of the present application;

fig. 12 is a schematic view illustrating an assembly of a heat exchanger and a bracket according to another embodiment of the present application.

Reference numerals illustrate:

10. A machine room; 20. a liquid cooling device; 30. a cold source device; 40. a cooling liquid distribution device; 41. a fifth heat exchange flow passage; 42. a sixth heat exchange flow passage; 50. an adsorption refrigeration device; 60. a second driving device;

100. an evaporator; 110. an evaporation chamber; 120. a third heat exchange flow passage;

200. a condenser; 210. a condensing chamber; 220. a fourth heat exchange flow passage;

300. an adsorber; 310. an adsorption chamber; 320. a bracket; 321. a support plate; 322. a frame body;

400. A first driving device;

510. a third valve; 520. a fourth valve; 530. a fifth valve; 540. a sixth valve;

610. A first valve; 620. a second valve;

700. a heat exchanger; 710. a first heat exchange flow passage; 720. a second heat exchange flow passage;

730. A first heat exchange assembly; 731. a first heat exchange plate; 7311. a first main board portion; 73111. a first portion; 73112. a second portion; 7312. a first connection portion; 7313. a second connecting portion;

740. a second heat exchange assembly; 741. a second heat exchange plate; 7411. a second main board portion; 74111. a third section; 74112. a fourth section; 7412. a third connecting portion; 7413. a fourth connecting portion;

751. A first connection pipe; 752. a second connection pipe; 753. a third connection pipe; 754. a fourth connection pipe;

760. a thermally conductive structure; 761. a third heat exchange fin;

770. A spacing space;

810. A first adsorbent; 820. a second adsorbent;

910. A fifth connection pipe; 920. a sixth connection pipe; 930. a seventh connection pipe; 940. an eighth connection pipe;

x, a first direction; y, the second direction; z, third direction.

Detailed Description

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.

Adsorption refrigeration is a technique for evaporating a liquid adsorbent by using an adsorption effect to realize refrigeration. The adsorption refrigeration device can utilize the adsorption process and the phase change process to construct thermodynamic cycle through conversion of heat energy, adsorption potential energy and phase change potential energy so as to realize the purpose of heat refrigeration.

The embodiment of the application provides an adsorption refrigeration device which can be applied to systems such as a data center, a base station, an automobile and the like. That is, the adsorption refrigeration device may include, but is not limited to, an adsorption refrigeration device for a data center, an adsorption refrigeration device for a base station, an adsorption refrigeration device for an automobile, and the like.

Fig. 1 is a schematic diagram of an adsorption refrigeration device according to an embodiment of the present application.

As shown in fig. 1, in the embodiment of the application, the adsorption refrigeration device 50 includes an adsorber 300, the adsorber 300 has an inlet end and an outlet end, the adsorber 300 includes an adsorption cavity, an adsorbent is disposed in the adsorption cavity, the inlet end of the adsorber 300 and the outlet end of the adsorber 300 are both communicated with the adsorption cavity, the inlet end of the adsorber 300 is used for allowing the adsorbent to flow into the adsorption cavity, and the outlet end of the adsorber 300 is used for allowing the adsorbent in the adsorption cavity to flow out of the adsorption cavity. The adsorber 300 includes a heat exchanger disposed within the adsorption chamber for providing cold or heat to the adsorbent within the adsorption chamber to cause the adsorbent to be adsorbed by and desorbed from the adsorbent within the adsorption chamber.

Exemplary adsorbents may include, but are not limited to, cooling water, cooling oil, and the like.

By way of example, the adsorbent may comprise one or more of the following: activated carbon, silica gel, metal organic frameworks (metal organic frameworks, MOF), activated alumina, and the like.

The adsorption refrigeration device 50 further includes a condenser 200, the condenser 200 has an inlet end and an outlet end, the condenser 200 includes a condensation chamber, the inlet end of the condenser 200 and the outlet end of the condenser 200 are both communicated with the condensation chamber, the inlet end of the condenser 200 is used for allowing the adsorbate to flow into the condensation chamber so as to make the adsorbate exothermically condense in the condensation chamber, and the outlet end of the condenser 200 is used for allowing the adsorbate condensed in the condensation chamber to flow out of the condensation chamber. The condenser 200 includes a cooling member disposed in the condensing chamber for absorbing heat from the adsorbate in the condensing chamber to exothermically condense the adsorbate in the condensing chamber.

The outlet end of the adsorber 300 is connected to the inlet end of the condenser 200 so that the adsorbate desorbed in the adsorption chamber may flow into the condensing chamber for condensation.

By way of example, the cooling member may include heat exchange tubes or the like for passing a heat exchange medium therethrough.

The adsorption refrigeration device 50 also includes an evaporator 100, the evaporator 100 having an inlet end and an outlet end. The evaporator 100 includes an evaporation cavity, an inlet end of the evaporator 100 and an outlet end of the evaporator 100 are both communicated with the evaporation cavity, the inlet end of the evaporator 100 is used for allowing the adsorbate to flow into the evaporation cavity so as to enable the adsorbate to absorb heat and evaporate in the evaporation cavity, and the outlet end of the evaporator 100 is used for allowing the adsorbate evaporated in the evaporation cavity to flow out of the evaporation cavity. The evaporator 100 includes a heat supply part provided in the evaporation chamber, and absorbs heat of the heat supply part when the liquid adsorbent in the evaporation chamber evaporates, so that the heat supply part can be used for cooling.

The outlet end of the condenser 200 is connected to the inlet end of the evaporator 100, so that the adsorbate condensed by the condenser 200 can flow into the evaporation chamber for evaporation.

By way of example, the heat supply means may comprise heat exchange tubes or the like for the flow of a heat exchange medium.

The adsorber 300 may alternately heat and cool the adsorbents in the adsorption chambers by alternately supplying a high temperature medium and a low temperature medium into the heat exchanger, so that the adsorbents in the adsorption chambers may alternately desorb and adsorb, the desorbed adsorbents may flow into the condensation chambers from the adsorption chambers, the adsorbents flowing into the condensation chambers from the adsorption chambers may enter the evaporation chambers after being condensed into a liquid state by the condenser 200 in the condensation chambers, and the evaporator 100 may evaporate the adsorbents in the liquid state in the evaporation chambers, thereby realizing refrigeration.

In order to enable continuous cooling of the evaporator 100, the adsorption refrigeration device 50 may include two adsorbers 300, and the outlet ends of the two adsorbers 300 are connected to the inlet end of the condenser 200, so that continuous cooling of the evaporator 100 may be achieved by alternately supplying the two adsorbers 300 with the adsorbent to the condenser 200. Specifically, when one of the two adsorbers 300 is desorbed to supply the adsorbent to the condenser 200, the other adsorber 300 is adsorbed to store the adsorbent, and when the desorption process of the desorbed adsorber 300 is completed or the adsorption process of the adsorbed adsorber 300 is completed, the currently desorbed adsorber 300 is switched to adsorb to store the adsorbent, and the currently adsorbed adsorber 300 is switched to desorb to supply the adsorbent to the condenser 200, so that the adsorbent is continuously supplied to the condenser 200, the adsorbent is continuously evaporated in the evaporation chamber, and the evaporator 100 is continuously cooled.

The inlet ends of the two adsorbers 300 may be connected to the outlet end of the evaporator 100, so that the gaseous adsorbent flowing out of the evaporation chamber may flow into the adsorption chamber of the adsorber 300 for adsorption to be adsorbed by the adsorbent, and thus, recycling of the adsorbent may be achieved.

Illustratively, the evaporating chamber, condensing chamber and adsorbing chamber may be in a negative pressure environment, which facilitates heated evaporation of the adsorbate.

In order to enable the adsorbent between the outlet end of the condenser 200 and the inlet end of the evaporator 100 to flow smoothly and stably into the evaporation chamber, the adsorption refrigeration device 50 may further include a first driving device 400 disposed between the outlet end of the condenser 200 and the inlet end of the evaporator 100, where the outlet end of the condenser 200 is connected to the inlet end of the evaporator 100 through the first driving device 400, and the first driving device 400 is used for driving the adsorbent at the inlet end of the first driving device 400 to flow toward the inlet end of the evaporator 100.

In this way, the adsorbate in the condensation chamber may flow to the inlet end of the evaporator 100 under the driving of the first driving device 400, after the adsorbate in the condensation chamber flows out, the pressure in the condensation chamber is reduced, and the adsorbate may be sucked into the condensation chamber from the outlet end of the adsorber 300 that performs desorption, so the arrangement positions of the evaporator 100, the condenser 200 and the adsorber 300 may be more flexible. In addition, the adsorbate flows relatively stably toward the inlet end of the evaporator 100 under the driving of the first driving device 400, so that the problem that the adsorbate is difficult to flow from the inlet end of the evaporator 100 due to the large pressure in the evaporation cavity is not easy to occur, and the problem that evaporation efficiency of the evaporator 100 is reduced due to the difficulty in flowing of the adsorbate is not easy to occur.

By way of example, the first drive means 400 may include, but is not limited to, a drive pump, a throttle valve, and the like. When the first driving device 400 is a driving pump, the driving pump may be a constant frequency pump or a variable frequency pump.

