CN117960636A - Brush, substrate processing device provided with brush, and method for controlling pushing force of brush - Google Patents
Brush, substrate processing device provided with brush, and method for controlling pushing force of brush Download PDFInfo
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- CN117960636A CN117960636A CN202311380217.5A CN202311380217A CN117960636A CN 117960636 A CN117960636 A CN 117960636A CN 202311380217 A CN202311380217 A CN 202311380217A CN 117960636 A CN117960636 A CN 117960636A
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- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000003825 pressing Methods 0.000 claims abstract description 72
- 238000009826 distribution Methods 0.000 claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 56
- 238000004140 cleaning Methods 0.000 claims description 86
- 230000008569 process Effects 0.000 claims description 48
- 238000005406 washing Methods 0.000 claims description 40
- 230000002093 peripheral effect Effects 0.000 claims description 34
- 230000009467 reduction Effects 0.000 claims description 4
- 230000003749 cleanliness Effects 0.000 abstract description 11
- 238000001514 detection method Methods 0.000 abstract description 11
- 239000007788 liquid Substances 0.000 description 52
- 238000011282 treatment Methods 0.000 description 32
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- 230000009471 action Effects 0.000 description 7
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000001012 protector Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The purpose of the present invention is to improve uniformity of in-plane cleanliness of a substrate by taking into account pressure distribution in the surface of a brush. The present invention relates to a brush, a substrate processing apparatus including the brush, and a method of controlling a pressing force of the brush. The control unit controls the pressing force by the pressing mechanism so as to adjust the pressing force according to the position of the brush (99) in the radial direction of the substrate based on the pressure distribution of the in-plane pressure distribution detection unit (SPD). Thus, even if the brushes (99) act unevenly according to the position of the brushes (99) in the radial direction of the substrate, the forces acting by the brushes (99) as seen from the upper surface of the substrate can be made substantially equal regardless of the position of the brushes (99). Therefore, uniformity of the in-plane cleanliness of the substrate can be improved.
Description
Technical Field
The present invention relates to a brush that acts on a substrate when the substrate such as a semiconductor substrate, a substrate for an FPD (FLAT PANEL DISPLAY) such as a liquid crystal display or an organic EL (Electroluminescence) display device, a glass substrate for a photomask, or a substrate for an optical disk is subjected to a cleaning process, a substrate processing apparatus including the brush, and a method for controlling a pressing force of the brush.
Background
Conventionally, there is a device including a rotation holding portion, a nozzle, a brush, a weight sensor, and a washing arm (for example, refer to patent document 1). The rotation holding portion holds the substrate and rotates the substrate in a horizontal plane. The nozzle supplies a cleaning liquid to the upper surface of the substrate. The washing arm includes a brush at a front end portion thereof, and rotates the brush about a vertical axis. The cleaning arm swings the brush on the upper surface of the substrate about the base end portion. At this time, the brush is subjected to a target load by a pressing mechanism built in the washing arm, and washed. The weight sensor is built into the brush. The weight sensor detects the pushing force of the brush. Thereby, the pressing mechanism is operated so that the pressing force of the brush becomes the target load.
[ Background art document ]
[ Patent literature ]
[ Patent document 1]
Japanese patent laid-open No. 2010-40943
Disclosure of Invention
[ Problem to be solved by the invention ]
However, in the case of the conventional example having such a configuration, there are the following problems.
And, in the substrate, devices are formed via processes that include various heat treatments. In this process, the peripheral edge portion of the substrate may warp toward one surface side with respect to the central portion due to a factor such as a difference in thermal expansion coefficient in the surface direction. If the substrate thus warped is washed with a brush, there is a difference in cleanliness between the central portion and the peripheral portion of the substrate. That is, there is a difference in cleanliness in the radial direction of the substrate.
At the center of the substrate, the entire lower surface of the brush acts on the substrate surface. On the other hand, in the peripheral portion of the substrate, since the substrate surface is inclined, only a part of the lower surface of the brush acts on the substrate surface. That is, the contact area of the brush in the peripheral portion is smaller than the contact area of the brush in the central portion. Therefore, when the pressing mechanism is operated by the weight sensor so that the pressing force of the brush becomes the target load, the load per unit area is greater in the peripheral portion than in the central portion. In other words, the force applied by the brush body increases as the brush body is positioned closer to the peripheral edge portion when viewed from the substrate surface. The forces exerted by the brush body, when seen from the substrate surface, differ in the radial direction of the substrate.
As a result, the conventional apparatus has a problem that the removal rate of particles varies in the radial direction of the substrate. In other words, the cleanliness is not uniform in the plane of the substrate. In addition, when the contact area of the brush is small, the load per unit area may be excessive. Therefore, there is also a problem that damage of the brush is increased and the time that the brush can be used (brush life) becomes short.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a brush capable of improving uniformity of in-plane cleanliness of a substrate by taking into consideration pressure distribution in a surface of the brush, a substrate processing apparatus including the brush, and a method of controlling pressing force of the brush.
[ Means of solving the problems ]
In order to achieve the above object, the present invention adopts the following constitution.
That is, the invention described in claim 1 is a brush that performs a cleaning process for a substrate, comprising: a brush body acting on the substrate; a brush seat for mounting the brush body; and an in-plane pressure distribution detecting unit which is disposed between the brush body and the brush holder, detects a pressure applied to the brush body, and detects a pressure distribution in a plane of the brush body acting on the substrate.
According to the invention described in claim 1, the in-plane pressure distribution of the brush body is detected by the in-plane pressure distribution detecting unit. Thereby, it can be judged whether the brush body unevenly acts on the substrate surface. The judgment result can be used to adjust the pushing force of the brush body against the substrate surface.
The invention described in claim 2 is a substrate processing apparatus for performing a cleaning process by applying a brush to a substrate, comprising: a rotation holding unit that holds the substrate in a horizontal posture and rotates the substrate; a brush which acts on the upper surface of the substrate held by the rotation holding part, and which is provided with a brush body acting on the substrate and a brush holder to which the brush body is attached; a cleaning arm having the brush at a distal end portion thereof, the cleaning arm being configured to move the brush in a radial direction of the substrate between a rotation center and a peripheral edge portion of the substrate held by the rotation holding portion; a pushing mechanism for pushing the brush toward the substrate with a pushing force; an in-plane pressure distribution detecting unit which is disposed between the brush body and the brush holder, detects a pressure applied to the brush body, and detects an in-plane pressure distribution of the brush body acting on a substrate; and a control unit configured to control the pressing force by the pressing mechanism so as to adjust the pressing force in accordance with the position of the brush in the radial direction of the substrate based on the pressure distribution.
According to the invention described in claim 2, the control unit controls the pressing force to be adjusted by the pressing mechanism in accordance with the position of the brush in the radial direction of the substrate based on the pressure distribution of the in-plane pressure distribution detecting unit. Thus, even if the brush body acts unevenly according to the position of the brush in the radial direction, the force applied by the brush body as seen from the substrate surface can be made almost equal regardless of the position of the brush. Therefore, uniformity of the in-plane cleanliness of the substrate can be improved.
In the present invention, it is preferable that the control unit adjusts the pressing force so that a load per unit area applied to the substrate by the brush is fixed in the radial direction of the substrate (claim 3).
The pressing force is adjusted in such a manner that the load per unit area applied to the substrate is fixed in the radial direction of the substrate. Therefore, the forces applied by the brush body as seen from the substrate surface can be made almost uniform regardless of the position of the brush.
In the present invention, it is preferable that the control unit sets an area of the pressure distribution at which the pressures are substantially the same as a same pressure area, sets the same pressure area when the brush is positioned at the center of the substrate as a reference same pressure area, and operates the pressing mechanism to reduce the pressing force to the brush according to the degree of reduction of the same pressure area when the same pressure area is reduced compared to the reference same pressure area (claim 4).
When the area of the same pressure is reduced as compared with the reference area of the same pressure, the area (contact area) of the brush body acting on the substrate surface is reduced. This means that the load per unit area becomes large. Therefore, the pressing mechanism is operated to reduce the pressing force to the brush according to the degree of reduction of the same pressure area. Thus, the forces applied by the brush body as seen from the substrate surface can be made almost uniform regardless of the position of the brush.
In the present invention, it is preferable that the control unit determines that the brush body is not normally attached to the brush holder when the reference co-pressure area is lower than a predetermined value (claim 5).
