CN117976600A - Two-dimensional material transfer device - Google Patents
Two-dimensional material transfer device Download PDFInfo
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- CN117976600A CN117976600A CN202311641521.0A CN202311641521A CN117976600A CN 117976600 A CN117976600 A CN 117976600A CN 202311641521 A CN202311641521 A CN 202311641521A CN 117976600 A CN117976600 A CN 117976600A
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- 238000012546 transfer Methods 0.000 title claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 195
- 238000001704 evaporation Methods 0.000 claims abstract description 5
- 238000001179 sorption measurement Methods 0.000 claims description 27
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- 238000010586 diagram Methods 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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Abstract
The application belongs to the technical field of two-dimensional material processing and preparation, and particularly relates to a two-dimensional material transfer device. The two-dimensional material transfer device comprises a first bearing module, a second bearing module and a first control module, wherein the first bearing module is used for bearing a base, and the second bearing module is used for bearing a target substrate; the first bearing module can drive the base to move to the bonding station so as to bond the two-dimensional material layer on the surface of the base with the target substrate, and/or the second bearing module can drive the target substrate to move to the bonding station so as to bond the two-dimensional material layer of the base with the target substrate; and an energy source for generating energy capable of evaporating a sacrificial layer adjacent to the two-dimensional material layer in the middle of the substrate, thereby detaching the two-dimensional material layer located at the bonding station from the substrate. The sacrificial layer can be rapidly evaporated under the action of an external energy source, so that large-area transfer of the two-dimensional material can be realized, and the transfer efficiency and the transfer success rate of the two-dimensional material are improved.
Description
Technical Field
The application belongs to the technical field of processing and preparing semiconductor film materials such as two-dimensional materials, and particularly relates to a two-dimensional material transfer device.
Background
Two-dimensional materials refer to materials such as nanofilms, superlattices, quantum wells, where electrons can only move freely (planar motion) on the nanoscale in two dimensions. Due to the excellent physical and chemical properties of the two-dimensional material, the two-dimensional material has great application potential in the fields of electronics, photoelectricity and sensing, and nowadays, the two-dimensional material is already a "pet" for industry and academic.
The two-dimensional material is transferred from the growth base to the target substrate before being subjected to photolithography, etching, and the like. However, the related process and device in the industry are seriously lost, the existing scheme is a transfer method for experiments in a laboratory, the transfer efficiency is low, the transfer area is small, two-dimensional materials are easy to damage, and the high-efficiency and wafer-level transfer required in the industry cannot be realized.
Disclosure of Invention
The embodiment of the application provides a two-dimensional material transfer device, which can solve the technical problems of low two-dimensional material transfer efficiency and low industrialization degree and can realize high-precision stacking and high-precision repeated transfer of two-dimensional materials.
The embodiment of the application provides a two-dimensional material transfer device, which comprises
A first bearing module for bearing the substrate,
The second bearing module is used for bearing the target substrate;
The first bearing module can drive the base to move to the bonding station so as to bond the two-dimensional material layer on the surface of the base with the target substrate, and/or the second bearing module can drive the target substrate to move to the bonding station so as to bond the two-dimensional material layer on the surface of the base with the target substrate;
And an energy source for generating energy capable of evaporating a sacrificial layer adjacent to the two-dimensional material layer in the middle of the substrate, thereby detaching the two-dimensional material layer located at the bonding station from the substrate.
According to the foregoing embodiment of the application, the apparatus further comprises a vacuum box for creating a vacuum environment, the laminating station is located within the vacuum box,
The first load module may transport the substrate between the exterior of the vacuum box and the interior of the vacuum box,
The second carrier module may transport the target substrate between the exterior of the vacuum box and the interior of the vacuum box.
According to any of the preceding embodiments of the application, the apparatus further comprises a third carrying module for carrying the energy source.
According to any of the foregoing embodiments of the application, the energy source is a light source capable of emitting broad spectrum pulsed light.
According to any of the foregoing embodiments of the present application, the third carrying module is disposed adjacent to the vacuum box, and a light-transmitting area that is light-permeable is disposed on a sidewall of the vacuum box adjacent to the first carrying module, and light emitted from the light source carried on the third carrying module can be irradiated into the vacuum box through the light-transmitting area.
According to any of the foregoing embodiments of the present application, the first carrying module includes a first moving assembly for transporting the substrate to the bonding station, and the first moving assembly has a first adsorbing surface for adsorbing the substrate thereon, where the first adsorbing surface faces a direction in which the second carrying module is located.
According to any of the foregoing embodiments of the application, the first carrier module includes a first stage for providing a movement track for the first moving assembly, the first moving assembly moving along the movement track between the inside and outside of the vacuum box,
Or (b)
The first bearing module comprises a first carrying platform which is used for providing a rotating shaft for the first moving assembly, and the first moving assembly rotates around the rotating shaft to move between the inside and the outside of the vacuum box.
According to any one of the foregoing embodiments of the present application, the first suction surface sucks the substrate by negative pressure, and a first gas path for generating negative pressure, which communicates with the first suction surface, is provided in the first moving assembly.
