CN117949755A - Test equipment and test system - Google Patents

Abstract

The application discloses test equipment and a test system, wherein the test equipment is provided with a first electronic element used for testing equipment to be tested on one side surface of a first plate body, a first electric connecting piece used for being electrically connected with the equipment to be tested is arranged on the other side surface of the first plate body, the test equipment can be loaded above a preset area of the equipment to be tested corresponding to the target electronic element based on the first electric connecting piece, the preset area of the equipment to be tested is provided with the target electronic element and a second electronic element, the height of the first electric connecting piece is larger than that of the second electronic element, and a gap is reserved between the first plate body and the second electronic element in the preset area. When the equipment to be tested is tested through the testing equipment, the testing equipment can be directly loaded above the preset area based on the gap, and the equipment can not collide with the second electronic element, and the electrical connection between the equipment to be tested and the testing equipment is realized without welding wires or other switching structures.

Description

Test equipment and test system

Technical Field

The application relates to the technical field of electronic equipment testing devices, in particular to testing equipment and a testing system.

Background

With the continuous development of science and technology, more and more electronic devices are widely applied to daily life and work of people, bring great convenience to daily life and work of people, and become an indispensable important tool for people at present.

In order to ensure that the electronic equipment can normally operate, the electronic equipment is required to be used as equipment to be tested, the electronic equipment is tested through the testing equipment, the working parameters of electronic elements in the electronic equipment are tested, and the performance of the electronic equipment is determined based on the working parameters.

In the prior art, in order to avoid collision between the testing device and the electronic component in the testing device, the testing device cannot be directly loaded on the electronic device for testing, the testing device needs to be arranged on the same plane as the device to be tested, and the electrical connection between the device to be tested and the testing device needs to be realized through a bonding wire or other switching structures, so that the testing device is inconvenient to use.

Disclosure of Invention

In view of the above, the present application provides a testing device and a testing system, and the scheme is as follows:

A test apparatus comprising:

A first plate body having opposite first and second surfaces;

A first electronic component disposed on the first surface;

The first electric connector is arranged on the second surface and is used for loading the first plate body above a preset area of the equipment to be tested so as to replace a target electronic element in the preset area to execute a test on the equipment to be tested, wherein the preset area is provided with the target electronic element and a second electronic element arranged on the periphery of the target electronic element;

The first electric connector is provided with a first height, the second electronic element is provided with a second height, and the first height is larger than the second height, so that a gap is reserved between the first plate body and the second electronic element when the testing equipment is loaded above the preset area.

Optionally, in the test apparatus, the first electrical connector has a pad and a conductive pad fixed on a side of the pad facing away from the first board body, so that the first connector has a first height.

Optionally, in the above test apparatus, the first electrical connector includes an input terminal and an output terminal;

The distance between the input end and the output end is adapted to the distance between the input pin and the output pin of the target electronic element, so that the test equipment can replace the target electronic element to be electrically connected with the equipment to be tested.

Optionally, in the above test apparatus, further includes: a cover, wherein the cover and the first plate form a shielding space for preventing the first electronic element from electromagnetic interference;

The first surface is also provided with an output port positioned outside the sealing cover so as to output the electric parameters acquired by the testing equipment to the external detecting equipment.

Optionally, in the above test apparatus, the target electronic component is a target power inductance; when the test equipment is loaded above the preset area, the test equipment is used for replacing the target power inductor so as to test the electric parameters of the power chip connected with the target power inductor.

Optionally, in the above test apparatus, the first electronic component includes:

sampling a resistor;

calibrating a power inductor, wherein one end of the power inductor is connected with an input end, and the other end of the power inductor is connected with an output end through a sampling resistor;

The first surface is provided with an output port connected with the sampling resistor so as to output the electric parameters acquired by the testing equipment to the external detection equipment.

Optionally, in the above test apparatus, the sampling resistor includes a plurality of resistive elements;

wherein a first sampling resistor obtained based on a combination of a plurality of resistive elements is adaptable to an output parameter of the power supply chip;

Or, the sampling resistor is an adjustable resistor, wherein a second sampling resistor obtained based on the adjustable resistor can be adapted to an output parameter of the power supply chip.

