CN117976604A - Wafer clamping mechanism and wafer transmission device - Google Patents

Abstract

The present application relates to the field of semiconductor manufacturing equipment, and in particular, to a wafer clamping mechanism and a wafer conveying device. The wafer clamping mechanism comprises a bracket, a first clamping member, a second clamping member and a linear driving member, wherein the linear driving member, the first clamping member and the second clamping member are arranged on the bracket; the first clamping member comprises a first clamping part, the second clamping member comprises a second clamping part, and the first clamping part and the second clamping part are oppositely arranged at intervals along a preset direction; the linear driving member drives the first clamping part and the second clamping part to approach or separate along a preset direction so that the first clamping part and the second clamping part clamp or release two preset edges of the special-shaped wafer. The wafer transfer device comprises the wafer clamping mechanism. The wafer clamping mechanism and the wafer conveying device drive the first clamping part and the second clamping part to be relatively close to or far away from each other by the linear driving component so as to clamp or release the special-shaped wafer, and can realize the clamping and transferring of the small-sized special-shaped wafer.

Description

Wafer clamping mechanism and wafer transmission device

Technical Field

The present application relates to the field of semiconductor manufacturing equipment, and in particular, to a wafer clamping mechanism and a wafer conveying device.

Background

The wafer transmission mechanism is an important mechanism for manufacturing an integrated circuit, one of important components of the wafer transmission mechanism is a vacuum manipulator, the vacuum manipulator is used for vacuum adsorption of wafers, and the adsorption contact mode mainly comprises edge contact, ring contact, bump contact and the like.

At present, as shown in fig. 1, a common vacuum mechanical arm 1 is shown, a vacuum cavity 10 of a vacuum pipeline of the vacuum mechanical arm is contacted with a wafer 2 through a ring 11 of the vacuum mechanical arm in the wafer transmission process, so as to realize the adsorption of the wafer 2, and as shown in fig. 2, the state that the vacuum mechanical arm 1 adsorbs the wafer 2 is shown.

However, the existing vacuum manipulator mainly aims at adsorbing and transporting round chips (commonly called wafers). With the development of integrated circuit materials, the new materials make the shape of the wafer not limited to a circular shape, for example, can be cut into a square or other special shape, and the size is smaller, about 40mm by 40mm, or even smaller. However, for such a shaped wafer, it is necessary to perform the transfer of more processes during the manufacturing process thereof, and thus a new structure of a transfer mechanism is required to perform the transfer of wafers of more processes.

Disclosure of Invention

The application aims to provide a wafer clamping mechanism and a wafer conveying device, which are used for solving the technical problems that a vacuum manipulator in the prior art can only convey a wafer in a vacuum adsorption mode, but cannot convey a special-shaped wafer in other processes to a certain extent.

The application provides a wafer clamping mechanism which is used for clamping and transferring a special-shaped wafer, wherein the special-shaped wafer is provided with two preset edges which are oppositely arranged along a preset direction;

The wafer clamping mechanism comprises a bracket, a first clamping member, a second clamping member and a linear driving member, wherein the linear driving member, the first clamping member and the second clamping member are arranged on the bracket;

the first clamping member comprises a first clamping part, the second clamping member comprises a second clamping part, and the first clamping part and the second clamping part are oppositely arranged at intervals along the preset direction;

the linear driving member can drive the first clamping part and the second clamping part to approach or separate along the preset direction, so that the first clamping part and the second clamping part respectively clamp or release the two preset edges of the special-shaped wafer.

In the above technical solution, further, the first clamping portion is provided with a first positioning groove facing the opening of the second clamping portion, and the second clamping portion is provided with a second positioning groove facing the opening of the second clamping portion;

The first positioning groove and the second positioning groove can both accommodate the preset edge of the special-shaped wafer.