According to any of the foregoing embodiments of the present application, the second carrier module includes a second stage for carrying the target substrate, the second stage having a second adsorbing face for adsorbing the target substrate.
According to any one of the foregoing embodiments of the present application, the second adsorption surface adsorbs the target substrate by negative pressure, and a second gas path for generating negative pressure, which communicates with the second adsorption surface, is provided in the second stage.
According to any of the preceding embodiments of the application, the second load module further comprises a second moving assembly for transporting the second stage between the exterior of the vacuum box and the interior of the vacuum box.
According to any of the foregoing embodiments of the present application, the second carrier module further includes a rotation mechanism for horizontally rotating the second stage.
According to any of the foregoing embodiments of the present application, the second carrier module further includes a leveling component for adjusting parallelism between the target substrate adsorbed by the second adsorption surface and the base adsorbed by the first adsorption surface.
According to any of the foregoing embodiments of the present application, the leveling assembly may move the target substrate on the second carrier to the bonding station.
According to any of the foregoing embodiments of the application, the leveling assembly includes a base plate and a leveling plate movably disposed on the base plate, a second stage disposed on the leveling plate,
A plurality of groups of driving components are arranged on the base plate, and each group of driving components can adjust the distance between the local leveling plate corresponding to the installation position of the driving components and the base plate.
According to any of the foregoing embodiments of the present application, the leveling plate is movably disposed on the base plate by an elastic member.
According to any of the foregoing embodiments of the present application, each set of driving assemblies includes a driving motor and a driving lever, one end of the driving lever is connected to the driving motor, the other end is abutted against the leveling plate, and the driving motor is used for driving the driving lever to extend toward the leveling plate or retract toward a direction away from the leveling plate.
According to any one of the embodiments of the present application, a ball head is provided at one end of the driving rod, which abuts against the leveling plate, and an abutment hole, which is engaged with the ball head, is provided at a corresponding position of the leveling plate.
According to the two-dimensional material transfer device provided by the embodiment of the application, the energy source capable of evaporating the sacrificial layer is arranged, so that the sacrificial layer can be rapidly evaporated under the condition that the two-dimensional material layer of the base is attached to the target substrate, the two-dimensional material layer is continuously attached to the target substrate under the action of Van der Waals force, the transfer efficiency of the two-dimensional material is greatly improved, and the large-area transfer and high-precision multiple transfer of the two-dimensional material can be realized.
Drawings
FIG. 1 is a schematic diagram of a base and a target substrate according to an embodiment of an aspect of the present application;
FIG. 2 is a schematic structural view of a two-dimensional material transfer apparatus according to an embodiment of an aspect of the present application;
FIG. 3 is a schematic view of a partial structure of a two-dimensional material transfer apparatus according to an embodiment of an aspect of the present application;
FIG. 4 is a schematic structural view of a first carrying module of a two-dimensional material transfer apparatus according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a fiber optic assembly of a first carrier module detecting a distance between a base layer and a target substrate according to an embodiment of an aspect of the present application;
FIG. 6 is a schematic structural view of a second carrying module of the two-dimensional material transfer apparatus according to an embodiment of an aspect of the present application;
FIG. 7 is a schematic structural view of a leveling assembly for a second load module according to an embodiment of an aspect of the present application;
fig. 8 is a schematic structural diagram of a third carrying module and an alignment detection module according to an embodiment of an aspect of the present application.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the particular embodiments described herein are meant to be illustrative of the application only and not limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.
Referring to fig. 1, an embodiment of the present application provides a substrate S including a substrate layer S1, a sacrificial layer S2 and a two-dimensional material layer S3 stacked in order, wherein the sacrificial layer S2 is used for evaporating under the action of an energy source to separate the two-dimensional material layer S3 from the substrate layer S1, i.e. the two-dimensional material layer S3 is separated from the substrate S. The detached two-dimensional material layer S3 may be attached to the target substrate T by the action of van der waals forces for the purpose of transferring the two-dimensional material.
In some embodiments, the sacrificial layer S2 is made of a photosensitive material, and the sacrificial layer S2 of the photosensitive material can be evaporated under the action of light energy, so that the two-dimensional material layer S3 is separated from the substrate S and attached to the target substrate T. In this embodiment, the substrate layer S1 is made of a material with high transmittance, such as quartz glass and borosilicate glass, so that light can be irradiated onto the sacrificial layer S2 through the substrate layer S1.
In some embodiments, the sacrificial layer S2 is a low melting point material. The sacrificial layer S2 of the low-melting-point material can be evaporated under the action of heat energy, so that the two-dimensional material layer S3 is separated from the substrate S and is attached to the target substrate T. In this embodiment, the substrate layer S1 may be made of silicon.
Both light energy and heat energy can cause the sacrificial layer S2 to evaporate rapidly, thereby improving the transfer efficiency of the two-dimensional material.
In some embodiments, a micrometer-scale gap exists between the two-dimensional material layer S3 and the target substrate T before transferring to the target substrate T, from which gap the evaporated sacrificial layer S2 can be pumped away, avoiding condensation; after the sacrificial layer S2 evaporates, the two-dimensional material layer S3 falls onto the target substrate T due to its own weight, and is bonded to the target substrate T by van der waals force. Of course, the two-dimensional material layer S3 may be directly bonded to the target substrate T before being transferred to the target substrate T without leaving a gap.
