CN117930743A - Method and device for correcting position of scheduled machining line, and machining method and device - Google Patents

Method and device for correcting position of scheduled machining line, and machining method and device Download PDF

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Publication number
CN117930743A
CN117930743A CN202311743466.6A CN202311743466A CN117930743A CN 117930743 A CN117930743 A CN 117930743A CN 202311743466 A CN202311743466 A CN 202311743466A CN 117930743 A CN117930743 A CN 117930743A
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preset
line
target
machining
image
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唐经易
包林
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MGA Technology Shenzhen Co Ltd
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MGA Technology Shenzhen Co Ltd
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Priority to CN202311743466.6A priority Critical patent/CN117930743A/en
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Abstract

The embodiment of the invention provides a method and a device for correcting the position of a preset processing line, and a processing method and a processing device. The predetermined processing line position correction method is applied to processing equipment and comprises the following steps: acquiring first position information of a target preset machining line, wherein the target preset machining line is a preset machining line to be corrected in at least one preset machining line; determining a position deviation value based on first position information of a target predetermined machining line and second position information of a machining tool; comparing the position deviation value with a target deviation threshold; and when the position deviation value is smaller than or equal to the target deviation threshold value, correcting the position of the target preset machining line according to the position deviation value, so as to machine the workpiece to be machined according to the corrected position of the target preset machining line. The scheme can avoid damaging the workpiece to be processed, and simultaneously reduces the hardware cost of processing equipment.

Description

Method and device for correcting position of scheduled machining line, and machining method and device
Technical Field
The present invention relates to the field of image processing technology, and more particularly, to a predetermined processing line position correction method, a processing method, a predetermined processing line position correction device, a processing device, an electronic apparatus, and a storage medium.
Background
In the manufacturing industry, many devices are used in combination with X, Y, R + vision positioning cameras to position and process a workpiece to be machined. For example, in a wafer splitting process in the semiconductor industry, a split wafer is split along a dicing path by a chopper of a splitter (which may also be referred to as a wafer splitting machine), so as to separate chips from a whole wafer. It is often necessary to determine the angle θ of the scribe line to be processed of the wafer by visual positioning during cleaving and then rotate the R-axis by θ ° to level the scribe line to be processed of the wafer.
When the cutting path to be processed is horizontally corrected, the cutting path near the center of the product is generally horizontally corrected, but the processing is usually started from the edge position of the workpiece to be processed in the processing process of the workpiece to be processed, and as the X, Y shaft cannot ensure 100% of verticality in the installation process, the error increases along with the accumulation of the splitting times in the splitting process, so that the processing position is not in the center position of the cutting path to be processed instead.
Disclosure of Invention
The present invention has been made in view of the above-described problems. The invention provides a predetermined processing line position correction method, a processing method, a predetermined processing line position correction device, a processing device, an electronic apparatus, and a storage medium.
According to a first aspect of the present invention, there is provided a predetermined machining line position correction method applied to a machining apparatus including a machining tool for machining a workpiece along a predetermined machining line, the workpiece including at least one predetermined machining line extending in a first direction, the method comprising: acquiring first position information of a target preset machining line, wherein the target preset machining line is a preset machining line to be corrected in at least one preset machining line; determining a position deviation value based on first position information of a target predetermined machining line and second position information of a machining tool; comparing the position deviation value with a target deviation threshold; and when the position deviation value is smaller than or equal to the target deviation threshold value, correcting the position of the target preset processing line according to the position deviation value, so as to process the workpiece according to the corrected position of the target preset processing line.
Illustratively, the target predetermined machining line is modified in a preset order; before comparing the position deviation value with the target deviation threshold, the method further comprises: determining a target deviation threshold based on an expected spacing between a current target predetermined process line and a previous target predetermined process line; when the expected distance falls into any specific distance range of at least two distance ranges, the target deviation threshold value is equal to a preset deviation threshold value corresponding to the specific distance range of at least two preset deviation threshold values, the at least two distance ranges are in one-to-one correspondence with the at least two preset deviation threshold values, and the larger the value of the distance range is, the larger the corresponding preset deviation threshold value is.
Illustratively, the at least two preset deviation thresholds include a first preset deviation threshold and a second preset deviation threshold, the first preset deviation threshold being greater than the second preset deviation threshold, the first preset deviation threshold and the second preset deviation threshold being respectively in one-to-one correspondence with two spacing ranges, a demarcation between the two spacing ranges being a preset spacing threshold, the determining a target deviation threshold based on an expected spacing between a current target predetermined processing line and a previous target predetermined processing line comprising: when the expected distance is greater than or equal to the preset distance threshold, determining the target deviation threshold as a first preset deviation threshold; and when the expected distance is smaller than the preset distance threshold, determining the target deviation threshold as a second preset deviation threshold.
The workpiece to be machined is a wafer, the preset spacing threshold value is equal to a specific multiple of a grain spacing of the wafer, the first preset deviation threshold value is equal to a specific multiple of a minimum deviation threshold value, the grain spacing is equal to a spacing between two adjacent preset machining lines, the minimum deviation threshold value is equal to a difference value between a position of any one of the first preset machining lines after the movement and a position of a second preset machining line before the movement when the workpiece to be machined is moved by one grain spacing along a second direction, the second preset machining line is a preset machining line adjacent to the first preset machining line and located on one side of a moving direction of the workpiece, and the second direction is a direction in which a second coordinate axis perpendicular to a first coordinate axis corresponding to the first direction is located in a mechanical coordinate system adopted by machining equipment.
Illustratively, prior to comparing the position deviation value to the target deviation threshold, the method further comprises: at least two preset deviation thresholds are determined based on first parameter setting information input by a user.
Illustratively, after comparing the position deviation value to the target deviation threshold, the method further comprises: and outputting alarm information when the position deviation value is larger than the target deviation threshold value.
Illustratively, prior to comparing the position deviation value to the target deviation threshold, the method further comprises: a target deviation threshold is determined based on the second parameter setting information entered by the user.
Illustratively, the processing apparatus includes a first image acquisition device; the physical position of the processing tool is aligned with the physical position corresponding to the visual field center of the first image acquisition device; the first position information of the target preset machining line is represented by a first image position corresponding to a characteristic point on the target preset machining line or a first physical position corresponding to the first image position in the image to be detected, which is acquired by the first image acquisition device and contains the target preset machining line, and the second position information of the machining tool is represented by a second image position corresponding to the center of the visual field of the first image acquisition device or a second physical position corresponding to the second image position.
Illustratively, correcting the position of the target predetermined processing line based on the position deviation value includes: and controlling the image acquisition device to move by a corresponding distance according to the position deviation value so as to correct the position of the target preset processing line.
Illustratively, prior to acquiring the first position information of the target predetermined tooling line, the method further comprises: identifying a first characteristic point from a first to-be-detected image acquired by a first image acquisition device, wherein the first characteristic point is a characteristic point on any preset processing line; correcting a third preset processing line where the first characteristic point is located according to the first direction; after correction is completed, the visual field center of the first image acquisition device is moved to a physical position corresponding to the first image acquisition device when the first image to be detected is acquired; acquiring a second image to be detected acquired after the first image acquisition device is moved; identifying a second characteristic point from the second image to be detected, wherein the second characteristic point is a characteristic point on any preset processing line; moving the center of view of the first image acquisition device by a corresponding distance according to an expected distance between a fourth predetermined processing line in which the second feature point is located and a starting target predetermined processing line in a first processing stage of the at least one processing stage; and acquiring a third to-be-detected image which is acquired after the first image acquisition device moves and contains the initial target preset machining line in the first machining stage, so as to execute the step of acquiring the first position information of the target preset machining line for the initial target preset machining line in the first machining stage based on the third to-be-detected image.
The processing apparatus further includes a second image capturing device having an image capturing range that is larger than that of the first image capturing device, wherein the method further includes, before identifying the first feature point from the first image to be measured captured by the first image capturing device: identifying the outline of the workpiece to be processed from a fourth image to be processed acquired by a second image acquisition device, wherein when the second image acquisition device acquires the fourth image to be processed, the center of the visual field of the second image acquisition device coincides with the center of a bearing device for bearing the workpiece to be processed; determining a third image position of a product center of the to-be-machined piece in a fourth to-be-machined image based on the outline of the to-be-machined piece; determining a physical position difference corresponding to the image position difference based on the image position difference between the second image position and the third image position corresponding to the center of view of the second image acquisition device and the conversion relationship between the image position and the physical position; moving the bearing device into the visual field range of the first image acquisition device, wherein the center of the bearing device after movement coincides with the visual field center of the first image acquisition device; based on the physical position difference, the position of the bearing device is adjusted so that the physical position corresponding to the product center of the workpiece to be machined on the adjusted bearing device coincides with the physical position corresponding to the visual field center of the first image acquisition device; and acquiring a first image to be tested acquired by the first image acquisition device after adjustment is completed.