In any of the above technical solutions, further, a buffer layer is provided on both the groove wall of the first positioning groove and the groove wall of the second positioning groove;

And/or, the cell wall of the first positioning groove comprises an arc-shaped first supporting wall, and the cell wall of the second positioning groove comprises an arc-shaped second supporting wall, so that the first positioning groove and the second positioning groove are all in an open shape, and the first supporting wall and the second supporting wall can be propped against the lower surface of the special-shaped wafer.

In any of the above technical solutions, further, the shaped wafer is square, and the size of the shaped wafer is not greater than 40mm by 40mm;

the groove depth of the first positioning groove and the groove depth of the second positioning groove are 2-5mm.

In any of the above solutions, further, the first clamping member further includes a first connecting arm, one end of the first connecting arm is connected to the bracket, and the other end of the first connecting arm extends out from the bracket and is connected to the first clamping portion;

The second clamping member further comprises a second connecting arm, one end of the second connecting arm is connected with the linear driving member, the other end of the second connecting arm is connected with the second clamping portion, and the linear driving member can drive the second clamping portion to reciprocate along the preset direction through the second connecting arm so as to be close to or far away from the first clamping portion.

In any of the foregoing solutions, further, the wafer clamping mechanism further includes a sliding guide assembly;

the sliding guide assembly extends along the preset direction and is connected between the second connecting arm and the bracket.

In any of the foregoing solutions, further, the wafer clamping mechanism further includes an elastic member capable of being elastically deformed in the predetermined direction;

The elastic member is connected between the second clamping member and the bracket, or the elastic member is connected between the second clamping member and the linear driving member.

In any of the above solutions, further, an elastic coefficient of the elastic member is configured to be inversely related to a preset stroke of the second clamping member.

The application also provides a wafer transmission device, which comprises the wafer clamping mechanism in any technical scheme.

In any of the above solutions, further, the wafer transfer device further includes a workpiece stage;

The workpiece table is provided with a first avoidance part and a second avoidance part which are arranged at intervals along a preset direction, so that a supporting part is formed between the first avoidance part and the second avoidance part;

Along the preset direction, the size of the supporting part is smaller than that of the special-shaped wafer, the size of the first avoiding part is larger than that of the first clamping part, and the size of the second avoiding part is larger than that of the second clamping part.

Compared with the prior art, the application has the beneficial effects that:

The wafer clamping mechanism provided by the application drives the first clamping part and the second clamping part to relatively approach or separate through the linear driving component, so that the special-shaped wafer is clamped or released through the first clamping part and the second clamping part. Furthermore, the wafer clamping mechanism can realize the clamping and transferring of small-sized special-shaped wafers, and provides a brand new transferring scheme except vacuum adsorption for manufacturing special-shaped wafers made of new materials.

The wafer transmission device provided by the application comprises the wafer clamping mechanism, so that all beneficial effects of the wafer clamping mechanism can be realized.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a vacuum robot in the prior art;

FIG. 2 is a schematic view of a vacuum robot in the prior art;

FIG. 3 is a schematic diagram of a wafer clamping mechanism according to an embodiment of the present application;

fig. 4 is a schematic diagram illustrating an operation principle of a wafer clamping mechanism according to a first embodiment of the present application;

FIG. 5 is a schematic view illustrating an operation state of a wafer clamping mechanism according to a first embodiment of the present application;

fig. 6 is a schematic diagram illustrating a first working state of a wafer transferring apparatus according to a second embodiment of the present application;

fig. 7 is a schematic diagram illustrating a second working state of the wafer transferring apparatus according to the second embodiment of the present application;

Fig. 8 is a schematic diagram illustrating a third working state of the wafer transferring apparatus according to the second embodiment of the present application;

fig. 9 is a schematic diagram illustrating a fourth operation state of the wafer transferring apparatus according to the second embodiment of the present application.

