CN117882027A

CN117882027A - Foldable electronic device

Info

Publication number: CN117882027A
Application number: CN202280056071.6A
Authority: CN
Inventors: 玄京勳; 朴旲炯; 沈熙辅; 李旻星
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2021-08-09
Filing date: 2022-08-09
Publication date: 2024-04-12

Abstract

An electronic device according to an exemplary embodiment of the present document includes: a foldable housing, a flexible display, a first support structure, a second support structure, a first hinge assembly, a second hinge assembly, and a first panel assembly. The foldable housing may include a first housing, a second housing, and a folded portion between the first housing and the second housing, and the flexible display may be located in an inner space of the foldable housing and visible through a front of the foldable housing. The first support structure may be located in an interior space of the first housing and support a first portion of the flexible display, and the second support structure may be located in an interior space of the second housing and support a second portion of the flexible display. The first hinge assembly and the second hinge assembly may be located in an inner space of the foldable housing so as to correspond to the folded portion, connect the first support structure to the second support structure, and be spaced apart from each other in a direction of a folding axis of the foldable portion. The first panel assembly may be located in the inner space of the foldable housing so as to correspond to the folded portion, be coupled to the first support structure, support a third portion of the flexible display corresponding to the folded portion, and include a first panel, a second panel, a third panel, and a fourth panel.

Description

Foldable electronic device

Technical Field

Various embodiments of this document relate to a foldable electronic device.

Background

When the foldable electronic device is switched from the unfolded state to the folded state, an area of the flexible display corresponding to the folded portion of the foldable electronic device may be transitioned from the unfolded state and set to the bent state.

Disclosure of Invention

Technical problem

When a foldable electronic device having a foldable display is placed in an unfolded state, a structure for supporting a bendable display area of the foldable display may be required such that a bendable area (e.g., a bendable display area) corresponding to a folded portion of the foldable electronic device in the foldable display is substantially maintained in the unfolded state to enhance the bendable display area against an external load (or an external pressure).

Various embodiments of the present document may provide a foldable electronic device including a structure for supporting a bendable display area corresponding to a folded portion of the foldable electronic device when the foldable electronic device is placed in an unfolded state.

The technical problems to be solved in this document are not limited to the above-described technical problems, and other technical problems not mentioned will be understood by those of ordinary skill in the art to which the present disclosure pertains from the following description.

Technical proposal

According to an example embodiment of this document, an electronic device may include: a foldable housing, a flexible display, a first support structure, a second support structure, a first hinge assembly, a second hinge assembly, and a first panel assembly. The foldable housing may include a first housing, a second housing, and a folded portion between the first housing and the second housing. The flexible display may be located in an interior space of the collapsible housing and visible through a front surface of the collapsible housing. The first support structure may be located in an interior space of the first housing and configured to support a first portion of the flexible display. The second support structure may be located in an interior space of the second housing and configured to support a second portion of the flexible display. The first hinge assembly and the second hinge assembly may be positioned in the interior space of the foldable housing above the foldable portion, configured to connect the first support structure and the second support structure, and spaced apart from each other in a direction of a folding axis of the foldable portion. The first plate assembly may be positioned in the interior space of the foldable housing above the folded portion, coupled to the first support structure, and configured to support a third portion of the flexible display corresponding to the folded portion. The first plate assembly may include a first plate, a second plate, a third plate, and a fourth plate. The first plate may include a first surface facing the first support structure and a second surface facing in a direction opposite to the direction of the first surface. The first plate may be located between the first hinge assembly and the second hinge assembly. The second plate may include a third surface facing the second surface and a fourth surface facing a direction opposite to the direction of the third surface. The third plate may include a fifth surface and a sixth surface facing in a direction opposite to the direction of the fifth surface. The fifth surface may face the first surface and the first hinge assembly. The fourth plate may include a seventh surface and an eighth surface facing in a direction opposite to the direction of the seventh surface. The seventh surface may face the first surface and the second hinge assembly. The second plate may be configured to be located between the third plate and the fourth plate when viewed from above the fourth surface.

Advantageous effects

The foldable electronic device according to the various embodiments of the present document includes a board assembly capable of stably supporting a flexible display region of a flexible display corresponding to a folded portion of the foldable electronic device when the foldable electronic device is in an unfolded state, thereby ensuring reliability of the foldable electronic device. The board assembly has a form in which a plurality of metal boards are combined, and can contribute to improvement in device yield and reliability by reduction of defects as compared with a whole metal board.

Furthermore, the effects obtainable or predicted by the various embodiments of this document may be directly or implicitly disclosed in the detailed description of the embodiments of this document.

Drawings

Fig. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment.

Fig. 2 is a diagram illustrating an electronic device in an unfolded state according to an embodiment.

Fig. 3 is a diagram illustrating an electronic device in a folded state according to an embodiment.

Fig. 4 is a partially exploded perspective view illustrating an electronic device in an unfolded state according to an embodiment.

Fig. 5 is a diagram illustrating a first assembly in a unfolded state in which a first front case, a second front case, a first hinge assembly, a second hinge assembly, and a hinge housing are combined, according to an embodiment.

Fig. 6 is an enlarged view showing a portion indicated by reference numeral "501" in fig. 5.

Fig. 7 is a diagram illustrating a first hinge assembly included in an electronic device in a unfolded state according to an embodiment.

Fig. 8 is a diagram illustrating a second assembly in an unfolded state in which a first plate, a second plate, a fifth plate, a sixth plate, a first electrical path, and a second electrical path are coupled to the first assembly of fig. 5, according to an embodiment.

Fig. 9 is a diagram illustrating a first plate and a fifth plate according to an embodiment.

Fig. 10 is a diagram illustrating a second plate and a sixth plate according to an embodiment.

Fig. 11 is a diagram showing a state where the first plate and the second plate are combined and a state where the fifth plate and the sixth plate are combined according to the embodiment.

Fig. 12 is a diagram illustrating a third assembly in an unfolded state in which a third plate, a fourth plate, a seventh plate, and an eighth plate are coupled to the second assembly of fig. 8, according to an embodiment.

Fig. 13 is an enlarged view showing a portion indicated by reference numeral "1201" in fig. 12.

Fig. 14 is a cross-sectional view illustrating a portion of the third assembly taken along line B-B' in fig. 13, according to an embodiment.

Fig. 15 is a cross-sectional view illustrating a portion of the third assembly taken along line C-C' in fig. 12, according to an embodiment.

Fig. 16 is a cross-sectional view taken along line D-D' in fig. 12, according to an embodiment.

Fig. 17 is a cross-sectional view taken along line E-E' in fig. 12, according to an embodiment.

Fig. 18 is a cross-sectional view illustrating the third plate, the first portion of the first hinge assembly, the first support structure, and the third screw of fig. 12, in accordance with an embodiment.

Fig. 19 is a cross-sectional view illustrating the third plate, the first support structure, and the thirteenth screw of fig. 12, according to an embodiment.

Fig. 20 is an enlarged view showing a portion indicated by reference numeral "1301" in fig. 13.

Fig. 21 is a perspective view showing the first plate and the third plate with respect to fig. 20.

Fig. 22 is a cross-sectional view illustrating the first plate and the third plate with respect to fig. 20 according to an embodiment.

Fig. 23 is a diagram showing another bonding structure between a first plate and a third plate according to another embodiment.

Fig. 24 is a cross-sectional view illustrating the electronic device in an unfolded state, taken along line G-G' in fig. 2, according to an embodiment.

Fig. 25 is a cross-sectional view illustrating the electronic device of fig. 24 in a folded state according to an embodiment.

Fig. 26 is a cross-sectional view illustrating a first plate assembly according to an embodiment.

Fig. 27 is an enlarged view showing a portion indicated by reference numeral "2401" in fig. 24 according to the embodiment.

Detailed Description

Hereinafter, various embodiments disclosed herein will be described with reference to the accompanying drawings.

Fig. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of an external electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). The electronic device 101 may communicate with the external electronic device 104 via a server 108. The electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM) 196, and/or an antenna module 197. In some embodiments of the present disclosure, at least one of the above-described components (e.g., connection end 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments of the present disclosure, some components may be implemented as a single integrated circuit. For example, the sensor module 176, the camera module 180, or the antenna module 197 may be implemented as embedded in a single component (e.g., the display module 160).

The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 that is connected to the processor 120, and may perform various data processing or calculations. As at least part of the data processing or calculation, the processor 120 may store commands or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) or an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or in combination with main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or be adapted to be dedicated to a particular function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 (instead of the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). The auxiliary processor 123, e.g., an Image Signal Processor (ISP) or a Communication Processor (CP), may be implemented as part of another component, e.g., the camera module 180 or the communication module 190, functionally related to the auxiliary processor 123. According to embodiments of the present disclosure, the auxiliary processor 123 (e.g., a neural network processing device) may include a hardware structure that is designated to process the artificial intelligence model. The artificial intelligence model may be created through machine learning. For example, learning may be performed by the electronic device 101 where the artificial intelligence model is performed, or may be performed by a separate server (e.g., server 108). The learning algorithm may include, for example, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers, which may be any of Deep Neural Network (DNN), convolutional Neural Network (CNN), recurrent Neural Network (RNN), limited Boltzmann machine (RBM), deep Belief Network (DBN), bi-directional recurrent DNN (BRDNN), deep Q network, or a combination of two or more of the above, but is not limited to the above examples. In addition to hardware structures, the artificial intelligence model may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. Memory 130 may include volatile memory 132 and/or nonvolatile memory 134.

Program 140 may be stored as software in memory 130, and program 140 may include, for example, an Operating System (OS) 142, middleware 144, and/or applications 146.

The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons) or a digital pen (e.g., a stylus).

The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing recordings, and the receiver may be used for incoming calls. The receiver may be implemented separately from the speaker or as part of the speaker.

Display module 160 may visually provide information to the outside (e.g., user) of electronic device 101. The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. The display module 160 may include touch circuitry (e.g., a touch sensor) adapted to detect touches, or sensor circuitry (e.g., a pressure sensor) adapted to measure the force generated by touches.

The audio module 170 may convert sound into electrical signals and vice versa. The audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., the external electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. The sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

Interface 177 may support one or more specific protocols that will be used to connect electronic device 101 with an external electronic device (e.g., external electronic device 102) directly (e.g., wired) or wirelessly. The interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and/or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the external electronic device 102). The connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthetic sense. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electro-stimulator.

The camera module 180 may capture still images or moving images. The camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power provided to the electronic device 101 or consumed by the electronic device 101. The power management module 188 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

Battery 189 may power at least one component of electronic device 101. Battery 189 may include, for example, a primary non-rechargeable battery, a rechargeable battery, and/or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the external electronic device 102, the external electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) or wireless communication. The communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a conventional cellular network, a 5G network, a next-generation communication network, the internet, or a computer network (e.g., a LAN or wide-area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

The wireless communication module 192 may support a 5G network following a 4G network as well as next generation communication technologies (e.g., new Radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), large-scale machine type communication (mctc), or Ultra Reliable Low Latency Communication (URLLC). The wireless communication module 192 may support a high frequency band (e.g., millimeter wave band) to achieve, for example, a high data transmission rate. The wireless communication module 192 may support various techniques for ensuring performance over high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 of the present disclosure may support various requirements specified in the electronic device 101, an external electronic device (e.g., the external electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or greater) for implementing an eMBB, a lost coverage (e.g., 164dB or less) for implementing an emtc, or a U-plane delay (e.g., a round trip of 0.5ms or less, or 1ms or less for each of the Downlink (DL) and Uplink (UL)) for implementing a URLLC.

The antenna module 197 may transmit signals or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 101 (e.g., an external electronic device). The antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate, such as a Printed Circuit Board (PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas, for example, by the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. Further components (e.g., radio Frequency Integrated Circuits (RFICs)) other than radiating elements may additionally be formed as part of the antenna module 197.

According to various embodiments of the present disclosure, antenna module 197 may form a millimeter wave antenna module. According to embodiments of the present disclosure, a millimeter-wave antenna module may include a printed circuit board, a Radio Frequency Integrated Circuit (RFIC) disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., a millimeter-wave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

At least some of the above components may be interconnected via an inter-peripheral communication scheme (e.g., bus, general Purpose Input Output (GPIO), serial Peripheral Interface (SPI), or Mobile Industrial Processor Interface (MIPI)) and communicatively communicate signals (e.g., commands or data) therebetween.

Commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. All or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the function or service or perform another function or another service related to the request and transmit the result of the performing to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. For this purpose, for example, cloud computing technology, distributed computing technology, mobile Edge Computing (MEC) technology, or client-server computing technology may be used. The electronic device 101 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment of the present disclosure, the external electronic device 104 may comprise an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment of the present disclosure, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to smart services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

The electronic device according to the embodiments of the present disclosure may be one of various types of electronic devices. The electronic device may include a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. However, the electronic device is not limited to any of the above.

The various embodiments of the disclosure and the terminology used herein are not intended to limit the technical features described herein to the particular embodiments, and include various modifications, equivalents, or alternatives for the corresponding embodiments. For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to a term may include one or more things unless the context clearly indicates otherwise. As used herein, each of the phrases such as "a or B", "at least one of a and B", "at least one of a or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any or all possible combinations of items listed with a corresponding one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to simply distinguish one element from another element and not to limit the element in other respects (e.g., importance or order). It will be understood that if the terms "operatively" or "communicatively" are used or the terms "operatively" or "communicatively" are not used, then if an element (e.g., a first element) is referred to as being "coupled to," "connected to," or "connected to" another element (e.g., a second element), it is intended that the element can be directly (e.g., wired) connected to, wireless connected to, or connected to the other element via a third element.

The term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment of the present disclosure, a module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

The various embodiments set forth herein may be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, under control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one instruction of the one or more instructions stored in the storage medium with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the at least one instruction invoked. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein the term "non-transitory" merely means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

Methods according to embodiments of the present disclosure may be included and provided in computer program products. The computer program product may be used as a product for conducting transactions between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disk read only memory (CD-ROM), or may be distributed via an application store, such as a play store ^TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or may be published (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). At least some of the computer program product may be temporarily generated if published online, or at least some of the computer program product may be stored at least temporarily in a machine readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a forwarding server.

Each of the above-described components (e.g., modules or programs) may include a single entity or multiple entities. One or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. Operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

Fig. 2 is a diagram illustrating the electronic device 2 in a flat or unfolded state according to embodiments. Fig. 3 is a diagram showing the electronic device 2 in a folded state or a folded state according to an embodiment.

Referring to fig. 2 and 3, in an embodiment, the electronic device 2 may include a foldable housing 20 and a flexible display 30. The foldable housing 20 may include a front surface 20A of the electronic device 2 and a rear surface 20B of the electronic device 2 positioned opposite the front surface 20A. For better understanding, the front surface 20A of the electronic device 2 is a surface of the flexible display 30 exposed to the outside, and the rear surface 20B of the electronic device 2 is interpreted as a surface located on the opposite side from the front surface 20A. The foldable housing 20 may include a first side surface 20C and a second side surface 20D of the electronic device 2, the first side surface 20C and the second side surface 20D at least partially surrounding a space between the front surface 20A and the rear surface 20B. The front surface 20A may include a first coverage areaSecond coverage area->And +/in the first coverage area>And a second coverage area->Fold coverage betweenRegion F. In the unfolded state of the foldable housing 20, the front surface 20A may be a substantially flat surface and the first coverage area +. >Second coverage area->And the folded coverage area F may face in substantially the same direction. Rear surface 20B may include a third coverage area +.>And fourth coverage area->Third coverage area->Can be positioned to be +_ with the first coverage area of the front surface 20A>Opposite, and facing the first coverage area +.>Opposite to the direction of the (c). Fourth coverage area->Second coverage area positionable to front surface 20A +.>Opposite, and facing the second coverage area +.>Opposite to the direction of the (c). In an embodiment, the foldable housing 20 may be implemented as an inner folded structure with the front surface 20A folded inwardly. For example, in the unfolded state of the foldable housing 20 (see fig. 2), the cover is foldedThe cover area F can be provided in planar form and the first cover area +.>And a second coverage area->An angle of about 180 degrees may be formed. In the folded state of the foldable housing 20 (see fig. 3), the folded coverage area F may be provided in a curved form and the first coverage area +.>And a second coverage area->An angle other than about 180 degrees may be formed. The folded state may include a fully folded state or an intermediate state. The fully folded state (see fig. 3) is the first coverage area of front surface 20A +.>And a second coverage area- >In a fully folded state no longer in close proximity, e.g. first coverage area +>And a second coverage area->An angle of about 0 degrees to about 10 degrees may be formed. In the fully folded state, the front surface 20A may be substantially not exposed to the outside. The intermediate state may refer to a state between an unfolded state and a fully folded state. The folded coverage area F of the front surface 20A may be more curved in the fully folded state than in the intermediate state. In some embodiments, the electronic device 2 may be implemented as an out-folded structure in which the front surface 20A (or screen) is folded out.

Depending on the implementationFor example, the collapsible housing 20 may include a front cover (e.g., window) 201 that provides at least a portion of the front surface 20A. The flexible display 30 may be at least partially overlapped with the front cover 201 to be positioned in the inner space of the electronic device 2. The front cover 201 may protect the flexible display 30 from the outside and is substantially transparent. Light output from the flexible display 30 may pass through the front cover 201 and travel to the outside. The flexible display 30 may include, for example, a first coverage area with the front surface 20AA first display area (or first effective area) stacked, a second coverage area with front surface 20A ∈>A second display area (or second effective area) stacked and a third display area (or third effective area) stacked with the folded coverage area F. In some embodiments, the third display area may be referred to as various other terms, such as "folded display area" or "bendable display area". The screen may refer to an area where an image may be presented in the device including the flexible display 30 and the front cover 201, and includes, for example, a display area of the flexible display 30 and an area of the front cover 201 overlapped therewith. In some embodiments, the front cover 201 may be integrally formed with the flexible display 30 as a component included in the flexible display 30. The front cover 201 may be implemented in a thin film form such as a film to have flexibility. The front cover 201 may include, for example, a plastic film (e.g., polyimide film) or a thin film glass (e.g., ultra Thin Glass (UTG)). In some embodiments, the bezel 201 may include multiple layers. For example, the front cover 201 may be in the form of a coating or protective layer of various polymer materials, such as Polyester (PET), polyimide (PI), or Thermoplastic Polyurethane (TPU), disposed in a plastic film or film glass.

According to an embodiment, the foldable housing 20 may include a first housing (or first housing portion or first housing structure) 21, a second housing (or second housing portion or second housing structure) 22, and a folded portion between the first housing 21 and the second housing 22. Coordinates shown for better understandingThe axis being based on the first housing 21, e.g. first coverage areaCan be oriented substantially in the +z-axis direction, third coverage area +.>May face substantially in the-z axis direction. The first housing 21 and the second housing 22 are connectable to the folded portion and are rotatable with respect to each other based on a folding axis a of the foldable housing 20. The folded portion may include, for example, a hinge assembly (or hinge structure) (not shown). The folding axis a may be the axis of rotation of the hinge assembly. In the example shown, the fold axis a may be parallel to the y-axis direction. The first housing 21 may comprise a first cover portion of the front cover 201 positioned on one side based on the folding axis a, a third cover area +_ providing the rear surface 20B>And a first side member (or first side frame structure) 212 at least partially surrounding a space between the first cover portion and the first rear cover 211 and providing the first side surface 20C. The first cover part of the front cover 201 may provide for example a first coverage area +. >And a first folded covering region F1 positioned on one side based on the folding axis a of the folded covering region F. The second housing 22 may include a second rear surface providing at least a portion of the second cover portion of the front cover 201 positioned on one side based on the folding axis a, a fourth coverage area providing the rear surface 20B>And a second side member (or side frame structure) 222 at least partially surrounding a space between the second cover portion and the second back cover 221 and providing the second side surface 20D. The second cover part of the front cover 201 may provide for example a second coverage area +.>And a second folded covering region F2 positioned on the other side based on the folding axis a of the folded covering region F. In the fully folded state of the collapsible housing 20, the first side member 212 and the second side member 222 may be at least partially aligned over one another. The first side member 212 and/or the second side member 222 can be provided, for example, from ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials. The first side member 212 and/or the second side member 222 can include various metallic materials such as, for example, titanium, amorphous alloys, metal-ceramic composites (e.g., cermets), stainless steel, magnesium alloys, aluminum alloys, zinc alloys, or copper alloys. The first rear cover 211 and/or the second rear cover 221 may be substantially transparent. The first rear cover 211 and/or the second rear cover 221 may be provided by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials. The first rear cover 211 or the second rear cover 221 may include, for example, a plate of various materials such as transparent glass, ceramic, or polymer, and at least one coating layer disposed on the plate. For another example, the first or second back cover 211 or 221 may include a plate of various materials such as transparent glass, ceramic, or polymer and a film (e.g., a decorative film) having various visual effects attached to the plate. In some embodiments, the first rear cover 211 and the first side member 212 may be integrally formed and include the same material. In some embodiments, the second back cover 221 and the second side member 222 may be integrally formed and include the same material.

According to an embodiment, the folded portion may comprise a hinge housing 23. The hinge housing 23 may cover at least one hinge connecting the first housing 21 and the second housing 22. In some embodiments, the hinge housing 23 may be referred to as a "hinge cover". When the electronic device 2 is switched from the unfolded state of fig. 2 to the folded state of fig. 3, the hinge housing 23 may cover the inside of the electronic device 2 from exposure with the gap B between the first housing 21 and the second housing 22 opened. As shown in fig. 2, in the unfolded state of the electronic device 2, the gap B may be substantially absent, and since the hinge housing 23 is covered by the first housing 21 and the second housing 22, it may not be exposed to the outside. Although not shown, in an intermediate state of the electronic device 2, the hinge housing 23 may be partially exposed between the first housing 21 and the second housing 22. The hinge housing 23 may be much exposed in the folded state of fig. 3 than in the intermediate state.