If the brush body is erroneously mounted to the brush holder in an inclined posture, the reference co-pressure area of the center of the substrate is lower than a prescribed value. Therefore, the control part can judge that the brush body is not normally installed. This makes it possible to determine that cleaning cannot be performed normally, and thus countermeasures such as stopping can be taken.
In the present invention, it is preferable that the control unit further adjusts at least one of a rotation speed of the substrate of the rotation holding unit, a rotation speed of the brush, and a movement speed of the washing arm (claim 6).
In addition to the pressing by the pressing mechanism, at least one of the rotation speed of the substrate of the rotation holding portion, the rotation speed of the brush, and the moving speed of the washing arm is further adjusted. Therefore, unevenness in the cleanliness, which cannot be completely adjusted by adjusting the pressing force, can be suppressed.
The invention described in claim 7 is a method for controlling a pressing force of a brush, comprising a brush having a brush body acting on a substrate and a brush holder to which the brush body is attached, and a cleaning arm having the brush at a distal end portion and being movable at a proximal end portion, wherein the pressing force is applied to the brush so as to move between a center and a peripheral portion of the substrate, thereby cleaning the substrate; and is characterized by implementing the following process: a pressure distribution detecting process of detecting a pressure distribution in a surface of the brush body acting on a substrate; and a pushing force adjustment process of adjusting the pushing force according to the position of the brush in the radial direction of the substrate based on the pressure distribution.
According to the invention described in claim 7, the pressure distribution in the surface of the brush body is detected in the pressure distribution detecting process. In the pressing force adjustment process, the pressing force is adjusted according to the position of the brush in the radial direction of the substrate based on the detected pressure distribution. Therefore, the pressing force is adjusted so that the brush body uniformly acts on the substrate surface when viewed from the substrate surface, regardless of the variation in the pressure distribution in the surface of the brush. As a result, the forces applied by the brush body as seen from the substrate surface can be made almost uniform. Therefore, uniformity of the in-plane cleanliness of the substrate can be improved.
[ Effect of the invention ]
According to the substrate processing apparatus of the present invention, the control unit controls the pressing force to be adjusted by the pressing mechanism in accordance with the brush position in the radial direction of the substrate based on the pressure distribution of the in-plane pressure distribution detecting unit. Thus, even if the brush body acts unevenly according to the position of the brush in the radial direction, the force applied by the brush body as seen from the substrate surface can be made almost equal regardless of the position of the brush. Therefore, uniformity of the in-plane cleanliness of the substrate can be improved.
Drawings
Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment.
Fig. 2 is a view of the substrate processing apparatus of fig. 1 from the rear side X.
Fig. 3 is a plan view schematically showing the structure of the back surface cleaning unit according to the embodiment.
Fig. 4 is a side view showing a schematic configuration of the back surface washing unit.
Fig. 5 is a longitudinal sectional view of the washing arm.
Fig. 6 is a diagram showing a configuration of the in-plane pressure distribution detecting section.
Fig. 7 is a block diagram showing a control system of the back surface washing unit.
Fig. 8 is a schematic view illustrating the state of the brush in the central portion and the peripheral portion of the warped substrate.
Fig. 9 is a flowchart showing a pre-process performed in advance.
Fig. 10 (a) is a graph showing a relationship between the opening degree of the electric air conditioner and the load of the electronic balance, fig. 10 (b) is a graph showing a relationship between the secondary side pressure of the electric air conditioner and the opening degree, and fig. 10 (c) is a graph showing a relationship between the load of the pressing actuator and the secondary side pressure of the electric air conditioner.
Fig. 11 is a flowchart showing the washing process.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment. Fig. 2 is a view of the substrate processing apparatus of fig. 1 from the rear side X.
<1 > Overall constitution >
The substrate processing apparatus 1 includes a carry-in/carry-out block 3, a carry-in block 5, and a processing block 7.
The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 performs, for example, a cleaning process on a substrate W. The substrate processing apparatus 1 processes a substrate W monolithically in a processing block 7. A single substrate W is processed one by one in a state of a horizontal posture.
In this specification, for convenience, the direction in which the carry-in/out block 3, the transfer block 5, and the process block 7 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. The direction from the processing block 7 toward the carry-in/out block 3 in the front-rear direction X is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right direction is referred to as "left direction". The direction perpendicular to the horizontal direction is referred to as "vertical direction Z". In the drawings, front, rear, right, left, upper, and lower are appropriately indicated as references.
< 2> Carry-in and carry-out Block >
The carry-in/out block 3 includes an input portion 9 and a removal portion 11. The input portion 9 and the removal portion 11 are arranged in the width direction Y. A plurality of (e.g., 25) substrates W are stacked and accommodated in a carrier C in a horizontal posture with a fixed interval therebetween. The carrier C accommodating the unprocessed substrate W is placed on the input unit 9. The loading unit 9 includes, for example, two stages 13 on which the carriers C are placed. The carrier C has a plurality of grooves (not shown) formed therein to separate the surfaces of the substrates W from each other and to store the substrates W one by one. The carrier C is accommodated in a posture in which the front surface of the substrate W faces upward, for example. The carrier C includes, for example, a FOUP (Front Opening Unify Pod: wafer cassette). FOUPs are closed containers. The carrier C may be an open container, and the type is not limited.
The removal portion 11 is provided on the opposite side of the input portion 9 of the substrate processing apparatus 1 across the center portion in the width direction Y. The removal portion 11 is disposed on the left side Y of the input portion 9. The removing section 11 accommodates the processed substrate W in the carrier C and removes the substrate W together with the carrier C. The removal unit 11 functioning as described above includes, for example, two stages 13 for placing the carriers C, as in the loading unit 9. The input portion 9 and the output portion 11 are also referred to as load ports.
< 3> Carrier block
The carrier block 5 is disposed adjacent to the rear side X of the carry-in/out block 3 in the substrate processing apparatus 1. The transfer block 5 includes a transfer robot IR and a transfer unit 15.
The transfer robot IR is rotatable about the vertical direction Z. The transfer robot IR is configured to be movable in the width direction Y. The transfer robot IR includes a1 st hand 19 and a2 nd hand 21. In fig. 1, only one hand is shown for the sake of illustration. The 1 st hand 19 and the 2 nd hand 21 hold 1 substrate W, respectively. The 1 st hand 19 and the 2 nd hand 21 are independently configured to advance and retreat in the front-rear direction X. The transfer robot IR moves in the width direction Y and rotates around the vertical direction Z, and advances and retreats the 1 st hand 19 or the 2 nd hand 21 to transfer the substrate W to and from each cassette C. Similarly, the transfer robot IR transfers the substrate W to and from the transfer section 15.
The interface 15 is arranged at the boundary between the carrier block 5 and the processing block 7. The delivery portion 15 is disposed, for example, at the center in the width direction Y. As shown in fig. 2, the joint 15 is formed long in the vertical direction Z.
The transfer section 15 includes the 1 st reversing means 23, the passage section 25, the passage section 27, and the 2 nd reversing means 29 from below in the vertical direction Z toward above.
The 1 st reversing unit 23 reverses the substrate W received from the carrier block 5 up and down. The 1 st reversing unit 23 reverses the horizontal posture of the substrate W. Specifically, the 1 st reversing unit 23 converts the substrate W facing upward into a posture facing downward. In other words, the posture of the substrate W is changed so as to be a back-up posture.
The 2 nd reversing unit 29 performs the opposite action. That is, the 2 nd reversing unit 29 reverses the substrate W received from the process block 7 up and down. The 2 nd reversing unit 29 converts the substrate W with the front face down into a posture with the front face up. In other words, the posture of the substrate W is changed so as to be a back-down posture.
The inversion directions of the 1 st inversion unit 23 and the 2 nd inversion unit 29 may be opposite to each other. That is, the 1 st reversing unit 23 converts the posture of the substrate W so as to be a right-side-up posture. The 2 nd reversing unit 29 converts the posture of the substrate W so as to be a back-up posture.
The passage portions 25 and 27 are used to transfer the substrate W between the carrier block 5 and the processing block 7. The passage portion 25 is used, for example, to convey the substrate W from the processing block 7 to the carrier block 5. The passage portion 27 is used, for example, to convey the substrate W from the carrier block 5 to the process block 7. The conveyance directions of the substrates W in the passage portions 25 and 27 may be opposite to each other.