Illustratively, before determining the physical position difference corresponding to the image position difference based on the image position difference between the second image position and the first image position corresponding to the center of field of view of the second image capturing device and the conversion relationship between the image position and the physical position, the method further includes: acquiring a plurality of fifth images to be detected, wherein the plurality of fifth images to be detected are images acquired by a first image acquisition device aiming at a workpiece to be detected when the workpiece to be detected is respectively positioned at a plurality of fourth physical positions, the number of the plurality of fifth images to be detected is more than or equal to 3, and any two fourth physical positions in the plurality of fourth physical positions are different; for each fifth to-be-detected image in the plurality of fifth to-be-detected images, determining the image position of the identification feature in the fifth to-be-detected image according to a template image, wherein the template image comprises the identification feature on the to-be-processed workpiece; and determining a conversion relation according to the image positions of the identification features in the fifth images to be detected and the fourth physical positions.
Illustratively, correcting the third predetermined processing line in which the first feature point is located according to the first direction includes: sequentially determining a plurality of groups of position points by taking the first characteristic points as reference position points, wherein each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between two position points contained in each group of position points is gradually increased along the first direction, and different position points in the reference position point and the plurality of groups of position points are position points corresponding to different characteristic points on a target preset processing line; after each time a set of position points is determined, calculating a line angle of a line connecting a first position point and a second position point in the set of position points with respect to a first direction, and performing the following correction operation: under the condition that the connecting line angle is larger than a preset angle threshold, determining a corresponding adjusting angle according to the connecting line angle, and adjusting the position of the to-be-machined piece based on the adjusting angle so as to correct the position of a third preset machining line on the to-be-machined piece; stopping correction under the condition that the connecting line angle is smaller than or equal to a preset angle threshold value; after each time a group of position points is determined and a correction operation corresponding to the group of position points is performed, a step of determining a next group of position points is performed, wherein a distance between two position points included in the next group of position points is larger than a distance between two position points included in the current group of position points along the first direction.
According to a second aspect of the present invention, there is also provided a machining method applied to a machining apparatus including a machining tool for machining a workpiece along a predetermined machining line, the workpiece including at least one predetermined machining line extending in a first direction, the method comprising: the following first machining operation is performed: determining the position of a target preset processing line in actual processing by adopting the preset processing line position correction method; and controlling the processing tool to process at the position of the target preset processing line.
Illustratively, at least one predetermined machining line sequentially performs machining in a preset sequence, and when machining of any one of the target predetermined machining lines is required, a first machining operation is performed.
Illustratively, the method further comprises: when it is necessary to process any one of the non-target predetermined processing lines other than the target predetermined processing line, the following second processing operation is performed: determining the position of a non-target preset processing line based on the position of a previous preset processing line processed last time; and controlling the processing tool to process at the position of the non-target preset processing line.
According to a third aspect of the present invention, there is also provided a predetermined machining line position correcting apparatus for use in a machining device including a machining tool for machining a workpiece along a predetermined machining line, the workpiece including at least one predetermined machining line extending in a first direction, the apparatus comprising: the acquisition module is used for acquiring first position information of a target preset machining line, wherein the target preset machining line is a preset machining line to be corrected in at least one preset machining line; a first determining module for determining a position deviation value based on first position information of a target predetermined processing line and second position information of a processing tool; the comparison module is used for comparing the position deviation value with a target deviation threshold value; and the correction module is used for correcting the position of the target preset processing line according to the position deviation value when the position deviation value is smaller than or equal to the target deviation threshold value so as to process the workpiece according to the corrected position of the target preset processing line.
According to a fourth aspect of the present invention, there is also provided a machining apparatus applied to a machining device, the machining device including a machining tool for machining a workpiece along a predetermined machining line, the workpiece including at least one predetermined machining line extending in a first direction, the apparatus including an execution module including a determination submodule and a control submodule, the determination submodule being configured to determine a position of a target predetermined machining line at the time of actual machining using the above-described predetermined machining line position correction apparatus; and the control sub-module is used for controlling the processing tool to process at the position of the target preset processing line.
According to a fifth aspect of the present invention there is also provided an electronic device comprising a processor and a memory, the memory having stored therein computer program instructions which, when executed by the processor, are adapted to carry out the predetermined process line position correction method and/or the process method described above.
According to a sixth aspect of the present invention, there is also provided a storage medium storing a computer program/instruction for executing the predetermined machining line position correction method and/or the machining method described above when running.
According to the predetermined machining line position correction method, the predetermined machining line determination device, the machining method, the machining device, the electronic apparatus, and the storage medium of the embodiment of the invention, the position deviation value can be determined based on the first position information of the target predetermined machining line and the second position information of the machining tool. And after comparing the position deviation value with the target deviation threshold, correcting the position of the target preset processing line according to the position deviation value when the position deviation value is smaller than or equal to the target deviation threshold. And processing the workpiece to be processed according to the corrected position of the target preset processing line. According to the scheme, whether the position of the current target preset processing line needs to be corrected or not is judged by acquiring the first position information of the target preset processing line and the second position information of the processing tool, and the position of the current target preset processing line is corrected when the position of the current target preset processing line needs to be corrected, so that whether the current splitting position of the chopper is accurate or not can be determined, and splitting of a workpiece to be processed is avoided. Meanwhile, the mounting requirement on the perpendicularity of the X axis and the Y axis in the processing equipment can be reduced, and the hardware cost of the processing equipment is further reduced.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following more particular description of embodiments of the present invention, as illustrated in the accompanying drawings. The accompanying drawings are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, and not constitute a limitation to the invention. In the drawings, like reference numerals generally refer to like parts or steps.
FIG. 1 shows a schematic flow chart of a predetermined process line position correction method according to one embodiment of the invention;
FIG. 2 shows a schematic diagram of an image coordinate system established for an image to be measured according to one embodiment of the invention;
FIG. 3 shows a schematic view of a part to be machined according to an embodiment of the invention;
FIG. 4 shows a schematic diagram of a template image according to one embodiment of the invention;
FIG. 5 shows a schematic representation of a fourth image under test according to one embodiment of the invention;
FIG. 6 shows a schematic flow chart of a first machining operation according to one embodiment of the invention;
FIG. 7 shows a schematic block diagram of a predetermined line position correction device according to one embodiment of the invention;
FIG. 8 shows a schematic block diagram of a processing apparatus according to one embodiment of the invention; and
Fig. 9 shows a schematic block diagram of an electronic device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present invention and not all embodiments of the present invention, and it should be understood that the present invention is not limited by the example embodiments described herein. Based on the embodiments of the invention described in the present application, all other embodiments that a person skilled in the art would have without inventive effort shall fall within the scope of the invention.
In order to at least partially solve the above-mentioned problems, an embodiment of the present invention provides a predetermined processing line position correction method. The predetermined processing line position correction method may be applied to any processing apparatus capable of processing a workpiece to be processed along a predetermined processing line on the workpiece to be processed, such as a splitter or the like. The processing apparatus may comprise a processing tool. The machining tool is used for machining a workpiece to be machined along a predetermined machining line. For example, when the processing apparatus is a splitter, the processing tool may be a riving knife, which may split the work piece to be processed along a predetermined processing line. The workpiece may include at least one predetermined machining line extending in the first direction. The first direction may be, for example, a direction in which a cleavage line generated when the riving knife cleaves a workpiece to be machined along a predetermined processing line. The workpiece may be any product for processing, such as ceramics, wafers, etc. The predetermined processing line is any characteristic line on the workpiece to be processed. In one example, the predetermined processing line may be a scribe line on the wafer. Fig. 1 shows a schematic flow chart of a predetermined process line position correction method 100 according to one embodiment of the invention. As shown in fig. 1, the method 100 may include the following steps S110, S120, S130, S140, and S150.
Step S110, acquiring first position information of a target predetermined processing line, where the target predetermined processing line is a predetermined processing line to be corrected in at least one predetermined processing line.
Illustratively, the workpiece to be machined may include one or more predetermined machining lines extending in the first direction. When a plurality of predetermined processing lines extending in the first direction may be included on the workpiece to be processed, the correction may be performed once before the processing is performed on the workpiece to be processed along each predetermined processing line, or may be performed once after a predetermined number of predetermined processing lines are spaced apart. The target predetermined processing line may be a predetermined processing line to be corrected. The first position information of the target predetermined processing line may represent a physical position or an image position of the target predetermined processing line.
Illustratively, the processing apparatus may include a first image acquisition device; the physical position of the processing tool is aligned with the physical position corresponding to the visual field center of the first image acquisition device; the first position information of the target preset machining line is represented by a first image position corresponding to a characteristic point on the target preset machining line or a first physical position corresponding to the first image position in the image to be detected, which is acquired by the first image acquisition device and contains the target preset machining line, and the second position information of the machining tool is represented by a second image position corresponding to the center of the visual field of the first image acquisition device or a second physical position corresponding to the second image position.
For ease of understanding hereafter, the manner in which the image positions mentioned herein are measured is described below.
