CN117912987A - Bonding system and bonding method - Google Patents

Bonding system and bonding method Download PDF

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Publication number
CN117912987A
CN117912987A CN202311048772.8A CN202311048772A CN117912987A CN 117912987 A CN117912987 A CN 117912987A CN 202311048772 A CN202311048772 A CN 202311048772A CN 117912987 A CN117912987 A CN 117912987A
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CN
China
Prior art keywords
path
pickup
tray
moving
pick
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Pending
Application number
CN202311048772.8A
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Chinese (zh)
Inventor
金丙根
姜泓求
文佶勇
李相洙
赵东熙
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Semes Co Ltd
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Semes Co Ltd
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Publication of CN117912987A publication Critical patent/CN117912987A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to an adhesive system and an adhesive method for adhering a picked-up object such as a semiconductor package to an adhesive object such as a release film of a carrier frame after picking up the picked-up object, and the adhesive system and the adhesive method may include: a first pick-up device that picks up a pick-up object at a1 st-1 st position and moves along a first path so as to bond the pick-up object to a bonding object located at a1 st-2 nd position; a second pick-up device picking up the pick-up object at the 2-1 position and moving along a second path so as to bond the pick-up object to the bonding object at the 2-2 position; and a vision device capable of photographing the first pickup device or the second pickup device to confirm a pickup state of the pickup object and located at an intermediate area between the 1 st and 1 st-2 nd positions or located at an intermediate area between the 2 nd and 2 nd-1 st positions so as to shorten the first path or the second path.

Description

Bonding system and bonding method
Technical Field
The present invention relates to an adhesive system and an adhesive method, and more particularly to an adhesive system and an adhesive method capable of picking up a pickup object such as a semiconductor package and adhering the pickup object to an adhesive object such as a release film of a carrier frame.
Background
A very wide variety of types of bonding apparatuses are used which pick up and bond various semiconductor components such as semiconductor packages and semiconductor chips to various substrates and films.
In general, the bonding apparatus may adopt a very variety of methods such as vacuum suction or clamping of the pickup object by the pickup apparatus or adhesion by static electricity, however, a phenomenon in which the pickup apparatus cannot pick up the pickup object occurs due to various pickup environments, abnormality of the pickup head, unevenness of adhesion force, various foreign matters, deformation of the pickup object, and the like.
The existing bonding apparatus can confirm the pickup state of the pickup apparatus using the vision apparatus so that a pickup failure phenomenon of the pickup apparatus like this can be sensed.
Disclosure of Invention
Problems to be solved
However, in the conventional vision device of the bonding apparatus, the vision device is fixedly installed at a specific place, and the pickup device needs to travel around to a distance and separate from a shortest path between the pickup object and the bonding object in order to pass through the photographing region of the vision device fixed at the specific place, so that the total accumulated distance of the moving path of the pickup device becomes long, which results in a problem that more operation time is consumed, or a problem that rapid changes in the path increase during the winding, and the pickup device needs to stay for a certain time in the photographing region of the vision device in order to stably photograph, which results in a significant reduction in yield.
The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide an adhesive system and an adhesive method, which can optimize a transfer path of a pickup device to a shortest distance by using a movable vision device, and can perform photographing or minimize photographing time even during movement of the pickup device, thereby greatly improving yield. However, such problems are merely illustrative, and the scope of the present invention is not limited by these problems.
Means for solving the problems
An adhesive system for solving the above problems based on the inventive concept may include: a first pick-up device that picks up a pick-up object at a1 st-1 st position and moves along a first path so as to bond the pick-up object to a bonding object located at a1 st-2 nd position; a second pick-up device picking up the pick-up object at the 2-1 position and moving along a second path so as to bond the pick-up object to the bonding object at the 2-2 position; and a vision device capable of photographing the first pickup device or the second pickup device to confirm a pickup state of the pickup object and located at an intermediate area between the 1 st and 1 st-2 nd positions or located at an intermediate area between the 2 nd and 2 nd-1 st positions so as to shorten the first path or the second path.
Furthermore, according to the present invention, the vision apparatus may include: a camera that sequentially captures the first pickup device and the second pickup device that are in transit or stopped during transit; and a camera moving device that moves the camera along a track to a first photographing position located below the first path of the first pickup device when the camera photographs the first pickup device, and moves the camera along the track to a second photographing position located below the second path of the second pickup device when the camera photographs the second pickup device.
Further, according to the present invention, the first path may be formed as a straight moving path or a curved moving path in a first direction or a second direction from the 1 st-1 position toward a direction close to the 1 st-2 position; the second path may be formed as a straight moving path or a curved moving path along the first direction or the second direction from the 2-1 position toward a direction close to the 2-2 position.
Furthermore, according to the present invention, at least a portion of the first path and the second path may be parallel to each other; the vision device may reciprocate linearly from below the first path to below the second path in a direction perpendicular to the first path and the second path.
Further, according to the present invention, the pickup object may be a semiconductor package; the adhesion object may be a release film formed on the carrier frame in order to form an electromagnetic wave shielding layer on the semiconductor package.