Reference numerals of fig. 1 and 2:

1-a vacuum manipulator; 10-vacuum chamber; 11-a circular ring; 2-wafer

Reference numerals of fig. 3 to 9:

3-a wafer clamping mechanism; 30-a first clamping member; 301-a first clamping portion; 3011-a first positioning slot; 3012-a first support wall; 302-a first connecting arm; 31-a second clamping member; 311-a second clamping portion; 3111-a second positioning slot; 3112-a second support wall; 312-a second connecting arm; 32-brackets; 33-a sliding guide assembly; 34-linear drive member; 4-a special-shaped wafer; 5-wafer transfer means; 50-a workpiece stage; 501-a support; 502-a first avoidance portion; 503-a second avoidance portion.

Detailed Description

The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

Example 1

Referring to fig. 3 and 5 in combination with fig. 6 to 9, an embodiment of the present application provides a wafer clamping mechanism 3 for clamping and transferring a shaped wafer 4, the shaped wafer 4 having two predetermined edges disposed opposite to each other along a predetermined direction a. That is, the shaped wafer 4 is different from a circular wafer, and two predetermined edges of the shaped wafer 4 are disposed straight and opposite to each other, and the shaped wafer 4 is, for example, a square wafer, specifically, a square wafer having a size of 40mm by 40mm or less.

The wafer holding mechanism 3 provided in this embodiment includes a bracket 32, a first holding member 30, a second holding member 31, and a linear driving member 34.

The wafer holding mechanism 3 includes a bracket 32, a first holding member 30, a second holding member 31, and a linear driving member 34, and the linear driving member 34, the first holding member 30, and the second holding member 31 are provided to the bracket 32. That is, the linear driving member 34, the first clamping member 30, and the second clamping member 31 are mounted and supported by the bracket 32, and by mounting the bracket 32 on the transfer robot, the wafer clamping mechanism 3 can be moved by the transfer robot.

The first clamping member 30 includes a first clamping portion 301, the second clamping member 31 includes a second clamping portion 311, and the first clamping portion 301 and the second clamping portion 311 are disposed at opposite intervals along the predetermined direction a.

The linear driving member 34 can drive the first clamping portion 301 and the second clamping portion 311 to approach or separate in the predetermined direction a so that the first clamping portion 301 and the second clamping portion 311 clamp or release two predetermined edges of the shaped wafer 4, respectively.

In other words, the linear driving member 34 can drive at least one of the first clamping portion 301 and the second clamping portion 311 to move along the predetermined direction a, so that the first clamping portion 301 and the second clamping portion 311 are relatively close until the first clamping portion 301 abuts against one predetermined edge of the shaped wafer 4 and the second clamping portion 311 abuts against the other predetermined edge of the shaped wafer 4, and the wafer clamping mechanism 3 can clamp the shaped wafer 4. Then, the wafer clamping mechanism 3 moves along with the transfer mechanical arm to the workpiece stage 50, and then the shaped wafer 4 clamped by the wafer clamping mechanism can be placed on the workpiece stage 50.

After the wafer placement is completed, the wafer holding mechanism 3 is required to release the shaped wafer 4.

In view of this, the linear driving member 34 is capable of driving at least one of the first clamping portion 301 and the second clamping portion 311 to move in the predetermined direction a, such that the first clamping portion 301 and the second clamping portion 311 are relatively far apart until the first clamping portion 301 is separated from one predetermined edge of the shaped wafer 4 and the second clamping portion 311 is separated from the other predetermined edge of the shaped wafer 4, and the wafer clamping mechanism 3 can realize releasing the shaped wafer 4, leaving the shaped wafer 4 on the workpiece stage 50.

After the wafer release is completed, the wafer clamping mechanism 3 moves along with the transferring mechanical arm to the wafer taking position, so that the next clamping and transferring operation of the special-shaped wafer 4 can be prepared.

In an alternative of the present embodiment, the first clamping portion 301 is provided with a first positioning groove 3011 that faces the second clamping portion 311 and the second clamping portion 311 is provided with a second positioning groove 3111 that faces the second clamping portion 311, where the first positioning groove 3011 and the second positioning groove 3111 can each accommodate a predetermined edge of the shaped wafer 4.

