CN117926230A - Process chamber, semiconductor process equipment and control method thereof - Google Patents

Process chamber, semiconductor process equipment and control method thereof Download PDF

Info

Publication number
CN117926230A
CN117926230A CN202410124923.1A CN202410124923A CN117926230A CN 117926230 A CN117926230 A CN 117926230A CN 202410124923 A CN202410124923 A CN 202410124923A CN 117926230 A CN117926230 A CN 117926230A
Authority
CN
China
Prior art keywords
chamber
boat
sleeve
sensor
carrier boat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410124923.1A
Other languages
Chinese (zh)
Inventor
程勇杰
纪安宽
韦鑫锋
江伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Priority to CN202410124923.1A priority Critical patent/CN117926230A/en
Publication of CN117926230A publication Critical patent/CN117926230A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application discloses a process chamber, semiconductor process equipment and a control method thereof, and relates to the technical field of coating equipment. Through add the second cavity in first cavity for bear boat and reaction gas and all be held in the second cavity, reaction gas is difficult for with the inner wall contact of first cavity, thereby realizes the protection to first cavity, has promoted the durability of technology cavity.

Description

Process chamber, semiconductor process equipment and control method thereof
Technical Field
The application relates to the technical field of coating equipment, in particular to a process chamber, semiconductor process equipment and a control method thereof.
Background
PECVD (Plasma-ENHANCED CHEMICAL Vapor Deposition) is a commonly used method for preparing thin film materials in semiconductor manufacturing processes, and is used for depositing semiconductor materials such as silicon dioxide, silicon nitride and the like.
In the related art, the PECVD process needs to be performed in the process chamber, however, during the process, the reaction gas in the process chamber inevitably corrodes and damages the inner wall of the process chamber, resulting in reduced durability of the process chamber.
Disclosure of Invention
The application discloses a process chamber, semiconductor process equipment and a control method thereof, which are used for solving the problem that in the related art, the inner wall of the process chamber is inevitably corroded and damaged by reaction gas in the process chamber, so that the durability of the process chamber is reduced.
In order to solve the technical problems, the application is realized as follows:
In a first aspect, an embodiment of the present application discloses a process chamber applied to a semiconductor process apparatus, the semiconductor process apparatus comprising a load-bearing boat, the process chamber comprising a chamber body;
The chamber body comprises a first chamber and a second chamber, wherein the second chamber is arranged in the first chamber, and the second chamber is used for accommodating the bearing boat.
In a second aspect, embodiments of the present application disclose a semiconductor processing apparatus comprising a transfer mechanism, a load boat, and a process chamber as described above, the transfer mechanism extending into the chamber body for transferring the load boat into the chamber body.
In a third aspect, an embodiment of the present application discloses a control method of a semiconductor process apparatus, which is applied to the semiconductor process apparatus, and the control method includes:
acquiring position information of the bearing boat in the process chamber;
And if the bearing boat is judged to be at the preset position according to the position information, controlling the bearing boat to stop running.
The technical scheme adopted by the application can achieve the following technical effects:
The process chamber disclosed by the embodiment of the application improves the related technology, and comprises a chamber main body, wherein the chamber main body comprises a first chamber and a second chamber, and the second chamber is arranged in the first chamber. Through add the second cavity in first cavity for bear boat and reaction gas and all be held in the second cavity, reaction gas is difficult for with the inner wall contact of first cavity, thereby realizes the protection to first cavity, has promoted the durability of technology cavity.
Drawings
FIG. 1 is a schematic diagram of a semiconductor processing apparatus according to an embodiment of the present application;
FIG. 2 is a schematic view of an assembly structure of a process chamber, an correlation sensor and a sleeve according to an embodiment of the present application;
FIG. 3 is a schematic diagram showing an assembly structure of a process chamber, an correlation sensor and a sleeve according to an embodiment of the present application;
FIG. 4 is a schematic view of a sleeve according to an embodiment of the present application;
FIG. 5 is a schematic diagram of an assembly structure of a process chamber, an electrode rod and a baffle mechanism according to an embodiment of the present application;
FIG. 6 is a second schematic view of an assembly structure of a process chamber, an electrode rod and a baffle mechanism according to an embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of a process chamber, electrode rod and baffle mechanism according to an embodiment of the present application;
FIG. 8 is a schematic diagram of a cross-sectional structure of a process chamber, an electrode rod and a baffle mechanism according to an embodiment of the present application;
Fig. 9 is a flowchart of a control method of a semiconductor processing apparatus according to an embodiment of the present application.
Reference numerals illustrate:
100-process chamber, 110-chamber body, 111-first chamber, 112-second chamber, 1121-guide wheel, 113-support, 114-insulator, 115-electrode rod, 116-baffle mechanism, 1161-drive, 1162-drive shaft, 1163-baffle body, 120-transfer mechanism, 121-loading zone, 122-first drive mechanism, 123-second drive mechanism, 124-encoder, 130-sensor assembly, 131-first sensor set, 1311-attitude sensor, 1312-displacement sensor, 132-second sensor set, 1321-correlation sensor, 1321 a-emitter, 1321 b-receiver, 1322-first correlation sensor, 1323-second correlation sensor, 133-sleeve, 1331-first sleeve, 1332-second sleeve, 1333-third sleeve, 1334-seal, 5-first flange, 1336-second flange;
200-carrying boat.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more.
The technical scheme disclosed by each embodiment of the application is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 8, an embodiment of the application discloses a process chamber 100, which is applied to semiconductor process equipment, wherein the semiconductor process equipment can comprise a carrier boat 200, the carrier boat 200 is used as a carrier for chemical vapor deposition and is mainly used for carrying a piece to be plated, the carrier boat 200 can be made of high-temperature resistant conductive materials such as graphite, and the piece to be plated can be a chip, a solar cell or the like. The PECVD technique is applied to the processing procedure of the solar cell, and a deep blue silicon nitride film, that is, an antireflection film, is deposited on the surface of the solar cell by the carrier boat 200, the radio frequency power supply and a proper amount of reaction gas, so that the photoelectric conversion efficiency of the solar cell can be significantly improved.