Fig. 2 shows a schematic diagram of an image coordinate system established for an image to be measured according to one embodiment of the invention. For example, an image coordinate system shown in fig. 2 may be established by taking the top left corner vertex of the image to be measured as an origin o, taking a side passing through the origin o and parallel to the top side of the image to be measured as an x-axis, and taking a side passing through the origin o and perpendicular to the x-axis and parallel to the left side of the image to be measured as a y-axis, where the point a is a feature point. For example, the first image to be measured includes 1000×1000 pixels in total. The feature point a is located at the pixel of the 150 th row and 300 th column, and thus the image position of the feature point a can be expressed as (150, 300). The feature points described herein (including the first feature point, the second feature point, and the like hereinafter) may be any identifiable feature point on the workpiece to be processed. In one embodiment, the feature points may represent feature points that are self-contained on the workpiece to be machined, such as feature points on certain shapes or structures. The feature points may also be feature points that are additionally marked on the workpiece to be machined by means of a manual or machining device or the like, for example some kind of easily identifiable symbol, pattern or the like. The feature points may be of any shape, such as circular, cross-shaped, or star-shaped, etc. The workpiece to be machined may include at least two predetermined machining lines thereon. The predetermined processing line is any characteristic line on the workpiece to be processed. The feature points are feature points on a predetermined processing line. In one example, the predetermined processing line may be a scribe line on the wafer. Preferably, the characteristic point is the center point of the intersection region of two mutually perpendicular dicing streets (simply referred to as "dicing street center").
The various physical locations described herein may be represented by coordinates in the same world coordinate system. The world coordinate system may also be referred to as a mechanism coordinate system. One example of establishing such a world coordinate system is described below. The workpiece to be machined may be placed on a movable carrier, for example a movable carrier. The movable stage may translate in a plane (which may be referred to as a "movement plane") or may rotate about a fixed axis of rotation in the movement plane. The workpiece to be machined moves synchronously with the movable stage, so that the physical position of the movable stage and the physical position of the workpiece to be machined described herein can be regarded as the same, and the two can be expressed interchangeably. Two mutually perpendicular grating scales can be arranged in the moving range of the movable carrier. For example, when the movable stage is stopped at a predetermined initial physical position, the reading of the grating scale at this time may be set to 0, and the physical position may be determined as the origin O of the world coordinate system. A first grating scale may be disposed along the first direction beyond the origin O, and an axis on which the first grating scale is located may be an X-axis of the world coordinate system. A second grating ruler is arranged perpendicularly to the X axis and passes through the origin O. The axis on which the second grating scale is located may be the Y-axis of the world coordinate system. After the world coordinate system is established, when the movable carrying platform moves each time, namely, when a workpiece to be machined moves, corresponding X-axis coordinates and Y-axis coordinates can be read from the first grating ruler and the second grating ruler, and the physical position of the workpiece to be machined can be represented by adopting the (X, Y) coordinates. It will be appreciated that (X, Y) may be coordinate data representing the displacement of the workpiece to be machined.
In one embodiment, the processing apparatus may include a first image acquisition device. Based on hardware limitations of the processing equipment, the physical position of the processing tool may be defaulted to coincide with a physical position corresponding to the center of view of the first image acquisition device. The first position information of the target predetermined processing line may be represented by a first image position corresponding to a feature point on the target predetermined processing line in the image to be measured including the target predetermined processing line acquired by the first image acquisition device, or may be represented by a first physical position corresponding to the first image position. The second position information of the processing tool may be represented by a second image position corresponding to the center of the field of view of the first image capturing device, or may be represented by a second physical position corresponding to the second image position.
According to the technical scheme, the first position information of the target preset machining line and the second position information of the machining tool are expressed by adopting the corresponding coordinates under the image coordinate system or the physical coordinates, so that the accuracy and consistency of the first position information and the second position information can be ensured.
Step S120, determining a position deviation value based on the first position information of the target predetermined processing line and the second position information of the processing tool.
For example, a position deviation value may be determined based on first position information of a target predetermined machining line and second position information of a machining tool. The positional deviation value may be a deviation in the X-axis direction or a deviation in the Y-axis direction, or may be a relative deviation between the position of the target predetermined processing line and the position of the processing tool.
Step S130, comparing the position deviation value with the target deviation threshold.
For example, the user may set a target deviation threshold in advance to correct the position of the target predetermined processing line based on the target position deviation threshold and the calculated position deviation value. The target deviation threshold may be equal to any number, such as 0.1 millimeters (mm), 0.2mm, or 0.3mm, etc. In one embodiment of the invention, the target position deviation threshold may be equal to 0.2mm.
And step S140, when the position deviation value is smaller than or equal to the target deviation threshold value, correcting the position of the target preset processing line according to the position deviation, so as to process the workpiece according to the corrected position of the target preset processing line.
For example, when the position deviation value is less than or equal to the target deviation threshold value, the position of the workpiece to be machined may be adjusted according to the position deviation value to correct the position of the target predetermined machining line. For example, when the target position deviation threshold value is equal to 0.2mm and the position deviation value is equal to +0.15mm, the workpiece to be machined may be moved by 0.15mm in the reverse direction to correct the position of the target predetermined machining line.
The corrected position of the target predetermined machining line is determined as the position of the target predetermined machining line at the time of actual machining, and the workpiece is machined according to the position. In one embodiment, after the position of the target scheduled machining line is corrected, the corrected position of the target scheduled machining line may be determined as the position of the target scheduled machining line at the time of actual machining. The machining tool may machine the target predetermined machining line along the corrected position of the target predetermined machining line.
According to the above-described aspect, the position deviation value may be determined based on the first position information of the target predetermined processing line and the second position information of the processing tool. And after comparing the position deviation value with the target deviation threshold, correcting the position of the target preset processing line according to the position deviation value when the position deviation value is smaller than or equal to the target deviation threshold. And processing the workpiece to be processed according to the corrected position of the target preset processing line. According to the scheme, whether the position of the current target preset processing line needs to be corrected or not is judged by acquiring the first position information of the target preset processing line and the second position information of the processing tool, and the position of the current target preset processing line is corrected when the position of the current target preset processing line needs to be corrected, so that whether the current splitting position of the chopper is accurate or not can be determined, and splitting of a workpiece to be processed is avoided. Meanwhile, the mounting requirement on the perpendicularity of the X axis and the Y axis in the processing equipment can be reduced, and the hardware cost of the processing equipment is further reduced.
Illustratively, the target predetermined machining line is modified in a preset order; the method may further comprise, prior to comparing the position deviation value to the target deviation threshold value: determining a target deviation threshold based on an expected spacing between a current target predetermined process line and a previous target predetermined process line; when the expected distance falls into any specific distance range of at least two distance ranges, the target deviation threshold value is equal to a preset deviation threshold value corresponding to the specific distance range of at least two preset deviation threshold values, the at least two distance ranges are in one-to-one correspondence with the at least two preset deviation threshold values, and the larger the value of the distance range is, the larger the corresponding preset deviation threshold value is.
In one embodiment, the target predetermined process line may be modified in a preset order. The preset sequence may represent a machining sequence during machining. Fig. 3 shows a schematic view of a workpiece to be machined according to an embodiment of the invention. As shown in fig. 3, the workpiece includes 7 predetermined processing lines extending in the first direction, which are predetermined processing lines L 1、L2、...L7, respectively. The machining may be performed in the order from top to bottom (i.e., in the order from L 1 to L 7), in the order from bottom to top (i.e., in the order from L 7 to L 1), or in the order from both ends to the middle (i.e., in the order from L 1 to L 4, and then from L 7 to L 4), which is not a limitation of the present invention. The user can select any processing sequence to process the workpiece according to the actual processing scene. A target deviation threshold may be determined based on an expected spacing H between a current target predetermined process line and a previous target predetermined process line. The expected spacing H may be equal to an integer multiple of the die spacing H between any two adjacent streets. For the case of sequential processing from L 7 to L 1, if the position of each predetermined processing line needs to be corrected before the workpiece is processed along that predetermined processing line, the intended pitch H is equal to the grain pitch H. If the position of the current predetermined process line needs to be corrected every two predetermined process lines, the expected pitch is equal to 2 times the grain pitch (i.e., h=2h). For the case of sequential machining from L 1 to L 4 followed by sequential machining from L 7 to L 4, the current target predetermined machining line is L 7 after machining L 4 if the position of each predetermined machining line needs to be corrected before machining the workpiece along that predetermined machining line. The previous target predetermined line L 7 corresponds to L 4, and the expected pitch H is equal to 3 times the die pitch. If the position of the current predetermined process line needs to be corrected every two predetermined process lines, the current target predetermined process line is L 7 after processing L 4. The previous target predetermined line L 7 corresponds to L 3, and the expected pitch H is equal to 4 times the die pitch. When the expected pitch falls within any specific pitch range of the at least two pitch ranges, the target deviation threshold is equal to a preset deviation threshold corresponding to the specific pitch range of the at least two preset deviation thresholds. For example, the distance ranges are [ h,5 h) and [6h,10h ] respectively, which have respective corresponding preset deviation thresholds. The larger the value of the range of pitches, the larger the corresponding preset deviation threshold. In one embodiment of the invention, the preset deviation threshold corresponding to the pitch range [ h,5 h) may be equal to 0.01mm and the preset deviation threshold corresponding to the pitch range [6h,10 h) may be equal to 0.2mm. If the expected distance is equal to 5h, then the preset deviation threshold corresponding to [6h,10h ] is taken as the target deviation threshold. If the expected distance is equal to 2h, then the preset deviation threshold corresponding to [ h,5 h) is taken as the target deviation threshold.
