CN215529419U - Antenna module testing board and antenna module testing equipment - Google Patents
Antenna module testing board and antenna module testing equipment Download PDFInfo
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- CN215529419U CN215529419U CN202120977571.6U CN202120977571U CN215529419U CN 215529419 U CN215529419 U CN 215529419U CN 202120977571 U CN202120977571 U CN 202120977571U CN 215529419 U CN215529419 U CN 215529419U
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- 238000012360 testing method Methods 0.000 title claims abstract description 75
- 238000003466 welding Methods 0.000 claims abstract description 17
- 238000005476 soldering Methods 0.000 claims description 8
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
The embodiment of the utility model discloses an antenna module test board and antenna module test equipment, wherein the antenna module test board comprises: a PCB board; at least two groups of welding pad groups arranged on the PCB, wherein each group of welding pad group is used for being electrically connected with an antenna module to be tested; the power supply module is arranged on the PCB and is connected with each group of the bonding pad groups; and the power supply module is arranged on the PCB, and each group of the welding pads is connected with the upper computer interface. The antenna module to be tested of different interfaces is integrated on one test board, so that the test board is not required to be designed for the antenna module of each interface, on one hand, the antenna module can be timely tested to obtain a test result to be presented to a customer, the project period is shortened, the cost is reduced, on the other hand, the number of the test boards is reduced, and the test boards are easy to manage.
Description
Technical Field
The utility model relates to the technical field of testing, in particular to an antenna module testing board and antenna module testing equipment.
Background
With the advancement of the WiFi wireless communication technology, the WiFi wireless communication technology is applied to a plurality of electronic devices, and in practical applications, in order to apply the WiFi product to electronic devices with different interfaces, the WiFi product is generally provided with a plurality of packaging interfaces, such as interfaces packaged with pins of 6pin, 11pin, and 17 pin.
The WiFi product need be tested the WiFi product in the design link, and a test panel is surveyed to WiFi product design money of a section encapsulation interface among the prior art and is tested the WiFi product, and this all need design a new test panel of a section with regard to every WiFi product of demand design, project cycle extension, the cost increase can't in time obtain the test result and present for the customer to survey test panel kind and be difficult to manage when too much.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model aims to: the utility model provides an antenna module surveys test panel and antenna module test equipment to solve among the prior art every design wiFi product need design a section survey test panel and test the problem that brings to the product.
To achieve the purpose, the embodiment of the utility model adopts the following technical scheme:
in a first aspect, an antenna module test board is provided, which includes:
a PCB board;
at least two groups of welding pad groups arranged on the PCB, wherein each group of welding pad group is used for being electrically connected with an antenna module to be tested;
the power supply module is arranged on the PCB and is connected with each group of the bonding pad groups;
and the power supply module is arranged on the PCB, and each group of the welding pads is connected with the upper computer interface.
Optionally, each pad group includes a power supply pin pad, and the power supply pin pad is connected to the power supply module.
Optionally, each pad group includes a data pin pad, and the data pin pad is connected to a data pin of the upper computer interface.
Optionally, the data pin pad in each pad group is connected to the data pin of the upper computer interface through a bridge resistor.
Optionally, the upper computer interface is a USB interface.
Optionally, the pad group includes a first pad group, a second pad group, and a third pad group.
Optionally, the first pad group includes 6 pads for soldering a 6pin antenna module to be tested.
Optionally, the second pad group includes 11 pads for soldering an 11pin antenna module to be tested.
Optionally, the third pad group includes 17 pads for soldering a 17pin antenna module to be tested.
In a second aspect, an embodiment of the present invention provides an antenna module testing apparatus, where the antenna module testing apparatus includes the antenna module testing board described in any one of the first aspects.
The antenna module test board comprises a PCB and at least two groups of pad groups, a power supply module and an upper computer interface which are arranged on the PCB, wherein each group of pad groups is used for being electrically connected with an antenna module to be tested, the power supply module is connected with each group of pad groups, and each group of pad groups is connected with the upper computer interface.
Drawings
The utility model is explained in more detail below with reference to the figures and examples.
FIG. 1 is a schematic view of a test board for an antenna module according to an embodiment of the present invention;
FIG. 2 is a schematic view of a test board for antenna modules according to another embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a connection between an antenna module and a pad set according to an embodiment of the utility model;
in the figure:
10. a PCB board; 20. a power supply module; 30. a pad group; 40. an upper computer interface; 50. an antenna module; 501. an antenna PCB board; 502. a radio frequency chip; 503. a shield case; 504. an antenna connecting base.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1, an antenna module test board according to an embodiment of the present invention includes a PCB 10, a power module 20, at least two pad sets 30, and an upper computer interface 40.
