CN117950431A

CN117950431A - Dynamic temperature control method of heating plate and semiconductor process equipment

Info

Publication number: CN117950431A
Application number: CN202211293166.8A
Authority: CN
Inventors: 范光华
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2022-10-21
Filing date: 2022-10-21
Publication date: 2024-04-30

Abstract

The embodiment of the invention provides a dynamic temperature control method and semiconductor process equipment for a heating plate, which are used for calculating a weighted average value as a temperature control temperature according to temperature values detected by a plurality of temperature sensors and corresponding weight values; according to the temperature control temperature, adjusting the weight value of the temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value; comparing the recalculated temperature control temperature with the process set temperature, and heating and controlling the heating plate according to the comparison result, compared with the single-point temperature control mode in the prior art, the invention can adopt the heating plate to heat the chamber lining more comprehensively, and the whole temperature of the chamber lining is reflected more comprehensively through the temperature values detected by a plurality of temperature sensors; the temperature control temperature is obtained by adjusting the weight value corresponding to the temperature sensor, so that the heating plate is heated according to the temperature control temperature and the process set temperature, the overall temperature of the heating plate is dynamically adjusted, and the overall temperature reaches the temperature required by the process requirement.

Description

Dynamic temperature control method of heating plate and semiconductor process equipment

Technical Field

The invention relates to the technical field of semiconductor processes, in particular to a dynamic temperature control method of a heating plate and semiconductor process equipment.

Background

When the process task is performed, the process chamber is pumped into vacuum by the vacuum pump, and the wafer passes through the air and vacuum conversion door to ensure the vacuum degree of the vacuum chamber, besides the vacuum degree of the process chamber is ensured, the heating of the process chamber is an essential and very important link, because byproducts are generated in the etching process, if the byproducts are not heated, the byproducts are attached to the chamber wall in a particle form, so that the chamber is polluted and products are polluted.

At present, in order to protect a process chamber in the prior art, a chamber liner is added, and the chamber liner is heated to a higher temperature, so that byproducts cannot be attached to the chamber liner in the form of particles and can be pumped away by a vacuum pump, the cleanliness in the chamber is ensured, and the product cannot be polluted. However, in the prior art, when the chamber liner is heated, the temperature of the chamber liner is generally monitored by setting a temperature measuring point and is controlled according to the monitored temperature, but the heating temperature of the chamber liner cannot be accurately controlled by the single-point temperature control mode, and the problem of poor cleaning effect of the chamber still exists.

Disclosure of Invention

In view of the foregoing, embodiments of the present invention have been developed to provide a dynamic temperature control method for a heating plate and corresponding semiconductor processing apparatus that overcome or at least partially solve the foregoing problems.

In order to solve the above problems, an embodiment of the present invention discloses a dynamic temperature control method of a heating plate, a semiconductor process apparatus including a chamber liner and a heating plate, the heating plate being provided with a plurality of temperature sensors, the heating plate being used for heating the chamber liner, and a temperature controller being used for measuring temperatures of the plurality of temperature sensors, the method comprising:

Acquiring temperature values and corresponding weight values detected by the plurality of temperature sensors;

Calculating a weighted average value according to the temperature values detected by the plurality of temperature sensors and the corresponding weight values, and taking the weighted average value as a temperature control temperature;

According to the temperature control temperature, adjusting a weight value of a temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value;

Acquiring a process set temperature;

And comparing the recalculated temperature control temperature with the process set temperature, and performing heating control on the heating plate according to a comparison result.

Optionally, the temperature control temperature, adjusting a weight value of a temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value, including:

If the temperature control temperature is not in the preset temperature range, heating and controlling the heating plate according to the temperature control temperature until the temperature control temperature is in the preset temperature range;

And if the temperature control temperature is in the preset temperature range and the temperature value detected by the at least one temperature sensor is not in the preset temperature range, adjusting the weight value of the temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value.

Optionally, the heating control of the heating disc according to the comparison result includes:

When the temperature control temperature is greater than the process set temperature, controlling the heating plate to reduce heating power according to the difference value between the temperature control temperature and the process set temperature;

When the temperature control temperature is smaller than the process set temperature, the heating disc is controlled to increase heating power according to the difference value between the temperature control temperature and the process set temperature.

Optionally, if the temperature control temperature is within the preset temperature range and the temperature value detected by the at least one temperature sensor is not within the preset temperature range, adjusting a weight value of the temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value, including:

If the temperature control temperature is in the preset temperature range and the temperature value detected by the at least one temperature sensor is not in the preset temperature range, determining a highest temperature value and a lowest temperature value in the temperature values detected by the plurality of temperature sensors;

comparing the highest temperature value with an upper boundary value of the preset temperature range, and comparing the lowest temperature value with a lower boundary value of the preset temperature range; the upper boundary value of the preset temperature range is the sum of the process set temperature and the allowable error temperature, and the lower boundary value of the preset temperature range is the difference between the process set temperature and the allowable error temperature;

If the highest temperature value is greater than or equal to the upper boundary value of the preset temperature range and the lowest temperature value is greater than or equal to the lower boundary value of the preset temperature range, increasing the weight value of one temperature sensor in the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value;

And if the highest temperature value is smaller than the upper boundary value of the preset temperature range and the lowest temperature value is smaller than the lower boundary value of the preset temperature range, reducing the weight value of one temperature sensor in the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value.

Optionally, if the maximum temperature value is greater than or equal to the upper boundary value of the preset temperature range and the minimum temperature value is greater than or equal to the lower boundary value of the preset temperature range, increasing the weight value of one temperature sensor of the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value, including:

If the highest temperature value is greater than or equal to the upper boundary value of the preset temperature range and the lowest temperature value is greater than or equal to the lower boundary value of the preset temperature range, taking the temperature sensor corresponding to the highest temperature value as a first sensor to be adjusted, and judging whether the weight value of the first sensor to be adjusted is equal to a preset maximum weight value;

If the weight value of the first sensor to be adjusted is equal to the preset maximum weight value, taking the sensor with the highest temperature value from the rest temperature sensors as the first sensor to be adjusted and returning to the step of judging whether the weight value of the first sensor to be adjusted is equal to the preset maximum weight value;

If the weight value of the first sensor to be adjusted is smaller than the preset maximum weight value, the weight value of the first sensor to be adjusted is increased by a preset value, and the updated weight value of the first sensor to be adjusted is obtained;

and recalculating the temperature control temperature according to the updated weight value of the first sensor to be adjusted.

Optionally, the recalculating the temperature control temperature according to the updated weight value of the first sensor to be adjusted includes:

After the updated weight value of the first sensor to be adjusted is obtained, judging whether the weight values of the temperature sensors at the current moment are all the preset maximum weight values or not;

If the weight values of the temperature sensors at the current moment are not all the preset maximum weight values, recalculating the temperature control temperature according to the weight values of the temperature sensors at the current moment.