In some embodiments, the substrate layer S1 is made of a high light transmittance material, and the high light transmittance can enable light to irradiate onto the sacrificial layer S2 from the transparent substrate layer S1, so that the sacrificial layer S2 is evaporated under the action of light energy. For example, the light transmittance of the base layer S1 is 99.5% or more, and an antireflection film may be coated on the side of the base layer S1 near the energy source 3 to improve the light transmittance. Preferably, the substrate layer S1 is made of quartz.
In some embodiments, the substrate layer S1 is made of a heat conductive material, and heat can be transferred to the sacrificial layer S2 through the substrate layer S1, so as to evaporate the sacrificial layer S2. Preferably, the substrate layer S1 is made of silicon.
Referring to fig. 2, a two-dimensional material transfer apparatus 100 according to a second embodiment of the present application includes a first carrying module 1, a second carrying module 2, and an energy source 3. Wherein the first carrier module 1 is used for carrying the substrate S as described above, the second carrier module 2 is used for carrying the target substrate T, and the energy source 3 is used for generating energy enabling the sacrificial layer S2 to evaporate.
The first carrying module 1 can drive the substrate S to move to a bonding station so as to bond the two-dimensional material layer S3 of the substrate S with the target substrate T; or alternatively
The second bearing module 2 can drive the target substrate T to move to a bonding station so as to bond the two-dimensional material layer S3 of the base S with the target substrate T; or alternatively
The first bearing module 1 and the second bearing module 2 can move, and can respectively drive the base S and the target substrate T to move to a bonding station, so that the two-dimensional material layer S3 of the base S is bonded with the target substrate T at the bonding station;
The energy generated by the energy source 3 evaporates the sacrificial layer S2 at the bonding station, thereby separating the two-dimensional material layer S3 from the substrate layer S1; the two-dimensional material layer S3 is attached to the target substrate T under the action of Van der Waals force, so that the two-dimensional material is successfully transferred to the target substrate T, and the transfer efficiency of the two-dimensional material is greatly improved.
With continued reference to FIG. 2, in some embodiments, the two-dimensional material transfer apparatus 100 further includes a vacuum box 4 for creating a vacuum environment, the laminating station being located within the vacuum box 4; the vacuum environment can reduce impurity adsorption, avoid the damage of the two-dimensional material in the transfer process, and simultaneously ensure that the two-dimensional material cannot drift. Due to the interior of the vacuum box 4 provided with the bonding station, the first carrier module 1 may transport the substrate S between the exterior of the vacuum box 4 and the interior of the vacuum box 4 and the second carrier module 2 may transport the target substrate T between the exterior of the vacuum box 4 and the interior of the vacuum box 4 in order to facilitate placement of the substrate S and the target substrate T. When the substrate S needs to be conveyed to the bonding station in the vacuum box, the first bearing module 1 is utilized to convey the substrate S from the outside of the vacuum box 4 to the bonding station in the vacuum box 4; when it is desired to transport the target substrate T to the bonding station inside the vacuum box 4, the target substrate is transported from outside the vacuum box 4 to the bonding station inside the vacuum box by means of the second carrier module 2. Of course, it is also possible to manually place the base S and the target substrate T on the first carrier module 1 and the second carrier module 2 inside the vacuum box 4 by an operator, respectively, and then to transport the base S and the target substrate T to the target station using the first carrier module 1 and the second carrier module 2, respectively. If a gap of the order of micrometers exists between the two-dimensional material layer S3 and the target substrate T before transferring to the target substrate T, the evaporated sacrificial layer S2 can be pumped away from the gap in the vacuum box, avoiding condensation of the sacrificial layer S2.
In some embodiments, the two-dimensional material transfer device 100 further comprises a third carrying module 5 for carrying the energy source 3. The third carrier module 5 can provide an installation reference position for the energy source 3, so that the energy source can be installed, adjusted or replaced conveniently, quickly and accurately. Since the energy source 3 mainly acts on the substrate S located at the bonding station, the energy source 3 may not be moved, and thus may be disposed inside the vacuum box 4 or outside the vacuum box 4, and the third carrier module 5 may be located inside the vacuum box 4 or outside the vacuum box 4. For example, if the energy source 3 is a heat source, the energy source 3 may be arranged inside the vacuum box, i.e. the energy source 3 is arranged inside the vacuum box 4 by means of the third carrier module 5, in order to reduce heat losses.
If the energy source 3 is a light source, the base layer S is made of a material having high light transmittance when the base layer S located at the bonding station is interposed between the light source and the target substrate T, and light emitted from the light source can be irradiated onto the sacrificial layer S2 through the base layer S. In order to reduce the volume of the vacuum box, in the embodiment shown in fig. 2, the third bearing module 5 is disposed outside the vacuum box 4 and adjacent to the vacuum box 4, the sidewall of the vacuum box 4 adjacent to the first bearing module 1 is provided with a light-transmitting area that can transmit light, and the light emitted by the light source located on the third bearing module 5 can irradiate the inside of the vacuum box 4 through the light-transmitting area, so that the sacrificial layer S2 of the attaching station can receive light energy and evaporate under the action of the light energy. The entire side wall of the vacuum box 4 adjacent to the first carrying module 1 may be set as a light transmission area, or the partial side wall of the vacuum box 4 adjacent to the first carrying module 1 may be set as a light transmission area, depending on the light area emitted by the light source.