Further, according to the present invention, the first pickup device may include: a first pickup head that picks up the semiconductor packages accommodated on the first tray; and a first pickup head moving device that moves the first pickup head in a first direction; the second pickup device includes: a second pickup head picking up the semiconductor packages accommodated on the second tray; and a second pickup head moving device that moves the second pickup head in the first direction.
Furthermore, according to the present invention, it may further include: a first tray table device for placing the first tray; and a second tray table device for placing the second tray.
Further, according to the present invention, the first pallet means may include: a first tray table on which the first tray is placed; and a first pallet moving means for moving the first pallet in a second direction from a first waiting position to the 1 st-1 st position; the second pallet means may comprise: a second tray table for placing the second tray; and a second pallet moving means for moving the second pallet in a second direction so as to move from the second waiting position to the 2-1 nd position.
Further, according to the present invention, it may further include a tray transfer device that transfers the first tray or the second tray containing the semiconductor packages from a cassette to the first waiting position or the second waiting position, and transfers the first tray or the second tray that is left out from the first waiting position or the second waiting position to the cassette.
Further, according to the present invention, the tray transfer device may include: a tray pickup head that picks up the first tray or the second tray; and a tray pickup head moving device that moves the tray pickup head in a first direction.
Further, according to the present invention, a carrying frame stage device may be further included, which is located at the 1 st-2 nd position or the 2 nd-2 nd position, and which houses the carrying frame.
Furthermore, according to the present invention, the carrying frame stage device may include: a bearing frame table for placing at least one bearing frame; and a carriage frame stage moving device that moves the carriage frame stage in a second direction.
Further, according to the present invention, a carrier frame transfer line that transfers the carrier frame to the carrier frame stage may be further included.
Furthermore, according to the present invention, the carrier frame transfer line may include: a loading section that loads a carrying frame box that accommodates the carrying frame; a first carrying frame transfer device for transferring the carrying frame in a second direction after the carrying frame is pulled out from the loading part; a second carrier frame transfer device for transferring the carrier frame in the first direction and placing the carrier frame on the carrier frame stage or transferring the carrier frame to which the semiconductor package is bonded to a repressing device; and an unloading section for unloading the carrier frame box containing the carrier frame to which the semiconductor package is bonded.
Furthermore, according to the present invention, the repressurization device may include: a pressurizing table for placing the bearing frame adhered with the semiconductor packaging piece; and a repressurizing head repressurizing the carrying frame placed on the repressurizing table.
Further, according to the present invention, one of the first picking device, one of the second picking device, and one of the vision devices may be provided in one side direction with respect to the carrying frame moving line, and the other of the first picking device, the other of the second picking device, and the vision device may be provided in the other side direction symmetrically with respect to the one of the first picking device, the one of the second picking device, and the one of the vision devices.
In addition, an adhesion method for solving the above problems based on the idea of the present invention may include: a step (a) of picking up the picked-up object at the 1 st-1 st position by a first pick-up device and moving along a first path so as to bond the picked-up object to the bonding object at the 1 st-2 nd position; a step (b) of locating a vision device in an intermediate area between the 1 st-1 st position and the 1 st-2 nd position, capable of photographing the first pickup device moving along the first path or stopped halfway to confirm a pickup state of the pickup object; a step (c) of picking up the picked-up object at the 2-1 position by a second pick-up device and moving along a second path so as to bond the picked-up object to the bonding object at the 2-2 position; and a step (d) of locating the vision device at an intermediate area between the 2-1 nd position and the 2-2 nd position, capable of photographing the second pickup device moving along the second path or stopped halfway to confirm a pickup state of the pickup object.
Furthermore, according to the present invention, the vision apparatus may be configured to: when a camera shoots the first pickup device, the camera is moved to a first shooting position located below the first path of the first pickup device, and when the camera shoots the second pickup device, the camera is moved to a second shooting position located below the second path of the second pickup device.
Furthermore, according to the present invention, at least a portion of the first path and the second path may be parallel to each other; the vision device is linearly reciprocated from below the first path to below the second path in a direction perpendicular to the first path and the second path.
In addition, an adhesive system for solving the above problems based on the idea of the present invention may include: a first pick-up device that picks up a pick-up object at a1 st-1 st position and moves along a first path so as to bond the pick-up object to a bonding object located at a1 st-2 nd position; a second pick-up device picking up the pick-up object at the 2-1 position and moving along a second path so as to bond the pick-up object to the bonding object at the 2-2 position; and a vision device capable of photographing the first pickup device or the second pickup device to confirm a pickup state of the pickup object and located at an intermediate area between the 1 st and 1 st-2 nd positions or located at an intermediate area between the 2 nd and 2 nd-1 st positions so as to shorten the first path or the second path; the vision apparatus includes: a camera that sequentially captures the first pickup device and the second pickup device that are in transit or stopped during transit; and a camera moving device that moves the camera along a track to a first photographing position located below the first path of the first pickup device when the camera photographs the first pickup device, and moves the camera along the track to a second photographing position located below the second path of the second pickup device when the camera photographs the second pickup device; the pick-up object is a semiconductor package; the adhesion object is a release film formed on a carrying frame for forming an electromagnetic wave shielding layer on the semiconductor package; the first pickup device includes: a first pickup head that picks up the semiconductor packages accommodated on the first tray; and a first pickup head moving device that moves the first pickup head in a first direction; the second pickup device includes: a second pickup head picking up the semiconductor packages accommodated on the second tray; and a second pickup head moving device that moves the second pickup head in a first direction; further comprises: a first tray table device for placing the first tray; and a second tray table device for placing the second tray; the tray transfer device transfers the first tray or the second tray containing the semiconductor packages from a wafer box to the first waiting position or the second waiting position, and transfers the first tray or the second tray which is left out from the first waiting position or the second waiting position to the wafer box; the device also comprises a bearing frame table device, wherein the bearing frame table device is positioned at the 1 st-2 position or the 2 nd-2 position and is used for placing the bearing frame; the device also comprises a bearing frame moving line, wherein the bearing frame moving line moves the bearing frame to the bearing frame table.