The application also provides a test system, comprising:

A first test apparatus, the first test apparatus comprising: a first plate body having opposite first and second surfaces; a first electronic component disposed on the first surface; a first electrical connector disposed on the second surface;

the device to be tested comprises a first preset area, wherein the first preset area is provided with a first target electronic element and a second electronic element placed on the periphery of the first target electronic element;

The first electric connector is used for bearing the first board body and loading the first board body above a first preset area of the equipment to be tested so as to replace a first target electronic element of the first preset area to execute test on the equipment to be tested; the first electrical connector has a first height, the second electrical component has a second height, and the first height is greater than the second height, such that a gap is provided between the first board and the second electrical component when the test apparatus is loaded over the first predetermined area.

Alternatively, in the above-described test system,

The equipment to be tested comprises a second preset area, and the second preset area is provided with a second target electronic element;

The test system further comprises a second test device comprising: a second plate body having opposite third and fourth surfaces; a fourth electronic component disposed on the third surface; a second electrical connector disposed on the fourth surface;

the second electric connector is used for bearing a second board body and loading the second board body above a second preset area of the equipment to be tested so as to replace a second target electronic element in the second preset area to execute test on the equipment to be tested;

The first distance between the input end and the output end of the first electric connector is matched with the distance between the input pin and the output pin of the first target electronic element, the second distance between the input end and the output end of the second electric connector is matched with the distance between the input pin and the output pin of the second target electronic element, and the first distance and the second distance are different.

Optionally, in the above test system, the first surface is further provided with a first output port, so as to output the electrical parameter collected by the first test device to an external detection device;

The third surface is also provided with a second output port so as to output the electric parameters acquired by the second testing equipment to the external detecting equipment for simultaneous detection of the equipment to be tested.

As can be seen from the foregoing description, in the test device and the test system provided by the technical solution of the present application, a first electrical connector for electrically connecting with a device to be tested is provided on one side surface of a first board body, and based on the first electrical connector, the test device can be loaded above a preset area of the device to be tested corresponding to a target electronic component, so that the device to be tested is tested by the target electronic component in the preset area, a second electronic component is further provided on the device to be tested, and the height of the first electrical connector is greater than that of the second electronic component. Since the height of the first electrical connector is greater than that of the second electronic component, a gap can be formed between the second surface of the first board body and the second electronic component in the preset area. When the equipment to be tested is tested through the testing equipment, the testing equipment can be directly loaded above the preset area based on the gap, and the equipment can not collide with the second electronic element, so that the equipment to be tested is electrically connected with the testing equipment without welding wires or other switching structures, and the equipment to be tested is convenient to test.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings required for the description of the embodiments or the prior art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to the provided drawings without inventive effort to those skilled in the art.

The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and therefore should not be construed as limiting the application, but rather as limiting the scope of the application, so that any structural modifications, proportional changes, or dimensional adjustments should fall within the scope of the application without affecting the efficacy or achievement thereof.

FIG. 1 is a schematic structural diagram of a test apparatus according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a device to be tested according to an embodiment of the present application;

FIG. 3 is a schematic diagram of the testing of the device under test shown in FIG. 2 based on the testing device shown in FIG. 1;

FIG. 4 is a schematic structural diagram of another test apparatus according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of another test apparatus according to an embodiment of the present application;

FIG. 6 is a top view of a device under test according to an embodiment of the present application;

FIG. 7 is a top view of a test apparatus facing a first surface according to an embodiment of the present application;

FIG. 8 is a top view of a test apparatus facing a second surface according to an embodiment of the present application;

FIG. 9 is a top view of a test system according to an embodiment of the present application;

Fig. 10 is a top view of another test system according to an embodiment of the present application.

Detailed Description

Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which it is shown, however, in which some, but not all embodiments of the application are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description.

Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a test device provided by an embodiment of the present application, fig. 2 is a schematic structural diagram of a device to be tested provided by an embodiment of the present application, and fig. 3 is a schematic structural diagram of a device to be tested based on the test device shown in fig. 1 to test the device to be tested shown in fig. 2, where the test device includes:

a first plate body 10, the first plate body 10 having opposite first and second surfaces 101 and 102;

A first electronic component 11 disposed on the first surface 101;

The first electrical connector 12 is disposed on the second surface 102, and the first electrical connector 12 is configured to carry the first board 10 to be loaded above a preset area of the device under test 20, so as to replace a target electronic component 22 in the preset area to perform a test on the device under test, where the preset area is provided with the target electronic component 22 and a second electronic component 21 disposed around the target electronic component 22; the target electronic component 22 and the second electronic component 21 are different types of electronic components in the device 20 to be tested.

