CN117894738A - Film transfer apparatus and method - Google Patents

Abstract

The invention relates to a film transfer device and a film transfer method, wherein the device comprises: the device comprises a container, a limiting cover, a bracket and a transferring tool, wherein the limiting cover is fixed on the container and defines a limiting cavity with two open ends; the bracket comprises a supporting plate, a plurality of through holes penetrating through the supporting plate and a plurality of supporting columns are arranged on the supporting plate, and a transferring tool for adsorbing the film is detachably fixed on the supporting columns. The thin film transfer device and the thin film transfer method can finish large-size transfer of the thin film based on a chemical corrosion method without complex mechanical equipment, have high transfer efficiency and can realize batch preparation of devices; through spacing and the layer board buffering of spacing cover, avoid the film motion and the collision that lead to because of rivers, reduce film breakage probability, guarantee the performance of transferring the film.

Description

Film transfer apparatus and method

Technical Field

The invention relates to the field of thin film device manufacturing, in particular to a thin film transfer device and a thin film transfer method.

Background

Two-dimensional materials, such as graphene, two-dimensional transition metal sulfides, MXenes and the like, have a nano-sized layered structure, excellent semiconductor performance and large specific surface area, and show great potential in research and application of novel sensing devices. For example, the application of graphene devices in biology, optics, gas and other aspects is attracting wide attention at home and abroad, and new important research results are continuously induced.

In the research of devices using two-dimensional materials, the device preparation process is a very important link, and not only directly affects the feasibility of research of various devices (such as the realization of novel device structural design), but also has an important effect on the device performance. At present, the preparation process which takes the main place in the research of the devices often involves a plurality of links: taking a very common stripping-transferring method as an example, firstly, a two-dimensional material needs to be stripped, then the two-dimensional material is transferred, and finally, a metal electrode of a device is prepared. Stripping and transferring two-dimensional materials typically employs wet transfer, which includes: spin-coating PMMA (polymethyl methacrylate) on the surface of a film with a substrate, placing the film into a container containing etching liquid to enable the etching liquid to corrode the substrate, after the substrate is completely removed, contacting a clean polished silicon substrate (or other polished substrates) with PMMA, so as to slightly drag the film coated with PMMA into deionized water to remove residual etching liquid, then contacting the silicon substrate with PMMA, slightly dragging the PMMA/film out of ionized water, transferring the film to the surface of a target substrate, contacting the film with the target substrate, slowly extracting the silicon substrate, baking the PMMA/film/target substrate, tightly attaching the film to the target substrate, removing PMMA by acetone, removing acetone by deionized water, and completing transfer.

However, in the existing transfer process, PMMA needs to be spin-coated on the film, the transfer of the film is realized through PMMA, then PMMA is removed after the transfer is completed, the process is complex, the transfer efficiency is low, and the devices cannot be prepared in batches.

Disclosure of Invention

The invention aims to provide a thin film transfer device and a thin film transfer method, so that the transfer efficiency of a thin film is improved, and the batch preparation of devices is realized.

Based on the above object, the present invention provides a film transferring device, which includes a container, a limiting cover, a bracket and a transferring tool, wherein the limiting cover is fixed on the container, and the limiting cover defines a limiting cavity with two open ends; the bracket comprises a supporting plate, a plurality of through holes penetrating through the supporting plate and a plurality of supporting columns are arranged on the supporting plate, and a transferring tool for adsorbing the film is detachably fixed on the supporting columns.

Further, the container has a receiving slot, and the pallet is positioned in the receiving slot.

Further, a liquid inlet and outlet device is arranged on the container, and the liquid inlet and outlet device is communicated with the containing groove.

Further, a limiting cover bracket is fixed on the container, and the limiting cover is fixed on the limiting cover bracket.

Further, the bracket further comprises a blocking plate, a buffer space is formed between the blocking plate and the supporting plate, and a plurality of supporting columns are located in the buffer space.

Further, each support column is provided with a clamping groove for fixing the transferring tool.

Further, the clamping groove forms a preset angle with the horizontal surface, so that the transfer tool is fixed on the support columns and then forms a preset angle with the horizontal surface.