The PECVD process needs to be performed in the process chamber 100, where the process chamber 100 may include a chamber main body 110, and the chamber main body 110 may have a single-chamber structure or a dual-chamber structure, and the chamber main body 110 may include a first chamber 111 and a second chamber 112, where the first chamber 111 is a carrying frame of the chamber main body 110, and may be formed by welding a stainless steel material, and has good workability and structural strength. The second chamber 112 is disposed in the first chamber 111 to form a nested structure, the second chamber 112 can be made of aluminum, the reaction gas, the plasma and the carrier boat 200 in the PECVD process are distributed in the second chamber 112, and the second chamber 112 made of aluminum has good weather resistance and is not easy to be damaged by the reaction gas and the plasma.
Because the aluminum material is inconvenient to process and weld, the second chamber 112 can be formed by splicing, riveting and the like, and the first chamber 111 made of stainless steel is matched, so that the structural strength of the chamber main body 110 is ensured, and meanwhile, the manufacturing difficulty and cost are reduced.
The inner wall of the first chamber 111 and the outer wall of the second chamber 112 may be fitted together, or a certain gap may be formed therebetween. To enhance the heat insulating effect of the chamber body 110, a certain gap may be provided between the inner wall of the first chamber 111 and the outer wall of the second chamber 112, so that heat transfer may be blocked to a certain extent.
As can be seen from the above description, the process chamber 100 disclosed in the embodiment of the present application improves the related art, and by adding the second chamber 112 in the first chamber 111, the carrier boat 200 and the reaction gas are both contained in the second chamber 112, and the reaction gas is not easy to contact with the inner wall of the first chamber 111, so that the first chamber 111 is protected, and the durability of the process chamber 100 is improved.
As shown in fig. 2, to secure the stability of the second chamber 112, the second chamber 112 may be supported by the first chamber 111. Specifically, the chamber body 110 may further include a supporting member 113, where the supporting member 113 is disposed between an inner wall of the first chamber 111 and an outer wall of the second chamber 112, and supports the second chamber 112 such that the second chamber 112 is relatively fixed to the first chamber 111. The shape of the supporting member 113 may be a block, a column, etc., and the connection manner between the supporting member 113 and the inner wall of the first chamber 111 and the outer wall of the second chamber 112 may be welding, clamping, etc.
As shown in fig. 2, taking a rectangular parallelepiped shape of the chamber body 110 as an example, the supporting member 113 may be disposed between the bottom surface of the first chamber 111 and the bottom surface of the second chamber 112, and the second chamber 112 may be directly overlapped on the supporting member 113 due to the gravity of the second chamber 112 itself; or the supporting member 113 may be disposed between the side surface of the first chamber 111 and the side surface of the second chamber 112, and connected to the side surface of the first chamber 111 and the side surface of the second chamber 112 by welding, clamping, or the like, so as to support the second chamber 112.
As shown in fig. 2, since the inside of the second chamber 112 may generate high temperature during the process, in order to avoid the influence of the high temperature on the parts outside the second chamber 112, the chamber main body 110 may further include a heat insulation member 114, where the heat insulation member 114 is disposed between the support member 113 and the outer wall of the second chamber 112, and the heat insulation member 114 may be in a sheet shape, a block shape, or the like, and in particular, may be made of a material such as ceramic, graphite, or the like.
In some alternative embodiments, a certain gap may be provided between the inner wall of the first chamber 111 and the outer wall of the second chamber 112, and the air pressure value of the first chamber 111 is not less than the air pressure value of the second chamber 112. By performing differential air pressure control on the first chamber 111 and the second chamber 112, the reaction gas in the second chamber 112 can be prevented from leaking into the first chamber or even the external environment, and thus the tightness of the second chamber 112 can be improved to a certain extent.
Referring to fig. 1 to 8, the embodiment of the present application also discloses a semiconductor process apparatus, which may include a transfer mechanism 120, a carrier boat 200, and the process chamber 100 described above. The transfer mechanism 120 is used to transfer the carrier boat 200 into the chamber body 110, the transfer mechanism 120 may be a conveyor belt, a conveyor roller, or the like, and the transfer mechanism 120 may extend into the chamber body 110, and, illustratively, the transfer mechanism 120 may extend into the second chamber 112 only, or may extend into both the first chamber 111 and the second chamber 112, i.e., one portion of the transfer mechanism 120 is located in the second chamber 112 and the other portion is located in the first chamber 111. In order to ensure the tightness of the chamber main body 110, a chamber door may be provided on the chamber main body 110, and the chamber door is in an opened state when the load boat 200 needs to enter and exit the chamber main body 110; the chamber door may be closed when a process is performed in the chamber body 110.
As shown in fig. 1, to avoid interference with the opening and closing of the chamber door, the transfer mechanism 120 may include a plurality of transfer rollers including a driving shaft for providing a driving force for the transfer of the carrier boat 200 and a driven shaft for supporting the carrier boat 200. The plurality of transfer rollers are spaced along the transfer direction of the carrier boat 200, and the distance between the transfer rollers can be properly increased near the chamber door to avoid interference with the chamber door.
It should be added that, two ends of the conveying roller outside the chamber main body 110 may be lapped on the bracket, and after two ends of the conveying roller inside the chamber main body 110 need to pass through the side wall of the chamber main body 110, a sealing bearing or a sealing pad may be disposed between the conveying roller and the side wall of the chamber main body 110 in order to ensure the tightness of the chamber main body 110.