The first electrical connector 12 has a first height H1, the second electronic component 21 has a second height H2, and the first height H1 is greater than the second height H2, so that a gap 30 is formed between the first board 10 and the second electronic component 21 when the test apparatus is loaded above the predetermined area.

In the test apparatus provided in the embodiment of the present application, the first electrical connector 12 for electrically connecting with the apparatus 20 to be tested is disposed on one side surface (i.e., the second surface 102) of the first board 10, and based on the first electrical connector 12, the test apparatus can be loaded onto the apparatus 20 to be tested above the preset area corresponding to the target electronic component 22, and the height of the first electrical connector 12 is set to be greater than the height of the second electronic component 21, so that the gap 30 is formed between the second surface 102 of the first board 10 and the second electronic component 21 in the preset area. When the device 20 to be tested is tested by the testing device, based on the gap 30, the testing device can be directly loaded above the preset area and cannot collide with the second electronic element 21, and the first electric connector is used for realizing electric connection between the device 20 to be tested and the testing device, so that the device 20 to be tested is conveniently tested. Meanwhile, the test equipment can be reused, and compared with the prior art, the test cost is greatly reduced.

In the embodiment of the present application, when the device 20 to be tested is tested by the testing device, the target electronic component 22 in the device 20 to be tested needs to be removed, so that the device 20 to be tested is electrically connected with the target electronic component 22 replaced by the testing device.

Referring to fig. 4, fig. 4 is a schematic structural diagram of another test apparatus according to the embodiment of the present application, and on the basis of the above-mentioned manner, as shown in fig. 1,2 and 4, the first electrical connector 12 has a bonding pad 13 and a conductive pad 14 fixed on a side of the bonding pad 13 facing away from the first board body 10, so that the first connector has the first height H1.

In the manner shown in fig. 4, the conductive pads 14 are provided on the surface of the pads 13, and by providing the height of the conductive pads 14, the first electrical connection 14 can be made to have a desired first height H1.

Optionally, the first connector 12 includes an input 121 and an output 122. The distance between input 121 and output 122 is adapted to the distance between input pin 221 and output pin 222 of target electronic component 22 to facilitate the test device replacing target electronic component 22 to be electrically connected to device under test 20.

There may be provided two first electrical connectors 12 as an input 121 and an output 122, respectively. When the two first electrical connectors 12 each include the bonding pad 13 and the conductive pad 14 as shown in fig. 4, the distance L1 between the two conductive pads 14 is adapted to the distance L2 between the input pin 221 and the output pin 222 of the target electronic component 22, and the two conductive pads 14 are used for respectively connecting the input pin 221 and the output pin 222, so that the test device replaces the target electronic component 22 to be electrically connected with the device to be tested 20.

Alternatively, the height of the conductive pad 14 may range from 1mm to 20mm, which may be set based on requirements, and the embodiment of the present application is not limited thereto.

The distance L1 between the two conductive pads 14 and the distance L2 between the input pin 221 and the output pin 222 of the target electronic component 22 are adapted to indicate that L1 is equal to L2, or that L1 is approximately equal to L2, so that when the target electronic component 22 is removed during the test of the device to be tested 20 by the test device, the two conductive pads 14 can be respectively connected to two electrical connection positions of the device to be tested 20 for connecting the input pin 221 and the output pin 222, so that the test device replaces the target electronic component 22 to be electrically connected to the device to be tested 20.

Optionally, in the same first electrical connector 12, the conductive pads 14 are soldered to the conductive surfaces of the corresponding pads 13 by a solder layer. In the direction of the line connecting the two pads 13 (horizontal direction in fig. 4), the width of the pad 13 is larger than the width of the conductive pad 14. Preferably, the width of the set pad 13 is not less than 1.5 times the width of the conductive pad 14. Since the width of the pad 13 is greater than the width of the conductive pad 14, the value of L1 can be adjusted based on adjusting the welding position of the conductive pad 14 on the surface of the pad 13, so as to adapt to the preset area corresponding to different values of L2. In addition, the conductive pads 14 are soldered to the conductive surfaces of the corresponding pads 13 by a solder layer, and the conductive pads 14 of a desired height can be replaced on demand to accommodate second electronic components 21 having different heights.