According to some embodiments, the collapsible housing 20 may refer to a structure (e.g., a collapsible housing structure or a collapsible housing assembly) that provides at least a portion of the front surface 20A, the rear surface 20B, the first side surface 20C, and the second side surface 20D. For example, the collapsible housing 20 may include a first housing portion, a second housing portion, and a folded portion connected to the first housing portion and the second housing portion. The folded portion may refer to a portion that is more flexible than the first and second housing portions and that is curved in the folded state of the electronic device 2. The folded portion may comprise, for example, a hinge assembly. For another example, the folded portion may include a structure (e.g., a multi-bar structure) in which a plurality of bars are arranged, but is not limited thereto, and may be implemented as various other structures that may have bending characteristics while connecting the first and second case portions.

According to an embodiment, the electronic device 2 may include a display (hereinafter, sub-display) 310 located inside the first housing 21 adjacent to the first rear cover 211. A partial region of the first rear cover 211 may overlap the sub display 310 and be substantially transparent. The electronic device 2 may use the sub-display 310 in the folded state of fig. 3 instead of the flexible display 30 to output an image.

According to an embodiment, the second back cover 221 may comprise a fourth coverage areaTowards the second coverage area->A second bending region 221a bent to extend seamlessly. The second curved region 221a may be disposed adjacent to a long edge of the second back cover 221 substantially parallel to the folding axis a. Sub-displayThe display 310 may include a flexible display that may be provided in a corresponding fashion.

According to an embodiment, the first rear cover 211 may comprise a third coverage areaTowards the first coverage area->A first bending region 211a which is bent to extend seamlessly. The first curved region 211a may be disposed adjacent to a long edge of the first back cover 211 that is substantially parallel to the folding axis a. For example, in the unfolded state (see fig. 2) or the folded state (see fig. 3) of the electronic device 2, the first curved region 211a and the second curved region 221a may be positioned substantially symmetrically on opposite sides of each other for aesthetic purposes. In some embodiments, the first curved region 211a or the second curved region 221a may be omitted.

According to an embodiment, the electronic device 2 may comprise an input module, a sound output module, a camera module, a sensor module or a connection terminal. In some embodiments, electronic device 2 may omit at least one of the components or additionally include other components. The locations or the number of components included in the electronic device 2 are not limited to the illustrated example, and may vary.

The input module may include, for example, a microphone located inside the electronic device 2, and a microphone aperture 301 provided in the first side surface 20C to correspond to the microphone. The location or number of input modules including microphones and corresponding microphone holes 301 is not limited to the example shown and may vary. In some embodiments, the electronic device 2 may include multiple microphones capable of detecting the direction of sound.

The input module may include, for example, a key input device 302. The key input device 302 may be located, for example, in an opening (not shown) provided at the first side surface 20C. In some embodiments, the electronic device 2 may not include some or all of the key input devices 302, and the non-included key input devices may be implemented as soft keys using the flexible display 30 or the sub-display 310. In some embodiments, the input module may include at least one sensor module.

The sound output module may include, for example, a speaker located inside the electronic device 2, and a speaker hole 303 provided in the second side surface 20D to correspond to the speaker. The positions or the number of sound output modules including the speakers and the speaker holes 303 corresponding thereto are not limited to the illustrated examples, and may vary. In some embodiments, the microphone aperture 301 and the speaker aperture 303 may be implemented as one aperture. In some embodiments, a piezoelectric speaker may be implemented that omits speaker hole 303. The sound output module may comprise, for example, a receiver for a call located inside the electronic device 2, and arranged in a fourth coverage areaTo a receiver hole (not shown) corresponding to the receiver for the call.

The camera module may include, for example, a location that is positioned with the fourth coverage areaThe corresponding first camera module (or front camera module) 305 is either positioned to be +_ with the third coverage area>A corresponding plurality of second camera modules (or rear camera modules) 306. The first camera module 305 and/or the plurality of second camera modules 306 may include one or more lenses, image sensors, and/or image signal processors. The location or number of first camera module 305 or plurality of second camera modules 306 is not limited to the example shown and may vary.

According to an embodiment, the sub-display 310 may include an opening aligned with the first camera module 305. External light may pass through the second back cover 221 and the opening of the sub display 310 to reach the first camera module 305. In some embodiments, the opening of the sub-display 310 may be provided in a notch form according to the position of the first camera module 305. In some embodiments, the first camera module 305 may be located at a rear surface of the sub-display 310, or below or beneath the sub-display 310, and perform related functions (e.g., capture images) without visually distinguishing (or exposing) its location. For example, the first camera module 305 may include a hidden display rear camera (e.g., a display under camera (UDC)). In some embodiments, the first camera module 305 may be positioned to align with a recess provided at a rear surface of the sub-display 310. The first camera module 305 may be disposed to overlap at least a portion of the screen and acquire an image of an external object without being visually exposed to the outside. In this case, a partial region of the sub-display 310 at least partially overlapping the first camera module 305 may include a pixel structure and/or a wiring structure different from those of other regions. For example, a partial region of the sub-display 310 at least partially overlapping the first camera module 305 may have a different pixel density than other regions. The pixel structure and/or the wiring structure disposed in a portion region of the sub-display 310 at least partially overlapping the first camera module 305 may reduce light loss between the outside and the first camera module 305. In some embodiments, no pixels may be disposed in a portion of the sub-display 310 that at least partially overlaps the first camera module 305.

According to an embodiment, the plurality of second camera modules 306 may have different properties (e.g., viewing angle) or functions and include, for example, a dual camera or a three-phase camera. The plurality of second camera modules 306 may include a plurality of camera modules including lenses having different perspectives, and the electronic device 2 may be controlled to change the perspective performed by the camera modules themselves based on a user's selection. The plurality of second camera modules 306 may include at least one of a wide angle camera, a telephoto camera, a color camera, a monochrome camera, or an Infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). In some embodiments, the IR camera may operate as at least a portion of the sensor module. The electronic device 2 may comprise a flash 307 as a light source for the plurality of second camera modules 306. The flash 307 may include, for example, a light emitting diode or a xenon lamp.

The sensor module may generate electrical signals or data values corresponding to the internal operating state of the electronic device 2 or the external environmental state. The sensor module may include, for example, at least one of a proximity sensor, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor (e.g., a fingerprint sensor, a Heart Rate Monitoring (HRM) sensor), a temperature sensor, a humidity sensor, or an illuminance sensor.

According to an embodiment, the sensor module may comprise a fourth coverage area located inside the electronic device 2A corresponding optical sensor 308. The optical sensor 308 may include, for example, a proximity sensor or an illuminance sensor. The optical sensor 308 may be aligned with an opening provided in the sub-display 310. External light may pass through the second back cover 221 and the opening of the sub display 310 to reach the optical sensor 308. In some embodiments, the optical sensor 308 may be located at the rear surface of the sub-display 310 or below or beneath the sub-display 310 and perform related functions without visually distinguishing (or exposing) the location of the optical sensor 308. In some embodiments, the optical sensor 308 may be positioned to align with a recess provided at the rear surface of the sub-display 310. The optical sensor 308 may be disposed to overlap at least a portion of the screen, and perform a sensing function without being exposed to the outside. In this case, a partial region of the sub-display 310 at least partially overlapping the optical sensor 308 may include a pixel structure and/or a wiring structure different from those of other regions. For example, a partial region of the sub-display 310 at least partially overlapping the optical sensor 308 may have a different pixel density than other regions. In some embodiments, the sensor module may include a fingerprint sensor (not shown) located below the sub-display 310. The fingerprint sensor may be implemented using capacitive, optical or ultrasonic methods. When various types of signals (e.g., light or ultrasound) associated with the sensor module pass between the outside and the sensor module, pixel structures and/or wiring structures disposed in a partial region of the sub-display 310 at least partially overlapping the sensor module may be reduced Loss. In some embodiments, a plurality of pixels may not be disposed in a partial region of the sub-display 310 at least partially overlapping the sensor module.

The connection end may comprise, for example, a connector (e.g., a USB connector) located inside the electronic device 2. The electronic device 2 may include a connector hole 309 provided in the first side surface 20C to correspond to the connector. The electronic device 2 may transmit power and/or data to and/or receive power and/or data from an external electronic device electrically connected to the connector through the connector hole 309. The location or number of connectors and corresponding connector holes 309 is not limited to the example shown and may vary.

According to some embodiments, the electronic device 2 may include a detachable pen input device (e.g., an electronic pen, a digital pen, or a stylus) (not shown). For example, the pen input device may be detached from the hinge housing 23 or attached to the hinge housing 23. The hinge housing 23 may include a recess, and a pen input device may be inserted into the recess. The pen input device may be detached from or attached to the externally exposed recess of the hinge housing 23, for example, in a folded state (see fig. 3) or an intermediate state of the electronic device 2. In some embodiments, the electronic device 2 may be implemented such that a pen input device may be inserted into the inner space of the first housing 21 or the second housing 22.

The electronic device 2 may further include various components according to its arrangement. Although all of these components cannot be described due to various variations depending on the fusion trend of the electronic device 2, components equivalent to the above components may be further included in the electronic device 2. In various embodiments, certain components may be excluded from the above components or replaced with other components according to their arrangement.

Fig. 4 is a partially exploded perspective view of the electronic device 2 in an unfolded state according to an embodiment.

Referring to fig. 4, the electronic device 2 may include a first front case 41, a second front case 42, a first hinge assembly 51, a second hinge assembly 52, a hinge housing 23, a first board assembly 6A, a second board assembly 6B, a rail assembly 7, a first electrical path 81, and/or a second electrical path 82.

According to an embodiment, the first front housing 41 may include a first side member 212 and a first support structure 411. The first support structure 411 may be located in an inner space of the first case 21 (see fig. 2) and connected to the first side member 212 or integrally formed with the first side member 212. The second front housing 42 may include a second side member 222 and a second support structure 421. The second support structure 421 may be located in an inner space of the second case 22 (see fig. 2) and connected to the second side member 222 or integrally formed with the second side member 222. The first support structure 411 and the second support structure 421 may be located in the electronic device 2 to bear a load, contributing to durability or stiffness (e.g., torsional stiffness) of the electronic device 2. The first support structure 411 and/or the second support structure 421 may be made using, for example, metallic materials and/or non-metallic materials (e.g., polymers). The electronic component or various components related to the electronic component may be disposed in the first front case 41 or the first support structure 411, or may be supported by the first front case 41 or the first support structure 411. The first support structure 411 may include a first coverage area, such as the front facing surface 20A First supporting area 411A and third covering area facing rear surface 20B (see fig. 2)>(see fig. 2) a third support area (not shown). The portion of the flexible display 30 (see fig. 2) corresponding to the first housing 21 may be disposed in the first support region 411A of the first support structure 411, or may be supported by the first support region 411A. Although not shown, a first PCB (or first substrate assembly) located in the inner space of the first housing 21 may be disposed in the third support region of the first support structure 411. The electronic components or various components associated with the electronic components may be disposed in the second front housing 42 or the second support structure 421, or may be supported by the second front housing 42 or the second support structure 421. The second support structure 421 may comprise, for example, a front facing surfaceSecond coverage area of 20A->Second supporting area 421A and fourth covering area of rear facing surface 20B (see fig. 2)>(see fig. 2) a fourth support area (not shown). The portion of the flexible display 30 corresponding to the second housing 22 may be disposed in the second support region 421A of the second support structure 421, or may be supported by the second support region 421A. Although not shown, a second PCB (or a second substrate assembly) located in the inner space of the second case 22 may be disposed in a fourth support region of the second support structure 421. The first front case 41 or the first support structure 411 may be included in the first case 21 (see fig. 2) of the foldable case 20 to bear a load, thereby contributing to durability or rigidity of the electronic device 2. A second front housing 42 or a second support structure 421 may be included in the second housing 22 of the collapsible housing 20 to bear a load, thereby contributing to the durability or rigidity of the electronic device 2. In some embodiments, the first front housing 41 or the first support structure 411 may be referred to as various other terms, such as "first frame," first frame structure, "or" first truss. In some embodiments, the second front housing 42 or the second support structure 421 may be referred to by various other terms, such as "second frame," second frame structure, "or" second truss. The first support structure 411 is an internal structure located in the internal space of the electronic device 2 corresponding to the first housing 21, and in some embodiments, the first support structure 411 may be referred to as various other terms, such as "first bracket" or "first support member". The second support structure 421 is an internal structure located in the internal space of the electronic device 2 corresponding to the second housing 22, and in some embodiments, the second support structure 421 may be referred to as various other terms, such as a "second bracket" or a "second support member. In some embodiments, the first support structure 411 may be construed as part of the first housing 21 and the second support structure 421 may be construed as part of the second housing 22.

According to an embodiment, the first hinge assembly 51 and the second hinge assembly 52 may connect the first front case 41 and the second front case 42. The first and second front cases 41 and 42 are rotatable with each other based on a rotation axis (e.g., a folding axis a) by the first and second hinge assemblies 51 and 52. The first hinge assembly 51 may include, for example, a first portion (1) coupled to the first support structure 411, a second portion (2) coupled to the second support structure 421, a third portion (3) connected to the first portion (1), a fourth portion (4) connected to the second portion (2), and a first actuator 511 for connecting the third portion (3) and the fourth portion (4). The first portion (1) may be provided in the first support region 411A or bonded to the first support region 411A, for example, and the first portion (1) may be in the form of a plate superposed with the first support region 411A when viewed from above the first support region 411A of the first support structure 411. In an embodiment, the first portion (1) may be coupled to the first support structure 411 using screws. The second portion (2) may be provided in the second support region 421A or bonded to the second support region 421A, for example, and the second portion (2) may be in the form of a plate superposed with the second support region 421A when viewed from above the second support region 421A of the second support structure 421. In an embodiment, the second portion (2) may be coupled to the second support structure 421 using screws. The third portion (3) may be in the form of, for example, a plate that overlaps the first support region 411A when viewed from above the first support region 411A of the first support structure 411. The fourth portion (4) may be in the form of, for example, a plate that overlaps the second support area 421A when viewed from above the second support area 421A of the second support structure 421. The first actuator 511 may connect the third portion (3) and the fourth portion (4) such that the third portion (3) and the fourth portion (4) may rotate with each other. The first actuator 511 may provide, for example, a driving force such that the third portion (3) and the fourth portion (4) rotate with respect to each other. The first actuator 511 may, for example, enable the third portion (3) and the fourth portion (4) to rotate at the same angle in opposite directions to each other. The first actuator 511 may, for example, enable the third portion (3) and the fourth portion (4) to be held at least one specified angle. Since the first part (1) connected to the third part (3) is connected to the first support structure 411, the first front housing 41 is movable together with the first part (1) and the third part (3). Since the second part (2) connected to the fourth part (4) is connected to the second support structure 421, the second front housing 42 is movable together with the second part (2) and the fourth part (4). Both the first part (1) and the second part (2) are referred to as "first swivel", and both the third part (3) and the fourth part (4) are referred to as "first hinge arm". In some embodiments, the first portion (1) and the third portion (3) may be integrally formed, and the second portion (2) and the fourth portion (4) may be integrally formed. The second hinge assembly 52 may be implemented substantially the same as or similar to the first hinge assembly 51. In an embodiment, the first hinge assembly 51 and the second hinge assembly 52 may be disposed substantially symmetrically based on a center between the first hinge assembly 51 and the second hinge assembly 52. The center between the first hinge assembly 51 and the second hinge assembly 52 may refer to, for example, a point on the folding axis a that is substantially spaced apart from the first hinge assembly 51 and the second hinge assembly 52. The second hinge assembly 52 may include, for example, a fifth portion (5) disposed in the first support region 411A of the first support structure 411 (or coupled to the first support region 411A of the first support structure 411), a sixth portion (6) disposed in the second support region 421A of the second support structure 421 (or coupled to the second support region 421A of the second support structure 421), a seventh portion (7) connected to the fifth portion (5), an eighth portion (8) connected to the sixth portion (6), and a second actuator 521 for connecting the seventh portion (7) and the eighth portion (8). The first hinge assembly 51 and the second hinge assembly 52 may be disposed apart in the direction of the folding axis a (e.g., y-axis direction). The first hinge arm of the first hinge assembly 51 comprising the third part (3) and the fourth part (4) and the second hinge arm of the second hinge assembly 52 comprising the seventh part (7) and the eighth part (8) may be located between the first swivel of the first hinge assembly 51 comprising the first part (1) and the second part (2) and the second swivel of the second hinge assembly 52 comprising the fifth part (5) and the sixth part (6). In the unfolded state of the electronic device 2 (see fig. 2), the first (1) and second (2) portions of the first hinge assembly 51, the third (3) and fourth (4) portions of the first hinge assembly 51, the fifth (5) and sixth (6) portions of the second hinge assembly 52, and the seventh (7) and eighth (8) portions of the second hinge assembly 52 may form an angle of about 180 degrees. In the folded state of the electronic device 2 (see fig. 3), the first (1) and second (2) portions of the first hinge assembly 51, the third (3) and fourth (4) portions of the first hinge assembly 51, the fifth (5) and sixth (6) portions of the second hinge assembly 52, and the seventh (7) and eighth (8) portions of the second hinge assembly 52 may be spaced apart and stacked to form an angle of about 0 degrees to about 10 degrees, or may be positioned substantially parallel.

According to an embodiment, the first hinge assembly 51 and the second hinge assembly 52 may be coupled to the hinge housing 23 using screws. The first and second front cases 41 and 42 may be connected to the hinge housing 23 using the first and second hinge assemblies 51 and 52.

According to an embodiment, the first plate assembly 6A may be in the form of a plurality of plates combined, and the plurality of plates may be combined to the first support structure 411 using screws. The second plate assembly 6B may be in the form of a plate that is coupled to a plurality of plates, and the plurality of plates may be coupled to the second support structure 421 using screws. The first and second board assemblies 6A and 6B can stably support a bendable region corresponding to a folded portion between the first and second cases 21 (see fig. 2) and 22 (see fig. 2) in a display assembly including the flexible display 30. In the embodiment, the first plate assembly 6A and the second plate assembly 6B each include a plurality of bonded metal plates, and the first plate assembly 6A and the second plate assembly 6B can together contribute to securing an improved device yield by reducing defects, as compared to the comparative example using a unitary metal plate. In the comparative example, the entire metal plate supports the bendable region of the display assembly including the flexible display 30, compared to the first plate assembly 6A or the second plate assembly 6B including a plurality of metal plates according to the embodiment of the present document. When processing such as removing foreign substances or smoothing a surface (e.g., barrel grinding) is performed using ceramic grains, the integral metal plate according to the comparative example may cause bending deformation due to a shape such as a large area or a large length, as compared to each of the plurality of metal plates included in the plate assembly according to the embodiment of the present document. In the unfolded state of the electronic device 2 (see fig. 2), the first plate assembly 6A and the second plate assembly 6B may form an angle of about 180 degrees. In the unfolded state of the electronic device 2, the first board assembly 6A may support one side region with reference to a folding axis a (see fig. 2) in a bendable region of the display assembly corresponding to a folding coverage region F (see fig. 2), and the second board assembly 6B may support the other side region with reference to the folding axis in the bending region of the display assembly. In the folded state of the electronic device 2 (see fig. 3), the first and second plate assemblies 6A, 6B may be spaced apart and stacked to form an angle of about 0 degrees to about 10 degrees, or may be positioned substantially parallel.

According to an embodiment, the first plate assembly 6A may include a first plate 61, a second plate 62, a third plate 63, and/or a fourth plate 64. The first plate 61 may be positioned between the first hinge assembly 51 and the second hinge assembly 52. The first plate 61 may not overlap the first hinge assembly 51 and the second hinge assembly 52 when viewed from above the first support region 411A of the first support structure 411. The first plate 61 may include a first surface (not shown) facing the first support region 411A and a second surface 602 facing a direction opposite to the direction of the first surface. The second plate 62 may overlap the first plate 61. The second plate 62 may include, for example, a third surface (not shown) facing the second surface 602 of the first plate 61 and a fourth surface 604 facing in a direction opposite to the direction of the third surface. A portion of the third plate 63 may overlap the first plate 61 and another portion of the third plate 63 may overlap the first hinge assembly 51. The third plate 63 may include a fifth surface (not shown) and a sixth surface 606 facing in a direction opposite to the direction of the fifth surface. A partial region of the fifth surface may face the second surface 602 of the first plate 61, and another partial region of the fifth surface may face the first hinge assembly 51. A portion of the fourth plate 64 may overlap the first plate 61 and another portion of the fourth plate 64 may overlap the second hinge assembly 52. The fourth plate 64 may include a seventh surface (not shown) and an eighth surface 608 facing in a direction opposite to the direction of the seventh surface. A partial region of the seventh surface may face the second surface 602 of the first plate 61 and another partial region of the seventh surface may face the second hinge assembly 52. The second plate 62 may be located between the third plate 63 and the fourth plate 64 when viewed from above the second surface 602 of the first plate 61 (e.g., when viewed in the-z axis direction), and the third plate 63, the second plate 62, and the fourth plate 64 may be arranged in the direction of the folding axis a (see fig. 2) (e.g., the y axis direction).

According to an embodiment, the second plate assembly 6B may be arranged in substantially the same or similar manner as the first plate assembly 6A. The second plate assembly 6B may include a fifth plate 65 corresponding to the first plate 61, a sixth plate 66 corresponding to the second plate 62, a seventh plate 67 corresponding to the third plate 63, and/or an eighth plate 68 corresponding to the fourth plate 64. The fifth plate 65 may be located between the first hinge assembly 51 and the second hinge assembly 52. The fifth plate 65 may not overlap the first hinge assembly 51 and the second hinge assembly 52 when viewed from above the second support region 421A of the second support structure 421. The fifth plate 65 may include a ninth surface (not shown) facing the second supporting region 421A and a tenth surface 610 facing a direction opposite to the direction of the ninth surface. The sixth plate 66 may overlap the fifth plate 65. The sixth plate 66 may include, for example, an eleventh surface (not shown) facing the tenth surface 610 of the fifth plate 65 and a twelfth surface 612 facing in a direction opposite to the direction of the eleventh surface. A portion of the seventh plate 67 may overlap the fifth plate 65 and another portion of the seventh plate 67 may overlap the first hinge assembly 51. The seventh plate 67 may include a thirteenth surface (not shown) and a fourteenth surface 614 facing in a direction opposite to the direction of the thirteenth surface. A partial region of the thirteenth surface may face the tenth surface 610 of the fifth plate 65 and another partial region of the thirteenth surface may face the first hinge assembly 51.