As shown in fig. 1 to 3, in order to grasp parameters such as a position, an operation posture, etc. of the carrier boat 200 during the transfer of the carrier boat 200, the semiconductor process apparatus may further include a sensor assembly 130, and the sensor assembly 130 may include a photoelectric sensor, a hall sensor, etc., and the sensor assembly 130 may be disposed on the sidewall of the transfer mechanism 120 and the chamber body 110, specifically may be disposed on the sidewall of the first chamber 111, or may be disposed on the sidewall of the second chamber 112.
Positional information of the carrier boat 200 may be detected using the sensor assembly 130, including but not limited to the position, operational attitude, operational speed, etc. of the carrier boat 200. The sensor assembly 130 may include a plurality of sensors spaced apart along the transport direction of the carrier boat 200, and may be capable of acquiring the position information of the carrier boat 200 in real time during the transport of the carrier boat 200. The connection between the plurality of sensors and the transfer mechanism 120 or the sidewall of the chamber body 110 may be a bolt connection, a clamping connection, or the like.
Before the carrier boat 200 enters the second chamber 112, the to-be-plated parts need to be loaded in the carrier boat 200, and a loading area 121 may be disposed on the conveying mechanism 120, where the loading area 121 is located outside the chamber main body 110. When the loading of the load boat 200 with the parts to be plated is completed, the transfer mechanism 120 will start the process by transferring the load boat 200 to the designated position of the chamber body 110, and when the process is completed, the transfer mechanism 120 will transfer the load boat 200 to the loading area 121 again.
As shown in fig. 1, the loading area 121 is provided with a first driving mechanism 122 and a first sensor group 131, the first sensor group 131 is used for detecting position information when the bearing boat 200 is located in the loading area 121, and the first sensor group 131 may include a plurality of sensors, where the plurality of sensors are located at different positions of the loading area 121 respectively; the first driving mechanism 122 can control the travel or stop of the carrier boat 200 according to the position information, if the sensor for detecting the position of the carrier boat 200 and the sensor for detecting the posture of the carrier boat 200 in the first sensor group 131 are triggered, that is, the position and the posture of the carrier boat 200 are in a normal state, the first sensor group 131 and the first driving mechanism 122 are linked, and the first driving mechanism 122 starts and drives the carrier boat 200 to travel; if the sensor for detecting the position of the carrier boat 200 and the sensor for detecting the posture of the carrier boat 200 in the first sensor group 131 are not triggered at the same time, the position or posture of the carrier boat 200 needs to be adjusted, and at this time, the first driving mechanism 122 is not started. The first drive mechanism 122 may be a motor, a rotary cylinder, or the like.
As shown in fig. 1, according to the functional division, the first sensor group 131 may be divided into an attitude sensor 1311 and a displacement sensor 1312, the attitude sensor 1311 is used to detect whether the carrier boat 200 is offset, the displacement sensor 1312 is used to detect a displacement distance of the carrier boat 200, and simultaneously, the attitude sensor 1311 and the displacement sensor 1312 may also detect whether the carrier boat 200 passes a preset position according to whether it is triggered, where the preset position may be the position where the attitude sensor 1311 or the displacement sensor 1312 is located.
Illustratively, as shown in fig. 1, the plurality of sensors are numbered sequentially from right to left, A, B, C, D, E, F, G, H, I, J respectively, and four sensors A, B, C, D respectively are disposed in the feeding area 121, where A, B is the displacement sensor 1312, and c and D are the attitude sensors 1311. When the carrier boat 200 is located in the loading area 121, the four sensors may be covered. The sensor C, D can detect if the boat 200 is offset, indicating that the boat 200 has been offset when both attitude sensors 1311 are not fully triggered; when both attitude sensors 1311 are triggered, it is indicated that the carrier boat 200 is in the correct position in the loading area 121, and at this time, the first driving mechanism 122 may be linked and the carrier boat 200 may be driven to travel. When the carrier boat 200 travels, the sensors A, B will be sequentially released from the triggered state, so as to obtain the displacement distance of the carrier boat 200, and it should be added that the two displacement sensors 1312 may also be linked with the first driving mechanism 122, and if the carrier boat 200 has passed through the sensor a (the sensor a releases the triggered state), the first driving mechanism 122 may reduce the rotation speed or keep running at a constant speed; if the boat 200 has passed sensor B (sensor B de-activated), the first drive mechanism 122 may reduce the rotational speed to ensure that the boat 200 is able to smoothly enter the chamber body 110.
After the carrier boat 200 enters the chamber body 110, it still needs to move a distance and reach a predetermined position of the chamber body 110, and thus, the sensor assembly 130 needs to be disposed in the chamber body 110. Specifically, the sensor assembly 130 may further include a second sensor group 132 disposed on a sidewall of the chamber body 110, and may be disposed on a sidewall of the first chamber 111 or on a sidewall of the second chamber 112. The second sensor set 132 may include a plurality of sensors respectively located at different positions of the sidewall of the chamber body 110. In fig. 1, the second sensor set 132 may include E, F, G, H, I, J six sensors.
As shown in fig. 1, a second driving mechanism 123 is further provided in the chamber main body 110, and the second driving mechanism 123 may be a motor, a rotary cylinder, or the like, and the second driving mechanism 123 can control the traveling or stopping of the carrier boat 200 according to the positional information of the carrier boat 200. The first driving mechanism 122, the second driving mechanism 123, the first sensor group 131 and the second sensor group 132 have the following matching relationship:
When the carrier boat 200 starts to travel from the loading area 121, the first driving mechanism 122 starts to operate, and when the carrier boat 200 passes the sensor B (sensor B is in a deactivated state), the front end of the carrier boat 200 starts to enter the chamber body 110, at this time, the second driving mechanism 123 starts to operate and maintains the same rotation speed as the first driving mechanism 122, so that the carrier boat 200 transitions smoothly between the first driving mechanism 122 and the second driving mechanism 123. When the carrier boat 200 passes the sensor C (the sensor C is deactivated), the first driving mechanism 122 stops operating, and the second driving mechanism 123 continues to operate, so that the second driving mechanism 123 can provide driving force to the carrier boat 200. When the carrier boat 200 passes the sensor G (sensor G triggered state), the second driving mechanism 123 can slow down, reducing the influence of inertia on the carrier boat 200, and preparing for the position control of the carrier boat 200. When the carrier boat 200 passes the sensor H (sensor H trigger state), the second driving mechanism 123 performs position control at this time, and when the position control is finished, whether the position is correct and whether the sensor I and the sensor E are triggered simultaneously or not are judged, and when both conditions are satisfied, the carrier boat 200 has reached the preset position, at which time the second driving mechanism 123 stops operating. If the sensor J is triggered or either of the above two conditions is not satisfied, it indicates that the carrier boat 200 has been moved away from the preset position, and at this time, the second driving mechanism 123 may be controlled to stop operating, and an alarm is given.
As shown in fig. 1 to 3, in the second sensor group 132, the sensor E, F, G, H, I, J may be a photoelectric sensor, a hall sensor, or the like, for example, the photoelectric sensor, and the second sensor group 132 includes at least two correlation sensors 1321, and in the sensor E, F, G, H, I, J, the correlation sensors 1321 may be used, or a part of the correlation sensors 1321 may be used.
Each correlation sensor 1321 includes a transmitting end 1321a and a receiving end 1321b, where the transmitting end 1321a and the receiving end 1321b are respectively disposed on two opposite sidewalls of the first chamber 111, and a connection manner between the transmitting end 1321a and the receiving end 1321b and the sidewalls of the first chamber 111 may be welding, bonding, bolting, or the like.
The correlation sensor 1321 operates according to the principle that when no shielding exists between the emitting end 1321a and the receiving end 1321b, the receiving end 1321b can normally receive the light excited by the emitting end 1321 a; when the emitting end 1321a and the receiving end 1321b have a shielding object, the receiving end 1321b cannot normally receive the light excited by the emitting end 1321 a.
In order to ensure that the optical path between the transmitting end 1321a and the receiving end 1321b is smooth, the opposite two sidewalls of the first chamber 111 are respectively provided with a first light hole, the opposite two sidewalls of the second chamber 112 are respectively provided with a second light hole, the first light hole and the second light hole are coaxially arranged, and the transmitting end 1321a and the receiving end 1321b realize transmitting and receiving through the first light hole and the second light hole.
In some alternative embodiments, the process chamber 100 is provided with an correlation sensor 1321, the correlation sensor 1321 comprising a transmitting end 1321a and a receiving end 1321b; the opposite two side walls of the first chamber 111 are respectively provided with a first light hole, the opposite two side walls of the second chamber 112 are respectively provided with a second light hole, and the first light holes and the second light holes are coaxially arranged; the transmitting end 1321a and the receiving end 1321b are respectively disposed on two opposite sidewalls of the first chamber 111, and transmit and receive through the first light hole and the second light hole.
As shown in fig. 2 to 4, the process chamber 100 is further provided with a sleeve 133, and two ends of the sleeve 133 are respectively connected to the inner wall of the first chamber 111 and the outer wall of the second chamber 112, and specific connection manners may be welding, bolting, and the like. The two ends of the sleeve 133 are respectively communicated with the first light hole and the second light hole, and the transmitting end 1321a and the receiving end 1321b of the correlation sensor 1321 can transmit and receive through the sleeve 133, the first light hole and the second light hole. Since the plating material in the second chamber 112 enters the first chamber 111 through the second light holes and is plated on the surfaces of the transmitting end 1321a and the receiving end 1321b through the first light holes, the sensitivity of the correlation sensor 1321 is reduced, so that the sensor signal is invalid or is triggered by mistake, and the transmission of the carrier boat is affected.
By providing the sleeve 133, the plating material that can escape from the light holes is preferentially plated on the inner wall of the sleeve 133, so that plating on the transmitting end 1321a and the receiving end 1321b can be reduced, and accuracy and durability of the correlation sensor 1321 are improved.
As shown in fig. 2 to 4, in consideration of a large temperature variation in the chamber body 110, in order to prevent the sleeve 133 from being damaged due to expansion with heat and contraction with cold, the sleeve 133 may be of a split type structure, and specifically may include a first sleeve 1331, a second sleeve 1332 and a third sleeve 1333, the inner diameter of the third sleeve 1333 being slightly larger than the outer diameters of the first sleeve 1331 and the second sleeve 1332, so that the third sleeve 1333 can be sleeved on the first sleeve 1331 and the second sleeve 1332, and the first sleeve 1331 and the second sleeve 1332 may be slidably connected with the third sleeve 1333, respectively. The sleeve 133 adopts the split structure, and the problem of deformation of the sleeve 133 caused by thermal expansion and contraction is overcome by the relative sliding between the first sleeve 1331 and the third sleeve 1333 and between the second sleeve 1332 and the third sleeve 1333, so that the durability of the sleeve 133 is improved.
As shown in fig. 2 to 4, the first sleeve 1331 and the second sleeve 1332 are respectively connected with the first chamber 111 and the second chamber 112, specifically, a first flange 1335 may be disposed at an end of the first sleeve 1331 facing away from the second sleeve 1332, a second flange 1336 may be disposed at an end of the second sleeve 1332 facing away from the first sleeve 1331, mounting holes are respectively disposed on the first flange 1335 and the second flange 1336, the first sleeve 1331 may be connected with an inner wall of the first chamber 111 through the first flange 1335 and a bolt, and the second sleeve 1332 may be connected with an outer wall of the second chamber 112 through the second flange 1336 and a bolt.
As shown in fig. 3, in order to prevent the plating material escaping from the second light holes from escaping from the assembly gaps of the first sleeve 1331 and the third sleeve 1333, the second sleeve 1332 and the third sleeve 1333, the sleeve 133 may further include a sealing member 1334, and the sealing member 1334 may be disposed in the assembly gaps of the first sleeve 1331 and the third sleeve 1333, and/or the second sleeve 1332 and the third sleeve 1333. The seal 1334 may be made of silicone, rubber, or the like.
