CN117954360A - Ball filling device - Google Patents
Ball filling device Download PDFInfo
- Publication number
- CN117954360A CN117954360A CN202410353807.7A CN202410353807A CN117954360A CN 117954360 A CN117954360 A CN 117954360A CN 202410353807 A CN202410353807 A CN 202410353807A CN 117954360 A CN117954360 A CN 117954360A
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- China
- Prior art keywords
- ball
- planting
- head
- sweeping
- air outlet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 56
- 238000010408 sweeping Methods 0.000 claims abstract description 53
- 230000000903 blocking effect Effects 0.000 claims description 35
- 238000005452 bending Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 14
- 230000008093 supporting effect Effects 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 238000013519 translation Methods 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 239000007943 implant Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims 2
- 238000005520 cutting process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 8
- 238000002513 implantation Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
- Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Prostheses (AREA)
Abstract
The invention relates to the technical field of ball planting, and discloses a ball filling device, which comprises: the device comprises a ball planting head, a ball mounting head and a ball mounting head, wherein a ball supplying flow channel for a solder ball to enter is arranged, the ball planting flow channel penetrates from the top of the ball planting head to the bottom surface of the ball planting head, M antistatic ball sweeping ropes are arranged at the bottom of the ball planting head and at least partially protrude out of the bottom surface of the ball planting head, and the M antistatic ball sweeping ropes are arranged around an outlet array of the ball supplying flow channel; m is a positive integer greater than 2; the ball planting cylinder is provided with a ball planting head which is rotatably arranged in the ball planting cylinder; n curved air outlet channels are arranged at the bottom of the ball planting cylinder in a circumferential array around the central line of the ball planting head, and air outlets of the curved air outlet channels face the anti-static ball sweeping rope; the gas sprayed out of the N curved air outlet channels forms a rotary air flow in the ball planting head so as to blow the solder balls to the antistatic ball sweeping ropes; n is a positive integer greater than 3. The ball filling device can further reduce the possibility of cutting the ball and improve the quality of planting the ball.
Description
Technical Field
The invention relates to the technical field of ball planting, in particular to a ball filling device.
Background
In the current ball planting technical field, a ball filling device is generally adopted to fill solder balls on a workpiece, a filling mask is generally arranged at the top of the workpiece, and the solder balls on the ball filling device fall into a set position through ball planting holes on the filling mask, so that the solder balls are distributed at proper positions of the workpiece.
The ball filling device comprises a ball planting head which forms a frame-shaped structure, the solder balls are piled in the frame-shaped structure, and the frame-shaped structure is driven by the translation device to translate along the top surface of the filling mask, so that the solder balls can fall into a setting area of a workpiece, which is coated with solder paste, along the ball planting hole of the filling mask.
The prior art has the following technical problems that in the process of translating the ball planting head to push the solder ball to move, the ball cutting condition is easy to generate, part of the solder ball is extruded to deform, and the ball planting holes on the filling mask can be blocked after the solder ball is deformed, so that the ball planting defect is caused.
In view of this, there is a need to design a ball filling device to further reduce the possibility of cutting the ball and to improve the quality of the ball placement.
Disclosure of Invention
The invention aims to provide a ball filling device which is used for further reducing the possibility of cutting balls and improving the quality of ball planting.
To achieve the purpose, the invention adopts the following technical scheme:
A ball filling device, comprising:
the device comprises a ball planting head, a ball collecting device and a ball collecting device, wherein a ball supplying flow channel for a tin ball to enter is arranged on the ball planting head, the ball planting flow channel penetrates from the top of the ball planting head to the bottom surface of the ball planting head, M antistatic ball sweeping ropes are arranged at the bottom of the ball planting head, at least part of the antistatic ball sweeping ropes protrude out of the bottom surface of the ball planting head, and the M antistatic ball sweeping ropes are arranged around an outlet array of the ball supplying flow channel; m is a positive integer greater than 2;
the ball planting barrel is provided with a ball planting head, and the ball planting head is rotatably arranged in the ball planting barrel; n bending air outlet flow channels are arranged at the bottom of the ball planting cylinder in an array mode around the central line of the ball planting head, and air outlets of the bending air outlet flow channels face the anti-static ball sweeping ropes; the N gases sprayed out of the curved air outlet channels form a rotary air flow in the ball planting head so as to blow the tin ball to the antistatic ball sweeping rope; n is a positive integer greater than 3.