A portion of the eighth plate 68 may overlap the fifth plate 65 and another portion of the eighth plate 68 may overlap the second hinge assembly 52. Eighth plate 68 may include a fifteenth surface (not shown) and a sixteenth surface 616 that faces in a direction opposite the direction of the fifteenth surface. A partial region of the fifteenth surface may face the tenth surface 610 of the fifth plate 65 and another partial region of the fifteenth surface may face the second hinge assembly 52. The sixth plate 66 may be located between the seventh plate 67 and the eighth plate 68 when viewed from above the tenth surface 610 of the fifth plate 65 (e.g., when viewed in the-z axis direction), and the seventh plate 67, the sixth plate 66, and the eighth plate 68 may be arranged in the direction of the fold axis a (see fig. 2) (e.g., in the y axis direction).

According to an embodiment, the first plate 61 and the second plate 62 may be bonded using welding. In some embodiments, the first plate 61 and the second plate 62 may be joined using a joining technique that includes joining with an adhesive material. In some embodiments, the first plate 61 and the second plate 62 may be coupled using screws.

According to an embodiment, the third plate 63 may be coupled to the first plate 61 and the first support structure 411 using screws. The third plate 63 may include screw holes and the first plate 61 may include screw holes aligned with the screw holes of the third plate 63 to correspond to the screws, and the first support structure 411 may include screw fastening portions aligned with the screw holes of the first plate 61. The screw tightening portion may be, for example, a boss including an internal thread corresponding to an external thread of the screw.

According to an embodiment, the third plate 63 may be coupled to the first hinge assembly 51 and the first support structure 411 using screws. For example, to correspond to a screw, the third plate 63 may include a screw hole, the first portion (1) of the first hinge assembly 51 may include a screw hole aligned with the screw hole of the third plate 63, and the first support structure 411 may include a screw fastening portion (e.g., a boss including internal threads) aligned with the screw hole of the first portion (1) of the first hinge assembly 51.

According to an embodiment, the fourth plate 64 may be coupled to the first plate 61 and the first support structure 411 using screws. To correspond to screws, the fourth plate 64 may include screw holes, the first plate 61 may include screw holes aligned with the screw holes of the fourth plate 64, and the first support structure 411 may include screw fastening portions (e.g., bosses including internal threads) aligned with the screw holes of the first plate 61.

According to an embodiment, the fourth plate 64 may be coupled to the second hinge assembly 52 and the first support structure 411 using screws. For example, to correspond to a screw, the fourth plate 64 may include a screw hole, the fifth portion (5) of the second hinge assembly 52 may include a screw hole aligned with the screw hole of the fourth plate 64, and the first support structure 411 may include a screw fastening portion (e.g., a boss including internal threads) aligned with the screw hole of the fifth portion (5) of the second hinge assembly 52.

According to an embodiment, the fifth plate 65 and the sixth plate 66 may use welding. In some embodiments, fifth plate 65 and sixth plate 66 may be joined using a joining technique that includes joining with an adhesive material. In some embodiments, fifth plate 65 and sixth plate 66 may be joined using screws.

According to an embodiment, seventh plate 67 may be coupled to fifth plate 65 and second support structure 421 using screws. To correspond to screws, seventh plate 67 may include screw holes, fifth plate 65 may include screw holes aligned with screw holes of seventh plate 67, and second support structure 421 may include screw fastening portions (e.g., bosses including internal threads) aligned with screw holes of fifth plate 65.

According to an embodiment, seventh plate 67 may be coupled to first hinge assembly 51 and second support structure 421 using screws. For example, to correspond to a screw, the seventh plate 67 may include a screw hole, the second portion (2) of the first hinge assembly 51 may include a screw hole aligned with the screw hole of the seventh plate 67, and the second support structure 421 may include a screw fastening portion (e.g., a boss including internal threads) aligned with the screw hole of the second portion (2) of the first hinge assembly 51.

According to an embodiment, the eighth plate 68 may be coupled to the fifth plate 65 and the second support structure 421 using screws. To correspond to screws, eighth plate 68 may include screw holes, fifth plate 65 may include screw holes aligned with screw holes of eighth plate 68, and second support structure 421 may include screw fastening portions (e.g., bosses including internal threads) aligned with screw holes of fifth plate 65.

According to an embodiment, the eighth plate 68 may be coupled to the second hinge assembly 52 and the second support structure 421 using screws. For example, to correspond to a screw, the eighth plate 68 includes a screw hole, the sixth portion (6) of the second hinge assembly 52 may include a screw hole aligned with the screw hole of the eighth plate 68, and the second support structure 421 may include a screw fastening portion (e.g., a boss including internal threads) aligned with the screw hole of the sixth portion (6) of the second hinge assembly 52.

According to an embodiment, the first plate 61, the second plate 62, the third plate 63, and the fourth plate 64 may be metal plates. The first plate 61, the second plate 62, the third plate 63, or the fourth plate 64 may be made of, for example, a metal material such as aluminum, stainless steel, magnesium, titanium, amorphous alloy. The first plate 61, the second plate 62, the third plate 63, or the fourth plate 64 may comprise a metal-ceramic composite (e.g., cermet), stainless steel, magnesium alloy, aluminum alloy, zinc alloy, copper alloy, or an alloy combination thereof. In some embodiments, at least one of the first plate 61, the second plate 62, the third plate 63, or the fourth plate 64 may comprise a non-metallic material capable of ensuring rigidity, such as engineering plastics, thermoplastics (such as polyoxymethylene-based plastics), fluoropolymers (such as polytetrafluoroethylene, polyethylene, polyurethane), phenolics, and acrylonitrile butadiene styrene-based plastics, although other materials are within the intended scope of the present disclosure. In some embodiments, the first plate 61, the second plate 62, the third plate 63, and the fourth plate 64 may be made of the same material. In some embodiments, at least one of the first plate 61, the second plate 62, the third plate 63, and the fourth plate 64 may be made of different materials.

According to an embodiment, the fifth plate 65, the sixth plate 66, the seventh plate 67, and the eighth plate 68 may be metal plates. The fifth plate 65, the sixth plate 66, the seventh plate 67 or the eighth plate 68 may be made of, for example, a metallic material such as aluminum, stainless steel, magnesium, titanium, amorphous alloy. The fifth plate 65, sixth plate 66, seventh plate 67, or eighth plate 68 may comprise a metal-ceramic composite (e.g., cermet), stainless steel, magnesium alloy, aluminum alloy, zinc alloy, copper alloy, or an alloy combination thereof. In some embodiments, at least one of fifth plate 65, sixth plate 66, seventh plate 67, or eighth plate 68 may comprise a non-metallic material capable of ensuring rigidity, such as engineering plastics, thermoplastics (such as polyoxymethylene-based plastics), fluoropolymers (such as polytetrafluoroethylene, polyethylene, polyurethane), phenolics, and acrylonitrile butadiene styrene-based plastics, although other materials are within the intended scope of the present disclosure. In some embodiments, fifth plate 65, sixth plate 66, seventh plate 67, and eighth plate 68 are made of the same material. In some embodiments, at least one of fifth plate 65, sixth plate 66, seventh plate 67, and eighth plate 68 are made from different materials.

According to embodiments, the rail assembly 7 may be provided in the hinge housing 23 or coupled to the hinge housing 23. The hinge housing 23 may include a recess provided in one surface opposite to the other surface exposed to the outside in the folded state of the electronic device 2 (see fig. 3), and the guide rail assembly 7 may be positioned in the recess of the hinge housing 23. The rail assembly 7 may be positioned in a space provided by the hinge housing 23, the first plate assembly 6A and the second plate assembly 6B. The rail assembly 7 may include a rail structure 71, a first slider structure 72, and/or a second slider structure 73. The first slider structure 72 and the second slider structure 73 may be slidably disposed in the rail structure 71. The rail structure 71 may be coupled to the hinge housing 23 using screws. The first slider structure 72 may be coupled to the first plate 61 of the first plate assembly 6A using screws, and may be rotationally movable together with the first plate assembly 6A coupled to the first front case 41. The second slider structure 73 may be coupled to the fifth plate 65 of the second plate assembly 6B using a screw, and may be rotationally movable together with the second plate assembly 6B coupled to the second front case 42. The rail structure 71 may include a first rail and a second rail. The first guide rail may be a space provided along a path corresponding to the rotational movement of the first front case 41 combined with the first plate assembly 6A, the first plate assembly 6A being combined with the first slider structure 72. The second guide rail may be a space provided along a path corresponding to the rotational movement of the second front case 42 coupled with the second plate assembly 6B, and the second plate assembly 6B is coupled with the second slider structure 73. The first slider structure 72 may include a first slider inserted into a first rail of the rail structure 71 and movable by being guided to the first rail. The second slider structure 73 may include a second slider inserted into a second rail of the rail structure 71 and movable by being guided to the second rail. The rail assembly 7 may be positioned between the first hinge assembly 51 and the second hinge assembly 52. For example, the rail assembly 7 may be positioned to correspond with a center between the first hinge assembly 51 and the second hinge assembly 52 (e.g., a point on the fold axis a that is substantially separate from the first hinge assembly 51 and the second hinge assembly 52). In an embodiment, the rail assembly 7 may be positioned at substantially the same separation distance from the first hinge assembly 51 and the second hinge assembly 52. The rail assembly 7 can reduce the lift-up phenomenon of the first and second plate assemblies 6A and 6B.

According to an embodiment, the first electrical path 81 and the second electrical path 82 may electrically connect a first electronic component housed in the first housing 21 (see fig. 2) and a second electronic component housed in the second housing 22 (see fig. 2). The first electrical path 81 and/or the second electrical path 82 may electrically connect, for example, a first PCB housed in the first housing 21 and a second PCB housed in the second housing 22. Signals (e.g., commands or data) between the first PCB and the second PCB may be transmitted through the first electrical path 81 and/or the second electrical path 82. The first and second electrical paths 81 and 82 may include a Flexible Printed Circuit Board (FPCB) or a Rigid Flexible Printed Circuit Board (RFPCB). The first and second electrical paths 81 and 82 may be coupled to the first and second board assemblies 6A and 6B and supported by the first and second board assemblies 6A and 6B. The first and second electrical paths 81 and 82 may extend between the hinge housing 23 and the first board assembly 6A and between the hinge housing 23 and the second board assembly 6B. The first electrical path 81 may include a first region bonded to the first board assembly 6A, a second region bonded to the second board assembly 6B, and a third region connecting the first and second regions. The third region may be located in a recess of the hinge housing 23 and may be curved and arranged according to a state change of the electronic device 2 (e.g., a switch between the unfolded state of fig. 2 and the folded state of fig. 3). The first electrical path 81 may include a fourth region extending from the first region to be electrically connected to the first electronic component accommodated in the first housing 21. The fourth region may include, for example, a first connector for electrically connecting with the first electronic component. The first electrical path 81 may include a fifth region extending from the second region to be electrically connected to the second electronic component accommodated in the second case 22. The fifth region may include, for example, a second connector for electrically connecting with a second electronic component. The second electrical path 82 may be arranged substantially the same or similar to the first electrical path 81. The rail assembly 7 may be positioned between the first electrical path 81 and the second electrical path 82 when viewed from above the first support region 411A of the first support structure 411 or the second support region 421A of the second support structure 421.

Fig. 5 is a diagram illustrating a first assembly 500 in a unfolded state, in which the first front case 41, the second front case 42, the first hinge assembly 51, the second hinge assembly 52, and the hinge housing 23 are combined in the first assembly 500, according to an embodiment. Fig. 6 is an enlarged view showing a portion indicated by reference numeral "501" in fig. 5, for example. Fig. 7 is a diagram illustrating a first hinge assembly 51 included in the electronic device 2 in a unfolded state according to an embodiment.

According to an embodiment, the first hinge assembly 51 may connect the first front housing 41 and the second front housing 42. The first hinge assembly 51 may include a first portion (1), a second portion (2), a third portion (3), a fourth portion (4), and a first actuator 511. The first portion (1) may be coupled to the first support structure 411 of the first front case 41 using a plurality of first screws S1. The first portion (1) may include a plurality of first screw holes H1 corresponding to the plurality of first screws S1, and the first support structure 411 may include a plurality of first screw fastening portions (e.g., a first boss including an inner screw) aligned with the plurality of first screw holes H1. The second portion (2) may be coupled to the second support structure 421 of the second front case 42 using a plurality of second screw holes S2. The second portion (2) may include a plurality of second screw holes H2 corresponding to the plurality of second screws S2, and the second support structure 421 may include a plurality of second screw fastening portions (e.g., a second boss including an inner screw) aligned with the plurality of second screw holes H2.

According to an embodiment, the first portion (1) of the first hinge assembly 51 may include a third screw hole H3, and the first support structure 411 may include a third screw fastening portion (e.g., a third boss including internal threads) aligned with the third screw hole H3. The third screw hole H3 and the third screw fastening portion may be used to tighten the third plate 63 (see fig. 4) and the first portion (1) with the first support structure 411. The second portion (2) of the first hinge assembly 51 may include a fourth screw hole H4, and the second support structure 421 may include a fourth screw fastening portion (e.g., a fourth boss including internal threads) aligned with the fourth screw hole H4. The fourth screw hole H4 and fourth screw tightening portion may be used to tighten the seventh plate 67 (see fig. 4) and the second portion (2) with the second support structure 421.

According to an embodiment, the second hinge assembly 52 may connect the first front housing 41 and the second front housing 42. The fifth portion (5) of the second hinge assembly 52 may be coupled to the first support structure 411 using a plurality of fifth screws S5. The fifth portion (5) may include a plurality of fifth screw holes corresponding to the plurality of fifth screws S5, and the first support structure 411 may include a plurality of fifth screw fastening portions (e.g., a fifth boss including an inner screw) aligned with the plurality of fifth screw holes. The sixth portion (6) of the second hinge assembly 52 may be coupled to the second support structure 421 using a plurality of sixth screws S6. The sixth portion (6) may include a plurality of sixth screw holes corresponding to the plurality of sixth screws S6, and the second support structure 421 may include a plurality of sixth screw fastening portions (e.g., a sixth boss including an inner screw) aligned with the plurality of sixth screw holes.

According to an embodiment, the fifth portion (5) of the second hinge assembly 52 may include a seventh screw hole H7, and the first support structure 411 may include a seventh screw fastening portion (e.g., a seventh boss including internal threads) aligned with the seventh screw hole H7. The seventh screw hole H7 and the seventh screw tightening portion may be used to tighten the fourth plate 64 (see fig. 4) and the fifth portion (5) with the first support structure 411.

The sixth portion (6) of the second hinge assembly 52 may include an eighth screw hole H8, and the second support structure 421 may include an eighth screw fastening portion (e.g., an eighth boss including internal threads) aligned with the eighth screw hole H8. The eighth screw hole H8 and the eighth screw tightening portion may be used to tighten the eighth plate 68 (see fig. 4) and the sixth portion (6) with the second support structure 421.

According to an embodiment, the first actuator 511 of the first hinge assembly 51 may comprise a gear assembly. The gear assembly may include, for example, a first shaft 618, a second shaft 620, a first shaft support 631, a second shaft support 632, a third shaft support 633, a fourth shaft support 634, a fifth shaft support 635, a first circular gear 641, a second circular gear 642, a third circular gear 643, a fourth circular gear 644, a gear support 650, a first torsion spring 661, a second torsion spring 662, a third torsion spring 663, a fourth torsion spring 664, a fifth torsion spring 665, and/or a sixth torsion spring 666.

According to an embodiment, the first shaft 618 may be positioned corresponding to the third portion (3) and based on the third portion (3) in a direction opposite to the direction of the first support region 411A of the first support structure 411 (e.g., -z-axis direction) to be at least partially accommodated in the recess of the hinge housing 23. The second shaft 620 may be positioned to correspond to the fourth portion (4) and be positioned based on the third portion (4) in a direction opposite to the direction of the second support area 421A of the second support structure 421 to be at least partially accommodated in the recess of the hinge housing 23. The first and second shafts 618, 620 may be parallel to the fold axis a. The first and second shafts 618, 620 may be rotatably positioned in the first, second, third, fourth, and fifth shaft supports 631, 632, 633, 634, 635. The first, second, third, fourth and fifth shaft supports 631, 632, 633, 634, 635 may be disposed to be spaced apart in the direction of the folding axis a (e.g., the y-axis direction). The first, second, third, fourth, and fifth shaft supports 631, 632, 633, 634, 635 may include a first aperture (not shown) in which the first shaft 618 may be rotatably positioned, and a second aperture (not shown) in which the second shaft 620 may be rotatably positioned. In an embodiment, the second shaft support 632 may be coupled to the hinge housing 23 using a ninth screw S9. The second shaft support 632 may include a ninth screw hole H9 corresponding to the ninth screw S9, and the hinge housing 23 may include a ninth screw fastening portion (e.g., a ninth boss including internal threads) aligned with the ninth screw hole H9. In an embodiment, the fifth shaft support 635 may be coupled to the hinge housing 23 using a tenth screw S10. The fifth shaft support 635 may include a tenth screw hole H10 corresponding to the tenth screw S10, and the hinge housing 23 may include a tenth screw fastening part (e.g., a tenth boss including internal threads) aligned with the tenth screw hole H10. The portion of the second shaft support 632 including the ninth screw hole H9 and the portion of the fifth shaft support 635 including the tenth screw hole H10 may be located between the first shaft 618 and the second shaft 620 when viewed in the x-y plane. The folding axis a of the electronic device 2 may, for example, be provided substantially by a combination of the first central axis A1 of the first shaft 618 and the second central axis A2 of the second shaft 620. The third portion (3) and the first portion (1) connected to the third portion (3) are rotatable based on the first central axis A1 of the first shaft 618. The fourth part (4) and the second part (2) connected to the fourth part (4) are rotatable based on the second central axis A2 of the second shaft 620.

According to an embodiment, the first circular gear 641 may be connected to the first shaft 618 and rotate with the first shaft 618 based on the first central axis A1. The second circular gear 642 may be connected to the second shaft 620 and rotate with the second shaft 620 based on the second central axis A2. The third circular gear 643 may be meshed with the first circular gear 641. The fourth circular gear 644 may mesh with the second circular gear 642. The third circular gear 643 and the fourth circular gear 644 may mesh with each other. The third rotational axis of the third circular gear 643 and the fourth rotational axis of the fourth circular gear 644 may be parallel to the first rotational axis (e.g., the first central axis A1) of the first circular gear 641 and the second rotational axis (e.g., the first central axis A2) of the second circular gear 642. The first circular gear 641, the second circular gear 642, the third circular gear 643, and the fourth circular gear 644 may be spur gears, for example. The gear support 650 may support the third circular gear 643 such that the third circular gear 643 may rotate by being engaged with the first circular gear 641 connected to the first shaft 618. The gear support 650 may support the fourth circular gear 644 such that the fourth circular gear 644 may be rotated by meshing with the second circular gear 642 connected to the second shaft 620. When the third portion (3) rotates based on the first central axis A1 of the first shaft 618, the first circular gear 641 connected to the first shaft 618 may rotate in the same direction as the third portion (3). When the fourth portion (4) rotates based on the second central axis A2 of the second shaft 620, the second circular gear 642 connected to the second shaft 620 may rotate in the same direction as the fourth portion (4). When the first circular gear 641 rotates in a first direction and the second circular gear 642 rotates in a second direction opposite to the first direction, the third circular gear 643 and the fourth circular gear 644 may facilitate transmission and balancing of forces (e.g., rotational forces) between the first circular gear 641 and the second circular gear 642.