ADVANTAGEOUS EFFECTS OF INVENTION
The embodiments according to the present invention configured as described above have the following effects.
By using the movable vision device of the variable photographing area, the transfer path of the pickup device can be optimized to the shortest distance, and the flying photographing can be performed even while the pickup device is moving or the vision device is moving, thereby minimizing photographing time, greatly improving yield, and simplifying and configuring the transfer path of the pickup device in parallel without abrupt change, thereby preventing falling or deformation of the pickup object during transfer. Of course, the invention is not limited to just these effects.
Drawings
FIG. 1 is a schematic diagram schematically illustrating an adhesive system in accordance with a portion of an embodiment of the present invention;
FIG. 2 is a top view showing the bonding system of FIG. 1;
fig. 3 is a perspective view showing a state in which a vision device of the bonding system of fig. 1 photographs a first pickup device;
Fig. 4 is a perspective view showing a state in which the vision device of the bonding system of fig. 3 photographs the second pickup device;
FIG. 5 is a top view showing an adhesive system according to another partial embodiment of the invention in more detail;
FIG. 6 is a perspective view schematically illustrating an adhesive system according to yet another portion of the present invention;
FIG. 7 is a perspective view schematically illustrating a carrier frame transfer line of the bonding system of FIG. 6;
Fig. 8 is a perspective view schematically showing a first pick-up device and a second pick-up device and a vision device of the bonding system of fig. 6;
FIG. 9 is a perspective view schematically illustrating a repressurization device of the bonding system of FIG. 6;
FIG. 10 is a top view of an adhesive system according to yet another embodiment of the invention;
FIG. 11 is a sequence diagram illustrating a bonding method according to some embodiments of the invention;
Reference numerals illustrate:
1.A semiconductor package; 2, carrying a frame;
3.A release film; p1 a first path;
A P2 second path; a first pick-up device;
11. A first pick-up head; t1 a first tray;
a T2 second tray; 12 first pick-up head movement means;
20. a second pick-up device; a second pick-up head 21;
22. A second pick-up head moving device; 30 a vision device;
31. A camera; a 32 camera movement device;
R track; 40a first pallet means;
41. A first pallet table; 42 first pallet station moving means;
50. A second pallet means; a second pallet table 51;
52. a second pallet moving means; 60 tray transfer means;
m sheet box; a tray pickup head 61;
62. A tray pickup head moving device; 70 carrying a frame table arrangement;
71. A carrying frame table; 72 carrying frame table moving means;
80. the carrying frame moves the wire; 81 a loading part;
82. A first load frame transfer device; 83 a second carriage frame transfer device;
84. an unloading section; 85 push rods;
86. a lower viewer; 90 repressurization means;
91. Pressurizing the platform; 92, pressurizing the pressure head;
93. A carrier frame feeder; 99 control part;
100. 200, 300, 400.
Detailed Description
Hereinafter, some preferred embodiments of the present invention are described in detail with reference to the accompanying drawings.
The embodiments of the present invention are intended to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified into several different forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are intended to provide a thorough and complete disclosure, and will fully convey the spirit of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of illustration.
The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification, the singular forms may include the plural unless the context clearly dictates otherwise. Furthermore, the use of "including" in this specification is particularly indicative of the existence of the referenced shapes, numbers, steps, operations, components, elements and/or combinations thereof, and does not preclude the existence or addition of more than one of the other shapes, numbers, operations, components, elements and/or combinations thereof.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings schematically showing preferred embodiments of the present invention. Variations from the depicted shapes are contemplated, for example, in the drawings, based on manufacturing techniques and/or tolerances. Therefore, embodiments of the inventive concept should not be construed as limited to the particular shapes illustrated herein but are to include, for example, variations in shape resulting from fabrication.
Fig. 1 is a schematic diagram conceptually illustrating an adhesive system 100 according to a portion of an embodiment of the invention.
First, as shown in fig. 1, an adhesive system 100 according to a part of the embodiment of the present invention may generally include a first pickup device 10, a second pickup device 20, a vision device 30, and a control part 99 controlling them.
For example, the first pick-up device 10 may be a device that, after picking up a pick-up object from the first tray T1 located at the 1 st-1 st position, moves along the first path P1 and bonds the pick-up object to the bonding object of the carriage frame table device 70 located at the 1 st-2 nd position.
Further, for example, the second pick-up device 20 may be a device that, after picking up the picked-up object from the 2-1 position, moves along the second path P2 and bonds the picked-up object to the bonding object of the carriage table device 70 located at the 2-2 position.