Optionally, the ball planting barrel comprises an air outlet barrel assembly;
The air outlet cylinder assembly comprises a ball planting pressure plate and a ball planting air flow plate, and the ball planting air flow plate is arranged on the ball planting pressure plate to form the bending air outlet channel;
The bottom of the ball planting pressure plate forms a first annular ball blocking part, the bottom of the ball planting air flow plate forms a second annular ball blocking part, the first annular ball blocking part is positioned at one side of the top of the first annular ball blocking part, and the air outlet is positioned between the first annular ball blocking part and the second annular ball blocking part;
The bottom surface of the first annular blocking ball part is lower than the bottom surface of the second annular blocking ball part, and the bottom surface of the second annular blocking ball part is higher than the sphere center of the tin ball on the filling mask.
Optionally, the inner wall surface of the second annular ball blocking part, which is close to the ball planting head, is an arc inner concave surface, and the arc inner concave surface extends to intersect with the bottom surface of the second annular ball blocking part.
Optionally, the ball planting barrel further comprises a supporting barrel;
The air outlet cylinder assembly is connected with the bottom of the supporting cylinder, the supporting cylinder is rotatably connected with the bulb planting head, and the center line of the inner hole of the air outlet cylinder assembly is overlapped with the center line of the supporting cylinder;
The support cylinder is provided with a plurality of vertical air inlet holes around the circumference array of the bulb, one air inlet hole is at least communicated with one bending air outlet flow passage, and the number of the bending air outlet flow passages communicated with each air inlet hole is equal.
Optionally, the ball filling device further comprises a rotating device, wherein the rotating device is used for driving the ball planting head to rotate on the ball planting cylinder;
The anti-static ball sweeping rope comprises a first end and a second end which are opposite, and the position of the first end connected with the ball planting head is closer to the outlet than the position of the second end connected with the ball planting head; the line connecting the first end and the second end does not pass through the center of the outlet; an inclined horn-shaped opening is formed between two adjacent anti-static ball sweeping ropes, and the closer the inclined horn-shaped opening is to the inner wall of the ball planting barrel, the larger the inclined horn-shaped opening is;
The rotating direction of the planting ball head is opposite to the flow direction of the rotating air flow, and under the air flow blowing of the bent air outlet flow channel, the tin ball is blown to the inclined horn-shaped opening.
Optionally, the ball filling device further comprises a translation device, and the translation device is used for driving the ball planting cylinder and the ball planting head to move in the horizontal direction.
Optionally, the anti-static ball sweeping rope is suspended on the bottom surface of the ball planting head in an arc shape.
Optionally, the rotating device comprises a servo motor and a driving belt assembly, and the servo motor drives the ball planting head to rotate through the driving belt assembly.
Optionally, the ball filling device further comprises a ball supply funnel installed at one side of the top of the ball planting head, and the ball supply funnel is communicated with the ball supply runner.
Optionally, the bottom surface of the bulb planting head is provided with a plurality of mounting grooves, connecting columns are detachably arranged in the mounting grooves, and the connecting columns are connected with two opposite side groove walls of the mounting grooves;
the anti-static ball sweeping rope is sleeved on the connecting column, an elastic pressing block embedding groove is formed in the groove bottom of the mounting groove, an elastic pressing block is detachably arranged in the elastic pressing block embedding groove, and the elastic pressing block is matched with the connecting column to press the anti-static ball sweeping rope.