According to the above technical solution, the target deviation threshold is determined based on an expected distance between a current target predetermined machining line and a previous target predetermined machining line. The target deviation threshold may be equal to a preset deviation threshold corresponding to a specific pitch range of the at least two preset deviation thresholds, and the larger the value of the pitch range, the larger the corresponding preset deviation threshold. The method can select a larger preset deviation threshold value when the expected distance is larger so as to avoid larger and larger errors caused by accumulation of machining times, and if the smaller preset deviation threshold value is still selected to be compared with the position deviation value of the current target preset line, correction failure can be caused. Otherwise, when the expected distance is smaller, a smaller preset deviation threshold value is selected, so that the situation that the correction amplitude is larger due to the fact that the larger preset deviation threshold value is compared with the position deviation value of the current target preset line is avoided.
Illustratively, the at least two preset deviation thresholds may include a first preset deviation threshold and a second preset deviation threshold, the first preset deviation threshold being greater than the second preset deviation threshold, the first preset deviation threshold and the second preset deviation threshold being respectively in one-to-one correspondence with two pitch ranges, a demarcation between the two pitch ranges being a preset pitch threshold, the determining a target deviation threshold based on an expected pitch between a current target predetermined process line and a previous target predetermined process line, comprising: when the expected distance is greater than or equal to the preset distance threshold, determining the target deviation threshold as a first preset deviation threshold; and when the expected distance is smaller than the preset distance threshold, determining the target deviation threshold as a second preset deviation threshold.
In one embodiment, the at least two preset deviation thresholds may include a first preset deviation threshold and a second preset deviation threshold. The first preset deviation threshold is greater than the second preset deviation threshold. The first preset deviation threshold value and the second preset deviation threshold value are respectively in one-to-one correspondence with the two interval ranges. Such as the pitch ranges [ h,5 h) and [5h,10h ] in the above embodiment, may correspond to the second preset deviation threshold T h2 and the first preset deviation threshold T h1, respectively. The boundary 5h between the two pitch ranges may represent a preset pitch threshold. When the expected pitch is greater than or equal to the preset pitch threshold, the target deviation threshold may be determined to be a first preset deviation threshold T h1. When the expected distance is less than the preset distance threshold, the target deviation threshold may be determined to be a second preset deviation threshold T h2.
According to the technical scheme, the demarcation between the two spacing ranges is taken as a set spacing threshold value. And when the expected distance is greater than or equal to the preset distance threshold, determining the target deviation threshold as a first preset deviation threshold, otherwise, determining the target deviation threshold as a second preset deviation threshold. Therefore, different preset deviation thresholds can be determined to be applicable based on the comparison result of the expected distance and the preset distance threshold, so that the accuracy of the correction result is ensured.
For example, the workpiece to be machined is a wafer, the preset spacing threshold may be equal to a specific multiple of a grain spacing of the wafer, the first preset deviation threshold is equal to a specific multiple of a minimum deviation threshold, the grain spacing is a spacing between two adjacent preset machining lines, the minimum deviation threshold is equal to a difference between a position of any one of the first preset machining lines after the movement and a position of a second preset machining line before the movement when the workpiece to be machined is moved by one grain spacing along a second direction, the second preset machining line is a preset machining line adjacent to the first preset machining line and located on one side of a moving direction of the workpiece, and the second direction is a direction in which a second coordinate axis perpendicular to the first coordinate axis corresponding to the first direction is located in a mechanical coordinate system adopted by the machining equipment.
In one embodiment, when the workpiece to be processed is a wafer, the preset pitch threshold may be equal to a specific multiple of the die pitch h of the wafer. For example, in the previous embodiment, the preset pitch threshold is 5h, then the preset pitch threshold is equal to 5 times the die pitch. The grain spacing is the spacing between two adjacent predetermined processing lines, i.e., the distance between any two adjacent streets in the previous embodiments. The first preset deviation threshold may be equal to a particular multiple of the minimum deviation threshold. The minimum deviation threshold is equal to the difference between the position of any one of the first predetermined processing lines after the movement and the position of the second predetermined processing line before the movement when the workpiece to be processed is moved by one grain spacing along the second direction. The first direction is a direction in which a first coordinate axis (X axis) is located, and the second direction may be a direction in which a second coordinate axis (Y axis) perpendicular to the first coordinate axis (X axis) is located. Referring to fig. 3, if the first predetermined processing line is L 2 and the processing sequence is further predetermined processing line L 1 to predetermined processing line L 7, then the second predetermined processing line is L 3. It will be appreciated that, in theory, when the machining apparatus is installed, the X axis and the Y axis are perpendicular to each other, but there may be a case where the X axis and the Y axis are not perpendicular due to an installation error, and then the difference between the position of any one of the first predetermined machining lines after the movement and the position of the second predetermined machining line before the movement is equal to the difference in the direction of the Y axis in the real physical world.
According to the technical scheme, the preset spacing threshold value can be set based on the grain spacing. A first preset deviation threshold is set based on the minimum deviation threshold. In this way, the reliability of the determined preset distance threshold value and the first preset deviation threshold value can be ensured.
Illustratively, prior to comparing the position deviation value to the target deviation threshold, the method may further comprise: at least two preset deviation thresholds are determined based on first parameter setting information input by a user.
In one embodiment, the processing apparatus may further comprise an input device and/or an output device. The input device and/or the output device may be communicatively coupled to or included in the process parameter sensing device. The input device may include, but is not limited to, one or more of a mouse, keyboard, microphone, touch screen, etc. The output devices may include, but are not limited to, one or more of a display device, a speaker, and the like. The user may input first parameter setting information via the input device to determine at least two preset deviation thresholds. In one embodiment of the present invention, the display interface of the current display device includes two text input controls, wherein one text input control is used for inputting a parameter corresponding to a first preset deviation threshold value, and the second text input control is used for inputting a parameter corresponding to a second preset deviation threshold value. The user may input 0.2 in the first text input control using a mouse or keyboard, indicating that the first preset deviation threshold is 0.2mm. Similarly, the user may also input 0.01 in the second text input control using a mouse or keyboard, indicating that the second preset deviation threshold is 0.01mm.
According to the technical scheme, the user can input the first parameter setting information to determine at least two preset deviation thresholds. Thus, the requirements of different users or application scenes can be met, and the interactivity is strong.
Illustratively, after comparing the position deviation value to the target deviation threshold, the method may further comprise: and outputting alarm information when the position deviation value is larger than the target deviation threshold value.
In one embodiment, the output device may also output an alarm message when the position deviation value is greater than the target deviation threshold. For example, if the output device is a display device, character information such as "correction failure" may be output as alarm information in a display interface of the display device, so as to prompt the user that the current position deviation value is greater than the target deviation threshold. For another example, if the output device is a microphone, voice information such as voice "correction failure" may be output as the alarm information to prompt the user that the current position deviation value is greater than the target deviation threshold.
According to the technical scheme, when the position deviation value is larger than the target deviation threshold value, alarm information can be output. Therefore, the user can be reminded of manually correcting the position of the current preset processing line, so that the workpiece to be processed can be ensured to be processed smoothly.
Illustratively, prior to comparing the position deviation value to the target deviation threshold, the method may further comprise: a target deviation threshold is determined based on the second parameter setting information entered by the user.
In an embodiment, the implementation manner of the user inputting the second parameter information may refer to the description related to the user inputting the first parameter information in the foregoing embodiment, which is not described herein for brevity. A target deviation threshold may be determined based on the second parameter setting information entered by the user. The target deviation threshold may be the first preset deviation threshold or the second preset deviation threshold in the above-described embodiments.
According to the technical scheme, the user can input the second parameter setting information to directly determine the target deviation threshold. Therefore, the operation of the user can be reduced, and the user experience is good and the interactivity is strong.
Illustratively, prior to comparing the position deviation value to the target deviation threshold, the method may further comprise: determining a starting target predetermined machining line and/or a machining line spacing in each of the at least one machining stage based on third parameter setting information entered by a user, the machining line spacing being a distance between any two target predetermined machining lines in each machining stage.
In an embodiment, the implementation manner of the user inputting the third parameter information may refer to the description related to the user inputting the first parameter information in the foregoing embodiment, which is not described herein for brevity. Based on the third parameter setting information entered by the user, a starting target predetermined process line or process line spacing in each of the at least one process stage may be determined, or a starting target predetermined process line and process line spacing in each of the at least one process stage may also be determined. Referring again to fig. 3, when processing a wafer in the order of L 1 to L 7, there may be an invalid scribe line on the wafer, for example, the scribe line corresponding to the predetermined processing line L 1 is an invalid scribe line, then the user may input "2" in the input control corresponding to the start target predetermined processing line to indicate that the position of the second predetermined processing line is the start target predetermined processing line. Likewise, the process line spacing may also be entered.