Referring to fig. 5, fig. 5 is a schematic structural diagram of still another test apparatus according to an embodiment of the present application, where, based on any one of the foregoing test apparatus implementations, the test apparatus shown in fig. 5 further includes: a cover 15, the cover 15 and the first board 10 forming a shielding space 16 for preventing the first electronic component 11 from electromagnetic interference; wherein the first surface 101 is further provided with an output port 17 located outside the cover 15 for outputting the electrical parameters collected by the testing device to an external detection device.

The cover 15 is a metal case. The first board body 10 can be provided with a grounding layer, and the grounding layer and the sealing cover 15 form an electromagnetic shielding space 16, so that electromagnetic interference caused by external electromagnetic signals to the first electronic element 11 can be avoided, and electromagnetic interference caused by the first electronic element 11 to the electronic element in the equipment 20 to be tested below can be prevented.

Referring to fig. 6, fig. 6 is a top view of a device to be tested according to an embodiment of the present application, where the device to be tested 20 includes a system-in-chip 23, the system-in-chip 23 has n power input ports, and the n power input ports are sequentially the 1 st power input port D1 to the n power input port Dn, where n is a positive integer greater than 1. Each power input port is connected with one power supply line. The power supply line includes a target power inductor 24 and a power chip 25, and in the same power supply line, the power chip 25 provides electric energy for the corresponding power input port through the corresponding target power inductor 24. The power chip 25 may be a Buck-Boost converter (Buck/Boost). The distance between the input pin and the output pin of the target power inductor 24 may be the same or different in different power supply lines.

In one implementation of the present embodiment, the target electronic component 22 is a target power inductor; when the test equipment is loaded above the preset area, the test equipment is used for replacing the target power inductor so as to test the electric parameters of the power chip 25 connected with the target power inductor. By adopting the test equipment provided by the embodiment of the application, the electrical parameters of the power chip 25 in the equipment to be tested 20 can be tested, so that the power consumption of the chip in the equipment to be tested 20 can be verified and debugged conveniently. In one embodiment, the electrical parameter may be a current parameter, and as such, the external detection device may detect a current waveform of the device under test to optimize the power consumption level of the test device.

When the target electronic component 22 is the target power inductor, the package corresponding to the test device can be matched with the target power inductor, the test device can be compatible with the conventional package mode of the power inductor, the test device is a standardized test module capable of supporting multiple package standards, and the test device can be matched with the target power inductor in different package modes.

The target power inductance 24 may be any one of 1210, 1218, 2010, 2512, and 2520 packaged patch inductances. When the target electronic component 22 is the target power inductors 24, each target power inductor 24 corresponds to a predetermined area. The target power inductances 24 may be the same or different in different predetermined regions.

When the target electronic component 22 is the target power inductor, the testing device loads the two first electrical connectors 12 adapted to the input pins and the output pins of the target power inductor 24 above the preset area corresponding to the target power inductor 24 so as to raise the height of the testing device above the preset area, and prevent the testing device from colliding with the second electronic component 21 in the preset area. Meanwhile, the test equipment is a modularized test piece, can be reused, and greatly reduces the test cost compared with the prior art.

Optionally, the device to be tested 20 comprises a system-on-a-chip (SoC), which is a common type of chip in electronic devices. With the higher and higher integration level of the system-level chip, the performance of the system-level chip is more and more powerful, and the requirement for saving the power consumption of the system-level chip is increasing. In order to achieve a power-saving design of the system-on-chip, the power consumption of the system-on-chip needs to be verified and debugged by the test equipment. It is common practice in the industry to make a single power board as a test device for power consumption debugging of a system-on-chip. However, the current power consumption board has large area, high manufacturing cost and large design difficulty. In order to avoid collision between the power board and the electronic components on the surface of the device 20 to be tested, the power board and the device 20 to be tested are generally disposed on the same plane, and the power board needs to be electrically connected to the device 20 to be tested through a welding wire or other switching structure (such as a connector), which occupies a relatively large testing space and is inconvenient to use.