Illustratively, both the evaporator 100 and the condenser 200 are disposed below the adsorber 300. In this way, the adsorber 300 does not need to support the evaporator 100 and the condenser 200, so that the requirement on the structural strength of the adsorber 300 is low, and a door opening with a larger size is formed on the side surface of the adsorber 300, so that articles such as a heat exchanger, an adsorbent and the like can be assembled in the adsorption cavity. In addition, the spacing between the evaporator 100 and the condenser 200 and the bearing surface for supporting the adsorption refrigeration device 50 is smaller, and the requirement for structural strength of the portion of the adsorption refrigeration device 50 for supporting the evaporator 100 and the condenser 200 is lower, so that the number of structural members of the portion of the adsorption refrigeration device 50 for supporting the evaporator 100 and the condenser 200 is smaller, the thickness is thinner, and the size of the adsorption refrigeration device 50 is further reduced.

In the embodiment of the application, the heat exchanger is provided with an inlet end and an outlet end, the inlet end of the heat exchanger is used for flowing high-temperature medium or low-temperature medium into the heat exchanger, the medium flowing into the heat exchanger can be used for carrying out heat exchange with the adsorbate in the adsorption cavity, and the outlet end of the heat exchanger is used for flowing out of the heat exchanger after carrying out heat exchange with the adsorbate in the adsorption cavity.

The inlet end of the heat exchanger is connected with the outlet end of the heat supply equipment and the outlet end of the cold source equipment, the outlet end of the heat supply equipment is used for enabling the high-temperature medium to flow out of the heat supply equipment, the high-temperature medium flowing out of the outlet end of the heat supply equipment can flow into the heat exchanger through the inlet end of the heat exchanger, and the high-temperature medium flowing into the heat exchanger can provide heat for the adsorbent in the adsorption cavity so that the adsorbent is desorbed from the adsorbent. The outlet end of the cold source equipment is used for allowing the low-temperature medium to flow out of the cold source equipment, the low-temperature medium flowing out of the outlet end of the cold source equipment can flow into the heat exchanger through the inlet end of the heat exchanger, and the low-temperature medium flowing into the heat exchanger can provide cold for the adsorbate in the adsorption cavity so that the adsorbate is adsorbed by the adsorbate.

By way of example, the heating equipment may include, but is not limited to, liquid cooling equipment that is a hot water tank, a data center, and the like.

By way of example, the cold source device may include, but is not limited to, a cooling tower, a cold water main, and the like.

In the related art, the outlet end of the heat supply device and the outlet end of the cold source device are connected to the same heat exchange flow passage of the heat exchanger, that is, when the adsorber alternately performs desorption and adsorption, the high temperature medium from the heat supply device and the low temperature medium from the cold source device alternately flow through the same heat exchange flow passage of the heat exchanger, residues are generated in the heat exchange flow passage when the high temperature medium from the heat supply device and the low temperature medium from the cold source device flow through the heat exchange flow passage, the high temperature medium from the heat supply device and the low temperature medium from the cold source device may be different mediums, or the quality standards of the high temperature medium from the heat supply device and the low temperature medium from the cold source device may be different, so that the medium from the heat supply device and the medium from the cold source device are liable to be contaminated with each other.

Based on the above, the embodiment of the application provides a heat exchanger, which comprises two heat exchange channels isolated from each other, wherein the inlet end of one heat exchange channel is used for being connected with the outlet end of heating equipment, and the inlet end of the other heat exchange channel is used for being connected with the outlet end of cold source equipment. Therefore, when the adsorber alternately carries out desorption and adsorption, the high-temperature medium from the heat supply equipment and the low-temperature medium from the cold source equipment respectively flow through two heat exchange channels which are isolated from each other in the heat exchanger, so that the medium from the heat supply equipment and the medium from the cold source equipment are not easy to pollute each other.

The embodiment of the application is described by taking a heat supply device as a liquid cooling device as an example, and the liquid cooling device can be a liquid cooling device of a data center. When the heat supply equipment is other equipment such as a hot water tank, the scheme that the heat supply equipment is liquid cooling equipment can be referred to for setting.

Fig. 2 is a schematic diagram of a data center according to an embodiment of the present application.

As shown in fig. 2, an embodiment of the present application provides a data center, which may include a machine room 10 and at least one liquid cooling apparatus 20 disposed in the machine room 10. The machine room 10 may be a closed room or an open room with one or more sides, for example. The machine room 10 may be a temporary room (e.g., tent, board room, etc.) or a permanent room.

The liquid cooling device 20 comprises a heating device, and heat generated by the heating device of the liquid cooling device 20 can be taken away by cooling liquid in the liquid cooling device 20, so that the liquid cooling device 20 has higher heat dissipation efficiency.

The liquid cooling apparatus 20 has an inlet end and an outlet end, the outlet end of the liquid cooling apparatus 20 is used for supplying the cooling liquid which absorbs the heat generated by the heating device to flow out of the liquid cooling apparatus 20, and the outlet end of the liquid cooling apparatus 20 is used for supplying the cooling liquid to flow into the liquid cooling apparatus 20.

Illustratively, any one of the liquid cooling apparatuses 20 may include, but is not limited to, a liquid cooling server, a liquid chiller, and the like. The liquid cooling server may be a blade server, a rack server, or the like.

Illustratively, any one of the liquid cooling apparatuses 20 may include, but is not limited to, a cold plate liquid cooling apparatus, an immersion liquid cooling apparatus, and the like.

The data center further includes an adsorption refrigeration device 50, and the adsorption refrigeration device 50 may be disposed in the machine room 10.

Fig. 3 is a schematic flow path diagram of a data center according to an embodiment of the present application.

As shown in fig. 3, the heat exchanger 700 includes a first heat exchange assembly 730 (see fig. 4), the first heat exchange assembly 730 is disposed in the adsorption cavity 310, the first heat exchange assembly 730 includes a first heat exchange flow passage 710 therein, and the medium flowing into the first heat exchange flow passage 710 can exchange heat with the adsorbent in the adsorption cavity 310. The first heat exchange flow channel 710 has an inlet end and an outlet end, the inlet end of the first heat exchange flow channel 710 is used for allowing a medium to flow into the first heat exchange flow channel 710, so that the medium in the first heat exchange flow channel 710 exchanges heat with the adsorbent in the adsorption cavity 310, and the outlet end of the first heat exchange flow channel 710 is used for allowing the medium in the first heat exchange flow channel 710 after exchanging heat with the adsorbent to flow out of the first heat exchange flow channel 710.

The inlet end of the first heat exchange flow channel 710 is connected to the outlet end of the liquid cooling device 20, and the outlet end of the first heat exchange flow channel 710 is connected to the inlet end of the liquid cooling device 20. The cooling liquid flowing out from the outlet end of the liquid cooling device 20 and absorbing the heat generated by the heat generating device of the liquid cooling device 20 can flow into the first heat exchange flow channel 710, the cooling liquid flowing into the first heat exchange flow channel 710 can be used for heating the adsorbate adsorbed by the adsorbent in the adsorption cavity 310 so as to desorb the adsorbate, and the cooling liquid from the liquid cooling device 20 can flow back into the liquid cooling device 20 after flowing out from the first heat exchange flow channel 710 and be continuously used for taking away the heat generated by the heat generating device of the liquid cooling device 20.

In this way, the heat generated by the heating device of the liquid cooling device 20 can be utilized to desorb the adsorbate in the adsorption cavity 310, so that the adsorption refrigeration device 50 can be used for refrigerating, the heat generated by the heating device of the liquid cooling device 20 can be recycled, the heat recovery efficiency of the data center can be improved, and the energy waste in the data center can be reduced.

Illustratively, the cooling fluid flowing from the outlet end of the liquid cooling apparatus 20 may include, but is not limited to, cooling water, a fluorinated fluid, and the like.

As shown in fig. 3, the heat exchanger 700 further includes a second heat exchange assembly 740 (see fig. 4), where the second heat exchange assembly 740 is disposed in the adsorption cavity 310, and the second heat exchange assembly 740 includes a second heat exchange flow passage 720, where the second heat exchange flow passage 720 and the first heat exchange flow passage 710 are isolated from each other, and the medium flowing into the second heat exchange flow passage 720 can exchange heat with the adsorbent in the adsorption cavity 310. The second heat exchange flow channel 720 has an inlet end and an outlet end, the inlet end of the second heat exchange flow channel 720 is used for allowing a medium to flow into the second heat exchange flow channel 720, so that the medium in the second heat exchange flow channel 720 exchanges heat with the adsorbent in the adsorption cavity 310, and the outlet end of the second heat exchange flow channel 720 is used for allowing the medium in the second heat exchange flow channel 720 after exchanging heat with the adsorbent to flow out of the second heat exchange flow channel 720.

When the heat exchanger 700 includes the first heat exchange assembly 730 and the second heat exchange assembly 740, the inlet end of the heat exchanger 700 includes the inlet end of the first heat exchange flow path 710 and the inlet end of the second heat exchange flow path 720, and the outlet end of the heat exchanger 700 includes the outlet end of the first heat exchange flow path 710 and the outlet end of the second heat exchange flow path 720.

