CN117930066A - Device testing method, testing device and storage medium - Google Patents
Device testing method, testing device and storage medium Download PDFInfo
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- CN117930066A CN117930066A CN202211261497.3A CN202211261497A CN117930066A CN 117930066 A CN117930066 A CN 117930066A CN 202211261497 A CN202211261497 A CN 202211261497A CN 117930066 A CN117930066 A CN 117930066A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
- G01R31/42—AC power supplies
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Abstract
The present invention relates to the field of device testing, and in particular, to a device testing method, a testing device, and a storage medium, where the device testing method includes: acquiring a first configuration file corresponding to a first test component in target equipment to be tested; generating a second configuration file according to the first configuration file, and carrying out component configuration on the test equipment according to the second configuration file to obtain a second test component matched with the first test component; and testing the first test assembly according to the second test assembly. By generating the second configuration file according to the first configuration file corresponding to the first test component in the target device, configuring the test device according to the second configuration file, and testing the first test component according to the obtained second test component, differential testing of different components in the target device based on the same test device can be achieved, and the universality of device testing is improved.
Description
Technical Field
The present invention relates to the field of device testing, and in particular, to a device testing method, a device for testing, and a storage medium.
Background
Most existing devices typically employ a modular design, e.g., power input distribution components, power conversion components, power output distribution components, all employing a plug-in box design, for ease of access and removal. Individual components often do not have testability and therefore the device requires complete machine testing. In the prior art, because the configurations of different devices are different, different testing devices are required to be used for completing the test in a targeted manner, and the universality of the test is reduced. In addition, the automatic testing of the equipment in a componentization mode is not supported in the whole machine stage, and different equipment needs to develop and use corresponding testing software, so that the universality of the testing is reduced.
Therefore, how to improve the versatility of the device test is a problem to be solved.
Disclosure of Invention
The invention provides a device testing method, a testing device and a storage medium.
In a first aspect, the present invention provides a device testing method, applied to a testing device, where the method includes: acquiring a first configuration file corresponding to a first test component in target equipment to be tested; generating a second configuration file according to the first configuration file, and carrying out component configuration on the test equipment according to the second configuration file to obtain a second test component matched with the first test component; and testing the first test assembly according to the second test assembly.
In a second aspect, the present invention also provides a test apparatus comprising a power input distribution assembly, a load assembly, a power output distribution assembly, a processor, and a memory; the power input distribution assembly is used for forming a test assembly with the power output distribution assembly in the target equipment and testing the output power of the target equipment; the load assembly is used for forming a test assembly with the power conversion assembly in the target equipment and is used for simulating and adjusting the output power of the target equipment; the power output distribution assembly is used for forming a test assembly with the power input distribution assembly in the target equipment and is used for testing the feedback power of the target equipment and simulating the input power supply of the target equipment; the memory is used for storing programs; the processor is configured to execute the program and implement the device testing method as described above when the program is executed.
In a third aspect, the present invention also provides a storage medium for readable storage, the storage medium storing one or more programs executable by one or more processors to implement a device testing method as described above.
The invention discloses a device testing method, a device and a storage medium, wherein a configuration parameter corresponding to a first testing component in target equipment to be tested can be obtained by obtaining a first configuration file corresponding to the first testing component in the target equipment to be tested, and a second configuration file can be generated according to the configuration parameter in the first configuration file; by generating a second configuration file according to the first configuration file and carrying out component configuration on the test equipment according to the second configuration file, a second test component matched with the first test component can be obtained, and the second test component matched with the first test component can be flexibly configured according to the second configuration file; by testing the first test component according to the second test component, different components in the target device can be subjected to differential test based on the same test device, different test devices or test software are not required to be adopted for testing the target device, and the universality of device test is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a device testing system provided by an embodiment of the present invention;
FIG. 2 is a schematic diagram of a test apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart of a device testing method provided by an embodiment of the present invention;
FIG. 4 is a schematic flow chart of sub-steps of a component configuration provided by an embodiment of the present invention;
FIG. 5 is a schematic flow chart of a sub-step of determining a current load value of a load assembly provided by an embodiment of the present invention;
FIG. 6 is a schematic diagram of a load assembly provided by an embodiment of the present invention;
FIG. 7 is a schematic diagram of another load assembly provided by an embodiment of the present invention;
FIG. 8 is a schematic flow chart of a sub-step of component testing provided by an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The flow diagrams depicted in the figures are merely illustrative and not necessarily all of the elements and operations/steps are included or performed in the order described. For example, some operations/steps may be further divided, combined, or partially combined, so that the order of actual execution may be changed according to actual situations.
It is to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should also be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the following description, suffixes such as "module", "part" or "unit" for representing elements are used only for facilitating the description of the present invention, and have no particular meaning in themselves. Thus, "module," "component," or "unit" may be used in combination.
The embodiment of the invention provides a device testing method, a testing device and a storage medium. The device testing method can be applied to the testing device, the second configuration file is generated according to the first configuration file corresponding to the first testing component in the target device, the components in the testing device are configured according to the second configuration file, the different components in the target device can be subjected to differential testing based on the same testing device, and the universality of the device testing is improved.
