CN116313967A - Method and device for correcting position of scheduled line, electronic equipment and storage medium - Google Patents

Method and device for correcting position of scheduled line, electronic equipment and storage medium Download PDF

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Publication number
CN116313967A
CN116313967A CN202211648884.2A CN202211648884A CN116313967A CN 116313967 A CN116313967 A CN 116313967A CN 202211648884 A CN202211648884 A CN 202211648884A CN 116313967 A CN116313967 A CN 116313967A
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China
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preset
points
image
point
line
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唐经易
方浩全
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MGA Technology Shenzhen Co Ltd
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MGA Technology Shenzhen Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

The embodiment of the invention provides a method and a device for correcting a preset line position, electronic equipment and a storage medium. The method comprises the following steps: acquiring a plurality of groups of to-be-detected preset line images comprising preset lines, wherein each group of to-be-detected preset line images is an image acquired by an image acquisition device aiming at the preset line on a to-be-processed workpiece under the condition that the to-be-processed workpiece moves along a preset reference direction; based on a plurality of groups of predetermined line images to be detected, and based on the reference position points, sequentially and correspondingly determining a plurality of groups of position points, wherein the plurality of groups of predetermined line images to be detected correspond to the plurality of groups of position points one by one; after each time a group of position points are determined, the position of the workpiece to be processed is adjusted according to the connecting line angle of the connecting line between the first position point and the second position point in the group of position points relative to the preset reference direction so as to correct the position of the preset line on the workpiece to be processed. The high-precision positioning of the predetermined line on the workpiece to be processed can be realized in a wider range.

Description

Method and device for correcting position of scheduled line, electronic equipment and storage medium
Technical Field
The present invention relates to the field of semiconductor processing, and more particularly, to a method of correcting a predetermined line position of a workpiece to be processed, a device for correcting a predetermined line position of a workpiece to be processed, an electronic apparatus, and a storage medium.
Background
In many industries, such as the semiconductor industry, for some processing equipment, visual positioning is required. For example, with a laser processing apparatus for dicing a wafer, it is necessary to position dicing streets of the wafer by vision so that the streets are parallel to the horizontal direction (X-axis moving direction, X-axis moving mechanism moves the wafer along the X-axis, during which the laser processing apparatus processes the wafer).
Conventional laser machining devices merely locate the product by a single method of mechanical or high precision vision. The mechanical positioning precision is lower, so that the product is difficult to correct to a position with a higher level, and the current technological requirements cannot be met. The high-precision visual positioning precision is high, but the visual field is small, the limitation is very high, and the product is difficult to correct to a better horizontal position for a large-scale product.
Therefore, under the background of the technology in the daily and monthly state, the high-end technology industry has higher and higher requirements on the positioning precision of the products, and the current positioning technology is difficult to meet the current requirements along with the diversity of the products.
Disclosure of Invention
The present invention has been made in view of the above-described problems. The invention provides a method for correcting a preset line position of a workpiece to be machined, a device for correcting the preset line position of the workpiece to be machined, electronic equipment and a storage medium.
According to an aspect of the present invention, there is provided a method for correcting a predetermined line position of a workpiece to be machined, the predetermined line being a characteristic line on the workpiece to be machined, including: acquiring a plurality of groups of to-be-detected preset line images comprising preset lines, wherein each group of to-be-detected preset line images is an image acquired by an image acquisition device aiming at the preset line on a to-be-processed workpiece under the condition that the to-be-processed workpiece moves along a preset reference direction; based on a plurality of groups of predetermined line images to be detected, and based on the reference position points, sequentially and correspondingly determining a plurality of groups of position points, wherein each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between the two position points contained in each group of position points is gradually increased along the preset reference direction, the plurality of groups of predetermined line images to be detected correspond to the plurality of groups of position points one by one, and any group of predetermined line images to be detected comprises two predetermined line images to be detected which correspond to the first position point and the second position point in the corresponding group of position points respectively; after each time a group of position points are determined, the position of a workpiece to be processed is adjusted according to the connecting line angle of a connecting line between a first position point and a second position point in the group of position points relative to a preset reference direction so as to correct the position of a preset line on the workpiece to be processed; among the reference position point and the plurality of groups of position points, different position points are position points corresponding to different feature points on a predetermined line.
Illustratively, determining a plurality of groups of position points based on a plurality of groups of predetermined line images to be measured and based on the reference position points sequentially and correspondingly includes: acquiring a preset template image, wherein the preset template image comprises position features and reference points associated with a preset line; matching the preset template image with any current preset line image to be detected according to the position characteristics contained in the preset template image; and determining a point corresponding to the reference point in the preset template image in the current predetermined line image to be detected as a current characteristic point corresponding to the current predetermined line image to be detected based on the matching result.
Illustratively, the workpiece to be processed includes a first predetermined line and a second predetermined line intersecting the first predetermined line, and an intersection point of the first predetermined line and the second predetermined line is taken as a reference point in the preset template image.
Illustratively, among the reference position points and the plurality of sets of position points, each position point is an image position point of the corresponding feature point in the corresponding predetermined line image to be measured, each image position point corresponds to a physical position point in the world coordinate system, and a distance between physical position points corresponding to two position points of each set of position points is an integer multiple of a distance between adjacent predetermined lines.
Illustratively, before determining the plurality of sets of location points based on the plurality of sets of predetermined line images to be measured and based on the reference location points in sequence, the method further comprises: acquiring a preset template image, wherein the preset template image comprises position features and reference points associated with a preset line; matching the preset template image with an initial preset line image according to the position characteristics contained in the preset template image, wherein the initial preset line image is an image acquired by the image acquisition device for acquiring a preset line when a workpiece to be processed is in an initial position; based on the matching result, determining points corresponding to reference points in the preset template image in the initial preset line image as initial feature points; based on the deviation between the image position of the initial characteristic point in the initial preset line image and the image center of the initial preset line image, adjusting the relative position between the image acquisition device and the workpiece to be processed, so that the initial characteristic point is aligned with the view center of the image acquisition device; and determining the position point corresponding to the initial characteristic point after alignment as a reference position point.