According to the above-described solution, the user may input third parameter setting information to determine a starting target predetermined process line and/or process line spacing in each of the at least one process stages. Therefore, the operation of the user can be reduced, and the user experience is good and the interactivity is strong.
Illustratively, correcting the position of the target predetermined processing line according to the position deviation value may include: and controlling the image acquisition device to move by a corresponding distance according to the position deviation value so as to correct the position of the target preset processing line.
In one embodiment, the image acquisition device may be controlled to move a corresponding distance according to the position deviation value to correct the position of the target predetermined processing line. For example, the position deviation value is equal to +0.15mm, which means that the workpiece to be processed is deviated by 0.15mm along the positive direction of the Y axis, then the image acquisition device can be controlled to move by 0.15mm towards the negative direction of the Y axis so as to correct the position of the target preset processing line.
According to the technical scheme, the image acquisition device is controlled to move by a corresponding distance according to the position deviation value so as to correct the position of the target preset processing line, so that complicated correction operation is not needed, and the efficiency is high.
Illustratively, prior to acquiring the first location information of the target predetermined tooling line, the method may further comprise: identifying a first characteristic point from a first to-be-detected image acquired by a first image acquisition device, wherein the first characteristic point is a characteristic point on any preset processing line; correcting a third preset processing line where the first characteristic point is located according to the first direction; after correction is completed, the visual field center of the first image acquisition device is moved to a physical position corresponding to the first image acquisition device when the first image to be detected is acquired; acquiring a second image to be detected acquired after the first image acquisition device is moved; identifying a second characteristic point from the second image to be detected, wherein the second characteristic point is a characteristic point on any preset processing line; moving the center of view of the first image acquisition device by a corresponding distance according to an expected distance between a fourth predetermined processing line in which the second feature point is located and a starting target predetermined processing line in a first processing stage of the at least one processing stage; and acquiring a third to-be-detected image which is acquired after the first image acquisition device moves and contains the initial target preset machining line in the first machining stage, so as to execute the step of acquiring the first position information of the target preset machining line for the initial target preset machining line in the first machining stage based on the third to-be-detected image.
In one embodiment, the processing apparatus may include a first image acquisition device. The first image to be detected is an image acquired by the first image acquisition device. A first feature point is identified from a first image to be measured. And performing template matching on the first to-be-detected image by using the template image, so that a first characteristic point in the first to-be-detected image can be obtained. In one embodiment, the workpiece to be processed is a wafer, and the template image may include an intersection region of two mutually perpendicular dicing lanes on the wafer and a region located within a preset range around the intersection region, and the matching feature point may be a center point of the intersection region. FIG. 4 shows a schematic diagram of a template image according to one embodiment of the invention. As shown in fig. 4, the template image includes a center of the scribe line (indicated by a black dot), and the center of the scribe line may be used as a reference point. Fig. 4 also shows a cross-shaped white area, which is part of two mutually perpendicular cut lines, respectively. The intersection area is the area where the rectangular frame shown by the middle broken line is located. Meanwhile, the template image may further include an area (may be referred to as a preset area) located within a preset range around the intersection area, such as 4 gray sub-areas and an area where two cutting lines are located outside the intersection area as shown in fig. 4. The preset range is set so that the intersection area and the image features contained in the preset area enable the image processing algorithm to be enough to identify the positions of the intersection area and the preset area from the image acquired by the image acquisition device based on the image features. As shown in fig. 4, the image features contained in the intersection area are not obvious and are difficult to distinguish, so that the image features which are enough to distinguish can be formed by combining the preset areas around the intersection area, the positions of the intersection area and the preset areas can be identified, the main purpose is to identify the positions of the intersection area, and then the positions of the matched feature points can be determined. Based on the positions of the matching feature points, the first feature points can be identified from the first image to be measured. And correcting the third preset processing line where the first characteristic point is located according to the first direction. The first direction may be, for example, a horizontal direction. Specifically, the predetermined processing line may be rotated by 2 ° in the counterclockwise direction based on an angle between the third predetermined processing line in which the first feature point is located and the first direction, for example, an angle between the predetermined processing line and the first direction in the clockwise direction is +2°, so that the predetermined processing line may be corrected. After the correction is completed, the visual field center of the first image acquisition device is moved to a physical position corresponding to the first image acquisition device when the first image to be detected is acquired. And then acquiring a second image to be detected by using the moved first image acquisition device. Based on the acquired second image to be measured and the template image, a second feature point can be identified from the second image to be measured. The second feature point may be a feature point on any predetermined processing line. For example, the second predetermined processing line may be a feature point on the predetermined processing line L 3 in the embodiment shown in fig. 3. The expected distance between the predetermined processing line L 3 and the initial target predetermined processing line (L 1) is 2h, and the center of the field of view of the first image capturing device may be shifted by 2h so that the initial target predetermined processing line is within the field of view of the shifted first image device. And acquiring a third image to be detected containing the initial target preset processing line by using the moved first image acquisition device.
According to the technical scheme, the first characteristic point can be quickly identified from the first image to be detected by identifying the first characteristic point from the first image to be detected acquired by the first image acquisition device. And correcting the third preset processing line where the first characteristic point is located according to the first direction, and further after the correction is completed, moving the center of the visual field of the first image acquisition device to a physical position corresponding to the first image acquisition device when the first image acquisition device acquires the first image to be detected, and acquiring a second image to be detected. And identifying a second characteristic point from the second image to be detected. The method can realize high-precision positioning of the preset processing line by correcting the preset processing line, thereby ensuring the accuracy of the obtained second characteristic point. And moving the visual field center of the first image acquisition device by a corresponding distance according to the expected distance between the fourth preset processing line where the second characteristic point is located and the initial target preset processing line in the first processing stage of the at least one processing stage, so as to acquire a third image to be detected, which is acquired after the first image acquisition device is moved and contains the initial target preset processing line in the first processing stage. In this way, the identified initial target preset machining line can be located in the central area of the image as much as possible, and the accuracy of the first position information of the target preset machining line can be guaranteed.
The processing apparatus may further include a second image capturing device having an image capturing range larger than that of the first image capturing device, wherein the method may further include, before identifying the first feature point from the first image to be measured captured by the first image capturing device: identifying the outline of the workpiece to be processed from a fourth image to be processed acquired by a second image acquisition device, wherein when the second image acquisition device acquires the fourth image to be processed, the center of the visual field of the second image acquisition device coincides with the center of a bearing device for bearing the workpiece to be processed; determining a third image position of a product center of the to-be-machined piece in a fourth to-be-machined image based on the outline of the to-be-machined piece; determining a physical position difference corresponding to the image position difference based on the image position difference between the second image position and the third image position corresponding to the center of view of the second image acquisition device and the conversion relationship between the image position and the physical position; moving the bearing device to the visual field range of the first image acquisition device, wherein the center of the bearing device after movement coincides with the visual field center of the image acquisition device; based on the physical position difference, the position of the bearing device is adjusted so that the physical position corresponding to the product center of the workpiece to be machined on the adjusted bearing device coincides with the physical position corresponding to the visual field center of the first image acquisition device; and acquiring a first image to be tested acquired by the first image acquisition device after adjustment is completed.
In one embodiment of the present invention, the processing apparatus may further include a second image pickup device having an image pickup range larger than that of the first image pickup device. And identifying the outline of the workpiece to be processed from the fourth image to be processed acquired by the second image acquisition device. Fig. 5 shows a schematic diagram of a fourth image to be measured according to an embodiment of the invention, as shown in fig. 5, a black circular area may represent a wafer. The outline of the black circular area is the outline of the wafer. For the fourth image to be measured, a gray value threshold may be set, and each pixel value in the fourth image to be measured is compared with the gray value threshold to determine the position of the outline of the wafer. The gray value threshold may be any number, such as 50, 100, 150, etc. Referring to fig. 5, a darker area may represent an area corresponding to a pixel having a gray value less than 50. The area occupied by the wafer and the contour of the wafer can be obtained. When the second image acquisition device acquires the fourth image to be detected, the center of the visual field of the second image acquisition device is coincident with the center of the bearing device for bearing the workpiece to be processed. In one embodiment of the present invention, when the workpiece to be processed is a wafer, the wafer is typically attached to the iron ring. The product center of the wafer and the center of the iron ring are not coincident due to the situations that the wafer is askew or incomplete, etc. And based on the hardware limitation of the processing equipment, the center of the iron ring can be coincided with the center of the bearing device by default when the iron ring is placed on the bearing device. Therefore, the product center of the wafer and the center of the carrier do not necessarily coincide. The image position of the center of the field of view of the second image acquisition device may be denoted (x M,yM). Based on the contour of the workpiece to be processed, a third image position of the product center in the fourth image to be processed can be determined by calculating a first average value of the sum of pixel values of each row of pixels and a second average value of the sum of pixel values of each column of pixels located in the contour of the workpiece to be processed. The third image position may be denoted as (x C1,yC1). From the third image position (x C1,yC1) and the second image position (x M,yM) corresponding to the center of field of view of the second image acquisition device, an image position difference between the image positions (x C1,yC1) and (x M,yM) can be calculated. Wherein the difference between the abscissas Δχ 1＝xC1-xM and the difference between the ordinates Δy 1＝yC1-yM. There is a one-to-one conversion relationship between the image location of any object described herein and the physical location of that object in the world coordinate system. For example, for an image position (X ', Y'), a corresponding physical position (X ', Y') of the image position in the world coordinate system may be obtained from the conversion relation. From the obtained image position differences Δx 1 and Δy 1, physical position differences δx 1 and δy 1 corresponding to the image position differences Δx 1 and Δy 1 may also be obtained according to the above-described conversion relationship. And moving the bearing device to the visual field range of the first image acquisition device, so that the center of the bearing device after movement coincides with the visual field center of the first image acquisition device. And adjusting the position of the bearing device according to the calculated physical position differences delta X 1 and delta Y 1. The operation of moving the carrier may be performed manually by a user, may be performed automatically by the process control system, may be performed by controlling a robot arm to move the carrier, or may be performed directly. The processing control system may be a processing apparatus for processing a workpiece to be processed or other control system communicably connected to the processing apparatus, such as a host computer system or the like. The physical position corresponding to the product center of the workpiece to be machined on the adjusted bearing device is overlapped with the physical position corresponding to the visual field center of the first image acquisition device. Based on the adjusted first image acquisition device, a first image to be measured can be acquired.