In this technical solution, during the process of clamping the profiled wafer 4 by the wafer clamping mechanism 3, one predetermined edge of the profiled wafer 4 is inserted into the first positioning slot 3011 of the first clamping portion 301, and the other predetermined edge of the profiled wafer 4 is inserted into the second positioning slot 3111 of the second clamping portion 311, so that the first clamping portion 301 and the second clamping portion 311 clamp the profiled wafer 4 in a hook-holding posture.

Compared with the scheme that the first clamping part 301 and the second clamping part 311 compress the preset edge of the special-shaped wafer 4 by the flat surface to apply the friction force in the vertical direction to the preset edge of the special-shaped wafer 4, the clamping scheme is realized in that the first positioning groove 3011 and the second positioning groove 3111 are arranged, so that the pressure and the friction force of the wafer clamping mechanism 3 on the special-shaped wafer 4 can be reduced, the clamping stability of the special-shaped wafer 4 is improved on the premise of reducing the damage to the special-shaped wafer 4, and the problem that the small special-shaped wafer 4 is not easy to pick up and transport due to undersize is solved.

Alternatively, both the first and second positioning grooves 3011 and 3111 are configured to be clearance fit with the shaped wafer 4, avoiding scratching the shaped wafer 4.

In this embodiment, the shaped wafer 4 is square, and the size of the shaped wafer 4 is not greater than 40mm by 40mm; the groove depth of the first positioning groove 3011 and the groove depth of the second positioning groove 3111 are 2-5mm, for example, 2mm, 3mm, or 5mm.

The shaped die 4 are significantly smaller in size than the conventional wafers having a diameter of not less than 50 mm. By configuring the groove depth of the first positioning groove 3011 and the groove depth of the second positioning groove 3111 to be not less than 3mm, the first positioning groove 3011 and the second positioning groove 3111 can be made to reliably hook the shaped wafer 4. Meanwhile, by configuring the groove depth of the first positioning groove 3011 and the groove depth of the second positioning groove 3111 to be not more than 8mm, the stroke of the relative movement of the first clamp member 30 and the second clamp member 31 can be controlled within a reasonable range, and the excessive stroke of the relative movement can be avoided.

In this embodiment, in order to protect the shaped wafer 4 from being scratched and damaged by the first clamping portion 301 and the second clamping portion 311, buffer layers may be provided on both the groove wall of the first positioning groove 3011 and the groove wall of the second positioning groove 3111, so that both the first clamping portion 301 and the second clamping portion 311 are in contact with the shaped wafer 4 through the buffer layers.

Wherein the buffer layer may be made of a flexible material.

In this embodiment, the groove wall of the first positioning groove 3011 includes an arc-shaped first supporting wall 3012, and the groove wall of the second positioning groove 3111 includes an arc-shaped second supporting wall 3112, so that the first positioning groove 3011 and the second positioning groove 3111 are open, and thus convenience and alignment accuracy of aligning the first positioning groove 3011 and the second positioning groove 3111 with the predetermined edge of the profiled wafer 4 can be improved when the first clamping portion 301 and the second clamping portion 311 move towards the profiled wafer 4.

The first support wall 3012 and the second support wall 3112 are each capable of abutting against the lower surface of the shaped wafer, in other words, in the use state of the wafer clamping mechanism 3, the first clamping portion 301 needs to be mounted in a posture where the first support wall 3012 is down, and the second clamping portion 311 needs to be mounted in a posture where the second support wall 3112 is down.

In an alternative of this embodiment, the first clamping member 30 further includes a first connecting arm 302, one end of the first connecting arm 302 is connected to the bracket 32, and the other end of the first connecting arm 302 extends from the bracket 32 and is connected to the first clamping portion 301.