Further, the bracket further comprises a sliding arm and a handle, wherein the sliding arm is respectively connected with two sides of the container in a sliding manner, and two ends of the handle are respectively connected with the sliding arm.

In another aspect, the present invention provides a film transfer method comprising:

Providing a thin film transfer device as described above, and injecting an etching solution into a container of the thin film transfer device;

floating the film to be transferred with the substrate in the etching solution in the limiting cavity to enable the etching solution to corrode the substrate;

After the substrate is completely corroded, fixing a transfer tool on each support column of a supporting plate, and sliding a bracket to a first position so that the transfer tool is positioned below a film to be transferred;

The corrosive liquid in the accommodating groove is emptied, so that the film to be transferred is gradually adsorbed on the surface of the transferring tool along with the descending of the liquid level;

Repeating the cleaning operations a plurality of times, wherein each cleaning operation comprises: injecting a cleaning solution into the accommodating groove so that the film to be transferred floats on the liquid level of the cleaning solution; after the preset time, evacuating the cleaning liquid in the accommodating groove so as to enable the film to be transferred to be adsorbed on the surface of the transfer tool;

Injecting a cleaning solution into the accommodating groove so that the film to be transferred floats on the liquid level of the cleaning solution; then sliding the bracket to a second position to enable the supporting plate to be far away from the cover body;

Fixing the target substrate on each support column of the supporting plate, and then sliding the bracket to a first position;

and evacuating the cleaning solution in the accommodating groove so that the film to be transferred is attached to the surface of the target substrate along with the descending of the liquid level, and the transfer of the film to be transferred is completed.

The thin film transfer device and the thin film transfer method can finish large-size transfer of the thin film based on a chemical corrosion method without complex mechanical equipment, have high transfer efficiency and can realize batch preparation of devices; the transfer of the film on target substrates with different sizes can be realized through the support columns on the support plate, so that the universality is strong; the film transfer device is simple to operate, less in manual operation and high in production efficiency.

Drawings

FIG. 1 is a block diagram of a film transfer apparatus according to an embodiment of the present invention;

FIG. 2 is a perspective view of a film transfer apparatus according to one embodiment of the present invention;

FIG. 3 is a top view of FIG. 2;

FIG. 4 is a schematic view of a limiting cover of a film transfer apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic view of a cage bracket and container according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a bracket according to an embodiment of the present invention;

FIG. 7 is a schematic view of another view of a bracket according to an embodiment of the present invention;

Fig. 8 is a schematic structural diagram of a transfer tool according to an embodiment of the present invention;

Fig. 9 is a flowchart of a film transfer method according to another embodiment of the present invention.

Detailed Description

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1, an embodiment of the present invention provides a film transferring apparatus, which includes a container 100, a limiting cover and a bracket, wherein the limiting cover includes a cover body 210 fixed on the container 100, and the cover body 210 defines a limiting cavity 220 with two open ends; the bracket comprises a supporting plate 310, a plurality of through holes 311 penetrating through the supporting plate 310 and a plurality of supporting columns 312 are arranged on the supporting plate 310, and a transferring tool for adsorbing the film is detachably fixed on the supporting columns 312.

As shown in fig. 2 and 3, in one embodiment, the thin film transfer apparatus includes a container 100 having a receiving groove 110, and the receiving groove 110 may receive an etching solution therein for reacting with a substrate of a thin film and etching the substrate, thereby removing the substrate; a limiting cover is fixed on the container 100, the limiting cover comprises a cover body 210, the cover body 210 is used for limiting a limiting cavity 220 with two open ends, the cover body 210 is at least partially positioned in the accommodating groove 110, so that the upper end opening of the limiting cavity 220 is positioned below the liquid level of the accommodating groove 110, and the lower end opening is positioned above the liquid level; the container 100 is further slidably connected with a bracket, the bracket includes a supporting plate 310, the supporting plate 310 is located in the accommodating groove 110 and can slide between a first position and a second position relative to the container 110, a plurality of through holes 311 penetrating the supporting plate 310 and a plurality of support columns 312 are formed in the supporting plate 310, a transferring tool 400 is detachably fixed on the plurality of support columns 312, the transferring tool 400 is used for adsorbing a film (not shown in the figure), when the supporting plate 310 is located at the first position, the supporting plate 310 is located below the limiting cavity 220, the transferring tool 400 covers a lower end opening of the limiting cavity 220 (namely, a projection of the lower end opening falls on the transferring tool 400 completely), and the second position is a position when the supporting plate 310 is far away from the cover 210.