According to an embodiment, the first shaft 618 may include a first cam (or first cam gear) 701 and a second cam (or second cam gear) 702. The first cam 701 may be positioned between the gear support 650 and the first shaft support 631. The second cam 702 may be positioned between the third shaft support 633 and the fourth shaft support 634. The first cam 701 may include, for example, a first cam gear 701a and a second cam gear 701b. The first cam gear 701a may include a first tooth surface facing the uneven form of the second cam gear 701b, and the second cam gear 701b may include a second tooth surface facing the uneven form of the first tooth surface. The second cam 702 may include, for example, a third cam gear 702a, a fourth cam gear 702b, and a fifth cam gear 702c. The fifth cam gear 702c may be positioned between the third cam gear 702a and the fourth cam gear 702b. The third cam gear 702a may include a third tooth surface in an uneven form facing the fifth cam gear 702c. The fourth cam gear 702b may include a fourth tooth surface in an uneven form facing the fifth cam gear 702c. The fifth cam gear 702c may include a fifth tooth surface facing the uneven form of the third tooth surface of the third cam gear 702a and a sixth surface facing the uneven form of the fourth tooth surface of the fourth cam gear 702b. The first shaft 618 may include: a first shaft portion including a first cam gear 701a; a second shaft portion including a second cam gear 701b and a third cam gear 702a; a third shaft portion including a fifth cam gear 702c; and a fourth shaft portion including a fourth cam gear 702b. The first shaft portion may be connected to the first circular gear 641 and rotate together with the first circular gear 641. The first torsion spring 661, the second torsion spring 662, and the third torsion spring 663 may be coil springs and arranged in a direction of the first center axis A1 (for example, the y-axis direction). The first torsion spring 661 may be flexibly positioned between the first shaft support 631 and the second shaft support 632, and the second shaft portion including the second cam gear 701b and the third cam gear 702a may be positioned to penetrate the first torsion spring 661. The second torsion spring 662 may be flexibly positioned between the second shaft support 632 and the third shaft support 633, and a second shaft portion including the second cam gear 701b and the third cam gear 702a may be positioned to penetrate the second torsion spring 662. The third torsion spring 663 may be flexibly positioned between the fourth shaft support 634 and the fifth shaft support 635, and a fourth shaft portion including the fourth cam gear 702b may be positioned through the third torsion spring 663. The second shaft 620 may be disposed substantially symmetrically with respect to the first shaft 618. The second shaft 620 may include, for example, a third cam 703 corresponding to the first cam 701 and a fourth cam 704 corresponding to the second cam 702. The fourth torsion spring 664 may be positioned in the second shaft 620 in substantially the same or similar manner as the first torsion spring 661 is provided in the first shaft 618. The fifth torsion spring 665 can be positioned in the second shaft 620 in substantially the same or similar manner as the second torsion spring 662 is disposed in the first shaft 618. The sixth torsion spring 666 may be positioned in the second shaft 620 in substantially the same or similar manner as the third torsion spring 663 is positioned in the first shaft 618. The first actuator 511 may perform a function of providing a driving force such that the third portion (3) and the fourth portion (4) may rotate with each other. The first actuator 511 may perform a function of enabling the third portion (3) and the fourth portion (4) to rotate at the same angle in directions opposite to each other. The first actuator 511 may perform a function (e.g., a free stop function) of enabling the third portion (3) and the fourth portion (4) to rotate and maintain at least a designated angle. The above-described function of the first actuator 511 may be provided by, for example, interactions between the plurality of circular gears 641, 642, 643, and 644, interactions between the two cam gears 701a and 701b of the first cam 701 using the elasticity of the first torsion spring 661, interactions between the three cam gears 702a, 702b, and 702c of the second cam 702 using the elasticity of the second torsion spring 662 and the elasticity of the third torsion spring 663, interactions between the two cam gears of the third cam 703 using the elasticity of the fourth torsion spring 664, and interactions between the three cam gears of the fourth cam 704 using the elasticity of the fifth torsion spring 665 and the elasticity of the sixth torsion spring 666.

According to an embodiment, the second actuating member 521 (see fig. 4) of the second hinge assembly 52 may be provided substantially identical or similar to the first actuating member 511 of the first hinge assembly 51. The second actuating member 521 may be disposed substantially symmetrically with the first actuating member 511 based on a center between the first hinge assembly 51 and the second hinge assembly 52. The second actuating member 521 may perform a function of providing a driving force such that the seventh portion (7) (see fig. 4) and the eighth portion (8) (see fig. 4) of the second hinge assembly 52 may be rotated with each other. The second actuator 521 may perform a function of enabling the seventh portion (7) and the eighth portion (8) of the second hinge assembly 52 to rotate in opposite directions at the same angle. The second actuator 521 may perform the function of enabling the seventh portion (7) and the eighth portion (8) of the second hinge assembly 52 to be maintained at least one designated angle.

The first hinge assembly 51 including the above-described components and the second hinge assembly 52 disposed substantially the same as or similar to the first hinge assembly 51 may be implemented in an elongated form spaced apart from the rear surface of the flexible display assembly so as not to press the rear surface of the flexible display assembly. The first hinge assembly 51 and the second hinge assembly 52 may be implemented to reduce or substantially exclude a planar area for supporting a rear surface of a display assembly including the flexible display 30. For example, in the case of a comparative example in which the hinge assembly includes a portion protruding toward the rear surface of the display assembly, the rear surface of the display assembly may include a recess in a form in which a portion corresponding to the protruding portion of the hinge assembly is removed. In the case of the comparative example, for example, the electromagnetic induction panel may not extend to the portion of the display assembly provided with the recess, and the portion of the display assembly provided with the recess may make it difficult to input using the pen input device. The first and second plate assemblies 6A and 6B are implemented to correspond to the first and second hinge assemblies 51 and 52 according to the embodiment, and a portion provided with a recess in the display assembly may be reduced or omitted and the rear surface of the display assembly may be stably supported as compared to the comparative example.

Fig. 8 is a diagram illustrating a second assembly 800 in a unfolded state, in which the first plate 61, the second plate 62, the fifth plate 65, the sixth plate 66, the first electrical path 81 and the second electrical path 82 are coupled to the first assembly 500 of fig. 5, according to an embodiment. Fig. 9 is a diagram showing the first plate 61 and the fifth plate 65 according to the embodiment. Fig. 10 is a diagram illustrating the second plate 62 and the sixth plate 66 according to the embodiment. Fig. 11 is a diagram showing a state where the first plate 61 and the second plate 62 are combined and a state where the fifth plate 65 and the sixth plate 66 are combined according to the embodiment.

Referring to fig. 8, 9, 10 and 11, the first plate 61 may be positioned between the first hinge assembly 51 and the second hinge assembly 52. The first plate 61 may not overlap the first hinge assembly 51 and the second hinge assembly 52 when viewed from above the first support region 411A of the first support structure 411. The first plate 61 may include a first surface (not shown) facing the first support region 411A and a second surface 602 facing a direction opposite to the direction of the first surface. The second plate 62 may overlap the first plate 61. The second plate 62 may include, for example, a third surface (not shown) facing the second surface 602 of the first plate 61 and a fourth surface 604 facing in a direction opposite to the direction of the third surface. In an embodiment, the first plate 61 and the second plate 62 may be bonded using welding. In some embodiments, the first plate 61 and the second plate 62 may be joined using a joining technique that includes joining with an adhesive material. In some embodiments, the first plate 61 and the second plate 62 may be coupled using screws.

According to an embodiment, the second plate 62 may not overlap the first hinge assembly 51 and the second hinge assembly 52 when viewed from above the first support region 411A of the first support structure 411.

According to an embodiment, the first plate 61 may comprise a first expanded region and a second expanded region when viewed from above the first support region 411A of the first support structure 411, as compared to the second plate 62. The first extension region may extend toward the first hinge assembly 51 so as not to overlap the second plate 62. The first expansion region may be coupled to the third plate 63 (see fig. 4) and the first support structure 411 using screws. The second expansion region may extend toward the second hinge assembly 52 so as not to overlap the second plate 62. The second expansion region may be coupled to the fourth plate 64 (see fig. 4) and the first support structure 411 using screws.

According to an embodiment, the fifth plate 65 may be located between the first hinge assembly 51 and the second hinge assembly 52. The fifth plate 65 may not overlap the first hinge assembly 51 and the second hinge assembly 52 when viewed from above the second support region 421A of the second support structure 421. The fifth plate 65 may include a ninth surface (not shown) facing the second supporting region 421A and a tenth surface 610 facing a direction opposite to the direction of the ninth surface. The sixth plate 66 may overlap the fifth plate 65. The sixth plate 66 may include, for example, an eleventh surface (not shown) facing the tenth surface 610 of the fifth plate 65 and a twelfth surface 612 facing in a direction opposite to the direction of the eleventh surface. In an embodiment, the fifth plate 65 and the sixth plate 66 may use welding. In some embodiments, fifth plate 65 and sixth plate 66 may be joined using a joining technique that includes joining with an adhesive material. In some embodiments, fifth plate 65 and sixth plate 66 may be joined using screws.

According to an embodiment, the fifth plate 65 may comprise a third and a fourth extension region when seen from above the second support region 421A of the second support structure 421, compared to the sixth plate 66. The third expansion region may extend toward the first hinge assembly 51 so as not to overlap the sixth plate 66. The third expansion region may be coupled to the seventh plate 67 (see fig. 4) and the second support structure 421 using screws. The fourth expansion region may extend toward the second hinge assembly 52 so as not to overlap the sixth plate 66. The fourth expansion region may be coupled to the eighth plate 68 (see fig. 4) and the second support structure 421 using screws.

According to an embodiment, the first plate 61 may include thirteenth screw hole H13, fourteenth screw hole H14, seventeenth screw hole H17, and/or eighteenth screw hole H18. The first support structure 411 may include a thirteenth screw fastening portion (e.g., a thirteenth boss including an inner screw) aligned with the thirteenth screw hole H13. The thirteenth screw hole H13 and thirteenth screw fastening portion may be used to tighten the third plate 63 (see fig. 4) and the first plate 61 with the first support structure 411. The first support structure 411 may include a fourteenth screw-securing portion (e.g., a fourteenth boss including an internal screw) aligned with the fourteenth screw hole H14. The fourteenth screw hole H14 and the fourteenth screw fastening portion may be used to screw the fourth plate 64 (see fig. 4) and the first plate 61 with the first support structure 411. The first plate 61 may be coupled to the first slider structure 72 using a seventeenth screw S17 corresponding to the seventeenth screw hole H17 (see fig. 4). The first plate 61 may be coupled to the first support structure 411 using an eighteenth screw S18 corresponding to the eighteenth screw hole H18.

According to an embodiment, the second plate 62 may include an opening 1017 (see fig. 10) aligned with (or overlapping) the seventeenth screw hole H17 of the first plate 61. The opening 1017 of the second plate 62 may prevent the second plate 62 from interfering with a structure in which a seventeenth screw S17 passes through the seventeenth screw hole H17 to be coupled to a seventeenth screw fastening portion (e.g., a seventeenth boss including an internal thread) provided in the first slider structure 72. The opening 1017 corresponding to the seventeenth screw hole H17 may be in the form of a through hole as shown in the example, but is not limited thereto, and may be provided in the form of a recess. The second plate 62 may include an opening 1018 (see fig. 10) aligned with (or stacked on) the eighteenth screw hole H18 of the first plate 61. The opening 1018 of the second plate 62 may prevent structural interference of the second plate 62 with an eighteenth screw fastening portion (e.g., an eighteenth boss including internal threads) in which an eighteenth screw S18 passes through the eighteenth screw hole H18 to be coupled to the first support structure 411. The opening 1018 corresponding to the eighteenth screw hole H18 may be in the form of a recess as shown in the example, but is not limited thereto, and may be provided in the form of a through hole.

According to an embodiment, fifth plate 65 may include a fifteenth screw hole H15, a sixteenth screw hole H16, a nineteenth screw hole H19, and/or a twentieth screw hole H20. The second support structure 421 may include a fifteenth screw securing portion (e.g., a fifteenth boss including an inner screw) aligned with the fifteenth screw hole H15. The fifteenth screw hole H15 and the fifteenth screw tightening portion may be used to tighten the seventh plate 67 (see fig. 4) and the fifth plate 65 with the second support structure 421. The second support structure 421 may include a sixteenth screw fastening portion (e.g., a sixteenth boss including an inner screw) aligned with the sixteenth screw hole H16. Sixteenth screw hole H16 and sixteenth screw fastening portion may be used to tighten eighth plate 68 (see fig. 4) and fifth plate 65 with second support structure 421. The fifth plate 65 may be coupled to the second slider structure 73 using a nineteenth screw S19 corresponding to the nineteenth screw hole H19 (see fig. 4). The fifth plate 65 may be coupled to the second support structure 421 using a twentieth screw S20 corresponding to the twentieth screw hole H20.

According to an embodiment, the sixth plate 66 may include an opening 1019 (see fig. 10) aligned with (or overlapping) the nineteenth screw hole H19 of the fifth plate 65. The opening 1019 of the sixth plate 66 may prevent the sixth plate 66 from interfering with structures in which the nineteenth screw S19 passes through the nineteenth screw hole H19 to be coupled to a nineteenth screw fastening portion (e.g., a nineteenth boss including internal threads) provided in the second slider structure 73 (see fig. 4). The opening 1019 corresponding to the nineteenth screw hole H19 may be in the form of a through hole as in the illustrated example, but is not limited thereto, and may be provided in the form of a recess. The sixth plate 66 may include an opening 1020 (see fig. 10) aligned with (or overlapping) the twentieth screw hole H20 of the fifth plate 65. The opening 1020 of the sixth plate 66 may prevent the sixth plate 66 from interfering with structures in which the twentieth screw S20 passes through the twentieth screw hole H20 to be coupled to a nineteenth screw fastening portion (e.g., a nineteenth boss including internal threads) provided in the second support structure 421. The opening 1020 corresponding to the twentieth screw hole H20 may be in the form of a recess as in the illustrated example, but is not limited thereto, and may be provided in the form of a through hole.

According to an embodiment, the rail structure 71 (see fig. 4) may be coupled to the hinge housing 23 using a twenty-first screw S21. The first plate 61 may include an opening 921 (see fig. 9) corresponding to the twenty-first screw S21. The second plate 62 may include an opening 1021 (see fig. 10) that is aligned with (or overlaps) the opening 921 of the first plate 61. The rail structure 71 (see fig. 4) may include a twenty-first screw hole corresponding to the twenty-first screw S21. The hinge housing 23 may include a twenty-first screw fastening portion (e.g., a twenty-first boss including internal threads) corresponding to the twenty-first screw hole. The openings 921 of the first plate 61 and the openings 1021 of the second plate 62 may prevent the first plate 61 and the second plate 62 from interfering with a structure in which the twenty-first screw S21 passes through the twenty-first screw hole of the guide rail structure 71 to be coupled to the twenty-first screw fastening portion provided in the hinge housing 23. The opening 921 of the first plate 61 corresponding to the twenty-first screw S21 may be in the form of a recess as in the illustrated example, but is not limited thereto, and may be provided in the form of a through hole. The opening 1021 of the second plate 62 corresponding to the twenty-first screw S21 may be in the form of a through hole as in the illustrated example, but is not limited thereto, and may be provided in the form of a recess.

According to an embodiment, the rail structure 71 (see fig. 4) may be coupled to the hinge housing 23 using a twenty-second screw S22. The fifth plate 65 may include openings 922 (see fig. 9) corresponding to the twenty-second screws S22. The sixth plate 66 may include an opening 1022 (see fig. 10) that is aligned with (or overlaps) the opening 922 of the fifth plate 65. The rail structure 71 (see fig. 4) may include a twenty-second screw hole corresponding to the twenty-second screw S22. The hinge housing 23 may include a twenty-second screw fastening portion (e.g., a twenty-second boss including internal threads) corresponding to the twenty-second screw hole. The openings 922 of the fifth plate 65 and the openings 1022 of the sixth plate 66 may prevent structural interference of the fifth plate 65 and the sixth plate 66 with a twenty-second screw hole in which the twenty-second screw S22 passes through the rail structure 71 (see fig. 4) to be coupled to the twenty-second screw fastening portion of the hinge housing 23. The opening 922 of the fifth plate 65 corresponding to the twenty-second screw S22 may be in the form of a recess as in the illustrated example, but is not limited thereto, and may be provided in the form of a through hole. The opening 1022 of the sixth plate 66 corresponding to the twenty-second screw S22 may be in the form of a through hole as in the illustrated example, but is not limited thereto, and may be provided in the form of a recess.

According to an embodiment, the first electrical path 81 may include a first region 811 bonded to the second board 62, a second region 812 bonded to the sixth board 66, and a third region 813 connecting the first region 811 and the second region 812. The third region 813 may be located at a recess of the hinge housing 23 and may be bent and set according to a state change of the electronic device 2 (e.g., a switch between the unfolded state of fig. 2 and the folded state of fig. 3). The first electrical path 81 may include a fourth region 814, the fourth region 814 extending from the first region 811 and electrically connected to a first electronic component (e.g., a first printed circuit board) housed in the first housing 21 (see fig. 2). The first electrical path 81 may include a first connector 814A disposed in a fourth region 814. The first connector 814A may be electrically connected to the first electronic component. The first electrical path 81 may include a fifth region 815, the fifth region 815 extending from the second region 812 and being electrically connected to a second electronic component (e.g., a second PCB) housed in the second housing 22 (see fig. 2). The first electrical path 81 may include a second connector 815A disposed in the fifth region 815. The second connector 815A may be electrically connected to a second electronic component. The second electrical path 82 may be arranged substantially the same or similar to the first electrical path 81. The second electrical path 82 may include, for example, a first region 821 bonded to the second board 62, a second region 822 bonded to the sixth board 66, and a third region 823 connecting the first region 821 and the second region 822. The second electrical path 82 may include a fourth region 824 extending from the first region 821 and a third connector 824A disposed in the fourth region 824. The second electrical path 82 may include a fifth region 825 extending from the second region 822 and a fourth connector 825A disposed in the fifth region 825.

According to an embodiment, to correspond to the first electrical path 81, the first plate 61 may comprise a first opening 901 and the fifth plate 65 may comprise a second opening 902. The first region 811 of the first electrical path 81 may pass through the first opening 901 to be disposed in the second plate 62. The second region 812 of the first electrical path 81 may pass through the second opening 902 to be disposed in the sixth plate 66. The first region 811 may be disposed at a third surface of the second plate 62 that faces the first plate 61. The second region 812 may be disposed at an eleventh surface of the sixth plate 66 facing the second plate 62.

According to an embodiment, to correspond to the second electrical path 82, the first plate 61 may comprise a third opening 903 and the fifth plate 65 may comprise a fourth opening 904. The first region 821 of the second electrical path 82 may pass through the third opening 903 to be disposed in the second plate 62. The second region 822 of the second electrical path 82 may pass through the fourth opening 904 to be disposed in the sixth plate 66. The first region 821 may be disposed at a third surface of the second plate 62 facing the first plate 61. The second region 822 may be disposed at an eleventh surface of the sixth plate 66 facing the second plate 62.

According to an embodiment, the first region 811 and the second region 812 of the first electrical path 81 may be substantially rigid, and the third region 813, the fourth region 814, and the fifth region 815 of the first electrical path 81 may be substantially flexible. The first region 821 and the second region 822 of the second electrical path 82 may be substantially rigid, and the third region 823, the fourth region 824, and the fifth region 825 of the second electrical path 82 may be substantially flexible. The first and second electrical paths 81 and 82 may be FPCBs or RFPCBs.

According to an embodiment, the second plate 62 may include a first opening structure 1001, one or more openings being provided in the first opening structure 1001 to correspond to the first region 811 of the first electrical path 81. Through the first opening structure 1001, an adhesive material for bonding the first region 811 and the second plate 62 may be introduced. In some embodiments, the first opening structure 1001 may enable a portion of the first region 811 to fit, thereby helping to stably bond the second plate 62 and the first region 811 to one another.

According to an embodiment, the sixth plate 66 may include a second opening structure 1002, one or more openings being provided in the second opening structure 1002 to correspond to the second region 812 of the first electrical path 81. The second opening structure 1002 may be used to bond the second region 812 of the first electrical path 81 to the sixth board 66 in substantially the same manner as the first opening structure 1001 was used in bonding the first region 811 of the first electrical path 81 to the second board 62.

According to an embodiment, the second plate 62 may comprise a third opening structure 1003, in which third opening structure 1003 one or more openings are provided to correspond with the first regions 821 of the second electrical paths 82. The third opening structure 1003 may be used to bond the first region 821 of the second electrical path 82 to the second board 62 in substantially the same way as the first opening structure 1001 was used when bonding the first region 811 of the first electrical path 81 to the second board 62.

According to an embodiment, the sixth plate 66 may include a fourth opening structure 1004, one or more openings being provided in the fourth opening structure 1004 to correspond to the second region 822 of the second electrical path 82. The fourth opening structure 1004 may be used to bond the second region 822 of the second electrical path 82 to the sixth board 66 in substantially the same way that the first opening structure 1001 was used when bonding the first region 811 of the first electrical path 81 to the second board 62.

Fig. 12 is a diagram illustrating a third assembly 1200 in a unfolded state, in which the third plate 63, the fourth plate 64, the seventh plate 67 and the eighth plate 68 are coupled to the second assembly 800 of fig. 8, in the third assembly 1200.

Referring to fig. 12, in an embodiment, a portion of the third plate 63 may overlap the first plate 61 when viewed from above the first support region 411A of the first support structure 411 (e.g., when viewed in the-z axis direction), and another portion of the third plate 63 may overlap the first hinge assembly 51. The third plate 63 may include a fifth surface and a sixth surface 606 facing in a direction opposite to the direction of the fifth surface. A partial region of the fifth surface may face the first plate 61 and another partial region of the fifth surface may face the first hinge assembly 51. The third plate 63 may be coupled to the first support structure 411 and the first portion (1) of the first hinge assembly 51 using a third screw S3. The third plate 63 may be coupled to the first plate 61 and the first support structure 411 using thirteenth screws S13.

According to an embodiment, a portion of the fourth plate 64 may overlap the first plate 61 and another portion of the fourth plate 64 may overlap the second hinge assembly 52 when viewed from above the first support region 411A of the first support structure 411 (e.g., when viewed in the-z-axis direction). The fourth plate 64 may include a seventh surface and an eighth surface 608 facing in a direction opposite to the direction of the seventh surface. A partial region of the seventh surface may face the first plate 61 and another partial region of the seventh surface may face the second hinge assembly 52. The fourth plate 64 may be coupled to the first support structure 411 and the fifth portion (5) of the second hinge assembly 52 using a seventh screw S7. The fourth plate 64 may be coupled to the first plate 61 and the first support structure 411 using a fourteenth screw S14.

According to an embodiment, the second plate 62 may be located between the third plate 63 and the fourth plate 64, and may not overlap the third plate 63 and the fourth plate 64 when viewed from above the first support region 411A of the first support structure 411 (e.g., when viewed in the-z axis direction).

According to an embodiment, a portion of the seventh plate 67 may overlap the fifth plate 65 and another portion of the seventh plate 67 may overlap the first hinge assembly 51 when viewed from above the second support area 421A of the second support structure 421. The seventh plate 67 may include a thirteenth surface and a fourteenth surface 614 facing in a direction opposite to the direction of the thirteenth surface. A partial region of the thirteenth surface may face the fifth plate 65 and another partial region of the thirteenth surface may face the first hinge assembly 51. The seventh plate 67 may be coupled to the second support structure 421 and the second portion (2) of the first hinge assembly 51 using a fourth screw S4. The seventh plate 67 may be coupled to the fifth plate 65 and the second support structure 421 using a fifteenth screw S15.

