CN1178783C - 微波介电材料 - Google Patents

微波介电材料 Download PDF

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CN1178783C
CN1178783C CNB998095354A CN99809535A CN1178783C CN 1178783 C CN1178783 C CN 1178783C CN B998095354 A CNB998095354 A CN B998095354A CN 99809535 A CN99809535 A CN 99809535A CN 1178783 C CN1178783 C CN 1178783C
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dielectric material
upper strata
laminated construction
loss factor
1ghz
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CN1312962A (zh
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L・贝里斯特德特
L·贝里斯特德特
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Telefonaktiebolaget LM Ericsson AB
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Waveguide Aerials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Details Of Aerials (AREA)

Abstract

用于如电路板或天线的微波电子装置的叠层结构，只在上部200μm中有在1GHz时Df＜0.005的低损耗系数的价格贵的介电材料，如PTFE/玻璃或Gore-层，在介电材料的下部400μm中有价格便宜的在1GHz时的Df＞0.005的大损耗系数的介电材料，如氰酸酯BT/环氧，热固性聚酰亚胺，或聚酰亚胺。因此能降低价格而保持相同的性能，即在使用温度和频率范围内的低能耗和稳定的介电常数。

Description

微波介电材料
技术领域
本发明涉及用于微波电子装置的含介电材料的叠层结构。它能用于微波应用特别是元件载体中，如电路板和微波天线中。本发明还涉及这种新的介电叠层结构的制造方法。
背景技术
这种电介质中，重要的是介电常数(Dk)的变化不要超过使用温度和使用频率的范围。还有一个重要问题是，损耗系数(tgδ)要小，因此，可以使功耗(发热)减至最小。通过设置介电层来支承其上的微波传输带导电层，已达到了这种效果。为达到上述效果，采用有理想性能的介电材料层。
这种设计中用的介电材料厚度约为600μm，有理想特性的介电材料，或者说要用有所要求的特性的介电材料能明显地提高GSM无线电移动系统中的电路板价格，例如，要用大量材料的天线，如果必须用高质量的介电材料，就会使天线价格很贵。
发明内容
根据对背景技术的说明，本发明的目的是提供一种介电微波电子元件载体或介电微波天线，它的价格比迄今已知的元件载体或天线的价格低，但它有同样高质量的特性，如低的总损耗系数。那就是说，能降低发热量和减小介电常数的变化。这尤其在用大量材料的天线，例如在新GSM1.8系统中用的天线中是需要的。本发明的测试的基础是在1GHz的频率下要求顶级(top)质量的电路板上部200μm处的损耗系数测试，剩余的下部的质量要求可以降低一点，以减小叠层结构的总价格。
本发明的另一目的是提供元件载体或天线的制造方法。
根据本发明的一个方面，提供了一种用于微波电子装置的叠层结构，包括：一个接地板；一个由损耗系数Df在1GHz时大于0.005的介电材料构成的下层，其位于所述接地板上；一个由损耗系数Df在1GHz时小于0.005的介电材料构成的上层，其位于所述下层上；导电层，包括安装在所述上层上的电子元件。其中，所述由介电材料构成的上层的厚度可为200μm
根据本发明的另一个方面，还提供了一种叠层结构的制造方法，包括以下步骤：在接地板上设置一个由损耗系数Df在1GHz时大于0.005的介电材料构成的下层；之后，在所述下层上设置一个由损耗系数Df在1GHz时小于0.005的介电材料构成的上层；之后，在所述上层上设置一导电层。
附图说明
附图示出了组合微波板的示意图。
具体实施方式
图给出了本发明实施例的组合微波板。接地板(earth plane)1上加了较便宜的介电材料下层2，在这种情况下的介电材料是FR-4材料。在本发明范围中也可用在1GHz下的损耗系数大于0.005的其它材料，如氰酸酯，BT/环氧，热固性聚酰亚胺，或聚酰亚胺。该下层2上加更高质量材料的上层3，如PTFE/玻璃，或Gore-层。该上层3在1GHz时的损耗系数小于0.005。
损耗系数Df是表示在一定的微波频率下(本发明中是1GHz)有关储存的能量的能量损耗大小。该损耗系数可表示成tgδ，式中δ是矢量分量ε′和ε″的夹角，其中ε′是对应储存能量的实数分量，ε″是对应损耗能量的虚数分量，叫做损耗系数。矢量曲线中，ε′和ε″之间具有90°的相位差，因此，它们之间的比可表示成tgδ，δ是两个矢量形成的角。
按本发明的方法中，用有大损耗系数(Df＞0.005)的价格较便宜的介电材料下层2加到接地板上。该下层的厚度在600μm的总电介质厚度中占400μm厚。之后，下层2上加价格更贵的损耗系数Df＞0.005的介电材料上层3。之后，上层3上加导电层4。电子元件可安装在导电层4上。