Further, as shown in fig. 1, the transfer mechanism 120 may also include an encoder 124 and a controller electrically connected to the encoder 124. The encoder 124 may be disposed at an outer sidewall of the chamber body 110 and partially protrude into the chamber body 110. When the carrier boat 200 passes through the encoder 124, the encoder 124 can count the displacement information of the carrier boat 200, the controller can obtain the displacement information and compare the displacement information with the preset displacement information stored in the controller, if the displacement information is matched with the preset displacement information, the position of the carrier boat 200 is accurate, the next step can be executed, if the displacement information is not matched with the preset displacement information, the position deviation of the carrier boat 200 occurs in the displacement process, and the position of the carrier boat 200 needs to be corrected.
In addition, as shown in fig. 1, the position of the carrier boat 200 may be checked secondarily, specifically, the second sensor group 132 may include a first correlation sensor 1322 and a second correlation sensor 1323, which correspond to the sensor E and the sensor I in fig. 1, respectively, and a distance between the first correlation sensor 1322 and the second correlation sensor 1323 along the transmission direction of the conveying mechanism 120 is equal to a length of the carrier boat 200, and it should be noted that the length of the carrier boat 200 refers to a dimension of the carrier boat 200 along the transmission direction of the conveying mechanism. Since the distance between the first and second correlation sensors 1322 and 1323 is equal to the length of the carrier boat 200, the position of the carrier boat 200 can be checked secondarily by determining the trigger state of the first and second correlation sensors 1322 and 1323. If the first correlation sensor 1322 and the second correlation sensor 1323 are both in the triggered state, the position of the carrier boat 200 is accurate; if the first and second correlation sensors 1322 and 1323 are not all in the triggered state, then the position of the load boat 200 is inaccurate. After the carrier boat 200 passes the above two position checks, the process may proceed to the next operation.
As shown in fig. 5 to 8, when the carrier boat 200 is positioned in the chamber body 110, it is necessary to conduct a process loop by means of an electrode, and in particular, as shown in fig. 5 to 8, the semiconductor process apparatus may further include an electrode rod 115, where the electrode rod 115 is telescopically disposed on an outer sidewall of the first chamber 111, and the expansion and contraction of the electrode rod 115 may be controlled by a cylinder. The electrode rod 115 is provided with an insertion end, the carrier boat 200 is provided with an electrode hole, and the insertion end can extend into the second chamber 112 and be inserted into the electrode hole to conduct a process loop.
When the carrier boat 200 is not at the predetermined position of the chamber body 110, the electrode rods 115 may be damaged by extending into the second chamber 112, and for this purpose, the semiconductor processing apparatus may further include a baffle mechanism 116, where the baffle mechanism 116 is connected to the sidewall of the chamber body 110, and may be connected to the sidewall of the first chamber 111 or the sidewall of the second chamber 112. And at least part of the baffle mechanism 116 extends into the second chamber 112, the baffle mechanism 116 has a first position and a second position relative to the electrode rod 115, when the baffle mechanism 116 is in the first position, the baffle mechanism 116 abuts against the plugging end of the electrode rod 115 to block the plugging end from extending into the electrode hole of the carrier boat 200, and when the baffle mechanism 116 is in the second position, the baffle mechanism 116 is separated from the plugging end to enable the plugging end to extend into the electrode hole, thereby protecting the carrier boat 200.
As shown in fig. 5 to 8, the blocking piece mechanism 116 may specifically include a driving piece 1161, a transmission shaft 1162 and a blocking piece main body 1163, where the driving piece 1161 is disposed on a side wall of the chamber main body 110, specifically may be disposed on an outer wall of the first chamber 111, the transmission shaft 1162 is disposed on a side wall of the chamber main body 110 in a penetrating manner, that is, the transmission shaft 1162 passes through the side wall of the first chamber 111 and the side wall of the second chamber 112 respectively, and is connected with an output end of the driving piece 1161, at least part of the transmission shaft 1162 extends into the second chamber 112, the blocking piece main body 1163 is connected with one end of the transmission shaft 1162, which is away from the driving piece 1161, and the driving piece 1161 drives the blocking piece main body 1163 to be abutted or separated from an inserting end of the electrode rod 115 through the transmission shaft 1162. The driving member 1161 may be a cylinder, a motor, or the like, and the shape of the shutter main body 1163 may be a plate, a block, or the like.
As shown in fig. 1, in order to make the carrier boat 200 run smoothly in the second chamber 112, a guide wheel 1121 may be provided on the inner wall of the second chamber 112, and the guide wheel 1121 may be rotatable relative to the inner wall of the second chamber 112, so as to be capable of guiding and matching with the carrier boat 200.
Referring to fig. 9, the embodiment of the application also discloses a control method of a semiconductor process device, which is applied to the semiconductor process device, and the disclosed control method may include:
Step 101, acquiring position information of the load boat 200 in the process chamber 100.
Specifically, as shown in fig. 1, the second sensor group 132 may obtain the position information of the carrier boat 200 located in the process chamber 100, where the position information may include an operation position, an operation speed, an operation posture, and the like of the carrier boat 200, and illustratively, the second sensor group 132 includes a sensor E, F, G, H, I, J, and may obtain the operation position of the carrier boat 200 by obtaining a trigger state of the sensor E, F, G, H, I, J, and if the sensor E is triggered and is continuously in the trigger state, it may be known that the first boat of the carrier boat 200 has just passed the sensor E; if the sensor F is triggered and is continuously in the triggered state, it is known that the boat head carrying the boat 200 has just passed the sensor F.
For the running speed, the running speed of the carrier boat 200 may be estimated by acquiring the time period for which the carrier boat 200 passes by the two sensors and the distance between the two sensors. For the operation gesture, the judgment can be performed by the triggering states of the sensor C and the sensor D located in the feeding area 121, or the judgment can be performed according to the triggering states of the sensor E and the sensor I.
Step 102, if the carrier boat 200 is determined to be at the preset position according to the position information, the carrier boat 200 is controlled to stop running.