The test equipment provided by the embodiment of the application can be used for verifying and debugging the power consumption of the system-level chip, and a standard sum test module is formed as the test equipment through an integrated structure, so that the test equipment can take the function of a power consumption board into consideration. Meanwhile, the test equipment is a modularized test piece, can be reused, and greatly reduces the test cost compared with the prior art. In addition, since the height of the first electrical connector 12 is greater than the height of the second electronic component 21, when the device 20 to be tested is tested by the testing device, the testing device can be directly loaded above the preset area of the device 20 to be tested, so that the relative arrangement of the testing device and the device 20 to be tested in the height direction is realized, the three-dimensional test of the device 20 to be tested is realized, the occupied space in the testing process is reduced, and the device 20 to be tested is conveniently tested.

Referring to fig. 7 and 8, fig. 7 is a top view of a testing apparatus facing a first surface according to an embodiment of the present application, and fig. 8 is a top view of a testing apparatus facing a second surface according to an embodiment of the present application, where in the testing apparatus provided in any of the foregoing embodiments, the second surface 102 is provided with two first electrical connectors 12, and the two first electrical connectors 12 serve as an output end 122 and an input end 121 of the testing apparatus, respectively.

The first electronic component 11 includes: a sampling resistor 112; the power calibration inductor 111, one end of the power calibration inductor 111 is connected with the input end 121 of the test equipment, and the other end of the power calibration inductor 111 is connected with the output end 122 of the test equipment through the sampling resistor 112; the first surface 101 is provided with output ports 17 connected to two ends of the sampling resistor 112, so as to output the electrical parameters collected by the testing device to an external detection device.

The output port 17 may be an ADC (analog/digital converter) standard test port, among others. The output port 17 includes at least two pins for respectively connecting two ends of the sampling resistor 112. Alternatively, the cover 15 may be fixed on the first surface 101, and the sampling resistor 112 and the calibration power inductor 111 are both located inside the cover 15, and the output port 17 is located outside the cover 15.

The test device is a standardized test module comprising a calibrated power inductor 111 and a sampling resistor 112, the resistance value of the sampling resistor 112 being adjustable so that the test device can adapt to the current required to connect to the power chip 25.

The size of the first board body 10 in the test apparatus is larger than the size of the target electronic component 22 in the corresponding preset area. The first surface 101 has integrated therein a sampling resistor 112 and calibration electronics identical to the target electronics 22, the calibration electronics being a calibration power inductance 111 when the target electronics 22 is the target power inductance 24.

The test apparatus may set the input terminal 121 and the output terminal 122 having the fitting distance based on the corresponding target element 22, and set the first electrical connector 12 having the fitting height based on the height of the second electronic element 21 in the preset area, so that the test apparatus may be adapted to different test environments. The external detection equipment can be plugged and sampled with the ADC standard test port, so that the voltage stability and the differential wiring in the test system are not affected. The external detection equipment comprises a test instrument, and can be directly spliced with an ADC standard test port to acquire adopted data without welding.

In one implementation of the present embodiment, as shown in FIG. 7, sampling resistor 112 includes a plurality of resistive elements 18. Obtaining the first sampling resistance based on the combination of the plurality of resistive elements 18 can be adapted to the output parameters of the power chip 25. For example, a desired number of the plurality of resistive elements 18 may be connected in parallel between the output 122 of the test device and the nominal power inductance 111 as a first sampling resistor; the resistance of the first sampling resistor is adapted to the output parameters of the power chip 25. Based on the output parameters of the connected power chip 25, the resistance of the sampling resistor 112 connected to the power supply line in the test device is set, so that the resistance of the sampling resistor 112 connected to the circuit and the power supply capability of the power chip 25 are adapted, thereby ensuring that the electrical parameters of the test device, which can be the voltage and/or the current output by the power chip 25, can be normally tested.