In some embodiments, the light source is capable of emitting broad spectrum pulsed light. The light source may be ultraviolet light, visible light, light in the far infrared band. Preferably, the light source is a large area broad spectrum pulsed sintering light source. The substrate S is exposed by the large-area wide-spectrum pulse sintering light source, the light source is large in area, and meanwhile, the light energy density is uniform, so that the sacrificial layer S2 can be instantaneously evaporated, the transfer efficiency of the two-dimensional material is improved, and the large-area transfer of the two-dimensional material is realized.
In some embodiments, the third carrying module 5 may move the energy source 3, so as to move between a position above the bonding station and other positions, and when the energy source 3 is needed to evaporate the sacrificial layer S2, the energy source 3 will be moved above the bonding station through the third carrying module 5, and after the work is completed, the third carrying module 5 is reset, and the energy source 3 is conveyed to other positions. As shown in fig. 2, the two-dimensional material transfer apparatus 100 further includes a frame 7, and the third carrying module 5 is movably disposed on the frame 7, and can be manually pushed or driven by a motor to move the third carrying module 5 along a track on the frame to above the attaching station.
Referring to fig. 3 and 4, in some embodiments, the first carrying module 1 includes a first moving assembly 11 for conveying the substrate S to the attaching station, the first moving assembly 11 has a first adsorbing surface 111 for adsorbing the substrate S, the first carrying module 1 is disposed adjacent to the second carrying module 2, and the first adsorbing surface 111 faces the direction of the second carrying module 2.
The attraction force for attracting the substrate S may be an electrostatic force, an attraction force due to negative pressure, or a magnetic force due to a magnet, depending on the material of the substrate layer S1. With continued reference to fig. 3 and 4, in some embodiments, the first suction surface 111 sucks the substrate S by negative pressure, and a first air path 112 for generating negative pressure is disposed in the first moving component 11 and is in communication with the first suction surface 111. The substrate S can be sucked by negative pressure regardless of the material of the substrate S1. Preferably, an annular groove communicating with the first air passage is provided on the first adsorption surface 111, and when the first air passage 112 operates, a negative pressure is formed in the annular groove, thereby adsorbing the substrate S.
With continued reference to fig. 3 and 4, in some embodiments, the first carrier module 1 includes a first stage 12, where the first stage 12 is configured to provide a moving track 121 for the first moving component 11, and the first moving component 11 moves between the inside and the outside of the vacuum box 4 along the moving track 121. The first moving assembly 11 forms a drawing type structure together with the moving rail 121, and the first moving assembly 11 can be moved between the inside and outside of the vacuum box 4 by drawing the first moving assembly 11, thereby transporting the substrate S into the vacuum box 4 or out of the vacuum box 4.
Of course, the first moving assembly 11 may also move between the inside and outside of the vacuum box 4 by other movement means. For example, the first moving component 11 may be pivotally connected to the vacuum box 4, and the first moving component 11 may be moved between the inside and the outside of the vacuum box 4 by opening and closing. In a specific implementation manner, a rotating shaft is arranged on the first stage 12/the vacuum box 4, and the first moving component 11 rotates around the rotating shaft to move between the inside and the outside of the vacuum box 4.
In the process of attaching the base S to the target substrate T, it is necessary to strictly secure the parallelism between the base S and the target substrate T, and therefore, a component dedicated to detecting the parallelism between the base S and the target substrate T may be provided.
With continued reference to fig. 4, in some embodiments, a plurality of sets of optical fiber assemblies 13 for detecting the distance between the base layer S1 and the target substrate T are disposed on the first carrier module 1. Each group of optical fiber components 13 detects the distance between the base layer S1 and the target substrate T at different positions, and by the distance values detected by the groups of optical fiber components 13, it can be determined whether the base layer S and the target substrate T are parallel.
Referring to fig. 5, the principle of detecting the distance between the base S and the target substrate T by using the optical fiber assembly 13 is as follows: in the process that the base S and the target substrate T are gradually close to each other, after a certain distance is reached between the base S and the target substrate T, white light generated by a light source externally connected with the optical fiber assembly 13 irradiates the target substrate T through the base S1, and reflected light of the target substrate T interferes with reflected light of the lower surface of the base S1 and enters the spectrometer through the optical fiber assembly 13; finally, the distance between the target substrate T and the base layer S1 is calculated through a spectrometer. The sacrificial layer S2 and the two-dimensional material layer S3 in the substrate S do not reflect white light, and thus, the position for measuring the distance is disposed outside the area where the sacrificial layer S2 and the two-dimensional material layer S3 are located.