The first clamping part 301 is mounted on the bracket 32 through the first connecting arm 302, and the first clamping part 301 extends out relative to the bracket 32, so that the junction between the first connecting arm 302 and the first clamping part 301 and the lower part of the first clamping part 301 are suspended, and the suspended position can be used for accommodating a tablet taking station or a workbench.

The second clamping member 31 further includes a second connection arm 312, one end of the second connection arm 312 is connected to the linear driving member 34, and the other end of the second connection arm 312 is connected to the second clamping portion 311.

The second clamping portion 311 is connected to the linear driving member 34 through the second connecting arm 312, the linear driving member 34 provides driving force for the second clamping member 31, and in addition, the second connecting arm 312 enables the second clamping portion 311 to extend out relative to the bracket 32, so that a connection point between the second connecting arm 312 and the second clamping portion 311 is suspended below the second clamping portion 311, and a suspended position can accommodate a picking station or a workbench.

The linear driving member 34 can drive the second clamping portion 311 to reciprocate in the predetermined direction a to approach or separate from the first clamping portion 301 by the second connecting arm 312. That is, the linear driving member 34 may drive the second clamping member 31 to reciprocate in the predetermined direction a, and may not drive the first clamping member 30 to reciprocate, and the first clamping member 30 may be fixed to the bracket 32.

The structure can be simplified and a predetermined stroke of relative movement therebetween in the predetermined direction a can be more precisely controlled than in the case of simultaneously driving the first and second clamping members 30 and 31. Therefore, the wafer clamping mechanism 3 can be integrally moved by the transfer mechanical arm, the first clamping part 301 of the first clamping member 30 is abutted against the preset edge of the special-shaped wafer 4, and then the second clamping member 31 is driven to move by the linear driving member 34 until the second clamping part 311 of the second clamping member 31 is abutted against the preset edge of the special-shaped wafer 4, so that the clamping of the special-shaped wafer 4 can be completed. It can be seen that the first clamping portion 301 and the second clamping portion 311 can be precisely aligned with the two predetermined edges of the shaped wafer 4 by controlling only the predetermined stroke of the second clamping member 31 reciprocating relative to the bracket 32.

Alternatively, the linear drive member 34 may be, for example, a linear slide, or a motor-driven screw mechanism or the like, to which reference is not made.

In an alternative of this embodiment, the wafer holding mechanism 3 further includes a sliding guide assembly 33, and the sliding guide assembly 33 extends along the predetermined direction a and is connected between the second connection arm 312 and the bracket 32. Specifically, the slide guide assembly 33 may be configured to include a slide rail provided to the bracket 32 and a slider provided to the second connection arm 312, the slider being slidably connected to the slide rail such that the slider moves in the predetermined direction a on the slide rail.

So that the second connecting arm 312 is directionally moved in the predetermined direction a with respect to the bracket 32, thereby securing the directionality of the reciprocal movement of the second clamping member 31 in the predetermined direction a. Ensuring that the second clamping member 31 is not askew during moving is beneficial to ensuring the clamping precision of the wafer clamping mechanism 3 on the special-shaped wafer 4, avoiding clamping failure caused by moving stroke errors and even overpressure on the special-shaped wafer 4.

In an alternative of this embodiment, the wafer holding mechanism 3 further includes an elastic member that is elastically deformable in the predetermined direction a, so that the elastic member can generate an elastic force in the predetermined direction a.

The elastic member is connected between the second clamping member 31 and the bracket 32, alternatively, between the second connecting arm 312 and the bracket 32, so that a restoring force against the first clamping portion 301 is provided to the second clamping member 31 by the elastic member. By adjusting the restoring force applied by the elastic member, the clamping force applied by the first clamping portion 301 and the second clamping portion 311 to the shaped wafer 4 can be adjusted, and the shaped wafer 4 is prevented from being over-pressed or even damaged due to improper clamping force.