In another implementation of the embodiment of the present application, the sampling resistor 112 may also be configured to include an adjustable resistor, wherein a second sampling resistor obtained based on the adjustable resistor is capable of adapting to the output parameter of the power chip 25. In this way, the second sampling resistor is formed by an adjustable resistor connected between the output terminal 122 of the test device and the calibration power inductor 111, so that the resistance value of the sampling resistor 112 connected to the circuit and the power supply capability of the power chip 25 are adapted, thereby ensuring that the test device can normally test the electrical parameter of the power chip 25, which may be the voltage and/or the current output by the power chip 25. The adjustable resistor includes a knob for adjusting the resistance value. In this manner, the test apparatus can be applied to the power supply chips 25 having different output parameters.

The test equipment provided by the embodiment of the application is used for testing and sampling the equipment to be tested 20, and high-cost power consumption plates are not required to be correspondingly arranged for different equipment to be tested 20 respectively, so that the test equipment can be flexibly disassembled and can be reused, the test cost is reduced, and the product development time and the test cost are saved. The multiple power supply lines in the device under test 20 may be tested simultaneously to obtain electrical parameters in the multiple power supply lines simultaneously for power consumption analysis. The test device can replace the target electronic element 22, and when the target electronic element 22 is the target power inductor 24 connected with the power chip 25, the test device replaces the target power inductor 24 to be connected into the corresponding power supply circuit, so that the stability of the output voltage of the power chip 25 is not affected.

In another implementation manner of the embodiment of the present application, a test system is also provided, and the test system may be as shown in fig. 9.

Referring to fig. 9, fig. 9 is a top view of a test system according to an embodiment of the present application, and in combination with the foregoing drawings and the fig. 9, the test system includes:

First test device 41, first test device 41 comprising: a first plate body 10, the first plate body 10 having opposite first and second surfaces 101 and 102; a first electronic component 11 disposed on the first surface 101; a first electrical connector 12 disposed on the second surface 102; the first test device may be a test device provided by any of the above embodiments;

The device to be tested 20, the device to be tested 20 comprises a first preset area 51, and the first preset area 51 is provided with a first target electronic component and a second electronic component placed on the periphery of the first target electronic component; the device under test 20 includes at least a predetermined area as a first predetermined area 51. The target electronic component 22 in the predetermined area is a first target electronic component.

Wherein the first electrical connector 12 is configured to load the first board 10 onto the first preset area 51 of the device 20 to be tested, so as to replace the first target electronic component of the first preset area 51 to perform a test on the device 20 to be tested; the first electrical connector 12 has a first height H1, the second electronic component 21 has a second height H2, and the first height H1 is greater than the second height H2, such that a gap 30 is provided between the first board 10 and the second electronic component 21 when the test apparatus is loaded over the first predetermined area 51.

Referring to fig. 10, fig. 10 is a top view of another test system according to an embodiment of the present application, where a device to be tested includes a second preset area 52, where the second preset area 52 is provided with a second target electronic component; the second preset area 52 is another preset area in the device to be tested, and the target electronic component 22 in the preset area is a second target electronic component.

The test system further comprises a second test device 42, the second test device 42 comprising: a second plate body having opposite third and fourth surfaces; a fourth electronic component disposed on the third surface; a second electrical connector disposed on the fourth surface; the second test device 42 may be similar in structure to the first test device 41, and thus the second test device 42 may be a test device provided by any of the above-described embodiments.

The second electrical connector is configured to load the second board onto the second preset area 52 of the device to be tested 20 to replace the second target electronic component of the second preset area 52 to perform the test on the device to be tested 20.

Wherein a first distance between the input terminal 121 and the output terminal 122 of the first electrical connector 12 is adapted to a distance between the input pin 221 and the output pin 222 of the first target electronic component, and a second distance between the input terminal 121 and the output terminal 122 of the second electrical connector is adapted to a distance between the input pin 221 and the output pin 222 of the second target electronic component, the first distance and the second distance being different.

The two dashed boxes in fig. 9 represent the first preset area 51 and the second preset area 52, respectively. The first preset area 42 can be used for loading the first test device 41 and the second preset area 52 can be used for loading the second test device 42. For convenience of illustration, the test device is arranged in the corresponding preset area, and in other modes, the test device and the corresponding preset area can be completely overlapped, or the test device is arranged to completely cover the corresponding preset area, and a space is reserved between the edge of the plate body of the test device and the edge of the preset area.