<4. Treatment Block >
The processing block 7 performs cleaning processing on the substrate W, for example. The washing treatment is, for example, a treatment using a brush in addition to the treatment liquid. As shown in fig. 1, the processing block 7 is divided into, for example, a 1 st row R1, a2 nd row R2, and a 3 rd row R3 in the width direction Y. Specifically, the 1 st column R1 is arranged in the left direction Y. The 2 nd column R2 is arranged at the center in the width direction Y. In other words, the 2 nd column R2 is arranged right Y of the 1 st column R1. Column 3, R3, is disposed right Y of column 2, R2.
<4-1, Column 1>
Column 1R 1 of the processing block 7 includes a plurality of processing units 31. Column 1R 1 includes, for example, 4 processing units 31. Column 1R 1 stacks 4 processing units 31 in the vertical direction Z. Details of the respective processing units 31 will be described later. Each processing unit 31 is, for example, a washing unit. The cleaning unit performs a cleaning process on the substrate W. The cleaning means includes a front surface cleaning means for cleaning the front surface of the substrate W and a rear surface cleaning means for cleaning the rear surface of the substrate W. In the present embodiment, the back surface cleaning unit SSR is taken as an example of the processing unit 31.
<4-2, Column 2>
Column 2R 2 of the processing block 7 is provided with a central robot CR. The center robot CR is configured to be rotatable about the vertical direction Z. The center robot CR is configured to be capable of ascending and descending in the vertical direction Z. The center robot CR includes, for example, a1 st hand 33 and a2 nd hand 35. The 1 st hand 33 and the 2 nd hand 35 each hold 1 substrate W. The 1 st hand 33 and the 2 nd hand 35 are independently configured to advance and retract in the front-rear direction X and the width direction Y.
<4-3, Column 3 >
Column 3R 3 of the processing block 7 has the same structure as column 1R 1. That is, the 3 rd column R3 includes a plurality of processing units 31. Column 3R 3 includes, for example, 4 processing units 31. The 3 rd row R3 stacks 4 processing units 31 in the vertical direction Z. The processing units 31 in the 1 st row R1 and the processing units 31 in the 3 rd row R3 are arranged to face each other in the width direction Y. Thus, the center robot CR can access each of the processing units 31 facing the 1 st row R1 and the 3 rd row R3 at the same height in the vertical direction Z.
The processing block 7 is constructed as described above. Here, an example of the operation of the center robot CR will be briefly described. The center robot CR receives the substrate W from, for example, the 1 st reversing unit 23. The center robot CR conveys the substrate W to any one of the back surface cleaning units SSR in the 1 st row R1 and the 3 rd row R3, and performs cleaning processing on the back surface of the substrate W. The center robot CR receives the substrate W after the cleaning process in any one of the back surface cleaning units SSR in the 1 st row R1 and the 3 rd row R. The center robot CR conveys the substrate W to the 2 nd reversing unit 29.
<4-4. Treatment Unit >
Here, the back surface cleaning unit SSR (processing unit 31) will be described with reference to fig. 3 to 5. Fig. 3 is a plan view schematically showing the structure of the back surface cleaning unit according to the embodiment. Fig. 4 is a side view showing a schematic configuration of the back surface washing unit. Fig. 5 is a longitudinal sectional view of the washing arm.
Here, the back surface cleaning unit SSR provided in the 1 st column R1 will be described as an example. The back surface cleaning units SSR in the 3 rd column R3 are arranged in the width direction Y instead.
The back surface cleaning unit SSR includes a rotation holding portion 37, a guard 39, a1 st treatment liquid arm 41, a2 nd treatment liquid arm 43, a cleaning arm 45, and a standby tank 47.
<4-4-1. Rotation holding portion >
The rotation holding portion 37 is disposed in the almost center of the back surface washing unit SSR in a plan view. The rotation holding unit 37 rotates the substrate W in a horizontal plane while holding the substrate W in a horizontal posture. The rotation holding portion 37 includes a motor 49, a rotation shaft 51, a rotation chuck 53, and support pins 55.
The motor 49 is disposed with the rotation shaft 51 oriented in the vertical direction Z. A spin chuck 53 is mounted on an upper end of the rotation shaft 51. The spin chuck 53 has a diameter slightly larger than the diameter of the substrate W. The spin chuck 53 is a circular plate-like member. The spin chuck 53 is provided with a plurality of support pins 55. In the embodiment, for example, 6 support pins 55 are provided. The 6 support pins 55 are abutted against the outer peripheral edge of the substrate W and support the substrate W in a horizontal posture. The number of the support pins 55 is not limited to 6 as long as the plurality of support pins 55 can stably support the substrate W in a horizontal posture. The 6 support pins 55 stand near the outer periphery of the substrate W in the spin chuck 53. The 6 support pins 55 release the peripheral edge of the substrate W when the substrate W is carried into the spin chuck 53 and when the substrate W is carried out of the spin chuck 53. Therefore, each support pin 55 is rotatable about the vertical direction Z. A specific configuration for performing the above-described operation will be omitted. The rotation holding portion 37 rotates the spin chuck 53 around the rotation center P1 when the motor 49 is rotated. The rotation center P1 is the vertical direction Z.
<4-4-2. Guard >
The guard 39 is disposed so as to surround the rotation holding portion 37 in a plan view. Specifically, the protector 39 includes a cylindrical body portion 57 and an inclined portion 59. The guard 39 is configured to be vertically movable in the vertical direction Z. The guard 39 can be lifted to a standby position where it is lowered and a processing position above the standby position. A specific configuration of lifting and lowering the guard 39 will be omitted.
The main body 57 of the protector 39 has a cylindrical shape. The inner peripheral surface of the main body 57 is disposed to be spaced outward from the outer peripheral side of the rotation holding portion 37. The inclined portion 59 is narrowed from the upper portion of the main body portion 57 toward the rotary shaft 51. The inclined portion 59 has an opening 61 at an upper portion. The opening 61 is formed in the center of the inclined portion 59. The opening 61 is larger than the diameter of the substrate W. The opening 61 is larger than the diameter of the spin chuck 53. When the substrate W is carried in and out, the guard 39 is lowered in the vertical direction Z to a position where the spin chuck 53 protrudes upward from the opening 61. During the cleaning process of the substrate W, the inclined portion 59 of the guard 39 is located near the height of the substrate W held by the spin chuck 53. The inclined portion 59 guides the processing liquid or the like scattered from the substrate W to the surroundings to the lower side of the guard 39 with the inclined inner peripheral surface.
<4-4-3. 1 St treatment fluid arm >
The 1 st treatment liquid arm 41 is disposed behind the rotation holding portion 37 in a plan view. The 1 st processing arm 41 includes a motor 42 on the base end side. The 1 st treatment liquid arm 41 is swung around the rotation center P2 on the base end portion side by the motor 42. The rotation center P2 is the vertical direction Z. The 1 st treatment liquid arm 41 includes 1 nozzle 63. The nozzle 63 has a discharge port below. The nozzle 63 ejects the processing liquid. The 1 st treatment liquid arm 41 is configured to swing the tip end portion of the nozzle 63 across the standby position shown in fig. 3 and the supply position near the rotation center P1. The 1 st processing liquid arm 41 moves the tip portion of the nozzle 63 to the supply position when the processing liquid is supplied to the substrate W. The 1 st processing liquid arm 41 moves the tip portion of the nozzle 63 to the standby position without supplying the processing liquid to the substrate W. The 1 st processing liquid arm 41 may swing and move the nozzle 63 above the substrate W so as not to interfere with the cleaning arm 45 when the processing liquid is supplied to the substrate W.
As the treatment liquid discharged from the nozzle 63, for example, a cleaning liquid is cited. Examples of the cleaning liquid include pure water, carbonated water, electrolytic ion water, hydrogen water, and ozone water.