By way of example, the target device may be a combined power device, e.g., a direct current power device, an alternating current power device, etc. In the embodiment of the present invention, a target device is taken as a dc power supply device for example.
Referring to fig. 1, fig. 1 is a schematic diagram of an apparatus testing system according to an embodiment of the present invention, as shown in fig. 1, the apparatus testing system may include a dc power supply apparatus and a dc power supply testing apparatus. The dc power source device may include, but is not limited to, a power output distribution component, a power conversion component, a power input distribution component, and the like. The power output distribution component is used for realizing the distribution of output power; the power conversion component is used for realizing power conversion; the power input distribution component is used for realizing distribution of input power. The specific configurations of the power output splitting assembly, the power conversion assembly, and the power input splitting assembly are not limited herein. The test device may include a dc power test device and a computer device, such as a server or terminal, that controls the dc power test device. The direct current power supply testing device can comprise a power input distribution component, a load component, a power output distribution component and the like. The power input distribution assembly, the load assembly, the power output distribution assembly and other assemblies can be installed through the plug box or the cabinet, different types of assemblies can be flexibly configured for the direct current power supply test equipment, and the assemblies are convenient for users to replace and maintain.
It should be noted that the dc power supply device is used for converting and managing the power generated by the commercial power, solar energy, wind energy, battery and generator. In different application scenarios, the requirements of the user on the dc power supply device are different, so that the dc power supply device is generally configured by combining components to meet the requirements. The dc power supply device needs to be tested before it is put into use. In the prior art, since the dc power supply apparatus is composed of the combined components, different dc power supply apparatuses or different components need to be tested by using different test apparatuses or test systems, and thus, the versatility of the test is inevitably reduced. In addition, the direct current power supply equipment does not support automatic testing of components in the whole machine stage, different components in the direct current power supply equipment need to be tested by developing corresponding testing software, development workload is large, and testing universality is reduced. According to the embodiment of the invention, the second configuration file is generated according to the first configuration file corresponding to the first test component in the target equipment, the component configuration is carried out on the test equipment according to the second configuration file, and the first test component is tested according to the obtained second test component, so that the differential test on different components in the target equipment based on the same test equipment can be realized, different test equipment or test software is not required to be adopted for testing the target equipment, the workload of software development is reduced, and the universality of equipment test is improved.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a test apparatus according to an embodiment of the invention. The test apparatus 1000 may comprise a processor 1001, a memory 1002, a power input distribution component 1003, a load component 1004, and a power output distribution component 1005, wherein the processor 1001, the memory 1002, the power input distribution component 1003, the load component 1004, and the power output distribution component 1005 may be connected by a bus, such as any suitable bus, for example, an I2C (Inter-INTEGRATED CIRCUIT) bus.
The memory 1002 may include a storage medium and an internal memory, among others. The storage medium may store an operating system and a computer program. The computer program comprises program instructions that, when executed, cause the processor 1001 to perform any of a number of device testing methods.
Wherein, the power input distribution component 1003 is configured to form a test component with the power output distribution component in the target device, and is configured to test the output power of the target device. The load assembly 1004, which may be a DC/AC power module, a DC/DC power module, or a DC power module, is configured to form a test assembly with the power conversion assembly in the target device for analog adjustment of the output power level of the target device. The power output distribution component 1005 is configured to form a test component with the power input distribution component in the target device, and is configured to test the feedback power of the target device and simulate the input power of the target device.
Wherein the processor 1001 is used to provide computing and control capabilities to support the operation of the entire test apparatus 1000.
The Processor 1001 may be a central processing unit (Central Processing Unit, CPU), which may also be other general purpose processors, digital signal processors (DIGITAL SIGNAL Processor, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), field-Programmable gate array (Field-Programmable GATE ARRAY, FPGA) or other Programmable logic device, discrete gate or transistor logic device, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
In an embodiment, the processor 1001 is configured to run a computer program stored in the memory 1002 and implement the following steps when executing the computer program:
Acquiring a first configuration file corresponding to a first test component in target equipment to be tested; generating a second configuration file according to the first configuration file, and carrying out component configuration on the test equipment according to the second configuration file to obtain a second test component matched with the first test component; and testing the first test assembly according to the second test assembly.
In one embodiment, the processor 1001, when implementing generating the second configuration file according to the first configuration file, is configured to implement:
Generating a template file according to the first configuration file, wherein the template file at least comprises a test function; based on a preset wiring corresponding relation table, wiring information between the test equipment and the target equipment is obtained, the wiring information is added into the test function, and the wiring information at least comprises test single board information, test channel information and amplification factor information; and determining the template file added with the wiring information as the second configuration file.