Optionally, the method further comprises:

And if the weight values of the temperature sensors at the current moment are all the preset maximum weight values, determining that the heating plate fails and sending out alarm information.

Optionally, if the maximum temperature value is smaller than the upper boundary value of the preset temperature range and the minimum temperature value is smaller than the lower boundary value of the preset temperature range, reducing the weight value of one temperature sensor of the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value, including:

If the highest temperature value is smaller than the upper boundary value of the preset temperature range and the lowest temperature value is smaller than the lower boundary value of the preset temperature range, taking the temperature sensor corresponding to the lowest temperature value as a second sensor to be adjusted, and judging whether the weight value of the second sensor to be adjusted is equal to a preset minimum weight value;

If the weight value of the second sensor to be adjusted is equal to the preset minimum weight value, taking the sensor with the lowest temperature value from the rest temperature sensors as the second sensor to be adjusted, and returning to the step of judging whether the weight value of the second sensor to be adjusted is equal to the preset minimum weight value;

If the weight value of the second sensor to be adjusted is larger than the preset minimum weight value, reducing the weight value of the second sensor to be adjusted by a preset value to obtain an updated weight value of the second sensor to be adjusted;

And recalculating the temperature control temperature according to the updated weight value of the second sensor to be adjusted.

Optionally, the recalculating the temperature control temperature according to the updated weight value of the second sensor to be adjusted includes:

After obtaining the updated weight value of the second sensor to be adjusted, judging whether the weight values of the plurality of sensors at the current moment are all the preset minimum weight values or not;

and if the weight values of the temperature sensors at the current moment are not all the preset minimum weight values, re-determining the temperature control temperature according to the weight values of the temperature sensors at the current moment.

Optionally, the method further comprises:

and if the weight values of the temperature sensors at the current moment are all the preset minimum weight values, determining that the heating plate fails and sending out alarm information.

Optionally, the method further comprises:

and if the highest temperature value is larger than the upper boundary value of the preset temperature range and the lowest temperature value is smaller than the lower boundary value of the preset temperature range, determining that the heating plate fails and sending out alarm information.

Optionally, the method further comprises:

And if the temperature control temperature is in the preset temperature range and the temperature values detected by the temperature sensors are all in the preset temperature range, not adjusting the heating power of the heating disc.

The embodiment of the invention also discloses semiconductor process equipment, which comprises a process chamber, a chamber liner arranged in the process chamber, a heating plate and a temperature control device, wherein the temperature control device comprises a plurality of temperature sensors and temperature controllers distributed on the heating plate;

The heating plate is used for heating the chamber liner;

The temperature sensors are used for detecting temperature values of different positions of the heating plate;

the temperature controller is used for executing the dynamic temperature control method of the heating plate.

Optionally, the heating device further comprises a heater cover plate, wherein the heater cover plate is arranged on the top surface of the chamber liner, the bottom surface of the heater cover plate is provided with a first annular groove, the upper part of the chamber liner is provided with a second annular groove, and the heating disc is positioned in the first annular groove and the second annular groove;

the heating plate is a mica heating plate, the mica heating plate comprises an upper layer mica sheet, a middle layer mica sheet and a lower layer mica sheet which are overlapped, and heating wires are wound on the middle layer mica sheet.

The embodiment of the invention has the following advantages:

In the embodiment of the invention, the semiconductor process equipment comprises a chamber liner and a heating disc, wherein the heating disc is arranged on the top surface of the chamber liner and is used for heating the chamber liner, and the heating disc is provided with a plurality of temperature sensors for acquiring temperature values and corresponding weight values detected by the temperature sensors; calculating a weighted average value according to the temperature values detected by the plurality of temperature sensors and the corresponding weight values, and taking the weighted average value as a temperature control temperature; according to the temperature control temperature, adjusting the weight value of the temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value; acquiring a process set temperature; comparing the recalculated temperature control temperature with the process set temperature, and heating and controlling the heating plate according to the comparison result, compared with the single-point temperature control mode in the prior art, the invention can adopt the heating plate to heat the chamber lining more comprehensively, and the whole temperature of the chamber lining is reflected more comprehensively through the temperature values detected by a plurality of temperature sensors; the temperature control temperature is obtained by adjusting the weight value corresponding to the temperature sensor, so that the heating plate is heated according to the temperature control temperature and the process set temperature, the overall temperature of the heating plate is dynamically adjusted, the overall temperature reaches the temperature required by the process requirement, and the cleanliness of the chamber and the pollution of products are ensured.

Drawings

FIG. 1 is a flow chart of steps of a method for dynamically controlling temperature of a heating plate according to an embodiment of the present invention;

FIG. 2 is a schematic illustration of the position of a mica heating plate provided by an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of a mica heating plate provided by an embodiment of the present invention;

FIG. 4 is a schematic diagram of dynamic temperature control of a mica heating plate provided by an embodiment of the invention;

FIG. 5A is a graph showing a temperature profile with a maximum temperature greater than an upper boundary of a predetermined temperature range according to an embodiment of the present invention;

FIG. 5B is a graph showing a temperature profile of the whole body temperature after adjustment according to the embodiment of the present invention;

FIG. 6A is a graph showing a temperature profile with a minimum temperature value less than a lower boundary value of a predetermined temperature range according to an embodiment of the present invention;

FIG. 6B is a graph showing another temperature profile of the bulk temperature adjusted according to an embodiment of the present invention;

FIG. 7 is a graph showing a temperature profile with a maximum temperature greater than an upper boundary of a predetermined temperature range and a minimum temperature less than a lower boundary of the predetermined temperature range according to an embodiment of the present invention;

FIG. 8 is a computational flow diagram of a temperature control adjustment provided by an embodiment of the present invention;

Fig. 9 is a block diagram of a semiconductor processing apparatus according to an embodiment of the present invention.

Reference numerals illustrate:

1-upper electrode, 2-lower electrode, 3-heater apron, 4-mica heating plate, 5-cavity inside lining upper portion, 6-cavity inside lining lower part, 7-upper layer splint, 8-lower floor splint, 9-upper layer mica sheet, 10-middle layer mica sheet, 11-lower layer mica sheet, 12-thermocouple, 13-temperature input channel, 14-temperature controller, 15-solid state relay.

Detailed Description

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.

In the prior art, a heater is arranged at the bottom of a chamber, the temperature of a chamber liner is higher than the evaporation point of an etching reaction byproduct, and the purpose that particles are attached to the chamber liner in the process is achieved, so that the process byproduct can be pumped away by a vacuum pump is achieved.