Compared with the prior art, the invention has the following beneficial effects:
in the embodiment, the ball planting head is rotatably arranged in the ball planting barrel, and the bottom of the ball planting head is provided with the anti-static ball scanning rope, and the anti-static ball scanning rope drives the solder ball to roll along the filling mask, so that the solder ball can be better filled into the ball planting hole on the filling mask, and the quality of the ball planting is improved; in addition, a curved air outlet flow channel is arranged at the bottom of the ball planting cylinder, and the gas sprayed out of the curved air outlet flow channel forms a rotary air flow in the ball planting cylinder; the arrangement of the bending air outlet flow channel can effectively reduce the possibility that the solder ball directly collides with the bottom of the ball planting cylinder, so that the possibility that the solder ball is deformed due to extrusion of the solder ball in the moving process of the ball planting cylinder is reduced; in addition, through the setting of the gas outlet of crooked runner of giving vent to anger towards preventing static and sweeping the ball rope, reduced under the blowing of air current the tin ball and hit the possibility of planting the opposite side section of thick bamboo wall of ball section of thick bamboo, further reduced the tin ball and receive the possibility of squeezing the deformation, and make more tin balls can be in planting the ball scope of the anti-static ball rope of sweeping of planting the bulb, this also does benefit to further to and has promoted and plants ball quality, reduces the possibility of planting the appearance partial empty ball in-process promptly.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are therefore not intended to limit the scope of the invention, since any modification, variation in proportions, or adjustment of the size, which would otherwise be used by those skilled in the art, would not have the essential significance of the present disclosure, would still fall within the scope of the present disclosure without affecting the efficacy or achievement of the present disclosure.
Fig. 1 is a schematic perspective view of a ball filling device according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a ball filling device according to an embodiment of the present invention;
FIG. 3 is a schematic view of the cross-sectional view of the ball-filling device of FIG. 2;
FIG. 4 is an enlarged schematic view of the position A in FIG. 3;
FIG. 5 is a schematic top view of an outlet barrel assembly according to an embodiment of the present invention;
FIG. 6 is a schematic view of a cross-sectional B-B configuration of the vent cartridge assembly of FIG. 5;
FIG. 7 is a schematic perspective view of an airflow tray for ball placement according to an embodiment of the present invention;
fig. 8 is a schematic perspective view of an air outlet tube assembly according to an embodiment of the present invention;
Fig. 9 is a schematic perspective view of a ball-planting platen according to an embodiment of the present invention;
FIG. 10 is a schematic view of the rotation direction of the ball-planting head and the rotation direction of the rotating air flow according to the embodiment of the present invention;
FIG. 11 is a schematic diagram of an installation structure of an anti-static ball-sweeping rope according to an embodiment of the present invention;
fig. 12 is a schematic perspective view of a ball planting head with an exhaust hole according to an embodiment of the present invention.
Illustration of: 1. planting a bulb; 1001. an exhaust hole; 101. a mounting groove; 102. a connecting column; 103. an elastic pressing block; 11. a ball supply flow channel; 12. anti-static ball sweeping rope; 2. a ball planting cylinder; 201. bending the air outlet flow channel; 3. an air outlet tube assembly; 3001. an arc-shaped concave surface; 31. ball planting pressure plate; 32. ball planting air flow disc; 301. a first ring-shaped ball blocking part; 302. a second ring-shaped ball blocking part; 4. a support cylinder; 41. an air inlet hole; 5. a rotating device; 6. and a ball supply funnel.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
The embodiment of the invention provides a ball filling device which can be beneficial to reducing the possibility of cutting balls in the ball planting process, improving the ball planting quality and reducing the possibility of empty balls; the term "empty ball" as used herein means that there is no solder ball in the area where the solder ball is dropped, i.e., the solder ball is not completely filled and there is a void.