Illustratively, among the reference position points and the plurality of sets of position points, each position point is an image position point of a corresponding feature point in a corresponding predetermined line image, each image position point corresponds to a physical position point in the world coordinate system, the plurality of sets of position points are determined based on the plurality of sets of predetermined line images to be measured and sequentially corresponding based on the reference position points, including: for each group of position points in the plurality of groups of position points, taking a physical position point corresponding to the reference position point as a center, controlling a to-be-machined piece to move to a first physical position along a first direction axis and acquiring a first to-be-measured preset line image acquired after the movement, and controlling the to-be-machined piece to move to a second physical position along a second direction axis opposite to the first direction axis and acquiring a second to-be-measured preset line image acquired after the movement; determining a first position point and a second position point of the group of position points based on the first predetermined line image to be measured and the second predetermined line image to be measured; wherein the first direction axis and the second direction axis are axes in a preset reference direction, the first physical position is a physical position point corresponding to a first position point in the set of position points, and the second physical position is a physical position point corresponding to a second position point in the set of position points.
Illustratively, adjusting the position of the workpiece to be processed according to the connecting angle of the connecting line between the first position point and the second position point in the group of position points relative to the preset reference direction to correct the position of the preset line on the workpiece to be processed comprises: the following correction operations are performed: under the condition that the connecting line angle is larger than a preset angle threshold, determining a corresponding adjusting angle according to the connecting line angle, and adjusting the position of the workpiece to be processed based on the adjusting angle so as to correct the position of a preset line on the workpiece to be processed; stopping correction under the condition that the connecting line angle is smaller than or equal to a preset angle threshold value; and under the condition that the connecting line angle is larger than a preset angle threshold value, after the step of determining a corresponding adjusting angle according to the connecting line angle and adjusting the position of the to-be-machined piece based on the adjusting angle, the step of determining the next group of position points is carried out, wherein the distance between two position points contained in the next group of position points is larger than the distance between two position points contained in the current group of position points along the preset reference direction.
Illustratively, the method further comprises: outputting a user interface; receiving a preset angle threshold value and a correction frequency threshold value which are set on a user interface by a user; and outputting alarm information when the execution times of the correction operation reach a correction times threshold value and the connecting line angle corresponding to the current group of position points is larger than a preset angle threshold value.
According to another aspect of the present invention, there is also provided a predetermined line position correction device for a workpiece to be machined, including: the acquisition module is used for acquiring a plurality of groups of to-be-detected preset line images containing preset lines, wherein each group of to-be-detected preset line images are images acquired by the image acquisition device aiming at the preset lines on the to-be-processed workpiece under the condition that the to-be-processed workpiece moves along the preset reference direction; the system comprises a determining module, a determining module and a display module, wherein the determining module is used for sequentially and correspondingly determining a plurality of groups of position points based on a plurality of groups of predetermined line images to be detected and based on reference position points, each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between the two position points contained in each group of position points is gradually increased along the preset reference direction, the plurality of groups of predetermined line images to be detected correspond to the plurality of groups of position points one by one, and any group of predetermined line images to be detected comprises two predetermined line images to be detected which correspond to the first position point and the second position point in the corresponding group of position points respectively; the correction module is used for adjusting the position of the workpiece to be processed according to the connecting angle of the connecting line between the first position point and the second position point in the group of position points relative to the preset reference direction after determining one group of position points each time so as to correct the position of the preset line on the workpiece to be processed; among the reference position point and the plurality of groups of position points, different position points are position points corresponding to different feature points on a predetermined line.
According to still another aspect of the present invention, there is also provided an electronic apparatus including a processor and a memory, wherein the memory stores therein computer program instructions for executing the predetermined line position correction method for a workpiece as described above when the computer program instructions are executed by the processor.
According to still another aspect of the present invention, there is also provided a storage medium on which program instructions are stored, wherein the program instructions are for executing the above-described predetermined line position correction method of a workpiece at run time.
According to the method for correcting the position of the preset line of the to-be-machined workpiece, the device for correcting the position of the preset line of the to-be-machined workpiece, the electronic equipment and the storage medium, a plurality of groups of position points are determined, and the position of the to-be-machined workpiece is adjusted through the connecting angle of the connecting line between two position points in each group of position points relative to the connecting line in the preset reference direction, so that the position of the preset line on the to-be-machined workpiece is corrected. By setting a plurality of groups of position points, the high-precision positioning of the preset line on the workpiece to be processed can be realized in a wider range.
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent.
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The above and other objects, features and advantages of the present invention will become more apparent from the following more particular description of embodiments of the present invention, as illustrated in the accompanying drawings. The accompanying drawings are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, and not constitute a limitation to the invention. In the drawings, like reference numerals generally refer to like parts or steps.
FIG. 1 shows a schematic flow chart of a method of correcting a predetermined line position of a workpiece to be machined according to one embodiment of the invention;
FIG. 2 illustrates a scribe line image according to one embodiment of the invention;
FIG. 3 shows a schematic diagram of a preset template image according to one embodiment of the invention;
FIG. 4 shows a schematic block diagram of a predetermined wire position correction device for a workpiece according to one embodiment of the invention;
fig. 5 shows a schematic block diagram of an electronic device according to an embodiment of the invention.
In order to make the objects, technical solutions and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present invention and not all embodiments of the present invention, and it should be understood that the present invention is not limited by the example embodiments described herein. Based on the embodiments of the invention described in the present application, all other embodiments that a person skilled in the art would have without inventive effort shall fall within the scope of the invention.
In order to at least partially solve the above-mentioned problems, an embodiment of the present invention provides a method for correcting a predetermined line position of a workpiece to be machined. The predetermined line is a characteristic line on the workpiece to be processed. Fig. 1 shows a schematic flow chart of a method 100 of correcting a predetermined line position of a workpiece according to an embodiment of the invention. As shown in fig. 1, the method 100 may include the following steps S110, S120 and S130.
Step S110, a plurality of groups of line images to be detected, which contain predetermined lines, are obtained by the image acquisition device aiming at the predetermined lines on the workpiece to be processed under the condition that the workpiece to be processed moves along the preset reference direction.
Illustratively, the predetermined line is a characteristic line on the workpiece to be machined. The workpiece to be machined may be any article, such as ceramic, wafer, etc. The predetermined line may be any characteristic line, such as a scribe line on the wafer, or the like. The predetermined line image to be measured may be an image containing any number of predetermined lines. For example, each set of predetermined line images to be measured may be images acquired for predetermined lines on the wafer by the image acquisition device in a case where the wafer is moved in a preset reference direction. The preset reference direction may be any direction, such as a horizontal direction, a vertical direction, etc. For purposes of illustration and understanding, the embodiments shown herein below are described with respect to a predetermined reference direction as the horizontal direction. Each group of predetermined line images to be detected can be static images or any video frame in dynamic video. The predetermined line image to be measured may be an original image collected by the image collecting device, or may be an image obtained after preprocessing (such as digitizing, normalizing, smoothing, etc.) the original image collected by the image collecting device. It will be appreciated that the preprocessing of the original image may include the operation of extracting sub-images including the predetermined lines to be detected from the original image acquired by the image acquisition device to obtain a plurality of sets of predetermined line images to be detected.