<4-4-4. 2 Nd treatment fluid arm >
The 2 nd treatment liquid arm 43 is disposed on the left side Y of the rotation holding portion 37 in a plan view. The 2 nd treatment liquid arm 41 includes a motor 44 on the base end side. The 2 nd treatment liquid arm swings around the rotation center P3 on the base end portion side by the motor 44. The rotation center P3 is the vertical direction Z. The 2 nd treatment liquid arm 43 includes 3 nozzles 65, 67, 69. The nozzles 65, 67, 69 each have a discharge port below. The nozzles 65, 67, 69 discharge the treatment liquid. The 2 nd treatment liquid arm 43 is configured to swing the tip ends of the nozzles 65, 67, 69 across the standby position shown in fig. 3 and the supply position near the rotation center P1. The 2 nd processing liquid arm 43 moves the tip ends of the nozzles 65, 67, 69 to the supply position when the processing liquid is supplied to the substrate W. The 2 nd processing liquid arm 43 moves the tip portions of the nozzles 65, 67, 69 to the standby position without supplying the processing liquid to the substrate W. The 2 nd processing liquid arm 43 may swing and move the nozzles 65, 67, 69 above the substrate W so as not to interfere with the cleaning arm 45 when the processing liquid is supplied to the substrate W.
Examples of the treatment liquid discharged from the nozzles 65, 67, and 69 include chemical liquids. Examples of the chemical solution include chemical solutions containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, and aqueous hydrogen peroxide. As a more specific chemical solution, for example, a mixed solution of aqueous ammonia and aqueous hydrogen peroxide, that is, SC-1 or the like can be used.
<4-4-5. Washing arm >
The washing arm 45 is configured as follows.
The washing arm 45 includes a rotation lifting mechanism 71, a support 73, a housing 75, and a washing unit 77.
The rotation lifting mechanism 71 is configured to be capable of lifting and lowering the support 73, the housing 75, and the cleaning section 77 in the vertical direction Z. The rotation elevating mechanism 71 is configured to be capable of swinging the support 73, the housing 75, and the washing unit 77 about the rotation center P4. Specifically, the rotation lifting mechanism 71 is configured by combining a motor and a cylinder, for example. The rotation and lifting mechanism 71 lifts the cleaning unit 77 from the standby tank 47 in the vertical direction Z at the standby position. The rotation lifting mechanism 71 swings (moves) the cleaning unit 77 in the horizontal plane so that the cleaning unit 77 passes near the rotation center P1.
The pillar 73 has a cylindrical shape. The lower portion of the stay 73 is coupled to the rotation elevating mechanism 71. The upper portion of the stay 73 is coupled to a lower portion of the housing 75. The housing 75 has a long axis in a horizontal plane. The housing 75 includes a cleaning portion 77 at the other lower portion. The washing section 77 rotates around the rotation center P5. The rotation center P5 is the vertical direction Z.
The housing 75 includes a lower housing 75a and an upper housing 75b. The lower housing 75a constitutes a lower portion of the housing 75. The upper housing 75b constitutes an upper portion of the housing 75. The upper case 75b and the lower case 75a are coupled to each other.
The housing 75 includes a pressing mechanism 81 and a rotating mechanism 83. Specifically, the lower housing 75a is mounted with a pressing mechanism 81 and a rotating mechanism 83.
The pressing mechanism 81 includes a fulcrum member 85, a seesaw member 87, a pressing actuator 89, and a support mechanism 91.
The fulcrum member 85 is mounted on the upper surface of the lower housing 75 a. The fulcrum member 85 stands on an almost central portion of the lower housing 75a in the front-rear direction X. The fulcrum member 85 includes a swing shaft 85a at an upper portion. The swing shaft 85a is rotatable about the width direction Y. The center portion 87c of the seesaw member 87 is swingably attached to the fulcrum member 85 via a swing shaft 85a. Both ends of one side 87l (action point portion) and the other side 87r (force point portion) of the seesaw member 87 can be alternately lifted and lowered in the vertical direction Z. The seesaw member 87 is supported by the pivot shaft 85a.
The operation piece 89a of the pressing actuator 89 is disposed in the vertical direction Z. The pushing actuator 89 extends the actuation shaft 89a to raise the one side 87l of the seesaw member 87. The pushing actuator 89 is preferably an air bearing actuator, for example.
The actuation shaft 89a of the air bearing actuator is supported so as to be capable of advancing and retreating in a minute gap by air. Therefore, theoretically, the sliding resistance of the actuation shaft 89a is zero without friction. Therefore, the air bearing actuator can advance and retreat the actuation shaft 89a even with a small air pressure as compared with a normal cylinder. Therefore, the device can linearly advance and retreat according to the air pressure. However, a normal cylinder may be used as the pressing actuator 89.
In the front-rear direction X, a support mechanism 91 is provided on the opposite side of the pressing actuator 89 across the fulcrum member 85. The supporting mechanism 91 supports the washing section 77. The supporting mechanism 91 suspends and supports the washing section 77 below the housing 75.
The support mechanism 91 includes a holding member 93, a pushing portion 95, and a guide portion 97.
The supporting mechanism 91 suspends and supports the washing section 77. The cleaning section 77 includes a brush 99 and a brush holder 101. The brush 99 is applied to the substrate W to perform cleaning. The brush holder 101 holds the brush 99. The brush holder 101 removably holds the brush 99. A rotary shaft 103 is attached to a center portion of the brush holder 101 in a plan view. The rotary shaft 103 extends from the brush holder 101 in the vertical direction Z. The brush 99 is held by the cleaning arm 45 and moves in a horizontal plane so as to pass near the rotation center P1 of the substrate W.
The holding member 93 rotatably holds the rotation shaft 103. The rotation shaft 103 is constituted by a spline shaft, for example. The rotation shaft 103 is mounted to the holding member 93 via a spline nut 103a. The rotation shaft 103 is movable in the vertical direction Z with respect to the spline nut 103a. The holding member 93 holds the spline nut 103a in a rotatable state about the vertical direction Z. The spline nut 103a is attached to the holding member 93 via a bearing, not shown. The rotation shaft 103 is rotatable about a rotation center P5. A pulley 105 is attached to a spline nut 103a protruding toward the upper portion of the holding member 93. The pulley 105 is fixed to the outer peripheral surface of the spline nut 103a. When the pulley 105 rotates, the spline nut 103a rotates, and at the same time, the rotation shaft 103 also rotates in the same direction.
A spring 95 is disposed above the pulley 105. The spring 95 includes an upper holding portion 107, a lower holding portion 109, and a coil spring 111. The upper holding portion 107 is mounted on the upper side of the rotation shaft 103 via a bearing (not shown). In other words, the upper holding portion 107 remains stationary even if the rotation shaft 103 rotates. The lower holding portion 109 is disposed apart from the upper holding portion 107. The lower holding portion 109 is disposed below the upper holding portion 107, and is an upper portion of the pulley 105. The inner peripheral surface of the lower holding portion 109 is disposed apart from the outer peripheral surface of the rotary shaft 103. Therefore, the lower holding portion 109 is kept in a stationary state even if the rotation shaft 103 rotates. The lower holding portion 109 is attached to the upper surface of the pulley 105 via a bearing. Therefore, the lower holding portion 109 is not affected by the rotation of the pulley 105.
The coil spring 111 is mounted on the upper holding portion 107 and the lower holding portion 109. The upper end of the coil spring 111 is fixed to the upper holding portion 107. The lower end of the coil spring 111 is fixed to the lower holding portion 109. The coil spring 111 has a cylindrical shape, for example. The coil spring 111 is a compression coil spring. Therefore, the upper holding portion 107 is pushed upward from the upper surface of the pulley 105 and the lower holding portion 109. As a result, the rotation shaft 103 is pushed upward in the vertical direction Z. Therefore, in a normal state in which the pushing actuator 89 is not activated, the brush 99 is maintained at a fixed height from the lower surface of the lower housing 75 a. In other words, in the normal state, the load of the brush 99 is zero.
The support mechanism 91 supports a rotation shaft 103 that moves up and down in the vertical direction Z. The support mechanism 91 includes a linear guide 113 and a shaft holding portion 115. The linear guide 113 is disposed adjacent to the holding member 93. The linear guide 113 stands in the vertical direction Z. The linear guide 113 includes a guide 113a and a carriage 113b. The guide rail 113a is disposed in the longitudinal direction Z. The guide rail 113a is mounted such that the carriage 113b can move in the vertical direction Z. The carriage 113b is disposed below the other side 87r of the seesaw member 87. The carriage 113b is disposed at a position where it contacts when the other side 87r of the seesaw member 87 is lowered.
