CN117881078A - High-speed signal line via hole, circuit board and electronic equipment - Google Patents
High-speed signal line via hole, circuit board and electronic equipment Download PDFInfo
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- CN117881078A CN117881078A CN202410089469.0A CN202410089469A CN117881078A CN 117881078 A CN117881078 A CN 117881078A CN 202410089469 A CN202410089469 A CN 202410089469A CN 117881078 A CN117881078 A CN 117881078A
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- 239000011148 porous material Substances 0.000 claims 1
- 238000012938 design process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 230000000750 progressive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
The high-speed signal wire via hole comprises signal holes, surface bonding pads corresponding to the signal holes one by one and anti-bonding pads corresponding to the signal holes; when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the first impedance, each signal hole corresponds to one first anti-bonding pad; when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the second impedance, two adjacent signal holes correspond to a second anti-bonding pad, and the second anti-bonding pad is a slotted hole-shaped bonding pad; through distinguishing the design modes of the anti-bonding pads of the through holes corresponding to the wiring designs with different impedances, the through holes of the high-speed signal lines are only designed in two modes, and the design requirements can be met by adopting the two design modes, so that the types of the through holes are simplified, and the probability of using errors caused by various types of the through holes in the design process is reduced. The design efficiency and the correctness, the consistency of the via impedance and the signal impedance are improved, and the signal integrity is improved.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a high-speed signal wire via hole, a circuit board and electronic equipment.
Background
High-speed signal line vias refer to holes through which signals are transmitted from one layer of interconnect lines to another layer of interconnect lines in a high-speed PCB multilayer board. When the frequency is lower than 1GHz, the via hole can play a good role in connection, and parasitic capacitance and inductance of the via hole are negligible. However, when the frequency is higher than 1GHz, the parasitic effect of the via hole cannot be ignored on the signal integrity, and the via hole presents a break point with discontinuous impedance on the transmission path, which can generate signal integrity problems such as reflection, delay, attenuation and the like of the signal.
In order to ensure signal integrity and reduce noise interference, a continuous design of high speed signal line via impedance is required. In a high-speed circuit, if the impedance of a signal line changes, problems such as reflection and crosstalk of signals are caused, which affect the quality and stability of signals. Accordingly, in high-speed signal line via designs, special attention needs to be paid to impedance continuity to reduce signal reflection and crosstalk, thereby ensuring signal integrity and reducing noise interference. Meanwhile, parameters such as the length, the diameter and the like of the via hole also need to be optimally designed so as to ensure the transmission quality and the stability of signals.
In the existing design method for continuous impedance of the high-speed signal line through holes, the high-speed signal line through holes are classified based on impedance types, so that the high-speed signal line through holes are various in variety. In practical application, the high-speed signal line is too many in via hole types, and the situation of using errors easily occurs in the design process, and the difference of the via holes is difficult to find by naked eyes, so that the via holes are also difficult to find in subsequent inspection, and the effect of controlling the impedance of the via holes cannot be achieved by the product.
Disclosure of Invention
In view of the above, the embodiments of the present invention provide a high-speed signal line via hole, a circuit board and an electronic device, so as to reduce the probability of passing through the high-speed signal line Kong Moyong.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
a high speed signal line via, comprising:
signal holes, surface bonding pads corresponding to the signal holes one by one, and anti-bonding pads corresponding to the signal holes;
when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the first impedance, each signal hole corresponds to one first anti-bonding pad;
when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the second impedance, two adjacent signal holes correspond to the same second anti-bonding pad, and the second anti-bonding pad is a slotted hole-shaped bonding pad;
the second impedance is greater than the first impedance.
Optionally, in the high-speed signal line via hole, the aperture of the signal hole is 0.2mm, the diameter of the surface pad is 0.45mm, and the diameter of the anti-pad is 0.75mm.
Optionally, in the high-speed signal line via hole, the first impedance is 85 ohms; the second impedance is 92 ohms.