In some embodiments, the number of optical fiber assemblies 13 disposed on the first carrier module 1 is at least 3, and each group of optical fiber assemblies 13 includes an optical fiber bundle 131, and the optical fiber bundle 131 includes an emitting optical fiber (not shown in the drawing) for emitting light toward the base layer S1 and the target substrate T and a receiving optical fiber (not shown in the drawing) for receiving reflected light reflected by the base layer S1 and the target substrate T. Preferably, as shown in FIG. 4, 3 sets of fiber optic assemblies 13 are provided; three sets of distance data can be obtained through the three sets of optical fiber assemblies 13, each set of distance data represents the distance between the target substrate T and the base layer S1 at different positions, and the parallelism between the target substrate T and the base layer S1 can be obtained through the three sets of data. Of course, a greater number of fiber optic assemblies 13 may be provided. The method of white light interference ranging can realize the resolution of nanometer level.
With continued reference to fig. 4, in some embodiments, each set of fiber optic assemblies 13 further includes a fiber optic refractor (not shown) for changing the optical path of the fiber optic bundle 131 so that light rays emanating from the emitting fibers can be received by the receiving fibers after being reflected by the substrate layer S1 and the target substrate T. As shown in fig. 4, if the emission fiber and the reflection fiber are bundled together, it is necessary to reflect the light emitted from the emission fiber and return the light to the reflection fiber substantially in the original path. According to the direction shown in fig. 5, the emission light from the emission fiber is incident on the base layer S1 and the target substrate T substantially perpendicularly, and the reflected light formed by reflection needs to be reflected back from the surfaces of the base layer S1 and the target substrate T substantially perpendicularly to the receiving fiber. In the embodiment of fig. 4, the fiber refractor causes a 90 ° change in the optical path of the emitting fiber, thereby enabling the outgoing light to be incident substantially perpendicularly to the base layer S1 and the surface of the target substrate T.
With continued reference to fig. 4, in some embodiments, fiber mounting grooves 14 for mounting fiber assemblies 13 are provided on the first carrier module 1, one fiber mounting groove 14 for each group of fiber assemblies 13. Each group of optical fiber assemblies 13 further includes a lens barrel 132 for mounting an optical fiber refractive mirror, and the optical fiber bundle 131 is optically connected to the lens barrel 132. The lens barrels 132 are also disposed in the corresponding fiber mounting grooves 14.
Referring to fig. 6, in some embodiments, the second carrier module 2 includes a second carrier 21 for carrying the target substrate T, and the second carrier 21 has a second adsorption surface 211 for adsorbing the target substrate T. Similarly, different adsorption modes, such as electrostatic adsorption, magnetic adsorption, negative pressure adsorption, etc., can be adopted according to the material of the target substrate T. In the present embodiment, the second suction surface 211 sucks the target substrate T by negative pressure, and a second gas path 212 for generating negative pressure, which communicates with the second suction surface 211, is provided in the second stage 21. Preferably, an annular groove communicated with the second air channel 212 is arranged on the second adsorption surface 211, and when the second air channel 212 works, negative pressure is formed in the annular groove, so that the target substrate T is adsorbed.
With continued reference to fig. 6, in some embodiments, the second carrier module 2 further includes a second movement assembly 22 for transporting the second stage 21 between the exterior of the vacuum box 4 and the interior of the vacuum box 4. The second moving assembly 22 can realize linear motion of nanometer resolution in a vacuum environment, so that the movement of the second stage 21 is more accurate.
With continued reference to fig. 6, in some embodiments, the second carrier module 2 further includes a rotation mechanism 23 for horizontally rotating the second stage 21. In the step of performing alignment of the base S with the target substrate T, adjustment of the horizontal rotation angle of the target substrate can be achieved by the rotation mechanism 23. The rotation mechanism 23 can realize the rotation motion of micro-arc resolution in a vacuum environment, so that the rotation of the second carrier 21 is more accurate.
With continued reference to fig. 6, in some embodiments, the second carrier module 2 further includes a leveling assembly 24 for adjusting the parallelism between the target substrate T adsorbed by the second adsorption surface 211 and the base substrate S adsorbed by the first adsorption surface 111. After detecting the parallelism between the base layer S1 and the target substrate T by the optical fiber assembly 13 and the external spectrometer, the leveling assembly 24 can adjust the levelness of the target substrate T by the data of the spectrometer, so that the target substrate T is parallel to the base layer S1. Of course, leveling assembly 24 may also be an adaptive gimbal adjustment mechanism that does not require the use of spectrometer data. After leveling, the transfer precision of the two-dimensional material can be ensured, and the two-dimensional material drift is avoided.
With continued reference to fig. 3 and 6, in some embodiments, leveling assembly 24 may move target substrate T on second stage 21 to a bonding station. When the leveling component 24 works, the target substrate T is driven to move towards the base S, and after a certain distance is reached, the optical fiber component 13 detects the parallelism between the target substrate T and the base S2; the leveling component 24 adjusts the levelness of the target substrate T according to the measured levelness, so that the target substrate T is parallel to the base layer S1; after the target substrate T is parallel to the base layer S2, the leveling assembly 24 drives the target substrate T to move to the bonding station to bond with the two-dimensional material layer S3.