Specifically, as shown in fig. 1, after the position information of the carrier boat 200 is acquired by the sensor group, it may be determined whether the carrier boat 200 is at the preset position according to the position information. For example, if the sensor I is triggered, the carrier boat 200 may be considered to be operated to a preset position, at which time the second driving mechanism 123 may be controlled to stop operating, thereby controlling the carrier boat 200 to stop operating.
Based on the above-mentioned control method, as shown in fig. 5 to 8, the semiconductor process apparatus may include an electrode rod 115, where the electrode rod 115 is telescopically disposed on an outer sidewall of the first chamber 111, the electrode rod 115 is provided with a socket end, and the carrier boat 200 is provided with an electrode hole, and the socket end is used to extend into the second chamber 112 and be plugged with the electrode hole to conduct a process loop.
After the load boat 200 is determined to be at the preset position according to the position information, the control method further includes:
step 103, controlling the electrode rods 115 to extend into the electrode holes of the bearing boat 200.
In the embodiment of the present application, as shown in fig. 5 to 8, one of the purposes of ensuring the carrier boat 200 is to be at the preset position is to enable the electrode rods 115 to smoothly extend into the electrode holes of the carrier boat 200 so as to conduct the process circuit. If the position of the carrier boat 200 is inaccurate, the electrode rods 115 are easy to damage the electrode holes or even the carrier boat 200, so that after the position information of the carrier boat 200 is obtained by the sensor group, the carrier boat 200 is determined to be at the preset position according to the position information, and then the electrode rods 115 are controlled to extend into the electrode holes of the carrier boat 200, so that the carrier boat 200 can be protected.
In addition, as shown in fig. 5 to 8, in order to further protect the carrier boat 200, the semiconductor processing apparatus may further include a baffle mechanism 116, where the baffle mechanism 116 is connected to a sidewall of the chamber body 110 and extends at least partially into the second chamber 112, and the baffle mechanism 116 and an inner wall of the second chamber may be made of the same material. The blocking piece mechanism 116 has a first position and a second position relative to the electrode rod 115, when the blocking piece mechanism 116 is in the first position, the blocking piece mechanism 116 abuts against the insertion end of the electrode rod 115 to block the insertion end from extending into the electrode hole, and when the blocking piece mechanism 116 is in the second position, the blocking piece mechanism 116 is separated from the insertion end of the electrode rod 115 to enable the insertion end to extend into the electrode hole of the carrier boat 200.
Based on the above functions of the shutter mechanism 116, the position of the shutter mechanism 116 and the carrier boat 200 may be linked, and after the carrier boat 200 is determined to be at the preset position according to the position information, the control method may further include:
step 104, verifying the position of the carrying boat 200.
As shown in fig. 1, the verification of the position of the carrier boat 200 may be performed by determining whether the sensor I is triggered, if the sensor I is in a triggered state, determining that the carrier boat 200 is in a preset position, and if the sensor I is in an un-triggered state, determining that the carrier boat 200 is not in the preset position. However, there is a great risk of verifying the position of the carrier boat 200 in the above-described single manner.
In order to make the position of the carrier boat 200 more accurate and reliable, on the one hand, as shown in fig. 1, the encoder 124 and the controller may be used to verify the position of the carrier boat 200, when the carrier boat 200 passes through the encoder 124, the encoder 124 may count the displacement information of the carrier boat 200, the controller may obtain the displacement information and compare the displacement information with the preset displacement information stored in the controller, if the displacement information matches with the preset displacement information, it indicates that the position of the carrier boat 200 is accurate, and the next procedure may be performed, and if the displacement information does not match with the preset displacement information, it indicates that the position deviation of the carrier boat 200 occurs in the displacement process, and then the position of the carrier boat 200 needs to be corrected.
On the other hand, as shown in fig. 1, the position of the carrier boat 200 may be checked by using the sensor E and the sensor I, where the distance between the sensor E and the sensor I is equal to the length of the carrier boat 200, and the position of the carrier boat 200 may be checked by determining the trigger states of the sensor E and the sensor I. If the sensor E and the sensor I are both in the trigger state, the position of the bearing boat 200 is accurate; if sensor E and sensor I are not all in the triggered state, then the position of load boat 200 is indicated as inaccurate.
The above two manners of checking the position of the carrier boat 200 can be alternatively used or combined to realize secondary checking, thereby further improving the accuracy of the position of the carrier boat 200.
Step 105, if the position of the carrier boat 200 passes the verification, controlling the flap mechanism 116 to be at the second position.
As shown in fig. 5 to 8, if the position of the carrier boat 200 passes the verification, it is indicated that the carrier boat 200 is at the preset position of the chamber main body 110, and the baffle mechanism 116 may be controlled to be at the second position, and the baffle mechanism 116 is separated from the plugging end of the electrode rod 115, so that the plugging end may extend into the electrode hole to realize the conduction of the process loop.
If the position of the carrier boat 200 fails to pass the verification, it indicates that there is a deviation in the position of the carrier boat 200, the blocking plate mechanism 116 may be controlled to be at the first position, and the blocking plate mechanism 116 abuts against the plugging end of the electrode rod 115 to block the plugging end from extending into the electrode hole of the carrier boat 200, so as to avoid the problem that the electrode hole is damaged even the carrier boat 200 is damaged due to the incorrect insertion of the electrode rod 115.
The foregoing embodiments of the present application mainly describe differences between the embodiments, and as long as the technical features of the differences between the embodiments are not contradictory, the embodiments can be combined to form a more specific embodiment, and in consideration of brevity of line text, the description is omitted herein.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.