One of the core concepts of the embodiment of the invention is that a heating disc is utilized to heat the inner lining of the cavity, and the whole temperature of the inner lining of the cavity is reflected more comprehensively through the temperature values detected by a plurality of temperature sensors; the temperature control temperature is obtained by adjusting the weight value corresponding to the temperature sensor, so that the heating plate is heated according to the temperature control temperature and the process set temperature, the overall temperature of the heating plate is dynamically adjusted, and the overall temperature reaches the temperature required by the process requirement.

Referring to fig. 1, a step flow chart of a dynamic temperature control method of a heating plate is shown, where a semiconductor process apparatus includes a chamber liner and a heating plate, the heating plate is disposed on a top surface of the chamber liner and is used for heating the chamber liner, the heating plate is provided with a plurality of temperature sensors, and the method specifically includes the following steps:

Step 101, obtaining temperature values and corresponding weight values detected by the plurality of temperature sensors;

In the embodiment of the invention, the semiconductor process equipment comprises a chamber liner, a heating disc and a temperature controller, wherein the heating disc can be provided with a plurality of temperature sensors, the heating disc can be arranged on the top surface of the chamber liner and can be used for heating the chamber liner, the temperature sensors can be thermocouples or thermal resistors, the number of the temperature sensors can be 8, and the temperature uniformity detection of the heating disc can be met through 8 uniformly arranged temperature sensors.

The temperature controller can acquire temperature values detected by a plurality of temperature sensors arranged on the heating plate, and the temperature controller can determine temperature control temperature according to the temperature values detected by the plurality of temperature sensors.

In the embodiment of the invention, the temperature controller can acquire weight values corresponding to a plurality of temperature sensors, the weight values corresponding to the temperature sensors are in a preset weight range, the preset weight range comprises a preset maximum weight value and a preset minimum weight value, and specifically, the preset maximum weight value and the preset minimum weight value can be determined according to actual conditions, and the person skilled in the art does not limit the invention.

Illustratively, the mica heating plate can be used for heating the chamber liner, the mica heating plate is pressed on the upper portion of the chamber liner through the heater cover plate, the inner side and the outer side of the upper portion of the heater cover plate and the upper portion of the chamber liner are fastened through screws, the upper portion of the chamber liner and the lower portion of the chamber liner are connected through screws, the lower end of the lower electrode is fixed on the lower portion of the chamber liner, the temperature sensor is placed on the mica heating plate, namely, the heater cover plate presses the thermocouple on the mica heating plate, wherein the bottom surface of the heater cover plate is provided with a first annular groove, the upper portion of the chamber liner is provided with a second annular groove, and the heater is located in the first annular groove and the second annular groove.

Illustratively, the mica heating plate is of a sandwich structure, the upper layer of mica sheets, the middle layer of mica sheets and the lower layer of mica sheets are fixed through screws, the middle layer of mica sheets are wound with heating wires, and the upper layer of mica sheets and the lower layer of mica sheets are in point lamination for insulation. Because the heating plate is arranged on the inner lining of the cavity, insulation and temperature resistance are needed to be considered, and therefore, the mica heating plate can meet the requirements of insulation and temperature resistance. In particular, a schematic cross-sectional view of a mica heating plate can be seen with reference to FIG. 3.

Step S102, calculating a weighted average value according to the temperature values detected by the temperature sensors and the corresponding weight values, and taking the weighted average value as the temperature control temperature.

In the embodiment of the invention, the temperature controller can acquire temperature values and corresponding weight values detected by a plurality of temperature sensors, and calculate a weighted average value to obtain temperature control temperatures, specifically, the temperature sensors can be thermocouples, the corresponding number of the temperature sensors is 8, the corresponding temperatures are respectively T ₁、T₂、T₃、T₄、T₅、T₆、T₇、T₈, the weight values corresponding to the detected temperature values are respectively a ₁、a₂、a₃、a₄、a₅、a₆、a₇、a₈, and the temperature control temperatures can be represented by T _input;

T_input＝(a₁T₁+a₂T₂+a₃T₃+a₄T₄+a₅T₅+a₆T₆+a₇T₇+a₈T₈)/8;

Wherein, the initial values of a ₁、a₂、a₃、a₄、a₅、a₆、a₇、a₈ can be all 1, and the corresponding weight value range can be 0-2.

Step 103, adjusting the weight value of the temperature sensor according to the temperature control temperature, and recalculating the temperature control temperature according to the adjusted weight value;

In the embodiment of the invention, the weight value of the temperature sensor can be adjusted according to the temperature control temperature, so that the temperature control temperature is recalculated according to the adjusted weight value.

In the embodiment of the present invention, the step 103 may include the following substeps S11 to S12:

step S11, if the temperature control temperature is not in the preset temperature range, heating and controlling the heating plate according to the temperature control temperature until the temperature control temperature is in the preset temperature range;

If the temperature control temperature is not within the preset temperature range, the temperature control temperature may be set as a temperature input value of PID control to control the temperature, and the heating plate is heated and controlled according to the temperature control temperature by using a temperature control principle of the temperature controller, where the temperature control principle of the temperature controller may be that when the temperature controller detects that the temperature control temperature is less than the process set temperature, the temperature controller increases the output of heating power, and when the temperature controller detects that the temperature control temperature is greater than the process set temperature, the temperature controller decreases the output of heating power until the temperature control temperature is within the preset temperature range.

Referring to fig. 4, a dynamic temperature control schematic diagram of a mica heating plate provided by the embodiment of the invention is shown, a cavity liner is heated by utilizing insulation temperature resistance of mica in an annular mica heating plate, a plurality of temperature sensors can be uniformly arranged on the annular mica heating plate, the temperature sensors in the scheme can take thermocouples as examples, the corresponding number of the temperature sensors can be 8, the temperature sensors are respectively connected into 8 temperature input channels of a temperature controller, programming is carried out in the temperature controller, 8 temperature input signals are processed into control loop input signals for the temperature controller according to a certain algorithm, and the output of the temperature controller is connected with a heating resistor of the mica heating plate through a solid state relay, wherein resistance wires adopted in the annular mica heating plate are wound manually. Specifically, the resistance wire wound by the mica heating plate can be wound in a partition mode, so that the function of partition instant heating control is realized, and the temperature of a local area can be further adjusted under the condition that the whole temperature is raised or lowered to a preset temperature range.

The preset temperature range may be composed of a process set temperature and an allowable error temperature, for example.

Step S12, if the temperature control temperature is within the preset temperature range and the temperature values detected by the at least one temperature sensor are not all within the preset temperature range, adjusting the weight value of the temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value;

In the embodiment of the invention, if the temperature control temperature is within the preset temperature range, whether the temperature values detected by the plurality of temperature sensors are all within the preset temperature range is judged, if the temperature values detected by at least one temperature sensor are not all within the preset temperature range, the weight value of the temperature sensor is adjusted, and the temperature control temperature can be obtained again by weighted average according to the weight value of the adjusted temperature sensor.