Referring to fig. 1 to 12, a ball filling apparatus fills solder balls supplied onto a filling mask into a plurality of ball-implanting holes on the filling mask by moving along the filling mask; comprising the following steps:
The ball planting head 1 is provided with a ball supplying flow channel 11 for a solder ball to enter, the ball planting flow channel penetrates through the top of the ball planting head 1 to the bottom surface of the ball planting head 1, M anti-static ball scanning ropes 12 are arranged at the bottom of the ball planting head 1, the anti-static ball scanning ropes 12 at least partially protrude out of the bottom surface of the ball planting head 1, and the M anti-static ball scanning ropes 12 are arranged around an outlet array of the ball supplying flow channel 11. M is a positive integer greater than 2.
The ball planting barrel 2, the ball planting head 1 is rotatably arranged in the ball planting barrel 2; n bending air outlet flow channels 201 are circumferentially arranged at the bottom of the ball planting cylinder 2 around the central line of the ball planting head 1, and air outlets of the bending air outlet flow channels 201 face the anti-static ball sweeping ropes 12; the gas sprayed from the N curved air outlet channels 201 forms a rotating air flow in the ball planting head 1 so as to blow the solder balls to the antistatic ball sweeping ropes 12.N is a positive integer greater than 3. Typically, N is greater than 6 and less than 41.
In this embodiment, the anti-static ball sweeping rope 12 at the bottom of the ball planting head 1 is used for sweeping the solder balls, so that the solder balls can enter the ball planting holes of the filling mask better. The shape of the ball implantation hole is consistent with the shape of the position on the workpiece where the ball is to be implanted. The anti-static ball sweeping rope 12 is an anti-static nylon rope, an anti-static cotton rope or other types of anti-static ropes.
It should be further noted that, the air outlet of the curved air outlet channel 201 is slowly air-discharged, so as to blow the solder ball away from the inner wall of the ball planting barrel 2, thereby reducing the possibility of cutting the solder ball during the translation process of the ball planting head 1, i.e. reducing the possibility of extrusion deformation of the solder ball. The shape of the solder ball is kept to be spherical, so that the solder ball can easily enter the ball implantation hole of the filling mask, the possibility that the solder ball cannot enter the ball implantation hole is reduced, and the quality of the ball implantation is improved; in addition, the shape of the solder ball is kept to be spherical, which is also beneficial to improving the subsequent welding quality.
It should be noted that, because the solder ball is smaller, a smaller portion of the solder ball is easy to roll rapidly under the blowing of the air flow to strike the inner wall of the other side of the ball planting barrel 2, which increases the possibility of the solder ball being deformed under pressure to some extent. Therefore, the air outlet of the curved air outlet flow channel 201 faces the antistatic ball sweeping rope 12, and the solder balls mainly roll or move towards the antistatic ball sweeping rope 12, and the antistatic ball sweeping rope 12 stops the solder balls, so that the possibility that the blown solder balls roll at too high speed and are easy to be extruded and deformed by the ball planting barrel 2 is avoided, more solder balls are converged in the ball planting area of the antistatic ball sweeping rope 12, and the ball planting efficiency and the ball planting yield are improved.
As shown in fig. 12, by providing the exhaust hole 1001, the air flow is exhausted from the exhaust hole 1001 and is conveyed upward, thereby facilitating the formation of a whirling air flow by the air flow at the bottom. The bottom air inlet of the exhaust hole 1001 is located at one side of the top of the anti-static ball sweeping rope 12, and two opposite sides of the bottom air inlet are provided with the anti-static ball sweeping ropes 12. The arrangement of the exhaust holes 1001 is beneficial to better converging the solder balls blown by the ball planting cylinder 2 and the solder balls flowing out of the ball supply flow channel 11 in the sweeping area of the anti-static ball sweeping rope 12. Preferably, an exhaust ball blocking net is provided in the exhaust hole 1001 to prevent the solder balls from being ejected upward from the exhaust hole 1001.