The inlet end of the second heat exchange flow channel 720 is connected with the outlet end of the cold source device 30, and the outlet end of the second heat exchange flow channel 720 is connected with the inlet end of the cold source device 30, so that the medium with lower temperature flowing out of the outlet end of the cold source device 30 can flow into the second heat exchange flow channel 720, and the medium flowing into the second heat exchange flow channel 720 can be used for cooling the adsorbate in the adsorption cavity 310, so that the adsorbate is adsorbed by the adsorbate, and the medium from the cold source device 30 can flow back to the cold source device 30 for heat dissipation after flowing out of the second heat exchange flow channel 720. The cold source device 30 has an inlet end and an outlet end, the outlet end of the cold source device 30 is used for outputting low-temperature medium, the inlet end of the cold source device 30 is used for allowing the medium absorbing heat to flow into the cold source device 30, and the medium absorbing heat can dissipate heat in the cold source device 30.

In this way, when the adsorption device 300 alternately performs desorption and adsorption, the cooling liquid from the liquid cooling device 20 flows through the first heat exchange flow channel 710 to supply heat to the adsorbate in the adsorption cavity 310, the medium from the cold source device 30 flows through the second heat exchange flow channel 720 to supply cold to the adsorbate in the adsorption cavity 310, and the first heat exchange flow channel 710 and the second heat exchange flow channel 720 are isolated from each other, so that the cooling liquid from the liquid cooling device 20 and the medium from the cold source device 30 are not easy to pollute each other.

Illustratively, the medium exiting the outlet end of cold source device 30 may include, but is not limited to, cooling water, cooling oil, and the like.

By way of example, the data center may include a cold source device 30.

For example, the data center may not include the cold source device 30, and the cold source device 30 may be independent from the data center.

The inlet end of the first heat exchange flow channel 710 is connected to the outlet end of the liquid cooling device 20 through a third valve 510, and the third valve 510 is used for controlling the on-off of a flow path between the inlet end of the first heat exchange flow channel 710 and the outlet end of the liquid cooling device 20. When the adsorber 300 is desorbing, the third valve 510 may be opened to communicate the inlet end of the first heat exchange flow channel 710 with the outlet end of the liquid cooling apparatus 20, so that the cooling liquid flowing out of the liquid cooling apparatus 20 may flow into the first heat exchange flow channel 710 to supply heat to the adsorbate in the adsorption cavity 310. When the adsorber 300 performs adsorption, the third valve 510 may be closed to block the flow path between the inlet end of the first heat exchange flow channel 710 and the outlet end of the liquid cooling apparatus 20, so that the cooling liquid flowing out of the liquid cooling apparatus 20 cannot flow into the first heat exchange flow channel 710, so as to avoid the influence of the cooling liquid flowing out of the liquid cooling apparatus 20 flowing into the first heat exchange flow channel 710 on adsorption of the adsorbent in the adsorption cavity 310.

The inlet end of the second heat exchange flow channel 720 is connected with the outlet end of the cold source device 30 through a fourth valve 520, and the fourth valve 520 is used for controlling the on-off of a flow path between the inlet end of the second heat exchange flow channel 720 and the outlet end of the cold source device 30. When the adsorber 300 performs adsorption, the fourth valve 520 may be opened to communicate the flow path between the inlet end of the second heat exchange flow path 720 and the outlet end of the cold source device 30, so that the medium flowing out of the cold source device 30 may flow into the second heat exchange flow path 720 to cool the adsorbent in the adsorption cavity 310. When the adsorber 300 performs desorption, the fourth valve 520 may be closed, so that the flow path between the inlet end of the second heat exchange flow channel 720 and the outlet end of the cold source device 30 is blocked, so that the medium flowing out of the cold source device 30 cannot flow into the second heat exchange flow channel 720, and the influence of the medium flowing out of the cold source device 30 flowing into the second heat exchange flow channel 720 on the desorption of the adsorbent in the adsorption cavity 310 is avoided.

The outlet end of the first heat exchange flow channel 710 is connected to the inlet end of the liquid cooling device 20 through a fifth valve 530, and the fifth valve 530 is used for controlling the on-off of the flow path between the outlet end of the first heat exchange flow channel 710 and the inlet end of the liquid cooling device 20. When the adsorber 300 is desorbing, the fifth valve 530 may be opened to communicate the flow path between the outlet end of the first heat exchange flow channel 710 and the inlet end of the liquid cooling device 20, so that the cooling liquid from the liquid cooling device 20 may flow back to the liquid cooling device 20 after exchanging heat with the adsorbate in the adsorption cavity 310 in the first heat exchange flow channel 710. When the adsorber 300 performs adsorption, the fifth valve 530 may be closed to block the flow path between the outlet end of the first heat exchange flow path 710 and the inlet end of the liquid cooling apparatus 20, so that the cooling liquid is not easy to flow into the first heat exchange flow path 710 from the outlet end of the first heat exchange flow path 710, and further the adsorption of the adsorbate in the adsorption cavity 310 is affected.

The outlet end of the second heat exchange flow channel 720 is connected to the inlet end of the cold source device 30 through a sixth valve 540, and the sixth valve 540 is used for controlling the on-off of the flow path between the outlet end of the second heat exchange flow channel 720 and the inlet end of the cold source device 30. When the adsorber 300 performs adsorption, the sixth valve 540 may be opened to communicate the flow path between the outlet end of the second heat exchange flow path 720 and the inlet end of the cold source device 30, so that the medium from the cold source device 30 may flow back to the cold source device 30 after exchanging heat with the adsorbent in the adsorption cavity 310 in the second heat exchange flow path 720. When the adsorber 300 performs desorption, the sixth valve 540 may be closed, so that the flow path between the outlet end of the second heat exchange flow channel 720 and the inlet end of the cold source device 30 is blocked, and the medium is not easy to flow into the second heat exchange flow channel 720 from the outlet end of the second heat exchange flow channel 720, thereby affecting the desorption of the adsorbate in the adsorption cavity 310.

The inlet end of the adsorber 300 is connected to the outlet end of the evaporator 100 through a first valve 610, and the first valve 610 is used to control the flow path between the inlet end of the adsorber 300 and the outlet end of the evaporator 100. When the adsorber 300 performs adsorption, the first valve 610 may be opened to allow a flow path between the inlet end of the adsorber 300 and the outlet end of the evaporator 100 so that the adsorbent flowing out of the outlet end of the evaporator 100 may flow into the adsorption chamber 310 to be adsorbed by the adsorbent. The first valve 610 may be closed to shut off the flow path between the inlet end of the adsorber 300 and the outlet end of the evaporator 100 when the adsorber 300 is desorbing.

The outlet end of the adsorber 300 is connected to the inlet end of the condenser 200 through a second valve 620, and the second valve 620 is used to control the on/off of the flow path between the outlet end of the adsorber 300 and the inlet end of the condenser 200. During desorption of the adsorber 300, the second valve 620 may be opened to allow a flow path between the outlet end of the adsorber 300 and the inlet end of the condenser 200 so that the desorbed adsorbate from the adsorption chamber 310 may flow into the condensation chamber 210 for condensation. When the adsorber 300 is adsorbing, the second valve 620 may be closed to shut off the flow path between the outlet end of the adsorber 300 and the inlet end of the condenser 200.

The first valve 610 and the second valve 620 may each be a vacuum valve to be suitable for use in a negative pressure environment.

When the adsorption refrigeration apparatus 50 includes a plurality of adsorbers 300, the inlet end of the first heat exchange flow path 710 of each adsorber 300 may be connected to the outlet end of the liquid cooling device 20 through a corresponding third valve 510, the inlet end of the second heat exchange flow path 720 of each adsorber 300 may be connected to the outlet end of the cold source device 30 through a corresponding fourth valve 520, the outlet end of the first heat exchange flow path 710 of each adsorber 300 may be connected to the inlet end of the liquid cooling device 20 through a corresponding fifth valve 530, the outlet end of the second heat exchange flow path 720 of each adsorber 300 may be connected to the inlet end of the cold source device 30 through a corresponding sixth valve 540, the inlet end of each adsorber 300 may be connected to the outlet end of the evaporator 100 through a corresponding first valve 610, and the outlet end of each adsorber 300 may be connected to the inlet end of the condenser 200 through a corresponding second valve 620.

When the plurality of adsorbers 300 alternately perform adsorption and desorption, the third valve 510, the fifth valve 530, and the second valve 620 connected to the adsorbers 300 performing the desorption are opened, the fourth valve 520, the sixth valve 540, and the first valve 610 connected to the adsorbers 300 performing the desorption are closed, the fourth valve 520, the sixth valve 540, and the first valve 610 connected to the adsorbers 300 performing the adsorption are opened, and the third valve 510, the fifth valve 530, and the second valve 620 connected to the adsorbers 300 performing the adsorption are closed.