In an embodiment of the present invention, the substep S12 may include the following substeps S121 to S124:

Sub-step S121, if the temperature controlled temperature is within the preset temperature range and the temperature value detected by the at least one temperature sensor is not within the preset temperature range, determining a highest temperature value and a lowest temperature value among the temperature values detected by the plurality of temperature sensors;

Sub-step S122, comparing the highest temperature value with an upper boundary value of the preset temperature range, and comparing the lowest temperature value with a lower boundary value of the preset temperature range; the upper boundary value of the preset temperature range is the sum of the process set temperature and the allowable error temperature, and the lower boundary value of the preset temperature range is the difference between the process set temperature and the allowable error temperature;

In the embodiment of the invention, if the temperature control temperature is in a preset range and at least one temperature sensor is not in the preset temperature range, determining a highest temperature value and a lowest temperature value in temperature values detected by the plurality of temperature sensors, comparing the highest temperature value with an upper boundary value of the preset temperature range, comparing the lowest temperature value with a lower boundary value of the preset temperature range, and adjusting a weight value of one temperature sensor in the plurality of temperature sensors according to the comparison result. Specifically, the preset temperature range may be determined by a process set temperature and an allowable error temperature, and an upper boundary value of the preset temperature range is a sum of the process set temperature and the allowable error temperature, and a lower boundary value of the preset temperature range is a difference between the process set temperature and the allowable error temperature.

Step S123, if the highest temperature value is greater than or equal to the upper boundary value of the preset temperature range and the lowest temperature value is greater than or equal to the lower boundary value of the preset temperature range, increasing the weight value of one temperature sensor in the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value;

In the embodiment of the invention, if the highest temperature value in the temperature values detected by the plurality of temperature sensors is greater than or equal to the sum of the process set temperature and the allowable error temperature and the lowest temperature value is greater than or equal to the difference between the process set temperature and the allowable error temperature, the weight value of one temperature sensor in the plurality of temperature sensors is increased to obtain an adjusted weight value, and weighted average calculation is performed according to the adjusted weight value to obtain the temperature control temperature.

In an embodiment of the present invention, the substep S123 may include the following substeps S1231 to S1235:

Sub-step S1231, if the maximum temperature value is greater than or equal to the upper boundary value of the preset temperature range and the minimum temperature value is greater than or equal to the lower boundary value of the preset temperature range, using the temperature sensor corresponding to the maximum temperature value as a first sensor to be adjusted, and judging whether the weight value of the first sensor to be adjusted is equal to the preset maximum weight value;

Step S1232, if the weight value of the first sensor to be adjusted is equal to the preset maximum weight value, using the sensor with the highest temperature value as the first sensor to be adjusted from the remaining temperature sensors, and returning to the step of judging whether the weight value of the first sensor to be adjusted is equal to the preset maximum weight value;

In the embodiment of the invention, if the highest temperature value in the temperature values detected by the plurality of temperature sensors is greater than or equal to the sum of the process set temperature and the allowable error temperature, and the lowest temperature value is greater than or equal to the difference between the process set temperature and the allowable error temperature, the temperature sensor corresponding to the highest temperature value is selected as the first sensor to be adjusted, whether the corresponding weight value of the first sensor to be adjusted is equal to the preset maximum weight value is judged, if the weight value of the first sensor to be adjusted is equal to the preset maximum weight value, the sensor with the highest temperature value is taken as the first sensor to be adjusted from the rest temperature sensors, and the step of judging whether the weight value of the first sensor to be adjusted is equal to the preset maximum weight value is returned until the weight value of the first sensor to be adjusted is not equal to the preset maximum weight value. The magnitude of the preset maximum weight value may be determined according to practical situations, and the present invention is not limited herein.

Step S1233, if the weight value of the first sensor to be adjusted is smaller than the preset maximum weight value, increasing the weight value of the first sensor to be adjusted by a preset value to obtain an updated weight value of the first sensor to be adjusted;

In the embodiment of the invention, if the weight value of the first sensor to be adjusted is smaller than the preset maximum weight value, the weight value of the first sensor to be adjusted is increased by a preset value, and the updated weight value of the first sensor to be adjusted is obtained. Specifically, the magnitude of the preset value may be determined according to practical situations, and the present invention is not limited herein.

And S1234, recalculating the temperature control temperature according to the updated weight value of the first sensor to be adjusted.

In an embodiment of the present invention, the substep S1234 may include the substeps S12341-S12342:

Step S12341, after obtaining the updated weight value of the first sensor to be adjusted, judging whether the weight values of the temperature sensors at the current moment are all the preset maximum weight values;

And step S12342, if the weight values of the temperature sensors at the current moment are not all the preset maximum weight values, recalculating the temperature control temperature according to the weight values of the temperature sensors at the current moment.

In the embodiment of the invention, after the updated weight value of the first sensor to be adjusted is obtained, whether the weight values of the plurality of temperature sensors at the current moment are all preset maximum weight values is judged, and if the weight values of the plurality of temperature sensors at the current moment are not all preset maximum weight values, the temperature control temperature is recalculated according to the weight values of the plurality of temperature sensors at the current moment.

In an example, for example, the preset maximum weight value may be 2, the preset number may be 0.1, the number of temperature sensors may be 8, the process set temperature may be T _set, the allowed error temperature is T _window, the preset temperature range is [ T _set-T_window,T_set+T_window ], when the maximum temperature value detected by the temperature sensor is greater than or equal to the upper boundary value of the preset temperature range and the minimum temperature value is greater than or equal to the lower boundary value of the preset temperature range, in order to make the temperature deviation after the weight change obvious, the temperature sensor corresponding to the maximum temperature value is selected as the first to-be-adjusted sensor, whether the weight value corresponding to the first to-be-adjusted sensor is equal to 2 is determined, if the weight value of the first to-be-adjusted sensor is equal to 2, the sensor with the highest temperature value is taken as the first to-be-adjusted sensor from the remaining temperature sensors, and the step of determining whether the weight value of the first to-be-adjusted sensor is equal to 2 is returned until the weight value of the first to-be-adjusted sensor is not equal to 2, and the weight value of the first to-be-adjusted sensor is increased by 0.1 until each time the weight value is increased to satisfy all the temperature values detected by the temperature sensor at T _set-T_window,T_set+T_window.