Optionally, the ball planting barrel 2 comprises an air outlet barrel assembly 3; the air outlet cylinder assembly 3 comprises a ball planting pressure plate 31 and a ball planting air flow plate 32, wherein the ball planting air flow plate 32 is arranged on the ball planting pressure plate 31 to form a bending air outlet channel 201. In this embodiment, any one of the ball planting pressure plate 31 and the ball planting air flow plate 32 is detachable, so that one of the components can be replaced in time after being damaged, and all the components do not need to be replaced, thereby reducing maintenance cost.
The bottom of the ball planting pressure plate 31 forms a first annular ball blocking part 301, the bottom of the ball planting air flow plate 32 forms a second annular ball blocking part 302, the first annular ball blocking part 301 is positioned at one side of the top of the first annular ball blocking part 301, and the air outlet is positioned between the first annular ball blocking part 301 and the second annular ball blocking part 302; the bottom surface of the first annular ball retainer 301 is lower than the bottom surface of the second annular ball retainer 302, and the bottom surface of the second annular ball retainer 302 is higher than the center of the solder ball on the fill mask. The bottom surface of the first annular ball retainer 301 is lower than the bottom surface of the second annular ball retainer 302, so that a narrower air outlet area is formed at the bottom, and tin balls can be blown in a better air outlet area. In addition, the bottom surface of the second ring-shaped ball blocking portion 302 is higher than the center of the solder ball on the filling mask, so that the possibility of squeezing the solder ball can be effectively reduced.
Optionally, an inner wall surface of the second annular ball blocking portion 302, which is close to the implant ball head 1, is an arc-shaped inner concave surface 3001, and the arc-shaped inner concave surface 3001 extends to intersect with a bottom surface of the second annular ball blocking portion 302. As shown in fig. 4, the arrangement of the arc concave 3001 can provide a certain buffering effect for the rolling of the solder ball, that is, the solder ball is easy to roll up along the arc concave 3001 on the basis that the bottom surface of the second ring-shaped ball blocking portion 302 is higher than the center of the solder ball on the filling mask in the process of being pushed by the ball implanting barrel 2. Namely, the inner wall which is relatively vertical is provided with the arc-shaped inner concave surface 3001, and the ball planting cylinder 2 is less likely to squeeze the solder balls, so that the possibility of cutting the balls is reduced. Of course, the radian of the arc-shaped inner concave surface can be specifically set according to the diameter of the solder ball.
Optionally, the ball planting barrel 2 further comprises a supporting barrel 4; the air outlet cylinder assembly 3 is connected with the bottom of the supporting cylinder 4, the supporting cylinder 4 is rotatably connected with the bulb 1, and the center line of the inner hole of the air outlet cylinder assembly 3 is overlapped with the center line of the supporting cylinder 4; the support cylinder 4 is provided with a plurality of air inlet holes 41 vertically arranged around the circumference of the planting ball head 1 in an array mode, one air inlet hole 41 is at least communicated with one bending air outlet flow channel 201, and the number of the bending air outlet flow channels 201 communicated with each air inlet hole 41 is equal. It is emphasized that the supply air pressure of the air intake holes 41 is the same to better form the whirling air flow.
Specifically, the supporting cylinder 4 has a supporting effect and supports the air outlet cylinder assembly 3 and the planting ball head 1. In this embodiment, as shown in fig. 5, each of the intake holes 41 communicates with 2 curved outlet flow passages 201.