Step S120, based on a plurality of groups of predetermined line images to be detected, and based on the reference position points, sequentially and correspondingly determining a plurality of groups of position points, wherein each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between the two position points contained in each group of position points is gradually increased along the preset reference direction, the plurality of groups of predetermined line images to be detected correspond to the plurality of groups of position points one by one, and any group of predetermined line images to be detected comprises two predetermined line images to be detected which correspond to the first position point and the second position point in the corresponding group of position points respectively; among the reference position point and the plurality of groups of position points, different position points are position points corresponding to different feature points on a predetermined line.
For ease of understanding hereafter, the manner in which the physical locations and image locations mentioned herein are measured is first described below.
The image position of any object (e.g., any feature point) described herein may be represented by pixel coordinates in the image coordinate system in which the object is located. For example, an image coordinate system may be established with the top left corner vertex of any image as the origin o, the side that passes through the origin o and is parallel to the top side of the image as the x-axis, and the side that passes through the origin o and is perpendicular to the x-axis and is parallel to the left side of the image as the y-axis. For example, a total of 1000×1000 pixels are included in any image. Any object is located at the 15 th pixel in the X direction and at the 30 th pixel in the Y direction, and thus the image position of the object can be represented as (15, 30).
The various physical locations described herein may be represented by coordinates in the same world coordinate system. One example of establishing such a world coordinate system is described below. The workpiece to be processed may be placed on a movable device, such as a movable stage. The movable stage may translate in a plane (which may be referred to as a "movement plane") or may rotate about a fixed axis of rotation in the movement plane. The workpiece to be machined moves synchronously with the movable stage, so that the physical position of the movable stage and the physical position of the workpiece to be machined described herein can be regarded as the same, and the two can be expressed interchangeably. Two mutually perpendicular grating scales can be arranged in the moving range of the movable carrier. For example, when the movable stage is stopped at a predetermined initial physical position, the reading of the grating scale at this time may be set to 0, and the physical position may be determined as the origin O of the world coordinate system. A first grating scale may be disposed along the first direction beyond the origin O, and an axis on which the first grating scale is located may be an X-axis of the world coordinate system. A second grating ruler is arranged perpendicularly to the X axis and passes through the origin O. The axis on which the second grating scale is located may be the Y-axis of the world coordinate system. The first direction may be defined as needed, and for convenience of description, the first direction is defined herein as a horizontal direction, which is also an X-axis direction, and a Y-axis direction perpendicular to the X-axis direction is defined as a vertical direction. After the world coordinate system is established, when the movable carrying platform moves each time, namely, when a workpiece to be machined moves, corresponding X-axis coordinates and Y-axis coordinates can be read from the first grating ruler and the second grating ruler, and the physical position of the workpiece to be machined can be represented by adopting the (X, Y) coordinates. It will be appreciated that (X, Y) may be coordinate data representing the displacement of the workpiece to be machined.
The image position and the physical position have a certain conversion relation. The conversion relation may be stored in the storage device in advance. The storage device may be a storage device included in a device (e.g., a host computer) for performing the method 100 for correcting a predetermined wire position of a workpiece, or may be a separate storage device to which the device for performing the method 100 for correcting a predetermined wire position of a workpiece may be communicably connected. Knowing the image location, i.e. the physical location, can be known based on the conversion relationship and vice versa.
And sequentially and correspondingly determining a plurality of groups of position points based on the plurality of groups of predetermined line images to be detected and based on the reference position points, wherein different position points are position points corresponding to different characteristic points on the predetermined line in the reference position points and the plurality of groups of position points. The feature points may be any identifiable feature points on the workpiece to be machined. The feature points may be feature points of the workpiece itself, or may be feature points that are additionally marked on the workpiece, for example, manually or by a machining device. In one example, the feature point may be a center point of an intersection region of two mutually perpendicular scribe lanes (simply referred to as a "scribe lane center") on the workpiece to be processed. The different feature points may be the center of the scribe line at different locations on the wafer, respectively. The position point corresponding to any feature point may be an image position point corresponding to the feature point in the image coordinate system, or may be a physical position point corresponding to the feature point in the world coordinate system.
Illustratively, FIG. 2 shows a scribe line image according to one embodiment of the invention. The reference position point may be represented by an image position point (i.e., an image position) or a physical position point (i.e., a physical position) corresponding to the center of the scribe line included in the first scribe line and the second scribe line. The first set of predetermined line images to be measured may include a first predetermined line image to be measured and a second predetermined line image to be measured. The first predetermined line image to be measured may at least include a dotted line area on the left side as shown in fig. 2, and the image may represent the first portion of the image capturing device during the process of moving the wafer from the reference position point to the right in the horizontal directionAn image acquired at the intersection area of the scribe line and the third scribe line. The second predetermined line image to be measured may at least include a dotted line area on the right side as shown in fig. 2, and the image may represent an image acquired by the image acquisition device for an intersection area of the first scribe line and the fourth scribe line in a process that the wafer starts to move leftwards in the horizontal direction from the reference position point. Therefore, the reference position points respectively move to two sides along the horizontal direction, a first group of predetermined line images to be detected can be acquired and obtained, and then the first position point A is determined based on the first group of predetermined line images to be detected 1 And a second position point A 2 . First position point A 1 The first scribe line and the third scribe line may include an image position point or a physical position point corresponding to the center of the scribe line. Second position point A 2 The first dicing lane and the fourth dicing lane may include an image position point or a physical position point corresponding to the dicing lane center. In a similar manner, multiple sets of location points B may be determined sequentially 1 B 2 、C 1 C 2 Etc., and each set of location points may include a first location point and a second location point. In the horizontal direction, the intervals between the two position points included in each of the plurality of groups of position points gradually increase. Namely C 1 C 2 The distance between them is greater than B 1 B 2 Distance between them. Illustratively, the number of groups of the plurality of groups of predetermined line images to be measured is identical to the number of groups of the plurality of groups of position points and the plurality of groups of predetermined line images to be measured are in one-to-one correspondence with the plurality of groups of position points.