With continued reference to fig. 6, in some embodiments leveling assembly 24 includes a base plate 241 and a leveling plate 242, leveling plate 242 being movably disposed on base plate 241, second stage 21 being disposed on leveling plate 242, base plate 241 being disposed on rotation mechanism 23, rotation mechanism 23 being disposed on second moving assembly 22; the second moving component 22 can drive the rotating mechanism 23 and the leveling component 24 to integrally move; a plurality of sets of driving units 243 are mounted on the substrate 241, each set of driving units being capable of adjusting a distance between a portion of the leveling plate 242 corresponding to a mounting position thereof and a corresponding portion of the substrate 241. One end of each set of driving components 243 is located on the base plate 241, and the other end is connected or abutted with the leveling plate 242, which corresponds to that each set of driving components 243 only contacts with the local parts of the leveling plate 242 and the base plate 241, and when the distance is adjusted, the distance between the local positions of the leveling plate 242 and the base plate 241 and the driving components 243 is adjusted. By providing a plurality of sets of leveling assemblies 24, the plurality of positions of the leveling plates 242 can be adjusted, so that the purpose of adjusting the levelness of the leveling plates 242 is achieved, and the purpose of adjusting the target substrate T on the second carrier 21 on the leveling plates 242 to be parallel to the base layer S1 of the base S on the first moving assembly 11 is achieved.
With continued reference to fig. 6, in some embodiments, the leveling plate 242 is movably disposed on the substrate 241 by an elastic member 244; the elastic member may be a spring, one end of the spring is connected to the leveling plate 242, the other end of the spring is connected to the base plate 241, the spring is in a stretched state when the driving assembly 243 drives the leveling plate 242 to move towards the first carrier module 1, and the leveling plate 242 can be reset under the action of elastic restoring force of the spring when the driving assembly 243 drives the leveling plate 242 to move away from the first carrier module 1.
Of course, the leveling plate 242 may be directly connected to the driving unit 243 without providing a spring, for example, one end of the driving unit 243 is fixed to the base plate 241, and the other end is connected to the leveling plate 242.
With continued reference to fig. 6, in some embodiments, each set of drive assemblies 243 includes a drive motor 2431 and a drive rod 2432, one end of the drive rod 2432 is connected to the drive motor 2431 and the other end is in abutment with the screed 242, the drive motor 2431 being configured to drive the drive rod 2432 either out toward the screed 242 or back toward a direction away from the screed 242. When the driving rod 2432 extends towards the direction of the leveling plate 242, the leveling plate 242 can be driven to move towards the direction of the first bearing module 1, so that the target substrate T on the second carrier 21 on the leveling plate 242 moves towards the attaching station to attach to the two-dimensional material layer S3; when the driving rod 2432 is retracted in a direction away from the leveling plate 242, the leveling plate 242 is reset under the action of the elastic restoring force of the spring, the target substrate T and the two-dimensional material layer S3 attached to the target substrate move in a direction away from the base layer S1, and the distance between the target substrate T and the base layer S1 is pulled, so that the target substrate T can be conveniently taken out subsequently. The drive motor 2431 may be a stepper piezoelectric motor, for example, that achieves linear motion at nanometer resolution in a vacuum environment.
Referring to fig. 7, in some embodiments, a ball 2433 is disposed at an end of the driving rod 2432 abutting against the leveling plate 242, and an abutting hole 2421 abutting against the ball 2433 is disposed at a corresponding position of the leveling plate 242. The abutment hole 2421 may be a chamfered circular hole.
With continued reference to fig. 2, in some embodiments, the two-dimensional material transfer apparatus 100 further includes an alignment detection module 6 for detecting whether the base layer S1 is aligned with the target substrate T. For large-area two-dimensional materials, it is necessary to ensure that the two-dimensional material is aligned with the target substrate during transfer to successfully transfer all of the two-dimensional material. Whether the target substrate T is aligned with the base S can be detected by the alignment detection module 6. The alignment detection module 6 may be mounted on the third carrier module 5.
A visual alignment system may be employed to perform the function of alignment detection. Specifically, as shown in fig. 8, the alignment detection module 6 includes a camera 61 for photographing an alignment mark on the base layer S1 and the target substrate T located in the vacuum box 4 and a camera adjustment assembly 62 for adjusting the angle and position of the camera 61.
As shown in fig. 8, the number of cameras 61 is two, one telecentric lens 610 is mounted on each camera, the cameras 61 are disposed on the camera adjusting assembly 62 through the camera mounting plate 63, and the camera adjusting assembly 62 is fixed on the third carrier module 5. The camera adjusting component 62 comprises a Z-direction lifting table 621 used for adjusting the Z-direction position of the camera, an XY translation table 622 used for adjusting the XY plane position of the camera, and a pitching adjustment table 623 used for adjusting the pitching angle of the camera, wherein the Z-direction lifting table 621, the XY translation table 622 and the pitching adjustment table 623 are fixedly connected in sequence; the Z-direction lifting table 621 is fixed to the third carrier module 5, and the camera mounting plate 63 is rotatably connected to the pitch adjustment table 623. The camera adjustment assembly 62 may enable sub-micron resolution motion.