In some embodiments, the container 100 may further be provided with a liquid inlet and outlet device 500 in communication with the receiving tank 110 for introducing the solution into the receiving tank 110 and discharging the solution from the receiving tank 110. The liquid inlet and outlet device 500 may include a three-way valve 510, a liquid inlet pipe 520 and a liquid outlet pipe 530, wherein the three-way valve 510 is respectively connected to the outlet of the container 100, the liquid inlet pipe 520 and the liquid outlet pipe 530 for controlling the communication between the liquid inlet pipe 520 and the liquid outlet pipe 530 and the outlet of the container 100, and when the liquid inlet pipe 520 is communicated with the outlet of the container 100, liquid inlet is achieved, and when the liquid outlet pipe 530 is communicated with the outlet of the container 100, liquid outlet is achieved. In an exemplary embodiment, the outlet of the container 100 is disposed at the bottom of the container 100.

When the film transferring device is used for transferring the film, firstly, corrosive liquid (such as ferric trichloride solution) is introduced into the accommodating groove 110, the corrosive liquid needs to be used for immersing a part of the cover body 210, so that two openings of the limiting cavity 220 are respectively positioned above and below the liquid level, then the film to be transferred floats in the corrosive liquid in the limiting cavity 220, so that the position of the film is limited in the limiting cavity 220, the corrosive liquid can remove the substrate at the bottom of the film, after the substrate is removed, the supporting plate 310 can slide to the lower part of the limiting cavity 220, then the corrosive liquid is discharged, along with the gradual discharge of the corrosive liquid, the liquid level in the accommodating groove 110 is gradually reduced, the film is adsorbed on the transferring tool 400, after the corrosive liquid is emptied, cleaning liquid remained on the film can be introduced into the accommodating groove 110 to clean, after the cleaning liquid is completely cleaned, the film is emptied, and along with the gradual reduction of the liquid level, the film is adsorbed on the transferring tool 400; then new cleaning liquid is refilled, along with the gradual filling of the cleaning liquid, the cleaning liquid passes through the supporting plate 310 through the through holes 311, when the liquid level exceeds the film, the film leaves the transferring tool 400 and floats on the liquid level, then the supporting plate 310 is slid to be far away from the cover body 210, then the transferring tool 400 on the supporting columns 312 is taken down, the target substrate is fixed on the supporting columns 312, then the supporting plate 310 is slid to the lower part of the limiting cavity 220, and then the cleaning liquid is emptied, so that the film gradually descends to be attached to the target substrate, and the transferring of the film is completed. Because the liquid passes through the supporting plate 310 through the through holes 311 when the liquid is injected and discharged, the liquid can be split, and the fluctuation of the sudden rise and fall liquid is reduced, so that the interference to the film when the liquid rises and falls is reduced.

In some embodiments, the container 100 may be a variety of trough-like containers commonly used in the industry, the liner material of which includes, but is not limited to, a variety of plastics, ceramics, or glass materials. In one exemplary embodiment, the container 100 is a rectangular trough-like container and the liner material of the container 100 is glass.

In some embodiments, the container 100 may have a cap holder 600 fixed thereon, and the cap body 210 may be detachably fixed on the cap holder 600, so that the cap with different dimensions may be replaced as needed to accommodate films with different dimensions. Specifically, the size of the spacing cavity 220 of the spacing cover needs to be larger than the size of the membrane so that the membrane can be confined within the spacing cavity 220. The shape of the cover 210 may be any suitable shape, and the material of the cover 210 may include, but is not limited to, various plastics, ceramics, or glass.

