SE9802769D0 - Microwave dielectric material - Google Patents

Microwave dielectric material

Info

Publication number
SE9802769D0
SE9802769D0 SE9802769A SE9802769A SE9802769D0 SE 9802769 D0 SE9802769 D0 SE 9802769D0 SE 9802769 A SE9802769 A SE 9802769A SE 9802769 A SE9802769 A SE 9802769A SE 9802769 D0 SE9802769 D0 SE 9802769D0
Authority
SE
Sweden
Prior art keywords
dielectric material
ghz
polyimide
dissipation factor
microwave dielectric
Prior art date
Application number
SE9802769A
Other languages
English (en)
Other versions
SE513022C2 (sv
SE9802769L (sv
Inventor
Leif Bergstedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9802769A priority Critical patent/SE513022C2/sv
Publication of SE9802769D0 publication Critical patent/SE9802769D0/sv
Priority to PCT/SE1999/001328 priority patent/WO2000011747A1/en
Priority to CNB998095354A priority patent/CN1178783C/zh
Priority to AU56620/99A priority patent/AU5662099A/en
Priority to KR1020017001642A priority patent/KR20010072326A/ko
Priority to CA002340988A priority patent/CA2340988A1/en
Priority to EP99943549A priority patent/EP1110270A1/en
Publication of SE9802769L publication Critical patent/SE9802769L/sv
Publication of SE513022C2 publication Critical patent/SE513022C2/sv
Priority to US09/829,247 priority patent/US20010050603A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
SE9802769A 1998-08-19 1998-08-19 Dielelektriskt material för mikrovågor SE513022C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9802769A SE513022C2 (sv) 1998-08-19 1998-08-19 Dielelektriskt material för mikrovågor
PCT/SE1999/001328 WO2000011747A1 (en) 1998-08-19 1999-07-30 Microwave dielectric material
CNB998095354A CN1178783C (zh) 1998-08-19 1999-07-30 微波介电材料
AU56620/99A AU5662099A (en) 1998-08-19 1999-07-30 Microwave dielectric material
KR1020017001642A KR20010072326A (ko) 1998-08-19 1999-07-30 마이크로파 유전 물질
CA002340988A CA2340988A1 (en) 1998-08-19 1999-07-30 Microwave dielectric material
EP99943549A EP1110270A1 (en) 1998-08-19 1999-07-30 Microwave dielectric material
US09/829,247 US20010050603A1 (en) 1998-08-19 2001-04-09 Microwave dielectric material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9802769A SE513022C2 (sv) 1998-08-19 1998-08-19 Dielelektriskt material för mikrovågor

Publications (3)

Publication Number Publication Date
SE9802769D0 true SE9802769D0 (sv) 1998-08-19
SE9802769L SE9802769L (sv) 2000-02-20
SE513022C2 SE513022C2 (sv) 2000-06-19

Family

ID=20412284

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9802769A SE513022C2 (sv) 1998-08-19 1998-08-19 Dielelektriskt material för mikrovågor

Country Status (7)

Country Link
EP (1) EP1110270A1 (sv)
KR (1) KR20010072326A (sv)
CN (1) CN1178783C (sv)
AU (1) AU5662099A (sv)
CA (1) CA2340988A1 (sv)
SE (1) SE513022C2 (sv)
WO (1) WO2000011747A1 (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617388B2 (ja) * 1999-10-20 2005-02-02 日本電気株式会社 プリント配線板及びその製造方法
ATE542262T1 (de) 2005-10-13 2012-02-15 Nokia Corp Antennenanordnung
US8344955B2 (en) 2010-01-08 2013-01-01 Nokia Corporation Integrated antenna with e-flex technology
US8716603B2 (en) 2010-11-24 2014-05-06 Nokia Corporation Printed wiring board with dielectric material sections having different dissipation factors
CN103458610B (zh) * 2012-06-04 2017-12-29 联想(北京)有限公司 印制电路板的基板及印制电路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886699A (en) * 1987-10-26 1989-12-12 Rogers Corporation Glass fiber reinforced fluoropolymeric circuit laminate
US4914445A (en) * 1988-12-23 1990-04-03 Shoemaker Kevin O Microstrip antennas and multiple radiator array antennas
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same

Also Published As

Publication number Publication date
EP1110270A1 (en) 2001-06-27
CN1312962A (zh) 2001-09-12
SE513022C2 (sv) 2000-06-19
CN1178783C (zh) 2004-12-08
AU5662099A (en) 2000-03-14
WO2000011747A1 (en) 2000-03-02
SE9802769L (sv) 2000-02-20
CA2340988A1 (en) 2000-03-02
KR20010072326A (ko) 2001-07-31

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