In the present embodiment, the elastic coefficient of the elastic member is configured to be inversely related to the preset stroke of the second clamping member 31, so that the clamping force can be reduced by reducing the preset stroke of the second clamping member 31 when the elastic coefficient of the elastic member is configured to be constant on the one hand. On the other hand, when the preset stroke of the first clamping member 30 is configured to be constant, the clamping force can be reduced by reducing the elastic coefficient of the elastic member.

Further, by configuring the elastic coefficient of the elastic member to be inversely related to the preset stroke of the second clamping member 31, the clamping force adjusting mechanism of the wafer clamping mechanism 3 is simplified, so that it is easy to match a proper clamping force for the shaped wafer 4.

Example two

The second embodiment provides a wafer transfer apparatus, the second embodiment includes the wafer clamping mechanism in the first embodiment, and the technical features of the first disclosed wafer clamping mechanism are also applicable to the second embodiment, and the technical features of the first disclosed wafer clamping mechanism are not repeated.

As shown in fig. 6 to 8 and fig. 3 to 5, the wafer transfer apparatus 5 provided in this embodiment includes a wafer clamping mechanism 3, and may further include a transfer mechanical arm, where the transfer mechanical arm is connected to a bracket 32 of the wafer clamping mechanism 3, so that the wafer clamping mechanism 3 and the profiled wafer 4 clamped by the wafer clamping mechanism 3 are moved by the transfer mechanical arm.

In an alternative of this embodiment, the wafer conveying device 5 further includes a workpiece table 50, where the workpiece table 50 is provided with a first avoidance portion 502 and a second avoidance portion 503 that are arranged at intervals along the predetermined direction a, so that the workpiece table 50 forms a supporting portion 501 between the first avoidance portion 502 and the second avoidance portion 503, and the supporting portion 501 is used to fix and support the profiled wafer 4, so that the profiled wafer 4 is subjected to processing in the next process under the support of the workpiece table.

Alternatively, the first relief portion 502 and the second relief portion 503 are each in a groove shape such that the support portion 501 protrudes with respect to the first relief portion 502 and the second relief portion 503.

Alternatively, the support 501 is in the form of a platform.

The size of the support portion 501 is smaller than the size of the shaped wafer 4 in the predetermined direction a, the size of the first escape portion 502 is larger than the size of the first clamping portion 301, and the size of the second escape portion 503 is larger than the size of the second clamping portion 311.

Specifically, as shown in fig. 6 to 9, the wafer holding mechanism 3 is shown in cooperation with the work table 50 to realize the whole process of transferring the shaped wafer 4.

As shown in fig. 6, the transfer mechanical arm drives the wafer clamping mechanism 3 to move to the wafer taking station, the first clamping portion 301 is aligned with a predetermined edge of the shaped wafer 4, and then the second clamping portion 311 is driven by the linear driving member 34 to be aligned with another predetermined edge of the shaped wafer 4, so as to clamp the shaped wafer 4.

As shown in fig. 7, the transferring mechanical arm drives the wafer clamping mechanism 3 to move towards the workbench, so that the first clamping portion 301 corresponds to the first avoiding portion 502, the second clamping portion 311 corresponds to the second avoiding portion 503, and since the size of the supporting portion 501 is smaller than that of the special-shaped wafer 4, the size of the first avoiding portion 502 is larger than that of the first clamping portion 301, and the size of the second avoiding portion 503 is larger than that of the second clamping portion 311, it can be ensured that the first clamping portion 301 and the second clamping portion 311 do not spatially interfere with the supporting portion 501, and the special-shaped wafer 4 is placed on the supporting portion 501.

As shown in fig. 8, the linear driving member 34 drives the second clamping portion 311 to separate from the shaped wafer 4, and makes a certain interval margin be reserved between the two, so that the transfer mechanical arm drives the wafer clamping mechanism 3 to move towards the side where the first clamping portion 301 is located until both the first clamping portion 301 and the second clamping portion 311 separate from the shaped wafer 4, and ensures that the orthographic projection of the shaped wafer 4 cannot fall on the first clamping portion 301 and the second clamping portion 311, so that the release of the shaped wafer 4 to the workbench can be completed.