Specifically, before the temperature control adjustment, as shown in fig. 5A, the temperature measuring points are 1-8, the preset temperature range is 145-155 ℃, wherein the temperature detected by the 8 th temperature measuring point is the highest temperature value of all the temperature measuring points and is larger than the upper boundary value of the preset temperature range; the temperature detected by the 5 th temperature measuring point is the lowest temperature value of all the temperature measuring points and is larger than the lower boundary value of the preset temperature range;

After the temperature control adjustment is performed, as shown in fig. 5B, the temperature values of all the temperature measurement points are within the preset temperature range relative to the temperature values of fig. 5A, and the temperature of all the temperature measurement points in fig. 5B is reduced by a certain temperature value relative to the temperature of all the temperature measurement points in fig. 5A, so that the temperature values of all the temperature measurement points are within the preset temperature range.

In an embodiment of the present invention, the substep S123 may further include: and if the weight values of the temperature sensors at the current moment are all the preset maximum weight values, determining that the heating plate fails and sending out alarm information.

In the embodiment of the invention, if the weight values of the temperature sensors at the current moment are all preset maximum weight values, the fact that the heating resistance wires of the heating disc are wound unevenly is indicated, the heating requirements of users cannot be met, and at the moment, the heating disc can be determined to be faulty and alarm information can be sent out.

And step S124, if the highest temperature value is smaller than the upper boundary value of the preset temperature range and the lowest temperature value is smaller than the lower boundary value of the preset temperature range, reducing the weight value of one temperature sensor in the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value.

In the embodiment of the invention, if the highest temperature value in the temperature values detected by the plurality of temperature sensors is smaller than the sum of the process set temperature and the allowable error temperature and the lowest temperature value is smaller than the difference between the process set temperature and the allowable error temperature, the weight value of one temperature sensor in the plurality of temperature sensors is reduced to obtain an adjusted weight value, and weighted average calculation is performed according to the adjusted weight value to obtain the temperature control temperature.

In an embodiment of the present invention, the substep S124 may include the following substeps S1241 to S1245:

step S1241, if the highest temperature value is smaller than the upper boundary value of the preset temperature range and the lowest temperature value is smaller than the lower boundary value of the preset temperature range, using the temperature sensor corresponding to the lowest temperature value as a second sensor to be adjusted, and judging whether the weight value of the second sensor to be adjusted is equal to the preset minimum weight value;

Sub-step S1242, if the weight value of the second sensor to be adjusted is equal to the preset minimum weight value, using the sensor with the lowest temperature value as the second sensor to be adjusted from the remaining temperature sensors, and returning to the step of determining whether the weight value of the second sensor to be adjusted is equal to the preset minimum weight value;

In the embodiment of the invention, if the highest temperature value in the temperature values detected by the plurality of temperature sensors is smaller than the sum of the process set temperature and the allowable error temperature, and the lowest temperature value is smaller than the difference between the process set temperature and the allowable error temperature, the temperature sensor corresponding to the lowest temperature value is selected as the second sensor to be adjusted, whether the corresponding weight value of the second sensor to be adjusted is equal to the preset minimum weight value is judged, if the weight value of the second sensor to be adjusted is equal to the preset minimum weight value, the sensor with the lowest temperature value is taken as the second sensor to be adjusted from the rest temperature sensors, and the step of judging whether the weight value of the second sensor to be adjusted is equal to the preset minimum weight value is returned until the weight value of the second sensor to be adjusted is not equal to the preset minimum weight value. The magnitude of the preset minimum weight value may be determined according to practical situations, and the present invention is not limited herein.

Step S1243, if the weight value of the second sensor to be adjusted is greater than the preset minimum weight value, reducing the weight value of the second sensor to be adjusted by a preset value to obtain an updated weight value of the second sensor to be adjusted;

in the embodiment of the invention, if the weight value of the second sensor to be adjusted is greater than the preset minimum weight value, the weight value of the second sensor to be adjusted is reduced by a preset value, and the updated weight value of the second sensor to be adjusted is obtained.

And substep S1244, recalculating the temperature control temperature according to the updated weight value of the second sensor to be adjusted.

In an embodiment of the present invention, the substep S1244 may include the following substeps S12441-S12442:

sub-step SS12441, after obtaining the updated weight value of the second sensor to be adjusted, judging whether the weight values of the temperature sensors at the current moment are all the preset minimum weight values;

And sub-step SS12442, if the weight values of the temperature sensors at the current moment are not all the preset minimum weight values, re-determining the temperature control temperature according to the weight values of the temperature sensors at the current moment.

In the embodiment of the invention, after the updated weight value of the second sensor to be adjusted is obtained, whether the weight values of the plurality of temperature sensors at the current moment are all preset minimum weight values is judged, and if the weight values of the plurality of temperature sensors at the current moment are not all preset minimum weight values, the temperature control temperature is recalculated according to the weight values of the plurality of temperature sensors at the current moment.

In an example, for example, the preset minimum weight value may be 0, the preset value may be 0.1, the number of temperature sensors may be 8, the process set temperature may be T _set, the allowable error temperature is T _window, the preset temperature range is [ T _set-T_window,T_set+T_window ], when the maximum temperature value detected by the temperature sensor is smaller than the upper boundary value of the preset temperature range and the minimum temperature value is smaller than the lower boundary value of the preset temperature range, in order to make the temperature deviation after the weight value change obvious, the temperature sensor corresponding to the minimum temperature value is selected as the second sensor to be adjusted, whether the weight value corresponding to the second sensor is equal to 0 is determined, if the weight value of the second sensor to be adjusted is equal to 0, the sensor with the lowest temperature value is taken as the second sensor to be adjusted, and the step of determining whether the weight value of the second sensor is equal to 0 is returned, until the weight value of the second sensor is not equal to 0, the weight value corresponding to the second sensor is reduced by 0.1, and each time the weight value of the second sensor is increased until all the temperature values are equal to the temperature values are detected by [ _set-T_window,T_set+T_window ].

Specifically, before the temperature control adjustment, as shown in fig. 6A, the temperature measuring points are 1-8, the preset temperature range is 145-155 ℃, wherein the temperature detected by the 8 th temperature measuring point is the lowest temperature value of all the temperature measuring points and is smaller than the lower boundary value of the preset temperature range; the temperature detected by the 1 st temperature measuring point is the highest temperature value of all the temperature measuring points and is smaller than the upper boundary value of the preset temperature range;

After the temperature control adjustment is performed, as shown in fig. 6B, the temperature values of all the temperature measurement points are within the preset temperature range relative to the temperature values of all the temperature measurement points in fig. 6A, and the temperature of all the temperature measurement points in fig. 6B is raised by a certain temperature value relative to the temperature of all the temperature measurement points in fig. 6A, so that the temperature values of all the temperature measurement points are within the preset temperature range.

In an embodiment of the present invention, the substep S12 may further include: and if the highest temperature value is larger than the upper boundary value of the preset temperature range and the lowest temperature value is smaller than the lower boundary value of the preset temperature range, determining that the heating plate fails and sending out alarm information.