According to an embodiment, a portion of the eighth plate 68 may overlap the fifth plate 65 and another portion of the eighth plate 68 may overlap the second hinge assembly 52 when viewed from above the second support area 421A of the second support structure 421. Eighth plate 68 may include a fifteenth surface and a sixteenth surface 616 that faces in a direction opposite the direction of fifteenth surface. A partial region of the fifteenth surface may face the fifth plate 65 and another partial region of the fifteenth surface may face the second hinge assembly 52. The eighth plate 68 may be coupled to the second support structure 421 and the sixth portion (6) of the second hinge assembly 52 using eighth screws S8. The eighth plate 68 may be coupled to the fifth plate 65 and the second support structure 421 using sixteenth screws S16.

According to an embodiment, the sixth plate 66 may be located between the seventh plate 67 and the eighth plate 68, and may not overlap the seventh plate 67 and the eighth plate 68, when viewed from above the second support region 421A of the second support structure 421.

According to an embodiment, the second plate 62, the third plate 63, and the fourth plate 64 (see fig. 4) of the first plate assembly 6A may substantially support a rear surface of a display assembly including the flexible display 30 (see fig. 2). In an embodiment, the first plate 61 may be disposed in the first support region 411A of the first support structure 411 and between the first hinge assembly 51 and the second hinge assembly 52 to serve as a bracket or base connecting the second plate 62, the third plate 63, and the fourth plate 64 supporting the display assembly to the first support structure 411. The first plate 61 may enable the second plate 62, the third plate 63, and the fourth plate 64 to be positioned apart from the first support structure 411 at a designated height. The second, third and fourth plates 62, 63, 64 disposed at the first plate 61 and positioned spaced apart from the first support structure 411 at a designated height may support the display assembly from sagging without substantially pressing the rear surface of the display assembly.

According to an embodiment, the portion supporting the rear surface of the display assembly in the first support region 411A of the first support structure 411 may be formed substantially without a height difference from at least a portion of the rear surface of the support display assembly of the fourth surface 604 of the second plate 62, at least a portion of the rear surface of the support display assembly of the sixth surface 606 of the third plate 63, and/or at least a portion of the rear surface of the support display assembly of the eighth surface 608 of the fourth plate 64.

According to an embodiment, the portion of the first portion (1) of the first hinge assembly 51 not covered by the third plate 63 may include a seventeenth surface 1217 supporting a rear surface of the display assembly including the flexible display 30 (see fig. 2). The seventeenth surface 1217 may be formed substantially free of a height difference from at least a portion of the first support region 411A of the first support structure 411 supporting the rear surface of the display assembly and/or at least a portion of the sixth surface 606 of the third plate 63 supporting the rear surface of the display assembly.

According to an embodiment, the portion of the fifth portion (5) of the second hinge assembly 52 not covered by the fourth plate 64 may include an eighteenth surface 1218 that supports a rear surface of a display assembly including the flexible display 30 (see fig. 2). The eighteenth surface 1218 may be formed substantially free of a height difference from at least a portion of the rear surface of the first support region 411A of the first support structure 411 and/or the rear surface of the support display assembly of the eighth surface 608 of the fourth plate 64.

According to an embodiment, the sixth plate 66, seventh plate 67, and eighth plate 68 (see fig. 4) of the second plate assembly 6B may substantially support a rear surface of a display assembly including the flexible display 30 (see fig. 2). In an embodiment, the fifth plate 65 may be disposed in the second support region 421A of the second support structure 421 and between the first hinge assembly 51 and the second hinge assembly 52 to serve as a bracket or base connecting the sixth plate 66, the seventh plate 67, and the eighth plate 68 supporting the display assembly to the second support structure 421. The fifth plate 65 may enable the sixth plate 66, the seventh plate 67, and the eighth plate 68 to be positioned apart from the second support structure 421 at a designated height. The sixth plate 66, seventh plate 67, and eighth plate 68 disposed at the fifth plate 65 and spaced apart from the second support structure 421 at a designated height may support the display assembly so as not to sag without substantially pressing the rear surface of the display assembly.

According to an embodiment, the portion of the second support region 421A of the second support structure 421 supporting the rear surface of the display assembly may be formed substantially free of a height difference from at least a portion of the rear surface of the twelfth surface 612 of the sixth plate 66 supporting the display assembly, at least a portion of the rear surface of the fourteenth surface 614 of the seventh plate 67 supporting the display assembly, and/or at least a portion of the rear surface of the sixteenth surface 616 of the eighth plate 68 supporting the display assembly.

According to an embodiment, the portion of the second portion (2) of the first hinge assembly 51 not covered by the seventh plate 67 may include a nineteenth surface 1219 that supports a rear surface of a display assembly that includes the flexible display 30 (see fig. 2). The nineteenth surface 1219 may be formed substantially free of a height difference from at least a portion of the second support region 421A of the second support structure 421 that supports the rear surface of the display assembly and/or at least a portion of the fourteenth surface 614 of the seventh plate 67 that supports the rear surface of the display assembly.

According to an embodiment, the portion of the sixth portion (6) of the second hinge assembly 52 not covered by the eighth plate 68 may include a twentieth surface 1220 that supports a rear surface of the display assembly including the flexible display 30 (see fig. 2). The twentieth surface 1220 may be formed substantially free of a height difference from a portion of the second support region 421A of the second support structure 421 supporting the rear surface of the display assembly and/or at least a portion of the sixteenth surface 616 of the eighth plate 68 supporting the rear surface of the display assembly.

According to an embodiment, in the unfolded state of the electronic device 2 (see fig. 2), the support of the first portion (1) of the first hinge assembly 51 comprises a seventeenth surface 1217 of the rear surface of the display assembly of the flexible display 30 (see fig. 2) and a nineteenth surface 1219 of the rear surface of the support display assembly in the second portion (2) of the first hinge assembly 51 may be provided substantially without a height difference.

According to an embodiment, in the unfolded state of the electronic device 2 (see fig. 2), the support of the fifth portion (5) of the second hinge assembly 52 comprises an eighteenth surface 1218 of the rear surface of the display assembly of the flexible display 30 (see fig. 2) and a twentieth surface 1220 of the rear surface of the display assembly of the support of the sixth portion (6) of the second hinge assembly 52 may be arranged substantially without a height difference.

According to an embodiment, in the unfolded state of the electronic device 2 (see fig. 2), the support of the sixth surface 606 of the third plate 63 comprises at least a portion of the rear surface of the display assembly of the flexible display 30 (see fig. 2) and at least a portion of the rear surface of the support display assembly of the fourteenth surface 614 of the seventh plate 67 may be arranged substantially without a height difference.

According to an embodiment, in the unfolded state of the electronic device 2 (see fig. 2), the support of the fourth surface 604 of the second plate 62 comprises at least a portion of the rear surface of the display assembly of the flexible display 30 (see fig. 2) and at least a portion of the rear surface of the display assembly of the support of the twelfth surface 612 of the sixth plate 66 may be arranged substantially without a height difference.

According to an embodiment, in the unfolded state of the electronic device 2 (see fig. 2), the support of the eighth surface 608 of the fourth plate 64, including at least a portion of the rear surface of the display assembly of the flexible display 30 (see fig. 2), and at least a portion of the rear surface of the support display assembly of the sixteenth surface 616 of the eighth plate 68 may be arranged substantially without a height difference.

According to some embodiments, in case it is found that it is difficult to substantially uniformly support the rear surface of the display assembly due to a height difference between two support surfaces of two adjacent components for supporting the rear surface of the display assembly, one or more members for reducing the height difference may be added.

According to an embodiment, the first portion (1), the second portion (2), the third portion (3) and the fourth portion (4) of the first hinge assembly 51 may be arranged so as not to interfere with the operation of the first actuator 511 (see fig. 4) of the first hinge assembly 51. The fifth (5), sixth (6), seventh (7) and eighth (8) portions of the second hinge assembly 52 may be arranged so as not to interfere with the operation of the second actuator 521 (see fig. 4) of the second hinge assembly 52. In an embodiment, the first plate assembly 6A (see fig. 4) and the second plate assembly 6B (see fig. 4) may be provided so as not to interfere with the operation of the first actuator 511 (see fig. 4) of the first hinge assembly 51 and the operation of the second actuator 521 (see fig. 4) of the second hinge assembly 52. A structure for not interfering with the operation of the first actuator 511 and the operation of the second actuator 521 will be described below with reference to fig. 13, 14, and 15.

Fig. 13 is an enlarged view showing a portion indicated by reference numeral "1201" in fig. 12, for example. Fig. 14 is a cross-sectional view 1400 illustrating a portion of the third assembly 1200 taken along line B-B' in fig. 13, in accordance with an embodiment. Fig. 15 is a cross-sectional view 1500 illustrating a portion of the third assembly 1200 taken along line C-C' in fig. 12, in accordance with an embodiment.

Referring to fig. 13 and 14, in an embodiment, a first rotational axis (e.g., a first central axis A1) of the first circular gear 641 and a second rotational axis (e.g., a second central axis A2) of the second circular gear 642 may be symmetrically positioned based on the folding axis a (see fig. 12). The first circular gear 641 and the second circular gear 642 may have substantially the same shape. For example, the first circular gear 641 and the second circular gear 642 may have the same number of teeth. The third rotational axis A3 of the third circular gear 643 and the fourth rotational axis A4 of the fourth circular gear 644 may be symmetrically positioned based on the fold axis a (see fig. 12). The third circular gear 643 and the fourth circular gear 644 may have substantially the same shape. For example, the third circular gear 643 and the fourth circular gear 644 may have the same number of teeth.

According to an embodiment, the third circular gear 643 and the fourth circular gear 644 may have substantially the same shape as the first circular gear 641 and the second circular gear 642. For example, the first circular gear 641, the second circular gear 642, the third circular gear 643, and the fourth circular gear 644 may have the same number of teeth.

According to some embodiments, the third circular gear 643 and the fourth circular gear 644 may have different sizes than the first circular gear 641 and the second circular gear 642. For example, the third circular gear 643 and the fourth circular gear 644 are gears smaller than the first circular gear 641 and the second circular gear 642, and may have fewer teeth than the first circular gear 641 and the second circular gear 642. For another example, the third circular gear 643 and the fourth circular gear 644 are gears that are larger than the first circular gear 641 and the second circular gear 642, and may have a number of teeth that is greater than the number of teeth of the first circular gear 641 and the second circular gear 642.

According to an embodiment, an imaginary first straight line 1401 passing through a first rotational axis (e.g., a first central axis A1) of the first circular gear 641 and a second rotational axis (e.g., a second central axis A2) of the second circular gear 642 may be spaced apart from an imaginary second straight line 1402 passing through a third rotational axis A3 of the third circular gear 643 and a fourth rotational axis A4 of the fourth circular gear 644, and substantially parallel to the imaginary second straight line 1402.

In an embodiment, referring to the cross-sectional view 1400 of fig. 14, in order for the first portion (1) of the first hinge assembly 51 and the third plate 63 not to interfere with the first circular gear 641, the first portion (1) may include an opening 1411 corresponding to the first circular gear 641, and the third plate 63 may include an opening 1412 aligned with (or overlapping) the opening 1411 of the first portion (1). A portion of the first circular gear 641 may pass through the opening 1411 of the first portion (1) to be positioned at the opening 1412 of the third plate 63. The first circular gear 641 may not protrude from the sixth surface 606 of the third plate 63 to avoid interference with or pressurizing a display assembly including the flexible display 30 (see fig. 2). The openings 1411 of the first portion (1) and the openings 1412 of the third plate 63 may help to thin the combined structure of the first hinge assembly 51, the first plate assembly 6A (see fig. 4), and the second plate assembly 6B (see fig. 4).

In an embodiment, referring to the cross-sectional view 1400 of fig. 14, in order for the second portion (2) of the first hinge assembly 51 and the seventh plate 67 not to interfere with the second circular gear 642, the second portion (2) may include an opening 1421 corresponding to the second circular gear 642, and the seventh plate 67 may include an opening 1422 aligned with (or overlapping) the opening 1421 of the second portion (2). A portion of the second circular gear 642 may pass through the opening 1421 of the second portion (2) to be positioned at the opening 1422 of the seventh plate 67. The second circular gear 642 may not protrude from the fourteenth surface 614 of the seventh plate 67 to avoid interference with or stressing a display assembly comprising the flexible display 30 (see fig. 2). The openings 1421 of the second portion (2) and the openings 1422 of the seventh plate 67 may help to thin the structure in which the first hinge assembly 51, the first plate assembly 6A (see fig. 4), and the second plate assembly 6B (see fig. 4) are combined.

Although not shown, the fourth plate 64 and the fifth portion (5) of the second hinge assembly 52 may include openings so as not to interfere with the circular gears included in the second hinge assembly 52. Although not shown, the eighth plate 68 and the sixth portion (6) of the second hinge assembly 52 may include openings to not interfere with the circular gears included in the second hinge assembly 52.

Referring to fig. 13 and 15, in an embodiment, a fifth shaft support 635 may be positioned between the first shaft 618 and the second shaft 620. The fifth shaft support 635 may be coupled to the hinge housing 23 using a tenth screw S10 (see fig. 4).

In an embodiment, referring to cross-sectional view 1500 of fig. 15, third plate 63 may include an opening 1501 corresponding to third torsion spring 663. The opening 1501 of the third plate 63 may prevent the third plate 63 from interfering with the third torsion spring 663. In an embodiment, referring to cross-sectional view 1500 of fig. 15, seventh plate 67 may include openings 1502 corresponding to sixth torsion springs 666. The opening 1502 of the seventh plate 67 prevents the seventh plate 67 from interfering with the sixth torsion spring 666.

According to an embodiment, the third plate 63 may include openings 1503 (see fig. 13) corresponding to the first and second torsion springs 661 and 662. The opening 1503 of the third plate 63 may prevent the third plate 63 from interfering with the first and second torsion springs 661 and 662. In an embodiment, the seventh plate 67 may include openings 1504 (see fig. 13) corresponding to the fourth torsion spring 664 and the fifth torsion spring 665. The opening 1504 of the seventh plate 67 may prevent the seventh plate 67 from interfering with the fourth torsion spring 664 and the fifth torsion spring 665.

According to an embodiment, openings 1501 and 1503 of third plate 63 and openings 1502 and 1504 of seventh plate 67 may help to thin the structure of first hinge assembly 51, first plate assembly 6A (see fig. 4), and second plate assembly 6B (see fig. 4) in combination.

According to an embodiment, the first torsion spring 661, the second torsion spring 662, and the third torsion spring 663 may not protrude from the sixth surface 606 of the third plate 63 so as not to interfere with or press the display assembly including the flexible display 30 (see fig. 2). The fourth torsion spring 664, the fifth torsion spring 665, and the sixth torsion spring 666 may not protrude from the fourteenth surface 614 of the seventh plate 67 so as not to interfere with or press the display assembly including the flexible display 30 (see fig. 2).

Although not shown, the fourth plate 64 (see fig. 12) may include an opening so as not to interfere with the torsion spring included in the second hinge assembly 52 (see fig. 12). Although not shown, the eighth plate 68 (see fig. 12) may include an opening so as not to interfere with the torsion spring included in the second hinge assembly 52 (see fig. 12).

Fig. 16 is a cross-sectional view 1600 taken along line D-D' in fig. 12, according to an embodiment. Fig. 17 is a cross-sectional view 1700 taken along line E-E' in fig. 12, according to an embodiment.

Referring to fig. 16 and 17, the electronic device 2 may include a first support structure 411, a second support structure 421, a first plate 61, a second plate 62, a fifth plate 65, a sixth plate 66, a rail structure 71, a first slider structure 72, a second slider structure 73, a seventeenth screw S17, a nineteenth screw S19, a twenty-first screw S21, a twenty-second screw S22, a first cover member 1610, and/or a second cover member 1620.

According to an embodiment, the rail structure 71 and the first slider structure 72 and the rail structure 71 and the second slider structure 73 may be a slider pair. The first slider structure 72 and the second slider structure 73 may be slidably disposed in the rail structure 71. The rail structure 71 may be coupled to the hinge housing 23 using a twenty-first screw S21 and a twenty-second screw S22. The rail structure 71 may include a twenty-first screw hole H21 corresponding to the twenty-first screw S21, and the hinge housing 23 may include a twenty-first screw fastening portion B21 (e.g., a twenty-first boss including internal threads) aligned with the twenty-first screw hole H21. The twenty-first screw S21 may pass through the twenty-first screw hole H21 to be coupled to the twenty-first screw fastening portion B21. The rail structure 71 may include a twenty-second screw hole H22 corresponding to the twenty-second screw S22, and the hinge housing 23 may include a twenty-second screw fastening portion B22 (e.g., a twenty-second boss including internal threads) aligned with the twenty-second screw hole H22. The twenty-second screw S22 may pass through the twenty-second screw hole H22 to be coupled to the twenty-second screw fastening part B22. The first plate 61 may be coupled to the first slider structure 72 using a seventeenth screw S17. The first slider structure 72 may include a seventeenth screw fastening portion B17 (e.g., a seventeenth boss including internal threads) aligned with the seventeenth screw hole H17 of the first plate 61. The seventeenth screw S17 may pass through the seventeenth screw hole H17 to be coupled to the seventeenth screw fastening part B17. The fifth plate 65 may be coupled to the second slider structure 73 using a nineteenth screw S19. The second slider structure 73 may include a nineteenth screw fastening portion B19 (e.g., a nineteenth boss including internal threads) that is aligned with the nineteenth screw hole H19 of the fifth plate 65. The nineteenth screw S19 may pass through the nineteenth screw hole H19 to be coupled to the nineteenth screw fastening portion B19.

According to an embodiment, the seventeenth screw S17 and the portion of the first plate 61 overlapping the opening 1017 of the second plate 62 may be provided so as not to protrude from the fourth surface 604 of the second plate 62 so as not to interfere with or press the display assembly including the flexible display 30 (see fig. 2).

According to an embodiment, the twenty-first screw S21 and the portion of the rail structure 71 overlapping the opening 1021 of the second plate 62 may be provided so as not to protrude from the fourth surface 604 of the second plate 62 so as not to interfere with or press the display assembly including the flexible display 30 (see fig. 2).

According to an embodiment, the nineteenth screw S19 and the portion of the fifth plate 65 that overlaps the opening 1019 of the sixth plate 66 may be disposed so as not to protrude from the twelfth surface 612 of the sixth plate 66 so as not to interfere with or press a display assembly including the flexible display 30 (see fig. 2).

According to an embodiment, the twenty-second screw S22 and the portion of the rail structure 71 that overlaps the opening 1022 of the second plate 62 may be disposed so as not to protrude from the twelfth surface 612 of the sixth plate 66 so as not to interfere with or press the display assembly including the flexible display 30 (see fig. 2).

According to an embodiment, the rail structure 71 may include a first rail 71A and a second rail 71B. The first guide rail 71A may be a space provided along a path corresponding to a rotational movement of the first front case 41 (see fig. 8) combined with the first plate assembly 6A (see fig. 4), and the first plate assembly 6A (see fig. 4) is combined with the first slider structure 72. The second guide rail 71B may be a space provided along a path corresponding to a rotational movement of the second front case 42 (see fig. 8) combined with the second plate assembly 6B (see fig. 4), and the second plate assembly 6B (see fig. 4) is combined with the second slider structure 73. The first slider structure 72 may include a first slider 721, the first slider 721 being inserted into the first rail 71A of the rail structure 71 and being movable by being guided to the first rail 71A. The second slider structure 73 may include a second slider 731, and the second slider 731 is inserted into the second guide rail 71B of the guide rail structure 71 and is movable by being guided to the second guide rail 71B. Because the first slider structure 72 is coupled to the first plate 61 of the first plate assembly 6A (see fig. 4), the first slider structure 72 may be rotatably moved together with the first plate assembly 6A coupled to the first front case 41. Because the second slider structure 73 is coupled to the fifth plate 65 (see fig. 4) of the second plate assembly 6B, the second slider structure 73 may be rotatably moved together with the second plate assembly 6B coupled to the second front case 42. In an embodiment, a rail assembly 7 (see fig. 4) including a rail structure 71, a first slider structure 72, and a second slider structure 73 may be positioned between the first hinge assembly 51 and the second hinge assembly 52. The rail assembly 7 may reduce a tilting phenomenon of the first plate assembly 6A (see fig. 4) and the second plate assembly 6B (see fig. 4).

According to an embodiment, the first cover member 1610 may be connected to the first support structure 411. In some embodiments, the first cover member 1610 may be integrally formed with the first support structure 411. The second cover member 1620 may be connected to the second support structure 421. In some embodiments, the second cover member 1620 may be integrally formed with the second support structure 421. In some embodiments, the first cover member 1610 may be construed as a portion of the first front housing 41 (see fig. 4) and the second cover member 1620 may be construed as a portion of the second front housing 42 (see fig. 4). One surface of the hinge housing 23 exposed to the outside in the folded state of the electronic device 2 (see fig. 3) may include a curved surface, and the first and second cover members 1610 and 1620 may be provided in a curved shape including a curved portion corresponding to the curved surface. In some embodiments, the first cover member 1610 may be referred to as various other terms, such as "first curved member" or "first curved surface", and the second cover member 1620 may be referred to as various other terms, such as "second curved member" or "second curved cover". In the unfolded state of the electronic device 2 (see fig. 2), the first cover member 1610 and the second cover member 1620 may cover both sides of the hinge housing 23, respectively, and the hinge housing 23 may not be substantially exposed to the outside. In the folded state of the electronic device 2 (see fig. 3), the hinge housing 23 may be exposed to the outside between the first cover member 1610 and the second cover member 1620. In some embodiments, the first cover member 1610 may be construed as a portion of the first housing 21 (see fig. 2) and the second cover member 1620 may be construed as a portion of the second housing 22 (see fig. 2). In some embodiments, the first and second cover members 1610, 1620 may be construed as part of a folded portion of the collapsible housing 20 (see fig. 2).