According to the technical scheme, based on the image position difference between the third image position and the second image position corresponding to the visual field center of the second image acquisition device and the conversion relation between the image position and the physical position, the physical position difference corresponding to the image position difference can be determined, and then after the bearing device is moved into the visual field range of the first image acquisition device, the first image acquisition device is adjusted according to the physical position difference, so that the physical position corresponding to the product center of the workpiece to be processed coincides with the visual field center of the first image acquisition device. And then the first image acquisition device after the acquisition and adjustment acquires a first image to be tested. The method can be used for quickly determining the physical position, corresponding to the product center of the workpiece to be processed, of the physical position which is overlapped with the visual field center of the first image acquisition device according to the conversion relation and in combination with the movement of the bearing device, and the algorithm of the scheme is relatively simple and the result of determining the overlapped physical position is relatively accurate.
For example, before determining the physical position difference corresponding to the image position difference based on the image position difference between the second image position and the first image position corresponding to the center of field of view of the second image capturing device and the conversion relationship between the image position and the physical position, the method may further include: acquiring a plurality of fifth images to be detected, wherein the plurality of fifth images to be detected are images acquired by a first image acquisition device aiming at a workpiece to be detected when the workpiece to be detected is respectively positioned at a plurality of fourth physical positions, the number of the plurality of fifth images to be detected is more than or equal to 3, and any two fourth physical positions in the plurality of fourth physical positions are different; for each fifth to-be-detected image in the plurality of fifth to-be-detected images, determining the image position of the identification feature in the fifth to-be-detected image according to a template image, wherein the template image comprises the identification feature on the to-be-processed workpiece; and determining a conversion relation according to the image positions of the identification features in the fifth images to be detected and the third physical positions.
In one embodiment, the number of the plurality of fifth images to be measured is greater than or equal to 3. By way of example and not limitation, the number of the plurality of fifth images to be measured is greater than or equal to 3 and less than or equal to 9. For example, the total number of the fifth images to be measured is 9. The 9 fifth images to be measured may be images acquired by the image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively at 9 different fourth physical positions. The 9 different fifth physical locations K 1、K2、...、K9 may be arbitrary.
For each of the 9 fifth images under test, the image location of the identification feature in the fifth image under test may be determined from the acquired template image. The identification feature may be any identifiable feature on the workpiece to be machined, it may be a feature point on a predetermined machining line as described herein, or it may be another form of feature. In one embodiment, the identification feature may be a feature that is self-contained on the work piece to be machined, such as a feature on some shape or structure. The identification feature may also be a feature that is additionally marked on the work piece to be processed, for example by a human or processing device or the like, such as some kind of easily identifiable symbol, pattern or the like. The identification feature may be of any shape, such as circular, cross-shaped, or star-shaped, etc. According to the template image, determining the image position of the identification feature in the fifth image to be detected can be realized by the following modes: identifying the identification feature matched with the identification feature in the template image from the fifth image to be detected, and determining the image position of the identification feature in the fifth image to be detected as the image position of the identification feature in the fifth image to be detected.
According to the image positions F 1、F2、...、F9 and the plurality of corresponding 9 fourth physical positions K 1、K2、...、K9 of the identification feature in the 9 fifth images to be detected, a mapping relationship (X K,YK)＝f(w)(xF,yF).(XK,YK) between coordinates corresponding to the image positions and coordinates corresponding to the physical positions can be established to represent each fourth physical position, and (X F,yF) represents each image position. The f (w) matrix can be calculated by the determined 9 coordinate points, and then a conversion relationship between each image position and the corresponding fourth physical position can be determined. The conversion relation between any image position and the corresponding physical position can be determined according to the conversion relation.
According to the above technical solution, the conversion relation may be determined based on the image positions of the identification features in the plurality of fifth images to be measured and the plurality of fourth physical positions of the identification features. The method determines the conversion relation through a plurality of image positions and a plurality of fourth physical positions, and has simple algorithm and convenient realization.
Illustratively, correcting the third predetermined processing line in which the first feature point is located according to the first direction may include: sequentially determining a plurality of groups of position points by taking the first characteristic points as reference position points, wherein each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between two position points contained in each group of position points is gradually increased along the first direction, and different position points in the reference position point and the plurality of groups of position points are position points corresponding to different characteristic points on a third preset processing line; after each time a set of position points is determined, calculating a line angle of a line connecting a first position point and a second position point in the set of position points with respect to a first direction, and performing the following correction operation: under the condition that the connecting line angle is larger than a preset angle threshold, determining a corresponding adjusting angle according to the connecting line angle, and adjusting the position of the to-be-machined piece based on the adjusting angle so as to correct the position of a third preset machining line on the to-be-machined piece; stopping correction under the condition that the connecting line angle is smaller than or equal to a preset angle threshold value; after each time a group of position points is determined and a correction operation corresponding to the group of position points is performed, a step of determining a next group of position points is performed, wherein a distance between two position points included in the next group of position points is larger than a distance between two position points included in the current group of position points along the first direction.
In one embodiment, the first feature point may be used as a reference position point, and the plurality of sets of position points may be sequentially determined based on the reference position point, where different position points are position points corresponding to different feature points on the third predetermined processing line among the reference position point and the plurality of sets of position points. The position point corresponding to any feature point may be an image position point corresponding to the feature point in the image coordinate system, or may be a physical position point corresponding to the feature point in the world coordinate system.
Illustratively, multiple sets of location points may be determined based on the first feature point as a reference location point. For example, for a first set of location points B 1B2, a first location point B 1 and a second location point B 2 may be included. The first location point B 1 and the second location point B 2 may be located on both sides of the reference location point. In a similar manner, multiple sets of location points C 1C2、D1D2, etc. may be determined in sequence, and each set of location points may include a first location point and a second location point. In the first direction (horizontal direction), the intervals between the two position points included in each of the plurality of sets of position points gradually increase. I.e. the distance between D 1D2 is greater than the distance between C 1C2. The reference position point and the plurality of groups of position points are position points corresponding to different characteristic points on a third preset processing line.
The following operations may be performed after each set of position points is determined to correct the position of the third predetermined processing line. The user may preset a preset angle threshold to determine whether the third predetermined processing line requires correction. The preset angle threshold may be any angle greater than 0. By way of example and not limitation, the preset angle threshold may be in the range of [0.001,0.2] degrees, such as 0.1 degrees, 0.03 degrees, 0.006 degrees, or 0.002 degrees, etc. Correcting the position of the third predetermined processing line may include the following correction operations. If the line angle between the first position point B 1 and the second position point B 2 is 0.7 degrees, the line angle is greater than the preset angle threshold value of 0.002 degrees. At this time, it is necessary to rotate the wafer at an angle opposite to the inclination direction of the line between the first position point B 1 and the second position point B 2 so that the line coincides with the horizontal direction. Then, for the second set of location points C 1C2, for the first location point C 1 and the second location point C 2 in the second set of location points C 1C2, it is determined in a similar manner as before whether the line angle between the first location point C 1 and the second location point C 2 is greater than the preset angle threshold value 0.002. And if so, performing a correction operation. After the above correction operations are sequentially performed, stopping correction until the line angle between the first and second one of the position points is less than or equal to the preset angle threshold value 0.002. It is noted that the spacing between two location points (e.g., C 1C2) contained in the next set of location points is greater than the spacing between two location points (e.g., B 1B2) contained in the current set of location points.
According to the technical scheme, a plurality of groups of position points are determined, and the position of a workpiece to be machined is adjusted through the connecting line angle of the connecting line between two position points in each group of position points relative to the preset reference direction, so that the position of a third preset machining line is corrected. By setting a plurality of groups of position points, the high-precision positioning of the third preset processing line on the workpiece to be processed can be realized in a wider range.