In the embodiment of the invention, if the highest temperature value in the temperature values detected by the plurality of temperature sensors is greater than the upper boundary value of the preset temperature range and the lowest temperature value is less than the lower boundary value of the preset temperature range, the heating plate is determined to be faulty and alarm information is sent out, so that the heating resistance wire in the heating plate is proved to be extremely uneven in winding and belongs to an unqualified product, and the heating resistance wire is considered to be replaced to a manufacturer, and at the moment, the temperature controller stops heating for protecting equipment, and the temperature of the whole heating plate is reduced. Specifically, in the case of a temperature distribution in which the highest temperature value is greater than the upper boundary value of the preset temperature range and the lowest temperature value is less than the lower boundary value of the preset temperature range, the temperature of the heating plate cannot be adjusted integrally at this time, so that the temperature values detected by the plurality of temperature sensors are all within the preset temperature range, and the distribution diagram of the temperature curve when the highest temperature value is greater than the upper boundary value of the preset temperature range and the lowest temperature value is less than the lower boundary value of the preset temperature range can be referred to fig. 7.

104, Obtaining a process set temperature;

And 105, comparing the recalculated temperature control temperature with the process set temperature, and performing heating control on the heating plate according to the comparison result.

In an embodiment of the present invention, the step 105 may include the following substeps S21 to S22:

step S21, when the temperature control temperature is greater than the process set temperature, controlling the heating plate to reduce heating power according to the difference value between the temperature control temperature and the process set temperature;

In the embodiment of the invention, the heating plate can be heated and controlled according to the recalculated temperature control temperature. Specifically, the recalculated temperature control temperature and the process set temperature are obtained and compared, and if the temperature control temperature is greater than the process set temperature, the temperature controller can reduce the output of heating power according to the difference between the temperature control temperature and the process set temperature, so that the temperature is reduced.

And S22, when the temperature control temperature is smaller than the process set temperature, controlling the heating plate to increase heating power according to the difference value between the temperature control temperature and the process set temperature.

In the embodiment of the invention, if the temperature control temperature is smaller than the process set temperature, the temperature controller can increase the output of the heating power according to the difference value between the temperature control temperature and the process set temperature so as to increase the temperature.

In an embodiment of the present invention, the substep S12 may further include: and if the temperature control temperature is in the preset temperature range and the temperature values detected by the temperature sensors are all in the preset temperature range, not adjusting the heating power of the heating disc.

In the embodiment of the invention, if the temperature control temperature is within the preset temperature range and the temperature values detected by the plurality of temperature sensors are all within the preset temperature range, the temperature of the heating disc heating the inner liner of the chamber at the moment is higher than the evaporation point of the by-product which is attached to the chamber during the process production, and the by-product of the process can be pumped away by the vacuum pump, so that the heating power of the heating disc does not need to be adjusted at the moment.

In the embodiment of the invention, the semiconductor process equipment comprises a chamber liner, a heating disc and a temperature controller, wherein the heating disc is arranged on the top surface of the chamber liner and is used for heating the chamber liner, and a plurality of temperature sensors are arranged on the heating disc and are used for acquiring temperature values and corresponding weight values detected by the temperature sensors; calculating a weighted average value according to the temperature values detected by the plurality of temperature sensors and the corresponding weight values, and taking the weighted average value as a temperature control temperature; according to the temperature control temperature, adjusting the weight value of the temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value; acquiring a process set temperature; and comparing the recalculated temperature control temperature with the process set temperature, and performing heating control on the heating plate according to the comparison result. Compared with the single-point temperature control mode in the prior art, the invention can adopt the heating disc to heat the chamber liner more comprehensively, and the whole temperature of the chamber liner is reflected more comprehensively through the temperature values detected by the plurality of temperature sensors; the temperature control temperature is obtained by adjusting the weight value corresponding to the temperature sensor, so that the heating plate is heated according to the temperature control temperature and the process set temperature, the overall temperature of the heating plate is dynamically adjusted, the overall temperature reaches the temperature required by the process requirement, and the cleanliness of the chamber and the pollution of products are ensured.

In order to enable those skilled in the art to better understand the dynamic temperature control process of the mica heating plate of the present invention, a complete example is described below. Referring to fig. 8, a calculation flow chart of temperature control adjustment provided by an embodiment of the present invention may specifically include the following steps:

Setting the process setting temperature as T _set, the allowable error temperature as + -T _window, the temperature control temperature as T _input, the temperature sensor as thermocouple, the corresponding detected temperatures as T ₁、T₂、T₃、T₄、T₅、T₆、T₇、T₈ respectively, the corresponding weight values as a ₁、a₂、a₃、a₄、a₅、a₆、a₇、a₈ respectively,

The preset temperature range is as follows: t _set-T_window≤T_input≤T_set+T_window

Upper boundary value of preset temperature range: t _set+T_window

Lower boundary value of preset temperature range: t _set-T_window

Presetting a maximum weight value: a=2 preset minimum weight value: a=0 preset value: 0.1

Step 801, temperature control begins;

step 802, setting an initial weight value corresponding to a temperature value detected by each temperature sensor to be 1;

Step 803, the temperature controller obtains the temperature value detected by each temperature sensor, and calculates the temperature control temperature T _input according to the weight value;

Step 804, determining whether T _input satisfies T _set-T_window≤T_input≤T_set+T_window; if not, go to step 805, if yes, go to step 806;

Step 805, setting T _input as a temperature input value of PID temperature control, controlling the temperature by PID, and then determining whether T _input satisfies T _set-T_window≤T_input≤T_set+T_window again until T _input satisfies, and entering step 806;

Step 806, determining whether all temperatures of T ₁～T₈ are within the range of T _set±T_window; if the temperature control is finished; if not, judging whether the highest temperature value of all the temperatures of the T ₁～T₈ is larger than T _set+T_window and the lowest temperature value is smaller than T _set-T_window; if the highest temperature values of all temperatures of T ₁～T₈ are greater than T _set+T_window and the lowest temperature value is less than T _set-T_window, then step 807 is entered, and if the highest temperature values of all temperatures of T ₁～T₈ are not greater than T _set+T_window or the lowest temperature value is not less than T _set-T_window, then step 808 is entered;

step 807, the mica heating plate fails and gives out alarm information;

Step 808, determining whether the highest temperature value of T ₁～T₈ is greater than or equal to T _set+T_window and the lowest temperature value is greater than or equal to T _set-T_window, if the highest temperature values of all temperatures of T ₁～T₈ are greater than or equal to T _set+T_window and the lowest temperature value is greater than or equal to T _set-T_window, then proceeding to step 809; if not, go to step 814;