In one embodiment, the test apparatus includes a power input distribution component, a load component, and a power output distribution component; the processor 1001 is configured to, when implementing component configuration on the test device according to the second configuration file to obtain a second test component matched with the first test component, implement:
Screening components in the test equipment according to the components required by the second configuration file to obtain a target component, wherein the target component comprises at least one of a power input distribution component, a load component and a power output distribution component; and carrying out parameter configuration on the target component according to the component parameters in the second configuration file, and determining the target component after parameter configuration as the second test component.
In one embodiment, the target component comprises a power input distribution component or a power output distribution component, and the component parameters comprise wiring information; when implementing parameter configuration of the target component according to the component parameters in the second configuration file, the processor 1001 is configured to implement:
parameter configuration is carried out on the power output distribution assembly according to wiring information in the second configuration file, wherein the wiring information comprises test single board information, test channel information and amplification factor information; or carrying out parameter configuration on the power input distribution assembly according to the wiring information in the second configuration file.
In one embodiment, the component parameter comprises a target load value; when implementing parameter configuration of the target component according to the component parameters in the second configuration file, the processor 1001 is configured to implement:
determining a current load value of the load assembly; and if the current load value of the load assembly is different from the target load value, adjusting the current load value of the load assembly so that the adjusted load value is the same as the target load value.
In one embodiment, the load assembly includes at least one load cell, each of the load cells being disposed in a respective slot; the processor 1001, when implementing determining the current load value of the load component, is configured to implement:
Acquiring a communication address of each load unit; based on a communication bus, communicating with each corresponding load unit according to the communication address of each load unit, and obtaining a sub-load value of each load unit; and determining the current load value of the load assembly according to the sub-load value of each load unit.
In one embodiment, each load unit is connected in parallel with a voltage dividing resistor; the processor 1001, when implementing the obtaining the communication address of each of the load units, is configured to implement:
Detecting the voltage value of a voltage dividing resistor corresponding to each load unit; determining a target slot number corresponding to each load unit according to a voltage ratio between a voltage value of each voltage dividing resistor and a preset total voltage value based on a corresponding relation between a preset voltage ratio and the slot number; and correspondingly determining the communication address of each load unit according to the target slot number corresponding to each load unit.
In one embodiment, the processor 1001 is further configured to, prior to implementing the adjustment of the current load value of the load assembly, implement:
Determining a maximum load value of the load assembly; and if the maximum load value is smaller than the target load value, outputting prompt information to prompt the increase of the number of load units of the load assembly.
In one embodiment, the processor 1001, when implementing the adjustment of the current load value of the load component, is configured to implement:
and adjusting the load value of the load assembly after the load unit is added.
In one embodiment, the second configuration file further includes a test case; the processor 1001, when implementing testing the first test component according to the second test component, is configured to implement:
Based on a preset communication protocol file, testing the first test assembly according to the test case to obtain first test data, and testing the second test assembly according to the test case to obtain second test data; and comparing the first test data with the second test data to obtain a test result.
In one embodiment, the test case includes a test function; when the processor 1001 performs testing on the first test component according to the test case based on the preset communication protocol file, and obtains first test data, the processor is configured to implement:
Based on the communication protocol file, converting the test function into a test instruction in a preset format, and sending the test instruction to the target equipment so that the target equipment can test the first test component according to the test instruction to obtain test information; and receiving test information returned by the target equipment, and carrying out classification analysis on the test information according to analysis parameters in the communication protocol file to obtain the first test data.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
As shown in fig. 3, fig. 3 is a schematic flowchart of a device testing method according to an embodiment of the present invention. According to the equipment testing method, the second configuration file is generated according to the first configuration file corresponding to the first testing component in the target equipment, the component configuration is carried out on the testing equipment according to the second configuration file, the first testing component is tested according to the obtained second testing component, differential testing on different components in the target equipment based on the same testing equipment can be achieved, and the universality of equipment testing is improved. The device testing method includes steps S10 to S30.
Step S10, a first configuration file corresponding to a first test component in target equipment to be tested is obtained.
The first test component is illustratively a component to be tested in the target device and may be at least one of a power output distribution component, a power conversion component, and a power input distribution component. For example, the first test component may be a power output distribution component. For another example, the first test component may be a power conversion component. For another example, the first test component may be a power conversion component and a power input distribution component.
In the embodiment of the invention, the user can define the first configuration file in advance based on the component to be tested. The first configuration file may include, for example, a name of the component to be tested, a test type, a test channel identification number, a maximum sampled voltage value, a minimum sampled voltage value, and so on.
The test device may directly read the first configuration file corresponding to the first test component in the target device, or may obtain the first configuration file corresponding to the first test component in the target device through a server or a terminal. For example, a first configuration file corresponding to a first test component in the target device is obtained by a computer. It should be noted that, the user may configure the first configuration file through the computer and send the first configuration file to the test device.
By acquiring the first configuration file corresponding to the first test component in the target equipment to be tested, the configuration parameters corresponding to the first test component to be tested in the target equipment can be acquired, and then the second configuration file can be generated according to the configuration parameters in the first configuration file.
And step S20, generating a second configuration file according to the first configuration file, and carrying out component configuration on the test equipment according to the second configuration file to obtain a second test component matched with the first test component.