The shaft holding portion 115 holds an upper portion of the rotation shaft 103. The shaft holding portion 115 is held in a state allowing the rotation shaft 103 to rotate. The shaft holding portion 115 holds the rotation shaft 103 via a bearing, for example, not shown. The carriage 113b is coupled to the shaft holding portion 115. When the pushing actuator 89 lifts the actuation shaft 89a with a driving force stronger than the urging force of the coil spring 111, one side 87l (the acting point portion) is lifted. When one side 87l is raised, the other side 87r (force point portion) is lowered. At this time, the other side 87r lowers the carriage 113b together with the shaft holding portion 115. Then, the rotation shaft 103 is lowered, and the brush 99 is moved downward from the predetermined position. When the pushing actuator 89 is thus driven, a pushing force corresponding to the driving force of the pushing actuator 89 is applied to the brush 99.
The rotation mechanism 83 is disposed adjacent to the support mechanism 91. The rotation mechanism 83 is disposed on the fulcrum member 85 side. The rotation mechanism 83 includes a mounting member 117 and a motor 119. The mounting member 117 is disposed so as to be spaced upward from the bottom surface of the lower case 75 a. The rotation shaft of the motor 119 is disposed downward in the vertical direction Z. The motor 119 rotates the rotation shaft around the rotation center P6. The rotation center P6 is almost parallel to the rotation center P5 in the vertical direction Z. The motor 119 is provided with a pulley 121 on a rotation shaft. A timing belt 123 is stretched over the pulleys 121 and 105. Therefore, when the motor 119 rotates, the rotation shaft 103 rotates around the rotation center P5 via the timing belt 123, the belts 105, 121, and the spline nut 103 a. Even if the rotation shaft 103 rotates in this way, the rotation shaft 103 can be lifted and lowered in the vertical direction Z.
The washing arm 45 is constructed as described above. That is, the operation of the pushing actuator 89 is applied to the other side 87r (the action point portion) via one side 87l (the force point portion) of the seesaw member 87. Therefore, by providing the seesaw member 87, the degree of freedom in arrangement of the pressing actuator 89 can be improved. Therefore, the height of the substrate processing apparatus 1 can be suppressed. As a result, the substrate processing apparatus 1 can be easily arranged in a multi-stage lamination.
Here, the height of the brush 99 to be lifted is described.
The seesaw member 87 swings by the pushing actuator 89. For example, as will be described later, the pushing actuator 89 is operated in accordance with the target load. By this operation, the brush 99 is moved in the vertical direction Z. Specifically, the brush 99 is lifted to the following height.
(1) No load height H1: the brush 99 does not act on the height of the substrate W in the vertical direction Z. The unloaded height H1 is higher than the other heights below. At normal times other than during washing, the brush 99 is located at the unloaded height H1.
(2) Action height H2: for applying a predetermined load to the brush 99 in the vertical direction Z of the substrate W. Is a height lower than the unloaded height H1. When the substrate W is subjected to the cleaning process, the brush 99 is lowered to the working height H2. But the position is a height at which a prescribed load is applied to the brush 99 and the reaction force from the substrate W is balanced with the load.
(3) Maximum press-in height H3: a height lower than the action height H2. The brush 99 is moved to the lowest position in the vertical direction Z. The maximum pressing height H3 is a position determined by the structure of the pressing mechanism 81. The brush 99 cannot move below the maximum pressing height H3.
<4-4-6 In-plane pressure distribution detecting section >
Here, refer to fig. 4 to 6. Fig. 6 is a diagram showing a configuration of the in-plane pressure distribution detecting section.
As described above, the cleaning section 77 includes the brush 99 and the brush holder 101. The brush 99 includes a tip portion 99a whose center portion protrudes downward. The brush 99 has a downwardly convex shape. The tip portion 99a is formed to be concentric with the brush 99.
The brush 99 corresponds to the "brush body" of the present invention.
As shown in fig. 4 and 5, the cleaning section 77 includes an in-plane pressure distribution detector SPD. The brush holder 101 has an in-plane pressure distribution detector SPD on its lower surface. The brush 99 is provided with an in-plane pressure distribution detector SPD on its upper surface. An in-plane pressure detector SPD is provided between the brush holder 101 and the brush 99. Specifically, the in-plane pressure distribution detecting unit SPD is mounted on the top surface of the brush holder 101, that is, at a position facing the upper surface of the brush 99.
The in-plane pressure detector SPD detects pressure applied to the front end portion 99a (protruding portion) of the brush 99. In detail, the in-plane pressure detector SPD detects a pressure distribution applied to the lower surface of the brush 99 with respect to the pressure applied to the brush 99. The in-plane pressure detecting unit SPD detects the pressure distribution, not the load. When a target load is applied to the brush 99 by the pressing mechanism 81, the in-plane pressure detector SPD detects a pressure distribution according to a reaction force received by the front end portion 99a from the upper surface of the substrate W.
The in-plane pressure detector SPD is configured as shown in fig. 6, for example.
The in-plane pressure detector SPD includes a detection unit 301, a readout unit 303, an Analog/Digital (a/D) converter 305, and a signal line 307.
The detection unit 301 has, for example, a rectangular shape. The detection portion 301 has a size larger than a circle of a circular shape constituting a cross section of the tip portion 99a of the brush 99 and smaller than a circle of a circular shape constituting a cross section of the brush 99. The detection portion 301 has an area larger than the cross-sectional area of the distal end portion 99 a. The detection unit 301 is configured as follows, for example.
The detection unit 301 is printed with ink on a flexible film. The ink is printed in a line in the row direction and in the column direction of the film. In other words, the ink is printed in a matrix form. The ink is composed of a material containing a sensitive resistive substance. The intersection point of the row direction and the column direction of the film is a sensitive part. When pressure is applied to the intersections in the matrix direction, the resistance value of the ink changes according to the magnitude of the pressure. The pressure referred to herein is not an absolute value of pressure. The pressure as referred to herein is a value indicating the strength of the pressure. The pressure read from the detection unit 301 tends to be a pressure distribution.
The readout unit 303 is arranged in the row direction and the column direction. The readout section 303 is connected to an a/D converter 305. The a/D converter 305 sequentially reads the pressure at each intersection of the thin films via the readout unit 303 in the matrix direction. Signals corresponding to the respective pressures read out are output through the signal line 307.
The signal read out to the signal line 307 is transmitted through the vertical hole 103b of the rotary shaft 103 and the slip ring 309. A vertical hole 103b is formed in the rotation shaft 103. The longitudinal hole 103b is bored along the long axis of the rotation shaft 103. The signal line 307 is inserted into the longitudinal hole 103b. The signal line 307 is electrically connected to the washing arm 45 via a slip ring 309 provided on the outer peripheral side of the rotation shaft 103. Thereby, a signal representing the pressure distribution is transmitted from the rotating brush 99 to the stationary wash arm 45.
<4-5 Control System >
Reference is made here to fig. 7. Fig. 7 is a block diagram showing a control system of the back surface washing unit.
One end of the pipe 125 is connected to the nozzle 63. The other end of the pipe 125 is connected to a cleaning liquid supply source 127. The cleaning liquid supply source 127 supplies the cleaning liquid. The pipe 125 includes a flow control valve 129. The flow control valve 129 controls the flow rate of the cleaning liquid in the pipe 125.
One end of the pipe 131 is connected to the nozzle 65. The other end of the pipe 131 is connected to a treatment liquid supply source 133. The treatment liquid supply source 133 supplies any one of the above-described various chemical liquids. The pipe 131 includes a flow control valve 135. The flow control valve 135 controls the flow rate of the chemical liquid in the pipe 131.
One end of a pipe 137 is connected to the nozzle 67. The other end of the pipe 137 is connected to a treatment liquid supply source 139. The treatment liquid supply source 139 supplies any one of the above-described various chemical liquids. The pipe 137 is provided with a flow control valve 141. The flow control valve 141 controls the flow rate of the chemical liquid in the piping 139.
One end of the pipe 143 is connected to the nozzle 69. The other end of the pipe 143 is connected to a treatment liquid supply source 145. The treatment liquid supply source 145 supplies any one of the above-described various chemical liquids. The pipe 143 is provided with a flow control valve 147. The flow control valve 147 controls the flow rate of the chemical liquid in the pipe 143.