Claims (5)

1.用于微波电子装置的叠层结构，包括：
一个接地板(1)，
一个由损耗系数Df在1GHz时大于0.005的介电材料构成的下层(2)，其位于所述接地板上；
一个由损耗系数Df在1GHz时小于0.005的介电材料构成的上层(3)，其位于所述下层(2)上；
导电层(4)，电子元件安装在该导电层的上层。
2.按权利要求1的叠层结构，其中，所述由介电材料构成的上层(3)的厚度为200μm。
3.按权利要求1或2的叠层结构，其中，所述叠层结构是电路板。
4.按权利要求1或2的叠层结构，其中，所述叠层结构是天线。
5.一种叠层结构的制造方法，包括以下步骤：
在接地板(1)上设置一个由损耗系数Df在1GHz时大于0.005的介电材料构成的下层(2)；
之后，在所述下层(2)上设置一个由损耗系数Df在1GHz时小于0.005的介电材料构成的上层(3)，
之后，在所述上层(3)上设置一导电层(4)。
CNB998095354A 1998-08-19 1999-07-30 微波介电材料 Expired - Lifetime CN1178783C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9802769-1 1998-08-19
SE9802769A SE513022C2 (sv) 1998-08-19 1998-08-19 Dielelektriskt material för mikrovågor
SE98027691 1998-08-19

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CN1312962A CN1312962A (zh) 2001-09-12
CN1178783C true CN1178783C (zh) 2004-12-08

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EP (1) EP1110270A1 (zh)
KR (1) KR20010072326A (zh)
CN (1) CN1178783C (zh)
AU (1) AU5662099A (zh)
CA (1) CA2340988A1 (zh)
SE (1) SE513022C2 (zh)
WO (1) WO2000011747A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103458610A (zh) * 2012-06-04 2013-12-18 联想(北京)有限公司 印制电路板的基板及印制电路板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617388B2 (ja) * 1999-10-20 2005-02-02 日本電気株式会社 プリント配線板及びその製造方法
ATE542262T1 (de) 2005-10-13 2012-02-15 Nokia Corp Antennenanordnung
US8344955B2 (en) 2010-01-08 2013-01-01 Nokia Corporation Integrated antenna with e-flex technology
US8716603B2 (en) 2010-11-24 2014-05-06 Nokia Corporation Printed wiring board with dielectric material sections having different dissipation factors

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886699A (en) * 1987-10-26 1989-12-12 Rogers Corporation Glass fiber reinforced fluoropolymeric circuit laminate
US4914445A (en) * 1988-12-23 1990-04-03 Shoemaker Kevin O Microstrip antennas and multiple radiator array antennas
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103458610A (zh) * 2012-06-04 2013-12-18 联想(北京)有限公司 印制电路板的基板及印制电路板
CN103458610B (zh) * 2012-06-04 2017-12-29 联想(北京)有限公司 印制电路板的基板及印制电路板

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Publication number Publication date
CA2340988A1 (en) 2000-03-02
SE9802769L (sv) 2000-02-20
AU5662099A (en) 2000-03-14
KR20010072326A (ko) 2001-07-31
WO2000011747A1 (en) 2000-03-02
EP1110270A1 (en) 2001-06-27
SE513022C2 (sv) 2000-06-19
CN1312962A (zh) 2001-09-12
SE9802769D0 (sv) 1998-08-19

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