It will be appreciated that "points" described in the present invention, such as position points, feature points, reference points, etc., are corresponding to a "region" in the case of enlarging the corresponding image, such as the center of the dicing lane where the first dicing lane intersects the second dicing lane as shown in fig. 2, although described above as "image position points", it is seen from fig. 2 that a "region" is shown in the illustrated case. The "region" herein may be an image region composed of a single pixel or a plurality of pixels in an image.
Step S130, after each time a group of position points are determined, the position of the workpiece to be processed is adjusted according to the connecting angle of the connecting line between the first position point and the second position point in the group of position points relative to the preset reference direction so as to correct the position of the preset line on the workpiece to be processed.
Illustratively, in performing step S120, the following operations may be performed after each set of location points is determined to correct the location of a predetermined line on the wafer. For example, after determining the first set of location points, the first location point A of the set of location points can be used 1 And a second position point A 2 The angle of the connecting line relative to the horizontal direction adjusts the position of the wafer. If the first position point A 1 And a second position point A 2 The connection line is inclined 2 degrees anticlockwise relative to the horizontal direction, and the wafer can be rotated 2 degrees clockwise at this time to enable the first position point A on the wafer 1 And a second position point A 2 The connecting line between the two is coincident with the horizontal direction. This makes it possible to correct the predetermined line to be inclined parallel to the preset reference direction. It will be appreciated that the direction of all predetermined lines on the workpiece to be machined may be corrected by adjusting the direction of all predetermined lines thereon.
According to the preset line positioning method provided by the embodiment of the invention, a plurality of groups of position points are determined, and the position of a workpiece to be machined is adjusted through the connecting angle of the connecting line between two position points in each group of position points relative to the connecting line in the preset reference direction, so that the position of the preset line on the workpiece to be machined is corrected. By setting a plurality of groups of position points, the high-precision positioning of the preset line on the workpiece to be processed can be realized in a wider range.
Illustratively, determining a plurality of groups of position points based on the plurality of groups of predetermined line images to be measured and based on the reference position points sequentially and correspondingly may include: acquiring a preset template image, wherein the preset template image comprises position features and reference points associated with a preset line; matching the preset template image with any current preset line image to be detected according to the position characteristics contained in the preset template image; and determining a point corresponding to the reference point in the preset template image in the current predetermined line image to be detected as a current characteristic point corresponding to the current predetermined line image to be detected based on the matching result.
In one embodiment, the method of obtaining the preset template image is similar to step S110, and is not described herein for brevity. The preset template image may be an image containing any of the position features associated with the predetermined line and the reference point on the workpiece to be processed. The workpiece may be any product for processing, such as ceramics, wafers, etc. The preset template image may be identical to or smaller than the image size of the predetermined line image to be measured. The preset template image is pre-marked with a position feature and a reference point which are associated with a preset line. The reference point may be any identifiable point on the predetermined line. The reference points are consistent with the types of the characteristic points and are used for being compared with each predetermined line image to be detected to determine the positions of the identification points. For example, the reference point may be the center of the scribe line. Fig. 3 shows a schematic diagram of a preset template image according to one embodiment of the invention. As shown in fig. 3, the preset template image includes a center of a scribe line (indicated by a black dot), and the center of the scribe line may be used as a reference point. Fig. 3 also shows a cross-shaped white area, which is part of two mutually perpendicular cutting tracks, respectively. The intersection area is the area where the rectangular frame shown by the middle broken line is located. Meanwhile, the preset template image may further include an area (may be referred to as a preset area) located within a preset range around the intersection area, such as 4 gray sub-areas and an area where two cutting lines are located outside the intersection area as shown in fig. 3. The preset range is set so that the intersection area and the image features contained in the preset area enable the image processing algorithm to be enough to identify the positions of the intersection area and the preset area from the image acquired by the image acquisition device based on the image features. As shown in fig. 3, the image features contained in the intersection area are not obvious and are difficult to distinguish, so that the image features which are enough to distinguish can be formed by combining the preset areas around the intersection area, the positions of the intersection area and the preset areas can be identified, and the main purpose is to identify the positions of the intersection area and further determine the positions of the identification features. The position features included in the preset template image may refer to the above-described intersection region and the preset region.
According to the position characteristics contained in the preset template image, the preset template image can be matched with any current preset line image to be detected. This can be achieved by: identifying a second position feature matched with the position feature in the preset template image from the preset template image to be detected, and determining the image position of the second position feature in the preset template image as the image position of the position feature in the preset template image to be detected. In addition, based on a matching result on the current predetermined line image to be detected and based on a relative position relation between the reference point and the position feature in the preset template image, a point corresponding to the reference point in the preset template image in the current predetermined line image to be detected can be determined as a current feature point corresponding to the current predetermined line image to be detected.
According to the technical scheme, the current feature point corresponding to the current preset line image to be detected can be determined through the matching result of the preset template image and any current preset line image to be detected. The method can accurately and efficiently obtain the characteristic points in the predetermined line image to be detected without complex operation and calculation.
For example, the workpiece to be processed may include a first predetermined line and a second predetermined line intersecting the first predetermined line, and an intersection point of the first predetermined line and the second predetermined line is taken as a reference point in the preset template image.
In one embodiment, the wafer may include a first predetermined line and a second predetermined line thereon. And the first predetermined line and the second predetermined line cross each other. The angle between the first predetermined line and the second predetermined line may be any angle. Such as 45 degrees, 60 degrees, 90 degrees, etc. In the preset template image, an intersection point of the first preset line and the second preset line may be used as a reference point. For example, when the first predetermined line and the second predetermined line represent two cut lines, respectively, the center point of the intersection region thereof may be used as the reference point.
According to the technical scheme, the intersection point of the first preset line and the second preset line is used as the reference point, the reference point is relatively easy to identify, namely, the characteristic point in the image of the preset line to be detected is relatively easy to determine, and the efficiency and the accuracy of the preset line position correction method are improved.
Illustratively, among the reference position points and the plurality of sets of position points, each position point is an image position point of the corresponding feature point in the corresponding predetermined line image, each image position point corresponds to a physical position point in the world coordinate system, and a distance between physical position points corresponding to two position points of each set of position points is an integer multiple of a distance between adjacent predetermined lines.