According to a second aspect of the invention, a method of processing is also provided. The processing method can be applied to processing equipment. The processing apparatus may comprise a processing tool. The machining tool is used for machining a workpiece to be machined along a predetermined machining line. The workpiece may include at least one predetermined machining line extending in the first direction. The machining method 600 may include a first machining operation 610. Fig. 6 shows a schematic flow chart of a first machining operation 610 according to one embodiment of the invention. As shown in fig. 6, the first machining operation 610 may include the following steps S611 and S612.
Step S611, determining the position of the target predetermined processing line during actual processing by using the above-mentioned predetermined processing line position correction method.
For example, a person skilled in the art can understand the specific implementation and technical effects of the step S611 by reading the above description about the predetermined line position correction method, and for brevity, the description is omitted here.
In step S612, the processing tool is controlled to perform processing at the position where the target predetermined processing line is located.
For example, after determining where the target predetermined processing line is located at the time of actual processing, the default processing tool may be substantially aligned with the location of the target predetermined processing line. And controlling the processing tool to start processing at the position of the target preset processing line.
According to the technical scheme, the position of the target preset machining line in actual machining is determined, and then the machining tool is controlled to perform machining at the position of the target preset machining line. Thus, the machining precision can be ensured, and the damage to the workpiece to be machined is avoided.
Illustratively, at least one predetermined machining line sequentially performs machining in a preset sequence, and when machining of any one of the target predetermined machining lines is required, a first machining operation is performed.
In one embodiment, the implementation manner of sequentially performing the processing on at least one predetermined processing line according to the preset sequence is described in detail in the foregoing embodiment, and in the interest of brevity, a description thereof will not be repeated here.
Illustratively, the method may further comprise: when it is necessary to process any one of the non-target predetermined processing lines other than the target predetermined processing line, the following second processing operation is performed: determining the position of a non-target preset processing line based on the position of a previous preset processing line processed last time; and controlling the processing tool to process at the position of the non-target preset processing line.
In one embodiment, the location of the non-target predetermined process line for the next process may be determined based on the location of the previous predetermined process line for the last process. Referring again to fig. 3, when machining is performed in the order from the predetermined machining line L 1 to the predetermined machining line L 7, if the predetermined machining line of the previous machining is L 1, the predetermined machining line of the next machining may be determined to be L 2. When machining is performed at a position where the predetermined machining line L 2 is located. The machining tool may be directly controlled to perform machining at the position where the predetermined machining line L 2 is located without correcting the position where the predetermined machining line L 2 is located.
According to the technical scheme, the position of the non-target preset machining line can be determined based on the position of the previous preset machining line of the last machining, and the machining tool is controlled to perform machining at the position of the non-target preset machining line. Thus, each preset processing line does not need to be corrected, so that the processing efficiency is improved.
According to a third aspect of the present invention, there is also provided a predetermined machining line position correcting device. The predetermined machining line position correcting device may be applied to a machining apparatus including a machining tool for machining a workpiece along a predetermined machining line including at least one predetermined machining line extending in a first direction. Fig. 7 illustrates a schematic block diagram of a predetermined line position correction device 700 according to one embodiment of the present invention, and as shown in fig. 7, the predetermined line position correction device 700 may include an acquisition module 710, a first determination module 720, a comparison module 730, a correction module 740, and a second determination module 750.
An acquiring module 710, configured to acquire first position information of a target predetermined processing line, where the target predetermined processing line is a predetermined processing line to be corrected in at least one predetermined processing line.
The first determining module 720 is configured to determine a position deviation value based on the first position information of the target predetermined processing line and the second position information of the processing tool.
A comparison module 730 for comparing the position deviation value with a target deviation threshold.
The correction module 740 is configured to correct the position of the target predetermined processing line according to the position deviation value when the position deviation value is less than or equal to the target deviation threshold value, so as to process the workpiece according to the corrected position of the target predetermined processing line.
Those skilled in the art will understand the specific implementation and technical effects of the above-mentioned position correction device for a predetermined processing line by reading the above description about the position correction method for a predetermined processing line, and for brevity, will not be described in detail herein.
According to a fourth aspect of the present invention, there is also provided a processing apparatus. The machining device may be applied to a machining apparatus comprising a machining tool for machining a workpiece along a predetermined machining line, the workpiece comprising at least one predetermined machining line extending in a first direction. Fig. 8 illustrates a schematic block diagram of a processing apparatus 800 according to one embodiment of the invention, as shown in fig. 8, the processing apparatus 800 may include an execution module 810. Execution module 810 may include a determination submodule 811 and a control submodule 812.
A determining sub-module 811 is configured to determine a position of the target scheduled machining line during actual machining by using the scheduled machining line position correction device.
A control sub-module 812 for controlling the processing tool to process at the location of the target predetermined processing line.
Those skilled in the art will understand the specific implementation and technical effects of the processing apparatus through reading the above description about the processing method, and for brevity, no further description is given here.
According to a fifth aspect of the present invention, there is also provided an electronic device. Fig. 9 shows a schematic block diagram of an electronic device according to an embodiment of the invention. As shown in fig. 9, the electronic device 900 includes a processor 910 and a memory 920, where the memory 920 stores a computer program, and the computer program instructions are executed by the processor 910 to perform the predetermined line position correction method and/or the machining method.
According to a sixth aspect of the present invention there is also provided a storage medium storing a computer program/instructions, the storage medium may comprise, for example, a storage component of a tablet computer, a hard disk of a personal computer, an erasable programmable read-only memory (EPROM), a portable read-only memory (CD-ROM), a USB memory, or any combination of the above storage media. The storage medium may be any combination of one or more computer readable storage media. The computer program/instructions are used by the processor when executed to perform the predetermined process line position correction method and/or the process method described above.
Those skilled in the art will understand the specific implementation of the electronic device and the storage medium according to the above description about the predetermined processing line position correction method and/or the processing method, and for brevity, will not be described in detail herein.
Although the illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the above illustrative embodiments are merely illustrative and are not intended to limit the scope of the present invention thereto. Various changes and modifications may be made therein by one of ordinary skill in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the present invention as set forth in the appended claims.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, e.g., the division of the elements is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple elements or components may be combined or integrated into another device, or some features may be omitted or not performed.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in order to streamline the invention and aid in understanding one or more of the various inventive aspects, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention. However, the method of the present invention should not be construed as reflecting the following intent: i.e., the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
It will be understood by those skilled in the art that all of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or units of any method or apparatus so disclosed, may be combined in any combination, except combinations where the features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.
Various component embodiments of the invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art will appreciate that a microprocessor or Digital Signal Processor (DSP) may be used in practice to implement some or all of the functions of some of the modules of the predetermined line position correction device and/or the processing device according to embodiments of the present invention. The present invention can also be implemented as an apparatus program (e.g., a computer program and a computer program product) for performing a portion or all of the methods described herein. Such a program embodying the present invention may be stored on a computer readable medium, or may have the form of one or more signals. Such signals may be downloaded from an internet website, provided on a carrier signal, or provided in any other form.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names.
The foregoing description is merely illustrative of specific embodiments of the present invention and the scope of the present invention is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the scope of the present invention. The protection scope of the invention is subject to the protection scope of the claims.

Claims (20)

1. A predetermined machining line position correction method applied to a machining apparatus including a machining tool for machining a workpiece along a predetermined machining line, the workpiece including at least one predetermined machining line extending in a first direction thereon, the method comprising:
Acquiring first position information of a target preset machining line, wherein the target preset machining line is a preset machining line to be corrected in the at least one preset machining line;
determining a position deviation value based on first position information of the target predetermined machining line and second position information of the machining tool;
comparing the position deviation value with a target deviation threshold;
And when the position deviation value is smaller than or equal to the target deviation threshold value, correcting the position of the target preset processing line according to the position deviation value, so as to process the workpiece to be processed according to the corrected position of the target preset processing line.
2. The method of claim 1, wherein the target predetermined processing line is modified in a predetermined sequence;
before said comparing the position deviation value with a target deviation threshold, the method further comprises:
determining the target deviation threshold based on an expected spacing between a current target predetermined process line and a previous target predetermined process line;
When the expected distance falls into any specific distance range of at least two distance ranges, the target deviation threshold value is equal to a preset deviation threshold value corresponding to the specific distance range of at least two preset deviation threshold values, the at least two distance ranges are in one-to-one correspondence with the at least two preset deviation threshold values, and the larger the value of the distance range is, the larger the corresponding preset deviation threshold value is.
3. The method of claim 2, wherein the at least two preset deviation thresholds comprise a first preset deviation threshold and a second preset deviation threshold, the first preset deviation threshold being greater than the second preset deviation threshold, the first preset deviation threshold and the second preset deviation threshold being in one-to-one correspondence with two pitch ranges, respectively, the demarcation between the two pitch ranges being a preset pitch threshold,
The determining the target deviation threshold based on an expected spacing between a current target predetermined process line and a previous target predetermined process line includes:
When the expected distance is greater than or equal to the preset distance threshold, determining that the target deviation threshold is the first preset deviation threshold;
And when the expected distance is smaller than the preset distance threshold, determining the target deviation threshold as the second preset deviation threshold.