The heat supply part may include a third heat exchange flow channel 120, where the third heat exchange flow channel 120 is isolated from the evaporation cavity 110, and the evaporator 100 is configured to exchange heat between a medium in the third heat exchange flow channel 120 and an adsorbent in the evaporation cavity 110, and absorb heat in the medium in the third heat exchange flow channel 120 when the liquid adsorbent in the evaporation cavity 110 evaporates. For example, the heat supply part may include a first heat exchange pipe including the third heat exchange flow passage 120, and a surface of the first heat exchange pipe may have first heat exchange fins. The evaporator 100 may be configured to make a low-temperature medium by introducing a high-temperature or normal-temperature medium into the third heat exchange flow passage 120. For example, the evaporator 100 may be made into cold water by supplying normal temperature water or high temperature water into the third heat exchange flow path 120.

For example, cold water produced by the evaporator 100 may be supplied to a cold source device 30, a cooling device, or other device or devices requiring cold to reduce energy consumption of the data center. Specifically, in some examples where the heating part includes the third heat exchange flow passage 120, the third heat exchange flow passage 120 may communicate with the cold source device 30, so that the low temperature medium made through the third heat exchange flow passage 120 may be used to radiate heat of the medium flowing back to the cold source device 30 after absorbing heat. For example, when the cold source device 30 is a cooling tower, the third heat exchange flow passage 120 may be in communication with a water distributor of the cooling tower, and the low-temperature medium produced through the third heat exchange flow passage 120 may flow to the water distributor of the cooling tower.

The cooling component may include a fourth heat exchange flow channel 220, where the fourth heat exchange flow channel 220 is isolated from the condensation chamber 210, and the condenser 200 is configured to exchange heat between a medium in the fourth heat exchange flow channel 220 and an adsorbent in the condensation chamber 210, and may take heat from the adsorbent in the condensation chamber 210 away by introducing a medium with a lower temperature into the fourth heat exchange flow channel 220, so as to condense the adsorbent in the condensation chamber 210. For example, the cooling member may include a second heat exchange tube including a fourth heat exchange flow passage 220, and a surface of the second heat exchange tube may have second heat exchange fins.

The fourth heat exchange flow channel 220 has an inlet end and an outlet end, and the medium for exchanging heat with the adsorbate in the condensation chamber 210 flows into the fourth heat exchange flow channel 220 through the inlet end of the fourth heat exchange flow channel 220, and after exchanging heat with the adsorbate in the condensation chamber 210, flows out of the fourth heat exchange flow channel 220 through the outlet end of the fourth heat exchange flow channel 220.

In some possible embodiments, the outlet end of the fourth heat exchange flow passage 220 of the cooling part is configured to communicate with the inlet end of the cold source device 30, and the inlet end of the fourth heat exchange flow passage 220 is connected to the outlet end of the second heat exchange flow passage 720, such that the outlet end of the second heat exchange flow passage 720 is connected to the inlet end of the cold source device 30 through the fourth heat exchange flow passage 220.

In this way, the low-temperature medium flowing out of the cold source device 30 after flowing through the second heat exchange flow passage 720 may flow into the fourth heat exchange flow passage 220 to absorb the heat of the adsorbate in the condensation chamber 210, so that the adsorbate in the condensation chamber 210 is cooled and condensed, and then flows out of the fourth heat exchange flow passage 220 to flow back into the cold source device 30. In this way, the utilization rate of the low-temperature medium flowing out of the cold source device 30 is high, and the number of the auxiliary devices such as the pipelines in the data center and the use amount of the medium for cooling in the data center can be reduced.

When the outlet end of the second heat exchange flow channel 720 is connected to the inlet end of the cold source device 30 through the sixth valve 540, the sixth valve 540 is disposed between the outlet end of the second heat exchange flow channel 720 and the inlet end of the fourth heat exchange flow channel 220, that is, the outlet end of the second heat exchange flow channel 720 is connected to the inlet end of the fourth heat exchange flow channel 220 through the sixth valve 540, and the sixth valve 540 is used for controlling the on-off of the flow path between the outlet end of the second heat exchange flow channel 720 and the inlet end of the fourth heat exchange flow channel 220.

In some possible embodiments, the data center may further include a coolant distribution device 40 (coolant distribution units, CDU), the coolant distribution device 40 including a fifth heat exchange flow path 41, the coolant distribution device 40 being operable to dissipate heat from the coolant within the fifth heat exchange flow path 41.

The fifth heat exchange flow channel 41 has an inlet end and an outlet end, the inlet end of the fifth heat exchange flow channel 41 is used for allowing the cooling liquid to flow into the fifth heat exchange flow channel 41 so as to dissipate heat in the fifth heat exchange flow channel 41, and the outlet end of the fifth heat exchange flow channel 41 is used for allowing the cooling liquid after dissipating heat in the fifth heat exchange flow channel 41 to flow out of the fifth heat exchange flow channel 41.

The outlet end of the fifth heat exchange flow channel 41 is used for being communicated with the inlet end of the liquid cooling device 20, and the inlet end of the fifth heat exchange flow channel 41 is used for being communicated with the outlet end of the first heat exchange flow channel 710, so that the outlet end of the first heat exchange flow channel 710 is connected with the inlet end of the liquid cooling device 20 through the fifth heat exchange flow channel 41.

In this way, after the cooling liquid flowing out from the liquid cooling device 20 passes through the first heat exchange flow channel 710, the cooling liquid can enter the cooling liquid distribution device 40 to further dissipate heat, so that the temperature of the cooling liquid flowing back to the liquid cooling device 20 meets the requirement of the liquid inlet temperature of the liquid cooling device 20.

When the outlet end of the first heat exchange flow channel 710 is connected to the inlet end of the liquid cooling device 20 through the fifth valve 530, the fifth valve 530 is disposed between the outlet end of the first heat exchange flow channel 710 and the inlet end of the fifth heat exchange flow channel 41, that is, the outlet end of the first heat exchange flow channel 710 is connected to the inlet end of the fifth heat exchange flow channel 41 through the fifth valve 530, and the fifth valve 530 is used for controlling the on-off of the flow path between the outlet end of the first heat exchange flow channel 710 and the inlet end of the fifth heat exchange flow channel 41.

For example, a fan blowing air toward the fifth heat exchanging channel 41 may be provided at the cooling liquid distribution device 40, and heat dissipating fins may be provided on the outer wall of the fifth heat exchanging channel 41 so that the cooling liquid in the fifth heat exchanging channel 41 may release heat.

The cooling liquid distribution device 40 may further include a sixth heat exchange flow channel 42, where the fifth heat exchange flow channel 41 and the sixth heat exchange flow channel 42 are isolated from each other, and the cooling liquid distribution device 40 is configured to exchange heat between the cooling liquid in the fifth heat exchange flow channel 41 and the medium in the sixth heat exchange flow channel 42, and may take away heat in the cooling liquid in the fifth heat exchange flow channel 41 by introducing the medium with a lower temperature into the sixth heat exchange flow channel 42, so that the cooling liquid in the fifth heat exchange flow channel 41 may release heat.

The sixth heat exchange flow channel 42 has an inlet end and an outlet end, the medium for taking away the heat of the cooling liquid in the fifth heat exchange flow channel 41 flows into the sixth heat exchange flow channel 42 through the inlet end of the sixth heat exchange flow channel 42, and after the medium in the sixth heat exchange flow channel 42 exchanges heat with the cooling liquid in the fifth heat exchange flow channel 41, the medium flows out of the sixth heat exchange flow channel 42 through the outlet end of the sixth heat exchange flow channel 42.

In some possible embodiments, the outlet end of the sixth heat exchange flow channel 42 is configured to communicate with the inlet end of the cold source device 30, and the inlet end of the sixth heat exchange flow channel 42 is configured to communicate with the outlet end of the cold source device 30.

In this way, the low-temperature medium can be supplied into the sixth heat exchange flow path 42 by the cold source device 30 supplying the low-temperature medium into the second heat exchange flow path 720, that is, the same cold source device 30 can be used to supply the cold amount for adsorbing the adsorbent in the adsorption chamber 310 to the adsorber 300 and to remove the heat from the coolant in the fifth heat exchange flow path 41, so that the number of devices to be installed can be reduced.

In some possible embodiments, the data center further includes a second driving device 60, and an inlet end of the second heat exchange flow channel 720 is connected to an outlet end of the cold source device 30 through the second driving device 60.

In this way, the second driving device 60 can provide the power for making the medium in the cold source device 30 flow to the second heat exchange flow channel 720, so as to facilitate the medium flowing out from the cold source device 30 to flow in a stable and circulating manner.

When the inlet end of the second heat exchange flow channel 720 is connected to the outlet end of the cold source device 30 through the fourth valve 520, the second driving device 60 is disposed between the fourth valve 520 and the outlet end of the cold source device 30, the inlet end of the second driving device 60 is connected to the outlet end of the cold source device 30, the inlet end of the second heat exchange flow channel 720 is connected to the outlet end of the second driving device 60 through the fourth valve 520, the second driving device 60 is used for driving the medium in the cold source device 30 to flow to the fourth valve 520, and the fourth valve 520 is used for controlling the on-off of the flow path between the inlet end of the second heat exchange flow channel 720 and the outlet end of the second driving device 60.

By way of example, the second drive 60 may include, but is not limited to, a drive pump, a throttle valve, and the like.