Here, for example, the pickup object is the semiconductor package 1, and the adhesion object is the release film 3 adhered to the carrier frame 2 for forming the electromagnetic wave shielding layer on the semiconductor package 1, and the carrier frame 2 is formed in a circular ring shape as a whole.
The release film 3 may be a protective film or a release film that can protect the solder ball surface, the terminal surface, or the like of the semiconductor package 1, and at the same time, can make the semiconductor package 1 easily peeled off when electromagnetic wave shielding layers are formed on the upper surface and the side surfaces of the semiconductor package 1 by a process such as sputtering.
In addition, for example, the carrying frame stage device 70 may be provided in total in two to correspond to the first pickup device 10 and the second pickup device 20, respectively, and in addition, one carrying frame stage device 70 having a double carrying frame stage may be provided.
Further, for example, the vision device 30 may photograph both the first pickup device 10 and the second pickup device 20 so as to confirm the pickup state of the pickup object, and the vision device 30 may be located in an intermediate area between the 1 st-1 st position and the 1 st-2 nd position or in an intermediate area between the 2 nd-1 st position and the 2 nd-2 nd position to shorten the first path P1 or the second path P2.
In addition to this, the vision device 30 may also have a wider photographing region that entirely includes at least a portion of the first path P1 and at least a portion of the second path P2 so that both the first pickup device 10 and the second pickup device 20 can be photographed.
Further, for example, the first path P1 may be formed as a straight moving path or a curved moving path from the 1 st position toward the 1 st position along the first direction or the second direction so as to be formed as a shortest distance, i.e., as a path such as a vertical ascent, a horizontal movement, a vertical descent, or the like; the second path P2 may be formed as a straight moving path or a curved moving path from the 2-1 position toward the 2-2 position along the first direction or the second direction so as to be formed as a shortest distance, i.e., as a path such as a vertical ascent, a horizontal movement, a vertical descent, or the like.
Further, for example, the control unit 99 may control the first pickup device 10, the second pickup device 20, and the vision device 30, may control the vision device 30 to take an image of the first pickup device 10 when the first pickup device 10 is transferred along the first path P1, and may control the vision device 30 to take an image of the second pickup device 20 when the second pickup device 20 is transferred along the first path P2.
FIG. 2 is a top view of the bonding system 100 of FIG. 1; fig. 3 is a perspective view showing a state in which the vision device 30 of the bonding system 100 of fig. 1 photographs the first pick-up device 10; fig. 4 is a perspective view illustrating a state in which the vision device 30 of the bonding system 100 of fig. 3 photographs the second pickup device 20.
As shown in fig. 2 to 4, the vision device 30 of the bonding system 100 according to a part of the embodiment of the present invention may include: a camera 31 capable of sequentially capturing images of the first pickup device 10 and the second pickup device 20 that are being transferred or stopped during transfer; and a camera moving device 32 that moves the camera 31 in the second direction.
More specifically, the camera mobile device 32 may be a mobile device configured as follows: when the camera 31 photographs the first pickup device 10, the camera 31 is moved along the track R to a first photographing position located below the first path P1 of the first pickup device 10, and when the camera 31 photographs the second pickup device 20, the camera 31 is moved along the track R to a second photographing position located below the second path P2 of the second pickup device 20.
Such a camera moving device 32 may use various power sources such as a motor, a linear motor, and a cylinder to combine a movable table with a threaded rod, a gear combination, a belt and pulley combination, a wire rope and pulley combination, a chain and sprocket combination, and a cam combination, and various power transmission devices and actuators may be applied.
Here, for example, the first direction and the second direction may be perpendicular to each other, and more specifically, for example, the first direction may be an X-axis direction, the second direction may be a Y-axis direction, and the third direction may be a Z-axis direction.
Further, for example, at least a part of the first path P1 and the second path P2 may be parallel to each other toward the first direction, i.e., toward the X-axis direction, and the vision device 30 may be linearly reciprocated from below the first path P1 to below the second path P2 in the second direction perpendicular to the first path P1 and the second path P2.
More specifically, for example, as shown in fig. 2 and 4, the first pickup device 10 may include: a first pickup head 11 that picks up the semiconductor packages 1 accommodated on the first tray T1; and a first pickup head moving device 12 that moves the first pickup head 11 in a first direction.
Further, for example, the second pickup device 20 may include: a second pickup head 21 that picks up the semiconductor packages 1 accommodated on the second tray T2; and a second pickup head moving device 22 that moves the second pickup head 21 in the first direction.
Here, the first pickup head 11 and the second pickup head 21 may be plural, plural vacuum suction holes or suction pads for sucking the semiconductor package 1 may be provided, and the first pickup head moving device 12 and the second pickup head moving device 22 may perform X-axis driving which is the first direction, may perform Z-axis driving in addition to X-axis driving, and may perform θ -axis (T-axis) driving.
In addition, although not shown, in order to confirm the moving positions of the first pickup 11 and the second pickup 21 as described above, various types of pickup monitors may be provided.