In some embodiments, the second moving assembly 22 described above can also be used to adjust the horizontal position of the second stage 21,
The two-dimensional material transfer apparatus 100 further includes a controller that calculates a degree of deviation between the base layer S1 and the alignment mark on the target substrate T from the image captured by the camera 61, and controls the second moving member 22 to move to a position to align the base layer S1 and the alignment mark on the target substrate T according to the degree of deviation. Whether the base layer S1 is aligned with the target substrate T or not can be detected by the alignment detection module 6, and in the case that misalignment is detected, the second movement mechanism 22 can be controlled by the controller to align the base layer S1 with the target substrate T, so that the accuracy of the two-dimensional material multiple transfer stacking can be realized.
In some embodiments, in the case where the second carrier module 2 includes the leveling assembly 24 for adjusting the parallelism between the target substrate T carried by the second carrier module 2 and the base S adsorbed by the first adsorption surface 111,
The controller of the two-dimensional material transfer apparatus 100 is further configured to determine the parallelism between the target substrate T and the base S according to the distance data detected by the optical fiber assembly 13, and control the leveling assembly 24 to adjust the position of the target substrate T according to the parallelism so that the target substrate T is parallel to the base S.
The two-dimensional material transfer apparatus 100 is used as follows:
first, the first moving assembly 11 is pulled out from the first carrying platform 12; placing the substrate S on the first adsorption surface 111, where the substrate S is adsorbed on the first adsorption surface 111 due to the effect of the external vacuum pump of the first air path 112; the first moving assembly 11 is then inverted, and reinserted into the first stage 12 even though the substrate S is facing downward.
The second moving assembly 22 is controlled to move outwards of the vacuum box 4, the displacement of the driving motor 2431 is 0, and the leveling plate 242 is positioned at the lowest stroke position, so that the target substrate can be placed manually; placing the target substrate on the second carrier 21, wherein the target substrate is fixed on the second adsorption surface 211 under the action of the external vacuum pump of the second air path 212; the second moving assembly 22 moves the target substrate under the alignment detection module 6 (transparent quartz glass is mounted on top of the vacuum box through a flange plate, ensuring that the camera 61 can acquire an image of the interior of the vacuum box 4 and the light source can directly illuminate on the substrate S).
Closing the gate of the vacuum box, vacuumizing the vacuum box 4 through a vacuum pump externally connected with the flange, ensuring that the air pressure formed by the vacuum box 4 is higher than the air pressure of the first air passage 112 and the second air passage 212, and ensuring that the target substrate and the base do not drop and displace through the air pressure difference.
The driving motor 2431 pushes the leveling plate 242 and the second stage 21 to move upward so that the target substrate approaches the base. When a certain distance is reached, white light generated by the light source connected with the optical fiber assembly 13 irradiates on the target substrate T through the base layer S1, and reflected light of the target substrate interferes with reflected light of the lower surface of the base layer S1 and enters an external spectrometer through the optical fiber assembly. And calculating the distance between the target substrate and the two-dimensional material substrate through the spectrometer data. The distance between the target substrate T and the 3 points on the base layer S1 is obtained through the data obtained by the 3 optical fiber assemblies 13, and the parallelism of the target substrate and the base layer S1 is obtained. The target substrate T is adjusted to be parallel to the base layer S1 by the leveling assembly 24.
The alignment detection module 6 is used for carrying out alignment detection on the target substrate and the base layer S1; the process ensures the precision of two-dimensional material stacking (i.e., multiple transfers) and ensures the ideal position of the two-dimensional material on a plane after each transfer. Specifically, the camera 61 is adjusted to an ideal position by the camera adjusting component 62, and the second moving component 22 and the rotating mechanism 23 move the target substrate T according to the image data obtained by the camera 61, so that the alignment mark on the target substrate T (the alignment mark processed in advance on both the base layer S1 and the target substrate T) is aligned with the alignment mark on the base layer S1. Wherein telecentric lens 610 ensures that the magnification of camera 61 does not change.
After leveling and alignment are completed, the leveling assembly 24 pushes the target substrate T in the direction of the base S, so that the target substrate T is attached to the two-dimensional material layer S3 at the attaching station.
The third carrier module 5 is pushed along a track on the frame 7, moving the energy source 3 directly above the target substrate T at the laminating station. The energy source 3 (light source) is turned on to expose, the sacrificial layer S2 is evaporated, the two-dimensional material layer S3 is attached to the target substrate T, and the single transfer is completed.
Then the vacuum box 4 can be depressurized, the substrate S is replaced, and the process is repeated to realize high-precision multiple transfer.
The base layer, the sacrificial layer, the two-dimensional material layer and the target substrate are all positioned in vacuum, and the position drift of the two-dimensional material during transfer can be avoided in vacuum, so that the transfer precision is influenced. The vacuum also causes the evaporated sacrificial layer to spread out rapidly. The method can realize wafer-level and efficient single transfer and realize high-precision two-dimensional material stacking.