In an exemplary embodiment, as shown in fig. 4, the cover 210 may be a hollow cube surrounded by four side plates, and the space surrounded by the four side plates is the limiting cavity 220. Two outwardly extending fixing arms 230 may be provided on the cover 210, and the two fixing arms 230 are used to cooperate with the limiting cover bracket 600, so as to mount the limiting cover on the limiting cover bracket 600.

As shown in fig. 5, in some embodiments, the limiting cover bracket 600 may be U-shaped, where the limiting cover bracket 600 is fixed on one side of the container 100 and includes two mounting arms 610 extending toward the other side of the container 100, each mounting arm 610 is provided with a groove 611 matching with the fixing arm 230, the two fixing arms 230 are respectively located in the grooves 611 on the two mounting arms 610 to achieve fixation, and the cover 210 is located between the two mounting arms 610; thus, the limiting cover can be fixed on the limiting cover bracket 600, and the cover 210 is at least partially positioned in the accommodating groove 110.

In some embodiments, the size of the cover 210 may be set according to needs, and two identical fixing arms 230 are disposed on the cover 210 with different sizes, so that the cover 210 with different sizes is mounted on the limiting cover bracket 600 by the two fixing arms 230, and limiting of the films with different sizes is achieved.

As shown in fig. 6 and 7, the circumference of the supporting plate 310 is provided with a blocking plate 320 extending along the vertical direction, a buffer space is formed between the blocking plate 320 and the supporting plate 310, a plurality of supporting columns 312 are all located in the buffer space, and in the transfer process, a thin film is also located in the buffer space, and the blocking plate 320 can prevent a large amount of liquid from entering and exiting the buffer space from the circumference of the supporting plate 310, i.e. the liquid can only enter and exit the buffer space from a plurality of through holes 311 on the supporting plate 310, thus, the fluctuation of the liquid can be buffered, and the interference of the liquid flow on the thin film when the liquid enters and exits can be reduced. In the transferring process, the film is limited in the limiting cavity 220 and is also located in the buffer space, so that the film movement and collision caused by water flow can be avoided, the film breakage probability is reduced, and the performance of transferring the film is ensured.

In some embodiments, the blocking plate 320 may be provided with two sliding arms 330, and the two sliding arms 330 are slidably connected to two sides of the container 100, so that the bracket may slide with respect to the container 100. For example, one of the sliding arm 330 and the container 100 may be provided with a slider, and the other may be provided with a slide rail, and the slider may be engaged with the slide rail, so that the sliding arm 330 may slide with respect to the container 100. In an exemplary embodiment, sliding arm 330 has a slide slot 331 formed therein, and the sidewall of container 100 mates with slide slot 331, i.e., the sidewall of container 100 is receivable in slide slot 331 such that sliding arm 330 slides over the sidewall of container 100.

In some embodiments, the bracket may further include a handle 340, both ends of the handle 340 being fixedly connected with the two sliding arms 330, respectively, such that the bracket slides on the container through the handle 340 and the bracket is placed on the container 100 or removed from the container 100.

In some embodiments, a notch 321 may be formed on a side of the blocking plate 320 near the cover 210, so as to avoid the cover 210, and avoid the blocking plate 320 interfering with the cover 210 when the bracket moves to the first position.

In some embodiments, the material of the brackets (including the pallet 310, the stop plate 320, the support posts 312, the slide arms 330, the handles 340, etc.) includes, but is not limited to, various plastics, ceramics, or glass, etc.

As shown in fig. 6, in an exemplary embodiment, the plurality of support columns 312 may be divided into A, B, C groups, each group including three support columns 312, and each group of support columns 312 may hold a single size of transfer tool 400, e.g., the left side of the transfer tool 400 is held on the left support column 312 of one group, the right side of the transfer tool 400 is held on the right support column 312 of the group, and the front side of the transfer tool 400 is held on the front support column 312 of the group, thereby achieving holding of the transfer tool 400. Three sets of support columns 312 may enable the securement of three sizes of transfer tool 400. In one exemplary embodiment, the three sets of support columns 312 are adapted for transfer of 3 inch, 4 inch, and 6 inch wafers, respectively.

In some embodiments, each support column 312 is provided with a slot (not shown in the drawings), as shown in fig. 8, the transferring tool 400 is a generally circular thin-walled structure, and has a small thickness, so that the transferring tool 400 can be directly inserted into the slot to achieve fixation, for example, the left side of the transferring tool 400 is inserted into the slot of the left support column 312, the right side of the transferring tool 400 is inserted into the slot of the right support column 312 to achieve fixation of the left and right sides, and the front side of the transferring tool 400 is inserted into the slot of the front support column 312 to define the position of the front side.

The transfer tool 400 needs to be larger than the size of the film to absorb the entire film, for example, if the size of the film is 3 inches of a wafer, the diameter of the transfer tool 400 may be 4 inches. In an exemplary embodiment, the transfer tool 400 may be a transfer tool as in patent application number 202310421966.1.

In some embodiments, the clamping grooves on the support columns 312 are at an angle (may be any angle between 0 and 180 degrees, such as 12 degrees) to the horizontal plane, so that after the transfer tool 400 is fixed on the support columns 312, the clamping grooves are at an angle to the horizontal plane, i.e. high on one side and low on one side; since the front support columns 312 are used to define the position of the transfer tool 400, the inclination angle and direction of the clamping grooves are the same as those of the front side of the transfer tool 400. In this way, in the transferring process, when the liquid level in the accommodating groove 110 gradually decreases, the film will contact with the higher side of the transferring tool 400 at first, then the contact part gradually increases, and the film is directly and completely attached to the transferring tool 400 (i.e. is completely adsorbed on the transferring tool 400), so that the film can be ensured to be attached to the surface of the transferring tool 400 smoothly, and the film is prevented from slipping; in addition, the inclined transferring tool 400 can also guide the liquid below the film, so that the attaching effect of the film and the transferring tool 400 is improved.

In some embodiments, the container 100 may be provided with a limiting device (not shown) for defining a first position of the bracket, and when the bracket moves to the first position, the bracket will be blocked by the limiting device and cannot move forward, so that the bracket is kept in the first position; in this way, in the film transferring process, when the bracket needs to be slid to the first position, the bracket only needs to slide along the container 100 until being limited, and other positioning operations are not needed, so that the film transferring device is quite convenient.

The thin film transfer device provided by the embodiment of the invention can finish large-size transfer of the thin film based on a chemical corrosion method without complex mechanical equipment, has high transfer efficiency, and can realize batch preparation of devices; the transfer of the film on target substrates with different sizes can be realized through the support columns 312 on the supporting plate 310, so that the universality is strong; the film transfer device disclosed by the invention is simple to operate, less in manual operation and high in production efficiency.

As shown in fig. 9, another embodiment of the present invention provides a film transfer method, which includes the following steps:

s1000: there is provided a thin film transfer apparatus of the above embodiment, and an etching liquid is injected into the accommodation groove 110 of the container 100 of the thin film transfer apparatus so that the liquid level of the etching liquid exceeds the lower end opening of the limiting chamber 220.

The size, shape and materials of the film transfer device can be selected as desired. The etching solution can react with the substrate of the film to be transferred to realize the etching of the substrate, for example, the etching solution can be ferric trichloride solution.

In some embodiments, the volume of the etching solution may be 2/3 to 3/4, preferably 2/3, of the volume of the accommodating groove 110.

S2000: floating the film to be transferred with the substrate in the etching solution in the limiting cavity 220 to enable the etching solution to corrode the substrate;

The film to be transferred comprises, but is not limited to, a graphene, a carbon nanotube film, a molybdenum disulfide, tungsten disulfide, molybdenum diselenide or tungsten diselenide and other two-dimensional material films. The size of the film to be transferred is smaller than that of the spacing cavity 220, so that the film to be transferred can be spacing in the spacing cavity 220. For example, the area of the film to be transferred may be 64 square centimeters and the area of the lower end opening of the spacing cavity 220 may be 67.24 square centimeters. Materials of the substrate include, but are not limited to, nickel, copper, silicon oxide, quartz, glass, plastic, silicon, PET, and the like; for example, the substrate may be made of copper.

S3000: after the substrate is completely corroded, the transfer tool 400 is fixed on each support column 312 of the supporting plate 310, and the bracket is slid to the first position, so that the supporting plate 310 slides to the lower side of the limiting cavity 220, and the transfer tool 400 covers the lower end opening of the limiting cavity 220.

During the sliding of the carriage to the first position, it can be made to slide slowly to reduce the disturbance of the liquid fluctuation to the film to be transferred.

S4000: the etching solution in the accommodating groove 110 is emptied, so that the film to be transferred is gradually adsorbed on the surface of the transferring tool 400 along with the descending of the liquid level.

Since the material of the film to be transferred has hydrophobicity, the film to be transferred floats on the liquid surface. When the corrosive liquid is gradually discharged out of the accommodating groove 110, the liquid level gradually descends, so that the film to be transferred descends together, and when the liquid level descends to the transferring tool 400, the film to be transferred is adsorbed on the transferring tool 400 and then remains still; for example, when the transferring tool 400 is obliquely arranged, the film to be transferred which gradually descends is firstly contacted with the higher side of the transferring tool 400 until the liquid level descends below the transferring tool 400, and the film to be transferred is completely attached to the transferring tool 400; after the etching solution is emptied, the etching solution remains between the film to be transferred and the transfer tool 400.

S5000: repeating the cleaning operations a plurality of times, wherein each cleaning operation comprises: injecting a cleaning solution into the accommodating groove 110, wherein the liquid level of the cleaning solution exceeds the lower end opening of the limiting cavity 220, so that the film to be transferred floats on the liquid level of the cleaning solution; after the preset time, the cleaning solution in the accommodating groove 110 is emptied, so that the film to be transferred is adsorbed on the surface of the transfer tool 400.

To remove the residual etching solution between the film to be transferred and the transfer tool 400, a number of cleaning operations are performed, and in some embodiments, the number of cleaning operations is at least 3. For example, it may be 5 times.

In each cleaning operation, after the cleaning liquid is injected into the accommodating groove 110, the liquid level gradually rises and exceeds the transferring tool 400, so that the film to be transferred leaves the transferring tool 400 and floats on the liquid level of the cleaning liquid again; for example, when the transferring tool 400 is obliquely arranged, the lower side of the film to be transferred floats on the liquid surface, and then the other parts are gradually separated from the transferring tool 400 until the liquid surface completely exceeds the transferring tool 400, so that the film to be transferred floats on the liquid surface completely; thus, the residual corrosive liquid is diffused in the cleaning liquid to clean the corrosive liquid; after the preset time, the cleaning solution is emptied, and the film to be transferred is re-adsorbed on the transferring tool 400.

S6000: injecting a cleaning solution into the accommodating groove 110, so that the liquid level of the cleaning solution exceeds the lower end opening of the limiting cavity 220, and the film to be transferred floats on the liquid level of the cleaning solution; the carriage is then slid to the second position to move the blade 310 away from the housing 210.

The carriage may be slid slowly during sliding away from the housing 210 to reduce interference of the liquid wave with the film to be transferred.

S7000: the target substrate is secured to the plurality of support posts 312 of the pallet 310 and then the carrier is slid to a first position such that the pallet 310 slides under the spacing cavity 220 and the target substrate covers the lower end opening of the spacing cavity 220.

The size of the target substrate is larger than the size of the thin film to be transferred. The carriage, when slid, can be slid slowly to reduce interference of liquid fluctuation with the film to be transferred.

S8000: and evacuating the cleaning solution in the accommodating groove 110 so that the film to be transferred is attached to the surface of the target substrate along with the descending of the liquid level, and the transfer of the film to be transferred is completed.

Since the film to be transferred is always held in the holding chamber 220 during transfer, its position remains almost unchanged.

The film transfer method provided by the embodiment of the invention can simply and conveniently realize large-size transfer of the film to be transferred by adopting the film transfer device provided by the embodiment of the invention, and has high transfer efficiency, thereby realizing batch preparation of devices.