Optionally, in the high-speed signal line via hole, a distance between the signal hole and a ground hole closest to the signal hole is 30mil;
the distance between two adjacent signal holes is 30mil.
Optionally, in the high-speed signal line Via hole, a type of the high-speed signal line Via hole is Via25G.
Optionally, in the high-speed signal line via hole, the signal hole and the ground hole are located on the same straight line.
A circuit board comprising the high-speed signal line via of any one of the above.
An electronic device comprises the circuit board.
Optionally, the electronic device is a mobile phone, a television, a computer or a vehicle-mounted computer.
Based on the technical scheme, the high-speed signal line via hole provided by the embodiment of the invention comprises signal holes, surface bonding pads corresponding to the signal holes one by one and anti-bonding pads corresponding to the signal holes; when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the first impedance, each signal hole corresponds to one first anti-bonding pad; when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the second impedance, two adjacent signal holes correspond to a second anti-bonding pad, and the second anti-bonding pad is a slotted hole-shaped bonding pad; according to the scheme, through distinguishing the design modes of the anti-bonding pads of the through holes corresponding to the wiring designs of different impedances, the through holes of the high-speed signal lines are only designed in two modes, and the design requirements can be met by adopting the two design modes. Design efficiency and accuracy are improved. And meanwhile, the consistency of the impedance of the through hole and the impedance of the signal is improved, and the signal integrity is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a high-speed signal line via hole when the high-speed signal line via hole disclosed in the embodiment of the present application is a first via hole;
fig. 2 is a schematic structural diagram of a high-speed signal line via hole when the high-speed signal line via hole disclosed in the embodiment of the present application is a second via hole;
fig. 3 and fig. 4 are schematic diagrams of simulation results of different types of simulations performed on the first via and the second via, respectively.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The present application passes impedance requirements for different signals. The hollowing mode of the signal via hole is optimized. The impedance of the via hole and the impedance of the signal line are made more uniform. The signal integrity is improved. Improving the quality of the signal. In addition, the high-speed signal wire through holes disclosed by the application do not need to be classified based on the impedance required by signals, so that the design of the signal through holes is simpler, the types are fewer, and the probability of misuse in the design application is reduced.
Specifically, the application discloses a high-speed signal line via hole, see fig. 1, the high-speed signal line via hole includes:
signal holes 01, surface pads 02 in one-to-one correspondence with the signal holes 01, and anti-pads 03 in correspondence with the signal holes 01. The signal holes and other signal holes corresponding to the signal holes and the ground holes 04 are all positioned on the same straight line, and in the circuit board, the ground holes and the signal holes are two different types of holes, and each hole has different functions and roles. Ground hole (Ground Via): ground holes are holes used to connect some or all of the conductive portions on the circuit board to the underlying layers. Their primary function is to provide electrical connections to ensure that all conductive portions of the circuit board are connected together to form a uniform reference plane. The ground holes may also be used to provide current and voltage to the desired circuit elements and to help prevent electromagnetic interference and signal crosstalk. Signal hole (Signal Via): signal holes are holes for transmitting signals and are typically located between signal lines on a circuit board. The signal holes transmit signals from one layer to another layer or from one element to another element. The structure and design of the signal holes are important to ensure the reliability and integrity of the signal transmission, as they may cause problems with impedance discontinuities, signal loss, and cross-talk. Surface layer pad (Surface Mount Pad): surface pads are pads located on the top or bottom layer of a circuit board, typically used for soldering of surface mount components. It is typically of a particular shape and size to accommodate the pin spacing and pad size of the various components. The surface pads are typically connected to the component pins by thermally melted solder to effect electrical connection of the component to the circuit board. Anti-Pad (Anti-Pad): anti-pads, also known as isolation pads or back plane pads, are used primarily to isolate different signal or power layers in a multilayer circuit board. The anti-pad prevents shorting between the different layers and ensures proper transmission of signals and power in the circuit board.