4. The method of claim 3 wherein the workpiece to be processed is a wafer, the predetermined pitch threshold is equal to a particular multiple of a die pitch of the wafer, the first predetermined deviation threshold is equal to the particular multiple of a minimum deviation threshold,
The grain spacing is the spacing between two adjacent preset processing lines, the minimum deviation threshold value is equal to the difference between the position of any first preset processing line after the movement and the position of a second preset processing line before the movement when the workpiece to be processed is moved by one grain spacing along a second direction, the second preset processing line is the preset processing line which is adjacent to the first preset processing line and is positioned at one side of the movement direction of the workpiece, and the second direction is the direction of a second coordinate axis which is perpendicular to the first coordinate axis corresponding to the first direction in a mechanical coordinate system adopted by processing equipment.
5. The method of claim 2, wherein prior to said comparing said position deviation value to said target deviation threshold, said method further comprises:
and determining the at least two preset deviation thresholds based on the first parameter setting information input by the user.
6. The method of claim 1, wherein after said comparing the position deviation value to a target deviation threshold, the method further comprises:
and outputting alarm information when the position deviation value is larger than the target deviation threshold value.
7. The method of claim 1, wherein prior to said comparing said position deviation value to said target deviation threshold, said method further comprises:
and determining the target deviation threshold based on the second parameter setting information input by the user.
8. The method of any one of claims 1-7, wherein the processing apparatus comprises a first image acquisition device; the physical position of the processing tool is aligned with the physical position corresponding to the visual field center of the first image acquisition device;
The first position information of the target preset processing line is represented by a first image position corresponding to a characteristic point on the target preset processing line or a first physical position corresponding to the first image position in an image to be detected, which is acquired by the first image acquisition device and contains the target preset processing line, and the second position information of the processing tool is represented by a second image position corresponding to the center of view of the first image acquisition device or a second physical position corresponding to the second image position.
9. The method of claim 8, wherein said correcting the position of said target predetermined processing line based on said position offset value comprises:
And controlling the image acquisition device to move by a corresponding distance according to the position deviation value so as to correct the position of the target preset processing line.
10. The method of claim 8, wherein prior to said obtaining the first position information of the target predetermined process line, the method further comprises:
identifying a first characteristic point from a first to-be-detected image acquired by the first image acquisition device, wherein the first characteristic point is a characteristic point on any preset processing line;
correcting a third preset processing line where the first characteristic point is located according to the first direction;
After correction is completed, the visual field center of the first image acquisition device is moved to a physical position corresponding to the first image acquisition device when the first image to be detected is acquired;
Acquiring a second image to be detected acquired after the first image acquisition device is moved;
identifying a second characteristic point from the second image to be detected, wherein the second characteristic point is a characteristic point on any preset processing line;
moving the center of the field of view of the first image acquisition device by a corresponding distance according to the expected distance between the fourth preset processing line where the second characteristic point is located and the initial target preset processing line in the first processing stage of at least one processing stage;
And acquiring a third to-be-detected image which is acquired after the first image acquisition device moves and contains the initial target preset machining line in the first machining stage, so as to execute the step of acquiring the first position information of the target preset machining line aiming at the initial target preset machining line in the first machining stage based on the third to-be-detected image.
11. The method of claim 10, wherein the processing apparatus further comprises a second image acquisition device having an image acquisition range that is greater than an image acquisition range of the first image acquisition device, wherein prior to identifying a first feature point in the first image to be measured acquired from the first image acquisition device, the method further comprises:
Identifying the outline of the to-be-machined piece from a fourth to-be-machined image acquired by the second image acquisition device, wherein when the second image acquisition device acquires the fourth to-be-machined image, the center of the visual field of the second image acquisition device coincides with the center of a bearing device for bearing the to-be-machined piece;
Determining a third image position of a product center of the to-be-machined piece in the fourth to-be-machined image based on the outline of the to-be-machined piece;
Determining a physical position difference corresponding to the image position difference based on the image position difference between the second image position corresponding to the center of view of the second image acquisition device and the third image position and the conversion relation between the image position and the physical position;
moving the bearing device into the visual field range of the first image acquisition device, wherein the center of the bearing device after movement coincides with the visual field center of the first image acquisition device;
Based on the physical position difference, adjusting the position of the bearing device so that the physical position corresponding to the product center of the to-be-machined piece on the adjusted bearing device coincides with the physical position corresponding to the visual field center of the first image acquisition device;
And acquiring the first image to be tested acquired by the first image acquisition device after adjustment is completed.
12. The method of claim 11, wherein prior to the determining the physical position difference corresponding to the image position difference based on the image position difference between the second image position corresponding to the center of field of view of the second image capturing device and the first image position and the conversion relationship between the image position and the physical position, the method further comprises:
Acquiring a plurality of fifth images to be detected, wherein the plurality of fifth images to be detected are images acquired by the first image acquisition device aiming at the to-be-processed workpiece when the to-be-processed workpiece is respectively positioned at a plurality of fourth physical positions, the number of the plurality of fifth images to be detected is more than or equal to 3, and any two fourth physical positions in the plurality of fourth physical positions are different;
for each fifth image to be detected in the plurality of fifth images to be detected, determining the image position of the identification feature in the fifth image to be detected according to a template image, wherein the template image comprises the identification feature on the workpiece to be detected;
and determining the conversion relation according to the image positions of the identification features in the fifth images to be detected and the fourth physical positions.
13. The method of claim 10, wherein said correcting the third predetermined process line in which the first feature point is located according to the first direction comprises:
sequentially determining a plurality of groups of position points by taking the first characteristic points as reference position points, wherein each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between two position points contained in each group of position points is gradually increased along the first direction, and different position points in the reference position point and the plurality of groups of position points are position points corresponding to different characteristic points on the third preset processing line;
After each time a set of position points is determined, calculating a link angle of a link between a first position point and a second position point in the set of position points with respect to the first direction, and performing the following correction operation:
when the connecting line angle is larger than a preset angle threshold, determining a corresponding adjusting angle according to the connecting line angle, and adjusting the position of the to-be-machined piece based on the adjusting angle so as to correct the position of the third preset machining line on the to-be-machined piece;
Stopping correction when the connecting line angle is smaller than or equal to the preset angle threshold value;
after each time a group of position points are determined and the correction operation corresponding to the group of position points is performed, the step of determining the next group of position points is performed, wherein the distance between two position points contained in the next group of position points is larger than the distance between two position points contained in the current group of position points along the first direction.
14. A machining method applied to a machining apparatus including a machining tool for machining a workpiece along a predetermined machining line, the workpiece including at least one predetermined machining line extending in a first direction thereon, the method comprising:
the following first machining operation is performed:
determining the position of a target predetermined processing line at the time of actual processing by using the predetermined processing line position correction method according to any one of claims 1 to 13;
And controlling the processing tool to process at the position of the target preset processing line.
15. The method of claim 14, wherein the at least one predetermined processing line is processed sequentially in a predetermined sequence, the first processing operation being performed when processing of any one of the target predetermined processing lines is desired.
16. The method of claim 15, wherein the method further comprises:
when it is necessary to process any non-target predetermined processing line other than the target predetermined processing line, performing the following second processing operation:
determining the position of the non-target preset processing line based on the position of the previous preset processing line processed last time;
and controlling the processing tool to process at the position of the non-target preset processing line.
17. A predetermined machining line position correcting apparatus applied to a machining device including a machining tool for machining a workpiece along a predetermined machining line, the workpiece including at least one predetermined machining line extending in a first direction thereon, the apparatus comprising:
the acquisition module is used for acquiring first position information of a target preset machining line, wherein the target preset machining line is a preset machining line to be corrected in the at least one preset machining line;
a first determining module configured to determine a position deviation value based on first position information of the target predetermined processing line and second position information of the processing tool;
the comparison module is used for comparing the position deviation value with a target deviation threshold value;
And the correction module is used for correcting the position of the target preset processing line according to the position deviation value when the position deviation value is smaller than or equal to the target deviation threshold value, so as to process the workpiece to be processed according to the corrected position of the target preset processing line.
18. A machining device for use in a machining apparatus, the machining apparatus comprising a machining tool for machining a workpiece along a predetermined machining line, the workpiece comprising at least one predetermined machining line extending in a first direction, characterized in that the device comprises an execution module comprising a determination submodule and a control submodule,
The determining submodule is used for determining the position of the target preset machining line in actual machining by adopting the preset machining line position correcting device according to claim 17;
the control submodule is used for controlling the machining tool to perform machining at the position of the target preset machining line.
19. An electronic device comprising a processor and a memory, characterized in that the memory has stored therein computer program instructions which, when executed by the processor, are adapted to carry out the predetermined process line position correction method according to any one of claims 1-13 and/or the process method according to any one of claims 14-16.
20. A storage medium storing a computer program/instruction, characterized in that the computer program/instruction is operative to perform the predetermined machining line position correction method according to any one of claims 1-13 and/or the machining method according to any one of claims 14-16.
CN202311743466.6A 2023-12-18 2023-12-18 Method and device for correcting position of scheduled machining line, and machining method and device Pending CN117930743A (en)

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