Claims (21)

1. A process chamber for use in a semiconductor processing apparatus, the semiconductor processing apparatus comprising a carrier boat (200), wherein the process chamber (100) comprises a chamber body (110);
the chamber body (110) comprises a first chamber (111) and a second chamber (112), the second chamber (112) is arranged in the first chamber (111), and the second chamber (112) is used for accommodating the bearing boat (200).
2. The process chamber according to claim 1, wherein the chamber body (110) further comprises a support (113), the support (113) being arranged between an inner wall of the first chamber (111) and an outer wall of the second chamber (112) for supporting the second chamber (112).
3. The process chamber of claim 2, wherein the chamber body (110) further comprises a thermal shield (114), the thermal shield (114) being disposed between the support (113) and an outer wall of the second chamber (112).
4. The process chamber according to claim 1, wherein the gas pressure value of the first chamber (111) is not smaller than the gas pressure value of the second chamber (112).
5. A semiconductor processing apparatus comprising a transfer mechanism (120), a carrier boat (200), and the process chamber (100) of any of claims 1-4, the transfer mechanism (120) extending into the chamber body (110) for transferring the carrier boat (200) into the chamber body (110).
6. The semiconductor processing apparatus of claim 5, further comprising a sensor assembly (130), the sensor assembly (130) being disposed on sidewalls of the transfer mechanism (120) and the chamber body (110), respectively, for detecting positional information of the load boat (200).
7. The semiconductor processing apparatus of claim 6, wherein the transfer mechanism (120) comprises a loading zone (121) and a first drive mechanism (122) disposed in the loading zone (121), the loading zone (121) being located outside the chamber body (110);
The sensor assembly (130) comprises a first sensor group (131) arranged in the feeding area (121), the first sensor group (131) is used for detecting position information of the bearing boat (200), and the first driving mechanism (122) is used for controlling running or stopping of the bearing boat (200) according to the position information.
8. The semiconductor processing apparatus of claim 7, wherein the first sensor group (131) includes an attitude sensor (1311) and a displacement sensor (1312), the attitude sensor (1311) being configured to detect whether the load boat (200) is offset, and the displacement sensor (1312) being configured to detect a displacement distance of the load boat (200).
9. The semiconductor processing apparatus of claim 6, wherein the sensor assembly (130) further comprises a second sensor group (132) disposed on a sidewall of the chamber body (110), the transfer mechanism (120) comprises a second driving mechanism (123) disposed through the chamber body (110), the second sensor group (132) is configured to detect positional information of the carrier boat (200), and the second driving mechanism (123) is configured to control traveling or stopping of the carrier boat (200) according to the positional information.
10. The semiconductor processing apparatus of claim 9, wherein the second set of sensors (132) comprises at least two correlation sensors (1321), the correlation sensors (1321) comprising a transmitting end (1321 a) and a receiving end (1321 b);
the two opposite side walls of the first chamber (111) are respectively provided with a first light hole, the two opposite side walls of the second chamber (112) are respectively provided with a second light hole, and the first light holes and the second light holes are coaxially arranged;
The transmitting end (1321 a) and the receiving end (1321 b) are respectively arranged on two opposite side walls of the first chamber (111), and the transmitting and receiving are realized through the first light holes and the second light holes.
11. The semiconductor processing apparatus of claim 5, wherein the process chamber (100) is provided with an correlation sensor (1321), the correlation sensor (1321) comprising a transmitting end (1321 a) and a receiving end (1321 b);
the two opposite side walls of the first chamber (111) are respectively provided with a first light hole, the two opposite side walls of the second chamber (112) are respectively provided with a second light hole, and the first light holes and the second light holes are coaxially arranged;
The transmitting end (1321 a) and the receiving end (1321 b) are respectively arranged on two opposite side walls of the first chamber (111), and transmit and receive through the first light holes and the second light holes;
The process chamber (100) is further provided with a sleeve (133), two ends of the sleeve (133) are respectively connected with the inner wall of the first chamber (111) and the outer wall of the second chamber (112), and two ends of the sleeve (133) are respectively communicated with the first light holes and the second light holes.
12. The semiconductor processing apparatus of claim 11, wherein the sleeve (133) comprises a first sleeve (1331), a second sleeve (1332), and a third sleeve (1333), the third sleeve (1333) being sleeved over the first sleeve (1331) and the second sleeve (1332) and being slidably connected to the first sleeve (1331) and the second sleeve (1332), respectively;
A first flange (1335) is arranged at one end, facing away from the second sleeve (1332), of the first sleeve (1331), and the first sleeve (1331) is connected with the inner wall of the first chamber (111) through the first flange (1335);
One end of the second sleeve (1332) facing away from the first sleeve (1331) is provided with a second flange (1336), and the second sleeve (1332) is connected with the outer wall of the second chamber (112) through the second flange (1336).
13. The semiconductor processing apparatus of claim 12, wherein the sleeve (133) further comprises a seal (1334), the seal (1334) being provided in an assembly gap of the first sleeve (1331) and the third sleeve (1333), and/or the second sleeve (1332) and the third sleeve (1333).
14. The semiconductor processing apparatus of claim 5, wherein the transfer mechanism (120) further comprises an encoder (124) and a controller, the controller being electrically connected to the encoder (124), the encoder (124) being configured to count displacement information of the load boat (200), the controller being configured to obtain the displacement information and compare the displacement information to a predetermined displacement information.
15. The semiconductor processing apparatus of claim 10, wherein the second sensor group (132) comprises a first correlation sensor (1322) and a second correlation sensor (1323), a distance between the first correlation sensor (1322) and the second correlation sensor (1323) being equal to a length of the carrier boat (200) along a transport direction of the transport mechanism (120).
16. The semiconductor processing apparatus of claim 5, further comprising an electrode rod (115) and a baffle mechanism (116), the electrode rod (115) being telescopically disposed on an outer sidewall of the first chamber (111), the electrode rod (115) being provided with a socket end, the carrier boat (200) being provided with an electrode hole, the socket end being adapted to extend into the second chamber (112) and to be socket-connected with the electrode hole;
The baffle mechanism (116) is connected with the side wall of the chamber main body (110) and at least partially stretches into the second chamber (112), the baffle mechanism (116) has a first position and a second position relative to the electrode rod (115), when the baffle mechanism (116) is in the first position, the baffle mechanism (116) is abutted with the plug end so as to prevent the plug end from stretching into the electrode hole, and when the baffle mechanism (116) is in the second position, the baffle mechanism (116) is separated from the plug end so that the plug end can stretch into the electrode hole.
17. The semiconductor processing apparatus of claim 16, wherein the shutter mechanism (116) comprises a drive (1161), a drive shaft (1162), and a shutter body (1163);
The driving piece (1161) is arranged on the side wall of the chamber main body (110), the driving shaft (1162) penetrates through the side wall of the chamber main body (110) and is connected with the output end of the driving piece (1161), at least part of the driving shaft (1162) stretches into the second chamber (112), the baffle main body (1163) is connected with one end, deviating from the driving piece (1161), of the driving piece (1162), and the driving piece (1161) drives the baffle main body (1163) to be in butt joint or separation with the plug end through the driving shaft (1162).
18. The semiconductor processing apparatus of claim 16, wherein an inner wall of the second chamber (112) is provided with guide wheels (1121), the guide wheels (1121) being adapted for guiding engagement with the carrier boat (200).
19. A control method of a semiconductor process apparatus, applied to the semiconductor process apparatus according to any one of claims 5 to 18, characterized by comprising:
Acquiring position information of the load boat (200) located in the process chamber (100);
And judging that the bearing boat (200) is at a preset position according to the position information, and controlling the bearing boat (200) to stop running.
20. The control method according to claim 19, the semiconductor process equipment including an electrode rod (115), the electrode rod (115) being telescopically provided to an outer sidewall of the first chamber (111), the electrode rod (115) being provided with a socket end, the carrier boat (200) being provided with an electrode hole, the socket end being adapted to extend into the second chamber (112) and to be socket-connected with the electrode hole, characterized in that, after the carrier boat (200) is determined to be in a preset position based on the position information, the carrier boat (200) is controlled to stop operating, the control method further comprises:
Controlling the electrode rods (115) to extend into electrode holes of the bearing boat (200).
21. The control method according to claim 20, the semiconductor process equipment further comprising a shutter mechanism (116), the shutter mechanism (116) being connected to a side wall of the chamber body (110) and extending at least partially into the second chamber (112), the shutter mechanism (116) having a first position and a second position with respect to the electrode shaft (115), the shutter mechanism (116) abutting the plug end to block the plug end from extending into the electrode hole when the shutter mechanism (116) is in the first position, the shutter mechanism (116) being separated from the plug end when the shutter mechanism (116) is in the second position so that the plug end can extend into the electrode hole, characterized in that, after the determination that the carrier boat (200) is in a preset position based on the position information, the carrier boat (200) is controlled to stop operating, the control method of the electrode shaft (115) extending into the electrode hole of the carrier boat (200) is controlled further comprising:
verifying the position of the bearing boat (200);
and if the position of the bearing boat (200) passes the verification, controlling the baffle mechanism (116) to be in the second position.
CN202410124923.1A 2024-01-29 2024-01-29 Process chamber, semiconductor process equipment and control method thereof Pending CN117926230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410124923.1A CN117926230A (en) 2024-01-29 2024-01-29 Process chamber, semiconductor process equipment and control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410124923.1A CN117926230A (en) 2024-01-29 2024-01-29 Process chamber, semiconductor process equipment and control method thereof