In circuit design, ohmic routing of different signal lines is mainly distinguished by line width and line spacing. The ratio of line width to line spacing determines the impedance of the trace and thus the ohmic value of the trace design.
The impedance of high-speed signal lines at higher speeds is typically 85 ohms and 92 ohms when designing a circuit board. The 92 ohm rate is higher and can be 10GHz,25GHz and 56GHz. The effect of the via corresponding to the high-speed signal line having an impedance of 92 ohms is not high-speed. Vias that are generally targeted for high speed signals are particularly addressed.
The high-speed signal line via hole is divided into two types based on different wiring designs, wherein one type of via hole of the high-speed signal line via hole is matched with the wiring design of the first impedance and is marked as a first via hole, and the other type of via hole of the high-speed signal line via hole is matched with the wiring design of the second impedance and is marked as a second via hole. The first impedance may be 85 ohms, at this time, the via Kong Juti adapted to the routing design of the first impedance is a via adapted to the routing design of 85 ohms, and of course, the first impedance may also be other impedance values, for example, the first impedance may belong to a certain interval, and the interval is denoted as a first interval, where the first interval includes the 85 ohms. The second impedance may be 92 ohms, at this time, the via Kong Juti adapted to the routing design of the second impedance is a via adapted to the routing design of 92 ohms, and of course, the second impedance may also be other impedance values, for example, the second impedance may belong to a certain interval, and the interval is denoted as a second interval, where the second interval includes the 92 ohms. When the high-speed signal wire through hole is a second through hole adapting to the wiring design of the second impedance, each signal hole corresponds to a second anti-bonding pad;
referring to fig. 1, when the high-speed signal line via hole is a first via hole adapting to a wiring design of a first impedance, each signal hole corresponds to a first anti-bonding pad, and the first anti-bonding pad is a circular bonding pad; referring to fig. 2, when the high-speed signal line via hole is a second via hole adapted to a routing design of the second impedance, referring to fig. 2, two adjacent signal holes correspond to a second anti-pad, and the second anti-pad is a oblong hole-shaped pad, which is equivalent to connecting two pads in the figure into one pad, two ends of the second pad are in a semicircular structure, and an area between the two semicircular structures can be considered as a rectangular structure.
The first via hole and the second via hole are simulated, the simulation results are shown in fig. 3 and fig. 4, in fig. 3, the vertical axis is loss, the horizontal axis is signal frequency, in fig. 3, S1 is a graph of the relationship between the design loss of the second via hole and the signal rate shown in fig. 1, S2 in fig. 3 is a graph of the relationship between the loss of the first via hole and the signal rate shown in fig. 3, when the signal rate becomes high, according to the simulation results, it can be seen from fig. 3 that the loss of the design form of the first pad is smaller, the loss of the design form of the second pad is larger, the signal rate of the normal 92 ohm routing design is higher, the lowest point of S3 in fig. 4 is the corresponding impedance of the second via hole, the lowest point of S4 in fig. 4 is the corresponding impedance of the first via hole, and the impedance of the second via hole is larger and is closer to 92omh when seen from fig. 4. The impedance of the first via is lower, closer to 85omh. As can be seen in fig. 3 and 4, the first via is adapted to a trace design with 85 ohm impedance, and the second via is adapted to a trace design with 92 ohm impedance, so that the continuity of the impedance is realized.
According to the scheme, the impedance corresponding to the routing design of the high-speed signal wire is distinguished, the first via hole and the second via hole are designed, the first via hole and the second via hole both comprise signal holes, surface layer bonding pads corresponding to the signal holes one by one, and anti-bonding pads corresponding to the signal holes, each signal hole in the first via hole corresponds to one first anti-bonding pad, two adjacent signal holes in the second via hole correspond to one second anti-bonding pad, the second anti-bonding pad is a long round hole bonding pad, in the scheme, the design modes of the anti-bonding pads of the via holes corresponding to the routing design of different impedances are distinguished, the design requirements can be met by adopting only two design modes of the high-speed signal wire via hole, and compared with the prior scheme, the type of the via hole is simplified, and the probability of using errors caused by various types of the via holes in the design process is reduced. Design efficiency and accuracy are improved. And meanwhile, the consistency of the impedance of the through hole and the impedance of the signal is improved, and the signal integrity is improved.