Fig. 18 is a cross-sectional view 1800 illustrating the third plate 63, the first portion (1) of the first hinge assembly 51, the first support structure 411, and the third screw S3 in fig. 12, according to an embodiment.

Referring to fig. 18, in an embodiment, the third plate 63, the first portion (1) of the first hinge assembly 51, and the first support structure 411 may be combined using a third screw S3. The first portion (1) may include a third screw hole H3 corresponding to the third screw S3. The third plate 63 may include screw holes H31 aligned with (or stacked on) the third screw holes H3. The first support structure 411 may include a third screw fastening portion B3 (e.g., a third boss including an inner screw) corresponding to the third screw S3. The third screw hole H3 of the first portion (1) may be located between the screw hole H31 of the third plate 63 and the third screw fastening portion B3 of the first support structure 411. The third screw S3 may pass through the screw hole H31 of the third plate 63 and the third screw hole H3 of the first part (1) to be coupled to the third screw fastening part B3.

According to an embodiment, the third screw S3, the portion of the third plate 63 including the screw hole H31, and the portion of the first portion (1) of the first hinge assembly 51 including the third screw hole H3 may be provided so as not to interfere with or press the display assembly including the flexible display 30 (see fig. 2). For example, a joint portion including the third screw S3, the portion of the third plate 63 where the screw hole H31 is provided, and the portion of the first portion (1) of the first hinge assembly 51 where the third screw hole H3 is provided may be provided in a recessed form with respect to the peripheral area so as not to interfere with or press the display assembly including the flexible display 30. The peripheral region may be interpreted as, for example, a portion adjacent to and at least partially surrounding a joint portion including the third screw S3 in a region supporting the rear surface of the display assembly of the third assembly 1200 of fig. 12, the portion provided with the screw hole H31 in the third plate 63, and the portion provided with the third screw hole H3 in the first portion (1) of the first hinge assembly 51.

Although not shown, the cross-sectional structures of the seventh plate 67, the second portion (2) of the first hinge assembly 51, the second support structure 421 and the fourth screw S4 shown in fig. 12 may be provided substantially the same as or similar to the cross-sectional view 1800 of fig. 18.

Although not shown, the cross-sectional structures of the fourth plate 64, the fifth portion (5) of the second hinge assembly 52, the first support structure 411, and the seventh screw S7 shown in fig. 12 may be provided substantially the same as or similar to the cross-sectional view 1800 of fig. 18.

Although not shown, the cross-sectional structures of the eighth plate 68, the sixth portion (6) of the second hinge assembly 52, the second support structure 421, and the eighth screw S8 shown in fig. 12 may be provided substantially the same as or similar to the cross-sectional view 1800 of fig. 18.

Fig. 19 is a cross-sectional view 1900 showing the third plate 63, the first plate 61, the first support structure 411, and the thirteenth screw S13 in fig. 12 according to an embodiment.

Referring to fig. 19, in an embodiment, the third plate 63, the first plate 61, and the first support structure 411 may be combined using thirteenth screws S13. The first plate 61 may include thirteenth screw holes H13 corresponding to thirteenth screws S13. The third plate 63 may include screw holes H131 aligned with (or stacked on) the thirteenth screw hole H13. The first support structure 411 may include a thirteenth screw fastening portion B13 (e.g., a thirteenth boss including an inner screw) corresponding to the thirteenth screw S13. The thirteenth screw hole H13 of the first plate 61 may be located between the screw hole H131 of the third plate 63 and the thirteenth screw hole B13 of the first support structure 411. The thirteenth screw S13 may pass through the screw hole H131 of the third plate 63 and the thirteenth screw hole H13 of the first plate 61 to be coupled to the thirteenth screw fastening part B13.

According to an embodiment, the thirteenth screw S13, the portion of the third plate 63 including the screw hole H131, and the portion of the first plate 61 including the thirteenth screw hole H13 may be provided so as not to interfere with or press the display assembly including the flexible display 30 (see fig. 2). For example, the joint portion including the thirteenth screw S13, the portion of the third plate 63 provided with the screw hole H131, and the portion of the first plate 61 provided with the thirteenth screw hole H13 may be provided in a recessed form with respect to the peripheral area so as not to interfere with or press the display assembly including the flexible display 30. The peripheral region may be interpreted as, for example, a portion adjacent to and at least partially surrounding a joint portion including the thirteenth screw S13 in a region supporting the rear surface of the display assembly of the third assembly 1200 of fig. 12, the portion of the third plate 63 provided with the screw hole H131, and the portion of the first plate 61 provided with the thirteenth screw hole H13.

Although not shown, the cross-sectional structures representing the seventh plate 67, the fifth plate 65, the second support structure 421, and the fifteenth screw S15 in fig. 12 may be provided substantially the same as or similar to the cross-sectional view 1900 of fig. 19.

Although not shown, the cross-sectional structures representing the fourth plate 64, the first plate 61, the first support structure 411, and the fourteenth screw S14 in fig. 12 may be provided to be substantially the same as or similar to the cross-sectional view 1900 of fig. 19.

Although not shown, the cross-sectional structures representing the eighth plate 68, the fifth plate 65, the second support structure 421, and the sixteenth screw S16 in fig. 12 may be provided substantially the same as or similar to the cross-sectional view 1900 of fig. 19.

Fig. 20 is an enlarged view showing a portion indicated by reference numeral "1301" in fig. 13, for example. Fig. 21 is a perspective view showing, for example, the first plate 61 and the third plate 63 with respect to fig. 20. Fig. 22 is a sectional view 2200 illustrating the first plate 61 and the third plate 63 with respect to fig. 20 according to an embodiment. Fig. 23 is a diagram showing another bonding structure between the first plate 61 and the third plate 63 according to another embodiment.

Referring to fig. 20, 21 and 22, the first plate 61 may include an opening 2010, and the third plate 63 may include an opening 2030 aligned with (or overlapping) the opening 2010 of the first plate 61. In an embodiment, the third plate 63 may include a plurality of extensions 2001, 2002, 2003 and 2004 extending from an edge of the opening 2030 to be inserted into the opening 2010 of the first plate 61. The plurality of extensions 2001, 2002, 2003, and 2004 may support the first plate 61 and help the first plate 61 and the third plate 63 to be stably coupled in a specified relative positional relationship.

According to an embodiment, the opening 2010 of the first plate 61 may be rectangular, and the first plate 61 may include four inner side surfaces included in the opening 2010. The plurality of extensions 2001, 2002, 2003 and 2004 of the third plate 63 may be positioned to correspond one-to-one with the four inner side surfaces of the first plate 61.

According to the embodiment, the bonding structure between the first plate 61 and the third plate 63 described with reference to fig. 20, 21, and 22 may be applied to the bonding structure between the first plate 61 and the fourth plate 64 (see fig. 12), the bonding structure between the fifth plate 65 (see fig. 12) and the seventh plate 67, and/or the bonding structure between the fifth plate 65 and the eighth plate 68 (see fig. 12).

According to some embodiments, the bonding structure between the first plate 61 and the third plate 63 described with reference to fig. 20, 21, and 22 may be applied to the bonding structure between the first plate 61 and the second plate 62 (see fig. 12), and/or the bonding structure between the fifth plate 65 (see fig. 12) and the sixth plate 66 (see fig. 12).

According to some embodiments, the bonding structure between the first plate 61 and the third plate 63 described with reference to fig. 20, 21 and 22 may be applied to the bonding structure between the first portion (1) (see fig. 12) of the first hinge assembly 51 and the third plate 63, and/or the bonding structure between the second portion (2) (see fig. 12) of the first hinge assembly 51 and the seventh plate 67 (see fig. 12).

According to some embodiments, the bonding structure between the first plate 61 and the third plate 63 described with reference to fig. 20, 21 and 22 may be applied to the bonding structure between the fifth portion (5) (see fig. 12) and the fourth plate 64 (see fig. 12) of the second hinge assembly 52, and/or the bonding structure between the sixth portion (6) (see fig. 12) and the eighth plate 68 (see fig. 12) of the second hinge assembly 52.

According to some embodiments, the bonding structure between the first plate 61 and the third plate 63 described with reference to fig. 20, 21 and 22 may be applied to the bonding structure between the third portion (3) (see fig. 12) of the first hinge assembly 51 and the third plate 63, and/or the bonding structure between the fourth portion (4) (see fig. 12) of the first hinge assembly 51 and the seventh plate 67 (see fig. 12).

According to some embodiments, the bonding structure between the first plate 61 and the third plate 63 described with reference to fig. 20, 21 and 22 may be applied to the bonding structure between the seventh portion (7) (see fig. 12) and the fourth plate 64 (see fig. 12) of the second hinge assembly 52, and/or the bonding structure between the eighth portion (8) (see fig. 12) and the eighth plate 68 (see fig. 12) of the second hinge assembly 52.

Referring to fig. 23, in another embodiment, the opening 2010 of the first plate 61 may be circular, and the first plate 61 may include a circular inner side surface included in the opening 2010. The plurality of extensions 2001, 2002, 2003 and 2004 of the third plate 63 may be positioned to correspond to the circular inner side surface of the first plate 61. The bonding structure between the first plate 61 and the third plate 63 is not limited to the illustrated example, and may vary. For example, the opening 2010 of the first plate 61 may be provided in an elliptical shape or various polygonal shapes such as a triangle, and the second plate 62 may include a plurality of extensions corresponding thereto.

Fig. 24 is a cross-sectional view 2400 showing the electronic device 2 in an unfolded state, taken along the line G-G' in fig. 2, according to an embodiment. Fig. 25 is a cross-sectional view 2500 showing the electronic device 2 in a folded state relative to the example of fig. 24, according to an embodiment.

Referring to fig. 24 and 25, the electronic device 2 may include a display assembly 300, a first support structure 411, a second support structure 421, a first cover member 1610, a second cover member 1620, a hinge housing 23, a first electrical path 81, a first board 61, a second board 62, a fifth board 65, and/or a sixth board 66.

According to an embodiment, the display assembly 300 may be a layer stack structure or a layer assembly in which a plurality of layers including the flexible display 30 (see fig. 2) are stacked.

According to an embodiment, the first support structure 411 may include a first support region 411A facing a front surface 20A (see fig. 2) of the electronic device 2 and a third support region 411B facing a rear surface 20B (see fig. 2) of the electronic device 2. The second support structure 421 may include a second support region 421A facing a front surface 20A (see fig. 2) of the electronic device 2 and a fourth support region 421B facing a rear surface 20B (see fig. 2) of the electronic device 2. A portion of the display assembly 300 may be disposed in a first support region 411A of the first support structure 411 to be supported by the first support structure 411. Another portion of the display assembly 300 may be disposed in the second support region 421A of the second support structure 421 to be supported by the second support structure 421. For example, the display assembly 300 may be bonded to the first support structure 411 and the second support structure 421 using various adhesive materials (such as a thermal reactive adhesive material, a photo reactive adhesive material, a general adhesive, and/or a double sided tape).

According to an embodiment, the first and second plates 61 and 62 coupled to the first support structure 411 and the fifth and sixth plates 65 and 66 coupled to the second support structure 421 may support a partial region of the display assembly 300 corresponding to the folded coverage region F (see fig. 2) in the unfolded state of the electronic device 2 (see fig. 2).

According to an embodiment, the electronic device 2 may include a first printed circuit board (e.g., a first PCB or Printed Board Assembly (PBA)) disposed in the third support region 411B of the first support structure 411 and between the first support structure 411 and the first rear cover 211 (see fig. 2). The electronic device 2 may include a first battery disposed in the third support region 411B of the first support structure 411 and between the first support structure 411 and the first rear cover 211.

According to an embodiment, the electronic device 2 may comprise a second printed circuit board (e.g. a second PCB or a second PBA) arranged in the fourth support area 421B of the second support structure 421 and between the second support structure 421 and the second back cover 221 (see fig. 2). The electronic device 2 may include a second battery disposed in the fourth support region 421B of the second support structure 421 and between the second support structure 421 and the second back cover 221.

According to some embodiments, the first PCB disposed in the first support structure 411 or the second PCB disposed in the second support structure 421 may include a main PCB, a sub PCB, and an interposer between the main PCB and the sub PCB. The interposer substrate may electrically connect the primary PCB and the secondary PCB. The interposer substrate may include, for example, a plurality of conductive vias electrically connecting the primary PCB and the secondary PCB. At least a portion of the plurality of conductive vias included in the interposer substrate may be a portion of signal lines that transmit signals between a first electronic component disposed on the primary PCB and a second electronic component disposed on the secondary PCB. In some embodiments, some of the plurality of conductive vias included in the interposer substrate may be part of a ground path that electrically connects a first ground plane included in the primary PCB and a second ground plane included in the secondary PCB.

According to an embodiment, the first electrical path 81 (e.g., FPCB) may electrically connect a first PCB disposed in the first support structure 411 and a second PCB disposed in the second support structure 421. One end of the first electrical path 81 may include a first connector 814A for electrically connecting with a first PCB, and the other end of the first electrical path 81 may include a second connector 815A for electrically connecting with a second PCB.

According to an embodiment, the first electrical path 81 may include a first region 811, a second region 812, a third region 813, a fourth region 814, and/or a fifth region 815. The first region 811 may pass through the first opening 901 of the first plate 61 to be coupled to the second plate 62. The first region 811 can be bonded to the second plate 62, for example, using bonding techniques including bonding with an adhesive material. The second region 812 may pass through the second opening 902 of the fifth plate 65 to be coupled to the sixth plate 66. The second region 812 may be bonded to the sixth plate 66, for example, using bonding techniques including bonding with an adhesive material. The first region 811 and the second region 812 may be substantially rigid. The first region 811 and the second region 812 may be provided in the form of, for example, a substantially rigid PCB. For other examples, the first region 811 and the second region 812 may include reinforcing members or reinforcing structures, such as reinforcements. In some embodiments, the first region 811 may be bonded to the second plate 62 and the second region 812 may be bonded to the sixth plate 66 using a mechanical connection such as screw fastening, rather than an adhesive member. The third region 813 may be flexible and connect the first region 811 and the second region 812. The third region 813 may be provided in the recess 231 of the hinge housing 23 to correspond to a folded portion of the foldable housing 20 (see fig. 2). The third region 813 may be modified according to a change in the state of the electronic device 2 (e.g., a switch between the unfolded state of fig. 2 and the folded state of fig. 3). The fourth region 814 may extend from the first region 811, and the first connector 814A may be disposed in the fourth region 814 or included in the fourth region 814. The fifth region 815 may extend from the second region 812, and the second connector 815A may be disposed in the fifth region 815 or included in the fifth region 815.

According to an embodiment, the hinge housing 23 may include one surface 23A corresponding to the first and second cover members 1610 and 1620. In the unfolded state of the electronic device 2 (see fig. 1), one surface 23A may not be exposed to the outside by being covered by the first cover member 1610 and the second cover member 1620. When the electronic device 2 is switched from the unfolded state to the folded state (see fig. 3), one surface 23A of the hinge housing 23 may be exposed to the outside to provide a portion of the external appearance of the electronic device 2 while the gap B (see fig. 2) between the first cover member 1610 and the second cover member 1620 is opened. When the electronic device 2 is switched from the unfolded state to the folded state, the area where the first cover member 1610 overlaps one surface 23A of the hinge housing 23 and the area where the second cover member 1620 overlaps one surface 23A of the hinge housing 23 can be reduced. In an embodiment, the first region 811 of the first electrical path 81 may be disposed between the second plate 62 and the first cover member 1610. In an embodiment, the second region 812 of the first electrical path 81 may be disposed between the sixth plate 66 and the second cover member 1620. One surface 23A of the hinge housing 23 may include one side region including a curved surface corresponding to the first cover member 1610 and another side region including a curved surface corresponding to the second cover member 1620. When viewed from a cross-section of the x-z plane shown in fig. 24 (e.g., a cross-section of the x-z plane perpendicular to the direction of the folding axis a), the first cover member 1610 may have a curved shape extending from the first end 1611 to the second end 1612 to cover one side area of one surface 23A of the hinge housing 23. The second cover member 1620 may have a curved shape extending from the third end 1621 to the fourth end 1622 to cover the other side area of the one surface 23A of the hinge housing 23 when viewed from the cross section of the x-z plane shown in fig. 24. In the deployed state of the electronic device 2, the second end 1612 of the first cover member 1610 and the fourth end 1622 of the second cover member 1620 are adjacent; accordingly, the gap B (see fig. 2) may be substantially absent, and the hinge housing 23 may not be exposed to the outside. When the electronic device 2 is switched from the unfolded state to the folded state, one surface 23A of the hinge housing 23 may be exposed to the outside to provide a portion of the external appearance of the electronic device 2 while a gap B (see fig. 2) between the second end 1612 of the first cover member 1610 and the fourth end 1622 of the second cover member 1620 is opened. In an embodiment, the first region 811 of the first electrical pathway 81 may be disposed between the first end 1611 of the first cover member 1610 and the second plate 62. The first end 1611 of the first cover member 1610 may be connected to the first support structure 411 using various methods, such as screw fastening or bonding. In an embodiment, the second region 812 of the first electrical pathway 81 may be disposed between the sixth plate 66 and the third end 1621 of the second cover member 1620. The third end 1621 of the second cover member 1620 may be connected to the second support structure 421 using various methods, such as screw fastening or bonding.

According to an embodiment, in the unfolded state (see fig. 24) of the electronic device 2, the first board assembly 6A (see fig. 4) including the first board 61, the second board 62, the third board 63 (see fig. 4) and the fourth board 64 (see fig. 4) may form an angle of about 180 degrees with the second board assembly 6B including the fifth board 65, the sixth board 66, the seventh board 67 (see fig. 4) and the eighth board 68 (see fig. 4). In the folded state of the electronic device 2 (see fig. 25), the first and second board assemblies 6A and 6B may be spaced apart from each other to face each other and form an angle of about 0 degrees to about 10 degrees, or may be disposed substantially parallel to each other. In the folded state of the electronic device 2, the second surface 602 of the first plate 61 (see fig. 4) and the tenth surface 610 of the fifth plate 65 (see fig. 4) may form an angle of about 0 degrees to about 10 degrees, or may be disposed substantially parallel to each other. In the folded state of the electronic device 2, the fourth surface 604 (see fig. 4) of the second plate 62 and the twelfth surface 612 (see fig. 4) of the sixth plate 66 may form an angle of about 0 degrees to about 10 degrees, or may be disposed substantially parallel to each other. In the folded state of the electronic device 2, the sixth surface 606 of the third plate 63 (see fig. 4) and the fourteenth surface 614 of the seventh plate 67 (see fig. 4) may form an angle of about 0 degrees to about 10 degrees, or may be disposed substantially parallel to each other. In the folded state of the electronic device 2, the eighth surface 608 of the fourth plate 64 (see fig. 4) and the sixteenth surface 616 of the eighth plate 68 (see fig. 4) may form an angle of about 0 degrees to about 10 degrees, or may be disposed substantially parallel to each other.

According to an embodiment, when viewing a cross-section of the x-z plane (e.g., a cross-section of the x-z plane perpendicular to the direction of the fold axis a), the display assembly 300 may include a bendable region 300F that overlaps a fold coverage region F (see fig. 2). The second plate 62 may include a first end region 62A corresponding to the bendable region 300F of the display assembly 300. The sixth plate 66 may include a second end region 66A corresponding to the bendable region 300F of the display assembly 300. In the unfolded state of the electronic device 2 (see fig. 24), the first end region 62A of the second plate 62 and the second end region 66A of the sixth plate 66 may support the bendable region 300F of the display assembly 300 provided in a planar form. The first end region 62A and the second end region 66A may help to enable the bendable region 300F of the display assembly 300 to remain planar in the unfolded state of the electronic device 2. In the folded state of the electronic device 2 (see fig. 25), due to the position of the folding axis a, a bendable region 300F of the display assembly 300, which is bent in the form of a bending surface, may be located between the first end region 62A of the second plate 62 and the second end region 66A of the sixth plate 66. In embodiments, other areas of the second plate 62 other than the first end area 62A and/or other areas of the sixth plate 66 other than the second end area 66A may be bonded to the display assembly 300 using an adhesive material. In some embodiments, other areas of the second plate 62 other than the first end area 62A and/or other areas of the sixth plate 66 other than the second end area 66A may be in a separate state from the display assembly 300.

Fig. 26 is a sectional view showing the first plate assembly 6A according to the embodiment.

Referring to fig. 26, the first plate assembly 6A may include a first plate 61, a second plate 62, a third plate 63, and a fourth plate 64. The second plate 62, the third plate 63, and the fourth plate 64 may be disposed in the second surface 602 of the first plate 61 or bonded to the second surface 602 of the first plate 61. The second panel 62 may be located between the third panel 63 and the fourth panel 64 in the direction of the fold axis a (see fig. 2) (e.g., y-axis direction). The portion of the third plate 63 that does not overlap the first plate 61 may be bonded to the first portion (1) of the first hinge assembly 51 (see fig. 4) when viewed in the-z-axis direction. The portion of the fourth plate 64 that does not overlap the first plate 61 may be bonded to the fifth portion (5) of the second hinge assembly 52 (see fig. 4) when viewed in the-z axis direction.

According to an embodiment, the fourth surface 604 of the second plate 62, the sixth surface 606 of the third plate 63, and the eighth surface 608 of the fourth plate 64 may support a rear surface of a display assembly (e.g., the display assembly 300 of fig. 24) along with the first support region 411A (see fig. 24) of the first support structure 411. In an embodiment, the first plate 61 may be disposed in the first support region 411A of the first support structure 411 (see fig. 4) so as not to overlap the first hinge assembly 51 and the second hinge assembly 52 when viewed in the-z axis direction, thereby becoming a bracket or base connecting the second plate 62, the third plate 63, and the fourth plate 64 supporting the display assembly to the first support structure 411. The first plate 61 may enable the second plate 62, the third plate 63, and the fourth plate 64 to be positioned apart from the first support structure 411 (fig. 4) at a designated height. The second, third and fourth plates 62, 63 and 64 are disposed in the first plate 61 and spaced apart from the first support structure 411 at a designated height to support the display assembly from sagging without substantially pressing the rear surface of the display assembly. The first plate 61 may have a first thickness T1 of about 0.5mm, but is not limited thereto.