Optionally, the ball filling device further comprises a rotating device 5, wherein the rotating device 5 is used for driving the ball planting head 1 to rotate on the ball planting barrel 2; the anti-static ball sweeping rope 12 comprises a first end and a second end which are opposite to each other, and the position of the first end connected with the ball planting head 1 is closer to the outlet than the position of the second end connected with the ball planting head 1; the line connecting the first end and the second end does not pass through the center of the outlet; an inclined horn-shaped opening is formed between two adjacent anti-static ball sweeping ropes 12, and the closer the inclined horn-shaped opening is to the inner wall of the ball planting barrel 2, the larger the inclined horn-shaped opening is; the rotation direction of the bulb 1 is opposite to the flow direction of the rotating air flow, and under the air flow blowing of the bent air outlet flow channel 201, the solder balls are blown to the inclined horn-shaped opening. As shown in fig. 11, the rotation direction of the implant bulb 1 and the flow direction of the rotating air flow can be clearly known. In this embodiment, the rotation direction of the ball implanting head 1 is opposite to the flow direction of the rotating air flow, so that the solder balls can be more easily blown into the space between the two anti-static ball sweeping ropes 12 for ball implanting.
Optionally, the ball filling device further comprises a translation device, and the translation device is used for driving the ball planting barrel 2 and the ball planting head 1 to move in the horizontal direction.
Alternatively, as shown in fig. 10, 11 or 12, the anti-static ball scanning rope 12 is suspended on the bottom surface of the implant bulb 1 in an arc shape. In the actual ball implantation process, the part of the anti-static ball scanning rope 12 which is hung down falls on the filling mask, and the anti-static ball scanning rope 12 is in linear contact with the filling mask.
Optionally, the rotating device 5 comprises a servo motor and a driving belt assembly, and the servo motor drives the ball planting head 1 to rotate through the driving belt assembly.
Optionally, the ball filling device further comprises a ball supply funnel 6 installed at one side of the top of the ball planting head 1, wherein the ball supply funnel 6 is communicated with the ball supply runner 11. Preferably, the ball supply funnel 6 is provided with a ball quantity control device for controlling the flow of the solder balls, and is provided with a visual detection device for detecting the solder balls in the ball planting barrel 2; the ball quantity control device is used for adjusting the quantity of the solder balls falling into the ball planting barrel 2 in a negative feedback mode based on the detection result of the visual detection device, so that the quantity of the solder balls in the ball planting barrel 2 is ensured to be in a set range.
Optionally, the bottom surface of the bulb planting head 1 is provided with a plurality of mounting grooves 101, connecting columns 102 are detachably arranged in the mounting grooves 101, and the connecting columns 102 are connected with two opposite side groove walls of the mounting grooves 101; the anti-static ball sweeping rope 12 is sleeved on the connecting column 102, an elastic pressing block embedding groove is formed in the groove bottom of the mounting groove 101, an elastic pressing block 103 is detachably arranged in the elastic pressing block embedding groove, and the elastic pressing block 103 is matched with the connecting column 102 to compress the anti-static ball sweeping rope.
Specifically, in this embodiment, the antistatic ball-sweeping rope 12 is directly sleeved on the connecting post 102, and then is installed in the installation groove 101. In addition, the anti-static ball-sweeping rope 12 can rotate relative to the connecting column 102, so that the defect that the anti-static ball-sweeping rope 12 with both ends fixed cannot be adjusted in the ball-sweeping position of the anti-static ball-sweeping rope 12 is avoided, and the installation of the anti-static ball-sweeping rope 12 is simplified. In addition, after abrasion exists on one side of the anti-static ball scanning rope 12, the torsion angle of the anti-static ball scanning rope 12 on the connecting column 102 can be directly adjusted, and then the anti-static ball scanning rope 12 is pressed by the elastic pressing block 103, so that one side of the anti-static ball scanning rope 12 which is not abraded is used for scanning balls. Preferably, one end of the connecting post 102 is hinged with a side groove wall ball of the installation groove 101, and the other end is detachably connected with the other side groove wall of the installation groove 101 through a threaded fastener, so that the convenience of assembling or replacing the anti-static ball sweeping rope 12 is further improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A ball filling device, comprising:
The device comprises a ball planting head (1), wherein a ball supplying flow channel (11) for a solder ball to enter is arranged, the ball planting flow channel penetrates from the top of the ball planting head (1) to the bottom surface of the ball planting head (1), M antistatic ball sweeping ropes (12) are arranged at the bottom of the ball planting head (1), the antistatic ball sweeping ropes (12) at least partially protrude out of the bottom surface of the ball planting head (1), and the M antistatic ball sweeping ropes (12) are arranged around an outlet array of the ball supplying flow channel (11), wherein M is a positive integer larger than 2;
the ball planting barrel (2), the ball planting head (1) is rotatably arranged in the ball planting barrel (2); n bending air outlet flow channels (201) are circumferentially arranged at the bottom of the ball planting cylinder (2) around the central line of the ball planting head (1), and air outlets of the bending air outlet flow channels (201) face the antistatic ball sweeping rope (12); the N gases sprayed out of the bending air outlet channels (201) form rotary air flow in the bulb (1) so as to blow tin balls to the antistatic ball sweeping ropes (12); n is a positive integer greater than 3.