Both the first test device 41 and the second test device 42 may be test devices provided in any of the above embodiments. The structure and the relative loading manner of the test device and the corresponding preset area may be described with reference to the above embodiments, and will not be described in detail in the test system embodiment.

Optionally, as shown in fig. 9, the first surface is further provided with a first output port, so as to output the electrical parameter collected by the first test device 41 to the external detection device 43; the third surface is further provided with a second output port for outputting the electrical parameters collected by the second testing device 42 to the external detecting device 43 for simultaneous detection of the device under test. The first test device 41 and the second test device 42 each have an output port 17, the output port 17 in the first test device 41 being a first output port, and the output port 17 in the second test device 42 being a second output port.

Based on the test system provided by the embodiment of the application, the device 20 to be tested can be tested through the test device, and the electrical parameters related to the device 20 to be tested can be obtained. Since the height of the electrical connector in the test apparatus is greater than the height of the second electronic component 21, a gap 30 can be provided between the board body of the test apparatus and the second electronic component 21 in the predetermined area. When the device 20 to be tested is tested by the testing device, based on the gap 30, the testing device can be directly loaded above the corresponding preset area and can not collide with the second electronic element 21, and the device 20 to be tested is electrically connected with the testing device without a welding wire or other switching structures, so that the device 20 to be tested is conveniently tested.

The test system has at least two test devices for loading onto the first preset area 51 and onto the second preset area 52, respectively; the spacing between the input 121 and output 122 of each test device is adapted to the distance between the input pin 221 and the output pin 222 of the target electronic component 22 in the corresponding predetermined area. In this way, the first preset area 51 and the second preset area 52 may be loaded with adapted test equipment, respectively, so that the target electronic components 22 in the first preset area 41 and the second preset area 42 can be replaced simultaneously to measure the electrical parameters of the corresponding power chips 25 simultaneously.

When the device to be tested 20 has a plurality of preset areas, the device to be tested 20 can load a plurality of test devices at the same time, and different test devices are loaded above different preset areas; the test equipment is connected to the same external test equipment 43. Such as to enable testing of electrical parameters of a plurality of power chips 25 based on the same external detection device 43. The external detection device 43 can be a current acquisition card, and the ADC standard test ports of different test devices can be connected to the same current acquisition card so as to realize multi-channel synchronous test and data acquisition.

As described above, the device 20 to be tested includes the system-on-chip 23, and the system-on-chip 23 generally requires tens or even tens of power supply lines, and the different power supply lines respectively require different power supply chips 25 to be independently supplied with power, resulting in a shortage of the mounting area of the electronic components on the circuit board 201. Because of the high density of electronic components on the circuit board 201, conventional power boards cannot simultaneously test the electrical parameters of multiple power supply lines. According to the test equipment provided by the embodiment of the application, based on the set gap 30, the test equipment can be directly loaded above the corresponding preset area, the three-dimensional test can be performed on the equipment to be tested 20 in the vertical direction, meanwhile, the test equipment with the intervals of the input end 121 and the output end 122 adapted to different preset areas can be respectively arranged, and the simultaneous test of multiple power supply lines is realized. For example, the current values in the multi-path power supply line can be measured at the same time, so as to determine the chip power consumption of the power supply line.

In the above-described test system, the electrical connectors may have the same height in all the test devices, and the height of the electrical connectors is not smaller than the height of the second electronic component 21 having the largest height in the device 20 to be tested. In this way, if the heights of the second electronic components 21 in the two preset areas are different, it is also possible to use test equipment having electrical connectors of the same height, respectively.

In other manners, the height of the electrical connector in each test device may be set to be associated with the height of the second electronic component 21 in the corresponding preset area, and the greater the height of the second electronic component 21 in the corresponding preset area, the greater the height of the electrical connector.

In the description of the present application, each embodiment is described in a progressive manner, or in parallel manner, or in a combination of progressive and parallel manners, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other. The embodiments provided by the embodiments of the present application may be combined with each other without contradiction.

It is to be noted, however, that the description of the drawings and embodiments are illustrative and not restrictive. Like reference numerals refer to like structures throughout the embodiments of the specification. In addition, the drawings may exaggerate the thicknesses of some layers, films, panels, regions, etc. for understanding and ease of description. It will also be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present. In addition, "on …" refers to positioning an element on or under another element, but not essentially on the upper side of the other element according to the direction of gravity.