Therefore, the semiconductor packages 1 accommodated in the first tray T1 can be picked up by the first pickup head 11 and transferred along the first path P1, and the semiconductor packages 1 accommodated in the second tray T2 can be picked up by the second pickup head 21 and transferred along the second path P2.
At this time, the camera moving device 32 may move the camera 31 to a first photographing position under the first path P1 of the first pickup device 10 along the track R, and may alternately move the camera 31 to a second photographing position under the second path P2 of the second pickup device 20 along the track R.
In addition, as shown in fig. 2 to 4, the bonding system 100 according to a part of the embodiment of the present invention may further include a first tray table device 40 to receive the first tray T1 and a second tray table device 50 to receive the second tray T2.
More specifically, as shown in fig. 2, for example, the first pallet means 40 may include: a first tray table 41 for placing a first tray T1; and a first tray table moving device 42 that moves the first tray table 41 in the second direction from the first waiting position to the 1 st-1 st position.
Further, for example, the second tray table device 50 may include: a second tray table 51 for placing a second tray T2; and a second pallet moving device 52 that moves the second pallet 51 in the second direction from the second waiting position to the 2-1 position.
Therefore, according to the bonding system 100 of a part of the embodiments of the present invention, description will be made regarding the operation of such a system, first, as shown in fig. 3, the first pick-up device 10 may pick up the pick-up object at the 1 st position and move along the first path P1 toward the first direction, i.e., the X-axis direction, so as to bond the pick-up object to the bonding object at the 1 st position and the 2 nd position.
At this time, in order to confirm the pickup state of the pickup object, the vision apparatus 30 may advance to move to an intermediate area between the 1 st-1 st position and the 1 st-2 nd position toward the second direction, i.e., the Y-axis direction, so that the first pickup apparatus 10 moving along the first path P1 or stopped in the middle can be photographed.
Next, as shown in fig. 4, the second pick-up device 20 may pick up the pick-up object at the 2-1 position and move along the second path P2 toward the first direction, i.e., the X-axis direction, so as to bond the pick-up object to the bonding object at the 2-2 position.
At this time, in order to confirm the pickup state of the pickup object, the vision apparatus 30 may be moved backward toward the second direction, i.e., the Y-axis direction, to an intermediate region between the 2-1 st position and the 2-2 nd position, so that the second pickup apparatus 20 moving along the second path P2 or stopped halfway can be photographed.
Thus, according to the present invention, by using the movable vision device 30 in which the imaging area is variable, the transfer paths P1 and P2 of the pickup devices 10 and 20 can be optimized to the shortest distance, and even when the pickup devices 10 and 20 are moving or the vision device 30 is moving, the flying imaging can be performed, so that the imaging time can be minimized, the throughput can be greatly improved, and the transfer paths P1 and P2 of the pickup devices 10 and 20 can be simplified and parallel without rapid change, thereby preventing the dropping or deformation of the pickup object during transfer, and further improving the transfer speed in a stable state.
FIG. 5 is a top view of an adhesive system 200 according to another embodiment of the invention in more detail; fig. 6 is a perspective view schematically showing an adhesive system 300 according to still another part of the embodiment of the present invention; fig. 7 is a perspective view schematically illustrating the carrier frame transfer line 80 of the bonding system 300 of fig. 6; fig. 8 is a perspective view schematically showing the first and second pick-up devices 10 and 20 and the vision device 30 of the bonding system 300 of fig. 6; fig. 9 is a perspective view schematically showing the repressurizing device 90 of the bonding system 300 of fig. 6.
As shown in fig. 5 to 9, the bonding system 200, 300 according to various other embodiments of the present invention may further include a tray transfer device 60, the tray transfer device 60 transferring the first tray T1 or the second tray T2 containing the semiconductor package 1 from the cassette M to the first waiting position or the second waiting position, and transferring the vacated first tray T1 or second tray T2 from the first waiting position or the second waiting position to the cassette M.
More specifically, for example, the tray transfer device 60 may include: a tray pickup head 61 that picks up the first tray T1 or the second tray T2; and a tray pickup head moving device 62 that moves the tray pickup head 61 in the first direction.
In addition, although not shown, a tray lifter (elevator) or a tray shuttle (shuttle) that can lift and lower the first tray T1 or the second tray T2 may be additionally provided.
Therefore, as shown in fig. 5 and 6, by using the tray transfer device 60, when the tray pickup head 61 picks up the first tray T1 or the second tray T2 containing the semiconductor packages 1 from the cassette M and transfers to the first waiting position or the second waiting position in the first direction, the first tray table device 40 or the second tray table device 50 can transfer the first tray T1 or the second tray T2 to the above-mentioned 1-1 position or 2-1 position in the second direction so that the first pickup device 10 or the second pickup device 20 can pick up the semiconductor packages 1.
Further, as shown in fig. 5-9, for example, the bonding systems 200, 300 according to various other embodiments of the present invention may further include a carrier frame stage device 70 positioned at the 1-2 or 2-2 position and receiving the carrier frame 2.
More specifically, the carrying frame stage device 70 may include: a carrying frame stage 71 for receiving at least one carrying frame 2; and a carriage frame stage moving device 72 that moves the carriage frame stage 71 in the second direction.