Fig. 4 is a schematic view of a heat exchanger according to an embodiment of the present application, and fig. 5 is a schematic view of another view of the heat exchanger in fig. 4. The x direction is a first direction, the y direction is a second direction, the z direction is a third direction, the first direction is a thickness direction of the first heat exchange plate 731 and the second heat exchange plate 741, the second direction is a length direction of the first heat exchange plate 731 and the second heat exchange plate 741, and the third direction is a width direction of the first heat exchange plate 731 and the second heat exchange plate 741.

As shown in fig. 4 and 5, in some possible embodiments, the first heat exchange assembly 730 and the second heat exchange assembly 740 are connected by a heat conducting structure 760, so that the first heat exchange assembly 730 and the second heat exchange assembly 740 can exchange heat through the heat conducting structure 760.

In this way, when the medium flows through the first heat exchange flow channel 710, the medium in the first heat exchange flow channel 710 can exchange heat with the adsorbate in the adsorption cavity 310 through the first heat exchange component 730, the heat conducting structure 760 and the second heat exchange component 740, and the overall heat exchange area formed by the first heat exchange component 730, the second heat exchange component 740 and the heat conducting structure 760 is larger, so that the heat exchange efficiency between the medium in the first heat exchange flow channel 710 and the adsorbate in the adsorption cavity 310 is higher. When the medium flows through the second heat exchange flow passage 720, the medium in the second heat exchange flow passage 720 can exchange heat with the adsorbate in the adsorption cavity 310 through the second heat exchange component 740, the heat conduction structure 760 and the first heat exchange component 730, and the overall heat exchange area formed by the first heat exchange component 730, the second heat exchange component 740 and the heat conduction structure 760 is larger, so that the heat exchange efficiency of the medium in the second heat exchange flow passage 720 and the adsorbate in the adsorption cavity 310 is higher. In this way, during adsorption and desorption, the adsorber 300 may be used for heat exchange with the adsorbate by the first heat exchange assembly 730 and the second heat exchange assembly 740, so that the utilization rate of the first heat exchange assembly 730 and the second heat exchange assembly 740 is higher, and the heat exchange efficiency between the medium flowing into the heat exchanger 700 and the adsorbate in the adsorption cavity 310 is higher. In addition, the adsorbents disposed at the first heat exchange assembly 730 and the second heat exchange assembly 740 may be more fully utilized, so that the utilization rate of the adsorbents is higher, and the adsorption capacity of the adsorber 300 to the adsorbents is larger.

In some possible embodiments, the first heat exchange assembly 730 comprises a plurality of first heat exchange plates 731 arranged side by side in a first direction, the first heat exchange flow channels 710 comprising first in-plate heat exchange flow channels within each first heat exchange plate 731, an inlet end of the first in-plate heat exchange flow channels being for connection to an outlet end of a heating device. Particularly, when the heat supply device is the liquid cooling device 20, the inlet end of the heat exchange flow channel in the first plate is used for being connected with the outlet end of the liquid cooling device 20.

In this way, the first heat exchange plate 731 has a larger heat exchange area, so that the heat exchange efficiency between the first heat exchange plate 731 and the adsorbate in the adsorption cavity 310 is higher. In addition, the first heat exchange flow passage 710 includes a first in-plate heat exchange flow passage located in the first heat exchange plate 731, and a heat conduction path between the medium in the first in-plate heat exchange flow passage and the first heat exchange plate 731 is shorter, so that heat exchange efficiency between the medium in the first heat exchange flow passage 710 and the adsorbent in the adsorption cavity 310 is higher.

Illustratively, the first heat exchange plate 731 is a hollow shell-like structure, and the shell of the first heat exchange plate 731 encloses to form a first intra-plate heat exchange flow passage. In this way, the heat exchange area between the medium in the first plate heat exchange flow channel and the first heat exchange plate 731 is larger, so that the heat exchange efficiency is higher, and the heat exchange efficiency between the medium in the first plate heat exchange flow channel and the medium in the adsorption cavity 310 is improved.

The outlet end of the heat exchange flow channel in the first plate is used for being connected with the inlet end of the heating equipment. Specifically, when the heat supply device is the liquid cooling device 20, the outlet end of the heat exchange flow channel in the first plate is used for being connected with the inlet end of the liquid cooling device 20. For example, the outlet end of the first plate heat exchange flow passage may be connected to the inlet end of the fifth valve 530.

In some possible embodiments, the second heat exchange assembly 740 includes a plurality of second heat exchange plates 741 arranged side by side in the first direction, and the second heat exchange flow passages 720 include second in-plate heat exchange flow passages located in each of the second heat exchange plates 741, with an inlet end of the second in-plate heat exchange flow passages being adapted to be connected to an outlet end of the heat sink apparatus 30.

In this way, the second heat exchange plate 741 has a larger heat exchange area, so that the heat exchange efficiency between the second heat exchange plate 741 and the adsorbent in the adsorption chamber 310 is higher. In addition, the second heat exchange flow channel 720 includes a second in-plate heat exchange flow channel located in the second heat exchange plate 741, and the heat conduction path between the medium in the second in-plate heat exchange flow channel and the second heat exchange plate 741 is shorter, so that the heat exchange efficiency between the medium in the second heat exchange flow channel 720 and the adsorbent in the adsorption cavity 310 is higher.

The second heat exchange plate 741 is a hollow shell structure, and the shell of the second heat exchange plate 741 encloses to form a second heat exchange flow channel in the plate. In this way, the heat exchange area between the medium in the second plate heat exchange flow channel and the second heat exchange plate 741 is larger, and the heat exchange efficiency is higher, so that the heat exchange efficiency between the medium in the second plate heat exchange flow channel and the medium in the adsorption cavity 310 is improved.

The outlet end of the second plate heat exchange flow passage is connected to the inlet end of the cold source device 30. For example, the outlet end of the second plate heat exchange flow passage may be connected to the inlet end of the sixth valve 540.

In some possible embodiments, all the first heat exchanger plates 731 and all the second heat exchanger plates 741 are alternately arranged in the first direction.

In this manner, the heat exchanger 700 provides a relatively uniform amount of cooling or heat throughout the adsorber 300 during adsorption and desorption.

In some possible embodiments, the heat exchanger 700 further includes a first connection pipe 751 and a second connection pipe 752, both ends of the first connection pipe 751 extend in the first direction, both ends of the second connection pipe 752 extend in the first direction, an inlet end and an outlet end of the first in-plate heat exchange flow path are respectively located at both ends of the first heat exchange plate 731 in the second direction, the first connection pipe 751 and the second connection pipe 752 are respectively located at both sides of the first heat exchange plate 731 in the second direction, the first connection pipe 751 and the second connection pipe 752 are respectively fixedly connected to both ends of the first heat exchange plate 731 in the second direction and respectively communicate with an inlet end and an outlet end of the first in-plate heat exchange flow path, the inlet end of the first in-plate heat exchange flow path is connected to an outlet end of the heating apparatus through one of the first connection pipe 751 and the second connection pipe 752, and the outlet end of the first in-plate heat exchange flow path is connected to an inlet end of the heating apparatus through the other of the first connection pipe 751 and the second connection pipe 752. Specifically, when the heating apparatus is the liquid cooling apparatus 20, the inlet end of the first in-plate heat exchange flow channel is connected to the outlet end of the liquid cooling apparatus 20 through one of the first connection pipe 751 and the second connection pipe 752, and the outlet end of the first in-plate heat exchange flow channel is connected to the inlet end of the liquid cooling apparatus 20 through the other of the first connection pipe 751 and the second connection pipe 752.

In this way, the plurality of first heat exchange plates 731 arranged in the first direction may be fixedly connected through the first connection pipes 751 and the second connection pipes 752, so that the fixing of the plurality of first heat exchange plates 731 arranged in the first direction is facilitated. In addition, the inlet ends of the first plate internal heat exchange flow channels in the plurality of first heat exchange plates 731 arranged along the first direction are conveniently connected with the outlet ends of the heat supply equipment, so that the medium flowing out of the heat supply equipment can flow into each first plate internal heat exchange flow channel. The outlet ends of the first plate heat exchange channels in the plurality of first heat exchange plates 731 arranged along the first direction are also more conveniently connected with the inlet ends of the heat supply equipment, so that the medium after heat exchange with the adsorbate in the adsorption cavity 310 in the first plate heat exchange channels can flow back to the heat supply equipment.

All the heat exchange flow passages in the first plate are arranged in parallel.

In this way, the heat in the medium in the heat exchange flow channels in each first plate is relatively balanced, so that the heat exchange between the heat exchanger 700 and the adsorbate in the adsorption cavity 310 is relatively balanced.

In some possible embodiments, the heat exchanger 700 further includes a third connection pipe 753 and a fourth connection pipe 754, both ends of the third connection pipe 753 extend in the first direction, both ends of the fourth connection pipe 754 extend in the first direction, an inlet end and an outlet end of the second in-plate heat exchange flow channel are respectively located at both ends of the second heat exchange plate 741 in the second direction, the third connection pipe 753 and the fourth connection pipe 754 are respectively located at both sides of the second heat exchange plate 741 in the second direction, the third connection pipe 753 and the fourth connection pipe 754 are respectively fixedly connected to both ends of the second heat exchange plate 741 in the second direction and respectively communicate with an inlet end and an outlet end of the second in-plate heat exchange flow channel, which is used to be connected to an outlet end of the cold source device 30 through one of the third connection pipe 753 and the fourth connection pipe 754, and an outlet end of the second in-plate heat exchange flow channel is used to be connected to an outlet end of the cold source device 30 through the other of the third connection pipe 753 and the fourth connection pipe 754.