Publications (1)

Publication Number Publication Date
CN117926230A true CN117926230A (en) 2024-04-26

Family

ID=90760960

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202410124923.1A Pending CN117926230A (en) 2024-01-29 2024-01-29 Process chamber, semiconductor process equipment and control method thereof

Country Status (1)

Country Link
CN (1) CN117926230A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138927A (en) * 1983-12-27 1985-07-23 Fujitsu Ltd Vacuum device
KR20060117620A (en) * 2005-05-13 2006-11-17 삼성전자주식회사 Equipment for manufacturing semiconductor device and control methode at the same
JP2009081267A (en) * 2007-09-26 2009-04-16 Tokyo Electron Ltd Positioning method for substrate conveyance position, substrate processing system, and computer-readable storage medium
US20130085595A1 (en) * 2003-11-10 2013-04-04 Christopher C. Kiley Wafer center finding with kalman filter
CN203639554U (en) * 2013-10-31 2014-06-11 上海广奕电子科技有限公司 Automatic caterpillar band track regulating device of constant-pressure chemical vapor deposition equipment
CN109309035A (en) * 2018-11-08 2019-02-05 德淮半导体有限公司 Semiconductor processing chamber and forming method thereof, semiconductor technology device
CN208848868U (en) * 2018-11-12 2019-05-10 东泰高科装备科技有限公司 Processing chamber and semiconductor processing equipment
CN110648940A (en) * 2018-06-27 2020-01-03 长鑫存储技术有限公司 Airlock, wafer transfer method and semiconductor manufacturing equipment
CN216413102U (en) * 2021-11-08 2022-04-29 通威太阳能(眉山)有限公司 Solar cell coating equipment

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138927A (en) * 1983-12-27 1985-07-23 Fujitsu Ltd Vacuum device
US20130085595A1 (en) * 2003-11-10 2013-04-04 Christopher C. Kiley Wafer center finding with kalman filter
KR20060117620A (en) * 2005-05-13 2006-11-17 삼성전자주식회사 Equipment for manufacturing semiconductor device and control methode at the same
JP2009081267A (en) * 2007-09-26 2009-04-16 Tokyo Electron Ltd Positioning method for substrate conveyance position, substrate processing system, and computer-readable storage medium
CN203639554U (en) * 2013-10-31 2014-06-11 上海广奕电子科技有限公司 Automatic caterpillar band track regulating device of constant-pressure chemical vapor deposition equipment
CN110648940A (en) * 2018-06-27 2020-01-03 长鑫存储技术有限公司 Airlock, wafer transfer method and semiconductor manufacturing equipment
CN109309035A (en) * 2018-11-08 2019-02-05 德淮半导体有限公司 Semiconductor processing chamber and forming method thereof, semiconductor technology device
CN208848868U (en) * 2018-11-12 2019-05-10 东泰高科装备科技有限公司 Processing chamber and semiconductor processing equipment
CN216413102U (en) * 2021-11-08 2022-04-29 通威太阳能(眉山)有限公司 Solar cell coating equipment

Similar Documents

Publication Publication Date Title
US20240112937A1 (en) On the fly automatic wafer centering method and apparatus
US8025475B2 (en) Wafer transfer apparatus, wafer transfer method and storage medium
TWI797087B (en) Substrate processing apparatus and substrate transfer method
US20130180448A1 (en) Substrate transfer device and substrate processing system
US10050401B2 (en) Terminal insertion device and terminal insertion method
WO2004059699A2 (en) System and method for on-the-fly eccentricity recognition
TWI611622B (en) Secondary battery transfer apparatus and method for detecting loading defects of secondary battery
CN112249709B (en) Manipulator and method for acquiring and transmitting wafers
CN117926230A (en) Process chamber, semiconductor process equipment and control method thereof
CN105762093A (en) Technological cavity and method for judging whether position of wafer on tray is abnormal or not
US20190310166A1 (en) Sensor
KR200436002Y1 (en) Dual arm robot
JP2010010396A (en) Lid opening/closing system and lid opening/closing method for sealed container
CN112834704A (en) Distributed flue gas sampling and measuring device
US20040226390A1 (en) Sensor signal transmission from processing system
WO2013051877A2 (en) Vacuum processing apparatus having a means for preventing counter-pressure between chambers
WO2019148763A1 (en) Coating apparatus
KR101408164B1 (en) Trasfer module
CN208848868U (en) Processing chamber and semiconductor processing equipment
CN105742216B (en) Wafer handling system
JP5718795B2 (en) Chuck device
WO2014181711A1 (en) Connector housing measurement device and connector housing measurement method
JP2006080345A (en) Wafer carrying arm, and wafer carrying apparatus
KR20060116912A (en) Apparatus for transferring wafer
CN219368597U (en) Thickness measuring device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination