CN117906074A - Wafer cleaning equipment and leakage detection method thereof - Google Patents

Abstract

A wafer cleaning apparatus includes a chamber, a rotating stage, a liquid spray column, a top cover, a liquid delivery line, a protection line, and a leak detector. The rotating stage is disposed in the chamber and configured to hold a wafer carrier. The liquid spraying column is positioned in the cavity and faces the wafer carrier. The upper cover is positioned on the cavity, wherein the liquid spraying column is arranged on the bottom surface of the upper cover. The liquid conveying pipeline is positioned outside the cavity, is communicated with the liquid spraying column and is arranged along the bottom surface, the outer side wall and the upper cover of the cavity. The protection pipeline is sleeved on the liquid conveying pipeline. The leakage detector is positioned in the protection pipeline and below the lowest part of the liquid conveying pipeline. The wafer cleaning equipment can monitor the flow terminal, ensure that the chemical liquid enters the cavity through the liquid conveying pipeline and the liquid spraying column, etch or clean the wafer, effectively improve the stability of the process and improve the yield of the product.

Description

Wafer cleaning equipment and leakage detection method thereof

Technical Field

The present disclosure relates to a wafer cleaning apparatus and a leak detection method of the wafer cleaning apparatus.

Background

Generally, during wafer rinsing, no leakage occurs in the liquid conveying pipeline, so that the quality during rinsing can be ensured. If the conveying pipeline is leaked, the flow rate of liquid entering the cavity is reduced or the chemical concentration is unstable, so that the flushing quality cannot be ensured.

However, some wafer rinsing machines have a possibility of breaking at joints or corners because the upper cover is often opened and closed and the liquid delivery pipe is repeatedly bent. In addition, these models may be limited by the space above, and the flow control valve cannot be arranged at the end of the pipeline at the top end of the machine, so that the flow entering the cavity is directly monitored, and therefore, part of the key pipelines cannot be monitored truly. For silicon carbide (SiC) wafer processes, the process cost is much higher than that of silicon wafer processes, so in order to avoid a large number of silicon carbide wafers being scrapped due to poor cleaning quality, the requirement for stability of the cleaning quality is higher.

Disclosure of Invention

One aspect of the present disclosure is a wafer cleaning apparatus.

According to one embodiment of the present disclosure, a wafer cleaning apparatus includes a chamber, a spin chuck, a liquid spray column, a top cover, a liquid delivery line, a protection line, and a leak detector. The rotating stage is disposed in the chamber and configured to hold a wafer carrier. The liquid spraying column is positioned in the cavity and faces the rotary carrying platform. The upper cover is positioned on the cavity, wherein the liquid spraying column is arranged on the bottom surface of the upper cover. The liquid conveying pipeline is positioned outside the cavity, communicated with the liquid spraying column and arranged along the bottom surface, the outer side wall and the upper cover of the cavity. The protection pipeline is sleeved on the liquid conveying pipeline. The leakage detector is positioned in the protection pipeline and below the lowest part of the liquid conveying pipeline.

In an embodiment of the disclosure, a lowest portion of the liquid conveying pipeline is near a connection portion between the bottom surface and the outer sidewall of the cavity.

In an embodiment of the disclosure, the liquid delivery pipe includes an upright portion disposed along an outer sidewall of the cavity, and the leak detector is at least partially overlapped with the upright portion of the liquid delivery pipe in a vertical direction.

In an embodiment of the disclosure, the liquid conveying pipeline includes a horizontal portion disposed along a bottom surface of the cavity, and the leakage detector at least partially overlaps the horizontal portion of the liquid conveying pipeline in a vertical direction.

In an embodiment of the disclosure, the leak detector is an impedance leak detector.

In an embodiment of the disclosure, the leak detector is located between the protection pipe and the liquid delivery pipe.

In an embodiment of the disclosure, the wafer cleaning apparatus further includes a liquid dispensing control module connected to the liquid inlet of the liquid conveying pipeline, and the liquid dispensing control module and the leakage detector are located below the bottom surface of the cavity.

In an embodiment of the disclosure, the dispensing control module includes a plurality of flow control valves and a plurality of manifold valves, the manifold valves are respectively connected to the flow control valves, and the manifold valves are located upstream of the liquid delivery pipeline and downstream of the flow control valves.

In an embodiment of the disclosure, the wafer cleaning apparatus further includes a monitoring device electrically connected to the leakage detector and configured to monitor an impedance value of the impedance detector.

In an embodiment of the disclosure, the rotating stage has a rotation shaft, and the wafer cleaning apparatus further includes a rotating device configured to rotate the rotating stage to move the wafer carrier around the liquid spray column.

According to another embodiment of the present disclosure, a wafer cleaning apparatus includes a chamber, a spin chuck, a liquid spray column, a top cover, a liquid delivery line, a protection line, and a leak detector. The rotating stage is disposed in the chamber and configured to hold a wafer carrier. The liquid spraying column is positioned in the cavity and faces the rotary carrying platform. The upper cover is positioned on the cavity, wherein the liquid spraying column is arranged on the bottom surface of the upper cover. The liquid conveying pipeline is positioned outside the cavity, communicated with the liquid spraying column and arranged along the bottom surface, the outer side wall and the upper cover of the cavity. The protection pipeline is sleeved on the liquid conveying pipeline. The leakage detector is positioned between the protection pipeline and the liquid conveying pipeline and below the lowest part of the liquid conveying pipeline.

In another embodiment of the disclosure, a lowest part of the liquid conveying pipeline is close to a connection part between the bottom surface and the outer side wall of the cavity.

In another embodiment of the disclosure, the liquid conveying pipeline includes an upright portion disposed along an outer sidewall of the cavity and a horizontal portion disposed along a bottom surface of the cavity, and the leak detector at least partially overlaps the upright portion of the liquid conveying pipeline in a vertical direction and at least partially overlaps the horizontal portion of the liquid conveying pipeline in the vertical direction.

In another embodiment of the disclosure, the wafer cleaning apparatus further includes a liquid dispensing control module connected to the liquid inlet of the liquid conveying pipeline, and the liquid dispensing control module and the leakage detector are located below the bottom surface of the cavity.

In another embodiment of the disclosure, the dispensing control module includes a plurality of flow control valves and a plurality of manifold valves, the manifold valves are respectively connected to the flow control valves, and the manifold valves are located upstream of the liquid delivery line and downstream of the flow control valves.

According to one embodiment of the present disclosure, a leak detection method of a wafer cleaning apparatus includes: placing the wafer carrier on a rotary carrier in the cavity, wherein the liquid spraying column is positioned in the cavity and faces the wafer carrier; rotating the rotary stage to move the rotary stage around the liquid spray column; providing liquid to the liquid spray column using a liquid delivery line; and detecting whether the liquid conveying pipeline leaks or not by using a leakage detector positioned below the turning part of the liquid conveying pipeline, wherein the leakage detector is positioned in a protection pipeline sleeved on the liquid conveying pipeline.

In an embodiment of the disclosure, the leakage detection method further includes measuring an impedance value of the leakage detector using a monitoring device electrically connected to the leakage detector.

In an embodiment of the disclosure, the leakage detection method further includes the monitoring device determining that the liquid delivery pipeline is free of leakage liquid when the impedance value of the leakage detector approaches infinity; and when the impedance value of the leakage detector approaches zero, the monitoring device judges that the liquid delivery pipeline has leakage liquid.

In an embodiment of the disclosure, the leak detection method further includes providing the liquid by using a liquid dispensing control module connected to the liquid inlet of the liquid conveying pipeline.

In an embodiment of the disclosure, the leak detection method further includes controlling and monitoring flow rates of a plurality of acid solutions of the liquid using a plurality of flow control valves of the liquid distribution control module; and mixing the acid solution flowing out of the flow control valve by using a plurality of manifold valves of the liquid preparation control module to prepare the liquid.

In the above embodiments of the disclosure, since the wafer cleaning apparatus has the protection pipeline sleeved on the liquid conveying pipeline, and the leakage detector is located below the lowest position of the liquid conveying pipeline and the protection pipeline, the leakage detector can detect whether the liquid conveying pipeline leaks or not while avoiding the liquid conveying pipeline from being broken due to repeated bending. Therefore, flow terminal monitoring can be performed, the quantity and the concentration of the chemical liquid are ensured to enter the cavity through the liquid conveying pipeline and the liquid spraying column, etching or cleaning of the wafer is performed, the process stability is effectively improved, and the product yield is improved.

Drawings

The aspects of the disclosure are best understood from the following detailed description when read with the accompanying drawing figures. Note that the various features are not drawn to scale in accordance with standard practices in the industry. Indeed, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

Fig. 1 is a schematic diagram of a wafer cleaning apparatus according to an embodiment of the disclosure.

Fig. 2 is a partially enlarged schematic illustration of the vicinity of the turn of the liquid delivery line of fig. 1.

Fig. 3 is a schematic view of the wafer cleaning apparatus of fig. 1 after the upper cover thereof is opened.

Fig. 4 is an enlarged schematic diagram of a portion of the liquid dispensing control module of fig. 1.

Fig. 5 is a partially enlarged schematic illustration of a region near a turn of a liquid delivery line according to another embodiment of the disclosure.

Fig. 6 is a schematic diagram of a rotating stage connection turning device of the wafer cleaning apparatus of fig. 1.

Fig. 7 is a flowchart illustrating a leak detection method of the wafer cleaning apparatus according to an embodiment of the present disclosure.

Detailed Description

The following disclosure of embodiments provides many different embodiments, or examples, for implementing different features of the provided objects. Specific examples of elements and arrangements are described below to simplify the present disclosure. Of course, these examples are merely examples and are not intended to be limiting. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms, such as "below … …," "below … …," "lower," "above … …," "upper," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Fig. 1 is a schematic diagram of a wafer cleaning apparatus 100 according to an embodiment of the disclosure. Referring to fig. 1, the wafer cleaning apparatus 100 includes a chamber 110, a spin stand 120, a liquid spray column 140, a cover 150, a liquid transfer line 160, a protection line 170, and a leakage detector 180. The spin chuck 120 is disposed within the chamber 110 and configured to hold a wafer carrier 130. The wafer carrier 130 is configured to hold a plurality of wafers W stacked. In fig. 1, only two opposing wafer carriers 130 are shown, but not limited thereto, e.g., the liquid spray column 140 may be surrounded by more than two wafer carriers 130. The wafer W may be a semi-finished product on which chemicals (not shown) to be cleaned are present after undergoing a front-end process. For example, the chemical may be a photoresist, but is not limited thereto. The liquid spray column 140 is positioned within the chamber 110 and is oriented toward the wafer carrier 130 to spray a spray of liquid L to clean the wafer W in the wafer carrier 130. For example, the liquid L may be a chemical liquid (e.g. an acid liquid), but is not limited thereto.

The upper cover 150 is disposed on the cavity 110, and the liquid spraying column 140 is disposed on the bottom surface of the upper cover 150. The liquid delivery line 160 is located outside the chamber 110 and communicates with the liquid spray column 140 through the upper cover 150. In addition, a liquid delivery line 160 is provided along the bottom surface 114, the outer sidewall 112, and the upper cover 150 of the chamber 110. The protection pipe 170 is sleeved on the liquid conveying pipe 160, and can protect the liquid conveying pipe 160 from being broken and damaged by external force, and prevent the liquid conveying pipe 160 from leaking into the external environment (such as on the floor) to cause danger to personnel. The leak detector 180 is located within the protection circuit 170 below the lowest portion 167 of the liquid delivery circuit 160. In the present embodiment, the lowest portion 167 of the liquid delivery line 160 is near the junction of the bottom surface 114 and the outer sidewall 112 of the chamber 110. The leakage detector 180 can detect whether the liquid L leaked from the liquid conveying pipeline 160 exists in the protection pipeline 170, so as to send out leakage warning.

Specifically, since the wafer cleaning apparatus 100 has the protection pipe 170 sleeved on the liquid conveying pipe 160, and the leakage detector 180 is located below the lowest portion 167 of the liquid conveying pipe 160 and within the protection pipe 170, not only the liquid conveying pipe 160 is prevented from being broken due to repeated bending, but also whether the liquid conveying pipe 160 leaks or not can be detected by the leakage detector 180. In this way, the flow terminal monitoring can be performed to ensure that the chemical liquid enters the cavity 110 through the liquid conveying pipeline 160 and the liquid spraying column 140, so as to etch or clean the wafer W, effectively improve the process stability and increase the product yield.

Fig. 2 is an enlarged partial schematic view of the region near the turn 166 of the liquid delivery line 160 of fig. 1. Referring to fig. 1 and 2 together, the liquid delivery line 160 has an upstanding portion 162, the upstanding portion 162 being disposed along the outer sidewall 112 of the cavity 110, and the leak detector 180 at least partially overlaps the upstanding portion 162 of the liquid delivery line 160 in a vertical direction. In addition, the liquid delivery line 160 has a horizontal portion 164 adjacent to the upstanding portion 162, the horizontal portion 164 being disposed along the bottom surface 114 of the cavity 110, and the leak detector 180 at least partially overlapping the horizontal portion 164 of the liquid delivery line 160 in a vertical direction. In fig. 2, the lowest portion 167 of the liquid delivery line 160 is adjacent to the turn 166 of the liquid delivery line 160, but the position of the lowest portion 167 is not limited thereto. In some embodiments, the lowest portion 167 of the liquid delivery line 160 can be the turn 166, or can be remote from the turn 166. This design ensures that the liquid delivery line 160 will be detected by gravity causing the liquid to flow down or drip down the leak detector 180 when leaking. In addition, the leak detector 180 is disposed between the protection pipe 170 and the liquid delivery pipe 160, which is convenient to install and can detect the accumulated (or flowing) liquid leakage in the space below the horizontal portion 164 of the liquid delivery pipe 160.

In this embodiment, the leak detector 180 may be an impedance leak detector, which can determine whether there is a leak in its impedance determination. For example, if the impedance of the leak detector 180 approaches infinity, it indicates that the liquid delivery line 160 is not leaking liquid L; if the impedance of the leak detector 180 approaches zero, it indicates that the liquid line 160 has leaking liquid L.

Fig. 3 is a schematic view of the wafer cleaning apparatus 100 of fig. 1 after the upper cover 150 is opened. Referring to fig. 1 and 3, in a state that the upper cover 150 is opened and the wafer carrier 130 is taken out from the chamber 110, portions of the liquid transfer line 160 and the protection line 170 are bent, and the turning portions 166 of the vertical portion 162 and the horizontal portion 164 of the liquid transfer line 160 shown in fig. 1 are also bent. Due to the arrangement of the protection pipe 170, the liquid delivery pipe 160 can be protected and prevented from being broken. In addition, when the upper cover 150 is opened, if the liquid L leaks out from the liquid delivery pipe 160, the liquid L flows down the protection pipe 170 to the leak detector 180 located at the lowest position 167, so that the leak detector 180 gives a warning.

The wafer cleaning apparatus 100 may monitor the leakage of the fluid delivery line 160 by an alarm from the leakage detector 180. Thereby ensuring that the flow rate of the liquid L entering the chamber 110 is sufficient to ensure the stability of the process.

Fig. 4 is an enlarged schematic diagram of a portion of the liquid dispensing control module 190 of fig. 1. Referring to fig. 1 and 4, the wafer cleaning apparatus 100 further includes a liquid dispensing control module 190 connected to the liquid inlet 168 of the liquid delivery line 160. The dispensing control module 190 and the leak detector 180 are located below the bottom 114 of the chamber 110. The dispensing control module 190 includes a plurality of manifold valves 192a, 192b, 192c, 192d, and 192e and a plurality of flow control valves 194a, 194b, 194c, 194d, and 194e. In fig. 4, the number of manifold valves and flow control valves is five, but not limited thereto. The manifold valves 192a, 192b, 192c, 192d, and 192e are connected to the flow control valves 194a, 194b, 194c, 194d, and 194e, respectively, and the manifold valves 192a, 192b, 192c, 192d, and 192e are located upstream of the fluid delivery line 160 and downstream of the flow control valves 194a, 194b, 194c, 194d, and 194e. The flow control valves 194a, 194b, 194c, 194d and 194e control the flow rates of the acid liquids L1, L2, L3, L4 and L5, respectively, so that the acid liquids L1, L2, L3, L4 and L5 of different flow rates, types or concentrations can be mixed to prepare the liquid L after entering the manifold valves 192a, 192b, 192c, 192d and 192 e. The liquid L can change the allocation of the acid liquid L1, L2, L3, L4 and L5 according to the process requirement. The liquid dispensing control module 190 delivers liquid L to the liquid delivery line 160 through the liquid inlet 168. In fig. 4, the acid solutions are five types, but not limited to this.

It should be understood that the connection and the effects of the elements described above will not be repeated, and the description is omitted.

Fig. 5 is an enlarged partial schematic view of an area near the lowest portion 167 of the liquid delivery line 160 according to another embodiment of the present disclosure. Referring to fig. 5, the wafer cleaning apparatus 100 of fig. 1 may further include a monitoring device 182 electrically connected to the impedance leakage detector 180, wherein the monitoring device 182 may measure the impedance value of the impedance leakage detector 180 to determine whether there is a leakage. If the impedance value of the leakage detector 180 displayed by the monitoring device 182 approaches infinity, it is determined that the liquid delivery line 160 is not leaking liquid L; if the impedance of the leakage detector 180 displayed by the monitoring device 182 approaches zero, it is determined that the liquid delivery line 160 has leaked liquid L. In some embodiments, the monitoring device 182 may further transmit a leak warning signal, such as a light or sound.

Fig. 6 is a schematic diagram illustrating a connection of the rotating stage 120 and the rotating device 124 of the wafer cleaning apparatus 100 of fig. 1. Referring to fig. 1 and 6, the rotary stage 120 has a rotation shaft 122 at the bottom thereof. The wafer cleaning apparatus 100 also includes a rotation device 124. The rotating device 124 is coupled to the spindle 122 and configured to rotate the rotating stage 120 to move the wafer carrier 130 about the liquid spray column 140. In this way, the liquid spray column 140 can be fixed to spray the liquid L in one direction but can clean the wafer W in the plurality of wafer carriers 130 moving around the liquid spray column 140. In some embodiments, the rotation device 124 is, for example, a motor.

In the following description, a leak detection method of the wafer cleaning apparatus will be described.

Fig. 7 is a flowchart illustrating a leak detection method of the wafer cleaning apparatus according to an embodiment of the present disclosure. Referring to fig. 1 and 7, the leak detection method of the wafer cleaning apparatus includes the following steps. First, in step 500, the wafer carrier 130 is placed on the rotating stage 120 within the chamber 110, wherein the liquid spray column 140 is located within the chamber 110 and facing the wafer carrier 130. Next, in step 600, the rotary stage 120 is rotated such that the rotary stage 120 moves around the liquid spray column 140. Next, in step 700, a liquid L is provided to the liquid spray column 140 using the liquid delivery line 160. Next, in step 800, the leak detector 180 located below the lowest portion 167 of the liquid delivery line 160 is used to detect whether the liquid delivery line 160 leaks, wherein the leak detector 180 is located in the protection line 170 sleeved on the liquid delivery line 160.

Referring to fig. 1 and 5, the leakage detection method of the wafer cleaning apparatus further includes measuring an impedance value of the leakage detector 180 using a monitoring device 182 electrically connected to the leakage detector 180. If the impedance value of the leakage detector 180 displayed by the monitoring device 182 approaches infinity, the monitoring device 182 determines that the liquid delivery line 160 is not leaking liquid L; if the impedance of the leakage detector 180 displayed by the monitoring device 182 approaches zero, the monitoring device 182 determines that the liquid delivery line 160 has leakage liquid L. In this way, the use of the monitoring device 182 can qualitatively measure the impedance of the leak detector 180, thereby better grasping the leak condition.

Referring to fig. 1, the leak detection method of the wafer cleaning apparatus further includes providing the liquid L using a liquid dispensing control module 190 connected to the liquid inlet 168 of the liquid delivery line 160. In this way, the composition of the liquid L can be prepared by the liquid preparation control module 190.

Referring to fig. 1 and 4, the leak detection method of the wafer cleaning apparatus further includes controlling and monitoring the flow rates of the acid solutions L1, L2, L3, L4 and L5 of the liquid L using the flow control valves 194a, 194b, 194c, 194d and 194e of the liquid distribution control module 190, and mixing the acid solutions L1, L2, L3, L4 and L5 flowing out of the flow control valves 194a, 194b, 194c, 194d and 194e using the manifold valves 192a, 192b, 192c, 192d and 192e of the liquid distribution control module 190 to prepare the liquid L. In this way, the respective acid solutions L1, L2, L3, L4, and L5 for preparing the liquid L can be mixed more precisely in the manifold valves 192a, 192b, 192c, 192d of the liquid preparation control module 190, and the flow rate ratio of the respective acid solutions L1, L2, L3, L4, and L5 can be monitored by the flow rate control valves 194a, 194b, 194c, 194d, and 194e to accurately prepare the liquid L, and the liquid L is fed to the liquid feed line 160 through the liquid feed port 168

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

[ Symbolic description ]

100 Wafer cleaning equipment

110 Cavity body

112 Outer side wall

114 Bottom surface

120 Rotary stage

122 Rotating shaft

124 Rotation means

130 Wafer carrier

140 Liquid spray column

150 Upper cover

160 Liquid conveying pipeline

162 Vertical part

164 Horizontal part

166 At the turning point

167: Lowest position

168 Liquid inlet

170 Protection pipeline

180 Leak detector

182 Monitoring device

190 Liquid preparation control module

192A,192b,192c,192d,192e manifold valve

194A,194b,194c,194d,194e flow control valve

500 Steps of

600 Steps

700 Step

800 Step

L1, L2, L3, L4, L5 acid liquor

L is liquid

W is wafer.

Claims (20)

1. A wafer cleaning apparatus, comprising:

a cavity;

The rotating carrier is positioned in the cavity and is configured to place the wafer carrier;

a liquid spray column located within the cavity and facing the wafer carrier;

the upper cover is positioned on the cavity, and the liquid spraying column is arranged on the bottom surface of the upper cover;

The liquid conveying pipeline is positioned outside the cavity, communicated with the liquid spraying column and arranged along the bottom surface, the outer side wall and the upper cover of the cavity;

The protection pipeline is sleeved on the liquid conveying pipeline; and

And the leakage detector is positioned in the protection pipeline and is positioned below the lowest part of the liquid conveying pipeline.

2. The wafer cleaning apparatus of claim 1, wherein the lowest point of the liquid delivery line is proximate to a junction of the bottom surface and the outer sidewall of the chamber.

3. The wafer cleaning apparatus of claim 1, wherein the liquid delivery line includes an upstanding portion disposed along the outer sidewall of the cavity, and the leak detector at least partially overlaps the upstanding portion of the liquid delivery line in a vertical direction.

4. The wafer cleaning apparatus of claim 1, wherein the liquid delivery line includes a horizontal portion disposed along the bottom surface of the chamber, and the leak detector at least partially overlaps the horizontal portion of the liquid delivery line in a vertical direction.

5. The wafer cleaning apparatus of claim 1, wherein the leak detector is an impedance leak detector.

6. The wafer cleaning apparatus of claim 1, wherein the leak detector is located between the protection conduit and the liquid delivery conduit.

7. The wafer cleaning apparatus of claim 1, further comprising:

and the liquid distribution control module is connected with the liquid inlet of the liquid conveying pipeline, wherein the liquid distribution control module and the leakage detector are positioned below the bottom surface of the cavity.

8. The wafer cleaning apparatus of claim 7, wherein the dispense control module comprises a plurality of flow control valves and a plurality of manifold valves, the plurality of manifold valves being respectively connected to the plurality of flow control valves and the plurality of manifold valves being located upstream of the fluid delivery line and downstream of the plurality of flow control valves.

9. The wafer cleaning apparatus of claim 1, further comprising:

and the monitoring device is electrically connected with the leakage detector and is configured to monitor the impedance value of the impedance detector.

10. The wafer cleaning apparatus of claim 1, wherein the rotating carrier has a spindle, the wafer cleaning apparatus further comprising:

And the rotating device is connected with the rotating shaft and is configured to rotate the rotating carrier to enable the wafer carrier to move around the liquid spraying column.

11. A wafer cleaning apparatus, comprising:

a cavity;

The rotating carrier is positioned in the cavity and is configured to place the wafer carrier;

a liquid spray column located within the cavity and facing the wafer carrier;

the upper cover is positioned on the cavity, and the liquid spraying column is arranged on the bottom surface of the upper cover;

The liquid conveying pipeline is positioned outside the cavity, communicated with the liquid spraying column and arranged along the bottom surface, the outer side wall and the upper cover of the cavity;

The protection pipeline is sleeved on the liquid conveying pipeline; and

And the leakage detector is positioned between the protection pipeline and the liquid conveying pipeline and is positioned below the lowest part of the liquid conveying pipeline.

12. The wafer cleaning apparatus of claim 11, wherein the lowest point of the liquid delivery line is proximate to a junction of the bottom surface and the outer sidewall of the chamber.

13. The wafer cleaning apparatus of claim 11, wherein the liquid delivery line includes an upstanding portion disposed along the outer sidewall of the cavity and a horizontal portion disposed along the bottom surface of the cavity, and the leak detector at least partially overlaps the upstanding portion of the liquid delivery line in a vertical direction and at least partially overlaps the horizontal portion of the liquid delivery line in a vertical direction.

14. The wafer cleaning apparatus of claim 11, further comprising:

and the liquid distribution control module is connected with the liquid inlet of the liquid conveying pipeline, wherein the liquid distribution control module and the leakage detector are positioned below the bottom surface of the cavity.

15. The wafer cleaning apparatus of claim 14, wherein the dispense control module comprises a plurality of flow control valves and a plurality of manifold valves, the plurality of manifold valves being respectively connected to the plurality of flow control valves and the plurality of manifold valves being located upstream of the fluid delivery line and downstream of the plurality of flow control valves.

16. A leak detection method for a wafer cleaning apparatus, comprising:

placing a wafer carrier on a rotating carrier in a cavity, wherein a liquid spray column is positioned in the cavity and faces the wafer carrier;

rotating the rotating carrier to move the rotating carrier around the liquid spray column;

Providing liquid to the liquid spray column using a liquid delivery line; and

And detecting whether the liquid conveying pipeline leaks or not by using a leakage detector positioned below the turning part of the liquid conveying pipeline, wherein the leakage detector is positioned in a protection pipeline sleeved on the liquid conveying pipeline.

17. The leak detection method as defined in claim 16, further comprising:

the impedance value of the leak detector is measured using a monitoring device electrically connected to the leak detector.

18. The leak detection method as defined in claim 17, further comprising:

when the impedance value of the leakage detector approaches infinity, the monitoring device judges that the liquid delivery pipeline does not leak the liquid; and

When the impedance value of the leakage detector approaches zero, the monitoring device judges that the liquid is leaked from the liquid conveying pipeline.

19. The leak detection method as defined in claim 16, further comprising:

and providing the liquid by using a liquid distribution control module connected with a liquid inlet of the liquid conveying pipeline.

20. The leak detection method as defined in claim 19, further comprising:

controlling and monitoring the flow of a plurality of acid solutions of the liquid by using a plurality of flow control valves of the liquid preparation control module; and

And mixing the acid solutions flowing out of the flow control valves by using a plurality of manifold valves of the liquid preparation control module to prepare the liquid.