In this way, the plurality of second heat exchange plates 741 arranged in the first direction may be fixedly connected through the third connection pipe 753 and the fourth connection pipe 754, so that the fixation of the plurality of second heat exchange plates 741 arranged in the first direction is facilitated. In addition, the inlet ends of the second plate heat exchange flow channels in the plurality of second heat exchange plates 741 arranged along the first direction are conveniently connected with the outlet ends of the cold source device 30, so that the medium flowing out of the cold source device 30 can flow into each second plate heat exchange flow channel. The outlet ends of the heat exchange flow channels in the second plates in the plurality of second heat exchange plates 741 arranged along the first direction are also more convenient to be connected with the inlet ends of the cold source equipment 30, so that the medium after heat exchange with the adsorbate in the adsorption cavity 310 in the heat exchange flow channels in the second plates can flow back to the cold source equipment 30.

All the heat exchange flow passages in the second plate are arranged in parallel.

In this way, the cooling capacity in the medium in the heat exchange flow channel in each second plate is relatively balanced, so that the heat exchange between each part of the heat exchanger 700 and the adsorbate in the adsorption cavity 310 is relatively balanced.

Fig. 6 is a schematic view of the heat exchanger of fig. 4 from yet another perspective.

As shown in fig. 6, and referring to fig. 4 and 5, in some possible embodiments, the first heat exchange plate 731 includes a first main plate portion 7311, a first connection portion 7312, and a second connection portion 7313, the first connection portion 7312 and the second connection portion 7313 are located at both ends of the first heat exchange plate 731 in the second direction, respectively, the first main plate portion 7311 is located between the first connection portion 7312 and the second connection portion 7313, one end of the first main plate portion 7311 in the second direction is fixedly connected with the first connection pipe 751 through the first connection portion 7312, and the other end of the first main plate portion 7311 in the second direction is fixedly connected with the second connection pipe 752 through the second connection portion 7313. The inlet and outlet ends of the heat exchange flow channels in the first plate are located at the first and second connection portions 7312 and 7313, respectively.

The second heat exchange plate 741 includes a second main plate portion 7411, a third connecting portion 7412 and a fourth connecting portion 7413, the third connecting portion 7412 and the fourth connecting portion 7413 are respectively located at two ends of the second heat exchange plate 741 in the second direction, the second main plate portion 7411 is located between the third connecting portion 7412 and the fourth connecting portion 7413, one end of the second main plate portion 7411 in the second direction is fixedly connected to the third connecting tube 751 through the third connecting portion 7412, and the other end of the second main plate portion 7411 in the second direction is fixedly connected to the fourth connecting tube 754 through the fourth connecting portion 7413. The inlet and outlet ends of the heat exchange flow channels in the second plate are located at the third and fourth connection portions 7412 and 7413, respectively.

The first main plate portion 7311 and the second main plate portion 7411 are arranged side by side in the first direction, the first connection portion 7312 and the third connection portion 7412 are located on the same side in the second direction as the first main plate portion 7311 and the second main plate portion 7411, and the second connection portion 7313 and the fourth connection portion 7413 are located on the same side in the second direction as the first main plate portion 7311 and the second main plate portion 7411.

For example, the projected outer edge of the first main plate portion 7311 in the first direction and the projected outer edge of the second main plate portion 7411 in the first direction may coincide. So that the integration degree of the first heat exchange assembly 730 and the second heat exchange assembly 740 is high.

In some possible embodiments, the dimension of the first connection portion 7312 in the third direction is smaller than the dimension of the first main plate portion 7311 in the third direction, the dimension of the third connection portion 7412 in the third direction is smaller than the dimension of the second main plate portion 7411 in the third direction, and the projection of the first connection portion 7312 in the first direction is located outside the projection of the third connection portion 7412 in the first direction.

In this way, a gap for avoiding the third connection pipe 753 may be formed between the first connection portion 7312 and the first main board portion 7311, and a gap for avoiding the first connection pipe 751 may be formed between the third connection portion 7412 and the second main board portion 7411, which is beneficial to improving the integration level between the first connection pipe 751, the third connection pipe 753, the first heat exchange assembly 730 and the second heat exchange assembly 740, so as to reduce the space occupied by the heat exchanger 700.

For example, the first connection pipe 751 and the third connection pipe 753 may be disposed side by side in the third direction.

For example, the first connection pipe 751 and the second connection pipe 752 may each be a straight pipe having both ends extending in the first direction.

In some possible embodiments, the dimension of the second connection portion 7313 in the third direction is smaller than the dimension of the first main plate portion 7311 in the third direction, the dimension of the fourth connection portion 7411 in the third direction is smaller than the dimension of the second main plate portion 7411 in the third direction, and the projection of the second connection portion 7313 in the first direction is located outside the projection of the fourth connection portion 7413 in the first direction.

In this way, a gap for avoiding the fourth connection pipe 754 may be formed between the second connection portion 7313 and the first main board portion 7311, and a gap for avoiding the second connection pipe 752 may be formed between the fourth connection portion 7413 and the second main board portion 7411, so as to facilitate improving the integration level between the second connection pipe 752, the fourth connection pipe 754, the first heat exchange assembly 730 and the second heat exchange assembly 740, so as to reduce the space occupied by the heat exchanger 700.

For example, the second connection pipe 752 and the fourth connection pipe 754 may be disposed side by side in the third direction.

Illustratively, the second and fourth connection pipes 752 and 754 may each be a straight pipe having both ends extending in the first direction.

Fig. 7 is a schematic view of a first heat exchange plate of a heat exchanger according to an embodiment of the present application.

As shown in fig. 7, in some possible embodiments, the first main board portion 7311 includes a first portion 73111 and a second portion 73112, where the first portion 73111 and the second portion 73112 are respectively located at two ends of the first main board portion 7311 in the third direction, the first portion 73111 is connected to the first connection portion 7312, and the second portion 73112 is connected to the second connection portion 7313.

In this way, the gaps formed between the first main plate portion 7311 and the first connection portion 7312 and between the first main plate portion 7311 and the second connection portion 7313 are large, so that the third connection tube 753 and the fourth connection tube 754 can be easily avoided. In addition, the inlet end and the outlet end of the first plate internal heat exchange flow channel are respectively positioned at the two ends of the first heat exchange plate 731 in the third direction, which is beneficial to smooth flow of the medium in the first plate internal heat exchange flow channel, so that the medium is not easy to stay in the first plate internal heat exchange flow channel.

Fig. 8 is a schematic view of a second heat exchange plate of a heat exchanger according to an embodiment of the present application.

As shown in fig. 8, in some possible embodiments, the second main board portion 7411 includes a third portion 7411 and a fourth portion 74112, the third portion 7411 and the fourth portion 74112 are respectively located at two ends of the second main board portion 7411 in the third direction, the third portion 7411 is connected to the third connecting portion 7412, and the fourth portion 74112 is connected to the fourth connecting portion 7413.

In this way, the gaps formed between the second main plate portion 7411 and the third connecting portion 7412 and between the second main plate portion 7411 and the fourth connecting portion 7413 are large, so that the first connecting pipe 751 and the second connecting pipe 752 can be easily avoided. In addition, the inlet end and the outlet end of the second plate internal heat exchange flow channel are respectively positioned at the two ends of the second heat exchange plate 741 in the third direction, which is beneficial to smooth flow of the medium in the second plate internal heat exchange flow channel, so that the medium is not easy to stay in the second plate internal heat exchange flow channel.

Fig. 9 is a schematic view of a heat exchanger provided in an embodiment of the present application, where the first heat exchange plate and the second heat exchange plate are adjacent to each other.

As shown in fig. 9, and referring to fig. 4 and 5, in some possible embodiments, a space 770 is provided between adjacent first and second heat exchange plates 731 and 741 of the heat exchanger 700, and the heat conductive structure 760 includes third heat exchange fins 761 disposed in the space 770, both ends of the third heat exchange fins 761 being respectively connected to the first and second heat exchange plates 731 and 741 adjacent to both sides such that the adjacent first and second heat exchange plates 731 and 741 can exchange heat through the third heat exchange fins 761 disposed therebetween.

In this way, both the first heat exchange plate 731 and the second heat exchange plate 741 can exchange heat with the adsorbent through the third heat exchange fins 761, so that the heat exchange efficiency between the medium flowing through the first heat exchange flow channel 710 and the second heat exchange flow channel 720 and the adsorbent is higher. In addition, the adjacent first heat exchange plate 731 and second heat exchange plate 741 are connected through the third heat exchange fin 761 therebetween, and the heat conduction path between the first heat exchange plate 731 and the second heat exchange plate 741 is shorter, so that the heat conduction efficiency between the first heat exchange assembly 730 and the second heat exchange assembly 740 is higher, the efficiency of heat exchange between the medium in the first heat exchange flow channel 710 and the adsorbate in the adsorption cavity 310 through the second heat exchange plate 741 is higher, and the efficiency of heat exchange between the medium in the second heat exchange flow channel 720 and the adsorbate in the adsorption cavity 310 through the first heat exchange plate 731 is higher.