Claims (18)
1. A two-dimensional material transfer device, characterized in that: comprising
A first bearing module for bearing the substrate,
The second bearing module is used for bearing the target substrate;
The first bearing module can drive the base to move to the bonding station so as to bond the two-dimensional material layer on the surface of the base with the target substrate, and/or the second bearing module can drive the target substrate to move to the bonding station so as to bond the two-dimensional material layer on the surface of the base with the target substrate;
And an energy source for generating energy capable of evaporating a sacrificial layer adjacent to the two-dimensional material layer in the middle of the substrate, thereby detaching the two-dimensional material layer located at the bonding station from the substrate.
2. The two-dimensional material transfer device of claim 1, wherein: and a vacuum box for generating a vacuum environment, wherein the fitting station is positioned in the vacuum box,
The first load module may transport the substrate between the exterior of the vacuum box and the interior of the vacuum box,
The second carrier module may transport the target substrate between the vacuum box exterior and the vacuum box interior.
3. The two-dimensional material transfer device of claim 1, wherein: a third carrier module for carrying the energy source is also included.
4. A two-dimensional material transfer device according to claim 3, wherein: the energy source is a light source capable of emitting broad spectrum pulsed light.
5. The two-dimensional material transfer device of claim 4, wherein: the third bearing module is arranged adjacent to the vacuum box, a light-transmitting area capable of transmitting light is arranged on the side wall of the vacuum box adjacent to the first bearing module, and light emitted by the light source borne on the third bearing module can penetrate through the light-transmitting area to irradiate into the vacuum box.
6. The two-dimensional material transfer device of claim 2, wherein: the first bearing module comprises a first moving assembly used for conveying the substrate to the attaching station, a first adsorption surface used for adsorbing the substrate is arranged on the first moving assembly, and the first adsorption surface faces to the direction in which the second bearing module is located.
7. The two-dimensional material transfer device of claim 6, wherein:
The first bearing module comprises a first carrying platform which is used for providing a moving track for the first moving component, the first moving component moves between the inside and the outside of the vacuum box along the moving track,
Or (b)
The first bearing module comprises a first carrying platform which is used for providing a rotating shaft for the first moving assembly, and the first moving assembly rotates around the rotating shaft to move between the inside and the outside of the vacuum box.
8. The two-dimensional material transfer device of claim 6, wherein: the first adsorption surface adsorbs the substrate through negative pressure, be provided with in the first movable assembly with first gas circuit that is used for producing the negative pressure of first adsorption surface intercommunication.
9. The two-dimensional material transfer device of claim 2, wherein: the second carrying module comprises a second carrying platform for carrying the target substrate, and the second carrying platform is provided with a second adsorption surface for adsorbing the target substrate.
10. The two-dimensional material transfer device of claim 9, wherein: the second adsorption surface adsorbs the target substrate through negative pressure, and a second gas circuit which is communicated with the second adsorption surface and used for generating negative pressure is arranged in the second carrier.
11. The two-dimensional material transfer device of claim 9, wherein: the second load module further includes a second movement assembly for transporting the second stage between the exterior of the vacuum box and the interior of the vacuum box.
12. The two-dimensional material transfer device of claim 9, wherein: the second bearing module further comprises a rotating mechanism for horizontally rotating the second carrying platform.
13. The two-dimensional material transfer device of claim 9, wherein: the second bearing module further comprises a leveling component for adjusting the parallelism between the target substrate adsorbed by the second adsorption surface and the substrate adsorbed by the first adsorption surface.
14. The two-dimensional material transfer device of claim 13, wherein: the leveling assembly can drive the target substrate positioned on the second carrying platform to move to the attaching station.
15. The two-dimensional material transfer device of claim 14, wherein: the leveling component comprises a base plate and a leveling plate, the leveling plate is movably arranged on the base plate, the second carrier is arranged on the leveling plate,
And a plurality of groups of driving assemblies are arranged on the base plate, and each group of driving assemblies can adjust the distance between the local leveling plate corresponding to the installation position of the driving assemblies and the base plate.
16. The two-dimensional material transfer device of claim 15, wherein: the leveling plate is movably arranged on the base plate through an elastic piece.
17. The two-dimensional material transfer device of claim 15, wherein: each group of driving assembly comprises a driving motor and a driving rod, one end of the driving rod is connected with the driving motor, the other end of the driving rod is in butt joint with the leveling plate, and the driving motor is used for driving the driving rod to extend towards the direction of the leveling plate or retract towards the direction deviating from the leveling plate.
18. The two-dimensional material transfer device of claim 15, wherein: one end of the driving rod, which is abutted with the leveling plate, is provided with a ball head, and an abutting hole matched with the ball head is formed in the corresponding position of the leveling plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311641521.0A CN117976600A (en) | 2022-12-30 | 2022-12-30 | Two-dimensional material transfer device |
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| CN202311641521.0A CN117976600A (en) | 2022-12-30 | 2022-12-30 | Two-dimensional material transfer device |
| CN202211724583.3A CN116130399A (en) | 2022-12-30 | 2022-12-30 | Substrate for two-dimensional material transfer and two-dimensional material transfer device |
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