Step 809, using a temperature sensor corresponding to the highest temperature value as a first sensor to be adjusted, where the corresponding temperature is T _N, and entering step 810;

Step 810, judging whether a weight value corresponding to a temperature value detected by a first sensor to be adjusted is equal to a preset maximum weight value (2); if the weight corresponding to T _N is equal to 2, step 811 is entered, and if the weight corresponding to T _N is not equal to 2, step 812 is entered;

Step 811, taking the temperature sensor with the highest temperature value from the rest sensors as a first sensor to be adjusted, and proceeding to step 810;

step 812, if the weight value of the first sensor to be adjusted is smaller than the preset maximum weight value, the weight value of the first sensor to be adjusted is increased by a preset value (0.1), and step 813 is performed;

Step 813, judging whether the weight values of the temperature sensors at the current moment are all 2; if the weight values of the temperature sensors at the current moment are all the preset maximum weight values, step 807 is entered; if the weight values of the temperature sensors are not all the preset maximum weight values at the moment, step 803 is entered;

Step 814, if the highest temperature values of all temperatures of T ₁～T₈ are less than T _set+T_window and the lowest temperature value is less than T _set-T_window, go to step 815;

Step 815, using the temperature sensor corresponding to the lowest temperature value as the second sensor to be adjusted, and setting the corresponding temperature to be T _n, and then entering step 816;

Step 816, determining whether the weight value of the second sensor to be adjusted is equal to a preset minimum weight value (0); if the weight value corresponding to T _n is equal to 0, step 817 is entered, and if the weight value corresponding to T _n is greater than 0, step 818 is entered;

Step 817, taking the sensor with the lowest temperature value from the rest temperature sensors as a second sensor to be adjusted, and entering step 816;

Step 818, if the weight value corresponding to T _n is greater than 0, the weight value of the second sensor to be adjusted is reduced by 0.1, and step 819 is entered;

Step 819, after obtaining the updated weight value of the second sensor to be adjusted, determining whether the weight values of the plurality of temperature sensors at the current moment are all 0; if the weight values of the temperature sensors at the current moment are all 0, step 807 is entered; if the weight values of the temperature sensors are not all 0 at the time, the process proceeds to step 803.

It should be noted that, for simplicity of description, the method embodiments are shown as a series of acts, but it should be understood by those skilled in the art that the embodiments are not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred embodiments, and that the acts are not necessarily required by the embodiments of the invention.

Referring to fig. 9, there is shown a block diagram of a semiconductor processing apparatus 901 according to an embodiment of the present invention, the semiconductor processing apparatus 901 includes a process chamber, a chamber liner disposed in the process chamber, a heating plate, and a temperature control device, the temperature control device including a plurality of temperature sensors and temperature controllers distributed on the heating plate; the method specifically comprises the following modules:

the heating plate 9011 is used for heating the chamber liner;

the plurality of temperature sensors 9012 are used for detecting temperature values of different positions of the heating plate;

the temperature controller 9013 is used for executing a dynamic temperature control method of the heating plate.

In an alternative embodiment of the present invention, the semiconductor process apparatus further comprises a heater cover plate, wherein the heater cover plate is disposed on the top surface of the chamber liner, the bottom surface of the heater cover plate is provided with a first annular groove, the upper part of the chamber liner is provided with a second annular groove, and the heating plate is located in the first annular groove and the second annular groove; the heating plate is a mica heating plate, the mica heating plate comprises an upper layer mica sheet, a middle layer mica sheet and a lower layer mica sheet which are overlapped, and heating wires are wound on the middle layer mica sheet.

In the embodiment of the invention, the semiconductor process equipment can further comprise a heater cover plate, wherein the heater cover plate is arranged on the top surface of the chamber liner, the bottom surface of the heater cover plate is provided with a first annular groove, the upper part of the chamber liner is provided with a second annular groove, and the heating plate can be positioned in the first annular groove and the second annular groove; specifically, the heating plate can be a mica heating plate, the mica heating plate is of a sandwich structure, the upper layer clamp plate and the lower layer clamp plate are used for fixing an upper layer mica sheet, a middle layer mica sheet and a lower layer mica sheet through screws, the middle layer mica sheet is wound with a heating wire, and the upper layer mica sheet and the lower layer mica sheet are insulated through point pressing. Because the heating plate is arranged on the inner lining of the cavity, insulation and temperature resistance are needed to be considered, and therefore, the mica heating plate can meet the requirements of insulation and temperature resistance. In particular, a schematic cross-sectional view of a mica heating plate can be seen with reference to FIG. 3.

Wherein, the resistance wire adopted in the annular mica heating plate is wound manually. Specifically, the resistance wire wound by the mica heating plate can be wound in a partition mode, so that the function of partition instant heating control is realized, and the temperature of a local area can be further adjusted under the condition that the whole temperature is raised or lowered to a preset temperature range.

In an optional embodiment of the present invention, the temperature controller is configured to perform heating control on the heating disc according to the temperature control temperature if the temperature control temperature is not within a preset temperature range, until the temperature control temperature is within the preset temperature range; and if the temperature control temperature is in the preset temperature range and the temperature values detected by the temperature sensors are not in the preset temperature range, adjusting the weight value of the temperature sensor, and recalculating the temperature control temperature according to the adjusted weight value.

In an optional embodiment of the present invention, the temperature controller is configured to control the heating plate to reduce the heating power according to a difference between the temperature control temperature and the process set temperature when the temperature control temperature is greater than the process set temperature; when the temperature control temperature is smaller than the process set temperature, the heating disc is controlled to increase heating power according to the difference value between the temperature control temperature and the process set temperature.

In an optional embodiment of the present invention, the temperature controller is configured to determine a highest temperature value and a lowest temperature value among the temperature values detected by the plurality of temperature sensors if the temperature controlled temperature is within the preset temperature range and the temperature value detected by the at least one temperature sensor is not within the preset temperature range; comparing the highest temperature value with an upper boundary value of the preset temperature range, and comparing the lowest temperature value with a lower boundary value of the preset temperature range; the upper boundary value of the preset temperature range is the sum of the process set temperature and the allowable error temperature, and the lower boundary value of the preset temperature range is the difference between the process set temperature and the allowable error temperature; if the highest temperature value is greater than or equal to the upper boundary value of the preset temperature range and the lowest temperature value is greater than or equal to the lower boundary value of the preset temperature range, increasing the weight value of one temperature sensor in the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value; and if the highest temperature value is smaller than the upper boundary value of the preset temperature range and the lowest temperature value is smaller than the lower boundary value of the preset temperature range, reducing the weight value of one temperature sensor in the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value.