2. The ball filling device according to claim 1, wherein the ball-implanting cartridge (2) comprises an air-outlet cartridge assembly (3);
The air outlet cylinder assembly (3) comprises a ball planting pressure plate (31) and a ball planting air flow plate (32), and the ball planting air flow plate (32) is arranged on the ball planting pressure plate (31) to form the bending air outlet flow channel (201);
The bottom of the ball planting pressure plate (31) forms a first annular ball blocking part (301), the bottom of the ball planting air flow plate (32) forms a second annular ball blocking part (302), the first annular ball blocking part (301) is positioned at one side of the top of the first annular ball blocking part (301), and the air outlet is positioned between the first annular ball blocking part (301) and the second annular ball blocking part (302);
The bottom surface of the first ring-shaped blocking ball part (301) is lower than the bottom surface of the second ring-shaped blocking ball part (302), and the bottom surface of the second ring-shaped blocking ball part (302) is higher than the sphere center of the tin ball on the filling mask.
3. The ball filling device according to claim 2, wherein an inner wall surface of the second annular ball blocking portion (302) adjacent to the implant ball head (1) is an arc-shaped inner concave surface (3001), and the arc-shaped inner concave surface (3001) extends and intersects with a bottom surface of the second annular ball blocking portion (302).
4. The ball filling device according to claim 2, wherein the ball-implanting cartridge (2) further comprises a support cartridge (4);
The air outlet cylinder assembly (3) is connected with the bottom of the supporting cylinder (4), the supporting cylinder (4) is rotatably connected with the bulb (1), and the central line of the inner hole of the air outlet cylinder assembly (3) is overlapped with the central line of the supporting cylinder (4);
the support cylinder (4) is provided with a plurality of air inlet holes (41) around the circumferential array of the planting ball head (1), one air inlet hole (41) is at least communicated with one curved air outlet flow channel (201), and the quantity of the curved air outlet flow channels (201) communicated with each air inlet hole (41) is equal.
5. The ball filling device according to claim 1, further comprising a rotating device (5), wherein the rotating device (5) is used for driving the ball planting head (1) to rotate on the ball planting barrel (2);
The anti-static ball sweeping rope (12) comprises a first end and a second end which are opposite, and the position of the first end connected with the ball planting head (1) is closer to the outlet than the position of the second end connected with the ball planting head (1); the line connecting the first end and the second end does not pass through the center of the outlet; an inclined horn-shaped opening is formed between two adjacent anti-static ball sweeping ropes (12), and the closer the inclined horn-shaped opening is to the inner wall of the ball planting barrel (2), the larger the inclined horn-shaped opening is;
The rotating direction of the planting ball head (1) is opposite to the flow direction of the rotating air flow, and under the air flow blowing of the bent air outlet flow channel (201), the tin ball is blown to the inclined horn-shaped opening.