For example, after the first configuration file is obtained, the second configuration file may be generated according to the first configuration file. It should be noted that, since the first configuration file is defined according to the first test component in the target device and is not suitable for directly configuring the component in the test device, the second configuration file needs to be generated according to the first configuration file, so that component configuration of the test device according to the second configuration file can be implemented.
In some embodiments, generating the second profile from the first profile includes: generating a template file according to the first configuration file, wherein the template file at least comprises a test function; based on a preset wiring corresponding relation table, wiring information between the test equipment and the target equipment is obtained, the wiring information is added to the test function, and a template file added with the wiring information is determined to be a second configuration file. The wiring information at least comprises test single board information, test channel information and amplification factor information.
For example, a corresponding template file may be generated according to the identification number in the first configuration file, where the template file includes at least the test function. For example, the template file is formatted as follows: < TestCase IsCompelTest = "N" FunctionName = "plat _ battcurr1" title= "battery 1 detection"/>. Wherein, "TestCase IsCompelTest" indicates whether the test item can be selected; "FunctionName" represents the name of the test function; "Title" indicates the name of the test item displayed on the test interface.
For example, after the template file is generated, wiring information between the test device and the target device may be obtained based on the wiring correspondence table, and the wiring information may be added to the test function. It should be noted that the wiring correspondence table may be predefined or configured, and includes wiring information between the test device and the target device. The wiring information may include, but is not limited to, test board information, test channel information, and amplification factor information.
For example, the wiring information is added to the test function as follows:
<row id＝"plat.battcurr1">
<para name＝"Board ID">MT500FT</para>
<para name＝"Board Type">1</para>
<para name＝"Maximum Sensor Data">25</para>
<para name＝"Maximum Analog Data">200</para>
Wherein, "Board ID" > MT500FT < means that the identification number of the test Board is MT500FT; "Board Type" >1< means that the test channel is 1 channel; "Maximum Sensor Data" >25< means that the maximum sense magnification is 25; maximum Analog Data denotes a maximum analog magnification of 200.
In some embodiments, after the wiring information is added to the test function, the template file after the wiring information is added may be determined as the second configuration file. Thus, the second configuration file may include information such as test board information, test channel information, and magnification information.
The wiring information between the test equipment and the target equipment is added to the test function based on the preset wiring corresponding relation table, and the template file added with the wiring information is determined to be the second configuration file, so that the wiring information between the test equipment and the target equipment is added to the second configuration file, the second test assembly can be ensured to be matched with the first test assembly, and the success rate of equipment test is improved.
In the embodiment of the invention, after the second configuration file is generated according to the first configuration file, the component configuration can be performed on the test equipment according to the second configuration file, so as to obtain the second test component matched with the first test component. The specific procedure of the component configuration will be described in detail below.
Referring to fig. 4, fig. 4 is a schematic flowchart of the sub-steps of a component configuration according to an embodiment of the present invention, which may include the following steps S201 and S202.
Step S201, screening components in the test device according to the components required by the second configuration file, to obtain a target component, where the target component includes at least one of a power input distribution component, a load component, and a power output distribution component.
It should be noted that, in the embodiment of the present invention, the second configuration file may include, in addition to the component parameters, components required for testing the first test component. For example, when the first test component is a power output distribution component, the required component may be a power input distribution component. For another example, when the first test component is a power conversion component, the desired component may be a load component.
Illustratively, the components in the test equipment are screened according to the components required by the second configuration file, and the target components are obtained. For example, if the component required by the second profile is a power input distribution component, the power input distribution component in the test equipment may be determined to be the target component. For another example, if the component required by the second profile is a power output allocation component, the power output allocation component in the test device may be determined to be the target component.
And step S202, carrying out parameter configuration on the target component according to the component parameters in the second configuration file, and determining the target component after parameter configuration as the second test component.
By way of example, the component parameters may include wiring information, such as test board information, test channel information, and magnification information, among others.
In some embodiments, when the target component includes a power input allocation component, configuring the target component according to the component parameters in the second configuration file may include: and carrying out parameter configuration on the power input distribution assembly according to the wiring information in the second configuration file.
For example, the power input allocation component may be configured according to the test board information, the test channel information, and the amplification factor information in the second configuration file. The specific process of parameter configuration is not limited herein.
In some embodiments, when the target component includes a power output allocation component, configuring the target component according to the component parameters in the second configuration file may include: and carrying out parameter configuration on the power output distribution assembly according to the wiring information in the second configuration file.
For example, the power output allocation component may be configured according to the test board information, the test channel information, and the amplification factor information in the second configuration file. The specific process of parameter configuration is not limited herein.
In the embodiment of the invention, the parameter configuration can be carried out on the power input distribution assembly and the power output distribution assembly, and the parameter configuration can also be carried out on the load assembly.