The terms "upper," "lower," "top," "bottom," "inner," "outer," and the like are used for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in an article or device comprising the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A test apparatus, comprising:

A first plate body having opposed first and second surfaces;

A first electronic component disposed on the first surface;

the first electric connector is arranged on the second surface and used for bearing the first board body to be loaded above a preset area of equipment to be tested so as to replace a target electronic element in the preset area to execute testing on the equipment to be tested, wherein the preset area is provided with the target electronic element and a second electronic element placed on the periphery of the target electronic element;

The first electrical connector has a first height, the second electrical component has a second height, the first height is greater than the second height, and when the test equipment is loaded above the preset area, a gap is formed between the first board and the second electrical component.

2. The test apparatus of claim 1, wherein a first electrical connector has a pad and a conductive pad secured to a side of the pad facing away from the first plate such that the first connector has the first height.

3. The test apparatus of claim 1, wherein the first electrical connection comprises an input and an output;

The distance between the input end and the output end is adapted to the distance between the input pin and the output pin of the target electronic element, so that the test equipment can replace the target electronic element to be electrically connected with the equipment to be tested.

4. The test apparatus of claim 1, further comprising: a cover forming a shielding space with the first board for preventing the first electronic component from electromagnetic interference;

The first surface is further provided with an output port positioned outside the sealing cover so as to output the electric parameters acquired by the testing equipment to external detection equipment.

5. The test apparatus of claim 1, wherein the target electronic component is a target power inductance; and when the test equipment is loaded above the preset area, the test equipment is used for replacing the target power inductor so as to test the electric parameters of the power chip connected with the target power inductor.

6. A test device according to claim 3, wherein the first electronic component comprises:

sampling a resistor;

Calibrating a power inductor, wherein one end of the power inductor is connected with the input end, and the other end of the power inductor is connected with the output end through the sampling resistor;

The first surface is provided with an output port connected with the sampling resistor so as to output the electric parameters acquired by the testing equipment to external detection equipment.

7. The test apparatus of claim 6, wherein the sampling resistor comprises a plurality of resistive elements;

Wherein a first sampling resistor obtained based on a combination of the plurality of resistive elements is adaptable to an output parameter of the power chip;

or, the sampling resistor comprises an adjustable resistor, wherein a second sampling resistor obtained based on the adjustable resistor can be adapted to an output parameter of the power supply chip.

8. A test system, comprising:

A first test apparatus, the first test apparatus comprising: a first plate body having opposed first and second surfaces; a first electronic component disposed on the first surface; a first electrical connection disposed on the second surface;

the device to be tested comprises a first preset area, wherein the first preset area is provided with a first target electronic element and a second electronic element arranged on the periphery of the first target electronic element;

The first electric connector is used for bearing the first board body and loading the first board body above a first preset area of the equipment to be tested so as to replace a first target electronic element in the first preset area to execute test on the equipment to be tested; the first electrical connector has a first height, the second electrical component has a second height, the first height is greater than the second height, and when the test equipment is loaded above the first preset area, a gap is formed between the first board and the second electrical component.

9. The test system of claim 8, wherein the test system comprises a plurality of test cells,

The equipment to be tested comprises a second preset area, and a second target electronic element is arranged in the second preset area;

The test system further comprises a second test device comprising: a second plate having opposed third and fourth surfaces; a fourth electronic component disposed on the third surface; a second electrical connection disposed on the fourth surface;

The second electric connector is used for bearing the second board body to be loaded above a second preset area of the equipment to be tested so as to replace a second target electronic element in the second preset area to execute test on the equipment to be tested;

The first distance between the input end and the output end of the first electric connector is matched with the distance between the input pin and the output pin of the first target electronic element, the second distance between the input end and the output end of the second electric connector is matched with the distance between the input pin and the output pin of the second target electronic element, and the first distance and the second distance are different.

10. The test system of claim 8, wherein the first surface is further provided with a first output port to output the electrical parameter collected by the first test device to an external test device;

and the third surface is also provided with a second output port so as to output the electric parameters acquired by the second testing equipment to the external detecting equipment for simultaneously detecting the equipment to be tested.