6. Ball filling device according to claim 1, further comprising a translation device for driving the ball planting cylinder (2) and the ball planting head (1) to move in a horizontal direction.
7. Ball filling device according to claim 1, characterized in that the antistatic ball-sweeping rope (12) hangs in an arc shape on the bottom surface of the implant ball head (1).
8. Ball filling device according to claim 5, characterized in that the rotating device (5) comprises a servo motor and a transmission belt assembly, and the servo motor drives the ball planting head (1) to rotate through the transmission belt assembly.
9. Ball filling device according to claim 5, further comprising a ball supply funnel (6) mounted on the top side of the ball planting head (1), the ball supply funnel (6) being in communication with the ball supply flow channel (11).
10. The ball filling device according to claim 1, wherein a plurality of mounting grooves (101) are formed in the bottom surface of the ball planting head (1), connecting columns (102) are detachably arranged in the mounting grooves (101), and the connecting columns (102) are connected with groove walls on two opposite sides of the mounting grooves (101);
The anti-static ball sweeping rope (12) is sleeved on the connecting column (102), an elastic pressing block embedding groove is formed in the groove bottom of the mounting groove (101), an elastic pressing block (103) is detachably arranged in the elastic pressing block embedding groove, and the elastic pressing block (103) is matched with the connecting column (102) to press the anti-static ball sweeping rope.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410353807.7A CN117954360B (en) | 2024-03-27 | 2024-03-27 | Ball filling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410353807.7A CN117954360B (en) | 2024-03-27 | 2024-03-27 | Ball filling device |
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| CN117954360A true CN117954360A (en) | 2024-04-30 |
| CN117954360B CN117954360B (en) | 2024-07-19 |
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| JP2009016695A (en) * | 2007-07-09 | 2009-01-22 | Athlete Fa Kk | Head and device for filling ball |
| JP2009267290A (en) * | 2008-04-30 | 2009-11-12 | Athlete Fa Kk | Ball mounting apparatus and ball loading method |
| CN101879642A (en) * | 2009-04-23 | 2010-11-10 | 株式会社日立工业设备技术 | Solder ball printing apparatus and solder ball printing method |
| CN101944488A (en) * | 2004-06-30 | 2011-01-12 | 爱立发股份有限公司 | The method and apparatus of conducting sphere is installed |
| JP2013034019A (en) * | 2012-11-09 | 2013-02-14 | Athlete Fa Kk | Method of mounting conductive ball on substrate |
| KR101647660B1 (en) * | 2015-02-12 | 2016-08-11 | (주) 에스에스피 | Solder ball supplier using air curtain |
| JP2023062354A (en) * | 2021-10-21 | 2023-05-08 | Ａｉメカテック株式会社 | solder ball printer |
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2024
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| CN101944488A (en) * | 2004-06-30 | 2011-01-12 | 爱立发股份有限公司 | The method and apparatus of conducting sphere is installed |
| JP2009016695A (en) * | 2007-07-09 | 2009-01-22 | Athlete Fa Kk | Head and device for filling ball |
| JP2009267290A (en) * | 2008-04-30 | 2009-11-12 | Athlete Fa Kk | Ball mounting apparatus and ball loading method |
| CN101879642A (en) * | 2009-04-23 | 2010-11-10 | 株式会社日立工业设备技术 | Solder ball printing apparatus and solder ball printing method |
| JP2013034019A (en) * | 2012-11-09 | 2013-02-14 | Athlete Fa Kk | Method of mounting conductive ball on substrate |
| KR101647660B1 (en) * | 2015-02-12 | 2016-08-11 | (주) 에스에스피 | Solder ball supplier using air curtain |
| JP2023062354A (en) * | 2021-10-21 | 2023-05-08 | Ａｉメカテック株式会社 | solder ball printer |
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| Publication number | Publication date |
|---|---|
| CN117954360B (en) | 2024-07-19 |
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