In one embodiment, each of the reference position point and the plurality of sets of position points is an image position point of the corresponding feature point in the corresponding predetermined line image to be measured. It is understood that the feature points are fixed features on the wafer, such as scribe line centers. The spacing between every two adjacent feature points may be uniform. In the process of moving the wafer along the horizontal direction, the physical position point corresponding to each feature point changes. For a first group of predetermined line images to be measured, a first position point A 1 And a second position point A 2 The image position points of the feature points in the two predetermined line images to be detected can be respectively corresponding. For example, a first location point A 1 The image position points of the characteristic points in the predetermined line image to be detected can be corresponding to the position points. Each image location point corresponds to a physical location point in the world coordinate system. The distance between the physical location points corresponding to two location points of each set of location points may be an integer multiple of the spacing between adjacent predetermined lines. Referring to FIG. 2, assume that the distance between any two vertical cuts is L, a first location point A 1 And a second position point A 2 The distance between the corresponding physical location points is an integer multiple of L, for example, 2L, 3L, etc. For example, in moving the wafer in the horizontal direction to obtain different line images to be measured, the displacement of the wafer may be made an integer multiple of L each time, and the current line image to be measured may be acquired each time the movement is stopped. Moving the wafer in the above manner can make the next dicing lane (which is an integer multiple of the distance L from the current dicing lane) also appear as much as possible within the image capturing range of the image capturing device. Since the scribe line itself may be inclined with respect to the horizontal, if the wafer is moved by other non-integer multiple of pitch displacement, the next scribe line may not appear in the image acquisition range of the image acquisition device And is enclosed inside.
According to the technical scheme, the distance between the physical position points corresponding to the two position points in each group of position points is an integral multiple of the distance between adjacent preset lines, so that the first position points and the second position points can be contained in each group of preset line images to be detected, and the preset lines can be corrected conveniently.
Illustratively, before determining the plurality of sets of location points based on the plurality of sets of predetermined line images to be measured and based on the reference location points in sequence, the method may further include: acquiring a preset template image, wherein the preset template image comprises position features and reference points associated with a preset line; matching the preset template image with an initial preset line image according to the position characteristics contained in the preset template image, wherein the initial preset line image is an image acquired by the image acquisition device for acquiring a preset line when a workpiece to be processed is in an initial position; based on the matching result, determining points corresponding to reference points in the preset template image in the initial preset line image as initial feature points; based on the deviation between the image position of the initial characteristic point in the initial preset line image and the image center of the initial preset line image, adjusting the relative position between the image acquisition device and the workpiece to be processed, so that the initial characteristic point is aligned with the view center of the image acquisition device; and determining the position point corresponding to the initial characteristic point after alignment as a reference position point.
In an embodiment, the method for acquiring the preset template image is described in detail above, and for brevity, will not be described herein. For example, the image capturing device may capture an image for a predetermined line on the wafer when the wafer is in the initial position, the image being the initial predetermined line image. The preset template image and the initial preset line image may be matched in a similar manner as before according to the intersection region of the dicing streets included in the preset template image. Points in the initial predetermined line image corresponding to reference points in the preset template image can be obtained based on the matching result. This point may be referred to as an initial feature point. The relative position between the image capture device and the wafer may then be adjusted, for example, the wafer is moved, based on the deviation of the initial feature points between the image positions in the initial pre-line image and the image center of the initial pre-line image, such that the initial feature points are aligned with the field of view center of the image capture device. And taking the position point corresponding to the initial characteristic point after alignment as a reference position point. The above-mentioned operation of adjusting the relative position between the image capturing device and the wafer based on the deviation so that the initial feature point is aligned with the center of the field of view of the image capturing device is optional, and the position point corresponding to the initial feature point may be directly used as the reference position point if necessary.
According to the technical scheme, the relative positions between the image acquisition device and the workpiece to be processed are adjusted through the deviation between the image positions of the initial characteristic points in the initial preset line image and the image center of the initial preset line image, so that the initial characteristic points are aligned with the visual field center of the image acquisition device. Thus, the method is favorable for accurately positioning the reference position point, and further is favorable for improving the positioning precision of other subsequent position points.
Illustratively, among the reference position points and the plurality of sets of position points, each position point is an image position point of the corresponding feature point in the corresponding predetermined line image, each image position point corresponds to a physical position point in the world coordinate system, the plurality of sets of position points are determined based on the plurality of sets of predetermined line images to be measured and corresponding in turn based on the reference position points, and for each set of position points in the plurality of sets of position points, it may include: controlling the to-be-machined piece to move to a first physical position along a first direction axis by taking a physical position point corresponding to the reference position point as a center, acquiring a first to-be-measured preset line image acquired after the movement, and controlling the to-be-machined piece to move to a second physical position along a second direction axis opposite to the first direction axis, and acquiring a second to-be-measured preset line image acquired after the movement; determining a first position point and a second position point of the group of position points based on the first predetermined line image to be measured and the second predetermined line image to be measured; wherein the first direction axis and the second direction axis are axes in a preset reference direction, the first physical position is a physical position point corresponding to a first position point in the set of position points, and the second physical position is a physical position point corresponding to a second position point in the set of position points.
In one embodiment, the following operations may be performed for each of the plurality of sets of location points. The direction to the right in the horizontal direction can be represented by a first direction axis (for example, x+ axis) with the physical position point corresponding to the reference position point as the center; its direction to the left in the horizontal direction may be represented by a second direction axis (e.g. X-). After the movable carrier carries the wafer to move to the first physical position along the X+ axis, a first predetermined line image to be measured of the wafer at the first physical position can be obtained by utilizing the image acquisition device. And then controlling the movable carrier to move to a second physical position along the X-axis, and acquiring a second predetermined line image to be detected of the wafer at the second physical position by utilizing the image acquisition device.
Based on the obtained first predetermined line image to be measured and the second predetermined line image to be measured, the centers of the cutting lines in the first predetermined line image to be measured and the second predetermined line image to be measured can be respectively determined as a first position point and a second position point. Wherein the first physical location is a physical location point corresponding to a first location point of the set of location points and the second physical location is a physical location point corresponding to a second location point of the set of location points.
According to the technical scheme, the workpiece to be processed is controlled to move towards two sides along the preset reference direction respectively, and the first predetermined line image to be detected and the second predetermined line image to be detected are acquired. Then, based on the first predetermined line image to be measured and the second predetermined line image to be measured, a first position point and a second position point of the set of position points are determined. The method is simple and convenient to operate, so that the efficiency is high, and the deviation of the preset line relative to the preset reference direction can be conveniently and accurately determined.
Illustratively, adjusting the position of the workpiece to be processed according to the connecting angle of the connecting line between the first position point and the second position point in the group of position points relative to the preset reference direction to correct the position of the preset line on the workpiece to be processed may include: the following correction operations are performed: under the condition that the connecting line angle is larger than a preset angle threshold, determining a corresponding adjusting angle according to the connecting line angle, and adjusting the position of the workpiece to be processed based on the adjusting angle so as to correct the position of a preset line on the workpiece to be processed; stopping correction under the condition that the connecting line angle is smaller than or equal to a preset angle threshold value; and under the condition that the connecting line angle is larger than a preset angle threshold value, after the step of determining a corresponding adjusting angle according to the connecting line angle and adjusting the position of the to-be-machined piece based on the adjusting angle, the step of determining the next group of position points is carried out, wherein the distance between two position points contained in the next group of position points is larger than the distance between two position points contained in the current group of position points along the preset reference direction.
In one embodiment, a user may preset a preset angle threshold to determine whether the predetermined line needs correction. The preset angle threshold may be any angle greater than 0. By way of example and not limitation, the preset angle threshold may be at [0.001,0.2 ]]The range of the degree is, for example, 0.1 degree, 0.03 degree, 0.006 degree, 0.002 degree, or the like. Correcting the position of the predetermined line on the wafer may include the following correction operation. If the first position point A 1 And a second position point A 2 The connecting line angle between the two is 0.7 degree and is larger than a preset angle threshold value of 0.002 degree. At this time, it is required to follow the first position point A 1 And a second position point A 2 The wafer is rotated by an angle opposite to the oblique direction of the line therebetween so that the line coincides with the horizontal direction. Then a second group of predetermined line images to be measured is obtained, aiming at a first position point B in the second group of predetermined line images to be measured 1 And a second position point B 2 The first position point B is judged in a similar manner to the foregoing 1 And a second position point B 2 Whether the connecting line angle between the two is larger than a preset angle threshold value of 0.002. And if so, performing a correction operation. After the correction operation is sequentially executed, stopping correction until the connecting line angle between the first position point and the second position point in a certain group of to-be-detected predetermined line images is smaller than or equal to a preset angle threshold value of 0.002. It should be noted that the next set of location points includes two location points (e.g., B 1 B 2 ) The distance between the two points is larger than that of the two points contained in the current group (such as A 1 A 2 ) The spacing between them.
According to the above-described technical solution, the position of the predetermined line can be repeatedly corrected a plurality of times by sequentially performing the above-described correction operations, and such a repeated correction scheme contributes to improvement of correction accuracy.
Illustratively, the method may further comprise: outputting a user interface; receiving a preset angle threshold value and a correction frequency threshold value which are set on a user interface by a user; and outputting alarm information when the execution times of the correction operation reach a correction times threshold value and the connecting line angle corresponding to the current group of position points is larger than a preset angle threshold value.
The user may input any of the user input information described herein, such as a preset angle threshold, a correction number threshold, etc., to a device (e.g., a host computer system) for performing the predetermined line position correction method 100 for a workpiece to be processed through an input device. The input device may include, but is not limited to, one or more of the following: a mouse, a keyboard, a touch screen, a microphone, etc. In one embodiment, the user interface may be displayed on a display device. The user may interact with the operable controls in the user interface via a mouse, keyboard, or the like to enter the user input information. For example, a user may set a preset angle threshold and a correction number threshold within a user interface using information input controls and operable controls. For example, the user interface includes two lines of information, and the first line is a preset angle threshold. The user clicks an information input box on the right side of the preset angle threshold to input 0.002, and clicks a confirm control. At this point it may be indicated that the user has completed setting the preset angle threshold. Similarly, the second row may be the correction number threshold. The correction number threshold may be set to any integer greater than 0. For example, may be equal to 3, 4, 6, etc. The user may click on the information input box to the right of the correction count threshold to enter "4" and click on the "confirm" control. At this time, it may be indicated that the user has completed setting the threshold for the correction number of times. And under the condition that the execution times of the correction operation reach 4 times and the connecting line angle corresponding to the current group of position points is still larger than the preset angle threshold value of 0.002 degrees, optionally outputting alarm information to prompt a user to timely adjust the position of the workpiece to be processed or take other countermeasures. Optionally, the preset angle threshold and/or the correction frequency threshold may also be preset fixed values.
According to the technical scheme, the user is allowed to set the preset angle threshold and the correction frequency threshold by the user interface, so that the user can conveniently control the execution of correction operation according to the user's own needs, and the diversified and personalized needs of the user can be met.
Illustratively, the conversion relationships described above may be determined by: acquiring a plurality of images to be detected, wherein the images to be detected are acquired by an image acquisition device aiming at a workpiece to be detected when the workpiece to be detected is respectively positioned at a plurality of different third physical positions, and the number of the images to be detected is more than or equal to 3; for each image to be detected in a plurality of images to be detected, determining the image position of the identification feature in the image to be detected according to the template image; and determining a conversion relation according to the image positions of the identification features in the images to be detected and the third physical positions.
The template image may be, for example, an image containing any identifying features on the workpiece to be machined. The identification feature may be any identifiable feature on the work piece to be processed. Illustratively, the identification feature may be a feature that is self-contained on the work piece to be processed, such as a feature on some shape or structure. The identification feature may also be a feature that is additionally marked on the work piece to be processed, for example by a manual or machining means or the like, such as some kind of easily identifiable symbol, pattern or the like. The identification feature may be of any shape, such as circular, cross-shaped, or star-shaped, etc. Preferably, the identification feature is a scribe line center.
In one embodiment, the number of the plurality of images to be measured is greater than or equal to 3. By way of example and not limitation, the number of the plurality of images to be measured is greater than or equal to 3 and less than or equal to 9. For example, there are 9 total images to be measured. The 9 images to be detected may be images acquired by the image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively at 9 different third physical positions. 9 different third physical positions K 1 、K 2 、...、K 9 May be arbitrary.
For each of the 9 images to be measured, the image position of the identification feature in the image to be measured can be determined according to the acquired template image. According to the template image, determining the image position of the identification feature in the image to be detected can be realized by the following modes: identifying a second identification feature matched with the identification feature in the template image from the image to be detected, and determining the image position of the second identification feature in the image to be detected as the image position of the identification feature in the image to be detected.
Image positions F in 9 images to be measured respectively according to the identification features 1 、F 2 、...、F 9 A plurality of corresponding 9 third physical locations K 1 、K 2 、...、K 9 Can establish a mapping relation (X K ,Y K )＝f(w)(x F ,y F )。(X K ,Y K ) Representing each third physical location, (x) F ,y F ) Representing the position of each image. The f (w) matrix can be calculated by the determined 9 coordinate points, and the conversion relationship between each image position and the corresponding third physical position can be determined. The conversion relation between any image position and the corresponding physical position can be determined according to the conversion relation.
According to the above technical solution, the conversion relationship may be determined based on the image positions of the identification features in the plurality of images to be measured and the plurality of third physical positions of the identification features. The method determines the conversion relation through the plurality of image positions and the plurality of third physical positions, and has simple algorithm and convenient realization.
According to another aspect of the present invention, there is also provided a predetermined line position correction device for a workpiece to be machined. Fig. 4 shows a schematic flow chart of a predetermined wire position correction device 400 of a workpiece to be processed according to an embodiment of the invention, and as shown in fig. 4, the device 400 may comprise an acquisition module 410, a determination module 420 and a correction module 430.
The acquiring module 410 is configured to acquire a plurality of sets of predetermined line images to be detected including predetermined lines, where each set of predetermined line images to be detected is an image acquired by the image acquisition device for a predetermined line on a workpiece to be processed when the workpiece to be processed moves along a preset reference direction.
The determining module 420 is configured to sequentially determine a plurality of groups of location points based on a plurality of groups of predetermined line images to be measured and based on reference location points, where each group of location points includes a first location point and a second location point, the first location point and the second location point are located at two sides of the reference location point, and along a preset reference direction, a distance between two location points included in each of the plurality of groups of location points is gradually increased, the plurality of groups of predetermined line images to be measured correspond to the plurality of groups of location points one by one, and any group of predetermined line images to be measured includes two predetermined line images to be measured corresponding to the first location point and the second location point in the corresponding group of location points; among the reference position point and the plurality of groups of position points, different position points are position points corresponding to different feature points on a predetermined line.
The correction module 430 is configured to adjust a position of the workpiece to be processed according to a line angle of a line between the first position point and the second position point in the set of position points with respect to a preset reference direction after determining a set of position points each time, so as to correct a position of a predetermined line on the workpiece to be processed.
According to still another aspect of the present invention, there is also provided an electronic apparatus. Fig. 5 shows a schematic block diagram of an electronic device 500 according to one embodiment of the invention, which electronic device 500 may comprise a processor 510 and a memory 520 as shown in fig. 5. Wherein the memory 520 stores a computer program, and the processor 510 executes the computer program to implement the above-mentioned method for correcting the predetermined line position of the workpiece.
According to still another aspect of the present invention, there is also provided a storage medium. Program instructions are stored on the storage medium for executing the above-described method of correcting a predetermined line position of a workpiece to be machined when running. The storage medium may include, for example, a storage component of a tablet computer, a hard disk of a personal computer, read-only memory (ROM), erasable programmable read-only memory (EPROM), portable compact disc read-only memory (CD-ROM), USB memory, or any combination of the foregoing storage media. The computer-readable storage medium may be any combination of one or more computer-readable storage media.
Those skilled in the art can understand the specific implementation schemes and the beneficial effects of the above-mentioned wire position correction device, electronic device and storage medium for the workpiece through reading the above-mentioned related description about the wire position correction method for the workpiece, and for brevity, the description is omitted here.
Although the illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the above illustrative embodiments are merely illustrative and are not intended to limit the scope of the present invention thereto. Various changes and modifications may be made therein by one of ordinary skill in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the present invention as set forth in the appended claims.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, e.g., the division of the elements is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple elements or components may be combined or integrated into another device, or some features may be omitted or not performed.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in order to streamline the invention and aid in understanding one or more of the various inventive aspects, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention. However, the method of the present invention should not be construed as reflecting the following intent: i.e., the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
It will be understood by those skilled in the art that all of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or units of any method or apparatus so disclosed, may be combined in any combination, except combinations where the features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.
Various component embodiments of the invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art will appreciate that some or all of the functions of some of the modules in the predetermined wire position correction device for a workpiece according to an embodiment of the invention may be implemented in practice using a microprocessor or Digital Signal Processor (DSP). The present invention can also be implemented as an apparatus program (e.g., a computer program and a computer program product) for performing a portion or all of the methods described herein. Such a program embodying the present invention may be stored on a computer readable medium, or may have the form of one or more signals. Such signals may be downloaded from an internet website, provided on a carrier signal, or provided in any other form.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names.
The foregoing description is merely illustrative of specific embodiments of the present invention and the scope of the present invention is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the scope of the present invention. The protection scope of the invention is subject to the protection scope of the claims.

Claims (11)

1. A predetermined line position correction method of a workpiece, the predetermined line being a characteristic line on the workpiece, comprising:
acquiring a plurality of groups of predetermined line images to be detected, wherein the predetermined line images to be detected comprise images of the predetermined lines, and each group of predetermined line images to be detected is an image acquired by an image acquisition device aiming at the predetermined line on the workpiece to be detected under the condition that the workpiece to be detected moves along a preset reference direction;
based on the multiple groups of predetermined line images to be detected, and based on reference position points, sequentially and correspondingly determining multiple groups of position points, wherein each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between two position points contained in each of the multiple groups of position points is gradually increased along the preset reference direction, the multiple groups of predetermined line images to be detected are in one-to-one correspondence with the multiple groups of position points, and any group of predetermined line images to be detected comprises two predetermined line images to be detected which are respectively corresponding to the first position point and the second position point in the corresponding group of position points;
after each time a group of position points are determined, the position of the to-be-machined piece is adjusted according to the connecting line angle of a connecting line between a first position point and a second position point in the group of position points relative to the preset reference direction so as to correct the position of the preset line on the to-be-machined piece;
Among the reference position points and the plurality of groups of position points, different position points are position points corresponding to different feature points on the predetermined line.