The antenna module test board provided by the embodiment of the utility model is used for testing the antenna module, the antenna module can be a radio frequency module comprising an antenna PCB, a plurality of pins are arranged on the antenna PCB of the antenna module, and after the pins are connected with the antenna test board provided by the embodiment of the utility model, the antenna test board is connected with an upper computer to test the antenna module.
The PCB (printed Circuit board) is also called a printed Circuit board, the PCB 10 is a carrier for electrically interconnecting electronic components on the antenna test board, and the PCB 10 may be divided into a single-layer board, a double-layer board, and a multi-layer board according to the number of wiring layers.
The land set 30 may be a plurality of lands provided on the PCB board 10 for fixing the antenna module to be tested, the positions and the number of the welding pads in the welding pad group used for fixing each antenna module to be tested are in one-to-one correspondence with the interface pins of the antenna module to be tested, when the antenna module to be tested is fixed with the PCB board 10, the interface pins of the antenna module to be tested are soldered with the soldering pads in the soldering pad set 30 one by one, thereby realizing the electrical connection and the mechanical connection between the antenna module to be tested and the PCB board 10, it should be noted that the number and the position of the pads of the plurality of pad groups 30 on the PCB board 10 are different to connect the antenna modules to be tested with different interface types, in one example, the plurality of pad sets 30 may be provided according to the interface type of an antenna module commonly used in the market, the antenna module test board provided by the embodiment of the utility model can meet the test requirements of most antenna modules.
The power module 20 may be a module for providing power to each electronic component on the antenna module test board, and in an example, the power module 20 may be an ac-to-dc circuit, for example, a circuit for converting ac 220V commercial power into dc 3.3V.
The upper computer interface 40 may be a data interface disposed on the PCB 10, and exemplarily, the upper computer interface 40 may be a USB interface, and optionally, may be a USB2.0 or USB3.0 interface, but may also be another data interface.
In the embodiment of the present invention, the power module 20 is connected to each group of the pad groups 30 to provide a working power for the antenna module to be tested connected to the pad group 30, each pad group 30 is connected to the upper computer interface 40, the antenna module to be tested connected to the pad group 30 can exchange test data with the upper computer through the upper computer interface 40, and it should be noted that the connection between the electrical components is electrically connected through a metal routing layer on the PCB board 10.
The antenna module test board comprises a PCB and at least two groups of pad groups, a power supply module and an upper computer interface which are arranged on the PCB, wherein each group of pad groups is used for being electrically connected with an antenna module to be tested, the power supply module is connected with each group of pad groups, and each group of pad groups is connected with the upper computer interface.
In practical application, the plurality of pads of each pad group 30 include a power supply pin pad, the power supply pin pad is connected to the power supply module 20, and after the antenna module to be tested is connected to the pad group 30, the working voltage can be obtained from the power supply module 20 through the power supply pin pad, so that an independent power supply module does not need to be set for each antenna module to be tested, and the circuit layout is simplified.
In a preferred embodiment of the present invention, the upper computer interface 40 is a USB interface, and the plurality of pads of each pad group 30 includes a data pin pad, and the data pin pad may be connected to a data pin of the upper computer interface 40 through a USB bus, specifically, as shown in fig. 1, 3 pad groups 30 are disposed on the PCB 10, and the USB bus of the upper computer interface 40 is divided into 3 branches and connected to the data pin pads of the 3 pad groups 30.
As shown in fig. 2, it is more preferable that the data pin pads in each pad group 30 are connected to the data pins of the upper computer interface 40 through a bridge resistor (R1, R2, R3), wherein the bridge resistor is a zero-ohm resistor, for example, a resistor with a resistance value of 50 milliohm or even smaller, in one example, a chip resistor pad may be disposed on a metal routing layer from the data pin pad to the data pins of the upper computer interface 40, and a chip bridge resistor is attached on the chip resistor pad, as shown in fig. 2, a chip bridge resistor R1, R2 and R3 is disposed between the 3 pad groups 30 and the upper computer interface 40, which is advantageous in that, on one hand, each pad group 30 can be accessed to the antenna module to be tested at any time for testing, on the other hand, when the test of the antenna module to be tested which is soldered on one pad group 30 is completed or the test is abnormal, the corresponding bridge resistor can be disassembled, and another antenna module to be tested is welded on another pad group 30, and the tests of the antenna modules to be tested on each pad group 30 are not mutually influenced.