Here, although not shown, a platen for supporting the lower surface of the release film 3 may be provided on the carrier frame stage 71, or a very various devices such as a gripper for gripping the carrier frame 2 or a lifter for raising or lowering the carrier frame 2, which can upload or unload one carrier frame 2 during the bonding work on the other carrier frame 2, may be additionally provided.
Accordingly, the carrier frame stage moving means 72 can move the carrier frame stage 71 on which the carrier frame 2 is placed in the second direction, thereby positioning the carrier frame 2 at the 1 st-2 nd position or the 2 nd-2 nd position, and thereby enabling the first pick-up device 10 or the second pick-up device 20 to adhere the picked-up semiconductor packages 1 to the release film 3 of the carrier frame 2.
Further, for example, as shown in fig. 5-9, the bonding systems 200, 300 according to various other embodiments of the present invention may also include a carrier frame transfer line 80 that transfers the carrier frame 2 to the carrier frame stage 71.
More specifically, for example, the carrier frame transfer line 80 may include: a loading section 81 for loading a carrier frame box accommodating the carrier frame 2; a first carriage frame transfer device 82 for transferring the carriage frame 2 in the second direction after being pulled out from the loading section 81; a second carrier transfer device 83 that transfers the carrier 2 in the first direction and mounts the carrier on the carrier stage 71 or transfers the carrier 2 with the semiconductor package 1 bonded thereto to the repressing device 90; and an unloading section 84 for unloading the carrier frame cassette accommodating the carrier frame 2 to which the semiconductor package 1 is bonded.
In addition, as shown in fig. 5 and 7, the carrier frame transfer line 80 may be additionally provided with a very various devices such as a push rod 85 that pulls out the carrier frame 2 from the carrier frame box loaded on the loading unit 81 alone, a lower monitor 86 that can confirm the adhesion state of the semiconductor packages 1 of the carrier frame 2, or a lifter, not shown, of a double structure that lifts the carrier frame 2.
In addition, as shown in fig. 5 and 9, the repressurization device 90 may include: a pressurizing table 91 for placing the carrier frame 2 to which the semiconductor package 1 is bonded so as to improve the adhesion between the semiconductor package 1 and the release film 3; a repressurizing head 93 repressurizing the carrying frame mounted on the repressurizing table 91; the carrier frame feeder 93 guides the carrier frame 2 to the repressurizing stage 91.
Therefore, as shown in fig. 5 to 9, the semiconductor package 1 is accommodated in the first tray T1 or the second tray T2 and loaded into the cassette M, and when being transferred to the waiting position in the X-axis direction by the tray transfer device 60, the first tray table device 40 or the second tray table device 50 can transfer the first tray T1 or the second tray T2 to the 1 st-1 st position or the 2 nd-1 st position in the Y-axis direction.
The carrier frame 2 may be mounted on the carrier frame stage 71 via the carrier frame transfer line 80 through the loading unit 81, the first carrier frame transfer device 82, and the second carrier frame transfer device 83.
Therefore, the first pickup device 10 can pick up the semiconductor packages 1 accommodated in the first tray T1 and move in the X-axis direction along the first path P1, and the second pickup device 20 can pick up the semiconductor packages 1 accommodated in the second tray T2 and move in the X-axis direction along the second path P2, and the first pickup device 10 and the second pickup device 20 alternately pick up the semiconductor packages while the vision device 30 reciprocates forward and backward below the first path P1 and below the second path P2.
Next, the semiconductor package 1 is entirely adhered to the carrier frame 2 on the release film 3, unloaded to the unloading section 84 by the carrier frame transfer line 80, and the empty trays T1 and T2 are unloaded to the cassette M by the tray transfer device 60 via the first tray table device 40 or the second tray table device 50.
Therefore, according to the present invention, not only the Layout (Layout) of the movable vision device 30 whose imaging area is variable but also the Layout of the series of the first tray table device 40, the second tray table device 50, the tray transfer device 60, the carriage frame table device 70, the carriage frame transfer line 80, and the repressurizing device 90 related to the pickup devices 10, 20 is optimized and applied to the actual equipment, as a result, the effect of improving the throughput by approximately 30% or more per unit time is obtained as compared with the conventional throughput, and the productivity can be improved by a maximum of two times or more while the occupied area of the equipment is reduced.
Fig. 10 is a top view illustrating an adhesive system 400 according to yet another portion of the present invention.
As shown in fig. 10, the bonding system 400 according to still another embodiment of the present invention may be provided with a first picking up device 10, a second picking up device 20 and a vision device 30 in one side direction with respect to the carrier frame moving line 80, and another first picking up device 10, another second picking up device 20 and another vision device 30 in the other side direction symmetrically to the first picking up device 10, the second picking up device 20 and the vision device 30.
Therefore, other devices can be symmetrically arranged with the carrier frame transfer line 80 as a reference, thereby greatly improving the capacity of the equipment, increasing the production speed, saving the production cost, and greatly improving the productivity.
Fig. 11 is a sequence diagram showing a bonding method according to a part of embodiments of the present invention.