The pressing actuator 89 is connected to one end of an air supply tube 149. The air for supporting the actuation shaft 89a at a small gap is supplied to the pressing actuator 89, but the piping and the like are omitted. An air supply source 151 is connected to the other end of the air supply pipe 149. The air supply source 151 supplies air, for example. The air is preferably dry air. The air supply 151 is also communicatively connected to other devices. The supply pressure of the air supply source 151 is affected by the operation state of other devices. That is, when the operation rate of other devices becomes high, the supply pressure may sometimes decrease. The air supply pipe 149 includes an on-off valve 153, a primary pressure gauge 155, an electric air conditioner 157, and a secondary pressure gauge 159 in this order from the air supply source 151 side.
The on-off valve 153 allows or cuts off the flow of air in the air supply tube 149. The primary side pressure gauge 155 measures the pressure of air in the upstream side of the electric air conditioner 157. The electro-pneumatic regulator 157 adjusts the opening degree of the built-in valve according to the input signal. Thereby, the electric air conditioner 157 adjusts the pressure of the air in the air supply pipe 149. Specifically, the electric air conditioner 157 adjusts the valve opening degree based on the input signal applied to reduce the primary side pressure, and sets the primary side pressure as the secondary side pressure in the air supply pipe 149. The electric air conditioner 157 cannot adjust to a secondary side pressure higher than the primary side pressure in the air supply pipe 149. The electric air conditioner 157 adjusts the secondary side pressure to be lower than the primary side pressure of the air supply pipe 149. When the primary side pressure exceeds a predetermined value, the electric air conditioner 157 can adjust the secondary side pressure within a range equal to or lower than the predetermined value. In other words, when the primary side pressure is equal to or lower than the predetermined value, the electric air conditioner 157 may fail to accurately adjust the secondary side pressure to a fixed value or higher.
The control unit 161 controls the respective units in general. Specifically, the control unit 161 controls the conveying operation of the loading unit 9 and the unloading unit 11, the conveying operation of the transfer robot IR, the reversing operation of the 1 st reversing unit 23 and the 2 nd reversing unit 29, the conveying operation of the center robot CR, and the like. The control unit 161 operates as a control target: the rotation control of the motor 49 in the back surface cleaning unit SSR (processing unit 31), the lifting operation of the guard 39, the opening and closing operation of the support pins 55 in the spin chuck 53, the swinging operation of the motors 42, 44, the opening and closing operation of the flow control valves 129, 135, 141, 147, the swinging and lifting operation of the rotation lifting mechanism 71, the rotation operation of the motor 119, the opening and closing operation of the opening and closing valve 153, and the opening operation of the electric air conditioner 157.
The control unit 161 includes a CPU (Central Processing Unit: central processing unit) and a memory, which are not shown. The instruction unit 163 is connected to the control unit 161. The instruction section 163 is operated by an operator of the substrate processing apparatus 1. The instruction unit 163 is used for an operator to instruct a recipe for defining the processing contents of the substrate W, or to start or stop the processing. The controller 161 is connected to a notification unit 165. The notification unit 165 issues an alarm when a problem occurs in the substrate processing apparatus 1, and notifies an operator of the problem. The notification unit 165 is, for example, a display device, a lamp, a buzzer, a speaker, or the like. The notification unit 165 is preferably capable of checking the type of the problem. The control unit 161 includes an input port IP. The input port IP inputs data of various electronic devices. The data input from the input port IP is processed or stored by the control section 161.
The control unit 161 receives the signal related to the in-plane pressure of the brush 99 from the in-plane pressure detecting unit SPD. The control unit 161 calculates the area (pressure distribution) of the same pressure based on the intersection point of the same pressure and the position of the intersection point, for example, based on the signal from the in-plane pressure detecting unit SPD. The control unit 161 preferably performs only one time of checking the attachment state of the brush 99 based on the pressure distribution when the cleaning process is started for a certain substrate W, as will be described later.
The control unit 161 receives the pressure distribution in the surface at a predetermined cycle when the brush 99 is subjected to the cleaning process by applying the target load thereto. The predetermined period is much shorter than the period in which the brush 99 moves from the center portion to the peripheral portion of the substrate W. The predetermined period is, for example, several tens ms to several hundreds ms. The control section 161 that receives the pressure distribution operates the pressing mechanism 81 according to the pressure distribution, and operates the pressing mechanism 81 in order to adjust the pressing of the brush 99 according to the radial position of the substrate W.
Here, refer to fig. 8. Fig. 8 is a schematic view illustrating the state of the brush in the central portion and the peripheral portion of the warped substrate.
When the substrate W is warped, the brush 99 is different in the action state between the central portion CP and the peripheral portion PP. Here, as shown in fig. 8, for example, the peripheral edge PP of the substrate W, which is separated in the radial direction of the substrate W, is hung downward from the central portion CP of the substrate W. In other words, the peripheral portion PP of the substrate W is warped downward with respect to the central portion CP.
In the case of performing the cleaning process on such a warped substrate W, the tip portion 99a of the brush 99 acts on the upper surface of the substrate W almost entirely at the center portion CP. That is, when the target load is applied to the brush 99, the almost entire surface of the tip portion 99a receives a reaction force corresponding to the target load. In other words, the front end portion 99a is subjected to almost the same degree of pressure over its entire surface.
Here, in fig. 8, the area of the lower surface of the front end portion 99a of the brush 99 acting on the substrate W is denoted by a symbol CA (hatched area) with the same pressure area. The center portion CP is set to the same pressure area CA1. On the other hand, only a portion of the front end portion 99a of the brush 99 near the center portion CP acts on the upper surface of the substrate W in the peripheral portion PP. That is, when the target load is applied to the brush 99, only a part of the tip portion 99a receives a reaction force corresponding to the target load. In other words, only a portion of the front end portion 99a receives the same pressure. The area acting on the upper surface of the substrate W in this case is set to the same pressure area CA2. In this example, the same pressure area CA1 > the same pressure area CA2.
The same pressure area CA is an area to which almost the same pressure is applied. The same pressure as used herein refers to, for example, an average value of pressures at all the intersections of the detection unit 301 calculated by the control unit 161, and is, for example, a pressure ranging from the average value to a predetermined value (for example, ±10%).
If the same target load is applied to the brush 99 at the center portion CP and the peripheral portion PP, the load per unit area acting on the upper surface of the substrate W is different at the center portion CP and the peripheral portion PP because the same pressure area acting on the upper surface of the substrate W is different. That is, in the radial direction of the substrate W, the force of the brush 99 acting on the upper surface of the substrate W is different. Accordingly, the control section 161 operates the pressing mechanism 81 according to the pressure distribution of the brush 99, that is, the same pressure area CA, in such a manner that the force of the brush 99 acting on the upper surface of the substrate W in the radial direction of the substrate W is the same.
The control unit 161 initially maintains the brush 99 at the unloaded height H1 in the cleaning process, and positions the cleaning arm 45 at the rotation center P1 of the substrate W. Next, the control unit 161 applies a target load to the brush 99 by the pressing mechanism 81. Further, the control unit 161 lowers the brush 99 to the load height H2. At this time, the control unit 161 obtains the same pressure area based on the output of the in-plane pressure distribution detecting unit SPD. And setting the same pressure area as a reference same pressure area. The control unit 161 preferably determines that the brush 99 is not normally mounted on the brush holder 101 and issues an alarm when the reference co-pressure area is lower than a predetermined value. The predetermined value to be compared with the reference equivalent pressure area is preferably set for each brush 99. This allows the brush 99 to be accurately attached.
In addition, the back surface cleaning unit SSR (processing unit 31) corresponds to the "substrate processing apparatus" of the present invention.
<5. Pretreatment in treatment Unit >
The preprocessing in the back surface cleaning unit SSR will be described with reference to fig. 9 and 10. Fig. 9 is a flowchart showing a pre-process performed in advance. Fig. 10 (a) is a graph showing a relationship between the opening degree of the electric air conditioner and the load of the electronic balance, fig. 10 (b) is a graph showing a relationship between the secondary side pressure of the electric air conditioner and the opening degree, and fig. 10 (c) is a graph showing a relationship between the load of the pressing actuator and the secondary side pressure of the electric air conditioner.
An operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct the pretreatment to one back surface cleaning unit SSR.