Unless specified or indicated otherwise, the terms "connected," "fixed," and the like are to be construed broadly and are, for example, capable of being fixedly connected, detachably connected, or integrally connected, electrically connected, or signally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the terms in the present disclosure may be understood by those skilled in the art according to the specific circumstances.

Further, in the description of the present disclosure, it should be understood that the terms "upper," "lower," "inner," "outer," and the like in the example embodiments of the present disclosure are merely for convenience, such as described in terms of the angles shown in the drawings, and should not be construed as limiting the example embodiments of the present disclosure. It will also be understood that in the context of an element or feature being connected to another element(s) "upper," "lower," or "inner," "outer," it can be directly connected to the other element(s) "upper," "lower," or "inner," "outer," or indirectly connected to the other element(s) "upper," "lower," or "inner," "outer" via intervening elements.

The terms "a," "an," "the," and "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first" and "second" and the like are used merely as labels, and are not intended to limit the number of their objects.

The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and various modifications can be made to the above-described embodiment of the present invention. All simple, equivalent changes and modifications made in accordance with the claims and the specification of this application fall within the scope of the patent claims. The present invention is not described in detail in the conventional art.

Claims (9)

1. The film transferring device is characterized by comprising a container, a limiting cover, a bracket and a transferring tool, wherein the limiting cover is fixed on the container and defines a limiting cavity with two open ends; the bracket comprises a supporting plate, a plurality of through holes penetrating through the supporting plate and a plurality of supporting columns are arranged on the supporting plate, and a transferring tool for adsorbing the film is detachably fixed on the supporting columns.

2. The film transfer apparatus of claim 1, wherein the container has a receiving slot, the pallet being positioned within the receiving slot.

3. The film transfer apparatus of claim 2, wherein the container is provided with a liquid inlet and outlet device, and the liquid inlet and outlet device is communicated with the accommodating groove.

4. The film transfer apparatus of claim 1, wherein a stopper bracket is fixed to the container, and wherein the stopper is fixed to the stopper bracket.

5. The film transfer apparatus of claim 1, wherein the carriage further comprises a blocking plate, a buffer space is formed between the blocking plate and the pallet, and a plurality of support columns are located in the buffer space.

6. The film transfer apparatus of claim 1, wherein each support post is provided with a slot for securing the transfer tool.

7. The film transfer apparatus of claim 6, wherein the clamping slot is at a predetermined angle to the horizontal such that the transfer tool is at a predetermined angle to the horizontal after being secured to the plurality of support posts.

8. The film transfer apparatus of claim 1, wherein the carriage further comprises a slide arm slidably coupled to both sides of the container, respectively, and a handle having both ends coupled to the slide arm, respectively.

9. A film transfer method comprising:

providing a thin film transfer apparatus according to any one of claims 1 to 8, and injecting a corrosive liquid into a container of the thin film transfer apparatus;

floating the film to be transferred with the substrate in the etching solution in the limiting cavity to enable the etching solution to corrode the substrate;

After the substrate is completely corroded, fixing a transfer tool on each support column of a supporting plate, and sliding a bracket to a first position so that the transfer tool is positioned below a film to be transferred;

The corrosive liquid in the accommodating groove is emptied, so that the film to be transferred is gradually adsorbed on the surface of the transferring tool along with the descending of the liquid level;

Repeating the cleaning operations a plurality of times, wherein each cleaning operation comprises: injecting a cleaning solution into the accommodating groove so that the film to be transferred floats on the liquid level of the cleaning solution; after the preset time, evacuating the cleaning liquid in the accommodating groove so as to enable the film to be transferred to be adsorbed on the surface of the transfer tool;

Injecting a cleaning solution into the accommodating groove so that the film to be transferred floats on the liquid level of the cleaning solution; then sliding the bracket to a second position to enable the supporting plate to be far away from the cover body;

Fixing the target substrate on each support column of the supporting plate, and then sliding the bracket to a first position;

and evacuating the cleaning solution in the accommodating groove so that the film to be transferred is attached to the surface of the target substrate along with the descending of the liquid level, and the transfer of the film to be transferred is completed.