In some embodiments, the component parameters may further include a target load value, and configuring the target component according to the component parameters in the second configuration file may include: determining a current load value of the load assembly; and if the current load value of the load assembly is different from the target load value, adjusting the current load value of the load assembly so that the adjusted load value is the same as the target load value. The target load value may be set according to actual situations, and specific values are not limited herein. For a power supply device, the load value may be a power value.
Referring to fig. 5, fig. 5 is a schematic flowchart of a sub-step of determining a current load value of a load component according to an embodiment of the present invention, which may include the following steps S2021 to S2023.
Step S2021, acquiring a communication address of each of the load units.
In the embodiment of the present invention, in order to read the load value of the load unit, it is necessary to obtain the communication address of the load unit, and then communicate with the load unit based on the communication address and read the load value.
In some embodiments, obtaining the communication address of each load unit may include: detecting the voltage value of a voltage dividing resistor corresponding to each load unit; determining a target slot number corresponding to each load unit according to the voltage ratio between the voltage value of each voltage dividing resistor and a preset total voltage value based on the corresponding relation between the preset voltage ratio and the slot number; and correspondingly determining the communication address of each load unit according to the target slot number corresponding to each load unit.
The preset total voltage value may be determined according to an actual power supply, and specific values are not limited herein.
Referring to fig. 6, fig. 6 is a schematic diagram of a load assembly according to an embodiment of the invention. As shown in fig. 6, the load assembly includes at least one load cell, each load cell being disposed in a respective slot; each load unit is connected with a voltage dividing resistor in parallel, the signal line S1X is connected with the positive electrode of the power supply, and the signal line S1Y is connected with the negative electrode of the voltage. The first voltage value of the voltage dividing resistor is used for determining a target slot number of the load unit, and further the communication address of the load unit can be determined according to the target slot number. The resistance of each voltage dividing resistor may be set according to actual conditions, and specific values are not limited herein. The total voltage value may be set according to practical situations, for example, the total voltage value is 48V, but may be other voltage values, which is not limited herein.
For example, as shown in fig. 6, the voltage value of the voltage dividing resistor corresponding to each load unit may be detected by the sampling circuit, for example, the voltage value of the voltage dividing resistor R1 is v1, the voltage value of the voltage dividing resistor R2 is v2, the voltage value of the voltage dividing resistor R3 is v3, and the voltage value of the voltage dividing resistor R4 is v4. Then, a voltage ratio between the voltage value of each voltage dividing resistor and the total voltage value, for example, the voltage ratios are k1, k2, k3, k4 in order, is calculated. And secondly, determining a target slot number corresponding to each load unit according to the voltage ratio between the voltage value and the total voltage value of each voltage dividing resistor based on the corresponding relation between the preset voltage ratio and the slot number, wherein the target slot numbers corresponding to the load units are c1, c2, c3 and c4 in sequence. Finally, the communication address of each load unit can be correspondingly determined according to the target slot number corresponding to each load unit. For example, the target slot number may be determined as the communication address. For another example, the communication address of each load unit may be correspondingly determined according to the target slot number corresponding to each load unit based on the corresponding relation between the preset slot number and the communication address.
By acquiring the communication address of each load unit, the load unit can be communicated with the subsequent load unit according to the communication address, and the sub-load value of the load unit is further acquired.
Step S2022, based on the communication bus, communicates with each corresponding load unit according to the communication address of each load unit, to obtain a sub-load value of each load unit.
For example, after determining the communication address of each load unit, the sub-load value of each load unit may be obtained by communicating with each corresponding load unit according to the communication address of each load unit based on the communication bus. For example, the sub-load value of the load unit 1 is read by communicating with the load unit 1 according to the communication address of the load unit 1. For another example, the sub-load value of the load unit 2 is read by communicating with the load unit 2 based on the communication address of the load unit 2.
Step S2023, determining a current load value of the load assembly according to the sub-load value of each load unit.
For example, the sub-load values of each load unit may be added to obtain the current load value of the load assembly.
In the embodiment of the invention, after the current load value of the load assembly is determined, the current load value of the load assembly is adjusted. For example, if the current load value of the load component is different from the target load value, the current load value of the load component is adjusted so that the adjusted load value is the same as the target load value. For example, when the current load value of the load assembly is less than the target load value, the current load value of the load assembly is scaled up to the target load value. And when the current load value of the load assembly is larger than the target load value, reducing the current load value of the load assembly to the target load value.
In some embodiments, before adjusting the current load value of the load assembly, the method may further include: determining a maximum load value of the load assembly; and if the maximum load value is smaller than the target load value, outputting prompt information to prompt the increase of the number of load units of the load assembly.
It should be noted that, when the maximum load value of the load assembly is smaller than the target load value, it is explained that the current load value of the load assembly cannot be made the same as the target load value by adjusting in any way. At this time, the user needs to be prompted to increase the load unit of the load assembly.
For example, when the maximum load value of the load assembly is smaller than the target load value, a prompt message is output to enable the user to increase the number of load units of the load assembly. The mode of outputting the prompt information may be a short message, a mail, a voice, an indicator light, etc., which is not limited herein.