Further, in order to make the circuit board with the high-speed signal line Via provided by the present solution have better performance, the high-speed signal line Via in the embodiment of the present application is a Via25G Via, "Via25G Via" is a term in the field of electronics and PCB design, and is generally referred to as a "Via" or a "through hole. In PCB (printed circuit board) designs, vias are a method of connecting conductive paths of different layers. This typically represents the diameter or size of the via in units of "grid", or 25G means 25 grid sizes. In PCB design, the grid is a unit of measure that describes the size and location of the circuit board. The specific dimensions may depend on particular design rules or criteria. "via 25G" refers to a via having a diameter or size of 25 mesh. The design parameters of the signal hole, the surface layer bonding pad and the anti-bonding pad are further limited, for example, in the technical scheme disclosed in the embodiment, the aperture of the signal hole can be designed to be 0.2mm, the diameter of the surface layer bonding pad can be designed to be 0.45mm, and the diameter of the anti-bonding pad can be designed to be 0.75mm. The distance between the signal hole and the ground hole closest to the signal hole is 30mil; the distance between two adjacent signal holes on the circuit board is 30mil. Where mil is the unit of measure, 1mil = 0.0254mm.
Corresponding to the high-speed signal wire through hole, the application also discloses a circuit board, wherein the high-speed signal wire through hole corresponding to the wiring design of the first impedance in the circuit board is the first through hole, and the high-speed signal wire through hole corresponding to the wiring design of the second impedance in the circuit board is the second through hole.
The electronic equipment is applied with the circuit board, and can be a mobile phone, a television, a computer or a vehicle-mounted computer, and can be other electronic terminals with PCB circuit boards.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A high speed signal line via, comprising:
signal holes, surface bonding pads corresponding to the signal holes one by one, and anti-bonding pads corresponding to the signal holes;
when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the first impedance, each signal hole corresponds to one first anti-bonding pad;
when the high-speed signal wire through hole is a first through hole adapting to the wiring design of the second impedance, two adjacent signal holes correspond to the same second anti-bonding pad, and the second anti-bonding pad is a slotted hole-shaped bonding pad;
the second impedance is greater than the first impedance.
2. The high speed signal line via of claim 1, wherein the signal hole has a pore diameter of 0.2mm, the surface pad has a diameter of 0.45mm, and the anti-pad has a diameter of 0.75mm.
3. The high speed signal line via of claim 1, wherein the first impedance is 85 ohms; the second impedance is 92 ohms.
4. The high speed signal line via of claim 1, wherein a distance between the signal hole and a ground hole nearest thereto is 30 mils;
the distance between two adjacent signal holes is 30mil.
5. The high-speed signal line Via of claim 1, wherein the high-speed signal line Via is of the type Via25G.
6. The high-speed signal line via of claim 1, wherein the signal hole is aligned with a ground hole.
7. A circuit board comprising the high-speed signal line via of any one of claims 1-6.
8. An electronic device comprising the circuit board of claim 7.
9. The electronic device of claim 8, wherein the electronic device is a cell phone, a television, a computer, or a car computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410089469.0A CN117881078A (en) | 2024-01-22 | 2024-01-22 | High-speed signal line via hole, circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410089469.0A CN117881078A (en) | 2024-01-22 | 2024-01-22 | High-speed signal line via hole, circuit board and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN117881078A true CN117881078A (en) | 2024-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410089469.0A Pending CN117881078A (en) | 2024-01-22 | 2024-01-22 | High-speed signal line via hole, circuit board and electronic equipment |
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| CN (1) | CN117881078A (en) |
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- 2024-01-22 CN CN202410089469.0A patent/CN117881078A/en active Pending
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