Step S1
An electronic balance is configured. Specifically, an electronic balance, not shown, is disposed in the rotation holding portion 37. An electronic balance is a device that measures a load. The electronic balance is preferably provided with a data output terminal. The data output terminal of the electronic balance is connected to the input port IP. The electronic balance outputs the measured value from the data output terminal. The measured value is, for example, the load (g).
Step S2
The load was measured. Specifically, for example, the control unit 161 changes the input signal to the electric air conditioner 157 in a state where the on-off valve 153 is opened, and measures the load X (g) of the electronic balance for each input signal at this time. Further, the instruction unit 163 may instruct the operator to apply a plurality of loads (target loads X (g)) to the brush 99 during the actual processing, and may change the input signal to the electric air conditioner 157 so that the measured value of the electronic balance becomes each target load X (g), thereby obtaining an input signal corresponding to each target load X (g) at that time. At this time, the control unit 161 receives the measured value of the secondary side pressure gauge 159, that is, the secondary side pressure, for each load.
Step S3
And storing the corresponding relation of the actually measured load. The control unit 161 obtains the relationship between the opening degree (input signal) of the electric air conditioner 157 and the load of the electronic balance (target load X (g)) as shown in fig. 10 (a) and the relationship between the secondary side pressure of the electric air conditioner 157 and the opening degree as shown in fig. 10 (b) by the measurement in step S2. The control unit 161 stores the relationship between the load of the pressing actuator 89 and the secondary pressure of the electric air conditioner 157 as shown in fig. 10 (c), together with the relationship, in a memory.
Step S4
An operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct the end of the pretreatment to one back surface cleaning unit SSR. An operator of the substrate processing apparatus 1 processes the electronic balance from the rotation holding section 37. The same pretreatment is also performed on other back surface cleaning units SSR as needed.
<6. Washing treatment in treatment Unit >
Next, a cleaning process will be described with reference to fig. 11. Fig. 11 is a flowchart showing the washing process.
Step S11
The operator instructs the process to start. Specifically, a process recipe including a target load X (g) is also indicated. Then, the substrate W is transported from the carrier block 5 to the transfer section 15, and the 1 st reversing unit 23 converts the posture to the back face upward.
Step S12
The substrate W with the back surface facing upward is carried to one back surface cleaning unit SSR by the center robot CR. The back surface cleaning unit SSR starts the cleaning process.
Step S13
The control unit 161 moves the brush 99. Specifically, the control section 161 first moves the cleaning arm 45 above the rotation center P1 of the substrate W. The control unit 161 applies a pressing force to the brush 99. Specifically, the control unit 161 refers to the relationship (fig. 10 (c)) acquired in advance, and adjusts the input signal to the electric air conditioner 157 so that the secondary side pressure of the secondary side pressure gauge 159 becomes the secondary side pressure Z (Pa) corresponding to the target load X (g). Thereby, air is supplied from the electric air conditioner 157 to the pushing actuator 89, and a load is applied from the brush 99 to the substrate W with a target load X (g). In other words, the control portion 161 moves the brush 99 from the unloaded height H1 to the active height H2.
Step S14
And obtaining a reference same-pressure area. Specifically, the control unit 161 calculates the reference co-pressure area as described above based on the signal from the in-plane pressure distribution detecting unit SPD.
Step S15
And judging whether the reference same-pressure area is smaller than a specified value. Specifically, the control unit 161 compares the reference common pressure area obtained in step S14 with a predetermined value. And branching the processing according to the result. If the reference area is equal to or larger than the predetermined value, the routine proceeds to step S16. If the reference area is smaller than the prescribed value, the process branches to step S21.
Here, the reference common pressure area is first set to a predetermined value or more, and will be described below.
Step S16
The control unit 161 operates the rotation lifting mechanism 71 to move the washing arm 45. Specifically, the control unit 161 operates the rotation driving mechanism 71 to move the cleaning arm 45 of the substrate W so that the brush 99 is reversed between the rotation center P1 and the end surface of the substrate W. At this time, the 1 st processing liquid arm 41 moves, and pure water is supplied to the entire surface of the substrate W at a position where the arm 45 does not interfere with the cleaning arm. Thereby, the brush 99 acts on the back surface of the substrate W to perform the cleaning process.
Step S17
The control unit 161 obtains the same pressure area. Specifically, as described above, the control unit 161 obtains the same pressure area of the brush 99 based on the signal from the in-plane pressure distribution detecting unit SPD. The same pressure area is performed every time the washing arm 45 moves by a predetermined angle. In other words, the calculation of the same pressure area is performed every time the brush 99 moves a predetermined distance in the radial direction of the substrate W. The calculation of the same pressure area is performed at a predetermined cycle while the brush 99 is positioned at the working height H2 and the washing arm 45 is moving.
Step S18
The control unit 161 adjusts the pressing force. Specifically, the control unit 161 adjusts the pressing force according to the ratio of the reference same-pressure area to the same-pressure area. More specifically, the pressing force is adjusted so as to be smaller in accordance with the ratio of the same pressure area to the smaller pressure area. Thus, the load per unit area acting on the substrate W is the same in the radial direction of the substrate W.
Step S19
The process is branched according to whether or not the scanning of the washing arm 45 reaches a prescribed number of times. When the scanning has reached the predetermined number of times, the control unit 161 branches the process to step S20. On the other hand, when the scanning has not reached the predetermined number of times, the process branches to step S16. That is, the scanning of the wash arm 45 is continued.
Step S20
To the processing of the next substrate W. The control unit 161 performs a cleaning process on the next substrate W carried in by the center robot CR. That is, the process returns to the step S12.
Here, in the step S15, a case where the reference common pressure area is smaller than the predetermined value will be described. In this case, the process branches to step S21.
Step S21
The control unit 161 issues an alarm. When the reference equivalent pressure area is smaller than the predetermined value, the brush 99 may not be properly mounted on the brush holder 101. Accordingly, the control unit 161 operates the notification unit 165 to issue an alarm. An operator of the substrate processing apparatus 1 can judge that there is a problem in the installation of the brush 99 by an alarm. The operator temporarily stops the device, for example, and confirms the mounted state of the brush 99. This prevents the substrate W from being continuously processed in an improper state of attachment of the brush 99.
In addition, the step S14 corresponds to the "pressure distribution detection process" of the present invention. The step S18 corresponds to the "pushing adjustment process" of the present invention.
According to the present embodiment, the control section 161 controls the pressing force by the pressing mechanism 81 according to the position of the brush 99 in the radial direction of the substrate W based on the pressure distribution of the in-plane pressure distribution detecting section SPD. Thus, even if the brush 99 unevenly acts according to the position of the brush 99 in the radial direction of the substrate W, the force exerted by the brush 99 as seen from the upper surface of the substrate W can be made almost uniform regardless of the position of the brush 99. Therefore, uniformity of the in-plane cleanliness of the substrate W can be improved.
The present invention is not limited to the above-described embodiments, and can be variously embodied as follows.
(1) In the embodiment, as the substrate processing apparatus, the back surface cleaning unit SSR has been described as an example. However, the present invention is not limited to the back surface washing unit SSR. For example, the present invention can also be applied to a front surface cleaning unit that cleans the front surface of a substrate with a brush 99.
(2) In the above embodiment, the description has been given taking, as an example, a configuration in which the back surface cleaning unit SSR (processing unit 31) as a substrate processing apparatus is provided in the substrate processing apparatus 1 provided with the carry-in/out block 3, the transfer block 5, and the like. However, the present invention is not limited to this configuration. For example, it may be constituted by only the back surface cleaning unit SSR (processing unit 31).
(3) In the illustrated embodiment, the wash arm 45 is not provided with a mechanism to detect the load applied to the brush 99. However, the present invention is not limited to this configuration. For example, the force applied to the carriage 113b may be detected by a load cell, and the degree of coincidence with the target load may be detected.
(4) In the above-described embodiment, the in-plane pressure distribution detecting unit SPD has been described by taking a configuration as an example as shown in fig. 6. However, the in-plane pressure distribution detecting unit SPD is not limited to this configuration. That is, the brush 99 may be of any configuration as long as the pressure distribution in the surface of the substrate W can be detected.
For example, a film which changes color or develops a pattern according to pressure is interposed between the brush 99 and the brush holder 101, and the brush holder 101 is made of a transparent material. The camera may capture the degree of discoloration from the lower surface of the washing arm 45 located above the brush holder 101 and detect the pressure distribution according to the degree.