As shown in fig. 2, in an example of the present invention, there are 3 pad groups 30 on the PCB 10, that is, the pad group 30 includes a first pad group, a second pad group and a third pad group, where the first pad group includes 6 pads for welding the antenna module to be tested with 6 pins, the second pad group includes 11 pads for welding the antenna module to be tested with 11 pins, and the third pad group includes 17 pads for welding the antenna module to be tested with 17 pins. Specifically, in an example, the first pad group includes 6 pads, the single-frequency 1T1R WiFi module for welding 6 pins, the second pad group includes 11 pads, the single-frequency 1T1R WiFi + BT module for welding 11 pins, the third pad group includes 17 pads, the dual-frequency 2T2R WiFi + BT module for welding 17 pins, and of course, in practical applications, a person skilled in the art may set more pad groups 30 on the PCB board 10, and set the number of pads of each pad group 30 to adapt to different antenna modules to be tested.
As shown in fig. 3, which is a schematic diagram of a dual-frequency 2T2RWiFi + BT module having 17 pins as a third land set, in fig. 3, an antenna module 50 of a dual-frequency 2T2R WiFi + BT includes an antenna PCB 501, a rf chip 502 disposed on the antenna PCB 501, a shielding can 503, and an antenna connecting socket 504, a land set 30 is disposed on the PCB 10 of the antenna module test board, the land set 30 includes 17 lands, the 17 lands correspond to the 17 pins of the antenna module 50, the antenna module 50 is disposed in a region where the land set 30 is located, and after the pins and the lands correspond to each other, the pins and the lands are soldered by solder to electrically and mechanically connect the antenna module 50 to the PCB 10, during testing, the upper computer interface 40 on the PCB 10 is connected to the upper computer, corresponding testing is performed on the test interface of the upper computer, when a plurality of antenna modules to be tested are connected to the PCB 10, can carry out the contrast test to many types of antenna module at the test interface, labour saving and time saving.
The embodiment of the utility model also provides antenna module testing equipment which comprises the antenna module testing board. Exemplarily, the antenna module testing device further comprises a power line and a fixing seat, one end of the power line is connected with the power module in the antenna testing board, the other end of the power line is connected with an external alternating current 220V commercial power or a 12V direct current, and the like, the PCB is fixed on the fixing seat, and of course, the antenna module testing device may further comprise other components.
In the antenna module testing equipment of the embodiment of the utility model, the antenna module testing board comprises a PCB and at least two groups of pad groups, a power supply module and an upper computer interface which are arranged on the PCB, wherein each group of pad groups is used for being electrically connected with the antenna module to be tested, the power supply module is connected with each group of pad groups, and each group of pad groups is connected with the upper computer interface, so that a plurality of different pad groups are arranged on one testing board, the antenna modules to be tested with different interfaces are integrated on one testing board for testing, and a testing board is not required to be designed for the antenna module with each interface.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single technical solution, and such description is for clarity only, and those skilled in the art should take the description as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments that may be understood by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. An antenna module testing board, comprising:
a PCB board;
at least two groups of welding pad groups arranged on the PCB, wherein each group of welding pad group is used for being electrically connected with an antenna module to be tested;
the power supply module is arranged on the PCB and is connected with each group of the bonding pad groups;
and the power supply module is arranged on the PCB, and each group of the welding pads is connected with the upper computer interface.
2. The antenna module testing board according to claim 1, wherein each of the pad groups comprises a power pin pad connected to the power module.
3. The antenna module testing board according to claim 1, wherein each group of the pads comprises a data pin pad, and the data pin pad is connected to a data pin of the upper computer interface.
4. The antenna module test board according to claim 3, wherein the data pin pads in each group of the pads are connected to the data pins of the upper computer interface through a bridge resistor.
5. The antenna module testing board according to any one of claims 1 to 4, wherein the host computer interface is a USB interface.
6. The antenna module testing board according to any one of claims 1 to 4, wherein the pad groups include a first pad group, a second pad group and a third pad group.
7. The antenna module test board according to claim 6, wherein the first pad group comprises 6 pads for soldering 6pin antenna modules to be tested.
8. The antenna module test board according to claim 6, wherein the second pad group comprises 11 pads for soldering 11pin antenna modules to be tested.
9. The antenna module test board according to claim 6, wherein the third pad group comprises 17 pads for soldering 17pin antenna modules to be tested.
10. An antenna module testing apparatus, characterized in that the antenna module testing apparatus comprises the antenna module testing board of any one of claims 1 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202120977571.6U CN215529419U (en) | 2021-05-08 | 2021-05-08 | Antenna module testing board and antenna module testing equipment |
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Application Number | Priority Date | Filing Date | Title |
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CN202120977571.6U CN215529419U (en) | 2021-05-08 | 2021-05-08 | Antenna module testing board and antenna module testing equipment |
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CN215529419U true CN215529419U (en) | 2022-01-14 |
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CN202120977571.6U Active CN215529419U (en) | 2021-05-08 | 2021-05-08 | Antenna module testing board and antenna module testing equipment |
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