Referring to fig. 7, fig. 7 is a schematic diagram of another load assembly according to an embodiment of the invention. As shown in fig. 7, when the maximum load value of the load assembly is smaller than the target load value, the load unit 5 and the voltage dividing resistor R5 may be added on the basis of the original load assembly.
By determining the maximum load value of the load assembly, when the maximum load value of the load assembly is smaller than the target load value, a prompt message is output to prompt a user to increase the number of load units of the load assembly.
In some embodiments, adjusting the current load value of the load assembly includes: and adjusting the load value of the load assembly after the load unit is added.
Illustratively, when the current load value of the load assembly is less than the target load value, the current load value of the load assembly is scaled up to the target load value. And when the current load value of the load assembly is larger than the target load value, reducing the current load value of the load assembly to the target load value.
For example, after the target component is configured according to the component parameters in the second configuration file, the target component after the parameter configuration may be determined as the second test component. For example, when the first test component is a power output distribution component, the second test component may be a power input distribution component. For another example, when the first test component is a power conversion component, the second test component may be a load component.
By configuring the components of the test equipment according to the component parameters in the second configuration file, the second test component matched with the first test component can be obtained, and the second test component matched with the first test component can be flexibly configured.
And step S30, testing the first test assembly according to the second test assembly.
In the embodiment of the invention, the first test assembly is tested according to the second test assembly, so that different assemblies in the target equipment can be subjected to differential test based on the same test equipment, different test equipment or test software is not required to be adopted for testing the target equipment, and the universality of equipment test is improved.
In some embodiments, after obtaining a second test component that matches the first test component, the first test component may be tested according to the second test component based on the test cases. In the embodiment of the present invention, component testing will be described in detail.
Illustratively, the second configuration file includes test cases. Wherein the test case may include a test function. The test function may be plat _ battcurr1 function as described above, or may be another function, which is not limited herein. In the embodiment of the invention, different test cases can be used for testing different test components.
Referring to fig. 8, fig. 8 is a schematic flow chart of a sub-step of component testing according to an embodiment of the present invention, which may include the following step S301 and step S302.
Step 301, based on a preset communication protocol file, testing the first test component according to the test case to obtain first test data, and testing the second test component according to the test case to obtain second test data.
The preset communication protocol file refers to a related file specified in the "YDT 1104-2001-switch power system monitoring technical requirement and test method for communication", and the communication protocol file adopts an XML file format. In the embodiment of the invention, the communication protocol file is used for converting the format of the instruction/data between two devices so as to avoid the situation that the instruction and the analysis data cannot be identified in the component test process.
Illustratively, the parsing parameters in the communication protocol file may include test volume names, data lengths, numbers, data types, and so forth. The test quantity designations may include, but are not limited to, voltage, battery current, battery temperature, load current, current divider, and the like, among others.
In some embodiments, based on a preset communication protocol file, testing the first test component according to the test case to obtain first test data may include: based on the communication protocol file, converting the test function into a test instruction in a preset format, and sending the test instruction to the target equipment so that the target equipment can test the first test component according to the test instruction to obtain test information; and receiving test information returned by the target equipment, and carrying out classification analysis on the test information according to analysis parameters in the communication protocol file to obtain first test data.
For example, the test function may be converted into a test instruction in a preset format based on the communication protocol file, and the test instruction may be transmitted to the target device. The preset format may be a format that can be identified by the target device, and the specific type is not limited herein.
The target device may test the first test component according to the test instruction, obtain test information, and send the test information to the test device. The test command may be a command for reading a battery current, a command for reading a battery voltage, a command for reading a battery temperature, or the like. The test information may include, but is not limited to, a direct current voltage value, a total load current, a battery current value, a number of battery current values, a battery temperature, a number of battery temperatures, and the like.
The test device performs classification analysis according to analysis parameters in the communication protocol file after receiving the test information returned by the target device, so as to obtain first test data. The specific classification analysis process is not limited herein.
For example, when the first test data is "PARAM NAME =" dc voltage "length=" 4 "datatype=" float ", it may be determined that the test quantity name is dc voltage, the data Length is 4 bytes, and the data type is float. For another example, when the first test data is "PARAM NAME =" battery temperature number "length=" 0 "count=" 4", the test quantity name is determined as the battery temperature number, the data Length is 0 bytes, and the number is 4.
In some embodiments, the second test component may be tested according to the test case to obtain second test data. The testing process of the second testing component is similar to that of the first testing component, and the specific testing process can be referred to the detailed description of the above embodiment, which is not repeated here.
The first test assembly and the second test assembly are tested according to the test cases based on the communication protocol file, so that the conversion of the format of instructions/data between the test equipment and the target equipment can be realized, and the problem that the instructions and the analysis data cannot be identified in the assembly test process is avoided.
And step S302, comparing the first test data with the second test data to obtain a test result.
For example, a regular expression may be used to compare the first test data with the second test data to obtain a test result. When the first test data is consistent with the second test data, the test result can be determined as that the test case passes the test; when the first test data is inconsistent with the second test data, the test result can be determined as that the test case fails the test.