As shown in fig. 1 to 11, the bonding method according to a part of embodiments of the present invention may include: a step (a) of the first pick-up device 10 picking up the pick-up object at the 1 st-1 st position and moving along the first path P1 so as to bond the pick-up object to the bonding object at the 1 st-2 nd position; step (b) of a vision device 30 located in an intermediate area between the 1 st and 1 st-2 nd positions, capable of photographing the first pickup device moving along the first path P1 or stopped halfway to confirm a pickup state of the pickup object; a step (c) of the second pick-up device 20 picking up the pick-up object at the 2-1 position and moving along the second path P2 so as to bond the pick-up object to the bonding object at the 2-2 position; and (d) the vision apparatus 30 is located at an intermediate area between the 2-1 position and the 2-2 position, and is capable of photographing the second pickup device 20 moving along the second path or stopped halfway to confirm a pickup state of the pickup object.
Here, for example, the vision apparatus 30 is configured to: when the camera 31 photographs the first pickup device 10, the camera 31 is moved to a first photographing position located under the first path P1 of the first pickup device 10, and when the camera 31 photographs the second pickup device 20, the camera 31 is moved to a second photographing position located under the second path P2 of the second pickup device 20.
Further, at least a portion of the first path P1 and the second path P2 are parallel to each other; the vision device 30 is linearly reciprocated from below the first path P1 to below the second path P2 in a direction perpendicular to the first path P1 and the second path P2.
The embodiments shown in the figures are described with reference to the present invention, but this is only an example, and it is understood that many variations and equivalent other embodiments can be made by those skilled in the art. Therefore, the true technical scope of the present invention should be determined according to the technical ideas of the appended claims.

Claims (20)

1. An adhesive system comprising:
A first pick-up device that picks up a pick-up object at a1 st-1 st position and moves along a first path so as to bond the pick-up object to a bonding object located at a1 st-2 nd position;
A second pick-up device picking up the pick-up object at the 2-1 position and moving along a second path so as to bond the pick-up object to the bonding object at the 2-2 position; and
And a vision device capable of photographing the first or second pickup device to confirm a pickup state of the pickup object and located at an intermediate area between the 1 st and 1 st-2 nd positions or located at an intermediate area between the 2 nd and 2 nd-1 st positions so as to shorten the first or second path.
2. The bonding system according to claim 1, wherein the adhesive is applied to the substrate,
The vision apparatus includes:
a camera that sequentially captures the first pickup device and the second pickup device that are in transit or stopped during transit; and
And a camera moving device which moves the camera along a track to a first photographing position located below the first path of the first pickup device when the camera photographs the first pickup device, and moves the camera along the track to a second photographing position located below the second path of the second pickup device when the camera photographs the second pickup device.
3. The bonding system according to claim 1, wherein the adhesive is applied to the substrate,
The first path is formed as a straight moving path or a curved moving path in a first direction or a second direction from the 1 st-1 position toward a direction close to the 1 st-2 position;
The second path is formed as a straight moving path or a curved moving path along the first direction or the second direction from the 2-1 position toward a direction approaching the 2-2 position.
4. The bonding system according to claim 1, wherein the adhesive is applied to the substrate,
At least a portion of the first path and the second path are parallel to each other;
The vision device is linearly reciprocated from below the first path to below the second path in a direction perpendicular to the first path and the second path.
5. The bonding system according to claim 1, wherein the adhesive is applied to the substrate,
The pick-up object is a semiconductor package;
The adhesion object is a release film formed on a carrier frame to form an electromagnetic wave shielding layer on the semiconductor package.
6. The bonding system according to claim 5, wherein the adhesive is applied to the substrate,
The first pickup device includes:
a first pickup head that picks up the semiconductor packages accommodated on the first tray; and
A first pickup head moving device that moves the first pickup head in a first direction;
The second pickup device includes:
A second pickup head picking up the semiconductor packages accommodated on the second tray; and
And a second pickup head moving device that moves the second pickup head in the first direction.
7. The bonding system according to claim 6, wherein the adhesive is applied to the substrate,
Further comprises:
A first tray table device for placing the first tray; and
And the second tray table device is used for placing the second tray.
8. The bonding system according to claim 7, wherein the adhesive is applied to the substrate,
The first pallet means includes:
A first tray table on which the first tray is placed; and
A first pallet moving means for moving the first pallet in a second direction from a first waiting position to the 1 st-1 st position;
The second pallet means includes:
A second tray table for placing the second tray; and
And a second pallet moving device for moving the second pallet in a second direction from a second waiting position to the 2-1 position.
9. The bonding system according to claim 8, wherein the adhesive is applied to the substrate,
The tray transfer device transfers the first tray or the second tray containing the semiconductor package from a cassette to the first waiting position or the second waiting position, and transfers the first tray or the second tray that is left out from the first waiting position or the second waiting position to the cassette.
10. The bonding system according to claim 9, wherein the adhesive is applied to the substrate,
The tray transfer device includes:
a tray pickup head that picks up the first tray or the second tray; and
And a tray pickup head moving device for moving the tray pickup head in a first direction.
11. The bonding system according to claim 5, wherein the adhesive is applied to the substrate,
And a bearing frame table device which is positioned at the 1 st-2 nd position or the 2 nd-2 nd position and is used for placing the bearing frame.
12. The bonding system according to claim 11, wherein the adhesive is applied to the substrate,
The carrying frame stage device includes:
A bearing frame table for placing at least one bearing frame; and
And a carriage frame stage moving device for moving the carriage frame stage in a second direction.