According to an embodiment, the fourth surface 604 of the second plate 62, the sixth surface 606 of the third plate 63, and the eighth surface 608 of the fourth plate 64 of the first plate assembly 6A are support surfaces that support a display assembly (e.g., the display assembly 300 of fig. 24), and may be formed with substantially no height differences. For example, the second thickness T2 of the second plate 62, the third thickness T3 of the third plate 63, and the fourth thickness T4 of the fourth plate 64 may be substantially the same. For example, the second thickness T2, the third thickness T3, and/or the fourth thickness T4 may be about 0.2mm, but is not limited thereto.

According to some embodiments, the third thickness T3 of the third plate 63 and the fourth thickness T4 of the fourth plate 64 may be substantially the same, and the second thickness T2 of the second plate 62 may be less than the third thickness T3 and the fourth thickness T4. The fourth surface 604 of the second plate 62 may be further spaced apart from the rear surface of the display assembly (e.g., the display assembly 300 of fig. 24) than the sixth surface 606 of the third plate 63 and the eighth surface 608 of the fourth plate 64. In this case, an additional member may be provided in the fourth surface 604. The additional member may support the rear surface of the display assembly instead of the fourth surface 604. In an embodiment, the additional member may be a ninth plate (not shown) disposed in the fourth surface 604. The ninth plate may be positioned between the third plate 63 and the fourth plate 64 when viewed from above the first support region 411A (see fig. 12) of the first support structure 411. The ninth plate may be interpreted as a part of the first plate assembly 6A. The ninth plate may comprise a metallic material and/or a non-metallic material. In the case where the ninth plate includes a metallic material, the ninth plate may be bonded to the second plate 62 using welding. For another example, the ninth plate may be bonded to the second plate 62 using a bonding technique that includes bonding with an adhesive material. For another example, the ninth plate may be coupled to the second plate 62 and/or the first plate 61 using screws. There may be substantially no height difference between the support surface of the ninth plate supporting the rear surface of the display assembly and the sixth surface 606 of the third plate 63 and between the support surface of the ninth plate supporting the rear surface of the display assembly and the eighth surface 608 of the fourth plate 64.

Although not shown, the second plate assembly 6B (see fig. 4) may be provided substantially the same as or similar to the first plate assembly 6A described with reference to fig. 26.

Referring to fig. 27, the electronic device 2 may include a display assembly 300, a first plate 61, a second plate 62, a fifth plate 65, a sixth plate 66, a first reinforcing plate 2711, a second reinforcing plate 2712, a first adhesive member 2721, and/or a second adhesive member 2722.

According to an embodiment, the display assembly 300 may include a front cover 201, an optically transparent adhesive member 202, and a flexible display 30. The flexible display 30 may be bonded to the front cover 201 using an optically transparent adhesive member 202, such as an optically transparent adhesive (OCA), optically transparent resin (OCR), or super-visible resin (SVR). The front cover 201 (e.g., window) may cover the flexible display 30 to protect the flexible display 30 from the outside. The front cover 201 may be implemented in a film form (e.g., a film layer) having flexibility. The front cover 201 may include, for example, a plastic film (e.g., polyimide film) or a thin film glass (e.g., ultra thin glass). In some embodiments, the bezel 201 may include multiple layers. For example, the front cover 201 may be in the form of various coatings provided in a plastic film or a film glass. For example, the front cover 201 may be in the form of at least one protective layer or coating comprising a polymeric material, such as Polyester (PET), polyimide (PI), or Thermoplastic Polyurethane (TPU), disposed in a plastic film or film glass. In some embodiments, the bezel 201 may define or interpret as a component included in the flexible display 30. The flexible display 30 may include, for example, a display panel 31, a base film 32, a support sheet 33, a lower panel 34, and/or an optical layer 35. The display panel 31 may be disposed between the optical layer 35 and the base film 32. The base film 32 may be disposed between the display panel 31 and the support sheet 33. The support sheet 33 may be disposed between the base film 32 and the lower panel 34. The optical layer 35 may be disposed between the optically transparent adhesive member 202 and the display panel 31. Adhesive members (not shown) of various polymers may be provided between the display panel 31 and the base film 32, between the base film 32 and the support sheet 33, between the support sheet 33 and the lower panel 34, and/or between the display panel 31 and the optical layer 35.

The display panel 31 may include, for example, a light emitting layer 31a, a Thin Film Transistor (TFT) film 31b, and/or a package (e.g., thin film package (TFE)) 31c. The light emitting layer 31a may include, for example, a plurality of pixels implemented as light emitting elements such as OLEDs or micro LEDs. The light emitting layer 31a may be disposed on the TFT film 31b by evaporation of an organic material. The TFT film 31b may be disposed between the light emitting layer 31a and the base film 32. The TFT film 31b may refer to a film structure in which at least one TFT is disposed on a flexible substrate (e.g., PI film) through a series of processes such as deposition, patterning, and etching. At least one TFT may control a current to a light emitting element of the light emitting layer 31a to adjust on/off of a pixel or brightness of the pixel. At least one of the TFTs may be implemented as, for example, an amorphous silicon (a-Si) TFT, a Liquid Crystal Polymer (LCP) TFT, a Low Temperature Poly Oxide (LTPO) TFT, or a Low Temperature Poly Silicon (LTPS) TFT. The display panel 31 may include a storage capacitor that may hold a voltage signal in a pixel, hold a voltage that enters the pixel within one frame, or reduce a variation in gate voltage of a TFT due to leakage during a light emission time. The storage capacitor may hold a voltage applied to the pixel for a predetermined time interval by a routine (e.g., initialization, data writing) that controls at least one TFT. In an embodiment, the display panel 31 may be implemented based on an OLED, and the encapsulation 31c may cover the light emitting layer 31a. Because organic materials and electrodes that emit light in the OLED may react very sensitively to oxygen and/or moisture to lose their light emitting properties, the encapsulation 31c may seal the light emitting layer 31a so that oxygen and/or moisture does not penetrate into the OLED. The package 31c may serve as a pixel protection layer for protecting a plurality of pixels of the light emitting layer 31a.

The base film 32 may comprise, for example, a flexible film made from a plastic or polymer such as polyimide or Polyester (PET). The base film 32 may serve to support and protect the display panel 31. In some embodiments, the base film 32 may be referred to by other terms, such as "protective film," back film, "or" backsheet.

According to an embodiment, the support sheet 33 may contribute to the durability of the display assembly 300 or the flexible display 30. The support sheet 33 may reduce the impact of loads or stresses on the flexible display 30 that may occur, for example, in switching between the unfolded state of fig. 2 and the folded state of fig. 3. The support sheet 33 may be made of various metallic and/or non-metallic materials (e.g., polymers). The support sheet 33 may comprise, for example, stainless steel. For another example, the support sheet 33 may comprise engineering plastic.

According to an embodiment, the support sheet 33 may include a mesh structure provided in a portion corresponding to the folded coverage area F (see fig. 2). The lattice structure may include, for example, a plurality of openings (or slits) 331. For example, the plurality of openings 331 may be periodically provided, have substantially the same shape, and be repeatedly arranged at regular intervals. In some embodiments, the mesh structure including the plurality of openings 331 may be referred to as an "opening pattern". The mesh structure may contribute to the flexibility of the portion of the display assembly 300 corresponding to the folded coverage area F. In some embodiments, the support sheet 33 may include a recess pattern (not shown) including a plurality of recesses, instead of the mesh structure. The recess pattern may include, for example, a plurality of recesses provided on a surface facing the base film 32 or a surface opposite the base film 32. In some embodiments, the mesh structure or the pattern of recesses contributing to the flexibility of the display assembly 300 may further extend to other portions. In some embodiments, the support sheet 33 or corresponding conductive member comprising a grid structure or a pattern of recesses may be formed in multiple layers.

According to some embodiments, the support sheet 33 may be disposed at the rear surface of the flexible display 30. For example, the support sheet 33 may be disposed at a rear surface of the lower panel 34 included in the flexible display 30. In some embodiments, the support sheet 33 may be defined or interpreted as a separate component from the flexible display 30. In some embodiments, the support sheet 33 may be omitted.

The lower panel 34 may include multiple layers, for example, for various functions. Various polymeric adhesive members (not shown) may be disposed between the various layers included in the lower panel 34. The lower panel 34 may include, for example, a light blocking layer 341, a buffer layer 342, a lower layer 343, and/or an electromagnetic induction panel 344. The light blocking layer 341 may be disposed between the support sheet 33 and the buffer layer 342. The buffer layer 342 may be disposed between the light blocking layer 341 and the electromagnetic induction panel 344. The electromagnetic induction panel 344 may be disposed between the buffer layer 342 and the lower layer 343. The light blocking layer 341 may block at least a portion of light incident from the outside. For example, the light blocking layer 341 may include an embossed (embos) layer. The embossed layer may be a black layer including a non-uniform pattern. The buffer layer 342 may alleviate external impact applied to the flexible display 30. For example, the buffer layer 342 may include a sponge layer or a cushion layer. The lower layer 343 may diffuse, disperse, or dissipate heat generated in the electronic device 2 or the flexible display 30. The lower layer 343 may absorb or shield electromagnetic waves. The lower layer 343 may mitigate external impact applied to the electronic device 2 or the flexible display 30. For example, the lower layer 343 may include a composite sheet 343a or a conductive sheet 343b. In an embodiment, the composite sheet 343a can be a sheet processed by combining layers or sheets having different properties. For example, the composite sheet 343a can comprise at least one of polyimide or graphite. The composite sheet 343a can be replaced by a single sheet comprising one material (e.g., polyimide or graphite). The composite sheet 343a can be disposed between the electromagnetic induction panel 344 and the conductive sheet 343b. The conductive sheet 343b can reduce or shield electromagnetic interference (EMI) to the flexible display 30. The conductive sheet 343b can include copper, but is not limited thereto, and can include various other metallic materials. In some embodiments, at least a portion of the lower layer 343 is a conductive member (e.g., a metal plate) that can help to enhance the rigidity of the electronic device 2 and serve to shield ambient noise and dissipate heat emitted from a peripheral heat sink component (e.g., display driver circuit (e.g., DDI)). The conductive member may include, for example, at least one of copper (Cu), aluminum (Al), stainless steel (SUS), or CLAD (e.g., a laminated member in which SUS and Al are alternately disposed). The lower layer 343 can include various layers for various other functions.

According to an embodiment, the electromagnetic induction panel 344 (e.g., digitizer) may be implemented in a form such as a flexible film or sheet. The electromagnetic induction panel 344 may be provided as, for example, a flexible PCB. When alternating current is supplied to the electromagnetic induction panel 344, an electromagnetic field may be formed using a plurality of electrode patterns included in the electromagnetic induction panel 344. The pen input device may be implemented in an electromagnetic induction scheme (e.g., an electromagnetic resonance (EMR) scheme). The pen input device includes a resonant circuit, and the resonant circuit may interact with the electromagnetic induction panel 344. When the pen tip of the pen input device is brought close to the front surface 20A (see fig. 2) of the electronic device 2, an electric current may flow to a coil included in a resonance circuit of the pen input device by electromagnetic induction. The pen input device may use energy supplied from the electromagnetic induction panel 344 to generate a signal (e.g., a radio frequency signal) related to user input on the screen (e.g., a position signal, a pen pressure signal, and/or an angle signal) and transmit the signal to the screen (e.g., the electromagnetic induction panel 344). The electromagnetic induction panel 344 may include a shielding sheet. The shielding sheet may be positioned at a rear surface of the flexible PCB including a plurality of electrode patterns (e.g., a surface of the flexible PCB facing the conductive sheet 343b in the illustrated embodiment). The shielding sheet can prevent interference between components included in the electronic device 2 due to electromagnetic fields generated in the components. The shield sheet may block electromagnetic fields generated in the assembly, thereby enabling input from the pen input device to be accurately transmitted to the coil included in the electromagnetic induction panel 344. In some embodiments, the electromagnetic induction panel 344 may be located between the conductive sheet 343b and the composite sheet 343a of the lower layer 343. In some embodiments, electromagnetic induction panel 344 may be located between light blocking layer 341 and buffer layer 342. In some embodiments, the electromagnetic induction panel 344 may be defined or interpreted as a component included in the flexible display 30. According to some embodiments, the pen input device may be implemented in an Active Electric Stylus (AES) scheme or an Electrically Coupled Resonance (ECR) scheme. In this case, the electromagnetic induction panel 344 may be omitted.

The optical layer 35 may comprise, for example, a polarizing layer (or polarizer) or a retarder layer (or retarder). The polarizing layer and the retarder layer may improve outdoor visibility of the screen. The optical layer 35 may selectively transmit light generated in a light source of the display panel 31 and vibrated in a predetermined direction, for example. In some embodiments, a single layer may be provided in which the polarizing layer and the retarder layer are combined, and such a layer may be defined as a "circularly polarizing layer. In some embodiments, the polarizing layer (or circularly polarizing layer) may be omitted, in which case a black Pixel Defining Layer (PDL) and/or color filters may be included instead of the polarizing layer.

According to some embodiments, although not shown, at least one additional polymer layer (e.g., a layer including PI, PET, or TPU) may be disposed at the rear surface of the display panel 31 in addition to the base film 32. In various embodiments, at least one of the plurality of layers (e.g., the light blocking layer 341, the buffer layer 342, the composite sheet 343a, the conductive sheet 343b, and the electromagnetic induction panel 344) included in the lower panel 34 may be omitted. In some embodiments, the arrangement order of the plurality of layers included in the lower panel 34 is not limited to the illustrated example, and may be variously changed.

According to an embodiment, the display assembly 300 may include touch sensing circuitry (e.g., a touch sensor) (not shown). The touch sensing circuitry may be implemented as a transparent conductive layer (or film) based on various conductive materials, such as Indium Tin Oxide (ITO). For example, a touch sensing circuit may be disposed between the front cover 201 and the optical layer 35 (e.g., add-on type). For another example, a touch sensing circuit may be disposed between the optical layer 35 and the display panel 31 (e.g., on-cell type). For another example, the display panel 31 may include a touch sensing circuit or a touch sensing function (e.g., in-cell type). In an embodiment (not shown), the flexible display 30 is a touch sensing circuit disposed on the package 31c between the package 31c and the optical layer 35, and may include a conductive pattern such as a metal mesh (e.g., an aluminum metal mesh). For example, to correspond to the bending of the flexible display 30, the durability of the metal mesh may be better than that of the transparent conductive layer implemented with ITO. In some embodiments, the flexible display 30 may also include a pressure sensor (not shown) capable of measuring the intensity (pressure) of a touch. The display panel 31 or the plurality of layers included in the lower panel 34, their laminated structure or the lamination order may be changed. The flexible display 30 may be implemented by omitting some components or by adding other components according to its arrangement form or fusion trend.

According to an embodiment, the display assembly 300 may include a recess 2701 provided at a rear surface of the display assembly 300 corresponding to the bendable region 300F (see fig. 24). For example, the lower panel 34 of the flexible display 30 may be implemented in a form in which a portion included in the bendable region 300F of the display assembly 300 is removed; thus, the recess 2701 provided at the rear surface of the display assembly 300 can be realized. For example, because the electromagnetic induction panel 344 does not extend in the portion including the recess 2701 in the bendable region 300F of the display assembly 300, it may be difficult to input (or recognize) using a pen input device. The recess 2701 may reduce bending stress generated in the bendable region 300F of the display assembly 300 in a folded state of the electronic device 2 (see fig. 3). Bending stresses may occur when an increased force (e.g., tensile stress) on one surface of the bendable region 300F collides with a decreased force (e.g., compressive stress) on the other surface of the bendable region 300F. When a bending stress equal to or greater than the yield stress occurs in the bendable region 300F, breakage or permanent deformation of the bendable region 300F may occur. When the switching of the electronic device 2 between the unfolded state (see fig. 2) and the folded state (see fig. 3) is repeated, the bending stress generated in the bendable region 300F may cause a reduction or loss of the elastic force due to the fatigue accumulation, resulting in a fracture or permanent deformation of the bendable region 300F. The bending stress that occurs in the bendable region 300F may be proportional, for example, to the longitudinal elastic modulus (e.g., the degree of stretch or compression resistance) of the bendable region 300F and/or the thickness of the bendable region 300F. The bending stress that occurs in the bendable region 300F may be inversely proportional to the radius of curvature, for example. The recess 2701 may reduce the thickness of the bendable region 300F to reduce bending stress generated in the bendable region 300F and reduce breakage of the bendable region 300F. In some embodiments, where the physical properties of the bendable region 300F are configured to reduce breakage or permanent deformation of the bendable region 300F, the recess 2701 may be omitted. The lower panel 34 extends further to the bendable region 300F; thus, the recess 2701 may not be provided, and in contrast to the embodiment including the recess 2701, input (or recognition) through the bendable region 300F may be performed using a pen input device. In some embodiments, the recess 2701 may be provided by omitting some of the plurality of layers included in the lower panel 34. For example, a portion of the lower layer 343 may be provided by omitting to correspond to the bendable region 300F of the plurality of layers included in the lower panel 34.

According to an embodiment, the first reinforcing plate 2711 may be bonded to the second plate 62 using a first adhesive member 2721. The second reinforcing plate 2712 may be bonded to the sixth plate 66 using a second adhesive member 2722. The first and second reinforcing plates 2711 and 2712 may not overlap the recess 2701 when the electronic device 2 is viewed from above the display assembly 300 in the unfolded state (for example, when viewed in the-z axis direction). The first reinforcing plate 2711 may reinforce or support the first plate assembly 6A as a reinforcement. The second reinforcing plate 2712 may reinforce or support the second plate assembly 6B as a reinforcement. In some embodiments, the lower panel 34 may further extend to the bendable region 300F; therefore, the recess 2701 may not be provided. In this case, the first and second reinforcement plates 2711 and 2712 may further extend to the bendable region 300F.

According to an embodiment, the first reinforcement plate 2711 and the first adhesive member 2721 may reduce a separation space between the second plate 62 and the rear surface of the flexible display 30, and the first reinforcement plate 2711 may support the rear surface of the flexible display 30 instead of the second plate 62. In some embodiments, first reinforcement plate 2711 and first adhesive member 2721 may be construed as part of first plate assembly 6A (see fig. 4). The first reinforcing plate 2711 may include a metallic material or a non-metallic material.

According to some embodiments, in the case where there is substantially no separation space between the second plate 62 and the rear surface of the flexible display 30, or in the case where the second plate 62 is provided to support the rear surface of the flexible display 30, the first reinforcing plate 2711 and the first adhesive member 2721 may be omitted.

According to an embodiment, the second reinforcement plate 2712 and the second adhesive member 2722 may reduce a separation space between the sixth plate 66 and the rear surface of the flexible display 30, and the second reinforcement plate 2712 may support the rear surface of the flexible display 30 instead of the sixth plate 66. In some embodiments, the second reinforcing plate 2712 and the second adhesive member 2722 may be interpreted as a part of the second plate assembly 6B (see fig. 4). The second reinforcing plate 2712 may include a metallic material or a non-metallic material.

According to some embodiments, in the case where there is substantially no separation space between the sixth plate 66 and the rear surface of the flexible display 30, or in the case where the sixth plate 66 is provided to support the rear surface of the flexible display 30, the second reinforcing plate 2712 and the second adhesive member 2722 may be omitted.

According to example embodiments of the present document, an electronic device (e.g., electronic device 2 of fig. 2) may include a first housing (e.g., first housing 21 of fig. 2), a second housing (e.g., second housing 22 of fig. 2), and a foldable housing (e.g., foldable housing 20 of fig. 2) including a folded portion between the first housing and the second housing. The electronic device may include a foldable display (e.g., flexible display 30 of fig. 2) located in the interior space of the foldable housing. The flexible display is visible through the front surface of the collapsible housing. The electronic device may include a first support structure (e.g., first support structure 411 of fig. 4) located in the interior space of the first housing. The first support structure may support a portion of the flexible display. The electronic device may include a second support structure (e.g., second support structure 421 of fig. 4) located in the interior space of the second housing. The second support structure may support a portion of the flexible display. The electronic device may include a first hinge assembly (e.g., the first hinge assembly 51 of fig. 4) and a second hinge assembly (e.g., the second hinge assembly 52 of fig. 4) located in the interior space of the foldable housing to correspond to the folded portion. The first hinge assembly and the second hinge assembly may connect the first support structure and the second support structure to be positioned to be spaced apart from each other in a direction of a folding axis of the folding portion. The electronic device may include a first board assembly (e.g., first board assembly 6A of fig. 4) located in the interior space of the foldable housing and corresponding to the folded portion. The first plate assembly may include a first plate (e.g., first plate 61 of fig. 4), a second plate (e.g., second plate 62 of fig. 4), a third plate (e.g., third plate 63 of fig. 4), and a fourth plate (e.g., fourth plate 64 of fig. 4). The first plate may be coupled to the first support structure and support a portion of the flexible display corresponding to the folded portion. The first plate may include a first surface (not shown) facing the first support structure and a second surface (e.g., second surface 602 of fig. 4) facing a direction opposite the direction of the first surface. The first plate may be located between the first hinge assembly and the second hinge assembly. The second plate may include a third surface (not shown) facing the second surface and a fourth surface (e.g., fourth surface 604 of fig. 4) facing a direction opposite to the direction of the third surface. The third plate may include a fifth surface (not shown) and a sixth surface (e.g., sixth surface 606 of fig. 4) facing in a direction opposite to the direction of the fifth surface. The fifth surface may face the first surface and the first hinge assembly. The third plate may not overlap the second plate when viewed from above the sixth surface. The fourth plate may include a seventh surface (not shown) and an eighth surface (e.g., eighth surface 608 of fig. 4) facing in a direction opposite to the direction of the seventh surface. The seventh surface may face the first surface and the second hinge assembly. The fourth plate may not overlap the second plate when viewed from above the eighth surface. The second plate may be located between the third plate and the fourth plate when viewed from above the fourth surface.