According to the device testing method, the device and the storage medium provided by the embodiment, the configuration parameters corresponding to the first testing component in the target device to be tested can be obtained by obtaining the first configuration file corresponding to the first testing component in the target device to be tested, and the second configuration file can be generated according to the configuration parameters in the first configuration file; the wiring information between the test equipment and the target equipment is added to the test function based on the preset wiring corresponding relation table, and the template file added with the wiring information is determined to be the second configuration file, so that the wiring information between the test equipment and the target equipment is added to the second configuration file, the second test assembly can be ensured to be matched with the first test assembly, and the success rate of equipment test is improved; by determining the maximum load value of the load assembly, when the maximum load value of the load assembly is smaller than the target load value, a prompt message is output to prompt a user to increase the number of load units of the load assembly; the second test assembly matched with the first test assembly can be obtained by carrying out assembly configuration on the test equipment according to the assembly parameters in the second configuration file, so that the second test assembly matched with the first test assembly can be flexibly configured; by testing the first test component according to the second test component, different components in the target device can be subjected to differential test based on the same test device, and the target device is not required to be tested by adopting different test devices or test software, so that the universality of device test is improved; the first test assembly and the second test assembly are tested according to the test cases based on the communication protocol file, so that the conversion of the format of instructions/data between the test equipment and the target equipment can be realized, and the problem that the instructions and the analysis data cannot be identified in the assembly test process is avoided.
The embodiment of the invention also provides a storage medium which is used for readable storage, the storage medium stores a program, the program comprises program instructions, and the processor executes the program instructions to realize any one of the device testing methods provided by the embodiment of the invention.
For example, the program is loaded by a processor, and the following steps may be performed:
Acquiring a first configuration file corresponding to a first test component in target equipment to be tested; generating a second configuration file according to the first configuration file, and carrying out component configuration on the test equipment according to the second configuration file to obtain a second test component matched with the first test component; and testing the first test assembly according to the second test assembly.
The storage medium may be an internal storage unit of the test device according to the foregoing embodiment, for example, a hard disk or a memory of the test device. The storage medium may also be an external storage device of the test device, such as a plug-in hard disk, a smart memory Card (SMART MEDIA CARD, SMC), a Secure digital Card (Secure DIGITAL CARD, SD Card), a flash memory Card (FLASH CARD) or the like, which are provided on the test device.
Those of ordinary skill in the art will appreciate that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof.
In a hardware implementation, the division between the functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed cooperatively by several physical components. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a storable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). The term storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, and thus do not limit the scope of the claims of the present invention. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and spirit of the present invention shall fall within the scope of the appended claims.
Claims (12)
1. A device testing method applied to a testing device, the method comprising:
acquiring a first configuration file corresponding to a first test component in target equipment to be tested;
Generating a second configuration file according to the first configuration file, and carrying out component configuration on the test equipment according to the second configuration file to obtain a second test component matched with the first test component;
And testing the first test assembly according to the second test assembly.
2. The device testing method of claim 1, wherein the generating a second profile from the first profile comprises:
generating a template file according to the first configuration file, wherein the template file at least comprises a test function;
based on a preset wiring corresponding relation table, wiring information between the test equipment and the target equipment is obtained, the wiring information is added into the test function, and the wiring information at least comprises test single board information, test channel information and amplification factor information;
and determining the template file added with the wiring information as the second configuration file.
3. The device testing method of claim 1, wherein the testing device comprises a power input distribution component, a load component, and a power output distribution component;
And performing component configuration on the test equipment according to the second configuration file to obtain a second test component matched with the first test component, wherein the method comprises the following steps:
Screening components in the test equipment according to the components required by the second configuration file to obtain a target component, wherein the target component comprises at least one of a power input distribution component, a load component and a power output distribution component;
and carrying out parameter configuration on the target component according to the component parameters in the second configuration file, and determining the target component after parameter configuration as the second test component.
4. The device testing method of claim 3, wherein the target component comprises a power input distribution component or a power output distribution component, the component parameters comprising wiring information; the parameter configuration of the target component according to the component parameters in the second configuration file includes:
parameter configuration is carried out on the power output distribution assembly according to wiring information in the second configuration file, wherein the wiring information comprises test single board information, test channel information and amplification factor information; or (b)
And carrying out parameter configuration on the power input distribution assembly according to the wiring information in the second configuration file.
5. A device testing method according to claim 3, wherein the component parameters comprise a target load value; the parameter configuration of the target component according to the component parameters in the second configuration file includes:
determining a current load value of the load assembly;
And if the current load value of the load assembly is different from the target load value, adjusting the current load value of the load assembly so that the adjusted load value is the same as the target load value.
6. The device testing method of claim 5, wherein the load assembly comprises at least one load cell, each load cell being disposed in a respective slot; the determining the current load value of the load assembly includes:
acquiring a communication address of each load unit;
Based on a communication bus, communicating with each corresponding load unit according to the communication address of each load unit, and obtaining a sub-load value of each load unit;
and determining the current load value of the load assembly according to the sub-load value of each load unit.