13. The bonding system according to claim 12, wherein the adhesive is applied to the substrate,
The device also comprises a bearing frame moving line, wherein the bearing frame moving line moves the bearing frame to the bearing frame table.
14. The bonding system according to claim 13, wherein the adhesive is applied to the substrate,
The carrying frame transfer line includes:
a loading section that loads a carrying frame box that accommodates the carrying frame;
A first carrying frame transfer device for transferring the carrying frame in a second direction after the carrying frame is pulled out from the loading part;
A second carrier frame transfer device for transferring the carrier frame in the first direction and placing the carrier frame on the carrier frame stage or transferring the carrier frame to which the semiconductor package is bonded to a repressing device; and
And an unloading unit for unloading the carrier frame box containing the carrier frame to which the semiconductor package is bonded.
15. The bonding system according to claim 14, wherein the adhesive is applied to the substrate,
The repressurization device includes:
A pressurizing table for placing the bearing frame adhered with the semiconductor packaging piece; and
And a repressurizing head repressurizing the carrying frame placed on the repressurizing table.
16. The bonding system according to claim 13, wherein the adhesive is applied to the substrate,
With respect to the carrying frame moving line, one of the first picking device, one of the second picking device and one of the vision devices is provided in one side direction, and the other first picking device, the other second picking device and the other vision device are provided in the other side direction symmetrically to the one of the first picking device, the one of the second picking device and the one of the vision devices.
17. A bonding method, comprising:
a step (a) of picking up the picked-up object at the 1 st-1 st position by a first pick-up device and moving along a first path so as to bond the picked-up object to the bonding object at the 1 st-2 nd position;
A step (b) of locating a vision device in an intermediate area between the 1 st-1 st position and the 1 st-2 nd position, capable of photographing the first pickup device moving along the first path or stopped halfway to confirm a pickup state of the pickup object;
A step (c) of picking up the picked-up object at the 2-1 position by a second pick-up device and moving along a second path so as to bond the picked-up object to the bonding object at the 2-2 position; and
And (d) the vision means is located at an intermediate area between the 2-1 nd and 2-2 nd positions, and is capable of photographing the second pickup device moving along the second path or stopped halfway to confirm a pickup state of the pickup object.
18. A bonding method according to claim 17, wherein,
The vision device is configured to:
when a camera shoots the first pickup device, the camera is moved to a first shooting position located below the first path of the first pickup device, and when the camera shoots the second pickup device, the camera is moved to a second shooting position located below the second path of the second pickup device.
19. A bonding method according to claim 18, wherein,
At least a portion of the first path and the second path are parallel to each other;
The vision device is linearly reciprocated from below the first path to below the second path in a direction perpendicular to the first path and the second path.
20. An adhesive system, comprising:
A first pick-up device that picks up a pick-up object at a1 st-1 st position and moves along a first path so as to bond the pick-up object to a bonding object located at a1 st-2 nd position;
A second pick-up device picking up the pick-up object at the 2-1 position and moving along a second path so as to bond the pick-up object to the bonding object at the 2-2 position; and
A vision device capable of photographing the first or second pickup device to confirm a pickup state of the pickup object and located at an intermediate area between the 1 st and 1 st-2 nd positions or located at an intermediate area between the 2 nd and 2 nd-1 st positions so as to shorten the first or second path;
The vision apparatus includes:
a camera that sequentially captures the first pickup device and the second pickup device that are in transit or stopped during transit; and
A camera moving device that moves the camera along a track to a first photographing position located below the first path of the first pickup device when the camera photographs the first pickup device, and moves the camera along the track to a second photographing position located below the second path of the second pickup device when the camera photographs the second pickup device;
the pick-up object is a semiconductor package;
The adhesion object is a release film formed on a carrying frame for forming an electromagnetic wave shielding layer on the semiconductor package;
The first pickup device includes:
a first pickup head that picks up the semiconductor packages accommodated on the first tray; and
A first pickup head moving device that moves the first pickup head in a first direction;
The second pickup device includes:
A second pickup head picking up the semiconductor packages accommodated on the second tray; and
A second pickup head moving device that moves the second pickup head in a first direction;
Further comprises:
A first tray table device for placing the first tray; and
A second tray table device for placing the second tray;
The tray transfer device transfers the first tray or the second tray containing the semiconductor packages from a wafer box to the first waiting position or the second waiting position, and transfers the first tray or the second tray which is left out from the first waiting position or the second waiting position to the wafer box;
The device also comprises a bearing frame table device, wherein the bearing frame table device is positioned at the 1 st-2 position or the 2 nd-2 position and is used for placing the bearing frame;
the device also comprises a bearing frame moving line, wherein the bearing frame moving line moves the bearing frame to the bearing frame table.
CN202311048772.8A 2022-10-18 2023-08-18 Bonding system and bonding method Pending CN117912987A (en)

Applications Claiming Priority (2)

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KR1020220134328A KR20240054058A (en) 2022-10-18 2022-10-18 System and method for attaching
KR10-2022-0134328 2022-10-18

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Publication Number Publication Date
CN117912987A true CN117912987A (en) 2024-04-19

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