2. The method according to claim 1, wherein the sequentially determining the plurality of sets of location points based on the plurality of sets of predetermined line images to be measured and based on the reference location points includes:
acquiring a preset template image, wherein the preset template image comprises position features and reference points associated with the preset line;
matching the preset template image with any current preset line image to be detected according to the position characteristics contained in the preset template image;
and determining a point corresponding to the reference point in the preset template image in the current preset line image to be detected as a current characteristic point corresponding to the current preset line image to be detected based on a matching result.
3. The method according to claim 2, wherein the workpiece to be machined includes a first predetermined line and a second predetermined line intersecting the first predetermined line, and an intersection point of the first predetermined line and the second predetermined line is taken as the reference point in the preset template image.
4. A method according to any one of claims 1-3, wherein each of the reference position points and the plurality of sets of position points is an image position point of a corresponding feature point in a corresponding predetermined line image to be measured, each image position point corresponding to a physical position point in a world coordinate system,
the distance between the physical position points corresponding to the two position points in each group of position points is an integral multiple of the distance between adjacent preset lines.
5. A method according to any one of claims 1-3, wherein before said sequentially corresponding determination of a plurality of sets of location points based on said plurality of sets of predetermined line images to be measured and based on reference location points, the method further comprises:
acquiring a preset template image, wherein the preset template image comprises position features and reference points associated with the preset line;
matching the preset template image with an initial preset line image according to the position characteristics contained in the preset template image, wherein the initial preset line image is an image acquired by the image acquisition device aiming at the preset line when the workpiece to be processed is at an initial position;
Determining a point corresponding to a reference point in the preset template image in the initial preset line image as an initial characteristic point based on a matching result;
based on the deviation between the image position of the initial characteristic point in the initial preset line image and the image center of the initial preset line image, adjusting the relative position between the image acquisition device and the workpiece to be processed so that the initial characteristic point is aligned with the visual field center of the image acquisition device;
and determining the position point corresponding to the initial characteristic point after alignment as the reference position point.
6. A method according to any one of claims 1-3, wherein each of the reference position points and the plurality of sets of position points is an image position point of a corresponding feature point in a corresponding predetermined line image, each image position point corresponding to a physical position point in a world coordinate system, the determining of the plurality of sets of position points based on the plurality of sets of predetermined line images to be measured and based on the reference position points in turn comprises:
for each of the plurality of sets of location points,
controlling the to-be-machined piece to move to a first physical position along a first direction axis by taking a physical position point corresponding to the reference position point as a center, acquiring a first to-be-measured preset line image acquired after the movement, and controlling the to-be-machined piece to move to a second physical position along a second direction axis opposite to the first direction axis, and acquiring a second to-be-measured preset line image acquired after the movement;
Determining a first position point and a second position point of the group of position points based on the first predetermined line image to be measured and the second predetermined line image to be measured;
wherein the first direction axis and the second direction axis are axes in the preset reference direction, the first physical position is a physical position point corresponding to a first position point in the set of position points, and the second physical position is a physical position point corresponding to a second position point in the set of position points.
7. A method according to any one of claims 1-3, wherein adjusting the position of the workpiece to be machined to correct the position of the predetermined line on the workpiece to be machined according to the line angle of the line between the first and second position points in the set of position points relative to the preset reference direction comprises: the following correction operations are performed:
when the connecting line angle is larger than a preset angle threshold, determining a corresponding adjusting angle according to the connecting line angle, and adjusting the position of the to-be-machined piece based on the adjusting angle so as to correct the position of the preset line on the to-be-machined piece;
stopping correction when the connecting line angle is smaller than or equal to the preset angle threshold value;
And when the connecting line angle is larger than the preset angle threshold, after the step of determining a corresponding adjusting angle according to the connecting line angle and adjusting the position of the workpiece to be processed based on the adjusting angle, the step of determining the next group of position points is executed, wherein the distance between two position points contained in the next group of position points is larger than the distance between two position points contained in the current group of position points along the preset reference direction.
8. The method of claim 7, wherein the method further comprises:
outputting a user interface;
receiving the preset angle threshold value and the correction frequency threshold value which are set on the user interface by a user;
and outputting alarm information when the execution times of the correction operation reach the correction times threshold value and the connecting line angle corresponding to the current group of position points is larger than the preset angle threshold value.
9. A predetermined line position correction device of a workpiece to be machined, comprising:
the acquisition module is used for acquiring a plurality of groups of to-be-detected preset line images containing the preset lines, wherein each group of to-be-detected preset line images are images acquired by an image acquisition device aiming at the preset lines on the to-be-processed workpiece under the condition that the to-be-processed workpiece moves along a preset reference direction;
The system comprises a determining module, a determining module and a display module, wherein the determining module is used for sequentially and correspondingly determining a plurality of groups of position points based on the plurality of groups of predetermined line images to be detected and based on reference position points, each group of position points comprises a first position point and a second position point, the first position point and the second position point are positioned at two sides of the reference position point, the distance between two position points contained in each group of position points is gradually increased along the preset reference direction, the plurality of groups of predetermined line images to be detected are in one-to-one correspondence with the plurality of groups of position points, and any group of predetermined line images to be detected comprises two predetermined line images to be detected which are respectively corresponding to the first position point and the second position point in the corresponding group of position points;
the correction module is used for adjusting the position of the workpiece to be processed according to the connecting line angle of the connecting line between the first position point and the second position point in the group of position points relative to the preset reference direction after determining one group of position points each time so as to correct the position of the preset line on the workpiece to be processed;
among the reference position points and the plurality of groups of position points, different position points are position points corresponding to different feature points on the predetermined line.
10. An electronic device comprising a processor and a memory, wherein the memory has stored therein computer program instructions which, when executed by the processor, are adapted to carry out the predetermined wire position correction method of a workpiece to be machined as claimed in any of claims 1 to 8.
11. A storage medium on which program instructions are stored, wherein the program instructions are operative to perform the predetermined wire position correction method of a workpiece as claimed in any one of claims 1 to 8.
CN202211648884.2A 2022-12-20 2022-12-20 Method and device for correcting position of scheduled line, electronic equipment and storage medium Pending CN116313967A (en)

Priority Applications (1)

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CN202211648884.2A CN116313967A (en) 2022-12-20 2022-12-20 Method and device for correcting position of scheduled line, electronic equipment and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211648884.2A CN116313967A (en) 2022-12-20 2022-12-20 Method and device for correcting position of scheduled line, electronic equipment and storage medium

Publications (1)

Publication Number Publication Date
CN116313967A true CN116313967A (en) 2023-06-23

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