Illustratively, the third heat exchanging fin 761 is disposed between the adjacent first and second main plate portions 7311 and 7411, and both ends of the third heat exchanging fin 761 are connected to the first and second main plate portions 7311 and 7411 adjacent to both sides, respectively.

Illustratively, a plurality of third heat exchange fins 761 distributed along the second direction are disposed in the space 770, and the third heat exchange fins 761 may be disposed obliquely to the first direction, and the oblique directions of the two connected third heat exchange fins 761 in the same space 770 may be opposite.

In this way, the heat exchange efficiency between the whole of the first heat exchange plate 731, the second heat exchange plate 741, and the third heat exchange fins 761 and the adsorbent in the adsorption chamber 310 is high.

Fig. 10 is a schematic view of another heat exchanger according to an embodiment of the present application, where the first heat exchange plate and the second heat exchange plate are adjacent to each other.

As shown in fig. 10, the surface of the heat exchanger 700 is attached with a first adsorbent 810.

In this way, the first adsorbent 810 attached to the surface of the heat exchanger 700 can adsorb and desorb the adsorbent in the adsorption cavity 310, so that the heat exchange efficiency between the adsorbent at the first adsorbent 810 and the heat exchanger 700 is high, and the adsorption and desorption efficiency of the adsorbent in the adsorption cavity 310 is high.

Illustratively, a surface of the first heat exchange assembly 730 and a surface of the second heat exchange assembly 740 are both attached with the first adsorbent 810. Specifically, the surface of each first heat exchange plate 731 and the surface of each second heat exchange plate 741 are attached with the first adsorbent 810.

When the heat exchanger 700 includes the heat conductive structure 760, the first adsorbent 810 is attached to the surface of the heat conductive structure 760. Specifically, when the heat conductive structure 760 includes third heat exchange fins 761, a surface of each third heat exchange fin 761 is attached with the first adsorbent 810.

Illustratively, the first adsorbent 810 may be adhered to the surface of the heat exchanger 700 by an adhesive such as epoxy.

In some possible embodiments, the first adsorbent 810 comprises activated carbon.

In some examples, the specific surface area of the activated carbon is in a range of greater than or equal to 200m ²/g and less than or equal to 5000m ²/g.

Thus, the adsorption and desorption performance of the activated carbon to the adsorbate is better.

Illustratively, the specific surface area of the activated carbon is in the range of greater than or equal to 800m ²/g and less than or equal to 2000m ²/g.

Thus, the adsorption quantity of the activated carbon to the adsorbate is large, and the stability of the adsorbate after being adsorbed by the activated carbon is good.

In some examples, the pore size of the activated carbon is in a range of greater than or equal to 0.1nm and less than or equal to 50 nm.

Illustratively, the pore size of the activated carbon is in the range of greater than or equal to 0.5nm and less than or equal to 1.5 nm.

In some examples, the pore volume of the activated carbon is in a range of greater than or equal to 0.1cc/g and less than or equal to 5 cc/g.

Illustratively, the pore volume of the activated carbon is in the range of greater than or equal to 0.3cc/g and less than or equal to 1.5 cc/g.

In some examples, the thickness of the first adsorbent 810 is in a range of greater than or equal to 0.1mm and less than or equal to 2 mm. Specifically, when the first adsorbent 810 includes activated carbon, the thickness of the activated carbon is in a range of greater than or equal to 0.1mm and less than or equal to 2 mm.

Thus, the thickness of the first adsorbent 810 is 0.1mm or more, and the adsorption amount of the first adsorbent 810 to the adsorbent can be made large. The first adsorbent 810 is less than or equal to 2mm, so that when adsorbing the adsorbent, the first adsorbent 810 close to the surface of the heat exchanger 700 cannot be fully adsorbed due to the fact that the stacking thickness of the first adsorbent 810 is thicker, when desorbing the adsorbent, the first adsorbent 810 is difficult to desorb due to the fact that the stacking thickness of the first adsorbent 810 is thicker, the first adsorbent 810 is far away from the first adsorbent 810 on the surface of the heat exchanger 700, and the efficiency of the first adsorbent 810 in adsorption and desorption is higher.

In some possible embodiments, the adsorption cavity 310 is filled with a second adsorbent 820.

Thus, the amount of the second adsorbent 820 that can be filled is large, and the adsorption amount of the adsorbent 300 to the adsorbent can be large.

In some examples, the surface of the heat exchanger 700 is attached with a first adsorbent 810 and the adsorption cavity 310 is filled with a second adsorbent 820.

Thus, the adsorber 300 has a large adsorption amount to the adsorbent and a high adsorption efficiency.

In other examples, the surface of the heat exchanger 700 is attached with the first adsorbent 810 and the adsorption cavity 310 is not filled with the second adsorbent 820.

In other examples, the adsorption cavity 310 is filled with the second adsorbent 820, and the first adsorbent 810 is not attached to the surface of the heat exchanger 700.

In some examples, the second adsorbent 820 is a granular structure.

In this way, the gaps between the second adsorbents 820 can be used to accommodate the adsorbed adsorbents, and the amount of adsorption of the adsorbents by the second adsorbents 820 can be made large.

By way of example, the second adsorbent 820 may include one or more of the following: silica gel, activated alumina, and the like.

In some examples, a second adsorbent 820 is packed between the first heat exchange assembly 730 and the second heat exchange assembly 740.

In this way, the adsorbate at the second adsorbent 820 can exchange heat with both the medium flowing through the first heat exchange flow channel 710 and the medium flowing through the second heat exchange flow channel 720, and the utilization efficiency of the second adsorbent 820 is high.

In some possible embodiments, the second adsorbent 820 is filled in the space 770 between the adjacent first heat exchange plates 731 and second heat exchange plates 741.

In this way, the first heat exchange plate 731, the second heat exchange plate 741 and the third heat exchange fin 761 can be used to exchange heat with the second adsorbent 820, and the second adsorbent 820 has high adsorption and desorption efficiency.

The space 770 between the adjacent first heat exchange plate 731 and second heat exchange plate 741 is partitioned into a plurality of subspaces by a plurality of third heat exchange fins 761 disposed therein, and each subspace is filled with the second adsorbent 820.

The heat exchanger 700 may be provided at edges of the first heat exchange plate 731 and the second heat exchange plate 741 with a porous plate having a plurality of through holes having a smaller diameter than the second adsorbent 820, the porous plate being for confining the second adsorbent 820 within the spacing space 770.

In this way, the second adsorbent 820 filled in the space 770 is not easily removed from the space 770, so that the efficiency of adsorption and desorption of the second adsorbent 820 is high. The through holes of the porous plate allow the adsorbent to flow through, and also allow the adsorbent to enter the space 770 to be adsorbed and the desorbed adsorbent to flow out of the space 770.

Fig. 11 is an assembly schematic diagram of a heat exchanger and a bracket according to an embodiment of the present application.

As shown in fig. 11, a plurality of heat exchangers 700 arranged in the third direction are provided in the adsorption chamber 310. Specifically, the adsorption chamber 310 is fixedly provided with a supporter 320, and a plurality of heat exchangers 700 arranged along the third direction are fixedly provided on the supporter 320.

In this way, the size of each heat exchanger 700 may be made smaller, and the difficulty of manufacturing the heat exchangers 700 may be smaller. For example, when the first heat exchange assembly 730 includes the first heat exchange plate 731 and the second heat exchange assembly 740 includes the second heat exchange plate 741, the span of the first heat exchange plate 731 including the first in-plate heat exchange flow path and the second heat exchange plate 741 including the second in-plate heat exchange flow path can be made smaller, the requirements on the structural strength of the first heat exchange plate 731 and the second heat exchange plate 741 are lower, and the manufacturing of the first heat exchange plate 731 and the second heat exchange plate 741 is facilitated.

The third direction may be a vertical direction, a horizontal direction, or a direction inclined from the horizontal direction, for example.

As shown in fig. 12, taking the third direction as the vertical direction as an example, the support 320 may include a plurality of support plates 321 arranged along the third direction, the support plates 321 may be fixedly connected with the cavity wall of the adsorption cavity 310 through the frame 322, and the upper surfaces of the support plates 321 are used for supporting the heat exchangers 700, so that a plurality of heat exchangers 700 may be arranged in the adsorption cavity 310 along the third direction. The support plate 321 may be a porous plate, and the support plate 321 may serve to restrict the second adsorbent 820 in the space 770 from being withdrawn from the space 770.

The data center further includes a fifth connection pipe 910, a sixth connection pipe 920, a seventh connection pipe 930, and an eighth connection pipe 940.

The first connection pipes 751 of all the heat exchangers 700 are connected to the fifth connection pipe 910 such that the first connection pipes 751 of all the heat exchangers 700 are connected to one of the outlet end of the heating apparatus and the inlet end of the heating apparatus through the fifth connection pipe 910.