In an optional embodiment of the present invention, the temperature controller is configured to determine whether a weight value of the first sensor to be adjusted is equal to a preset maximum weight value, if the maximum temperature value is greater than or equal to an upper boundary value of a preset temperature range, and the minimum temperature value is greater than or equal to a lower boundary value of the preset temperature range, using a temperature sensor corresponding to the maximum temperature value as the first sensor to be adjusted; if the weight value of the first sensor to be adjusted is equal to the preset maximum weight value, taking the sensor with the highest temperature value from the rest temperature sensors as the first sensor to be adjusted and returning to the step of judging whether the weight value of the first sensor to be adjusted is equal to the preset maximum weight value; if the weight value of the first sensor to be adjusted is smaller than the preset maximum weight value, the weight value of the first sensor to be adjusted is increased by a preset value, and the updated weight value of the first sensor to be adjusted is obtained; and recalculating the temperature control temperature according to the updated weight value of the first sensor to be adjusted.

In an optional embodiment of the present invention, the temperature controller is configured to determine whether the weight values of the plurality of temperature sensors at the current moment are all the preset maximum weight values after obtaining the updated weight value of the first sensor to be adjusted; if the weight values of the temperature sensors at the current moment are not all the preset maximum weight values, recalculating the temperature control temperature according to the weight values of the temperature sensors at the current moment.

In an optional embodiment of the present invention, the temperature controller is configured to determine that the heating disc fails and send out alarm information if the weight values of the plurality of temperature sensors at the current moment are all the preset maximum weight values.

In an optional embodiment of the present invention, the temperature controller is configured to determine, if the maximum temperature value is smaller than an upper boundary value of the preset temperature range and the minimum temperature value is smaller than a lower boundary value of the preset temperature range, whether a weight value of the second sensor to be adjusted is equal to a preset minimum weight value by using a temperature sensor corresponding to the minimum temperature value as the second sensor to be adjusted; if the weight value of the second sensor to be adjusted is equal to the preset minimum weight value, taking the sensor with the lowest temperature value from the rest temperature sensors as the second sensor to be adjusted, and returning to the step of judging whether the weight value of the second sensor to be adjusted is equal to the preset minimum weight value; if the weight value of the second sensor to be adjusted is larger than the preset minimum weight value, reducing the weight value of the second sensor to be adjusted by a preset value to obtain an updated weight value of the second sensor to be adjusted; and recalculating the temperature control temperature according to the updated weight value of the second sensor to be adjusted.

In an optional embodiment of the present invention, the temperature controller is configured to determine whether the weight values of the plurality of temperature sensors at the current moment are all the preset minimum weight values after obtaining the updated weight value of the second sensor to be adjusted; and if the weight values of the temperature sensors at the current moment are not all the preset minimum weight values, re-determining the temperature control temperature according to the weight values of the temperature sensors at the current moment.

In an optional embodiment of the present invention, the temperature controller is configured to determine that the heating disc is faulty and send out alarm information if the weight values of the plurality of temperature sensors at the current moment are all the preset minimum weight values.

In an optional embodiment of the present invention, the temperature controller is configured to determine that the heating plate fails and send out an alarm message if the maximum temperature value is greater than an upper boundary value of the preset temperature range and the minimum temperature value is less than a lower boundary value of the preset temperature range.

In an optional embodiment of the present invention, the temperature controller is further configured to not adjust the heating power of the heating disc if the temperature controlled temperature is within the preset temperature range and the temperature values detected by the plurality of temperature sensors are all within the preset temperature range.

For the device embodiments, since they are substantially similar to the method embodiments, the description is relatively simple, and reference is made to the description of the method embodiments for relevant points.

In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

It will be apparent to those skilled in the art that embodiments of the present invention may be provided as a method, apparatus, or computer program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the invention may take the form of a computer program product on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.

Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the invention.

Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or terminal device that comprises the element.

The above description of the dynamic temperature control method of the heating plate and the semiconductor process equipment provided by the invention applies specific examples to illustrate the principles and embodiments of the invention, and the above examples are only used to help understand the method and core ideas of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.

Claims

1. A method of dynamically controlling temperature of a heating platen, wherein a semiconductor processing apparatus comprises a chamber liner and a heating platen disposed on a top surface of the chamber liner for heating the chamber liner, the heating platen being provided with a plurality of temperature sensors, the method comprising:

Acquiring a process set temperature;

2. The method of claim 1, wherein adjusting the weight value of the temperature sensor according to the temperature control temperature and recalculating the temperature control temperature according to the adjusted weight value comprises:

3. The method of claim 2, wherein the heating of the heating plate is controlled based on the comparison result, comprising:

4. The method of claim 2, wherein adjusting the weight value of the temperature sensor if the temperature control temperature is within the preset temperature range and the temperature value detected by the at least one temperature sensor is not within the preset temperature range, and recalculating the temperature control temperature according to the adjusted weight value, comprises:

5. The method of claim 4, wherein if the maximum temperature value is greater than or equal to an upper boundary value of the preset temperature range and the minimum temperature value is greater than or equal to a lower boundary value of the preset temperature range, increasing the weight value of one of the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value, comprises:

if the weight value of the first sensor to be adjusted is equal to the preset maximum weight value, taking the temperature sensor with the highest temperature value from the rest sensors as the first sensor to be adjusted and returning to the step of judging whether the weight value of the first sensor to be adjusted is equal to the preset maximum weight value;

6. The method of claim 5, wherein recalculating the temperature control temperature based on the updated weight value of the first sensor to be adjusted comprises:

7. The method as recited in claim 6, further comprising:

8. The method of claim 4, wherein if the maximum temperature value is less than an upper boundary value of the preset temperature range and the minimum temperature value is less than a lower boundary value of the preset temperature range, reducing the weight value of one of the plurality of temperature sensors, and recalculating the temperature control temperature according to the adjusted weight value, comprises:

9. The method of claim 8, wherein recalculating the temperature-controlled temperature based on the updated weight value of the second sensor to be adjusted comprises:

After obtaining the updated weight value of the second sensor to be adjusted, judging whether the weight values of the temperature sensors at the current moment are all the preset minimum weight values;

10. The method as recited in claim 9, further comprising:

11. The method as recited in claim 4, further comprising:

12. The method as recited in claim 2, further comprising:

13. The semiconductor process equipment is characterized by comprising a process chamber, a chamber liner arranged in the process chamber, a heating plate and a temperature control device, wherein the temperature control device comprises a plurality of temperature sensors and temperature controllers distributed on the heating plate;

The heating plate is used for heating the chamber liner;

the temperature controller is used for executing the dynamic temperature control method of the heating plate according to the claims 1-12.

14. The semiconductor processing apparatus of claim 13, further comprising a heater cover plate disposed on a top surface of the chamber liner, a bottom surface of the heater cover plate having a first annular groove, an upper portion of the chamber liner having a second annular groove, the heating plates being positioned within the first and second annular grooves;