As shown in fig. 9, the wafer clamping mechanism 3 is then driven by the transfer robot arm to leave the workbench, so as to prepare for the picking and transferring operation of the next profiled wafer 4.

The wafer transfer device in this embodiment has the advantages of the wafer holding mechanism in the first embodiment, and the advantages of the wafer holding mechanism disclosed in the first embodiment are not repeated here.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, any of the claimed embodiments can be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Claims (10)

1. The wafer clamping mechanism is characterized by being used for clamping and transferring a special-shaped wafer, wherein the special-shaped wafer is provided with two preset edges which are oppositely arranged along a preset direction; the wafer clamping mechanism comprises a bracket, a first clamping member, a second clamping member and a linear driving member, wherein the linear driving member, the first clamping member and the second clamping member are arranged on the bracket;

the first clamping member comprises a first clamping part, the second clamping member comprises a second clamping part, and the first clamping part and the second clamping part are oppositely arranged at intervals along the preset direction;

the linear driving member can drive the first clamping part and the second clamping part to approach or separate along the preset direction, so that the first clamping part and the second clamping part respectively clamp or release the two preset edges of the special-shaped wafer.

2. The wafer clamping mechanism of claim 1 wherein the first clamping portion is provided with a first detent facing the second clamping portion opening and the second clamping portion is provided with a second detent facing the second clamping portion opening; the first positioning groove and the second positioning groove can both accommodate the preset edge of the special-shaped wafer.

3. The wafer clamping mechanism of claim 2 wherein the slot walls of the first detent and the second detent are each provided with a buffer layer; and/or, the cell wall of the first positioning groove comprises an arc-shaped first supporting wall, and the cell wall of the second positioning groove comprises an arc-shaped second supporting wall, so that the first positioning groove and the second positioning groove are all in an open shape, and the first supporting wall and the second supporting wall can be propped against the lower surface of the special-shaped wafer.

4. The wafer clamping mechanism of claim 2 wherein said profiled wafer is square, said profiled wafer having a dimension no greater than 40mm by 40mm; the groove depth of the first positioning groove and the groove depth of the second positioning groove are 2-5mm.

5. The wafer clamping mechanism of claim 1 wherein said first clamping member further comprises a first connecting arm, one end of said first connecting arm being connected to said bracket, the other end of said first connecting arm extending from said bracket and being connected to said first clamping portion; the second clamping member further comprises a second connecting arm, one end of the second connecting arm is connected with the linear driving member, the other end of the second connecting arm is connected with the second clamping portion, and the linear driving member can drive the second clamping portion to reciprocate along the preset direction through the second connecting arm so as to be close to or far away from the first clamping portion.

6. The wafer clamping mechanism of claim 5 further comprising a sliding guide assembly;

the sliding guide assembly extends along the preset direction and is connected between the second connecting arm and the bracket.

7. The wafer clamping mechanism of claim 5 further comprising an elastic member, said elastic member being elastically deformable in said predetermined direction; the elastic member is connected between the second clamping member and the bracket, or the elastic member is connected between the second clamping member and the linear driving member.

8. The wafer clamping mechanism of claim 7 wherein the spring rate of the spring member is configured to be inversely related to the predetermined travel of the second clamping member.

9. A wafer transfer apparatus comprising the wafer clamping mechanism of any one of claims 1 to 8.

10. The wafer transport apparatus of claim 9, further comprising a workpiece stage;

The workpiece table is provided with a first avoidance part and a second avoidance part which are arranged at intervals along a preset direction, so that a supporting part is formed between the first avoidance part and the second avoidance part;

Along the preset direction, the size of the supporting part is smaller than that of the special-shaped wafer, the size of the first avoiding part is larger than that of the first clamping part, and the size of the second avoiding part is larger than that of the second clamping part.