(5) In the above embodiment, the brush 99 has been described as an example of a brush having a tip portion 99a thinner than the diameter of the brush 99 and having a convex shape downward. However, the present invention is not limited to this shape. For example, the brush 99 may have a shape protruding downward with the original diameter.
(6) In the embodiment, the same-pressure area is obtained based on the output of the in-plane pressure detecting section SPD. Then, the pressing force is adjusted according to the ratio of the same pressure area. However, the present invention may adjust the pressing force without determining the same pressure area. For example, the pressing force may be adjusted by a ratio of the number of intersecting points of the in-plane pressure detector SPD, which are equal in pressure.
(7) In the embodiment, the pressing force to the brush 99 is reduced according to the degree of reduction in the same-pressure area with reference to the reference same-pressure area when the brush 99 is positioned at the center of the substrate W. However, the present invention is not limited to this method. For example, a predetermined reference equivalent pressure area may be used as the reference. This can omit the process of obtaining the reference equivalent pressure area, and can reduce the load of the control unit 161.
(8) In the above embodiment, the process of determining that the brush 99 is not normally mounted on the brush holder 101 is included when the reference equivalent pressure area is lower than the predetermined value. However, the present invention does not necessarily require the process. The load of the control section 161 can be reduced by omitting the processing.
(9) In the embodiment, as a configuration for extracting a signal from the in-plane pressure distribution detecting section SPD via the signal line 307, the slip ring 309 is adopted. However, the present invention is not necessarily of such a constitution.
(10) In the embodiment, only the pressing is adjusted according to the ratio of the same pressure area, but the present invention is not limited to such adjustment. For example, any one of the motor 49 for controlling the rotation speed of the substrate W, the motor 119 for controlling the rotation speed of the brush 99, and the rotation elevating mechanism 71 for controlling the movement speed of the cleaning arm 45 may be further adjusted. This can further suppress unevenness in the cleaning degree which cannot be completely adjusted by adjusting the pressing force.
For example, the rotation speed of the brush 99 is adjusted when the brush moves from the center portion to the peripheral portion with respect to the substrate W. For example, the movement speed of the cleaning arm 45 is made different between the center portion and the peripheral portion of the substrate W. For example, the brush 99 is configured such that the rotation speed is different between the center portion and the peripheral portion.
(11) In the above embodiment, the description has been given taking, as an example, the substrate W warped with the peripheral portion hanging downward with respect to the central portion. However, the present invention is not limited to such a substrate W. That is, the opposite can be applied to a substrate W whose peripheral edge portion is warped upward with respect to the central portion.
(12) In the above embodiment, the brush 99 is moved by swinging the washing arm by the rotation lifting mechanism 71 mounted on the washing arm 45. However, the present invention is not limited to this configuration, and the brush 99 held by the washing arm 45 may be linearly moved by linearly driving the washing arm 45 using a linear motion mechanism such as a ball screw or a linear guide.
[ Description of the symbols ]
1. Substrate processing apparatus
3. Carrying in and carrying out block
5. Load transfer block
7. Processing block
W substrate
C carrier
IR load transfer robot
15 Interface
231 St inversion unit
25,27 Passage portions
29 Nd reversing unit
31 Processing unit
SSR back surface cleaning unit
CR center robot
37 Rotation holding part
39 Guard
41 St treatment liquid arm
42 Motor
43 Nd treatment liquid arm
45-Degree cleaning arm
47 Standby slot
53 Spin chuck
71 Rotary lifting mechanism
75 Shell
77 Cleaning part
81 Pushing mechanism
83 Rotation mechanism
85 Fulcrum component
87 Seesaw component
87C central portion
87L side
87R another side
89 Pushing actuator
91 Supporting mechanism
93 Holding member
95 Spring pushing part
97 Guide part
99 Brush
99A front end part
101. Brush holder
103. Rotary shaft
111. Spiral spring
113. Linear guide rail
H1 no load height
Height of H2 action
H3 maximum press-in height
149. Air supply pipe
151. Air supply source
155. Primary side pressure gauge
157. Electric air conditioner
159. Secondary side pressure gauge
161. Control unit
163. Indication part
165. Informing part
SPD in-plane pressure distribution detecting section
301. Detection unit
303. Reading part
305A/D converter
307 Signal line
CP center portion
PP peripheral edge
CA, CA1, CA2 area of equal pressure.
Claims (7)
1. A brush for cleaning a substrate, characterized by comprising:
a brush body acting on the substrate;
a brush seat for mounting the brush body; and
An in-plane pressure distribution detecting unit which is disposed between the brush body and the brush holder, detects a pressure applied to the brush body, and detects a pressure distribution in a plane of the brush body acting on a substrate.
2. A substrate processing apparatus for performing a cleaning process by applying a brush to a substrate, comprising:
A rotation holding unit that holds the substrate in a horizontal posture and rotates the substrate;
A brush which acts on the upper surface of the substrate held by the rotation holding part, and which is provided with a brush body acting on the substrate and a brush holder to which the brush body is attached;
a cleaning arm having the brush at a distal end portion thereof, the cleaning arm being configured to move the brush in a radial direction of the substrate between a rotation center and a peripheral edge portion of the substrate held by the rotation holding portion;
A pushing mechanism for pushing the brush toward the substrate with a pushing force;
An in-plane pressure distribution detecting unit which is disposed between the brush body and the brush holder, detects a pressure applied to the brush body, and detects an in-plane pressure distribution of the brush body acting on a substrate; and
And a control unit configured to control the pressing force by the pressing mechanism so as to adjust the pressing force in accordance with the position of the brush in the radial direction of the substrate based on the pressure distribution.
3. The substrate processing apparatus according to claim 2, wherein
The control section adjusts the pressing force in such a manner that a load per unit area applied to the substrate by the brush is fixed in a radial direction of the substrate.
4. The substrate processing apparatus according to claim 2, wherein
The control unit sets an area of the pressure distribution, which is substantially the same pressure, as a same pressure area, sets the same pressure area when the brush is positioned at the center of the substrate as a reference same pressure area, and operates the pressing mechanism to reduce the pressing force to the brush according to the degree of reduction of the same pressure area when the same pressure area is reduced compared to the reference same pressure area.
5. The substrate processing apparatus according to claim 4, wherein
And the control part judges that the brush body is not normally mounted on the brush seat when the reference co-pressure area is lower than a specified value.
6. The substrate processing apparatus according to any one of claims 2 to 5, wherein
The control unit further adjusts at least one of a rotation speed of the substrate of the rotation holding unit, a rotation speed of the brush, and a movement speed of the washing arm.
7. A method for controlling the pushing force of a brush comprises a brush having a brush body acting on a substrate and a brush holder to which the brush body is attached, and a cleaning arm having the brush at a front end portion and being movable at a base end portion, wherein the brush is pushed to move between a center and a peripheral portion of the substrate to clean the substrate; and is characterized by implementing the following process:
a pressure distribution detecting process of detecting a pressure distribution in a surface of the brush body acting on a substrate; and
And a pushing force adjustment process of adjusting the pushing force according to the position of the brush in the radial direction of the substrate based on the pressure distribution.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022172630A JP2024064209A (en) | 2022-10-27 | 2022-10-27 | Brush, substrate processing apparatus equipped with same, and brush pressure control method |
| JP2022-172630 | 2022-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117960636A true CN117960636A (en) | 2024-05-03 |
Family
ID=90844701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311380217.5A Pending CN117960636A (en) | 2022-10-27 | 2023-10-24 | Brush, substrate processing device provided with brush, and method for controlling pushing force of brush |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2024064209A (en) |
| KR (1) | KR20240059566A (en) |
| CN (1) | CN117960636A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5009253B2 (en) | 2008-08-07 | 2012-08-22 | 東京エレクトロン株式会社 | Substrate cleaning device |
-
2022
- 2022-10-27 JP JP2022172630A patent/JP2024064209A/en active Pending
-
2023
- 2023-10-24 CN CN202311380217.5A patent/CN117960636A/en active Pending
- 2023-10-25 KR KR1020230143608A patent/KR20240059566A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240059566A (en) | 2024-05-07 |
| JP2024064209A (en) | 2024-05-14 |
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