The second connection pipes 752 of all the heat exchangers 700 are connected to the sixth connection pipe 920 such that the second connection pipes 752 of all the heat exchangers 700 are connected to the other one of the outlet end of the heating apparatus and the inlet end of the heating apparatus through the sixth connection pipe 920.

The third connection pipes 753 of all the heat exchangers 700 are connected to the seventh connection pipe 930 such that the third connection pipes 753 of all the heat exchangers 700 are connected to one of the outlet end of the cold source apparatus 30 and the inlet end of the cold source apparatus 30 through the seventh connection pipe 930.

The fourth connection pipes 754 of all the heat exchangers 700 are connected to the eighth connection pipe 940 such that the fourth connection pipes 754 of all the heat exchangers 700 are connected to the other one of the outlet end of the cold source apparatus 30 and the inlet end of the cold source apparatus 30 through the eighth connection pipe 940.

Illustratively, an inlet end of one of the fifth and sixth connection pipes 910 and 920 is connected to an outlet end of the third valve 510, an outlet end of the other of the fifth and sixth connection pipes 910 and 920 is connected to an inlet end of the fifth valve 530, an inlet end of one of the seventh and eighth connection pipes 930 and 940 is connected to an outlet end of the fourth valve 520, and an outlet end of the other of the seventh and eighth connection pipes 930 and 940 is connected to an inlet end of the sixth valve 540.

Illustratively, portions of the fifth, sixth, seventh and eighth connection pipes 910, 920, 930 and 940 are disposed within the adsorption cavity 310, and portions of the fifth, sixth, seventh and eighth connection pipes 910, 920, 930 and 940 are located outside the adsorption cavity 310.

In describing embodiments of the present application, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "coupled" should be construed broadly, as for example, in a fixed connection, in an indirect connection via an intermediary, in a communication between two elements, or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.

The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the embodiments of the present application, and are not limited thereto; although embodiments of the present application have been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An adsorption refrigeration device is characterized by comprising an evaporator, a condenser and an adsorber;

The adsorber comprises an adsorption cavity and a heat exchanger arranged in the adsorption cavity, wherein the outlet end of the adsorber is connected with the inlet end of the condenser, the outlet end of the condenser is connected with the inlet end of the evaporator, the outlet end of the evaporator is connected with the inlet end of the adsorber, and the inlet end of the adsorber and the outlet end of the adsorber are both communicated with the adsorption cavity;

the heat exchanger comprises a first heat exchange assembly and a second heat exchange assembly;

The heat exchange device comprises a first heat exchange assembly, wherein the first heat exchange assembly comprises a second heat exchange assembly, the second heat exchange assembly comprises a second heat exchange assembly, the first heat exchange assembly and the second heat exchange assembly are mutually isolated, the inlet end of the first heat exchange assembly is used for being connected with the outlet end of heat supply equipment, and the inlet end of the second heat exchange assembly is used for being connected with the outlet end of cold source equipment.

2. The adsorption refrigeration device of claim 1, wherein the first heat exchange assembly comprises a plurality of first heat exchange plates arranged side-by-side in a first direction, the first heat exchange flow passages comprising first in-plate heat exchange flow passages within each of the first heat exchange plates, an inlet end of the first in-plate heat exchange flow passages being adapted to be connected to an outlet end of the heating apparatus;

The second heat exchange assembly comprises a plurality of second heat exchange plates which are distributed side by side along the first direction, the second heat exchange flow channels comprise second in-plate heat exchange flow channels positioned in each second heat exchange plate, and the inlet ends of the second in-plate heat exchange flow channels are used for being connected with the outlet ends of the cold source equipment;

the first heat exchange plates and the second heat exchange plates are alternately arranged in the first direction;

wherein the first direction is the thickness direction of the first heat exchange plate and the second heat exchange plate.

3. The adsorption refrigeration device according to claim 2, wherein the heat exchanger further comprises a first connecting pipe and a second connecting pipe, both ends of the first connecting pipe extend in the first direction, both ends of the second connecting pipe extend in the first direction, an inlet end and an outlet end of the first plate heat exchange flow passage are respectively located at both ends of the first heat exchange plate in the second direction, the first connecting pipe and the second connecting pipe are respectively located at both sides of the first heat exchange plate in the second direction, the first connecting pipe and the second connecting pipe are respectively fixedly connected with both ends of the first heat exchange plate in the second direction and are respectively communicated with an inlet end and an outlet end of the first plate heat exchange flow passage, the inlet end of the first plate heat exchange flow passage is used for being connected with the outlet end of the heating equipment through the first connecting pipe or the second connecting pipe, and all of the first plate heat exchange flow passages are arranged in parallel;

And/or the heat exchanger further comprises a third connecting pipe and a fourth connecting pipe, wherein the two ends of the third connecting pipe extend along the first direction, the two ends of the fourth connecting pipe extend along the first direction, the inlet end and the outlet end of the second plate internal heat exchange flow channel are respectively positioned at the two ends of the second heat exchange plate in the second direction, the third connecting pipe and the fourth connecting pipe are respectively arranged at the two sides of the second heat exchange plate in the second direction, the third connecting pipe and the fourth connecting pipe are respectively fixedly connected with the two ends of the second heat exchange plate in the second direction and are respectively communicated with the inlet end and the outlet end of the second plate internal heat exchange flow channel, the inlet end of the second plate internal heat exchange flow channel is used for being connected with the outlet end of the cold source equipment through the third connecting pipe or the fourth connecting pipe, and all the second plate internal heat exchange flow channels are arranged in parallel;

the second direction is the length direction of the first heat exchange plate and the second heat exchange plate.

4. The adsorption refrigeration device according to claim 3, wherein the first heat exchange plate includes a first main plate portion, a first connection portion, and a second connection portion, the first connection portion and the second connection portion being located at both ends of the first heat exchange plate in the second direction, respectively, the first main plate portion being located between the first connection portion and the second connection portion, one end of the first main plate portion in the second direction being fixedly connected to the first connection pipe through the first connection portion, and the other end of the first main plate portion in the second direction being fixedly connected to the second connection pipe through the second connection portion;

The second heat exchange plate comprises a second main plate part, a third connecting part and a fourth connecting part, the third connecting part and the fourth connecting part are respectively positioned at two ends of the second heat exchange plate in the second direction, the second main plate part is positioned between the third connecting part and the fourth connecting part, one end of the second main plate part in the second direction is fixedly connected with the third connecting pipe through the third connecting part, and the other end of the second main plate part in the second direction is fixedly connected with the fourth connecting pipe through the fourth connecting part;

The first main board portion and the second main board portion are arranged side by side in the first direction, the first connecting portion and the third connecting portion are located on the same side of the first main board portion and the second main board portion in the second direction, and the second connecting portion and the fourth connecting portion are located on the same side of the first main board portion and the second main board portion in the second direction;

The size of the first connecting part in the third direction is smaller than that of the first main board part in the third direction, the size of the third connecting part in the third direction is smaller than that of the second main board part in the third direction, and the projection of the first connecting part in the first direction is located outside the projection of the third connecting part in the first direction; and/or the dimension of the second connecting part in the third direction is smaller than the dimension of the first main board part in the third direction, the dimension of the fourth connecting part in the third direction is smaller than the dimension of the second main board part in the third direction, and the projection of the second connecting part in the first direction is positioned outside the projection of the fourth connecting part in the first direction;

the third direction is the width direction of the first heat exchange plate and the second heat exchange plate.

5. The adsorption refrigeration device according to any one of claims 1-4, wherein the first heat exchange assembly and the second heat exchange assembly are connected by a heat conducting structure, such that the first heat exchange assembly and the second heat exchange assembly can exchange heat through the heat conducting structure.

6. The adsorption refrigeration device of claim 5, wherein a space is provided between adjacent first and second heat exchange plates of the heat exchanger, the heat conducting structure comprises heat exchange fins arranged in the space, and two ends of the heat exchange fins are respectively connected with the first and second heat exchange plates adjacent to two sides, so that the adjacent first and second heat exchange plates can exchange heat through the heat exchange fins arranged between the two heat exchange plates.

7. The adsorption refrigeration device of any one of claims 1-6, wherein a surface of the first heat exchange assembly, a surface of the second heat exchange assembly, and a surface of the heat transfer structure of the heat exchanger are each adhered with a first adsorbent.

8. The adsorption refrigeration device of any one of claims 1-7, wherein a second adsorbent is filled between the first heat exchange assembly and the second heat exchange assembly.

9. The adsorption refrigeration device according to any one of claims 1 to 8 wherein the inlet end of the adsorber is connected to the outlet end of the evaporator by a first valve for controlling the flow path between the inlet end of the adsorber and the outlet end of the evaporator;

The outlet end of the absorber is connected with the inlet end of the condenser through a second valve, and the second valve is used for controlling the on-off of a flow path between the outlet end of the absorber and the inlet end of the condenser.

10. The adsorption refrigeration device of claim 9, wherein said adsorption refrigeration device comprises at least 2 of said adsorbers, each of said adsorbers having an inlet coupled to an outlet of said evaporator by a respective one of said first valves and each of said adsorbers having an outlet coupled to an inlet of said condenser by a respective one of said second valves.