According to example embodiments of the present document, the first plate (e.g., first plate 61 of fig. 4) and the second plate (e.g., second plate 62 of fig. 4) may be bonded using welding.

According to example embodiments of the present document, a screw (e.g., the eighteenth screw S18 of fig. 8) may pass through a screw hole (e.g., the eighteenth screw hole H18 of fig. 9) provided in the first plate (e.g., the first plate 61 of fig. 8) to be coupled to a screw fastening part provided in the first support structure (e.g., the first support structure 411 of fig. 8).

According to example embodiments of the present document, the second plate (e.g., second plate 62 of fig. 8) may include an opening (e.g., opening 1018 of fig. 10) that overlaps with the screw hole (e.g., eighteenth screw hole H18 of fig. 9) of the first plate (e.g., first plate 61 of fig. 8).

According to example embodiments of the present document, a screw (e.g., thirteenth screw S13 of fig. 12) may pass through a screw hole (e.g., thirteenth screw hole H13 of fig. 9) provided in the first plate (first plate 61 of fig. 12) and a screw hole provided in the third plate (e.g., third plate 63 of fig. 12) to be coupled to a screw fastening portion provided in the first support structure (e.g., first support structure 411 of fig. 12).

According to example embodiments of the present document, a screw (e.g., the third screw S3 of fig. 12) may pass through a screw hole provided in a third plate (e.g., the third plate 63 of fig. 12) and a screw hole (e.g., the third screw hole H3 of fig. 7) provided in a first hinge assembly (e.g., the first hinge assembly 51 of fig. 12) to be coupled to a screw fastening part provided in a first support structure (e.g., the first support structure 411 of fig. 12).

According to example embodiments of the present document, a screw (e.g., the seventh screw S7 of fig. 12) may pass through a screw hole provided in a fourth plate (e.g., the fourth plate 64 of fig. 12) and a screw hole provided in a second hinge assembly (e.g., the second hinge assembly 52 of fig. 12) to be coupled to a screw fastening part provided in a second support structure (e.g., the second support structure 421 of fig. 12).

According to example embodiments of the present document, a first hinge assembly (e.g., first hinge assembly 51 of fig. 4) may include a first rotating member, a first hinge arm, and a first actuating member (e.g., first actuating member 511 of fig. 4). The first rotation member may include a first portion (e.g., first portion (1) of fig. 4) coupled to a first support structure (e.g., first support structure 411 of fig. 4) and a second portion (e.g., second portion (2) of fig. 4) coupled to a second support structure (e.g., second support structure 421 of fig. 4). The first hinge arm may include a third portion (e.g., third portion (3) of fig. 4) connected to the first portion and a fourth portion (e.g., fourth portion (4) of fig. 4) connected to the second portion. The first actuator may connect the third portion and the fourth portion. The first actuator may include a gear assembly for providing a driving force for the rotational movement between the third and fourth portions using the elasticity of the torsion spring. The second hinge assembly (e.g., second hinge assembly 52 of fig. 4) may include a second rotating member, a second hinge arm, and a second actuating member (e.g., second actuating member 521 of fig. 4). The second rotation member may include a fifth portion (e.g., fifth portion (5) of fig. 4) coupled to the first support structure and a sixth portion (e.g., sixth portion (6) of fig. 4) coupled to the second support structure. The second hinge arm may include a sixth portion (e.g., seventh portion (7) of fig. 4) connected to the fifth portion and an eighth portion (e.g., eighth portion (8) of fig. 4) connected to the sixth portion. The second actuator may connect the seventh portion and the eighth portion. The second actuator may comprise a gear assembly for providing a driving force for a rotational movement between the seventh and eighth portions using the elasticity of the torsion spring. The first hinge arm and the second hinge arm may be located between the first rotating member and the second rotating member.

According to example embodiments of the present document, the first plate may be located between the first hinge arm (e.g., the third portion (3) and the fourth portion (4) of fig. 12) and the second hinge arm (e.g., the seventh portion (7) and the eighth portion (8) of fig. 12) when viewed from above the second surface (e.g., the second surface 602 of fig. 8). Screws (e.g., third screw S3 of fig. 12) may pass through screw holes provided in a third plate (e.g., third plate 63 of fig. 12) and screw holes (e.g., third screw hole H3 of fig. 7) provided in a first portion (e.g., first portion (1) of fig. 12) to be coupled to screw fastening portions provided in a first support structure (e.g., first support structure 411 of fig. 12). Screws (e.g., seventh screw S7 of fig. 12) may pass through screw holes provided in a fourth plate (e.g., fourth plate 64 of fig. 12) and screw holes provided in a fifth portion (e.g., fifth portion (5) of fig. 12) to be coupled to screw fastening portions provided in the first support structure.

According to example embodiments of the present document, the third plate (e.g., third plate 63 of fig. 13) may include openings (e.g., openings 1501 and 1503 of fig. 13) that prevent the third plate from interfering with a portion of the first actuator (e.g., first actuator 511 of fig. 4). The fourth plate (e.g., fourth plate 64 of fig. 12) may include openings that prevent the fourth plate from interfering with a portion of the second actuation member (e.g., second actuation member 521 of fig. 4).

According to an example embodiment of the present document, the folding portion may include a hinge housing (e.g., hinge housing 23 of fig. 4) for covering the first hinge assembly and the second hinge assembly, and a rail assembly (e.g., rail assembly 7 of fig. 4) disposed in the hinge housing and located between the first hinge assembly and the second hinge assembly. When the foldable housing is switched from the unfolded state to the folded state, the hinge housing may be exposed to the outside to provide a portion of an outer surface of the electronic device. The rail assembly may include a rail structure (e.g., rail structure 71 of fig. 4, 16, and 17) and a slider structure (e.g., first slider structure 72 of fig. 4 and 16). The rail structure may be coupled to the hinge housing. The slider structure may be coupled to the first plate. The slider structure may comprise a slider that is movable by being guided to a guide rail provided in the guide rail structure. Screws (e.g., seventeenth screws S17 of fig. 16) may pass through screw holes (e.g., seventeenth screw holes H17 of fig. 16) provided in the first plate (e.g., first plate 61 of fig. 16) to be coupled to screw fastening portions (e.g., seventeenth screw fastening portions B17 of fig. 16) provided in the rail structure.

According to example embodiments of the present document, the second plate (e.g., second plate 62 of fig. 16) may include an opening (e.g., opening 1017 of fig. 16) that overlaps with the screw hole (e.g., seventeenth screw hole H17 of fig. 16) of the first plate (e.g., first plate 61 of fig. 16).

According to an example embodiment of the present document, a screw (e.g., the twenty-first screw S21 of fig. 17) may pass through a screw hole (e.g., the twenty-first screw hole H21 of fig. 17) provided in a guide rail structure (e.g., the guide rail structure 71 of fig. 17) to be coupled to a screw fastening portion (e.g., the screw fastening portion B21 of fig. 17) provided in a hinge housing (e.g., the hinge housing 23 of fig. 17). The first plate (e.g., first plate 61 of fig. 21) and the second plate (e.g., second plate 62 of fig. 21) may include openings (e.g., opening 921 of fig. 9 and opening 1021 of fig. 10) that overlap with screw holes (e.g., twenty-first screw hole H21 of fig. 21) provided in the rail structure.

According to example embodiments of the present document, an electronic device may include a flexible PCB (e.g., first electrical path 81 or second electrical path 82 of fig. 4) located in an interior space of a foldable housing (e.g., foldable housing 20 of fig. 2). The flexible PCB may electrically connect a first electronic component housed in a first housing (e.g., first housing 21 of fig. 2) and a second electronic component housed in a second housing (e.g., second housing 22 of fig. 2). The flexible PCB may extend between a first board assembly (e.g., the first board assembly 6A of fig. 4) and a hinge housing (e.g., the hinge housing 23 of fig. 4). A portion of the flexible PCB (e.g., the first region 811 of fig. 24) may pass through an opening (e.g., the first opening 901 of fig. 24) provided in a first board (e.g., the first board 61 of fig. 24) to be coupled to a second board (e.g., the second board 62 of fig. 24).

According to example embodiments of the present document, the first plate (e.g., first plate 61 of fig. 20) may include a first opening (e.g., opening 2010 of fig. 20). The third plate (e.g., third plate 63 of fig. 20) may include a second opening (e.g., opening 2030 of fig. 20) that overlaps the first opening. The third plate may include one or more extensions (e.g., the plurality of extensions 2001, 2002, 2003, and 2004 of fig. 20) extending from the edge of the second opening and inserted into the first opening to support the first plate.

According to example embodiments of the present document, the electronic device may include a second board assembly (e.g., second board assembly 6B of fig. 4). The second panel assembly may be located in an interior space of a foldable housing (e.g., foldable housing 20 of fig. 4) corresponding to the folded portion. The second plate assembly may be coupled to a second support structure (e.g., second support structure 421 of fig. 4). The second plate assembly may support a portion of a flexible display (e.g., flexible display 30 of fig. 2) corresponding to the folded portion. In the unfolded state of the foldable housing, the first plate assembly (e.g., the first plate assembly 6A of fig. 4) and the second plate assembly may form an angle of 180 degrees. In the folded state of the foldable housing, the first plate assembly and the second plate assembly may form an angle of 0 to 10 degrees. The second plate assembly may include a fifth plate (e.g., fifth plate 65 of fig. 4), a sixth plate (e.g., sixth plate 66 of fig. 4), a seventh plate (e.g., seventh plate 67 of fig. 4), and an eighth plate (e.g., eighth plate 68 of fig. 4). The fifth plate may include a ninth surface (not shown) facing the second support structure (e.g., second support structure 421 of fig. 4) and a tenth surface (e.g., tenth surface 610 of fig. 4) facing a direction opposite to the direction of the ninth surface. The fifth plate may be located between the first hinge assembly and the second hinge assembly. The sixth plate may include an eleventh surface (not shown) facing the tenth surface and a twelfth surface (e.g., twelfth surface 612 of fig. 4) facing a direction opposite to the direction of the eleventh surface. The seventh plate may include a thirteenth surface (not shown) and a fourteenth surface (e.g., fourteenth surface 614 of fig. 4) facing in a direction opposite the direction of the thirteenth surface. The thirteenth surface may face the tenth surface and the first hinge assembly (e.g., the first hinge assembly 51 of fig. 4). The seventh plate may not overlap the sixth plate when viewed from above the fourteenth surface. The eighth plate may include a fifteenth surface (not shown) and a sixteenth surface (e.g., sixteenth surface 616 of fig. 4) facing in a direction opposite the direction of the fifteenth surface. The fifteenth surface may face the tenth surface and a second hinge assembly (e.g., second hinge assembly 52 of fig. 4). The eighth plate may not overlap the sixth plate when viewed from above the sixteenth surface. The sixth plate may be located between the seventh plate and the eighth plate when viewed from above the twelfth surface.

According to example embodiments of the present document, the fifth plate (e.g., fifth plate 65 of fig. 4) and the sixth plate (e.g., sixth plate 66 of fig. 4) may be bonded using welding.

According to example embodiments of the present document, a screw (e.g., the twentieth screw S20 of fig. 8) may pass through a screw hole (e.g., the twentieth screw hole S20 of fig. 9) provided in a fifth plate (e.g., the fifth plate 65 of fig. 8) to be coupled to a screw fastening portion provided in a second support structure (e.g., the second support structure 421 of fig. 8). The sixth plate (e.g., sixth plate 66 of fig. 8) may include an opening (e.g., opening 1020 of fig. 10) overlying the screw hole of the fifth plate.

According to example embodiments of the present document, a screw (e.g., fifteenth screw S15 of fig. 12) may pass through a screw hole (e.g., fifteenth screw hole H15 of fig. 9) provided in a fifth plate (e.g., fifth plate 65 of fig. 12) and a screw hole provided in a seventh plate (e.g., seventh plate 67 of fig. 12) to be coupled to a screw fastening portion provided in a second support structure (e.g., second support structure 421 of fig. 12).

According to example embodiments of the present document, a screw (e.g., the fourth screw S4 of fig. 12) may pass through a screw hole provided in a seventh plate (e.g., the seventh plate 67 of fig. 12) and a screw hole (e.g., the fourth screw hole H4 of fig. 7) provided in a first hinge assembly (e.g., the first hinge assembly 51 of fig. 12) to be coupled to a screw fastening part provided in a first support structure (e.g., the first support structure 411 of fig. 12). Screws (e.g., eighth screw S8 of fig. 12) may pass through screw holes provided in an eighth plate (e.g., eighth plate 68 of fig. 12) and screw holes provided in a second hinge assembly (e.g., second hinge assembly 52 of fig. 12) to be coupled to screw fastening portions provided in a second support structure (e.g., second support structure 421 of fig. 12).

According to example embodiments of the present document, the electronic device may further include a flexible PCB (e.g., the first electrical path 81 or the second electrical path 82 of fig. 4) located in an interior space of the foldable housing (e.g., the foldable housing 20 of fig. 2). The folded portion may include a hinge housing (e.g., hinge housing 23 of fig. 4) that covers a first hinge assembly (e.g., first hinge assembly 51 of fig. 4) and a second hinge assembly (e.g., second hinge assembly 52 of fig. 4). When the foldable housing is switched from the unfolded state to the folded state, the hinge housing may be exposed to the outside to provide a portion of an outer surface of the electronic device. The flexible PCB may electrically connect a first electronic component housed in a first housing (e.g., first housing 21 of fig. 2) and a second electronic component housed in a second housing (e.g., second housing 22 of fig. 2). The flexible PCB may extend between a first board assembly (e.g., the first board assembly 6A of fig. 4) and the hinge housing and between a second board assembly (e.g., the second board assembly 6B of fig. 4) and the hinge housing. The flexible PCB may include a first region (e.g., first region 811 of fig. 24), a second region (e.g., second region 812 of fig. 24), and a third region (e.g., third region 813 of fig. 24). The first region may pass through an opening (e.g., opening 901 of fig. 24) provided in a first plate (e.g., first plate 61 of fig. 24) to be coupled to a second plate (e.g., second plate 62 of fig. 24). The second region may pass through an opening (e.g., second opening 902 of fig. 24) provided in a fifth plate (e.g., fifth plate 65 of fig. 24) to be coupled to a sixth plate (e.g., sixth plate 66 of fig. 24). The third region may connect the first region and the second region and be located in a recess (e.g., recess 231 of fig. 24) of the hinge housing.

The embodiments disclosed in this document and the drawings present only specific examples to easily describe technical contents and aid understanding of the embodiments, and are not intended to limit the scope of the embodiments. Thus, changes or modifications, in addition to the embodiments disclosed herein, should be construed as being included within the scope of the various embodiments of the present document.

Claims

1. An electronic device, comprising:

a foldable housing comprising a first housing, a second housing, and a folded portion between the first housing and the second housing;

a flexible display located in an interior space of the foldable housing and visible through a front surface of the foldable housing;

a first support structure located in an interior space of the first housing and configured to support a first portion of the flexible display;

a second support structure located in an interior space of the second housing and configured to support a second portion of the flexible display;

a first hinge assembly and a second hinge assembly located in the inner space of the foldable housing to correspond to the folding portion, configured to connect the first support structure and the second support structure, and spaced apart from each other in a direction of a folding axis of the folding portion; and

A first board assembly located in the inner space of the foldable housing to correspond to the folded portion, coupled to the first support structure, and configured to support a third portion of the flexible display corresponding to the folded portion,

wherein the first plate assembly comprises:

a first plate including a first surface facing the first support structure and a second surface facing a direction opposite to the direction of the first surface and located between the first hinge assembly and the second hinge assembly;

a second plate including a third surface facing the second surface and a fourth surface facing a direction opposite to the direction of the third surface;

a third plate including a fifth surface facing the first surface and the first hinge assembly and a sixth surface facing in a direction opposite to the direction of the fifth surface; and

a fourth plate including a seventh surface and an eighth surface facing in a direction opposite to that of the seventh surface, the seventh surface facing the first surface and the second hinge assembly,

wherein the second plate is configured to be located between the third plate and the fourth plate when viewed from above the fourth surface.

2. The electronic device of claim 1, wherein the first and second plates are configured to be bonded using solder.

3. The electronic device of claim 1, wherein a screw is configured to pass through a screw hole provided in the first plate to be coupled to a screw fastening portion provided in the first support structure.

4. The electronic device of claim 3, wherein the second plate includes an opening that overlaps the screw hole of the first plate.

5. The electronic device of claim 1, wherein a screw is configured to pass through a screw hole provided in the first plate and a screw hole provided in the third plate to be coupled to a screw fastening portion provided in the first support structure.

6. The electronic device of claim 1, wherein a screw is configured to pass through a screw hole provided in the third plate and a screw hole provided in the first hinge assembly to be coupled to a screw fastening portion provided in the first support structure; and is also provided with

The screw is configured to pass through a screw hole provided in the fourth plate and a screw hole provided in the second hinge assembly to be coupled to a screw fastening portion provided in the second support structure.

7. The electronic device of claim 1, wherein the first hinge assembly comprises:

a first rotating member comprising a first portion coupled to the first support structure and a second portion coupled to the second support structure;

a first hinge arm including a third portion connected to the first portion and a fourth portion connected to the second portion; and

a first actuator having a gear assembly configured to connect the third portion and the fourth portion and to provide a driving force for a rotational movement between the third portion and the fourth portion using elasticity of a torsion spring;

wherein the second hinge assembly comprises:

a second rotating member comprising a fifth portion coupled to the first support structure and a sixth portion coupled to the second support structure;

a second hinge arm including a seventh portion connected to the fifth portion and an eighth portion connected to the sixth portion; and

a second actuator having a gear assembly configured to connect the seventh portion and the eighth portion and to provide a driving force for a rotational movement between the seventh portion and the eighth portion using elasticity of a torsion spring,

Wherein the first hinge arm and the second hinge arm are configured to be located between the first rotating member and the second rotating member.

8. The electronic device of claim 7, wherein the first plate is configured to be located between the first hinge arm and the second hinge arm when viewed from above the second surface;

a screw is configured to pass through a screw hole provided in the third plate and a screw hole provided in the first portion to be coupled to a screw fastening portion provided in the first support structure; and is also provided with

The screw is configured to pass through a screw hole provided in the fourth plate and a screw hole provided in the fifth portion to be coupled to a screw fastening portion provided in the first support structure.

9. The electronic device of claim 7, wherein the third plate includes an opening configured to prevent the third plate from interfering with a portion of the first actuation member; and is also provided with

The fourth plate includes an opening configured to prevent interference of the fourth plate with a portion of the second actuator.

10. The electronic device of claim 1, wherein the folded portion comprises:

A hinge housing configured to cover the first hinge assembly and the second hinge assembly; and

a guide rail assembly disposed in the hinge housing and between the first hinge assembly and the second hinge assembly;

wherein the hinge housing is configured to be exposed to the outside when the foldable housing is switched from the unfolded state to the folded state to provide a portion of an outer surface of the electronic device,

wherein the rail assembly comprises:

a rail structure coupled to the hinge housing; and

a slider structure including a slider coupled to the first plate and capable of moving by being guided to a guide rail provided in the guide rail structure,

wherein a screw is configured to pass through a screw hole provided in the first plate to be coupled to a screw fastening portion provided in the rail structure.

11. The electronic device of claim 10, wherein the second plate includes an opening that overlaps the screw hole of the first plate.

12. The electronic device according to claim 10, wherein a screw is configured to pass through a screw hole provided in the rail structure to be coupled to a screw fastening portion provided in the hinge housing; and is also provided with

The first plate and the second plate include openings that overlap with screw holes provided in the rail structure.

13. The electronic device of claim 1, further comprising a flexible printed circuit board located in the interior space of the foldable housing and configured to electrically connect a first electronic component housed in the first housing and a second electronic component housed in the second housing;

wherein the flexible printed circuit board is configured to extend between the first board assembly and the hinge housing; and is also provided with

A portion of the flexible printed circuit board is configured to pass through an opening provided in the first board to be bonded to the second board.

14. The electronic device of claim 1, wherein the first plate comprises a first opening;

the third plate includes a second opening overlapping the first opening; and is also provided with

The third plate includes one or more extensions extending from an edge of the second opening and inserted into the first opening to support the first plate.

15. The electronic device of claim 1, further comprising a second plate assembly located in the interior space of the foldable housing to correspond to the folded portion, coupled to the second support structure, and configured to support a fourth portion of the flexible display corresponding to the folded portion;

Wherein in an unfolded state of the foldable housing, the first plate assembly and the second plate assembly are configured to form an angle of 180 degrees;

in a folded state of the foldable housing, the first and second panel assemblies are configured to form an angle of 0 degrees to 10 degrees;

wherein the second plate assembly comprises:

a fifth plate including a ninth surface facing the second support structure and a tenth surface facing a direction opposite to the direction of the ninth surface and located between the first hinge assembly and the second hinge assembly;

a sixth plate including an eleventh surface facing the tenth surface and a twelfth surface facing a direction opposite to the direction of the eleventh surface;

a seventh plate including a thirteenth surface and a fourteenth surface facing in a direction opposite to that of the thirteenth surface, the thirteenth surface facing the tenth surface and the first hinge assembly; and

an eighth plate including a fifteenth surface and a sixteenth surface facing in a direction opposite to that of the fifteenth surface, the fifteenth surface facing the tenth surface and the second hinge assembly;

Wherein the sixth plate is configured to be located between the seventh plate and the eighth plate when viewed from above the twelfth surface.