7. The device testing method of claim 6, wherein each of the load cells is connected in parallel with a voltage dividing resistor; the obtaining the communication address of each load unit includes:
detecting the voltage value of a voltage dividing resistor corresponding to each load unit;
determining a target slot number corresponding to each load unit according to a voltage ratio between a voltage value of each voltage dividing resistor and a preset total voltage value based on a corresponding relation between a preset voltage ratio and the slot number;
and correspondingly determining the communication address of each load unit according to the target slot number corresponding to each load unit.
8. The device testing method of claim 5, wherein prior to said adjusting the current load value of the load assembly, further comprising:
determining a maximum load value of the load assembly;
If the maximum load value is smaller than the target load value, outputting prompt information to prompt the increase of the number of load units of the load assembly;
The adjusting the current load value of the load assembly comprises the following steps:
and adjusting the load value of the load assembly after the load unit is added.
9. The device testing method of claim 1, wherein the second configuration file further comprises a test case; the testing the first test assembly according to the second test assembly includes:
based on a preset communication protocol file, testing the first test assembly according to the test case to obtain first test data, and testing the second test assembly according to the test case to obtain second test data;
And comparing the first test data with the second test data to obtain a test result.
10. The device testing method of claim 9, wherein the test case comprises a test function; the testing of the first test assembly based on the preset communication protocol file according to the test case, to obtain first test data, includes:
Based on the communication protocol file, converting the test function into a test instruction in a preset format, and sending the test instruction to the target equipment so that the target equipment can test the first test component according to the test instruction to obtain test information;
And receiving test information returned by the target equipment, and carrying out classification analysis on the test information according to analysis parameters in the communication protocol file to obtain the first test data.
11. A test apparatus comprising a power input distribution assembly, a load assembly, a power output distribution assembly, a processor, and a memory;
the power input distribution assembly is used for forming a test assembly with the power output distribution assembly in the target equipment and testing the output power of the target equipment;
The load assembly is used for forming a test assembly with the power conversion assembly in the target equipment and is used for simulating and adjusting the output power of the target equipment;
the power output distribution assembly is used for forming a test assembly with the power input distribution assembly in the target equipment and is used for testing the feedback power of the target equipment and simulating the input power supply of the target equipment;
the memory is used for storing programs;
The processor configured to execute the program and implement the device testing method according to any one of claims 1 to 10 when the program is executed.
12. A storage medium for readable storage, wherein the storage medium stores one or more programs executable by one or more processors to implement the device testing method of any of claims 1-10.
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| CN202211261497.3A CN117930066A (en) | 2022-10-14 | 2022-10-14 | Device testing method, testing device and storage medium |
| PCT/CN2023/091899 WO2024077938A1 (en) | 2022-10-14 | 2023-04-28 | Device test method, test device and storage medium |
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| CN202211261497.3A CN117930066A (en) | 2022-10-14 | 2022-10-14 | Device testing method, testing device and storage medium |
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| US7343558B2 (en) * | 2005-03-31 | 2008-03-11 | Teradyne, Inc. | Configurable automatic-test-equipment system |
| US7844413B2 (en) * | 2005-06-30 | 2010-11-30 | Broadcom Corporation | Self-generated test automation |
| CN101907689B (en) * | 2010-06-30 | 2014-07-02 | 中兴通讯股份有限公司 | Generation method and device of test circuit and power supply testing system |
| CN102175962B (en) * | 2011-01-30 | 2013-03-13 | 深圳创维数字技术股份有限公司 | Testing method and testing device |
| CN103869260B (en) * | 2012-12-13 | 2016-08-24 | 中兴通讯股份有限公司 | A kind of power detecting system and method |
| CN106569146A (en) * | 2016-11-01 | 2017-04-19 | 四川九洲电器集团有限责任公司 | Power supply module test system and method |
| CN109038699A (en) * | 2017-06-12 | 2018-12-18 | 中兴通讯股份有限公司 | A kind of management method of base station power system and DC power supply multiple groups battery |
| CN112763931A (en) * | 2020-12-22 | 2021-05-07 | 广州辰创科技发展有限公司 | Secondary power supply automatic test system, method and storage medium |
| CN113157598A (en) * | 2021-05-26 | 2021-07-23 | 中国银行股份有限公司 | Interface testing method and simulation baffle |
| CN113740758A (en) * | 2021-09-04 | 2021-12-03 | 深圳一信泰质量技术有限公司 | Automatic energy efficiency testing method, device, equipment and medium for power supply product |
| CN114325458B (en) * | 2021-12-17 | 2024-02-09 | 苏州浪潮智能科技有限公司 | Test method, system, device, equipment and storage medium of switching power supply |
| CN115167339A (en) * | 2022-06-16 | 2022-10-11 | 中车工业研究院有限公司 | Test method, test platform, test system and computer readable storage medium |
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